Wafer drying treatment device with buffer jacking structure

Abstract

The application discloses a wafer drying treatment device with a buffer jacking structure, which comprises a machine body and a wafer body. A treatment area is arranged in the machine body. A drying device, a jacking device and a bearing device are arranged in the treatment area. The drying device is used for drying the wafer body and comprises a groove body and a liquid supply mechanism for supplying liquid into the groove body. Through the arrangement of the jacking device and the bearing device, the device is designed in a separated mode. The wafer body to be dried is directly fed to the jacking device. The drying process does not need a basket. After the drying is completed, the clean wafer body is directly jacked up by the jacking device and transferred to the basket which has not contacted the undried wafer body. Since the basket is in a separated state before the drying, the interior of the basket has not contacted the pollutants, so that the cross contamination problem caused by the repeated use of the basket in the traditional technology can be effectively avoided, and the cleanliness of the wafer body surface is obviously improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a wafer drying apparatus with a buffer lifting structure. Background Technology

[0002] Wafers are a core material in the semiconductor industry, with wide-ranging applications. Wafer processing includes polishing, cleaning, and drying. In the drying process, the Marangoni effect is commonly used. Etching machines, as core equipment in semiconductor device manufacturing, play a crucial role in wafer manufacturing. They use precise physical or chemical methods to etch complex circuit patterns onto the wafer surface, directly impacting chip performance and yield. The cleanliness of the wafer before and after etching and other critical processes is essential for ensuring etching accuracy and device reliability. Therefore, the quality of wafer drying directly affects the final processing results of etching machines and other equipment.

[0003] In the wafer drying process, traditional technology typically employs a basket pre-loading – transfer drying – secondary transfer unloading process. Specifically, the wafer to be dried is first placed in a basket, then transferred to the drying unit via a transfer device. After drying, the wafer is transferred back to the basket via the same transfer device. This process has significant drawbacks: First, after carrying undried wafers, the basket surface is prone to residual impurities, moisture, or chemical residues. When a clean, dried wafer is placed back into the same basket, contaminants from the basket directly contact the wafer surface, leading to cross-contamination and affecting wafer cleanliness and subsequent processing quality. Second, the repeated loading and unloading of the wafer between the basket and the drying unit during multiple transfers not only increases operational steps and time costs but also risks wafer detachment, damage, or misalignment due to mechanical vibration or positioning deviations during transfer, reducing production efficiency and yield. Furthermore, the lifting mechanism of traditional drying equipment lacks flexible position adjustment and buffering mechanisms. During the lifting or lowering of the wafer, excessive speed or impact force can easily cause wafer wobbling, further increasing the risk of wafer damage. Therefore, it is necessary to design a wafer drying device with a buffer lifting structure to solve the above problems. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the present invention aims to provide a wafer drying device with a buffer lifting structure.

[0005] The objective of this invention is achieved through the following technical solution: A wafer drying processing apparatus with a buffer lifting structure includes a body and a wafer body. The body has a processing area inside, and the processing area is respectively equipped with a drying device, a lifting device and a supporting device. A drying apparatus for drying the wafer body, the drying apparatus including a tank and a liquid supply mechanism for supplying liquid into the tank; A lifting device is installed inside the tank to support and transport the wafer body into the drying device for drying, and to lift the dried wafer body onto the carrying device for storage. A support device, disposed above the lifting device, is used to store the dried wafer body, and includes a support mechanism and an electric slide rail for adjusting the position of the support mechanism.

[0006] According to the wafer drying processing apparatus with a buffer lifting structure, the supporting mechanism includes a material basket, a support part disposed inside the material basket, and a rotating clamping assembly rotatably connected to the material basket. The rotating clamping assembly is used to support and limit the dried wafer body inside the material basket.

[0007] According to the wafer drying device with a buffer lifting structure, the rotating clamping assembly includes a rotating shaft rotatably connected inside the basket, a plate mounted on the outer wall of the rotating shaft, a second support portion formed on the plate, a housing mounted on one side of the basket, a drive cylinder mounted inside the housing, a linkage shaft mounted on the output end of the drive cylinder, a first connecting rod movably connected to the outside of the linkage shaft, and a sliding groove formed on the first connecting rod. The linkage shaft slides on the inner wall of the sliding groove, and the first connecting rod is connected to the rotating shaft.

[0008] According to the wafer drying processing device with a buffer lifting structure, a cover plate is provided above the material basket, and an electric slide rail is installed on the side of the machine body near the material basket. The electric slide rail drives the material basket to move in the front-back direction inside the machine body, and a perforated plate is installed inside the side of the machine body near the material basket.

[0009] According to the wafer drying processing apparatus with a buffer lifting structure, the lifting device includes a frame, a second support mechanism that moves vertically up and down along the interior of the frame, a drive mechanism for driving the second support mechanism to move up and down, a buffer assembly installed on the drive mechanism, and a monitoring assembly for monitoring the operation of the drive mechanism.

[0010] According to the wafer drying processing apparatus with a buffer lifting structure, the second support mechanism includes a support plate, support rods symmetrically mounted on the support plate, support members mounted on the support rods, and support portions formed on the support members in a linear array.

[0011] According to the wafer drying processing device with a buffer lifting structure, the driving mechanism includes a guide rail installed inside the machine body, a first sliding member and a second sliding member slidably connected to the guide rail, a second connecting rod and a third connecting rod respectively installed on one side of the first sliding member and the second sliding member, and a first connecting frame and a second connecting frame respectively installed on one side of the first sliding member and the second sliding member. The first connecting frame is connected to the support plate, the second connecting frame is connected to the frame, and a connecting shaft is installed at the connection between the second connecting rod and the third connecting rod.

[0012] According to the wafer drying processing device with a buffer lifting structure, the buffer assembly includes a shaft mounted on one side of the guide rail, a buffer one and a buffer two mounted on the outer wall of the shaft, and the monitoring assembly includes a group of multiple position monitoring sensors mounted on one side of the guide rail.

[0013] The wafer drying apparatus with a buffer lifting structure further includes a control system for controlling and monitoring the overall operation of the apparatus.

[0014] A wafer drying method includes the following steps: S1. Control the load-bearing device to move from the initial position to the position above the perforated plate; S2. Initially, the lifting device is located in the first predetermined position, and the wafer body is loaded onto the lifting device; S3. Set the wafer body drying time through the control system. The wafer body stays and dries inside the drying device to complete the wafer body drying. S5. After drying is completed, the lifting device rises to the second predetermined position and lifts the wafer body upwards, while driving the carrier device back to the initial position. At this time, the lifting device lifts the wafer body and moves it into the carrier device. S6. The carrier device clamps and limits the internal wafer body; S7. The lifting device descends back to the first predetermined position and removes the wafer body from inside the carrier device.

[0015] The above-mentioned solution has the following beneficial effects: 1. Through the setting of the lifting device and the carrying device, this device adopts a separate design to directly feed the wafer body to be dried onto the lifting device, without the need for the material basket during the drying process; after drying, the clean wafer body is directly lifted by the lifting device and transferred to the material basket that has not been in contact with the undried wafer body. Since the material basket is in a separated state before drying, its interior is not in contact with contaminants, thus effectively avoiding the cross-contamination problem caused by the reuse of material baskets in traditional technologies, and significantly improving the cleanliness of the wafer body surface.

[0016] 2. Through the precise lifting and lowering of the lifting device and the automatic limiting of the rotating clamping assembly, the integrated operation of wafer drying, lifting, clamping and storage is realized. Wafer loading, drying and unloading can be completed without additional transfer devices, simplifying the operation steps. At the same time, the buffer assembly and position monitoring sensor group of the lifting device can control the lifting speed and position in real time. Combined with the opposing clamping action of the rotating clamping assembly, it effectively prevents the wafer from falling off or being damaged during the lifting and lowering process, improving the stability of the processing and production efficiency.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a schematic diagram of the overall structure of a wafer drying device with a buffer lifting structure according to the present invention. Figure 2 This is a schematic diagram of the overall internal structure of a wafer drying device with a buffer lifting structure according to the present invention; Figure 3 This is a schematic diagram of the overall internal structure of a wafer drying device with a buffer lifting structure according to the present invention. Figure 4 This is a schematic diagram of the drying device of a wafer drying process apparatus with a buffer lifting structure according to the present invention; Figure 5 This is a schematic diagram of the supporting device of a wafer drying processing apparatus with a buffer lifting structure according to the present invention; Figure 6 This is a schematic diagram of the rotating clamping assembly of a wafer drying processing device with a buffer lifting structure according to the present invention; Figure 7 This is a schematic diagram of the drive mechanism of a wafer drying device with a buffer lifting structure according to the present invention; Figure 8 This is a schematic diagram of the support mechanism 2 of a wafer drying processing device with a buffer lifting structure according to the present invention.

[0019] Legend: 1. Main body; 2. Wafer body; 3. Processing area; 4. Drying device; 41. Tank; 42. Liquid supply mechanism; 51. Frame; 52. Support mechanism two; 521. Support plate; 522. Support rod; 523. Support component; 524. Support part; 53. Drive mechanism; 531. Guide rail; 532. Sliding component one; 533. Sliding component two; 534. Link two; 535. Link three; 536. Connecting frame one; 537. Connecting frame two; 54. Buffer assembly; 541. Shaft; 542. Buffer 1. Buffer 2; 543. Position monitoring sensor group; 6. Bearing device; 61. Supporting mechanism 1; 611. Material basket; 612. Support part 1; 613. Rotating clamping assembly; 6131. ​​Rotating shaft; 6132. Plate; 6133. Support part 2; 6134. Housing; 6135. Drive cylinder; 6136. Linkage shaft; 6137. Connecting rod 1; 6138. Sliding groove; 62. Electric slide rail; 7. Cover plate; 8. Mesh plate; 9. Connecting shaft; 10. Universal wheel; 11. Support leg. Detailed Implementation

[0020] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Reference Figures 1-8 A wafer drying apparatus with a buffer lifting structure, see also Figure 1 , Figure 2 and Figure 3 The device includes a main body 1 and a wafer body 2. The main body 1 has a processing area 3 inside, which is equipped with a drying device 4, a lifting device, and a supporting device 6. The main body 1 is equipped with casters 10 and adjustable feet 11. The casters 10 and adjustable feet 11 make it easy to move the overall position of the device and fix the position of the supporting device, making it convenient to use. The wafer body 2 can move within the three areas of the drying device 4, the lifting device, and the supporting device 6, ultimately achieving the purpose of drying and storing the wafer body 2.

[0024] Continue reading Figure 4 Drying device 4 is used to dry wafer body 2. Drying device 4 includes a tank 41 and a liquid supply mechanism 42 for supplying liquid into the tank 41. The tank 41 is installed inside the processing area 3. The liquid supply mechanism 42 is existing technology, so its working principle and structure will not be described in detail. The liquid supply mechanism 42 supplies and drains liquid into the tank 41, thereby drying the wafer body 2 inside. The inner bottom wall of the tank 41 is set with a certain slope, which facilitates the drainage of deionized water inside the tank 41. The wafer body 2 is dried using the Marangoni principle. First, the liquid supply mechanism 42 supplies deionized water into the tank 41. Then, the drying device 4 is also symmetrically equipped with gas supply pipes, such as... Figure 4 As shown, nitrogen gas is introduced into the gas supply pipe on the upper side of the inner wall of the tank 41. The IPA vapor carried by the nitrogen gas will form an IPA gas environment on the liquid surface. The IPA gas will dissolve into the deionized water on the surface of the wafer body 2. Since the surface tension of IPA is much lower than that of water, a surface tension gradient will immediately form on the liquid film surface. According to the Marangoni effect, the fluid will automatically flow from the area of ​​low surface tension (high IPA concentration) to the area of ​​high surface tension (low IPA concentration). This pulling force will pull the water film on the surface of the wafer body 2 back into the water tank below, thereby achieving the purpose of drying the wafer body 2. This method is a relatively mature technology and will not be described in detail.

[0025] Continue reading Figure 4 and Figure 7 A lifting device, located inside the tank 41, is used to support and transfer the wafer body 2 into the drying device 4 for drying, and to lift the dried wafer body 2 onto the carrying device 6 for storage. The lifting device can move inside the tank 41, and the entire lifting device is located within the tank 41. Figure 4 The interior of the groove 41 shown.

[0026] The support device 6, located above the lifting device, is used to store the dried wafer body 2. It includes a support mechanism 61 and an electric slide rail 62 for adjusting the position of the support mechanism 61. In its initial state, the support device 6 is located above the tank 41. That is, the positional relationship between the support device 6, the lifting device, and the drying device 4 is as follows: the support device 6 is located directly above the lifting device, the lifting device is located inside the drying device 4, and the drying device 4 is installed inside the processing area 3. The support device 6 has two states: one is the initial state, which is located directly above the lifting device and supported by the support truss inside the processing area 3; the other is the separated state, which is when the support mechanism 61 moves to one side of the perforated plate 8 under the drive of the electric slide rail 62 and finally moves onto the perforated plate 8. At this time, the support device 6 is separated from the lifting device.

[0027] Continue reading Figure 5 The support mechanism 61 includes a basket 611, a support part 612 disposed inside the basket 611, and a rotating clamping assembly 613 rotatably connected to the basket 611. The rotating clamping assembly 613 is used to support and limit the dried wafer body 2 inside the basket 611. The rotating clamping assembly 613 includes a rotating shaft 6131 rotatably connected inside the basket 611, a plate 6132 mounted on the outer wall of the rotating shaft 6131, a second support part 6133 opened on the plate 6132, a housing 6134 mounted on one side of the basket 611, a drive cylinder 6135 mounted inside the housing 6134, a linkage shaft 6136 mounted on the output end of the drive cylinder 6135, a first connecting rod 6137 movably connected to the outside of the linkage shaft 6136, and a sliding groove 6138 opened on the first connecting rod 6137. The linkage shaft 6136 slides on the inner wall of the sliding groove 6138, and the first connecting rod 6137 is connected to the rotating shaft 6131. A cover plate 7 is provided above the material basket 611. An electric slide rail 62 is installed on the side of the machine body 1 near the material basket 611. The electric slide rail 62 drives the material basket 611 to move in the front and back direction inside the machine body 1. A perforated plate 8 is installed inside the side of the machine body 1 near the material basket 611.

[0028] The operation of the carrier device 6 is as follows: In the initial state, the support mechanism 61 of the carrier device 6 is located above the lifting device. When the lifting device is needed to load the wafer body 2 for drying, the drive electric slide rail 62 is activated, which drives the support mechanism 61 to move to one side of the perforated plate 8. At this time, the carrier device 6 is located above the perforated plate 8, using the perforated plate 8 for support. Then, multiple wafer bodies 2 are loaded into the lifting device. After loading is completed, the support mechanism 61 returns to its initial position under the drive of the electric slide rail 62. At the same time, the drying device 4 dries the wafer body 2. After drying, the wafer body 2 is lifted by the lifting device and loaded onto the inner wall of the support part 612 and support part 6133 inside the basket 611. The lower surface of the wafer body 2 is supported by the support mechanism 52. At this time, the drive cylinder 6135 is activated to drive the linkage shaft 6136 to slide on the inner wall of the sliding groove 6138, thereby driving... The first moving link 6137 rotates, and the first moving link 6137 is connected to the rotating shaft 6131. ​​The rotation of the first moving link 6137 synchronously drives the rotating shaft 6131 to rotate. The plate 6132 is installed on the outer wall of the rotating shaft 6131, thus the plate 6132 rotates synchronously. The rotating clamping assembly 613 consists of two sets, symmetrically installed inside the housing 6134. With the cooperation of two driving cylinders 6135, the linkage shaft 6136, the sliding groove 6138, and the first moving link 6137, it can drive the two... The plates 6132 rotate towards each other within the basket 611, that is, they rotate towards the outer wall of the wafer body 2, thereby firmly clamping the wafer body 2 and preventing the wafer body 2 from detaching from the support device 6 when the lifting device returns to its position. When it is necessary to remove multiple wafer bodies 2 from inside the basket 611, the cover plate 7 is connected to the basket 611 by bolts. The cover plate 7 can be removed from the basket 611 to unload the multiple dried wafer bodies 2 from inside the basket 611, which is convenient to use.

[0029] Continue reading Figure 7 and Figure 8The lifting device includes a frame 51, a second support mechanism 52 that moves vertically up and down inside the frame 51, a drive mechanism 53 for driving the second support mechanism 52 to move up and down, a buffer assembly 54 installed on the drive mechanism 53, and a monitoring assembly for monitoring the operation of the drive mechanism 53. The second support mechanism 52 includes a support plate 521, support rods 522 symmetrically installed on the support plate 521, support members 523 installed on the support rods 522, and support portions 524 opened on the support members 523 in a linear array. The drive mechanism 53 includes a guide rail 531 installed inside the body 1, a sliding member 532 slidably connected to the guide rail 531, and a sliding member 534. The components include: component 2 533; connecting rod 2 534 and connecting rod 3 535 respectively installed on one side of sliding component 1 532 and sliding component 2 533; connecting frame 1 536 and connecting frame 2 537 respectively installed on one side of sliding component 1 532 and sliding component 2 533; connecting frame 1 536 connected to support plate 521; connecting frame 2 537 connected to frame 51; and connecting shaft 9 installed at the connection of connecting rod 2 534 and connecting rod 3 535. The buffer assembly 54 includes shaft 541 installed on one side of guide rail 531; buffer 1 542 and buffer 2 543 installed on the outer wall of shaft 541. The monitoring assembly includes multiple position monitoring sensor groups 55 installed on one side of guide rail 531.

[0030] The operation of the lifting device is as follows: After the wafer body 2 is loaded onto the support part 524 of the lifting device, one of the sliding members 532 and 533 can be used as a driving source. If sliding member 532 is the driving source and slides on the guide rail 531 by electric drive, then sliding member 533 is the driven member. Conversely, if sliding member 533 is the driving source and also slides on the guide rail 531 by electric drive, then sliding member 532 is the driven member. The operating principle of the lifting device will be explained in detail using sliding member 533 as the driving source. Figure 8 As shown, there are four sets of position monitoring sensor groups 55, which are arranged symmetrically in pairs on one side of the guide rail 531. The four sets of position monitoring sensor groups 55 are numbered 1, 2, 3, and 4 from bottom to top. Position monitoring sensor groups 55 3 and 4 are used to detect the position of slider 1 532, and position monitoring sensor groups 55 1 and 2 are used to detect the position of slider 2 533. Figure 8In the initial state, the second sliding member 533 is located on one side of the No. 1 position monitoring sensor group 55, and the third sliding member 533 is located on the other side of the No. 3 position monitoring sensor group 55. That is, in the initial state, the lifting device is located inside the tank 41 of the drying device 4 (i.e., the first predetermined position of the lifting device). After the wafer body 2 is loaded onto the lifting device, the drying device 4 dries the multiple wafer bodies 2 supported on it. The control system presets the residence time of the wafer body 2 inside the drying device 4, i.e., the drying time. After drying is completed, the second sliding member 533 is activated to slide upward on the guide rail 531. The upward sliding of the second sliding member 533 drives the second connecting rod 534 to rotate through the third connecting rod 535 and the connecting shaft 9. Linkage 2 534 is mounted on slider 1 532 and rotatably connected to slider 1 532. Guide rail 531 limits slider 1 532 to only vertical movement. Thus, slider 2 533, through link 3 535, link 2 534, and connecting shaft 9, can drive slider 1 532 to slide upwards on guide rail 531. Simultaneously, as slider 2 533 and slider 1 532 move upwards, they drive support mechanism 2 52 and frame 51 upwards through connecting bracket 1 536 and connecting bracket 2 537. When slider 2 533 is detected by position monitoring sensor group 55 (group 2), slider 2 533 stops moving. At this time, slider 1 532 stops at the position of position monitoring sensor group 55 (group 4) and is detected by it, thereby lifting the wafer body 2. Figure 8 The final state of the lifting device shown (i.e., the second predetermined position of the lifting device).

[0031] It also includes a control system, which is used to control and monitor the overall operation of the device. The control system is located outside the device and is not shown in the figure.

[0032] A wafer drying method includes the following steps: S1. Control the load-bearing device 6 to move from the initial position to the position above the perforated plate 8; S2. Initially, the lifting device is located in the first predetermined position, and the wafer body 2 is loaded onto the lifting device; S3. The drying time of the wafer body 2 is set by the control system. The wafer body 2 stays and dries inside the drying device 4, and the drying of the wafer body 2 is completed. S5. After drying is completed, the lifting device rises to the second predetermined position and lifts the wafer body 2 upward, while driving the carrier device 6 back to the initial position. At this time, the lifting device lifts the wafer body 2 and moves it into the carrier device 6. S6, the carrier device 6 clamps and limits the internal wafer body 2; S7. The lifting device descends back to the first predetermined position and removes the wafer body 2 from inside the carrier device 6.

[0033] Working principle: Step 1: When the lifting device is needed to load the wafer body 2 for drying, the drive electric slide rail 62 is started, which drives the support mechanism 61 to move to one side of the perforated plate 8. At this time, the support device 6 is located above the perforated plate 8, and the perforated plate 8 is used for support. Then, multiple wafer bodies 2 are loaded into the lifting device. After loading is completed, the support mechanism 61 returns to its initial position under the drive of the electric slide rail 62. Step 2: The lifting device is located inside the tank 41 of the drying device 4 (i.e., the first predetermined position of the lifting device). After the wafer body 2 is loaded onto the lifting device, the drying device 4 is used to dry the multiple wafer bodies 2 supported on it. The control system presets the residence time of the wafer body 2 inside the drying device, i.e. the drying time. Step 3: After drying, activate slider 2 533 to slide upwards on guide rail 531. Sliding slider 2 533 upwards drives connecting rod 2 534 to rotate via connecting rod 3 535 and connecting shaft 9. Since connecting rod 2 534 is mounted on slider 1 532 and rotatably connected to it, and guide rail 531 limits slider 1 532 to only vertical movement, slider 2 533, through connecting rod 3 535, connecting rod 2 534, and connecting shaft 9, can drive slider 1 532 to slide upwards on guide rail 531. Simultaneously, slider 2 533 and slider 1 532... 2. While moving upward, the supporting mechanism 2 and the frame 51 are driven to move upward through the connecting frame 1 536 and the connecting frame 2 537. When the sliding part 2 533 is detected by the position monitoring sensor group 55, the sliding part 2 533 stops moving. At this time, the sliding part 1 532 stops at the position of the position monitoring sensor group 55 and is detected by it, thereby lifting the wafer body 2. During the lifting process, the buffer 1 542 and the buffer 2 543 are used to buffer the lifting and lowering of the sliding parts 1 532 and 2 533 too fast, which may cause the wafer body 2 to fall off or be damaged. Step 4: After drying, the wafer body 2 is lifted by the lifting device and loaded onto the inner wall of the support part 1 612 and support part 2 6133 inside the basket 611. The lower surface of the wafer body 2 is supported by the support mechanism 2 52. At this time, the drive cylinder 6135 is activated to drive the linkage shaft 6136 to slide on the inner wall of the sliding groove 6138, thereby driving the connecting rod 1 6137 to rotate. The connecting rod 1 6137 is connected to the rotating shaft 6131. ​​While the connecting rod 1 6137 rotates, it will synchronously drive the linkage shaft 6131 to rotate. The rotating shaft 6131 rotates, and the plate 6132 is installed on the outer wall of the rotating shaft 6131, so that the plate 6132 rotates synchronously. The rotating clamping assembly 613 consists of two sets, which are symmetrically installed in the housing 6134. With the cooperation of two drive cylinders 6135, linkage shaft 6136, sliding groove 6138 and connecting rod 6137, the two plates 6132 can be driven to rotate towards each other in the basket 611, that is, rotate towards the outer wall of the wafer body 2, so as to firmly clamp the wafer body 2. Step 5: The lifting device returns to its original position inside the drying device 4. At this time, the wafer body 2 is separated from the support part 524 of the lifting device under the restriction of the rotating clamping assembly 613 of the bearing device 6, that is, it does not descend synchronously with the lifting device. Step 6: When it is finally necessary to remove the multiple wafer bodies 2 inside the material basket 611, the cover plate 7 is connected to the material basket 611 by bolts. The multiple dried wafer bodies 2 inside the material basket 611 can be unloaded by removing the cover plate 7 from the material basket 611.

[0034] This device, by incorporating a detachable support device 6 and a lifting device, allows for the direct loading of the wafer body 2 onto the lifting device for drying. Simultaneously, the support device 6 returns to its position above the lifting device during drying. Once drying is complete, the lifting device lifts the wafer body 2 into the support device 6, which then clamps and limits its position. This is significantly more efficient than the existing method of first loading the wafer body 2 into a basket 611, then transferring it to the drying device 4 via a transfer device, and finally transferring the dried wafer body 2 to the drying device. Regarding the method of transferring the wafer body 2 to the basket 611, the existing technology first loads the undried wafer body 2 onto the basket 611, and then loads the dried wafer body 2 onto the basket 611 again. As a result, impurities on the basket 611 can cause cross-contamination with the dried wafer body 2. However, this device adopts a separation method, directly loading the wafer body 2 onto the lifting device for drying, and then loading the clean dried wafer body 2 onto the uncontaminated basket 611 for storage, thereby avoiding cross-contamination and making it convenient to use.

[0035] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A wafer drying apparatus with a buffer lifting structure, comprising a main body and a wafer body, characterized in that, The machine body has a processing area inside, and the processing area is equipped with a drying device, a lifting device and a supporting device. A drying apparatus for drying the wafer body, the drying apparatus including a tank and a liquid supply mechanism for supplying liquid into the tank; A lifting device is installed inside the tank to support and transport the wafer body into the drying device for drying, and to lift the dried wafer body onto the carrying device for storage. A support device, disposed above the lifting device, is used to store the dried wafer body. It includes a support mechanism and an electric slide rail for adjusting the position of the support mechanism. The support mechanism includes a basket, a support part disposed inside the basket, and a rotating clamping assembly rotatably connected to the basket. The rotating clamping assembly is used to support and limit the dried wafer body to the inside of the basket. A perforated plate is installed inside the side of the machine body near the basket. The rotating clamping assembly includes a rotating shaft rotatably connected inside the material basket, a plate mounted on the outer wall of the rotating shaft, a second support portion formed on the plate, a housing mounted on one side of the material basket, a drive cylinder mounted inside the housing, a linkage shaft mounted on the output end of the drive cylinder, a first connecting rod movably connected to the outside of the linkage shaft, and a sliding groove formed on the first connecting rod. The linkage shaft slides on the inner wall of the sliding groove, and the first connecting rod is connected to the rotating shaft. The rotating clamping assembly consists of two sets, symmetrically installed inside the housing. With the cooperation of the two driving cylinders, the linkage shaft, the sliding groove and the connecting rod, the two plates can be driven to rotate towards each other in the basket, that is, rotate towards the outer wall of the wafer body, thereby firmly clamping the wafer body.

2. The wafer drying apparatus with a buffer lifting structure according to claim 1, characterized in that, A cover plate is provided above the material basket, and the electric slide rail is installed on the side of the machine body near the material basket. The electric slide rail drives the material basket to move in the front-to-back direction inside the machine body.

3. The wafer drying apparatus with a buffer lifting structure according to claim 1, characterized in that, The lifting device includes a frame, a second support mechanism that moves vertically up and down along the interior of the frame, a drive mechanism for driving the second support mechanism to move up and down, a buffer assembly installed on the drive mechanism, and a monitoring assembly for monitoring the operation of the drive mechanism.

4. A wafer drying apparatus with a buffer lifting structure according to claim 3, characterized in that, The second support mechanism includes a support plate, support rods symmetrically mounted on the support plate, support members mounted on the support rods, and support portions formed on the support members in a linear array.

5. A wafer drying apparatus with a buffer lifting structure according to claim 4, characterized in that, The drive mechanism includes a guide rail installed inside the body, a first slider and a second slider slidably connected to the guide rail, a second connecting rod and a third connecting rod installed on one side of the first slider and the second slider, and a first connecting frame and a second connecting frame installed on one side of the first slider and the second slider. The first connecting frame is connected to the support plate, the second connecting frame is connected to the frame, and a connecting shaft is installed at the connection point of the second connecting rod and the third connecting rod.

6. A wafer drying apparatus with a buffer lifting structure according to claim 5, characterized in that, The buffer assembly includes a shaft mounted on one side of the guide rail, and buffer one and buffer two mounted on the outer wall of the shaft. The monitoring assembly includes a group of multiple position monitoring sensors mounted on one side of the guide rail.

7. A wafer drying apparatus with a buffer lifting structure according to claim 1, characterized in that, It also includes a control system, which is used to control and monitor the overall operation of the device.

8. A wafer drying method, comprising the wafer drying apparatus with a buffer lifting structure according to any one of claims 1-7, including the following steps: S1. Control the load-bearing device to move from the initial position to the position above the perforated plate; S2. Initially, the lifting device is located in the first predetermined position, and the wafer body is loaded onto the lifting device; S3. Set the wafer body drying time through the control system. The wafer body stays and dries inside the drying device to complete the wafer body drying. S5. After drying is completed, the lifting device rises to the second predetermined position and lifts the wafer body upwards, while driving the carrier device back to the initial position. At this time, the lifting device lifts the wafer body and moves it into the carrier device. S6. The carrier device clamps and limits the internal wafer body; S7. The lifting device descends back to the first predetermined position and removes the wafer body from inside the carrier device.

Images