A patch machine head binding device and patching equipment

Abstract

The application relates to a patch machine binding head device and a patch mounting equipment. The patch machine binding head device comprises a base, a patch mounting assembly and an electromagnetic assembly. The patch mounting assembly can move in the Z-axis direction relative to the base, and the electromagnetic assembly is arranged between the patch mounting assembly and the base. The electromagnetic assembly comprises an electromagnet and a magnetic piece. The electromagnet comprises a winding iron core and a power coil. The power coil is sleeved on the winding iron core. The winding iron core is installed on the base. The magnetic piece is installed on the patch mounting assembly. The winding iron core and the magnetic piece are oppositely arranged. When the power coil is powered, the power coil and the magnetic piece form a magnetic field with the same or opposite magnetic poles, which is used for providing repulsive force or magnetic attraction force to the base and the patch mounting assembly. The patch mounting equipment has the same beneficial effects as the above-mentioned patch machine binding head device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a chip mounter binding device and mounting equipment. Background Technology

[0002] The chip mounter is an indispensable piece of equipment in the integrated circuit packaging process. It is mainly used in the semiconductor industry for the automatic chip mounting process to pick up and mount chips. Chip picking is the process of using the nozzle of the mounter to remove the chip from the wafer, and chip mounting is the process of placing the removed chip onto the lead frame.

[0003] However, in existing pick-and-place machine head binding devices, when the floating nozzle mechanism requires high flexibility, the required preset downward pressure is relatively small. At this time, the structural rigidity of the head binding device is low, and the rigidity of the floating nozzle mechanism is insufficient, which makes it easy to become unstable due to inertial forces during high-speed movement. When the floating nozzle mechanism requires high rigidity, the floating flexibility is low.

[0004] In view of this, the bonding head device for a chip mounter provided by the present invention can adjust the preset downward pressure by controlling the current or voltage of the winding iron core coil, so that the bonding head device has both high flexibility and rigidity, thereby solving the above-mentioned technical problems. Summary of the Invention

[0005] To address the technical problem that the floating nozzle mechanism of traditional pick-and-place machine head binding devices cannot simultaneously achieve high flexibility and high rigidity, thereby affecting control stability and die bonding process efficiency, this invention provides a pick-and-place machine head binding device and mounting equipment.

[0006] The solution to the technical problem of the present invention is to provide a pick and place machine head binding device, the pick and place machine head binding device includes a base, a mounting assembly and an electromagnetic assembly, the mounting assembly can move relative to the base in the Z-axis direction, and the electromagnetic assembly is disposed between the mounting assembly and the base; The electromagnetic component includes an electromagnet and a magnetic element. The electromagnet includes a wound iron core and an energized coil. The energized coil is sleeved on the wound iron core. The wound iron core is installed on the base. The magnetic element is installed on the mounting assembly, and the wound iron core and the magnetic element are arranged opposite to each other. When the energized coil is energized, it forms a magnetic field with the same or opposite magnetic poles as the magnetic component, which is used to provide repulsive force or magnetic attraction to the base and the mounting assembly.

[0007] Preferably, the pick-and-place machine binding device further includes a vertical guide assembly, which includes a Z-axis slide rail assembly and a transmission assembly. The transmission assembly includes a transmission component and a limit adjustment assembly having a fixed portion and a movable portion. The fixed portion of the limit adjustment assembly is mounted on the base, and the movable portion of the limit adjustment assembly is in contact with the transmission component to prevent the placement assembly from shifting in the vertical direction. The Z-axis slide rail assembly is mounted on the base along the Z-axis direction. The transmission component is disposed between the Z-axis slide rail assembly and the placement assembly, and the transmission component is located at one end of the placement assembly corresponding to the magnetic component.

[0008] Preferably, the limiting adjustment assembly includes a limiting member and an adjusting member. The limiting member is installed on the base corresponding to the bottom end of the transmission member, and the limiting member and the transmission member are spaced apart. The adjusting member fits into the transmission member after passing through the limiting member.

[0009] Preferably, the mounting assembly includes a floating seat and a working head arranged sequentially in the Z-axis direction, with the magnetic component and the transmission component both located on the floating seat at one end away from the working head; the magnetic component and the transmission component are spaced apart, and the limiting component and the adjusting component are also spaced apart from the floating seat.

[0010] Preferably, the pick-and-place machine binding device further includes a self-weight balancing component, which includes a tension spring, a first fixing member, and a second fixing member. The first fixing member is installed on the base, and the second fixing member is installed on the floating seat. One end of the tension spring is connected and fixed to the first fixing member, and the other end is connected and fixed to the second fixing member. The tension spring is arranged parallel to the electromagnetic component. The distance between the first fixing member and the second fixing member is greater than the free length of the tension spring, so that the tension spring generates elastic deformation in the Z-axis direction to balance the self-weight of the placement component and the vertical guide component.

[0011] Preferably, the electromagnetic component and the tension spring are disposed on opposite sides of the mounting component corresponding to the Z-axis slide rail component, and the Z-axis slide rail component, the electromagnetic component and the tension spring are arranged in a triangular distribution.

[0012] Preferably, the Z-axis slide rail assembly includes a first slide rail and a second slide rail that can slide relative to each other. The first slide rail and the second slide rail are arranged along the Z-axis direction between the base and the transmission member. The first slide rail is fixedly installed on the outer wall surface of the base, and the second slide rail is fixedly installed on the outer wall surface of the transmission member. The length of the first slide rail is greater than the length of the second slide rail. When the pick-and-place machine binding head device moves along the Z-axis direction, the placement assembly moves toward or away from the base so that the second slide rail slides stably relative to the first slide rail.

[0013] Preferably, the bonding head device of the patch machine is further provided with a distance measuring module for measuring the moving distance of the transmission component. The distance measuring module is installed on the base on one side corresponding to the transmission component.

[0014] Preferably, the working head is detachably mounted on the floating base at the end opposite to the magnetic component, and the working head is one of a vacuum nozzle or a eutectic head.

[0015] The present invention also provides a placement device, the placement device including a control module, a power supply module and the above-mentioned placement machine binding head device; the control module is signal-connected to the placement machine binding head device, and the power supply module is electrically connected to the energized coil.

[0016] Compared with the prior art, the pick-and-place machine binding device and placement equipment provided by the present invention have the following advantages: 1. This invention provides a bonding head device for a chip mounter. An electromagnetic component is installed between the mounting assembly and the base. The electromagnetic component includes an electromagnet and a magnetic component mounted on the mounting assembly. The electromagnet comprises a wound iron core mounted on the base and an energized coil sleeved on the wound iron core. The wound iron core and the magnetic component are positioned opposite each other. By energizing the energized coil on the wound iron core, a repulsive or magnetic attraction force is generated between the wound iron core and the oppositely positioned magnetic component. By controlling the magnitude and direction of the current in the energized coil, the magnitude of the repulsive or magnetic attraction force between the electromagnet and the magnetic component can be precisely adjusted, thereby achieving continuous dynamic adjustment of the connection stiffness between the base and the mounting assembly. When greater rigid support is required, the repulsive force is increased to improve system stiffness; when flexible buffering is required, the repulsive force is reduced or the magnetic attraction force is increased to reduce system stiffness.

[0017] 2. In the pick-and-place machine binding device provided in this embodiment of the invention, by setting a vertical guide component, by installing the fixed part of the limit adjustment component on the base, and by having the movable part of the limit adjustment component fit with the transmission component, the placement component can be restricted from shifting in the vertical direction, thus ensuring the stability of the placement component's movement in its Z-axis direction; the coordinated cooperation between the Z-axis slide rail component and the transmission component further improves the stability of the placement component's movement.

[0018] 3. In the pick-and-place machine binding device provided in this embodiment of the invention, a limiting adjustment component is set between the placement assembly and the base. The displacement of the adjusting component relative to the limiting component is used to change the position of the transmission component, thereby adjusting the distance between the wound iron core and the magnetic component. This achieves the effect of flexibly adjusting the magnetic force output without changing the electrical parameters of the electromagnetic component. It is understandable that electromagnetic principles show that electromagnetic force and magnetic pole spacing have a non-linear negative correlation; when the magnetic pole spacing decreases, the electromagnetic force increases accordingly. In this embodiment of the invention, the limiting component of the limiting adjustment component is installed on the base corresponding to the bottom end of the transmission component. The adjusting component is connected to the transmission component after passing through the limiting component. By rotating or moving the adjusting component, the transmission component can be pushed to move along a direction perpendicular to the magnetic pole connection line, thereby changing the relative distance between the wound iron core and the magnetic component. Specifically, when it is necessary to increase the repulsive force or magnetic attraction force, decreasing the distance will result in a greater electromagnetic force output; when it is necessary to decrease the repulsive force or magnetic attraction force, increasing the distance will result in a greater electromagnetic force output.

[0019] 4. In the pick-and-place machine head-binding device provided in this embodiment of the invention, the transmission component, floating seat, and working head are arranged sequentially in the Z-axis direction. The placement assembly adopts a separate arrangement of the floating seat and the working head to facilitate the installation layout of related components such as the magnetic component and the Z-axis slide rail assembly. The magnetic component and the transmission component are arranged to avoid each other, and the limiting component and the adjusting component are also arranged to avoid each other from the floating seat, which can avoid motion interference between the components and ensure smooth operation of the pick-and-place machine head-binding device.

[0020] 5. In the pick-and-place machine head-binding device provided in this embodiment of the invention, the first fixing member is exposed on the base, the second fixing member is exposed on the floating seat, and the tension spring and the electromagnetic component are arranged in parallel. The two ends of the tension spring are respectively connected to the first fixing member and the second fixing member, that is, the tension spring is used to balance the weight of the placement component and the vertical guide component. In the vertical direction, the placement component is subjected to the combined action of its own weight, the elastic tension of the tension spring, and the magnetic force of the electromagnetic component. The elastic tension of the tension spring offsets part of its own weight, thereby reducing the load required by the electromagnetic component and making the preset downward pressure precisely controllable. By using the tension spring, the influence of the weight of each component of the pick-and-place machine head-binding device on the material picking and placement downward pressure can be reduced, the driving load of the electromagnetic component can be reduced, and the movement stability of the pick-and-place machine head-binding device can be improved.

[0021] 6. In the pick-and-place machine head binding device provided in this embodiment of the invention, the electromagnetic component and the tension spring are arranged on opposite sides of the Z-axis slide rail component on the placement component. The Z-axis slide rail component, the electromagnetic component, and the tension spring are arranged in a triangular distribution, which can optimize the force structure of the pick-and-place machine head binding device and improve the structural stability of the pick-and-place machine head binding device. Furthermore, the triangular distribution of the Z-axis slide rail component, the electromagnetic component, and the tension spring can prevent the energized coil on the electromagnetic component from accidentally getting tangled in the Z-axis slide rail component or the tension spring, thereby significantly reducing the failure rate of the pick-and-place machine head binding device.

[0022] 7. In the chip mounter binding device provided in this embodiment of the invention, the first slide rail and the second slide rail are arranged between the base and the transmission component along the Z-axis. The relative sliding between the first slide rail and the second slide rail can serve as a guide to complete the force-controlled downward picking and mounting of the chip. It has the advantages of low friction and high precision. Moreover, it will not generate lateral force on the chip during chip picking or mounting, avoiding chip damage and affecting yield. Through the cooperation of the first slide rail and the second slide rail, the smoothness and guiding consistency of the mounting component in the Z-axis movement can be ensured. The length of the first slide rail is greater than the length of the second slide rail. On the one hand, it can adapt to the movement stroke requirements of the mounting component. On the other hand, it can ensure that the second slide rail always slides relative to the first slide rail, improving the stability of the stroke.

[0023] 8. In the chip mounter binding device provided in this embodiment of the invention, by pre-calibrating the relationship between the moving distance of the transmission component and the preset downward pressure, a non-contact ranging method is adopted to measure the moving distance of the transmission component, thereby realizing closed-loop control of force control. The ranging module can monitor the movement displacement of the mounting assembly in the Z-axis direction in real time, so as to accurately control the movement of the mounting assembly. When relative sliding occurs between the first slide rail and the second slide rail, the transmission component moves relative to the base along the Z-axis direction. By installing the ranging module on the base on the side corresponding to the transmission component, the ranging module and the base remain relatively stationary, and the transmission component moves relative to the ranging module, thereby improving the yield of chip packaging achieved by the chip mounter binding device.

[0024] 9. In the pick-and-place machine head binding device provided in the embodiments of the present invention, the working head is detachably installed and can be either a vacuum nozzle or a eutectic head, adapting to different process requirements and improving the versatility of the pick-and-place machine head binding device; when using a eutectic head to replace the vacuum nozzle, the pick-and-place machine head binding device can be applied to the eutectic process.

[0025] 10. This embodiment of the invention also provides a placement device, which includes a control module, a power supply module, and the aforementioned pick-and-place machine head-binding device; the control module is signal-connected to the pick-and-place machine head-binding device, and the power supply module is electrically connected to the energized coil. It should be noted that this placement device has the same beneficial effects as the aforementioned pick-and-place machine head-binding device, and will not be elaborated upon here. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of the pick-and-place machine binding device in this embodiment of the invention, without the use of a self-balancing component. Figure 1 .

[0028] Figure 2 This is a schematic diagram of the overall structure of the pick-and-place machine binding device in this embodiment of the invention, without the use of a self-balancing component. Figure 2 .

[0029] Figure 3 This is a schematic diagram of the overall structure of the pick-and-place machine binding device in this embodiment of the invention, without the use of a self-balancing component. Figure 3 .

[0030] Figure 4 This is a schematic diagram of the overall structure of the pick-and-place machine binding device using a self-weight balancing assembly, according to an embodiment of the present invention. Figure 1 .

[0031] Figure 5 This is a schematic diagram of the overall structure of the pick-and-place machine binding device using a self-weight balancing assembly, according to an embodiment of the present invention. Figure 2 .

[0032] Figure 6 This is a schematic diagram of a frame in which the Z-axis slide rail assembly, electromagnetic assembly, and tension spring of the pick-and-place machine binding device are arranged in a triangular configuration according to an embodiment of the present invention.

[0033] Figure 7 This is a schematic diagram of the overall framework of the mounting equipment according to an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached diagram: 10. Pick and place machine binding device; 20. Placement equipment; 201. Control module; 202. Power supply module; 1. Base; 2. Mounting assembly; 21. Floating seat; 22. Working head; 3. Electromagnetic assembly; 31. Winding core; 32. Energized coil; 33. Magnetic component; 4. Vertical guide assembly; 41. Z-axis slide rail assembly; 411. First slide rail; 412. Second slide rail; 42. Transmission assembly; 421. Transmission component; 422. Limit adjustment assembly; 4221. Limiting component; 4222. Adjusting component; 5. Self-weight balancing assembly; 51. Tension spring; 52. First fixing component; 53. Second fixing component; 6. Distance measuring module. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information. It should be understood that "an embodiment" or "one embodiment" mentioned throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in one embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the invention. In the various embodiments of this invention, it should be understood that the sequence number of the above processes does not necessarily imply a necessary order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this invention. The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0036] Please see Figure 1 , Figure 2 and Figure 3This invention provides a pick-and-place machine head binding device 10, which includes a base 1, a mounting assembly 2, and an electromagnetic assembly 3. The mounting assembly 2 is movable relative to the base 1 in the Z-axis direction. The electromagnetic assembly 3 is disposed between the mounting assembly 2 and the base 1. The electromagnetic assembly 3 includes a wound iron core 31, an energized coil 32, and a magnetic element 33. The energized coil 32 is sleeved on the wound iron core 31, the wound iron core 31 is mounted on the base 1, and the magnetic element 33 is mounted on the mounting assembly 2, with the wound iron core 31 and the magnetic element 33 arranged opposite to each other. When the energized coil 32 is energized, the wound iron core 31 and the magnetic element 33 form a magnetic field with the same or opposite magnetic poles, which is used to provide repulsive force or magnetic attraction force to the base 1 and the mounting assembly 2.

[0037] The chip mounter binding device 10 provided in this embodiment of the invention can be used for chip picking and mounting in the automatic mounting process of the semiconductor industry. The chip mounter binding device 10 is applied in applications requiring high-precision chip mounting. When picking up and adsorbing the chip, it can expose the features that need to be identified, and when mounting the chip, it can realize the mounting process of real-time alignment and mounting of the chip's upper surface and the identification points of the mounting position.

[0038] Understandably, by setting an electromagnetic component 3 between the mounting assembly 2 and the base 1, the electromagnetic component 3 includes an electromagnet mounted on the base 1 and a magnetic component 33 mounted on the mounting assembly 2. The electromagnet includes a wound iron core 31 and an energized coil 32 sleeved on the wound iron core 31, with the wound iron core 31 and the magnetic component 33 arranged opposite to each other. By energizing the energized coil 32 on the wound iron core 31, a repulsive force or magnetic attraction force is generated between the wound iron core 31 and the oppositely arranged magnetic component 33. By controlling the magnitude and direction of the current in the energized coil 32, the magnitude of the repulsive force or magnetic attraction force between the electromagnet and the magnetic component 33 can be precisely adjusted, thereby achieving continuous dynamic adjustment of the connection stiffness between the base 1 and the mounting assembly 2. When greater rigid support is required, the repulsive force is increased to improve system stiffness; when flexible buffering is required, the repulsive force is reduced or the magnetic attraction force is increased to reduce system stiffness. In this embodiment of the invention, the magnetic component 33 is a magnet.

[0039] Specifically, in this embodiment of the invention, the preset downward pressure on the mounting assembly 2 is adjusted by controlling the current and voltage of the energized coil 32 and changing the magnetic field strength of the wound iron core 31. By controlling the opening and closing of the energized coil 32, the repulsive force or magnetic attraction force can be controlled, thereby adjusting the preset downward pressure and thus achieving the function of adjusting the stiffness of the mounting assembly 2. This allows the pick-and-place machine binding device 10 to simultaneously possess high flexibility and high stiffness. High flexibility allows for lower force control capability, while high stiffness provides reliable positioning accuracy, stability, and better responsiveness. This enables the pick-and-place machine binding device 10 to have a faster operating cycle, reducing production cycle time and improving production efficiency. It should be noted that the technical solution of this invention places the relatively heavy wound iron core 31 and energized coil 32 on the base 1, and the relatively light magnetic component 33 on the mounting assembly 2, to facilitate high-precision force control of the mounting assembly 2.

[0040] In this embodiment of the invention, when the self-weight balancing component is not used to balance the weight of the mounting component 2 and the vertical guide component 4, the structure is more compact because the tension spring is eliminated; at this time, the working process of the pick-and-place machine binding device 10 is as follows: 1. Utilizing the principle that opposite magnetic poles attract each other and like magnetic poles repel each other, when a chip adsorption process is required, the magnetic field of the wound iron core 31 is controlled to be opposite in direction to the magnetic field of the magnetic component 33 below it. The direction of the magnetic field is as follows: Figure 2 As shown, by controlling the current and voltage of the energized coil 32, the magnetic field strength of the wound iron core 31 is changed, thereby adjusting the magnitude of the magnetic attraction force and balancing the weight of the mounting assembly 2 and the vertical guide assembly 4. 2. During the movement of the pick-and-place machine binding head device 10, the magnetic field of the winding iron core 31 is controlled to be in the same direction as the magnetic field of the magnetic component 33 below it. The direction of the magnetic field is as follows: Figure 3 As shown, this creates a repulsive force. By controlling the current and voltage of the energized coil 32, the magnetic field strength of the wound iron core 31 is changed, thereby adjusting the preset downward pressure of the mounting assembly 2. By controlling the energization and opening / closing of the energized coil 32, the switching of the repulsive force can be controlled, thus achieving the adjustment of the preset downward pressure.

[0041] The bonding head device 10 of the pick and place machine adopts closed-loop control in force control. By calibrating the relationship between the moving distance of the transmission component 421 and the preset downward pressure in advance, the moving distance of the transmission component 421 is measured by non-contact distance measurement method to realize closed-loop control of force control. The distance measurement module 6 can monitor the movement displacement of the mounting component 2 in the Z-axis direction in real time, so as to accurately control the movement of the mounting component 2.

[0042] Please see Figure 1The pick and place machine binding device 10 also includes a vertical guide assembly 4, which includes a Z-axis slide rail assembly 41 and a transmission assembly 42. The transmission assembly 42 includes a transmission component 421 and a limit adjustment assembly 422 having a fixed part and a movable part. The fixed part of the limit adjustment assembly 422 is mounted on the base 1, and the movable part of the limit adjustment assembly 422 is in contact with the transmission component 421 so that the mounting assembly 2 does not shift in the vertical direction.

[0043] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, by setting a vertical guide component 4, and by installing the fixed part of the limit adjustment component 422 on the base 1, and by having the movable part of the limit adjustment component 422 fit against the transmission component 421, the placement component 2 can be restricted from shifting in the vertical direction, ensuring the stability of the placement component 2's movement in its Z-axis direction. Specifically, under the action of a preset downward pressure, the limit adjustment component 422 fits against the transmission component 421, so that the placement component 2 does not shift after sliding along the Z-axis direction and then resetting.

[0044] The Z-axis slide rail assembly 41 is mounted on the base 1 along the Z-axis direction. The transmission component 421 is disposed between the Z-axis slide rail assembly 41 and the mounting assembly 2, and the transmission component 421 is located at one end of the mounting assembly 2 corresponding to the magnetic component 33. It can be understood that the coordinated operation of the Z-axis slide rail assembly 41 and the transmission component 42 further improves the motion stability of the mounting assembly 2.

[0045] Furthermore, the limit adjustment assembly 422 includes a limit member 4221 and an adjustment member 4222. The limit member 4221 is installed on the base 1 corresponding to the bottom end of the transmission member 421, and the limit member 4221 and the transmission member 421 are spaced apart. The adjustment member 4222 fits against the transmission member 421 after passing through the limit member 4221.

[0046] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, the limiting member 4221 and the transmission member 421 are spaced apart. By setting a limiting adjustment member 422 between the mounting assembly 2 and the base 1, the position of the transmission member 421 is changed by the displacement of the adjustment member 4222 relative to the limiting member 4221, thereby adjusting the distance between the winding iron core 31 and the magnetic member 33. This achieves the effect of flexibly adjusting the magnetic force output without changing the electrical parameters of the electromagnetic component 3.

[0047] Understandably, electromagnetic principles indicate that electromagnetic force and the distance between magnetic poles have a non-linear, negative correlation; when the distance between magnetic poles decreases, the electromagnetic force increases accordingly. In this embodiment of the invention, the limiting member 4221 of the limiting adjustment assembly 422 is installed on the base 1 corresponding to the bottom end of the transmission member 421. After passing through the limiting member 4221, the adjusting member 4222 fits against the transmission member 421. By rotating or moving the adjusting member 4222, the transmission member 421 can be pushed to move along a direction perpendicular to the magnetic pole connection line, thereby changing the relative distance between the wound iron core 31 and the magnetic member 33. Specifically, when it is necessary to increase the repulsive force or magnetic attraction force, decreasing the distance will result in a greater electromagnetic force output; when it is necessary to decrease the repulsive force or magnetic attraction force, increasing the distance will result in a greater electromagnetic force output.

[0048] In this embodiment of the invention, the technical solution of enhancing magnetic force through spacing adjustment effectively solves the problem in the prior art where increasing the current or voltage of the energized coil is the only way to achieve a greater magnetic force. In the traditional solution, taking a 5mm spacing and a 5V / 1A current to generate a 5N repulsive force as an example, when a 10N repulsive force is required, the current or voltage must be doubled. This will lead to an increase in the magnetic flux density of the wound iron core 31, an increase in the copper loss of the energized coil 32, and an aggravated temperature rise, which can easily cause the magnetic core to saturate or even be damaged. However, the present invention can achieve the target magnetic force output by reducing the spacing, while keeping the electrical parameters unchanged. The magnetic flux density of the wound iron core 31 and the temperature rise of the energized coil 32 are both controlled at the original levels.

[0049] It should be noted that the adjusting member 4222 can be used to adjust the position of the transmission member 421 in the Z-axis direction. Since the mounting assembly 2 moves synchronously with the transmission member 421, the position of the mounting assembly 2 can be adjusted at the same time. Through the cooperation of the limiting member 4221 and the adjusting member 4222, the movement of the transmission member 421 and the mounting assembly 2 in the Z-axis can be limited and adjusted, thereby improving the controllability of the movement of the mounting machine binding head device 10.

[0050] In this embodiment of the invention, the adjusting member 4222 is an adjustable limiting screw that can adjust the position of the mounting assembly 2 in the height direction. When the energizing coil 32 is energized and a preset downward pressure is applied to the mounting assembly 2, the transmission member 421 is tightly fitted to the limiting screw, ensuring the positioning accuracy of the mounting assembly 2. It can be understood that the adjusting member 4222 is a threaded component, and the transmission member 421 will only abut against the limiting member 4221 mounted on the base 1 when it extends downward to a certain extent in the Z-axis direction.

[0051] Please continue reading. Figure 1The mounting assembly 2 includes a floating seat 21 and a working head 22 arranged sequentially in the Z-axis direction. The magnetic component 33 and the transmission component 421 are both located on the floating seat 21 at one end away from the working head 22. The magnetic component 33 and the transmission component 421 are arranged to avoid each other. The limiting component 4221 and the adjusting component 4222 are also arranged to avoid each other from the floating seat 21.

[0052] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, the transmission component 421, the floating seat 21 and the working head 22 are arranged sequentially in the Z-axis direction. The placement component 2 adopts a separate arrangement of the floating seat 21 and the working head 22 to facilitate the installation layout of related components such as the magnetic component 33 and the Z-axis slide rail assembly 41.

[0053] Understandably, the magnetic component 33 and the transmission component 421 are positioned to avoid each other, and the limiting component 4221 and the adjusting component 4222 are also positioned to avoid each other with the floating seat 21. This avoids motion interference between the components and ensures smooth operation of the pick-and-place machine binding device 10. In this embodiment of the invention, the transmission component 421 is located on the top of the floating seat 21 on the side relatively close to the base 1, and the magnetic component 33 is located on the top of the floating seat 21 on the side relatively far from the base 1. The adjusting component 4222 is located on the bottom of the transmission component 421 on the side relatively close to the base 1. The limiting component 4221 is fixedly mounted on the base 1 and simultaneously sleeved on the adjusting component 4222. The floating seat 21 is located on the bottom of the transmission component 421 on the side relatively far from the base 1.

[0054] Please see Figure 4 and Figure 5 As an optional implementation, the pick-and-place machine binding device 10 further includes a self-weight balancing component 5, which includes a tension spring 51, a first fixing member 52, and a second fixing member 53. The first fixing member 52 is installed on the base 1, and the second fixing member 53 is installed on the floating seat 21. One end of the tension spring 51 is connected and fixed to the first fixing member 52, and the other end is connected and fixed to the second fixing member 53. The tension spring 51 is arranged in parallel with the electromagnetic component 3.

[0055] It should be noted that the distance between the first fixing member 52 and the second fixing member 53 is greater than the free length of the tension spring 51, so that the tension spring 51 produces elastic deformation in the Z-axis direction, which is used to balance the self-weight of the mounting assembly 2 and the vertical guide assembly 4.

[0056] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, the first fixing member 52 is exposed on the base 1, and the second fixing member 53 is exposed on the floating seat 21. The tension spring 51 is arranged parallel to the electromagnetic component 3. The two ends of the tension spring 51 are connected to the first fixing member 52 and the second fixing member 53, respectively. The tension spring 51 is used to balance the weight of the mounting assembly 2 and the vertical guide assembly 4. In the vertical direction, the mounting assembly 2 is subjected to the combined action of its own weight, the elastic tension of the tension spring 51, and the magnetic force of the electromagnetic component 3. The elastic tension of the tension spring 51 offsets part of the weight of the mounting assembly 2, thereby reducing the load on the electromagnetic component 3 and allowing for precise control of the preset downward pressure.

[0057] Understandably, by employing the tension spring 51, the influence of the self-weight of each component of the pick-and-place machine binding device 10 on the material picking and placement pressure can be reduced, the drive load of the electromagnetic component 3 can be reduced, and the movement stability of the pick-and-place machine binding device 10 can be improved. In this embodiment of the invention, the first fixing member 52 is exposed and installed on the side of the base 1 facing the floating seat 21, and the second fixing member 53 is exposed and installed on the side of the floating seat 21 facing the base 1. In this device, the two ends of the tension spring 51 are respectively connected to the base 1 and the floating seat 21. By adjusting the tension amount or elastic coefficient of the tension spring, the flexibility of the placement component 2 during operation can be controlled, while achieving precise control of its own weight. This is suitable for die bonding processes with force control requirements of less than 10g.

[0058] In some embodiments, a hollow channel runs vertically through the base 1 and the floating seat 21. The first fixing member 52, the tension spring 51 and the second fixing member 53 are sequentially arranged in the hollow channel along the Z-axis. This design allows for a more compact structural layout of the self-weight balancing component 5, without additionally occupying the external space of the pick-and-place machine head binding device 10. This facilitates the miniaturization and integration of the overall pick-and-place machine head binding device 10. The centralized layout of each component also facilitates later maintenance and replacement, further reducing the maintenance cost of the pick-and-place machine head binding device 10.

[0059] In this embodiment of the invention, when the self-weight balancing component 5 is used to balance the weight of the mounting component 2 and the vertical guide component 4, the working process of the pick-and-place machine binding device 10 is as follows: 1. Utilizing the principle that opposite magnetic poles attract each other and like magnetic poles repel each other, the pick-and-place machine binding head device 10 energizes the energizing coil 32 during its movement to pick up the chip from the waffle box, blue film, or transfer station. This controls the magnetic field of the wound iron core 31 to form a magnetic field with the same magnetic poles as the magnetic component 33, such as both being N poles or both being S poles. By controlling the current and voltage of the energizing coil 32, the magnetic field strength of the wound iron core 31 is changed, thereby adjusting the magnitude of the repulsive force and providing sufficient preset downward pressure to the mounting assembly 2. At this time, the mounting assembly 2 has high rigidity, enabling the pick-and-place machine binding head device 10 to run smoothly at a relatively fast speed. 2. When the nozzle moves close to the chip, the power coil 32 is de-energized. At this time, the preset downward pressure acting on the mounting assembly 2 disappears, thus achieving high flexibility. The nozzle can make just the right contact with the chip with minimal downward pressure and pick up the chip through vacuum adsorption. 3. During the process of the nozzle picking up the chip and moving it to the substrate, the energizing coil 32 is energized to control the magnetic field of the winding iron core 31 and the magnetic field of the magnetic component 33 to form a magnetic field with the same magnetic pole, so that the mounting assembly 2 has high rigidity; when the chip picked up by the nozzle is close to the substrate, the energizing coil 32 is de-energized. At this time, the mounting assembly 2 has high flexibility and is suitable for die bonding processes with force control requirements of less than 10g.

[0060] Please continue reading. Figure 4 , Figure 5 and Figure 6 The electromagnetic component 3 and the tension spring 51 are located on opposite sides of the mounting component 2 corresponding to the Z-axis slide rail component 41, and the Z-axis slide rail component 41, the electromagnetic component 3 and the tension spring 51 are arranged in a triangular distribution.

[0061] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, the electromagnetic component 3 and the tension spring 51 are arranged on opposite sides of the Z-axis slide rail component 41 on the mounting component 2. The Z-axis slide rail component 41, the electromagnetic component 3 and the tension spring 51 are arranged in a triangular distribution, which can optimize the force structure of the pick-and-place machine binding device 10 and improve the structural stability of the pick-and-place machine binding device 10 during operation.

[0062] Furthermore, the Z-axis slide rail assembly 41, the electromagnetic assembly 3, and the tension spring 51 are arranged in a triangular layout, which can prevent the energized coil 32 on the electromagnetic assembly 3 from accidentally getting tangled in the Z-axis slide rail assembly 41 or the tension spring 51, thereby significantly reducing the failure rate of the pick-and-place machine binding device 10. In this embodiment of the invention, the electromagnetic assembly 3 and the tension spring 51 are coplanar in the Z-axis direction, and the Z-axis slide rail assembly 41, the electromagnetic assembly 3, and the tension spring 51 are arranged in an approximately equilateral triangle, such as... Figure 6 As shown, the structure is relatively regular and the components will not interfere with each other, thus affecting the normal operation of the pick and place machine binding device 10.

[0063] Please see Figure 5 The Z-axis slide rail assembly 41 includes a first slide rail 411 and a second slide rail 412 that can slide relative to each other. The first slide rail 411 and the second slide rail 412 are arranged along the Z-axis direction between the base 1 and the transmission member 421. The first slide rail 411 is fixedly installed on the outer wall surface of the base 1, and the second slide rail 412 is fixedly installed on the outer wall surface of the transmission member 421. The length of the first slide rail 411 is greater than the length of the second slide rail 412. When the pick-and-place machine binding head device moves along the Z-axis direction, the placement assembly moves toward or away from the base so that the second slide rail slides stably relative to the first slide rail.

[0064] In the chip mounter binding device 10 provided in this embodiment of the invention, the first slide rail 411 and the second slide rail 412 are arranged between the base 1 and the transmission member 421 along the Z-axis direction. The relative sliding between the first slide rail 411 and the second slide rail 412 can serve as a guide to complete the force-controlled downward picking and mounting of the chip. It has the advantages of low friction and high precision. Moreover, it will not generate lateral force on the chip when picking up or mounting the chip, avoiding chip damage and affecting yield. Through the cooperation of the first slide rail 411 and the second slide rail 412, the smoothness and guiding consistency of the mounting assembly 2 in the Z-axis movement can be ensured.

[0065] Understandably, the length of the first slide rail 411 is greater than the length of the second slide rail 412. On the one hand, this can adapt to the movement stroke requirements of the mounting component 2, and on the other hand, it can ensure that the second slide rail 412 always slides relative to the first slide rail 411, thereby improving the stability of the stroke.

[0066] It should be noted that the first slide rail 411 and the second slide rail 412 of the Z-axis slide rail assembly 41 can slide relative to each other to form a cross roller guide. A set of cross roller guides is provided between the base 1 and the transmission component 421. As a high-precision, high-rigidity finite linear motion system, the cross roller guide generally consists of two slide rails with V-shaped raceways, a roller cage, and cylindrical rollers. The cylindrical rollers, arranged in a cross pattern, reciprocate on the precision-ground V-shaped raceway surface, capable of withstanding loads in all directions and achieving high-precision, stable linear motion. Compared to linear guides, the cross roller guide is a split structure, consisting of two slide rails that can slide relative to each other, and is generally suitable for short-stroke, high-frequency, and high-precision applications. The main function of the cross roller guide is to provide stable and efficient linear motion. It achieves smooth motion by sliding between the guide rails using precision rollers or other rolling elements. This design allows the cross roller guide to maintain good stability and high load-bearing capacity under multi-directional loads.

[0067] In addition, the cross roller guide is set between the base 1 and the transmission component 421, which can ensure that the first slide rail 411 and the second slide rail 412 will not be easily damaged and affect their lifespan. This also avoids poor relative sliding between the first slide rail 411 and the second slide rail 412, which would affect the accuracy of chip mounting.

[0068] As an automated device, the pick-and-place machine's head-binding device 10 achieves stable support and rapid movement through its cross roller guide structure, ensuring high stability and accuracy during processing, thereby improving placement efficiency and precision. Furthermore, compared to traditional slider guides, the cross roller guide requires less installation space, and its placement between the base 1 and the transmission component 421 makes the overall structure of the pick-and-place machine's head-binding device 10 more compact. Moreover, the rolling friction of the cross roller guide results in less energy loss, further improving the overall working efficiency of the pick-and-place machine's head-binding device 10.

[0069] Please continue reading. Figure 4 and Figure 5 The pick and place machine binding device 10 is also equipped with a distance measuring module 6, which is used to measure the moving distance of the transmission component 421. The distance measuring module 6 is installed on the base 1 on the side corresponding to the transmission component 421.

[0070] In the pick-and-place machine binding device 10 provided in this embodiment of the invention, by pre-calibrating the relationship between the moving distance of the transmission component 421 and the preset downward pressure, a non-contact ranging method is adopted to measure the moving distance of the transmission component 421, thereby realizing closed-loop control of force control. The ranging module 6 can monitor the movement displacement of the mounting component 2 in the Z-axis direction in real time, so as to accurately control the movement of the mounting component 2.

[0071] Understandably, when relative sliding occurs between the first slide rail 411 and the second slide rail 412, the transmission component 421 moves relative to the base 1 along the Z-axis direction. By installing the ranging module 6 on the base 1 on the side corresponding to the transmission component 421, the ranging module 6 and the base 1 remain relatively stationary, and the transmission component 421 moves relative to the ranging module 6, thereby improving the yield of chip packaging achieved by the chip mounting head binding device 10.

[0072] Furthermore, the working head 22 is detachably mounted on the floating base 21 at the end opposite to the magnetic component 33, and the working head 22 is either a vacuum nozzle or a eutectic head.

[0073] In the pick-and-place machine head binding device 10 provided in this embodiment of the invention, the working head 22 is detachably installed and can be either a vacuum nozzle or a eutectic head, adapting to different process requirements and improving the versatility of the pick-and-place machine head binding device 10.

[0074] It should be noted that when the working head 22 is a vacuum nozzle, the pick-and-place machine head binding device 10 can achieve stable use of the vacuum nozzle at high speed. The floating seat 21 is detachably connected to the working head 22 and can be connected to vacuum nozzles of different specifications to adsorb different types of chips. The vacuum nozzle is responsible for picking up and adsorbing chips and completing chip placement. When using a eutectic head to replace the vacuum nozzle, the pick-and-place machine head binding device 10 can also be applied to the eutectic process.

[0075] Please see Figure 1 and Figure 7 The present invention also provides a mounting device 20, which includes a control module 201, a power supply module 202 and the aforementioned pick and place machine binding head device 10. The control module 201 is signal-connected to the pick and place machine binding head device 10, and the power supply module 202 is electrically connected to the energized coil 32.

[0076] Understandably, the control module 201 can send a signal to the pick-and-place machine's bonding head device 10 to pick up or place chips. When chip picking is required, the control module 201 controls the bonding head device 10 to move to the waffle box, blue film, or transfer table. When chip placement is required, the control module 201 controls the bonding head device 10 to move to the substrate where die bonding is required. The power supply module 202 can control the energizing and closing of the energizing coil 32, and control the switching of repulsive or magnetic attraction forces. When chip adsorption is required, the power supply module 202 controls the energizing coil 32 to close, so that the magnetic fields of the wound iron core 31 and the magnetic component 33 are in the same or opposite directions.

[0077] It should be noted that the mounting equipment 20 has the same beneficial effects as the pick and place machine binding device 10 described above, and will not be elaborated here.

[0078] The foregoing provides a detailed description of a chip mounter binding device and mounting equipment according to embodiments of the present invention. Specific examples are used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding head device for a chip mounter, characterized in that: The pick and place machine binding device includes a base, a placement assembly, and an electromagnetic assembly. The placement assembly can move relative to the base in the Z-axis direction, and the electromagnetic assembly is located between the placement assembly and the base. The electromagnetic component includes an electromagnet and a magnetic element. The electromagnet includes a wound iron core and an energized coil. The energized coil is sleeved on the wound iron core. The wound iron core is installed on the base. The magnetic element is installed on the mounting assembly, and the wound iron core and the magnetic element are arranged opposite to each other. When energized, the energized coil and the magnetic component form a magnetic field with the same or opposite magnetic poles, which is used to provide repulsive or magnetic attraction to the base and the mounting assembly; the pick-and-place machine binding device also includes a vertical guide assembly, which includes a Z-axis slide rail assembly and a transmission assembly. The transmission assembly includes a transmission component and a limit adjustment assembly with a fixed part and a movable part. The fixed part of the limit adjustment assembly is installed on the base, and the movable part of the limit adjustment assembly is in contact with the transmission component so that the mounting assembly does not shift in the vertical direction; The Z-axis slide rail assembly is mounted on the base along the Z-axis direction. The transmission component is disposed between the Z-axis slide rail assembly and the mounting assembly, and the transmission component is located on the mounting assembly at one end corresponding to the magnetic component. The limiting adjustment assembly includes a limiting component and an adjusting component. The limiting component is mounted on the base at the bottom end corresponding to the transmission component, and the limiting component and the transmission component are spaced apart. The adjusting component passes through the limiting component and then engages with the transmission component. The mounting assembly includes a floating seat and a working head arranged sequentially along the Z-axis direction. The magnetic component and the transmission component are both disposed on the floating seat at one end away from the working head. The magnetic component and the transmission component are positioned to avoid each other, and the limiting component and the adjusting component are also positioned to avoid each other from the floating seat.

2. The pick-and-place machine head binding device as described in claim 1, characterized in that: The bonding head device of the chip mounter also includes a self-weight balancing component, which includes a tension spring, a first fixing member and a second fixing member; The first fixing member is installed on the base, and the second fixing member is installed on the floating seat. One end of the tension spring is connected and fixed to the first fixing member, and the other end is connected and fixed to the second fixing member. The tension spring and the electromagnetic component are arranged parallel to each other. The distance between the first fixing member and the second fixing member is greater than the free length of the tension spring, so that the tension spring generates elastic deformation in the Z-axis direction to balance the weight of the mounting component and the vertical guide component.

3. The pick-and-place machine head binding device as described in claim 2, characterized in that: The electromagnetic component and the tension spring are disposed on opposite sides of the mounting component corresponding to the Z-axis slide rail component, and the Z-axis slide rail component, the electromagnetic component and the tension spring are arranged in a triangular distribution.

4. The bonding head device for a chip mounter as described in claim 1, characterized in that: The Z-axis slide rail assembly includes a first slide rail and a second slide rail that can slide relative to each other, and the first slide rail and the second slide rail are arranged along the Z-axis direction between the base and the transmission member; The first slide rail is fixedly installed on the outer wall of the base, and the second slide rail is fixedly installed on the outer wall of the transmission component, and the length of the first slide rail is greater than the length of the second slide rail; When the pick-and-place machine binding head device moves along the Z-axis, the placement assembly moves toward or away from the base, so that the second slide rail slides stably relative to the first slide rail.

5. The pick-and-place machine head binding device as described in claim 4, characterized in that: The bonding head device of the chip mounter is also equipped with a distance measuring module for measuring the moving distance of the transmission component. The distance measuring module is installed on the base on one side corresponding to the transmission component.

6. The pick-and-place machine head binding device as described in claim 1, characterized in that: The working head is detachably mounted on the floating base at the end opposite to the magnetic component, and the working head is one of a vacuum nozzle or a eutectic head.

7. A mounting device, characterized in that, The mounting equipment includes a control module, a power supply module, and a mounting head binding device as described in any one of claims 1-6; The control module is connected to the bonding head device of the placement machine via a signal connection, and the power supply module is electrically connected to the energized coil.

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