Substrate conveying method, substrate conveying apparatus, and substrate processing method

Abstract

The present application provides a substrate carrying method, a substrate carrying device and a substrate processing method, in a substrate carrying technology which carries a substrate while keeping the peripheral portion of the substrate in a floating state and a substrate processing technology which supplies a processing liquid to the upper surface of the substrate while carrying the substrate using the substrate carrying technology, it is possible to cope with a plurality of substrates having different substrate sizes in the carrying direction. The relative relationship between the carrying-in position of the substrate and the holding position of the holding portion is changed depending on whether the substrate carried into the upper portion of the floating stage is a first substrate or a second substrate. Therefore, in the substrate carrying portion, the relationship between the carrying-in position and the holding position of the holding portion can be adjusted for either of the first substrate and the second substrate. Thus, for substrates having different lengths in the carrying direction, the position of the holding portion is appropriately adjusted, and the substrate carried into the upper portion of the floating stage is reliably held by the holding portion. As a result, it is not necessary to redesign and manufacture the substrate carrying portion.

Description

Technical Field

[0001] This invention relates to a substrate transport method, a substrate transport apparatus, and a substrate processing method that supplies a processing liquid to the upper surface of a substrate being transported along a predetermined transport direction by blowing fluid onto the lower surface of a substrate having a rectangular shape, thereby maintaining the substrate in a horizontal position while it is in a floating state. Furthermore, the substrates include glass substrates for FPD (flat panel display) devices such as liquid crystal display devices or organic EL display devices, substrates for semiconductor wafers, glass substrates for photomasks, substrates for filters, substrates for recording discs, substrates for solar cells, substrates for electronic paper, and substrates for semiconductor packaging (hereinafter, simply referred to as "substrates"). Background Technology

[0002] In the manufacturing process of electronic devices such as semiconductor devices or liquid crystal display devices, a substrate processing apparatus is used to supply a liquid, such as a photoresist solution, to the surface of a substrate and apply the liquid to the substrate. For example, the substrate processing apparatus described in Japanese Patent Application Publication No. 2024-30264 transports the substrate while keeping it in a floating state, delivers liquid to a slit nozzle, and sprays the liquid from the nozzle's outlet onto the surface of the substrate, thus coating the substrate approximately across its entire surface.

[0003] This substrate processing apparatus includes: a floating stage section, from which gas is blown from the upper surface of the floating stage, which is opposite to the center of the lower surface of the substrate, to lift the substrate; and an adsorption travel control mechanism, which is an example of the substrate transport apparatus of the present invention. Furthermore, the adsorption travel control mechanism adsorbs and holds the periphery of the substrate, which is lifted by the floating stage section, and transports it along a horizontal transport direction. With this configuration, even large-sized substrates can be precisely controlled in terms of their relative position to the slit nozzle (an example of the "coating position" to be described later), resulting in a uniform coating film thickness.

[0004] In the manufacturing process of such substrates, in addition to standardized standard sizes, substrates with different external dimensions are sometimes used. For example, in glass substrates for manufacturing liquid crystal display panels, a substrate size with half the length along the transport direction is sometimes used, relative to the substrate size commonly referred to as G8 (2160mm × 2460mm). In this specification, the large substrate is referred to as a full-size substrate, and the substrate with half the length along the transport direction is referred to as a half-size substrate.

[0005] On the other hand, in the substrate processing apparatus, the floating stage section is divided into three stages. More specifically, the floating stage section includes: a coating stage, positioned opposite the slit nozzle; an upstream floating stage, disposed upstream of the coating stage in the substrate transport direction; and a downstream floating stage, disposed downstream of the coating stage in the same transport direction. Once the substrate is moved into the upstream floating stage, the substrate transport section (corresponding to the "substrate transport apparatus" of the present invention) begins to pick up and transport the substrate. At this time, the position of the substrate when it is moved into the upstream floating stage, for example, the position of the front end of the substrate in the transport direction, varies depending on the substrate size. Furthermore, in existing substrate processing apparatuses, the design is already optimized for substrates of a specific size, and the holding position of the peripheral portion of the substrate is fixed using a clamping mechanism. As a result, since the substrate sizes vary in the transport direction, it is necessary to redesign and manufacture a substrate transport section that matches them. Summary of the Invention

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a technology that can handle a variety of substrates with different substrate sizes in the transport direction, in a substrate transport technology that transports the substrate while keeping it in a floating state at its periphery and in a substrate processing technology that supplies processing liquid to the upper surface while transporting the substrate using the substrate transport technology.

[0007] The first aspect of the present invention discloses a substrate transport method, wherein a substrate being transported onto a floating platform above which gas is ejected upwards is held from the lower surface side by a holding portion above the floating platform, and the substrate is transported along a first direction. The substrate transport method is characterized by comprising: a first transport step, wherein when the substrate being transported onto the floating platform is a first substrate having a rectangular shape having a first length in a first direction and having a first side and a second side opposite to each other in a second direction orthogonal to the first direction, after adjusting the relationship between the transport position of the first substrate and the holding position of the holding portion, the first substrate is moved along the first direction while partially holding the vicinity of at least one of the first and second sides by the holding portion; and a second transport step, wherein when the substrate being transported onto the floating platform is a second substrate having a rectangular shape having a second length shorter than the first length in the first direction and having a third side and a fourth side opposite to each other in the second direction, after adjusting the relationship between the transport position of the second substrate and the holding position of the holding portion, the second substrate is moved along the first direction while partially holding the vicinity of at least one of the third and fourth sides by the holding portion.

[0008] Furthermore, the substrate transport apparatus of the second aspect of the present invention is used to perform a substrate transport method, characterized in that the substrate transport apparatus comprises: a substrate size determination unit for determining whether the substrate being transported onto the upper part of the floating platform is a first substrate or a second substrate; a first transport control unit for moving the first substrate along the first direction while partially holding the vicinity of at least one of the first side and the second side using the holding part, after adjusting the relationship between the transport position of the first substrate and the holding position of the holding part, when the substrate size determination unit determines that it is the first substrate; and a second transport control unit for moving the second substrate along the first direction while partially holding the vicinity of at least one of the third side and the fourth side using the holding part, after adjusting the relationship between the transport position of the second substrate and the holding position of the holding part, when the substrate size determination unit determines that it is the second substrate.

[0009] Furthermore, the third-party substrate processing method of the present invention, while holding a substrate that has been moved onto a floating platform above which gas is being ejected upwards using a holding part above the floating platform, transports the substrate along a first direction and supplies processing liquid to the substrate, is characterized by the following: the substrate processing method includes a first processing step, in which, when the substrate moved onto the floating platform is a first substrate having a rectangular shape having a first length in a first direction and having a first side and a second side opposite to each other in a second direction orthogonal to the first direction, after adjusting the relationship between the moving position of the first substrate and the holding position of the holding part, while using the holding part... While partially holding the vicinity of at least one of the first and second sides, the first substrate is moved along a first direction and the processing liquid is supplied to the first substrate; and in the second processing step, when the substrate being moved onto the floating platform is a rectangular substrate having a second length shorter than the first length in the first direction and a third and fourth side opposite to each other in the second direction, after adjusting the relationship between the loading position of the second substrate and the holding position of the holding part, the second substrate is moved along the first direction while partially holding the vicinity of at least one of the third and fourth sides by the holding part, and the processing liquid is supplied to the second substrate.

[0010] The relative relationship between the substrate's loading position and the holding position of the holding part varies depending on whether the substrate being loaded onto the floating platform is a first substrate with a first length in the first direction or a second substrate with a second length in the first direction. Therefore, in this invention, the relationship between the loading position and the holding position of the holding part can be adjusted for either the first substrate or the second substrate. Thus, by appropriately positioning the holding part for substrates with different lengths in the transport direction, the substrate loaded onto the floating platform is reliably held by the holding part and stably transported in the first direction.

[0011] The effects of the invention

[0012] As described above, according to the present invention, it is possible to handle a variety of substrates with different substrate sizes in the transport direction. Attached Figure Description

[0013] Figure 1 This is a schematic diagram showing the overall structure of the coating apparatus as a first embodiment of the substrate processing apparatus of the present invention.

[0014] Figure 2 This is a top view of the coating apparatus viewed from vertical.

[0015] Figure 3 From Figure 2 Top view of the coating mechanism after it has been removed.

[0016] Figure 4 This is a schematic diagram showing the traveling section of the adsorption travel control mechanism.

[0017] Figure 5 This is a schematic diagram illustrating the clamping unit of the adsorption travel control mechanism.

[0018] Figure 6 It means by Figure 1 The flowchart shows the coating action performed by the coating device.

[0019] Figure 7 It is a diagram showing the positional relationship in the horizontal plane of the substrate and clamp that are moved above the upstream floating platform.

[0020] Figure 8 This is a diagram showing the positional relationship in the horizontal plane between the substrate and the clamp that are moved above the upstream floating platform in the second embodiment of the present invention.

[0021] Figure 9 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the third embodiment of the present invention.

[0022] Figure 10 This is a schematic diagram illustrating the structure of the traveling section in the fourth embodiment of the present invention.

[0023] Figure 11 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the fourth embodiment.

[0024] Figure 12 This is a top view of the coating apparatus, a fifth embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above.

[0025] Figure 13 This is a diagram showing the positional relationship between the loading substrate and the fixture in the horizontal plane in the fifth embodiment.

[0026] Figure 14 This is a diagram showing the positional relationship between the substrate and the fixture in the horizontal plane in the coating apparatus of the sixth embodiment of the substrate processing apparatus of the present invention.

[0027] Figure 15 This is a diagram showing the positional relationship between the substrate and the fixture in the horizontal plane in the coating apparatus of the seventh embodiment of the substrate processing apparatus of the present invention.

[0028] Figure 16 This is a diagram showing the positional relationship between the substrate and the fixture in the horizontal plane in the coating apparatus of the eighth embodiment of the substrate processing apparatus of the present invention.

[0029] Figure 17 This is a top view of the coating apparatus of the ninth embodiment of the substrate processing apparatus of the present invention, viewed from vertical above.

[0030] Figure 18 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the ninth embodiment.

[0031] Figure 19 This is a diagram showing the positional relationship between the substrate and the clamp in the horizontal plane in the tenth embodiment of the substrate processing apparatus of the present invention.

[0032] Figure 20 This is a top view of the coating apparatus of the eleventh embodiment of the substrate processing apparatus of the present invention, viewed from vertical above.

[0033] Figure 21 This is a schematic diagram showing the traveling section of the adsorption traveling control mechanism in the eleventh embodiment.

[0034] Figure 22 This is a schematic diagram of the clamping unit of the adsorption travel control mechanism in the eleventh embodiment.

[0035] Figure 23 This is a diagram showing the positional relationship in the horizontal plane between the substrate and the clamp that are moved above the upstream floating platform in the eleventh embodiment.

[0036] Figure 24 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane in the twelfth embodiment of the present invention.

[0037] Figure 25 This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane according to the thirteenth embodiment of the present invention.

[0038] Figure 26This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane according to the fourteenth embodiment of the present invention.

[0039] Figure 27 This is a top view of the coating apparatus according to the fifteenth embodiment of the substrate processing apparatus of the present invention, viewed from vertical above.

[0040] Figure 28 This is a schematic diagram showing the traveling section of the adsorption travel control mechanism in the fifteenth embodiment.

[0041] Figure 29 This is a diagram showing the positional relationship in the horizontal plane between the substrate and the clamp that are moved above the upstream floating platform in the fifteenth embodiment.

[0042] Explanation of reference numerals in the attached figures: 1: Coating apparatus (substrate processing apparatus) 3A: Upstream floating platform 3B: Central Floating Platform 3C: Downstream floating platform 5: Substrate handling section 7: Coating organization 9: Control Unit 51: Fixture mechanism 51L, 51R: Fixture Unit 51a~51f: Fixtures 52: Adsorption and travel control mechanism 52L, 52R: Propeller section 53L, 53R: Interval Adjustment Section Dt: Direction of transport Pfb: (Full-size substrate) Rear end position Pfc: (Central position of the full-size substrate) Pff: (Full-size substrate) Front end position Phb: (Rear end position of half-size substrate) Phc: (Central position of half-size substrate) Phf: (Front-end position of half-size substrate) Psb: (The rear position of the fixture) Psc: (Central position of the fixture) Psf: (Front position of the fixture) Psw: Standby position S: Substrate Sb: (substrate) lower surface Sf: Full-size substrate Sh: Half-size substrate X: X direction (first direction) Y: Y direction (second direction) Detailed Implementation

[0043] <First Implementation>

[0044] Figure 1 This is a schematic diagram showing the overall structure of a coating apparatus according to a first embodiment of the substrate processing apparatus of the present invention. The coating apparatus 1 is used to coat substrates from... Figure 1 A slit coating machine is used to coat the upper surface Sa of a substrate S, which is carried horizontally with its left side facing the right side, with a coating liquid applied. For example, this coating apparatus 1 is preferred for coating the upper surface Sa of various substrates S, such as glass substrates and semiconductor substrates, with a coating liquid containing a resist film, a coating liquid containing an electrode material, or other processing liquids, to form a uniform coating film.

[0045] Furthermore, in the following figures, to clarify the configuration relationships of the various parts of the device, such as... Figure 1 As shown, a right-handed XYZ orthogonal coordinate system is established. The transport direction of substrate S is referred to as the "X direction". Figure 1 The horizontal direction from the left hand side to the right hand side is called the "+X direction," and its opposite direction is called the "-X direction." Furthermore, the front side (near the front in the diagram) of the device in the horizontal direction Y, which is orthogonal to the X direction, is called the "-Y direction," and the back side of the device is called the "+Y direction." Additionally, the upward and downward directions in the vertical direction Z are called the "+Z direction" and "-Z direction," respectively. Furthermore, the (-X) side is called the upstream side of the X direction, and the (-X) side is called the downstream side of the X direction.

[0046] In the coating apparatus 1, the input conveyor 100, the input transfer unit 2, and the lifting unit 3 are arranged close to each other in sequence along the transport direction Dt (+X direction) of the substrate S, as detailed below, and together they form a transport path of the substrate S extending in a generally horizontal direction.

[0047] The substrate S, which is the object of processing, is removed from... Figure 1 The substrate S is fed into the input conveyor 100 from the left side. The input conveyor 100 includes a roller conveyor 101 and a rotation drive mechanism 102 that rotates the roller conveyor 101. By rotating the roller conveyor 101, the substrate S is transported horizontally downstream in the (+X) direction. The input transfer unit 2 includes a roller conveyor 21 and a rotation lifting drive mechanism 22, which has the function of rotating and driving the roller conveyor 21 and lifting and lowering the roller conveyor 21. By rotating the roller conveyor 21, the substrate S is further transported in the (+X) direction. In addition, by lifting and lowering the roller conveyor 21, the vertical position of the substrate S is changed. Using the input transfer unit 2 configured in this way, the substrate S is transferred from the input conveyor 100 to the floating unit 3.

[0048] Figure 2 This is a top view of the coating apparatus from a vertical perspective. Additionally, Figure 3 From Figure 2 A top view of the coating mechanism after removal. The following is a reference to these attachments. Figure 1 The specific mechanical structure of the coating apparatus 1 will be described below. For some mechanisms, a more detailed understanding of the structure can be obtained by referring to the contents of Japanese Patent Application Publication No. 2024-30264. Furthermore, in Figure 2 and Figure 3 The description of the rollers in the input conveyor 100, etc., is omitted.

[0049] like Figure 3 As shown, the levitation section 3 consists of three levitation platforms. The upstream levitation platform 3A and the downstream levitation platform 3C each have a plurality of air ejection holes arranged in a matrix pattern across the entire surface of a plate-shaped platform. Furthermore, by applying compressed air to each ejection hole, the airflow generated by the compressed air ejected from each hole causes the substrate S to levitate. Thus, on the upstream levitation platform 3A and the downstream levitation platform 3C, the substrate S levitates from the platform surface to a predetermined levitation height, for example, 10 to 500 micrometers. To supply compressed air to each ejection hole, as follows... Figure 1 As shown, a buoyancy control mechanism 35 is provided. Thus, in this embodiment, air is used as the "gas" of the present invention.

[0050] In addition, although the illustration is omitted, the upstream floating platform 3A and the downstream floating platform 3C, in addition to the aforementioned ejection holes, also have a plurality of lifting pins. Furthermore, as... Figure 1As shown, lifting pin drive mechanisms 34 and 36 are respectively provided for the upstream floating platform 3A and the downstream floating platform 3C to enable the lifting pins to move up and down. A plurality of lifting pins are configured to pass through the gaps between the ejection holes and are spaced at predetermined intervals, directly opposite the lower surface Sb of the substrate S. The lifting pins are driven by the lifting pin drive mechanisms 34 and 36 located below the platform surface to move up and down in the vertical direction (Z-axis direction). That is, the substrate S is raised and / or lowered on the upstream floating platform 3A and the downstream floating platform 3C. Thus, as explained later, in the upstream floating platform 3A, the floating substrate S is transferred to the substrate transport unit 5 by the movement of the lifting pins driven by the lifting pin drive mechanism 34. On the other hand, in the downstream floating platform 3C, the substrate S raised by the lifting pin drive mechanism 36 is handed over to the transfer robot (not shown). In addition, in this embodiment, the unloading process is performed by a transfer robot. However, similar to the device described in Japanese Patent Application Publication No. 2024-30264, an output transfer unit and an output conveyor may be provided on the downstream side of the downstream floating platform 3C, and the unloading process may be performed by them.

[0051] On the other hand, the central floating platform 3B is configured to have higher floating accuracy than the upstream floating platform 3A and the downstream floating platform 3C. Specifically, the central floating platform 3B has a rectangular, plate-shaped platform surface. In this central floating platform 3B, a plurality of holes are distributed in a matrix pattern with a narrower spacing than the ejection holes provided in the upstream floating platform 3A and the downstream floating platform 3C. Furthermore, unlike the upstream and downstream floating platforms 3A and 3C, in the central floating platform 3B, half of the holes function as compressed air ejection holes, and the remaining half function as suction holes. That is, compressed air is ejected from the ejection holes towards the lower surface Sb of the substrate S, thereby supplying compressed air into the space between the platform surface and the lower surface Sb of the substrate S. On the other hand, it is configured to draw air from the space via the suction holes. By ejecting and drawing air into the aforementioned space, the compressed air flow ejected from each ejection hole diffuses horizontally within the space and is then drawn into the air layer (pressurized gas layer) adjacent to that ejection hole, resulting in a more stable pressure balance. This allows for highly precise and stable control of the levitation height of the substrate S. Furthermore, the levitation control mechanism 35 controls the supply of compressed air to each ejection hole and the drawing of air from the suction hole.

[0052] The substrate S, which is transferred into the floating section 3 via the input transfer unit 2, is propelled in the (+X) direction by the rotation of the roller conveyor 21, and thus transferred onto the upstream floating stage 3A. The upstream floating stage 3A, the central floating stage 3B, and the downstream floating stage 3C support the substrate S in a floating state, but do not have the function of moving the substrate S in the horizontal direction. The transfer of the substrate S in the floating section 3 is performed by the substrate transfer unit 5, which is located below the upstream floating stage 3A, the central floating stage 3B, and the downstream floating stage 3C.

[0053] The substrate transport unit 5 includes a clamping mechanism 51 and an adsorption travel control mechanism 52. The clamping mechanism 51 has four clamps 51a to 51d, all or part of which partially abut against the peripheral portion of the lower surface of the substrate S, thereby supporting the substrate S from below. Clamps 51a and 51b, located on the (+Y) side, are mounted on a base 521 on the (+Y) side. Furthermore, clamps 51a and 51b are connected to each other in a separated state in the X direction via the base 521. While connected, clamps 51a and 51b are supported by a travel guide 523 on the (+Y) side, enabling them to travel in the X direction. Additionally, adsorption pads are provided on the upper surfaces of clamps 51a and 51b.

[0054] The clamps 51c and 51d, located on the (-Y) side, are also mounted on the base 521 on the (-Y) side. Furthermore, the clamps 51c and 51d are connected to each other in a separated state via the base 521. While connected, they can be supported by the travel guide 523 extending along the X direction on the (-Y) side of the base 10, allowing them to travel in the X direction. Additionally, suction pads are provided on the upper surfaces of the clamps 51c and 51d, and the entire upper surface of the clamps 51c and 51d functions as a holding surface for adsorbing and holding the lower peripheral portion of the substrate S.

[0055] The adsorption travel control mechanism 52 has the function of applying negative pressure to the adsorption pad of the adsorption member provided on the upper end of the clamping mechanism 51 to adsorb and hold the substrate S, and the function of causing the clamping mechanism 51 to reciprocate along the travel guide 523 in the X direction. Furthermore, the adsorption travel control mechanism 52 is controlled by the control unit 9 to cause the clamps 51a to 51d to travel in such a way that clamps 51a and 51c are always in the same position in the X direction, and clamps 51b and 51d are in the same position. Thus, the four clamps 51a to 51d appear to move as a single clamping mechanism 51. In this specification, this type of movement is referred to as "integrated movement type" to distinguish it from the "unit-based movement type" or "clamp-independent movement type" used in the embodiments described later. Furthermore, a more detailed description of the structure of the substrate transport unit 5 will be provided later.

[0056] The clamping mechanism 51 holds the substrate S that has been moved from the input transfer unit 2 into the floating unit 3. In this state, the clamping mechanism 51 moves in the (+X) direction, thereby transporting the substrate S from above the upstream floating platform 3A, over the central floating platform 3B, to above the downstream floating platform 3C. After the substrate S is lifted from the downstream floating platform 3C by the lifting pin drive mechanism 36, it is handed over to the transfer robot (not shown).

[0057] Along the transport path of the substrate S transported in the manner described above, a coating mechanism 7 is provided for applying a coating liquid to the upper surface Sa of the substrate S. The coating mechanism 7 has a slit nozzle 71. Additionally, as... Figure 1 As shown, the slit nozzle 71 is connected to a nozzle drive mechanism 8. The nozzle drive mechanism 8 has a lifting section that raises and lowers the slit nozzle 71 in the Z direction and a moving section that moves the slit nozzle 71 in the X direction. Therefore, according to the command from the control unit 9, the lifting section and / or the moving section are activated, thereby positioning the slit nozzle 71 in a coating position above the central floating platform 3B, an upper position separated from the coating position, a contact position slightly below the coating position for performing contact actions, or a maintenance position. Furthermore, the slit nozzle 71 is connected to a coating liquid supply mechanism (not shown), from which coating liquid is supplied, and the coating liquid is sprayed out as a treatment liquid from the spray outlet 711 that opens downward at the lower part of the nozzle.

[0058] The slit nozzle 71 has an outlet 711 extending along the Y direction and is supported by a nozzle support 701 to spray coating liquid vertically downwards (towards the -Z side). The nozzle support is connected to the nozzle drive mechanism 8. When coating liquid is supplied to the upper surface Sa of the substrate S using the slit nozzle 71, the lifting and moving parts are controlled by the control unit 9, causing the slit nozzle 71 to move with the outlet 711 in the upper position. Then, the lifting part is controlled by the control unit 9 to adjust the gap between the outlet 711 and the substrate S to a predetermined value by descending to the contact position (contact action) and rising to the coating position. Then, in the state where the gap adjustment is completed, coating liquid is sprayed from the outlet 711 onto the upper surface Sa of the substrate S, while the substrate S is transported along the (+X) direction.

[0059] Furthermore, the nozzle support 701 is configured to move in the X direction. Specifically, a pair of travel guides 81L and 81R extending in the X direction are respectively mounted on the upper surfaces of the (+Y) and (-Y) side ends of the base 10. The nozzle support 701 engages with the travel guides 81L and 81R via a sliding member (not shown) mounted at its lower part, allowing it to move freely in the X direction along the travel guides 81L and 81R. Therefore, by controlling the moving part via the control unit 9, the slit nozzle 71 is moved in the X direction.

[0060] In order to perform the prescribed maintenance on the slit nozzle 71 configured as described above, such as Figure 1 As shown, a nozzle cleaning standby unit 79 is provided on the coating mechanism 7. The nozzle cleaning standby unit 79 mainly includes a roller 791, a cleaning section 792, and a roller groove 793. The roller groove 793 is supported by a roller groove support section 702 extending along the Y direction. The roller groove support section 702 engages with travel guides 84L and 84R via a sliding member (not shown) mounted on its lower part, and moves freely along the travel guides 84L and 84R in the X direction. Therefore, the control unit 9 controls the moving section, thereby moving the nozzle cleaning standby unit 79 along the X direction. Furthermore, with the slit nozzle 71 positioned in the maintenance position, nozzle cleaning and pre-ejection processing are performed appropriately, adjusting the nozzle outlet of the slit nozzle 71 to a state suitable for the next coating process.

[0061] Next, refer to Figures 2 to 5 The detailed structure of the substrate transport unit 5 will be described. Figure 4 This diagram schematically illustrates the traveling section of the adsorption traveling control mechanism, extracting and illustrating the structure of the traveling section that transports the substrate in the levitation section. Figure 5 This is a schematic diagram of the clamping unit of the adsorption travel control mechanism, extracting and schematically showing the structure for adsorbing the substrate above the levitation part.

[0062] In the clamping mechanism 51, clamps 51a and 51b are mounted on the base 521 on the (+Y) side and function as clamping unit 51L, while clamps 51c and 51d are mounted on the base 521 on the (-Y) side and function as clamping unit 51R. Furthermore, a traveling section 52L for moving the base 521 carrying the clamping unit 51L along the transport direction Dt is provided on the (+Y) side of the lifting section 3, and a traveling section 52R for moving the base 521 carrying the clamping unit 51R along the transport direction Dt is provided on the (-Y) side of the lifting section 3. These traveling sections 52L and 52R have the same structure, such as... Figure 2 and Figure 3As shown, when viewed from above, these traveling parts 52L and 52R are symmetrically arranged with respect to the floating part 3. Similarly, the clamping units 51L and 51R are also arranged in the same manner. Therefore, in this specification, while referring to… Figure 4 and Figure 5 The structure of the clamping unit 51R and the traveling part 52R will be described in detail. On the other hand, the structure of the clamping unit 51L and the traveling part 52L will be labeled with the same reference numerals and the description will be omitted.

[0063] The traveling unit 52R includes a base 521, sliders 522, a traveling guide 523, and a linear motor 524. The base 521 has a flat plate shape extending in the X direction, and its upper surface is machined to be flat. A clamping unit 51R is mounted on the upper surface of the base 521. Two sliders 522 are mounted on the lower surface of the base 521. The sliders 522 engage with the traveling guide 523. Thus, the base 521 can travel in the X direction along the traveling guide 523 while holding the substrate S held by the clamping unit 51R and the substrate S held by the clamping unit 51R. Furthermore, in the first embodiment, as explained in detail later, in order to vary the X-direction position of the clamping unit 51R according to the substrate size in the transport direction Dt (X direction), such as... Figure 2 and Figure 3 As shown, the end of the travel guide 523 on the (-X) direction side extends into the adjacent area of ​​the input conveyor 100.

[0064] In addition, a linear motor 524 is provided to enable the base 521 to move. Specifically, the magnet module 524M of the linear motor 524 extends along the X direction on the base 10 as a fixing member, and the coil module 524C is mounted on the lower part of the base 521 as a moving member. The linear motor 524 operates according to control commands from the control unit 9, thereby moving the base 521 along the X direction. As a result, the substrate S, which is attracted to the clamping unit 51R on the base 521, moves along the transport direction Dt. Furthermore, the X-direction position of the clamping unit 51R can be detected using a linear scale (not shown). While the linear motor 524 is used to move the substrate S in the first embodiment, it is also possible to use other traveling mechanisms, such as a ball screw mechanism, and to use an encoder to detect the X-direction position of the clamping unit 51R.

[0065] The clamps 51c and 51d constituting the clamp unit 51R have the same structure and are separated and disposed on the upper surface of the base 521 at a distance corresponding to the X-direction dimension of the full-size substrate Sf. More specifically, as... Figure 4 As shown, clamps 51c and 51d are arranged separately from each other with a distance L from the rear end of clamp 51c to the front end of clamp 51d. Here, only the structure of clamp 51c will be described, and the structure of the other clamp will be omitted.

[0066] The clamp 51c has a retaining member 511 mounted on the base 521. The retaining member 511 is configured to be freely attached and detached from the base 521, for example, by means of a fastening member 512 such as bolts. The upper end of the retaining member 511 is machined to be flat, and at least one (two in this example) adsorption pad 513 is provided on the upper surface. By supplying negative pressure to the adsorption pad 513 from the negative pressure application part 514, the retaining member 511 adsorbs and holds the substrate S in a state where the adsorption pad 513 abuts against the lower surface Sb of the substrate S.

[0067] The upper surface of the base 521 is machined to be flat and has a plurality of threaded holes 521a for mounting the retaining member 511. On the other hand, the retaining member 511 has a through hole 515 through which the fixing member 512 is inserted. By screwing the fixing member 512, which is inserted through the through hole 515 of the retaining member 511, into the threaded hole 521a of the base 521, the retaining member 511 is joined to the base 521.

[0068] Here, the base 521 has more threaded holes 521a than the retaining member 511 has through holes 515. Specifically, the retaining member 511 has a plurality of (three in this example) through holes 515 at constant intervals in the X direction. On the other hand, the base 521 has more threaded holes 521a (five in this example) arranged in the X direction at the same intervals as the through holes 515 in the retaining member 511. Furthermore, the base 521 has a plurality of (three columns in this example) rows of threaded holes 521a arranged in this way in the X direction at different positions in the Y direction.

[0069] Therefore, the mounting position of the retaining member 511 relative to the base 521 is not unique, and multiple retaining members 511 are provided in both the X and Y directions. That is, the retaining member 511 can be positioned in multiple ways on the base 521. Multiple retaining member 511 mounting positions are provided at the (-X) side end and the (+X) side end of the base 521, respectively.

[0070] The negative pressure supply unit 514 is mounted on the base 521 corresponding to the retaining member 511 mounted on the base 521. The negative pressure supply unit 514 has: a manifold portion 514a, which has a cavity formed inside to form a manifold space; and a flexible tube 514b connected to the manifold portion 514a. With the retaining member 511 mounted on the base 521, the flexible tube 514b is connected to the suction port 519 provided on the retaining member 511 and communicating with the suction pad 513. The internal space of the manifold portion 514a is connected to a suction source such as a vacuum pump (see figure) via a piping 516 in a cable bracket (not shown) connected to the base 521. Figure 3 (Connection). Additionally, an on / off valve 517 is installed on piping 516.

[0071] Therefore, when the on / off valve 517 is opened according to the opening command from the control unit 9, the negative pressure supplied from the suction source is supplied to the adsorption pad 513 via the manifold 514a and the flexible tube 514b. As a result, the peripheral portion of the lower surface of the substrate S is adsorbed and held. On the other hand, when the on / off valve 517 is closed according to the closing command from the control unit 9, the supply of the aforementioned negative pressure stops. Furthermore, in the first embodiment, as... Figure 3 As shown, the supply / stop of negative pressure to clamps 51c and 51a is switched by one on / off valve 517 (first common on / off valve 517a), while the supply / stop of negative pressure to clamps 51d and 51b is switched by another on / off valve 517 (second common on / off valve 517b). Alternatively, a dedicated on / off valve 517 can be provided for each of clamps 51a to 51d, and the control unit 9 can control the opening and closing of each valve 517.

[0072] A control unit 9 is provided to control each part of the coating apparatus 1 configured as described above. Figure 1 As shown, the control unit 9 is configured as a general computer system consisting of an arithmetic unit 91 (e.g., a CPU) that performs various arithmetic operations, a storage unit 92 (e.g., a ROM or RAM) that stores basic programs and various information, and a bus. The bus also connects a disk 93 (e.g., a hard disk drive) for storing coating programs, a display unit 94 (e.g., a monitor) for displaying various information, and an input unit 95 (e.g., a keyboard and mouse) for receiving input from the operator. Alternatively, a touch panel display integrating the display unit 94 and the input unit 95 can be used. Furthermore, by receiving signals from sensors installed in various parts of the device via an interface (not shown), the arithmetic unit 91 of the control unit 9 controls each part of the device according to the coating program to perform the coating process described below.

[0073] Furthermore, although the substrate S transported into the upstream floating stage 3A via the input conveyor 100 and the input transfer unit 2 has a rectangular shape, there are cases where "small-sized substrates" and "large-sized substrates" with different dimensions in the transport direction Dt are floated and transported while coating is being performed. Here, "large-sized substrate" refers to a substrate with a first length (and thereafter) in the transport direction Dt. Figure 7In the attached diagram, the first and second sides of a substrate (referred to as Lf) are opposite each other in the Y direction. "Small-size substrate" refers to a substrate with the same width as the large-size substrate (hereinafter referred to as Lf). Figure 7 (referring to the figure in Figure W), and has a second length shorter than the first length in the transport direction Dt (thereafter). Figure 7 The first and second sides of the substrate (referred to as Lh in the attached drawing) are opposite each other in the Y direction. As a representative example, there is a case where full-size substrates Sf and half-size substrates Sh are mixed. Therefore, as will be explained below, the calculation unit 91 determines whether the substrate S being moved into the upstream floating platform 3A is a full-size substrate or a half-size substrate. Then, based on this determination result, the calculation unit 91 selectively performs a first transport step that adapts the transport method of substrate S to the transport method of a full-size substrate or a second transport step that adapts the transport method of substrate S to the transport method of a half-size substrate. Thus, in the first embodiment, the calculation unit 91 functions as the "substrate size determination unit," "first transport control unit," and "second transport control unit" of the present invention.

[0074] Figure 6 It means by Figure 1 The flowchart shows the coating action performed by the coating device. Figure 7 This diagram shows the horizontal positional relationship between the substrate and the clamps being moved to the upper part of the upstream floating platform. Column (a) shows the relationship between the full-size substrate Sf and the clamps 51a-51d, and column (b) shows the relationship between the half-size substrate Sh and the clamps 51a-51d. Additionally, in Figure 7 In this diagram, to indicate the adsorption / adsorption cessation of clamps 51a to 51d, additional points are added to each clamp 51a to 51d only during adsorption. These points will be explained later. Figure 8 , Figure 9 The same applies to the attached diagrams.

[0075] In this coating apparatus 1, the slit nozzle 71 used for coating is moved to a maintenance position to perform a pre-dispensing process. Additionally, compressed air in the starting levitation section 3 is ejected and drawn in to prepare for the levitation of the substrate S being transported. Furthermore, the slit nozzle 71 can be cleaned before the pre-dispensing process.

[0076] Next, the substrate S is fed into the coating apparatus 1. The substrate S, to be processed, is placed on the input conveyor 100 via a separate processing unit and a transport robot on the upstream side, and is transported in the (+X) direction by the rotating roller conveyor 101. Through the coordinated operation of the input transfer unit 2, which positions the upper surface of the roller conveyor 21 at the same height as the roller conveyor 101 of the input conveyor 100, the substrate S is transported to the upper part of the upstream floating stage 3A, where buoyancy is applied to the substrate S by the ejection of compressed air. Furthermore, when the substrate S is fed into the upstream floating stage 3A, the lifting pin provided on the upstream floating stage 3A is positioned by the lifting pin drive mechanism 34 at an upper position where its upper end protrudes upwards from the upper surface of the upstream floating stage 3A. Here, if the substrate S being fed is a full-size substrate Sf, as... Figure 7 As shown in column (a), in the transport direction Dt, the front end position Pff of the substrate S is located at the end of the upstream floating stage 3A on the (+X) side, and the rear end position Pfb of the substrate S is located at the input transfer section 2. On the other hand, when the substrate S being transported is a half-size substrate Sh, as shown in column (a), the rear end position Pfb of the substrate S is located at the input transfer section 2. Figure 7 As shown in column (b), in the transport direction Dt, similar to the case of the full-size substrate Sf, the rear end position Phb of substrate S is located at the input transfer section 2, but the front end position Phf of substrate S is located in the middle of the upstream floating stage 3A. In other words, the transport position of substrate S at the time of transport varies depending on the substrate size.

[0077] Therefore, the calculation unit 91 acquires substrate size information indicating the transport direction dimension of the substrate S being moved into the upstream floating platform 3A (step S1). Then, the calculation unit 91 determines whether the substrate S is a full-size substrate Sf or a half-size substrate Sh based on the substrate size information (step S2). Furthermore, the aforementioned substrate size information can be obtained using sensor output information detected by a size detection sensor pre-installed on the upstream floating platform 3A, substrate information contained in the specifications stored in the fixed disk 93, etc.

[0078] When the computing unit 91 determines that the substrate S being transported is a full-size substrate Sf (in step S2, it is determined to be a "full-size substrate"), it performs a first transport process suitable for the full-size substrate Sf (steps S3A, S4A, S5-S7) while simultaneously performing a coating process. The first transport process and coating process for the full-size substrate Sf correspond to an example of the "first processing step" of the present invention. Conversely, when the computing unit 91 determines that the substrate S being transported is a half-size substrate Sh (in step S2, it is determined to be a "half-size substrate"), it performs a second transport process suitable for the half-size substrate Sh (steps S3B, S4B, S5-S7) while simultaneously performing a coating process. The second transport process and coating process for the half-size substrate Sh correspond to an example of the "second processing step" of the present invention.

[0079] In the first handling process, such as Figure 7 As shown in column (a), all clamps 51a to 51d constituting the clamping mechanism 51 move integrally to a position directly below the full-size substrate Sf (step S3A). More specifically, viewed from above, the clamping mechanism 51 moves so that the front position Psf of the clamping mechanism 51, i.e., the front end position of clamps 51b and 51d, coincides with the front end position Pff of the substrate S. At this time, the rear position Psb of the clamping mechanism 51, i.e., the rear end position of clamps 51a and 51c, coincides with the rear end position Pfb of the full-size substrate Sf. Thus, the relationship between the loading position of the full-size substrate Sf and the holding position of the clamping mechanism 51 is adjusted. That is, in this embodiment, the front end position Pff and the rear end position Pfb of the full-size substrate Sf correspond to an example of the "loading position" of the present invention, and the front position Psf and the rear position Psb of the clamping mechanism 51 correspond to an example of the "holding position" of the present invention.

[0080] When the clamps 51a-51d are positioned close to the four corners of the full-size substrate Sf in the vertical direction Z by executing step S3A, the full-size substrate Sf is transferred to the clamping mechanism 51 by the descent of the lifting pin. Next, an opening command is issued to the first common opening / closing valve 517a and the second common opening / closing valve 517b, applying negative pressure to the suction pads 513 of the clamps 51a-51d (step S4A). As a result, the clamping mechanism 51 holds the periphery of the four corners of the lower surface of the full-size substrate Sf, and in this state, begins to move the full-size substrate Sf in the transport direction Dt (step S5). After the movement begins, the full-size substrate Sf is transported until its front end is at the coating start position, and then temporarily stopped. Simultaneously, the slit nozzle 71 moves from the pre-dispensing position to the coating position and is positioned. That is, the slit nozzle 71 is moved to a position above the coating position by the nozzle drive mechanism 8. Next, the slit nozzle 71 descends towards the full-size substrate Sf, and the coating liquid adhering near the nozzle 711 comes into contact with the upper surface of the full-size substrate Sf at the coating start position. As a result, a meniscus of coating liquid is formed on the upper surface of the full-size substrate Sf at the coating start position.

[0081] After the meniscus is formed, the slit nozzle 71 rises from the contact position by a distance corresponding to the thickness of the coating liquid using the nozzle drive mechanism 8. This adjusts the gap between the nozzle outlet 711 and the upper surface of the full-size substrate Sf, the so-called coating gap. After adjusting this coating gap, the coating operation begins. That is, the coating liquid ejected from the nozzle outlet 711 of the slit nozzle 71 falls onto the upper surface Sa of the substrate S. Meanwhile, the clamping mechanism 51 restarts the movement of the full-size substrate Sf, transporting it at a constant speed so that the full-size substrate Sf passes through the coating area held by the slit nozzle 71 and the stage. Thus, the slit nozzle 71 applies the coating liquid to the upper surface Sa of the full-size substrate Sf, forming a coating film of constant thickness using the coating liquid.

[0082] The coating process continues until the full-size substrate Sf is transported to the end position where coating should be completed. When the full-size substrate Sf reaches the end position, the slit nozzle 71 disengages from the coating position and returns to the maintenance position, performing a pre-ejection process again. Meanwhile, the clamping mechanism 51 moves in the transport direction Dt until the calculation unit 91 determines that the front end of the full-size substrate Sf is located at the (+X) side end of the downstream floating stage 3C, i.e., the transport end position ("Yes" in step S6). After the clamping mechanism 51 stops at the transport end position, it issues a closing command to the on / off valve 517, stopping the supply of negative pressure to the full-adsorption pad 513. This releases the adsorption and holding of the full-size substrate Sf (step S7). The full-size substrate Sf is then handed over to the transfer robot (not shown) and sent to the downstream unit (unloading process).

[0083] On the other hand, in the second handling process, such as Figure 7 As shown in column (b), the clamping mechanism 51 moves in the (-X) direction until the front position Psf of the clamps 51b and 51d (hereinafter referred to as the "front clamp pair") on the (+Y) side of the clamps 51a to 51d constituting the clamping mechanism 51 coincides with the front end position Phf of the half-size substrate Sh (step S3B). At this time, the clamps 51a and 51c (hereinafter referred to as the "rear clamp pair") on the (-Y) side of the clamps 51a to 51d move and are positioned by the half-size substrate Sh moving downward toward the input conveyor 100 side. Thus, when viewed from vertically above, the front position Psf of the front clamp pair coincides with the front end position Phf of the half-size substrate Sh. In this way, the relationship between the loading position of the half-size substrate Sh and the holding position of the clamping mechanism 51 is adjusted. In other words, in this embodiment, the front end position Phf of the half-size substrate Sh corresponds to an example of the "loading position" of the present invention, and the front position Psf of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0084] When the clamps 51b and 51d are positioned close to the (+Y) side periphery of the half-size substrate Sh in the vertical direction Z by executing step S3B, the half-size substrate Sh is transferred to the clamping mechanism 51 by lowering the lifting pin. Next, an opening command is issued only to the second common opening / closing valve 517b, applying negative pressure to the suction pads 513 of the clamps 51b and 51d. As a result, the periphery of the two front corners of the lower surface of the half-size substrate Sh is suctioned and held (step S4B). Meanwhile, the first common opening / closing valve 517a remains closed. Thus, the clamping mechanism 51 suctions and holds the periphery of the two front corners of the lower surface of the half-size substrate Sh, and in this state, begins to move the half-size substrate Sh in the transport direction Dt (step S5). After the movement begins, the half-size substrate Sh is transported until its front end is at the coating start position, and then temporarily stopped. In parallel with this, after the slit nozzle 71 moves from the pre-ejection position to the coating position and forms a meniscus of coating liquid of the desired thickness, the clamping mechanism 51 restarts moving the half-size substrate Sh at a constant speed, so that the half-size substrate Sh passes through the coating area held by the slit nozzle 71 and the stage surface. Thus, the slit nozzle 71 applies coating liquid to the upper surface Sa of the half-size substrate Sh, forming a coating film of constant thickness using the coating liquid.

[0085] Additionally, when the half-size substrate Sh reaches the end position, the slit nozzle 71 disengages from the coating position and returns to the maintenance position, performing the pre-ejection process again. Meanwhile, the clamping mechanism 51 moves in the transport direction Dt until the calculation unit 91 determines that the front end of the half-size substrate Sh is at the transport end position ("Yes" in step S6). After the clamping mechanism 51 stops at the transport end position, it sends a closing command to the second common on / off valve 517b, stopping the supply of negative pressure to the suction pad 513 of the forward clamping pair. As a result, the full suction pad 513 enters a suction stop state, releasing the suction holding of the half-size substrate Sh (step S7). Then, the transfer robot (not shown) moves the half-size substrate Sh in the (+X) direction and finally delivers it to the downstream unit.

[0086] As described above, according to the first embodiment, although the loading positions of the substrate S onto the upstream floating stage 3A differ for full-size substrate Sf and half-size substrate Sh, the holding position of the clamping mechanism 51 can still be adjusted according to the loading position. Furthermore, by adjusting the relationship between the loading position and the holding position, the peripheral portions of the two substrates S with different sizes—namely, the full-size substrate Sf or the half-size substrate Sh in this embodiment—can be held while the substrate S is lifted and transported. Thus, the coating apparatus 1 can handle substrates S of different sizes with a single clamping mechanism 51, exhibiting high versatility. Therefore, it is unnecessary to design and manufacture the substrate transport section 5 required in existing apparatuses. Additionally, when the substrate to be coated is switched from a full-size substrate Sf to a half-size substrate Sh, or vice versa, changeover adjustments to the apparatus become easier.

[0087] Furthermore, for larger full-size substrates Sf, since the four corners are held by the adsorption pads 513 while the full-size substrate Sf is being transported, stable transport of the full-size substrate Sf is possible. On the other hand, for half-size substrates Sh, which are smaller than full-size substrates Sf, the load applied to the adsorption source can be reduced by cutting off the adsorption holding area while transporting them. This reduces the environmental impact when applying the coating liquid to the half-size substrate Sh.

[0088] In the first embodiment described above, the X direction and Y direction correspond to the "first direction" and "second direction" of the present invention, respectively. The full-size substrate Sf and the half-size substrate Sh correspond to examples of the "first substrate" and "second substrate" of the present invention, respectively. The clamping mechanism 51 corresponds to an example of the "holding portion" of the present invention. The clamps 51a to 51d constituting the clamping mechanism 51 correspond to examples of the first to fourth clamps of the present invention, respectively.

[0089] The peripheral portion of one of the (+Y) side and (-Y) side of the lower surface of the full-size substrate Sf corresponds to an example of the "near the first side" of the present invention, and the corner portions of the (+X) side and (-X) side of this peripheral portion correspond to an example of the "first front corner" and "first rear corner" of the present invention, respectively. The peripheral portion of the other side corresponds to an example of the "near the second side" of the present invention, and the corner portions of the (+X) side and (-X) side of this peripheral portion correspond to an example of the "second front corner" and "second rear corner" of the present invention, respectively.

[0090] One of the peripheral portions on the (+Y) side and (-Y) side of the lower surface of the half-size substrate Sh corresponds to an example of the "near the third side" of the present invention, and the corner portions on the (+X) side and (-X) side of this peripheral portion correspond to examples of the "third front corner" and "third rear corner" of the present invention, respectively. The other peripheral portion corresponds to an example of the "near the fourth side" of the present invention, and the corner portions on the (+X) side and (-X) side of this peripheral portion correspond to examples of the "fourth front corner" and "fourth rear corner" of the present invention, respectively.

[0091] <Second Implementation>

[0092] Figure 8 This diagram illustrates the positional relationship in the horizontal plane between the substrate above the upstream floating platform and the clamps in the second embodiment of the present invention. The major difference between this second embodiment and the first embodiment is that a rear clamp pair (i.e., clamps 51a and 51c) is used when moving the half-size substrate Sh. Otherwise, the other structures and operations are the same as in the first embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for identical structures and omitting structural descriptions.

[0093] In the second embodiment, when it is determined that the substrate S being moved in is a full-size substrate Sf (determined as a "full-size substrate" in step S2), as follows: Figure 8 As shown in column (a), the arithmetic unit 91 performs the same first transport process (steps S3A, S4A, S5-S7) as in the first embodiment, while simultaneously performing the coating process. Conversely, when it is determined that the substrate S to be transported is a half-size substrate Sh (determined as a "half-size substrate" in step S2), as... Figure 8 As shown in column (b) of the second embodiment, unlike the first embodiment, the clamping mechanism 51 moves the half-size substrate Sh in the transport direction Dt while adsorbing and holding the peripheral portions of the two rear corners of the lower surface of the half-size substrate Sh. That is, in the second transport step of the second embodiment, as shown in column (b) of the second embodiment, the clamping mechanism 51 moves the half-size substrate Sh in the transport direction Dt. Figure 8As shown in column (b), the clamping mechanism 51 moves in the (-X) direction until the rear position Psb of the rear clamp pair (i.e., clamps 51a, 51c) of the clamping mechanism 51 coincides with the rear position Phb of the half-size substrate Sh (step S3B). At this time, the front clamp pair (i.e., clamps 51b, 51d) is positioned at a position corresponding to the front loading position of the full-size substrate Sf in the first handling process described above (reference numeral Psf in column (a) of the figure). Thus, viewed from vertically, the front clamp pair is positioned at a position separating from the half-size substrate Sh in the (+X) direction. In this way, the relationship between the loading position of the half-size substrate Sh and the holding position of the clamping mechanism 51 is adjusted. That is, in this embodiment, the rear position Phb of the half-size substrate Sh corresponds to an example of the "loading position" of the present invention, and the rear position Psb of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0094] When the clamps 51a and 51c are positioned close to the (+Y) side periphery of the half-size substrate Sh in the vertical direction Z after step S3B, the half-size substrate Sh is transferred to the clamp mechanism 51 by the descent of the lifting pin. Next, an opening command is issued only to the first common opening / closing valve 517a, applying negative pressure to the suction pads 513 of the clamps 51a and 51c. As a result, the periphery of the two rear corners of the lower surface of the half-size substrate Sh is suctioned and held (step S4B). Meanwhile, the second common opening / closing valve 517b remains closed. As a result, the clamp mechanism 51 suctions and holds the periphery of the two rear corners of the lower surface of the half-size substrate Sh, and in this state, begins to move the half-size substrate Sh in the transport direction Dt (step S5). Subsequently, the same operation as the second transport process in the first embodiment is performed, including the formation of the meniscus of the coating liquid and the application of the coating liquid.

[0095] When the half-size substrate Sh reaches the end position, the slit nozzle 71 disengages from the coating position and returns to the maintenance position, performing the pre-ejection process again. Meanwhile, the clamping mechanism 51 moves until the calculation unit 91 determines that the rear end of the half-size substrate Sh is at the end of the transport ("Yes" in step S6). After the clamping mechanism 51 stops at the end of the transport, a closing command is issued to the first common on / off valve 517a, stopping the supply of negative pressure to the adsorption pad 513 of the rear clamp pair. As a result, the full adsorption pad 513 enters a stopped adsorption state, and the adsorption holding of the half-size substrate Sh is released (step S7). Then, the transfer robot (not shown) moves the half-size substrate Sh in the (+X) direction and finally delivers it to the downstream unit.

[0096] As described above, in the second embodiment, the holding position of the clamping mechanism 51 can also be adjusted according to the loading position of the substrate S. By simply adjusting this position, the substrate S can be lifted and transported while simultaneously holding the periphery of the full-size substrate Sf and the half-size substrate Sh. As a result, the same effect as in the first embodiment can be obtained.

[0097] <Third Implementation Method>

[0098] Figure 9 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane according to the third embodiment of the present invention. The major difference between this third embodiment and the first embodiment lies in the mechanism for adjusting the relationship between the loading substrate S and the holding position of the clamp mechanism 51. In the first embodiment, regardless of the substrate size, the rear end position of the loading substrate S is constant (the rear end position Pfb of the full-size substrate Sf = the rear end position Phb of the half-size substrate Sb). Therefore, the relationship between the loading substrate S and the holding position of the clamp mechanism 51 is adjusted by the position of the clamp mechanism 51. In contrast, in the third embodiment, this adjustment is performed by adjusting the input conveyor 100 and the upstream floating platform 3A. Furthermore, other structures and operations are the same as those in the first embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for the same structures and omitting structural descriptions.

[0099] In the third embodiment, the handling and coating process of the full-size substrate Sf is performed in the same manner as in the first embodiment (see reference). Figure 9 (see column (a)). Here, when the substrate S being moved in is changed from a full-size substrate Sf to a half-size substrate Sh, the following changeover adjustment is performed. The X-direction dimension of the upstream floating stage 3A is shortened by the amount of change in the substrate size. Thus, as Figure 9 As shown, the front end position Phf of the half-size substrate Sh being moved into the upstream floating platform 3A is the same as the front end position Pff of the full-size substrate Sf. Therefore, the second transport step of moving the half-size substrate Sh can be performed in the same way as the first transport step of moving the full-size substrate Sf. In addition, when the substrate S being moved in changes from the half-size substrate Sh to the full-size substrate Sf, the X-direction dimension of the upstream floating platform 3A increases by the amount of change in the substrate size. That is, in the third embodiment, the clamping mechanism 51 is made to hold the substrate S in a common position, and on the other hand, the loading position of the substrate S is adjusted by extending and retracting the upstream floating platform 3A in the X-direction according to the change in the substrate size. As a result, the coating apparatus 1 can be used with a single clamping mechanism 51 to handle substrates S of different sizes, and has high versatility. As a result, it is not necessary to design and manufacture the substrate transport section 5 required in existing apparatuses.

[0100] Furthermore, in the third embodiment, the input conveyor 100 extends in the X direction as the upstream floating platform 3A shortens, and shortens in the X direction as the upstream floating platform 3A extends. Therefore, the X-direction dimension of the coating apparatus 1 is constant, resulting in the following effect: While it is possible to adjust the upstream floating platform 3A only for product changes based on substrate size variations, in this case, the X-direction dimension of the coating apparatus 1 changes. Consequently, in factories where the coating apparatus 1 is installed, it is sometimes necessary to change the apparatus layout based on changes in the X-direction dimension. However, according to the third embodiment, since the X-direction dimension of the coating apparatus 1 does not change, no change in apparatus layout is required.

[0101] As described above, in the third embodiment, the front end position Pff and rear end position Pfb of the full-size substrate Sf, and the front end position Phf of the half-size substrate Sh correspond to an example of the "loading position" of the present invention, and the front end position Psf and rear end position Psb of the clamping mechanism 51 correspond to an example of the "holding position" of the present invention.

[0102] <Fourth Implementation>

[0103] Figure 10 This is a schematic diagram showing the structure of the traveling section according to the fourth embodiment of the present invention. Figure 11 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane according to the fourth embodiment. In the fourth embodiment, the clamp unit 51L includes clamp 51e in addition to the clamps 51a and 51b, and the clamp unit 51R includes clamp 51f in addition to the clamps 51c and 51d. Figure 10 As shown, clamps 51e (51f) are mounted on base 521 such that the distance from their rear end to the front end of clamp 51b (51d) is a distance Lh corresponding to the X-direction dimension of half-size substrate Sh. Furthermore, clamps 51e and 51f are connected to a suction source such as a vacuum pump via piping 516 on which a second common on / off valve 517b is mounted. Other structures and operations are the same as in the first embodiment. Hereinafter, the description will focus on the differences; identical reference numerals will be used for identical structures, and descriptions will be omitted.

[0104] In the fourth embodiment, the handling and coating process of the full-size substrate Sf is performed in the same manner as in the first embodiment (see reference). Figure 11(see column (a) in the figure). However, with the addition of clamps 51e and 51f, the number of portions holding the lower peripheral edge of the full-size substrate Sf increases from four to six. Furthermore, the reference numeral Psm in this figure indicates the rear position of clamps 51e and 51f, and the portions of the lower peripheral edge of the full-size substrate Sf held by clamps 51e and 51f correspond to examples of the "first intermediate portion" and "second intermediate portion" of the present invention, respectively.

[0105] In addition, similar to the first embodiment, the handling and coating process of the half-size substrate Sh is also performed (see reference). Figure 11 (see column (b)). However, with the addition of clamps 51e and 51f, the number of portions holding the lower peripheral edge of the half-size substrate Sh increases from two to four. The portions of the lower peripheral edge of the half-size substrate Sh held by clamps 51e and 51f correspond to examples of the "third intermediate portion" and "fourth intermediate portion" of the present invention, respectively.

[0106] Thus, in the fourth embodiment, regardless of the substrate size, the substrate S being transported can be floated and transported along the transport direction, achieving the same effect as in the first embodiment. Furthermore, by adding clamps 51e and 51f, the adsorption and holding portion of the substrate S is increased, enabling more stable floating transport of the substrate S compared to the first embodiment. Thus, clamps 51e and 51f respectively correspond to examples of the "fifth clamp" and "sixth clamp" of the present invention.

[0107] <Fifth Implementation>

[0108] Figure 12 This is a top view of the coating apparatus, a fifth embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above. Figure 13 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane according to the fifth embodiment. The main difference between this fifth embodiment and the first embodiment is that the clamp unit 51L is composed of a single clamp 51b, and the clamp unit 51R is composed of a single clamp 51d; the end of the travel guide 523 on the (-X) direction side is shortened compared to the first embodiment, and its extension terminates at the contact area of ​​the input transfer section 2; other structures are the same. Hereinafter, the description will focus on the differences, and the same reference numerals will be used for the same structures, with descriptions omitted.

[0109] pass Figure 7 (First Implementation) and Figure 13A comparison with the fifth embodiment reveals that, in the fifth embodiment, the relationship between the loading position of the substrate S and the holding position of the clamping mechanism 51 is adjusted so that even if either the full-size substrate Sf or the half-size substrate Sh is loaded, the front position Psf of the front clamp pair (i.e., clamps 51b and 51d) remains consistent with the front end positions Pff and Phf of the substrate S. Furthermore, while using the front clamp pair to hold the peripheral portions of the two front corners of the lower surface of the substrate S, the substrate S is transported in the transport direction Dt. In other words, in this embodiment, the front end position Pff of the full-size substrate Sf and the front end position Phf of the half-size substrate Sh correspond to an example of the "loading position" of the present invention, and the front position Psf of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0110] As described above, in the fifth embodiment, regardless of the substrate size, the substrate S can be lifted and transported while simultaneously holding the front end of the substrate S being transported in by adsorption. Therefore, the same effect as in the first embodiment can be obtained.

[0111] <Sixth Implementation Method>

[0112] Figure 14 This diagram shows the positional relationship between the substrate and the clamp in the horizontal plane of the coating apparatus according to the sixth embodiment of the substrate processing apparatus of the present invention. The main difference between this sixth embodiment and the second embodiment is that the clamp unit 51L is composed of a single clamp 51a, and the clamp unit 51R is composed of a single clamp 51c; similarly to the fifth embodiment, the end of the travel guide 523 on the (-X) direction side is shortened compared to the second embodiment, and its extension terminates in the adjacent area of ​​the input transfer section 2; the other structures are the same. Hereinafter, the description will focus on the differences, and the same reference numerals will be used for the same structures, and descriptions will be omitted.

[0113] pass Figure 8 (Second Implementation) and Figure 14 A comparison with the sixth embodiment reveals that, in the sixth embodiment, the relationship between the loading position of the substrate S and the holding position of the clamping mechanism 51 is adjusted so that even if either the full-size substrate Sf or the half-size substrate Sh is loaded, the rear position Psb of the rear clamp pair (i.e., clamps 51a, 51c) is consistent with the rear end positions Pfb and Phb of the substrate S. Furthermore, the substrate S is transported in the transport direction Dt while the rear clamps are used to hold the peripheral portions of the two rear corners of the lower surface of the substrate S. In other words, in this embodiment, the rear end position Pfb of the full-size substrate Sf and the rear end position Phb of the half-size substrate Sh correspond to an example of the "loading position" of the present invention, and the rear position Psb of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0114] As described above, in the sixth embodiment, regardless of the substrate size, the substrate S can be lifted and transported while simultaneously holding its rear end position in an adsorbed manner. Therefore, the same effect as in the second embodiment can be obtained.

[0115] <Seventh Implementation>

[0116] In the fifth embodiment described above, clamp units 51L and 51R each have a single clamp 51b and 51d, and are held in an adsorption state where the front position Psf of clamps 51b and 51d coincides with the front end position Pff and Phs of substrate S. Furthermore, in the sixth embodiment described above, clamp units 51L and 51R each have a single clamp 51a and 51c, and are held in an adsorption state where the rear position Psb of clamps 51a and 51c coincides with the rear end position Pfb and Phb of substrate S. Here, the adsorption and holding position of the clamps is not limited to the above-described manner and is arbitrary in the X direction. For example, when the single clamp constituting clamp unit 51L is designated as "clamp 51g" and the single clamp constituting clamp unit 51R is designated as "clamp 51h", for example, as... Figure 15 As shown, it can also be configured as a central clamp adsorbing and holding substrate S, which is composed of clamps 51g and 51h.

[0117] Figure 15 This is a diagram showing the positional relationship between the substrate transfer plate and the clamp in the horizontal plane in the coating apparatus of the seventh embodiment of the substrate processing apparatus of the present invention. In this seventh embodiment, as... Figure 15 As shown in column (a), when the full-size substrate Sf is moved into the upstream floating stage 3A, the position of the clamping mechanism 51 is adjusted so that the central position Psc of the clamps 51g and 51h in the X direction coincides with the central position Pfc of the full-size substrate Sf. Then, the clamps 51g and 51h hold the central periphery of the lower surface of the full-size substrate Sf. Finally, the full-size substrate Sf is transported and coated.

[0118] Additionally, when the half-size substrate Sh is moved into the upstream floating stage 3A, such as Figure 15 As shown in column (b), the position of the clamping mechanism 51 is adjusted so that the central position Psc of the clamps 51g and 51h in the X direction coincides with the central position Phc of the half-size substrate Sh. Next, the clamps 51g and 51h hold the central periphery of the lower surface of the half-size substrate Sh. Then, the half-size substrate Sh is transported and coated. In other words, in this embodiment, the central position Pfc of the full-size substrate Sf and the central position Phc of the half-size substrate Sh correspond to an example of the "carrying position" of the present invention, and the central position Psc of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0119] As described above, in the seventh embodiment, regardless of the substrate size, the substrate S can be lifted and transported while being held in the central position by adsorption. Therefore, the same effects as in the fifth and sixth embodiments can be obtained.

[0120] <Eighth Implementation Method>

[0121] In the fifth to seventh embodiments described above, the clamping units 51L and 51R each use a clamping mechanism 51 with a single clamp, and the clamping mechanism 51 is moved along the X direction according to the position of the substrate S being moved in, thereby adjusting the relationship between the loading position of the substrate S and the holding position of the clamping mechanism 51. Here, similar to the third embodiment, the adsorption and holding position of the clamping mechanism 51 on the substrate S can be made common, and the loading position of the substrate S can be adjusted by extending and retracting the upstream floating stage 3A along the X direction according to changes in the substrate size. Hereinafter, similar to the fifth embodiment, an example will be given of using a clamping mechanism 51 with only a front clamp pair (i.e., clamps 51b, 51d) to transport the substrate S. Of course, it is also possible to apply the case of using a clamping mechanism 51 with only a rear clamp pair (i.e., clamps 51a, 51c) as in the sixth embodiment, or the case of using a clamping mechanism 51 with only a central clamp pair (i.e., clamps 51g, 51h) as in the seventh embodiment.

[0122] Figure 16 This diagram shows the positional relationship between the substrate and the clamp in the horizontal plane of the coating apparatus in the eighth embodiment of the substrate processing apparatus of the present invention. In this eighth embodiment, the handling and coating processing of the full-size substrate Sf is performed in the same manner as in the fifth embodiment (see Figure 1). Figure 16 (Column (a)). Here, when the substrate S being moved in changes from a full-size substrate Sf to a half-size substrate Sh, the X-direction dimension of the upstream floating stage 3A decreases by the amount of change in the substrate size. Thus, as Figure 16 As shown, the front end position Phf of the half-size substrate Sh being moved into the upstream floating platform 3A coincides with the front end position Pff of the full-size substrate Sf. Therefore, the second transport step of moving the half-size substrate Sh can be performed in the same way as the first transport step of moving the full-size substrate Sf. Furthermore, when the substrate S being moved changes from a half-size substrate Sh to a full-size substrate Sf, the X-direction dimension of the upstream floating platform 3A increases by the amount of change in the substrate size. That is, in the eighth embodiment, the clamping mechanism 51's adsorption and holding position on the substrate S is made consistent, and the upstream floating platform 3A is extended and retracted in the X-direction according to the change in substrate size, thereby adjusting the loading position of the substrate S. As a result, the same effect as in the third embodiment can be obtained.

[0123] As described above, in the third embodiment, the front end position Pff of the full-size substrate Sf and the front end position Phf of the half-size substrate Sh correspond to an example of the "loading position" of the present invention, and the front position Psf of the clamping mechanism 51 corresponds to an example of the "holding position" of the present invention.

[0124] <Ninth Implementation Method>

[0125] In the first to eighth embodiments described above, the clamping units 51L and 51R constituting the clamping mechanism 51 travel in a manner that they are always in the same position in the X direction, and the plurality of clamps included in the clamping mechanism 51 are configured to move as a visually integrated clamping mechanism 51. Here, it is not necessary to provide both clamping units 51L and 51R; for example, as... Figure 17 and Figure 18 As shown, it can also be configured to use a clamping mechanism 51 with only clamping unit 51L to lift and transport the substrate S (ninth embodiment).

[0126] Figure 17 This is a top view of the coating apparatus, a ninth embodiment of the substrate processing apparatus of the present invention, as viewed from vertical above. Figure 18 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane in the ninth embodiment. A major difference between this ninth embodiment and the seventh embodiment is the absence of the clamp unit 51R and the traveling section 52R. In other words, the clamp mechanism 51 is composed of a clamp unit 51L containing only the clamp 51g. Otherwise, the other structures are the same. Hereinafter, the description will focus on the differences; identical reference numerals will be used for identical structures, and descriptions will be omitted.

[0127] In the seventh embodiment, such as Figure 18 As shown in column (a), when the full-size substrate Sf is moved into the upstream floating stage 3A, the position of the clamping mechanism 51 is adjusted so that the central position Psc of the clamp 51g in the X direction coincides with the central position Pfc of the full-size substrate Sf. Next, the clamp 51g holds the central peripheral portion (corresponding to an example of the "first central portion" of the present invention) of the lower surface of the full-size substrate Sf. Then, the transport and coating process of the full-size substrate Sf is performed.

[0128] Additionally, when the half-size substrate Sh is moved into the upstream floating stage 3A, such as Figure 18As shown in column (b), the position of the clamping mechanism 51 is adjusted so that the central position Psc of the clamp 51g in the X direction coincides with the central position Phc of the half-size substrate Sh. Next, the clamp 51g adsorbs and holds the central peripheral portion (corresponding to an example of the "second central portion" of the present invention) on the lower surface of the half-size substrate Sh. Then, the half-size substrate Sh is transported and coated. That is, in this embodiment, the central position Pfc of the full-size substrate Sf and the central position Phc of the half-size substrate Sh correspond to an example of the "carrying position" of the present invention, and the central position Psc of the clamp 51g corresponds to an example of the "holding position" of the present invention.

[0129] As described above, in the ninth embodiment, regardless of the substrate size, the substrate S can be lifted and transported while being held in the central position by adsorption. Therefore, the same effect as in the seventh embodiment can be obtained.

[0130] Furthermore, although in the ninth embodiment, the clamping unit 51L is constructed from the same clamping unit 51g as in the seventh embodiment, a clamping unit 51L having the same structure as in the first to sixth and eighth embodiments can also be used. Additionally, although the clamping mechanism 51 is constructed from only the clamping unit 51L, it can also be constructed from only the clamping unit 51R, and the clamping unit 51R of the first to eighth embodiments can also be used as this clamping unit 51R.

[0131] <Tenth Implementation>

[0132] In the first to eighth embodiments described above, the clamping units 51L and 51R constituting the clamping mechanism 51 travel in a manner that they are always in the same position in the X direction, and the plurality of clamps included in the clamping mechanism 51 move as a single clamping mechanism 51. Alternatively, the clamping units 51L and 51R may be configured to move independently in the X direction. This allows the substrate S to be held and held in various ways. For example, as... Figure 19 As shown, the substrate transport unit 5 (tenth embodiment) can also be configured such that the substrate S is floated and transported while adsorbing and holding the peripheral portions of the two diagonally opposite corners of the lower surface of the substrate S.

[0133] Figure 19 This diagram illustrates the positional relationship between the substrate being loaded and the clamp in the horizontal plane in the tenth embodiment of the substrate processing apparatus of the present invention. The major difference between the tenth embodiment and the fifth embodiment is that the clamp units 51L and 51R are configured to move independently along the X direction as described above; the other structures are the same. Hereinafter, the description will focus on the differences, and the same reference numerals will be used for identical structures, with descriptions omitted.

[0134] pass Figure 13 (Fifth Implementation) and Figure 19 A comparison with the tenth embodiment shows that, in the tenth embodiment, the relationship between the loading position of the substrate S and the holding position of the clamp 51 is adjusted so that even if either the full-size substrate Sf or the half-size substrate Sh is loaded, the front position Psf of the clamp 51b of the clamp unit 51L is consistent with the front end position Pff, Phf of the substrate S, and the rear position Psb of the clamp 51d of the clamp unit 51R is consistent with the rear end position Pfb, Phb of the substrate S. Furthermore, the clamps 51b and 51d respectively hold the peripheral portions of the front corner on the (+Y) side and the rear corner on the (-Y) side of the lower surface of the substrate S while transporting the substrate S in the transport direction Dt. In other words, in this embodiment, the front end position Pff and the rear end position Pfb of the full-size substrate Sf, the front end position Phf and the rear end position Phb of the half-size substrate Sh correspond to an example of the "loading position" of the present invention, and the front position Psf of the clamp 51b and the rear position Psb of the clamp 51d correspond to an example of the "holding position" of the present invention.

[0135] As described above, in the tenth embodiment, regardless of the substrate size, the substrate S being transported can be held in place by adsorption while being lifted and transported. Therefore, the same effect as in the fifth embodiment can be obtained.

[0136] Furthermore, although in the tenth embodiment, each of the clamping units 51L and 51R is composed of a single clamp, the number of clamps is arbitrary. Additionally, the number of clamps in clamping unit 51L and the number of clamps in clamping unit 51R can also be different.

[0137] <Eleventh Implementation Method>

[0138] In the first to fourth embodiments described above, the clamping units 51L and 51R are configured to move along the X direction while a plurality of clamps on the base 521 are separated from each other by a constant distance along the X direction. Therefore, when adsorbing a half-size substrate Sh, for example, as Figures 7 to 9 and Figure 11 As shown in column (b) of the figure, some of the clamps (clamps not marked in the figure) do not contribute to adsorption retention. Therefore, clamp units 51L and 51R can also be configured such that a plurality of clamps on the base 521 can move freely relative to each other in the X direction. For example, as Figures 20 to 22 As shown, the clamping mechanism 51 can also be configured such that clamps 51a and 51b move independently along the X direction in clamping unit 51L, and clamps 51c and 51d move independently along the X direction in clamping unit 51R (eleventh embodiment).

[0139] Figure 20This is a top view of the coating apparatus according to the eleventh embodiment of the substrate processing apparatus of the present invention, viewed from vertical above. Figure 21 This diagram schematically illustrates the traveling section of the adsorption traveling control mechanism, extracting and schematically illustrating the structure of the traveling section that transports the substrate in the levitation section. Figure 22 This is a schematic diagram of a clamping unit for adsorption travel control mechanism, which extracts and illustrates the structure for adsorbing the substrate above the levitation part.

[0140] like Figures 20 to 22 As shown, the eleventh embodiment differs significantly from the first embodiment in that, relative to the clamp unit 51R, the base 521 on the (-Y) side is separated into two, and clamps 51c and 51d are respectively mounted on the separated bases 521 and 521. Each base 521 moves independently along the travel guide 523 in the transport direction Dt (=X direction) using a linear motor 524. A piping 516 equipped with an on / off valve 517 is connected to each of the clamps 51c and 51d. Due to this difference, not only can the X-direction spacing of the clamps 51c and 51d be arbitrarily changed, but the clamps 51c and 51d can also be moved integrally in the X-direction while maintaining the changed X-direction spacing. The clamp unit 51L also has the same difference. Other structures are the same. Hereinafter, the description will focus on the differences, and the same reference numerals will be used for the same structures, and descriptions will be omitted.

[0141] Figure 23 This diagram illustrates the positional relationship in the horizontal plane between the substrate S being moved above the upstream floating platform and the clamps 51a-51d. Column (a) shows the relationship between the full-size substrate Sf and the clamps 51a-51d, while column (b) shows the relationship between the half-size substrate Sh and the clamps 51a-51d. In this eleventh embodiment, the relationship between the loading position of the substrate S and the holding position of the clamping mechanism 51 is adjusted so that even if either the full-size substrate Sf or the half-size substrate Sh is loaded, • The front position Psf of the clamp 51b of the clamp unit 51L is also consistent with the front position Pff and Phf of the substrate S. • The rear position Psb of the clamp 51a of the clamp unit 51L is also consistent with the rear positions Pfb and Phb of the substrate S. • The front position Psf of the clamp 51d of the clamp unit 51R is also consistent with the front position Pff and Phf of the substrate S. The rear position Psb of the clamp 51c of the clamp unit 51R also coincides with the rear positions Pfb and Phb of the substrate S. Furthermore, clamps 51a to 51d hold the peripheral portions of the four corners of the lower surface of the substrate S, and in this state, the substrate S is moved in the transport direction Dt. In other words, in this embodiment, the front positions Pff and Phf and the rear positions Pfb and Phb of the substrate S correspond to an example of the "loading position" of the present invention, and the front positions Psf and Psb of the clamp mechanism 51 correspond to an example of the "holding position" of the present invention.

[0142] As described above, in the eleventh embodiment, not only are the same effects as in the first embodiment achieved, but the following additional effects are also achieved: the clamps 51a to 51d can move independently along the X direction, and the spacing between clamps 51a and 51b and the spacing between clamps 51c and 51d in the X direction correspond to the X-direction dimension of the substrate S. As a result, regardless of the substrate size, the substrate S can be lifted and transported while simultaneously holding the periphery of its four corners. Therefore, compared to the first embodiment, the substrate S can be lifted and transported more stably.

[0143] Furthermore, although in the eleventh embodiment, clamping units 51L and 51R each have two clamps, as in the fourth embodiment, the present invention can be applied to substrate transport units 5 where clamping units 51L and 51R each have three clamps. Additionally, the present invention can also be applied when the number of clamps provided in clamping units 51L and 51R is different.

[0144] <Twelfth Implementation>

[0145] Although in the eleventh embodiment described above, when the half-size substrate Sh is moved along the X direction, all clamps 51a to 51d are used to hold the half-size substrate Sh, similar to the first embodiment, the half-size substrate Sh can be moved along the X direction while only the front clamp pair (i.e., clamps 51b and 51d) is used to hold it. In this case, as long as clamps 51a and 51c are both closer to the (-X) side in the X direction than clamps 51b and 51d, it can be kept at any position. However, in the twelfth embodiment, for example, clamps 51a and 51c are positioned further (-X) than clamps 51b and 51d. Figure 24 The standby position Psw in column (b) is in standby mode. See below for reference. Figure 24 The twelfth embodiment will be described.

[0146] Figure 24This is a diagram showing the positional relationship between the loading substrate and the clamp in the horizontal plane according to the twelfth embodiment of the present invention. In the twelfth embodiment, when loading the full-size substrate Sf, as shown in column (a) of this figure, the relationship between the loading position of the full-size substrate Sf and the holding position of the clamp mechanism 51 is adjusted so that the front position Psf of the clamp 51b and the rear position Psb of the clamp 51a in the clamp unit 51L are consistent with the front position Pff and the rear position Pfb of the full-size substrate Sf, respectively, and the front position Psf of the clamp 51d and the rear position Psb of the clamp 51c in the clamp unit 51R are consistent with the front position Pff and the rear position Pfb of the full-size substrate Sf, respectively.

[0147] On the other hand, when the half-size substrate Sh is moved in, as shown in column (b) of the figure, the relationship between the moving position of the half-size substrate Sh and the holding position of the clamping mechanism 51 is adjusted so that the front position Psf of the clamp 51b in the clamping unit 51L is consistent with the front end position Phf of the half-size substrate Sh, and the front position Psf of the clamp 51d in the clamping unit 51R is consistent with the front end position Phf of the half-size substrate Sh.

[0148] Here, during the continuous transport of the half-size substrate Sh, the clamps 51a and 51c are not directly related to the adsorption, holding, and movement of the half-size substrate Sh. However, for example, as Figure 7 As shown in column (b), when the clamps 51a and 51c are moved significantly away from the rear end position Pfb of the full-size substrate Sf to prevent interference with the half-size substrate Sh being transported, the following problem arises: When the substrate S being transported changes from the half-size substrate Sh to the full-size substrate Sf, the standby clamps 51a and 51c need to move a relatively long distance in the (+X) direction to reach the rear end position Pfb. In contrast, as... Figure 24 As shown in column (b), when the clamps 51a and 51c are in standby position Psw, adjacent to the rear end position Pfb of the substrate S on the (-X) side, the moving distance and moving time of the clamps 51a and 51c after the switch are significantly shortened. As a result, the time and energy required to switch from the half-size substrate Sh to the full-size substrate Sf can be saved. Moreover, the shortened moving distance helps to achieve miniaturization of the travel guide 523 in the X direction and the magnet module 524M of the linear motor 524. As a result, the device size can be miniaturized and the manufacturing cost can be reduced.

[0149] <Thirteenth Implementation Method>

[0150] The standby position Psw setting implemented in the twelfth embodiment can also be applied to the substrate transport unit 5, in which three or more clamps move independently in the clamp units 51L and 51R in the X direction (thirteenth embodiment).

[0151] Figure 25 This is a diagram showing the positional relationship between the substrate and the clamps in the horizontal plane according to the thirteenth embodiment of the present invention. As shown in column (a) of the figure, the coating apparatus 1, in which the three clamps move freely in the clamp units 51L and 51R independently, lifts and transports the full-size substrate Sf while holding the periphery of the full-size substrate Sf with all clamps 51a to 51f. On the other hand, when the coating apparatus 1 is transporting the half-size substrate Sh, it lifts and transports the half-size substrate Sh while holding the periphery of the half-size substrate Sh with clamps 51b, 51d to 51f, and sets clamps 51a and 51c in a standby position Psw adjacent to the rear end position Pfb of the half-size substrate Sh on the (-X) side.

[0152] <Fourteenth Implementation>

[0153] Although in the eleventh embodiment described above, regardless of the substrate size, the substrate S is lifted and transported while adsorbing and holding the peripheral portions of the four corners of the substrate S, for example, Figure 26 As shown, clamping units 51L and 51R can also be selectively used to hold the substrate S and perform floating transport, depending on the substrate size. Hereinafter, refer to... Figure 26 The fourteenth embodiment will be described.

[0154] Figure 26 This diagram illustrates the positional relationship between the loading substrate and the clamp in the horizontal plane according to the fourteenth embodiment of the present invention. In the fourteenth embodiment, when the full-size substrate Sf is loaded, as shown in column (a) of this diagram, in the clamp unit 51R, the front position Psf of clamp 51d and the rear position Psb of clamp 51c are aligned with the front end position Pff and the rear end position Pfb of the full-size substrate Sf, respectively, adsorbing and holding the peripheral portions of the two corners on the (-Y) side of the lower surface of the full-size substrate Sf. In this state, the clamps 51c and 51d of the clamp unit 51R move along the X direction, thereby lifting and transporting the full-size substrate Sf in the transport direction Dt. Furthermore, during this period, the clamps 51a and 51b constituting the clamp unit 51L are not directly related to the adsorption, holding and movement of the full-size substrate Sf. In order to prevent interference with the full-size substrate Sf during transport, similar to the twelfth embodiment, the clamps 51a and 51b are in standby position Psw adjacent to the rear end position Pfb of the full-size substrate Sf on the (-X) side.

[0155] On the other hand, when the half-size substrate Sh is moved in, such as Figure 26As shown in column (b), in the clamping unit 51L, the front position Psf of clamp 51b and the rear position Psb of clamp 51a are aligned with the front end position Phf and the rear end position Phb of half-size substrate Sh, respectively, adsorbing and holding the peripheral portions of the two corners on the (+Y) side of the lower surface of half-size substrate Sh. In this state, the clamps 51c and 51d of clamping unit 51R move along the X direction, thereby lifting and transporting half-size substrate Sh in the transport direction Dt. Furthermore, during this period, the clamps 51c and 51d constituting clamping unit 51R are not directly related to the adsorption, holding, and movement of half-size substrate Sh. In order to prevent interference with the half-size substrate Sh during transport, similarly to the twelfth embodiment, clamps 51a and 51b are in standby position Psw, which is adjacent to the rear end position Phb of half-size substrate Sh on the (-X) side.

[0156] Therefore, the moving distance and time of the clamps 51a and 51c when switching from a full-size substrate Sf to a half-size substrate Sh are significantly reduced. As a result, the time and energy required for switching from a full-size substrate Sf to a half-size substrate Sh can be saved. Furthermore, the moving distance and time of the clamps 51c and 51d when switching from a half-size substrate Sh to a full-size substrate Sf are significantly reduced. As a result, the time and energy required for switching from a half-size substrate Sh to a full-size substrate Sf can be saved.

[0157] Furthermore, the standby position Psw setting implemented in the fourteenth embodiment can also be applied to the substrate transport unit 5 in which one or more clamps move independently in the clamp units 51L, 51R in the X direction.

[0158] <Fifteenth Implementation>

[0159] In the first to third embodiments, clamps 51a and 51b are separated in the X direction on the (+Y) side base 521 by a distance equivalent to the X direction dimension of the full-size substrate Sf, and clamps 51c and 51d are separated in the X direction on the (-Y) side base 521 by a distance equivalent to the X direction dimension of the full-size substrate Sf. Therefore, when transporting the full-size substrate Sf, four clamps 51a to 51d can be used for adsorption and holding, but when transporting the full-size substrate Sf, only two clamps 51a and 51c (or clamps 51b and 51d) can be used for adsorption and holding. Here, the substrate transport unit 5 (fifteenth embodiment) is configured such that clamps 51a and 51b on the (+Y) side base 521 can move independently in the X direction, and clamps 51c and 51d on the (-Y) side base 521 can move independently in the X direction. Hereinafter, referring to… Figures 27 to 29 The fifteenth embodiment will be described.

[0160] Figure 27 This is a top view of the coating apparatus according to the fifteenth embodiment of the substrate processing apparatus of the present invention, viewed from vertical above. Figure 28 This diagram schematically illustrates the traveling section of the adsorption traveling control mechanism in the fifteenth embodiment, extracting and schematically illustrating the structure of the traveling section that transports the substrate in the levitation section. The major difference between this fifteenth embodiment and the first embodiment is that the end of the traveling guide 523 in the (-X) direction is shorter than in the first embodiment, extending to the adjacent area of ​​the input transfer section 2; the structure and operation of the substrate transport section 5 are basically the same as in the first embodiment. Therefore, the following description focuses on the differences, using the same reference numerals for identical structures and omitting structural descriptions.

[0161] In the clamping mechanism 51, clamps 51a and 51b, which are independently movable along the X direction and are mounted on the base 521 on the (+Y) side, function as clamping unit 51L. Clamps 51c and 51d, which are independently movable along the X direction and are mounted on the base 521 on the (-Y) side, function as clamping unit 51R. Additionally, a spacing adjustment section 53L is provided on the base 521 on the (+Y) side, which adjusts the spacing of clamps 51a and 51b in the X direction by moving them independently. Similarly, a spacing adjustment section 53R is provided on the base 521 on the (-Y) side, which adjusts the spacing of clamps 51c and 51d in the X direction by moving them independently. Furthermore, a traveling section 52L for moving the base 521, which is equipped with the clamp unit 51L and the spacing adjustment section 53L, in the transport direction Dt is provided on the (+Y) side of the floating section 3, and a traveling section 52R for moving the base 521, which is equipped with the clamp unit 51R and the spacing adjustment section 53R, in the transport direction Dt is provided on the (-Y) side of the floating section 3. The traveling sections 52L and 52R, and the spacing adjustment sections 53L and 53R, have the same structure, such as... Figure 27 As shown, when viewed from above, they are symmetrically arranged across the floating section 3. Similarly, the clamping units 51L and 51R are also arranged in the same manner. Therefore, in this specification, refer to... Figure 27 and Figure 28 The structure of the clamping unit 51R, the traveling part 52R, and the interval adjustment part 53R is described in detail. On the other hand, the same reference numerals are used to refer to the structure of the clamping unit 51L, the traveling part 52L, and the interval adjustment part 53L, and the description is omitted.

[0162] The traveling unit 52R includes a base 521, sliders 522, a traveling guide 523, and a linear motor 524. The base 521 has a flat plate shape extending in the X direction, and its upper surface is machined to be flat. The clamping unit 51R is mounted on the upper surface of the base 521 via a spacing adjustment part 53R. Two sliders 522 are mounted on the lower surface of the base 521. The sliders 522 engage with the traveling guide 523. Thus, the base 521 can travel in the X direction along the traveling guide 523 while holding the substrate S held by the clamping unit 51R and the substrate S held by the clamping unit 51R.

[0163] In addition, a linear motor 524 is provided to enable the base 521 to move. Specifically, the magnet module 524M of the linear motor 524 extends along the X direction on the base 10 as a fixing member, and the coil module 524C is mounted on the lower part of the base 521 as a moving member. The linear motor 524 operates according to control commands from the control unit 9, thereby moving the base 521 along the X direction. Thus, the substrate S, which is attracted by the clamping unit 51R on the base 521, moves in the transport direction Dt. Furthermore, the X-direction position of the clamping unit 51R can be detected using a linear scale (not shown). Although the linear motor 524 is used to move the substrate S in the first embodiment, other traveling mechanisms, such as a ball screw mechanism, can also be used, and an encoder can be used to detect the X-direction position of the clamping unit 51R.

[0164] Next, the interval adjustment unit 53R will be described. The interval adjustment unit 53R includes short bases 531 and 532, sliding members 533 and 534, a travel guide 535, and a linear motor 536. The short bases 531 and 532 are flat plates extending in the X direction with a shorter dimension than the base 521, and their upper surfaces are machined to be flat. The clamps 51c and 51d constituting the clamp unit 51R are respectively mounted on the short bases 531 and 532 (see reference). Figure 22 ).

[0165] Sliding members 533 and 534 are respectively mounted on the lower surfaces of short bases 531 and 532. Sliding members 533 and 534 engage with a travel guide 535 fixed to base 521. Thus, clamps 51c and 51d respectively mounted on short bases 531 and 532 can move independently along the X direction. Furthermore, a linear motor 536 is provided to enable the short bases 531 and 532 to travel. Specifically, the magnet module 536M of the linear motor 536 extends along the X direction on base 521 as a fixed member, and coil modules 536C1 and 536C2 are respectively mounted as moving members on the lower parts of short bases 531 and 532.

[0166] The linear motor 536 operates according to control commands from the control unit 9, causing the short bases 531 and 532 to move independently along the X direction. This allows adjustment of the spacing between the clamps 51c and 51d in the X direction. For example, when transporting a full-size substrate Sf in the transport direction Dt, by widening the spacing between the clamps 51c and 51d, the peripheral portions of the two corners on the holding (-Y) side can be adsorbed and held onto the lower surface of the full-size substrate Sf. Conversely, by narrowing the spacing between the clamps 51c and 51d, the peripheral portions of the two corners on the holding (-Y) side can be adsorbed and held onto the lower surface of a half-size substrate Sh.

[0167] When the substrate S held in this adsorption manner is transported in the transport direction Dt, the linear motor 524 operates according to the control command from the control unit 9, and the base 521 moves in the X direction. Thus, the substrate S, adsorbed by the clamping unit 51R with its spacing adjusted as described above, travels in the transport direction Dt on the base 521. Furthermore, the X-direction position of the clamping unit 51R can be detected by a linear scale (not shown). Although the fifteenth embodiment uses linear motors 524 and 536 to travel the substrate S, it is also possible to use other traveling mechanisms, such as ball screw mechanisms, and to use an encoder to detect the X-direction position of the clamping unit 51R.

[0168] Figure 29 This diagram illustrates the horizontal positional relationship between the substrate being moved above the upstream floating platform and the clamps. Column (a) shows the relationship between the full-size substrate Sf and the clamps 51a to 51d, while column (b) shows the relationship between the half-size substrate Sh and the clamps 51a to 51d. In this fifteenth embodiment, when the full-size substrate Sf is moved in, as shown in column (a) of the diagram, the X-direction spacing of clamps 51a and 51b and the X-direction spacing of clamps 51c and 51d are adjusted to values ​​suitable for the full-size substrate Sf. In this state, the base 521 moves directly below the full-size substrate Sf. Consequently, the forward position Psf of clamps 51b and 51d coincides with the front end position Pff of the full-size substrate Sf, and the rear position Psb of clamps 51a and 51c coincides with the rear end position Pfb of the full-size substrate Sf. The clamps 51a to 51d hold the periphery of the four corners of the lower surface of the substrate S, and in this state, move the substrate S in the transport direction Dt.

[0169] On the other hand, when the half-size substrate Sh is loaded, as shown in column (b) of the figure, the X-direction spacing of clamps 51a and 51b and the X-direction spacing of clamps 51c and 51d are adjusted to values ​​suitable for the half-size substrate Sh. In this state, the base 521 moves directly below the half-size substrate Sh. As a result, the front position Psf of clamps 51b and 51d coincides with the front end position Pff of the half-size substrate Sh, and the rear position Psb of clamps 51a and 51c coincides with the rear end position Pfb of the half-size substrate Sh. Clamps 51a to 51d hold the periphery of the four corners of the lower surface of the substrate S, and in this state, the substrate S is moved in the transport direction Dt. That is, in this embodiment, the front end positions Pff and Phf and the rear end positions Pfb and Phb of the substrate S correspond to an example of the "loading position" of the present invention, and the front positions Psf and Psb of the clamp mechanism 51 correspond to an example of the "holding position" of the present invention.

[0170] As described above, in the fifteenth embodiment, not only are the same effects as in the first embodiment achieved, but the following additional effects are also achieved: The clamps 51a to 51d can move independently along the X direction, and the spacing between clamps 51a and 51b and between clamps 51c and 51d in the X direction corresponds to the X-direction dimension of the substrate S. As a result, regardless of the substrate size, the substrate S can be lifted and transported while simultaneously holding the periphery of its four corners. Therefore, compared to the first embodiment, the substrate S can be lifted and transported more stably.

[0171] Furthermore, although in the fifteenth embodiment, the substrate S is held in place by the clamping units 51L and 51R while being lifted and transported, similar to the ninth embodiment, the substrate S can also be transported using only one of the clamping units.

[0172] Furthermore, although in the fifteenth embodiment each of the clamp units 51L and 51R is equipped with two clamps, it is also possible to configure three or more clamps in one or both of them to move freely along the X direction independently on the base 521. The same applies to the sixteenth embodiment, which will be described below.

[0173] Furthermore, although in the fifteenth embodiment, all clamps 51a to 51d are used to hold the substrate S while lifting and transporting it, regardless of the substrate size, it is also possible to configure it in the same way as the first, twelfth, and thirteenth embodiments, such that the end of the travel guide 523 in the (-X) direction extends to the adjacent area of ​​the input conveyor 100, and the remaining clamps are used to transport the half-size substrate Sh while some clamps are in standby position. In other words, for the full-size substrate Sf, all clamps 51a to 51d can be used for transport, while for the half-size substrate Sh, the remaining clamps can be used while the rear clamp pair (i.e., clamps 51a and 51c) is in standby position Psw. Alternatively, it can be configured similarly to the fourteenth embodiment, with the end of the travel guide 523 extending to the adjacent area of ​​the input conveyor 100. For a full-size substrate Sf, one clamping unit is in standby position Psw while the other clamping unit is in standby position. On the other hand, for a half-size substrate Sh, one clamping unit is in standby position Psw while the other clamping unit is in standby position.

[0174] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made in addition to the above without departing from its spirit. For example, in the above embodiments, a full-size substrate Sf is exemplified as a first substrate having a first length in a first direction (X direction) and a first side and a second side opposite to each other in a second direction (Y direction) orthogonal to the first direction, and a half-size substrate Sh is exemplified as a second substrate having a second length in a first direction shorter than the first length and a third side and a fourth side opposite to each other in the second direction, but the first substrate and the second substrate are not limited to these.

[0175] Furthermore, in the above embodiments, the present invention applies to a coating apparatus 1 that supplies coating liquid to the upper surface Sa of a substrate S, but the application scope of the present invention is not limited thereto. That is, it is applicable to all substrate processing techniques that perform a prescribed process by supplying processing liquid to a nozzle, thereby supplying processing liquid from the nozzle to the surface of the substrate while moving the substrate, which is levitated by receiving gas from a levitation stage, relative to the nozzle.

[0176] This invention is applicable to all substrate handling techniques that hold a substrate in a floating state and in a horizontal position by blowing fluid onto the lower surface of a substrate having a rectangular shape, and transport the substrate along a predetermined transport direction, as well as all substrate processing techniques that use the substrate handling techniques to supply processing liquid to the upper surface of the substrate being transported along the predetermined direction.

Claims

1. A substrate handling method, wherein a substrate, which is being held above a floating platform by a holding portion above the platform on its lower surface side and onto the platform where gas is being ejected upwards, is handled by a holding portion, and the substrate is handled along a handling direction parallel to a first direction, characterized in that, The substrate handling method has the following characteristics: In the first transport process, when the substrate being transported above the floating platform is a rectangular substrate having a first length in a first direction and a first side and a second side that are opposite to each other in a second direction orthogonal to the first direction, after adjusting the relationship between the transport position of the first substrate and the holding position of the holding part, the first substrate is moved along the first direction while the holding part partially holds the vicinity of at least one of the first side and the second side. In the second transport process, when the substrate being transported above the floating platform is a rectangular substrate having a second length that is shorter than the first length in the first direction and a third side and a fourth side that are opposite to each other in the second direction, after adjusting the relationship between the transport position of the second substrate and the holding position of the holding part, the second substrate is moved along the first direction while the holding part partially holds the vicinity of at least one of the third side and the fourth side.

2. The substrate handling method according to claim 1, wherein, The first transport step includes a step of moving the holding portion near the first edge along the first direction. The second transport step includes a step of moving the holding portion near the third side along the first direction.

3. The substrate handling method according to claim 2, wherein, In the first transport step, the holding part holds the first central portion in the first direction near the first side. In the second transport step, the holding part holds the second central part in the first direction near the third side.

4. The substrate handling method according to claim 1, wherein, The first transport step includes a step of moving the holding portion, which partially holds the vicinity of the first side and the vicinity of the second side, along the first direction. The second transport step includes a step of moving the holding portion, which partially holds the vicinity of the third side and the vicinity of the fourth side, along the first direction.

5. The substrate handling method according to claim 4, wherein, The first transport step includes a step of moving the holding portion that holds the first front corner located on the front end side and the first rear end corner located on the rear end side near the first side, and the second front corner located on the front end side and the second rear end corner located on the rear end side near the second side, along the first direction. The second transport step includes a step of moving the holding portion, which holds at least one of the third front corner on the front end side and the third rear end corner on the rear end side near the third side, and holds at least one of the fourth front corner on the front end side and the fourth rear end corner on the rear end side near the fourth side, along the first direction.

6. The substrate handling method according to claim 5, wherein, In the second transport process, the holding part does not hold the third rear end corner and the fourth rear end corner, but holds the third front end corner and the fourth front end corner.

7. The substrate handling method according to claim 6, wherein, The retaining part has: The first clamp moves freely along the first direction on one side of the floating platform in the second direction; The second clamp is located on one side of the floating platform and on the transport direction side of the first clamp, and moves freely along the first direction. The third clamp is free to move along the first direction on the other side of the floating platform in the second direction; as well as The fourth clamp, located on the other side of the floating platform and on the transport direction side of the third clamp, moves freely along the first direction. In the first transport step, the first clamp, the second clamp, the third clamp, and the fourth clamp, while respectively holding the first rear end corner, the first front end corner, the second rear end corner, and the second front end corner, move together in the transport direction. In the second transport process, the first clamp and the third clamp are on the opposite side of the second substrate in the transport direction. On the other hand, the second clamp and the fourth clamp move together in the transport direction while holding the first front corner and the second front corner respectively.

8. The substrate handling method according to claim 6, wherein, In the first transport step, the holding part also holds the first intermediate part located between the first front corner and the first rear corner, and the second intermediate part located between the second front corner and the second rear corner. In the second transport process, the holding part also holds the third intermediate part located between the third front corner and the third rear corner, and the fourth intermediate part located between the fourth front corner and the fourth rear corner.

9. The substrate handling method according to claim 8, wherein, The retaining part has: The first clamp moves freely along the first direction on one side of the floating platform in the second direction; The second clamp is located on one side of the floating platform and on the transport direction side of the first clamp, and moves freely along the first direction. The third clamp is free to move along the first direction on the other side of the floating platform in the second direction; The fourth clamp is located on the other side of the floating platform and on the transport direction side of the third clamp, and moves freely along the first direction; The fifth clamp is located between the first clamp and the second clamp and moves freely along the first direction; as well as The sixth clamp, between the third clamp and the fourth clamp, can move freely along the first direction. In the first transport step, the first clamp, the second clamp, the third clamp, the fourth clamp, the fifth clamp, and the sixth clamp, while respectively holding the first rear end corner, the first front end corner, the second rear end corner, the second front end corner, the first middle portion, and the second middle portion, move together in the transport direction. In the second transport process, the first clamp and the third clamp are on standby on the opposite side of the transport direction relative to the second substrate. On the other hand, the second clamp, the fourth clamp, the fifth clamp and the sixth clamp move together in the transport direction while holding the first front corner, the second front corner, the first middle part and the second middle part respectively.

10. The substrate handling method according to claim 5, wherein, In the second transport process, the holding part does not hold the third front end corner and the fourth front end corner, but holds the third rear end corner and the fourth rear end corner.

11. The substrate handling method according to claim 4, wherein, In the first transport step, the holding part holds the first front corner located on the front end side near the first side and the second front corner located on the front end side near the second side. In the second transport step, the holding part holds the third front corner located on the front end side near the third side and the fourth front corner located on the front end side near the fourth side.

12. The substrate handling method according to claim 4, wherein, In the first transport step, the holding part holds the first rear end corner located on the rear end side near the first side and the second rear end corner located on the rear end side near the second side. In the second transport step, the holding part holds the third rear end corner located on the rear end side near the third side and the fourth rear end corner located on the rear end side near the fourth side.

13. The substrate handling method according to claim 4, wherein, In the first transport step, the holding part holds the first front corner located on the front end side near the first side and the second rear corner located on the rear end side near the second side. In the second transport step, the holding part holds the third front corner located on the front end side near the third side and the fourth rear corner located on the rear end side near the fourth side.

14. The substrate handling method according to claim 4, wherein, The retaining part has: The first clamp moves freely along the first direction on one side of the floating platform in the second direction; The second clamp is located on one side of the floating platform and on the transport direction side of the first clamp, and moves freely along the first direction. The third clamp is free to move along the first direction on the other side of the floating platform in the second direction; as well as The fourth clamp, located on the other side of the floating platform and on the transport direction side of the third clamp, moves freely along the first direction. In the first transport step, the first clamp and the second clamp are in standby on the opposite side of the first substrate in the transport direction. On the other hand, the third clamp and the fourth clamp, while respectively holding the second rear end corner on the rear end side and the second front end corner on the front end side near the second side, move together in the transport direction. In the second transport process, the third clamp and the fourth clamp are in standby on the opposite side of the transport direction relative to the second substrate. On the other hand, the first clamp and the second clamp move together in the transport direction while holding the first rear end corner located on the rear end side and the first front end corner located on the front end side near the first side, respectively.

15. The substrate handling method according to claim 5, wherein, In the second transport process, the holding part holds the third front corner, the fourth front corner, the third rear corner and the fourth rear corner.

16. A substrate handling apparatus for performing the substrate handling method according to any one of claims 1 to 15, characterized in that, The substrate transport device has: The substrate size determination unit determines which of the first substrate and the second substrate the substrate is being moved above the floating platform; When the substrate size determination unit determines that it is the first substrate, the first transport control unit adjusts the relationship between the transport position of the first substrate and the holding position of the holding unit, and moves the first substrate along the first direction while partially holding the vicinity of at least one of the first side and the second side by the holding unit. as well as When the substrate size determination unit determines that it is the second substrate, the second transport control unit adjusts the relationship between the transport position of the second substrate and the holding position of the holding unit, and moves the second substrate along the first direction while using the holding unit to partially hold near at least one of the third side and the fourth side.

17. A substrate processing method, wherein a substrate, which is being held above a floating stage by a holding portion above the floating stage where gas is being ejected upwards, is transported along a transport direction parallel to a first direction, and a processing liquid is supplied to the substrate, characterized in that, The substrate processing method includes: In the first processing step, when the substrate being moved onto the floating platform is a rectangular substrate having a first length in a first direction and a first side and a second side that are opposite to each other in a second direction orthogonal to the first direction, after adjusting the relationship between the loading position of the first substrate and the holding position of the holding part, the first substrate is moved along the first direction while the holding part partially holds the vicinity of at least one of the first side and the second side, and the processing liquid is supplied to the first substrate. as well as In the second processing step, when the substrate being moved onto the floating platform is a rectangular substrate having a second length shorter than the first length in the first direction and a third and fourth side opposite to each other in the second direction, after adjusting the relationship between the loading position of the second substrate and the holding position of the holding part, the second substrate is moved along the first direction while the holding part partially holds the vicinity of at least one of the third and fourth sides, and the processing liquid is supplied to the second substrate.

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