Flexible thermal interface material and method of making and use

Abstract

This invention belongs to the field of thermal interface materials technology, specifically relating to a flexible thermal interface material, its preparation method, and its application. The preparation method includes the following steps: Step S1: Encapsulating a carbon nanotube array using a first flexible polymer precursor solution; Step S2: Encapsulating the carbon nanotube array using a second flexible polymer precursor solution; Step S3: Removing the polymer material adhering to the surface of the carbon nanotube array. This invention solves the problem of stress-induced material breakage due to the rigidity of the carbon nanotube array material in practical applications, while avoiding insufficient material strength caused by incomplete wetting of the encapsulation material; it significantly improves the thermal diffusivity and thermal conductivity of the carbon nanotube array material, enabling the carbon nanotube array as a thermal interface material to be applied efficiently and stably in the above scenarios.

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