An omnidirectional heat conduction plate structure

Abstract

The application discloses an omnidirectional uniform temperature plate structure, relates to the field of uniform temperature regulation, and comprises an upper plate body, a lower plate body, a plurality of transverse partitions and a plurality of longitudinal partitions which are arranged between the upper plate body and the lower plate body, the transverse partitions and the longitudinal partitions are arranged in a transverse-longitudinal staggered mode, the internal space between the upper plate body and the lower plate body is divided into a plurality of closed sub-cavities, a plurality of communication holes are formed in each transverse partition and each longitudinal partition, the communication holes enable adjacent sub-cavities to communicate with each other, and a thermosensitive element is arranged in each communication hole, passive bending deformation is realized through the thermal expansion difference of the three-layer structure of the thermosensitive element, the opening and closing of the communication holes are automatically adjusted according to the real-time temperature difference between the sub-cavities, condensate in a high-temperature area is preferentially supplemented, the working medium in the high-temperature area is effectively prevented from being dried, and the uniform temperature performance and reliability of the uniform temperature plate under the conditions of multiple heat sources and non-uniform heat load are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of temperature equalization and regulation technology, and in particular to an omnidirectional temperature equalization plate structure. Background Technology

[0002] Vapor chambers, as highly efficient two-phase heat transfer elements, are widely used in heat dissipation of high-power electronic devices, temperature control of precision instruments, high-efficiency cooking equipment, and medical thermotherapy devices. Their basic working principle is as follows: a capillary structure is set up in a sealed chamber and filled with a working medium. The medium absorbs heat and vaporizes at the evaporation end (the lower plate near the heat source). The vapor diffuses to the condensation end (the upper plate) where it releases heat and liquefies. The liquid working medium flows back to the evaporation end by capillary force, thus achieving rapid heat transfer and diffusion through this cycle.

[0003] However, with the increasing complexity of application scenarios, traditional vapor chambers face a key technical challenge: when there are multiple areas with significant temperature differences on the surface of the heat source (such as chips with different power consumption in a multi-chip module, local hot spots, etc.), traditional vapor chambers are prone to the phenomenon of working fluid drying out in high-temperature areas and condensate retention in low-temperature areas, resulting in a significant decrease in temperature uniformity performance.

[0004] In existing technologies, some attempts have been made to divide the cavity into multiple sub-cavities. However, these sub-cavities are usually either fixedly connected or completely isolated, making it impossible to dynamically adjust the working fluid distribution based on real-time temperature distribution. Some solutions use electrically controlled valves or piezoelectric drive components, but these introduce external energy and control circuits, increasing the complexity of the system and the risk of failure. Summary of the Invention

[0005] In view of this, the present invention provides an omnidirectional heat exchanger structure that can adaptively regulate the flow of working fluid between sub-cavities, solving the technical problems of uneven working fluid distribution and easy drying of high-temperature areas in existing heat exchangers under local hot spot conditions.

[0006] The following technical solution is adopted in this application:

[0007] An omnidirectional heat exchanger structure includes an upper plate and a lower plate that are sealed to each other, and multiple transverse partitions and multiple longitudinal partitions disposed between the upper and lower plates. The transverse and longitudinal partitions are arranged alternately to divide the internal space between the upper and lower plates into multiple enclosed sub-cavities. Each transverse and longitudinal partition has multiple vertical reflux grooves on its surface, which guide condensate to flow along the surface of the transverse or longitudinal partitions. Each transverse and longitudinal partition also has multiple connecting holes, which allow adjacent sub-cavities to communicate. The components are interconnected, and each connecting hole contains a thermistor. The thermistor is a three-layer composite structure. One end of the thermistor is fixed to the inner wall of the connecting hole, and the other end is a free end. The thermistor includes an active layer, a transition layer, and a passive layer in sequence. The coefficient of thermal expansion of the active layer is greater than that of the passive layer. The transition layer is disposed between the active layer and the passive layer. The thermistor can undergo directional bending deformation in response to the temperature difference of the sub-cavity it is in, so as to control the opening and closing of the connecting hole, so that the reflux liquid in the low-temperature sub-cavity corresponding to the heat source flows preferentially to the high-temperature sub-cavity.

[0008] Preferably, the ratio of the thermal expansion coefficients of the active layer to the passive layer is ≥5:1, and the thermal expansion coefficient of the active layer is 15×10⁻⁶. -6 / K-25×10 -6 / K, the coefficient of thermal expansion of the passive layer is 0.5×10. -6 / K-5×10 -6 / K; The active layer is made of copper, brass, or a manganese-nickel-copper alloy; the passive layer is made of Invar alloy or an iron-nickel alloy; the transition layer is made of nickel or chromium; the thickness of the transition layer is 0.01mm-0.02mm; and the thicknesses of the active layer and the passive layer are each independently 0.05mm-0.1mm.

[0009] Preferably, the connecting hole is an inclined connecting hole, with one end of the connecting hole being higher than the other in the vertical direction, and the angle between its axis and the horizontal plane being 15°-75°.

[0010] Preferably, the vertical return channel and the connecting hole intersect each other perpendicularly, so that the condensate in the vertical return channel can directly flow into the connecting hole.

[0011] Preferably, the transverse partitions and the longitudinal partitions are arranged perpendicularly to each other to form a grid-like support structure. The multiple sub-cavities are arranged in a matrix, and each sub-cavity is surrounded by adjacent transverse partitions, longitudinal partitions, and the upper and lower plates.

[0012] Preferably, each sub-cavity is further provided with multiple sub-horizontal partitions or sub-vertical partitions, which divide the sub-cavity into multiple sub-chambers. Each sub-horizontal partition or sub-vertical partition does not have a connecting hole, and each sub-horizontal partition or sub-vertical partition also has a vertical reflux groove on its surface.

[0013] Preferably, the cross-section of the connecting hole is circular, elliptical, or rectangular, the shape of the thermal element matches the cross-sectional shape of the connecting hole, and the cross-section of the vertical return channel is rectangular, V-shaped, or U-shaped.

[0014] Preferably, the inner surfaces of the upper plate and the lower plate are respectively provided with a first capillary layer and a second capillary layer, and the upper and lower ends of each vertical reflux groove are connected to the corresponding first capillary layer and second capillary layer. The first capillary layer and the second capillary layer are used to adsorb and transport the reflux liquid.

[0015] Preferably, the plurality of connecting holes are distributed at equal intervals along the length direction on the transverse and longitudinal partitions, and each connecting hole is located between two adjacent vertical return channels.

[0016] Preferably, the upper plate, lower plate, transverse partition, and longitudinal partition are all made of copper or copper alloy, and the inner surfaces of the vertical reflux groove and the connecting hole are roughened or have capillary grooves.

[0017] Preferably, the vacuum cavity of the omnidirectional heat exchanger is filled with a phase change working fluid, which is deionized water, ammonia, or acetone.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: First, this invention achieves passive bending deformation through the thermal expansion difference of the thermistor element, and automatically adjusts the opening and closing of the connecting hole according to the real-time temperature difference between the sub-cavities, so that the condensate in the high-temperature zone is preferentially replenished, effectively avoiding the working fluid in the high-temperature zone from drying out, and significantly improving the temperature uniformity performance and reliability of the heat spreader under multi-point heat source and non-uniform heat load conditions.

[0019] Secondly, the thermal element relies entirely on temperature changes to drive mechanical deformation, which is a passive control method. This avoids the additional energy, sensors, and control logic required by solutions such as electrically controlled valves and piezoelectric drives. The system has a simple structure, low cost, strong anti-interference ability, and good long-term stability.

[0020] Third, by dividing the cavity into multiple sub-cavities through horizontal and vertical partitions, and combining vertical reflux channels and a network of connecting holes, the working fluid migration and heat transfer in both horizontal and vertical directions are realized simultaneously. This effectively suppresses local hot spots and rapidly diffuses the heat from the high-temperature zone to the entire temperature distribution plate, achieving a synergistic dual circulation of "steam forward heat transfer and liquid reverse replenishment". Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of the omnidirectional heat exchanger structure of the present invention; Figure 2 This is a schematic diagram of the internal three-dimensional structure of the omnidirectional heat exchanger of the present invention; Figure 3 This is a top view of the internal structure of the omnidirectional heat exchanger of the present invention. Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure along line AA; Figure 5 This is a partial structural diagram of a transverse or longitudinal partition. Figure 6 for Figure 5 Enlarged structural diagram of section A in the middle; Figure 7 This is a schematic diagram of the structure of the thermistor within the connecting hole under steady-state conditions; Figure 8 This is a schematic diagram of the deformation of a thermistor within a connecting hole; Figure 9 This is a schematic diagram of the structure of the thermal element inside the inclined connecting hole; Figure 10 This is a schematic diagram illustrating the implementation of the present invention; Figure 11 This is a schematic diagram of another embodiment; In the figure: upper plate 1, lower plate 2, transverse partition 3, longitudinal partition 4, sub-cavity 5, vertical reflux groove 6, connecting hole 7, thermal element 8, active layer 80, transition layer 81, passive layer 82, first capillary layer 9, second capillary layer 10, capillary groove 11, sub-transverse partition 12 and sub-vertical partition 13. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0023] In the description of this invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] Example 1: See Figures 1-10 An omnidirectional heat exchanger structure includes an upper plate 1 and a lower plate 2 that are sealed together, and multiple transverse partitions 3 and multiple longitudinal partitions 4 disposed between the upper plate 1 and the lower plate 2. The transverse partitions 3 and the longitudinal partitions 4 are arranged alternately to divide the internal space between the upper plate 1 and the lower plate 2 into multiple closed sub-cavities 5. Each transverse partition 3 and each longitudinal partition 4 has multiple vertical reflux grooves 6 on its surface, which guide condensate to flow along the surface of the transverse partitions 3 or the longitudinal partitions 4. Each transverse partition 3 and each longitudinal partition 4 also has multiple connecting holes 7, which allow adjacent sub-cavities 5 to communicate with each other. The connection is made so that each connecting hole 7 is provided with a thermistor 8. The thermistor 8 is a three-layer composite structure. One end of the thermistor 8 is fixed to the inner wall of the connecting hole 7, and the other end is a free end. The thermistor 8 includes an active layer 80, a transition layer 81 and a passive layer 82 in sequence. The coefficient of thermal expansion of the active layer 80 is greater than that of the passive layer 82. The transition layer 81 is disposed between the active layer 80 and the passive layer 82. The thermistor 8 can undergo directional bending deformation in response to the temperature difference of the sub-cavity 5 to control the opening and closing of the connecting hole 7, so that the reflux liquid in the low-temperature sub-cavity 5 corresponding to the heat source flows preferentially to the high-temperature sub-cavity 5.

[0025] In some preferred embodiments, see Figure 7-9 The ratio of the thermal expansion coefficients of the active layer 80 to the passive layer 82 is ≥5:1, ensuring significant bending even at a small temperature difference of 5℃-10℃, and sensitively opening the connecting holes. The thermal expansion coefficient of the active layer 80 is 15×10⁻⁶. -6 / K-25×10 -6 / K, the coefficient of thermal expansion of the passive layer 82 is 0.5×10. -6 / K-5×10 -6 / K; The active layer 80 is made of copper, brass, or manganese-nickel-copper alloy; the passive layer 82 is made of Invar alloy or iron-nickel alloy; and the transition layer 81 is made of nickel or chromium. The transition layer 81 can effectively alleviate lattice mismatch and diffusion between dissimilar metals, prevent interlayer peeling, and reduce contact thermal resistance. The thickness of the transition layer 81 is 0.01mm-0.02mm. The thicknesses of the active layer 80 and the passive layer 82 are each independently 0.05mm-0.1mm. The thickness is controlled within 0.05mm-0.1mm, so that the thermistor 8 has both sufficient mechanical strength and low heat capacity, and a short response time. The specific implementation process is as follows: First, a passive layer 82 is prepared, then a transition layer 81 is electroplated or sputtered, and finally an active layer 80 is composited. The entire assembly is then photolithographically or laser-cut into a sheet-like element with a cross-sectional shape consistent with the connecting hole 7. A precision fixture is used to insert one end of the thermistor 8 into a pre-reserved slot or welding point on the inner wall of the connecting hole 7, and it is fixed using laser spot welding or brazing to ensure that the free end can be freely bent. Furthermore, at room temperature (25℃), the thermistor 8 remains essentially straight or slightly bent, and the connecting hole 7 is in a slightly closed or closed state.

[0026] The above technical solution solves the problems of insufficient bending deformation, slow response speed and low interface bonding strength of the thermal element 8 in a limited space, and can prevent interlayer cracking or fatigue failure after long-term thermal cycling.

[0027] In some preferred embodiments, see Figure 9 The connecting hole 7 is an inclined connecting hole 7, with one end of the connecting hole 7 being higher and the other lower in the vertical direction. The angle between its axis and the horizontal plane is 15°-75°, and the thermal element 8 is disposed in the connecting hole 7.

[0028] This technical solution solves the problem of condensate in the horizontal connecting hole 7 being stuck due to surface tension and unable to flow smoothly from the low temperature zone back to the high temperature zone, avoiding blockage of the liquid working fluid. It utilizes gravity to assist the directional flow of condensate: when the high temperature zone sub-cavity 5 is located below the low temperature zone sub-cavity 5, the condensate can automatically flow downwards into the high temperature zone along the inclined hole; if the high temperature zone is above, the vapor migrates upwards, and the liquid can still slide down by gravity. The included angle of 15°-75° takes into account both the smoothness of the flow and the effective space for the bending of the thermistor 8. If the included angle is too small (<15°), the driving force of the liquid flow is insufficient, and if it is too large (>75°), the bending of the thermistor element will easily touch the hole wall.

[0029] In some preferred embodiments, the vertical reflux channel 6 and the connecting hole 7 intersect each other perpendicularly. Due to the change in the cross-section of the flow channel at the perpendicular intersection, a local capillary suction force is generated, which helps to overcome air resistance and promotes the liquid to enter the connecting hole 7. In this embodiment, the cross-section of the connecting hole 7 is rectangular, so that the condensate in the vertical reflux channel 6 can directly flow into the connecting hole 7.

[0030] In some preferred embodiments, see Figure 10 The transverse partition 3 and the longitudinal partition 4 are arranged perpendicularly to each other to form a grid-like support structure. The grid-like structure formed by the transverse partition 3 and the longitudinal partition 4 serves as an internal support column, replacing the traditional point-like cylindrical support column, which significantly improves the overall mechanical strength and allows for the design of larger temperature distribution plates. The multiple sub-cavities 5 are arranged in a matrix. Each sub-cavity 5 is surrounded by adjacent transverse partitions 3, longitudinal partitions 4, and the upper plate 1 and lower plate 2. The matrix-like sub-cavities 5 facilitate heat source matching and can correspond to multi-chip modules (such as GPU+HBM array). Each chip corresponds to one or more sub-cavities 5, realizing precise local thermal management.

[0031] In some preferred embodiments, see Figure 11 Each sub-cavity 5 is further provided with multiple sub-horizontal partitions 12 or sub-vertical partitions 13. The sub-horizontal partitions 12 or sub-vertical partitions 13 divide the sub-cavity 5 into multiple sub-chambers. Each sub-horizontal partition 12 or sub-vertical partition 13 does not have a connecting hole 7. Each sub-horizontal partition 12 or sub-vertical partition 13 also has a vertical return groove 6 on its surface. The vertical return groove 6 is only for liquid circulation and has a supporting function. The upper and lower ends of the sub-horizontal partitions 12 and sub-vertical partitions 13 are respectively connected to the corresponding first capillary layer 9 and second capillary layer 10. It should be understood that the sub-cavity 5 can contain one or more sub-horizontal partitions 12 or sub-vertical partitions 13, or a combination of sub-horizontal partitions 12 and sub-vertical partitions 13. When the number of sub-cavities 5 is large, they may not be provided.

[0032] In some preferred embodiments, the cross-section of the connecting hole 7 is circular, elliptical, or rectangular, and the shape of the thermal element 8 matches the cross-sectional shape of the connecting hole 7. This solves the problem of fitting accuracy between the thermal element 8 and the connecting hole 7 under different manufacturing processes, as well as the balance between the capillary performance and processing cost of the vertical return groove 6. The cross-section of the vertical return groove 6 is rectangular, V-shaped, or U-shaped.

[0033] In some preferred embodiments, see Figure 4 The inner surfaces of the upper plate 1 and the lower plate 2 are respectively provided with a first capillary layer 9 and a second capillary layer 10, and the upper and lower ends of each vertical reflux groove 6 are connected to the corresponding first capillary layer 9 and second capillary layer 10. The first capillary layer 9 and the second capillary layer 10 are used to adsorb and transport the reflux liquid.

[0034] Specifically: the first capillary layer 9 and the second capillary layer 10 are formed by a sintering process. For example, the second capillary layer 10 is a copper powder capillary layer (thickness 0.3 mm, porosity 50%) sintered on the inner surface of the lower plate 2. Similarly, the first capillary layer 9 is a copper mesh capillary layer (0.1 mm) sintered on the inner surface of the upper plate 1.

[0035] The above technical solution solves the problem of continuous transmission of condensate from the surface of the horizontal baffle 3 or the vertical baffle 4 into the vertical flow channel and from the outlet of the vertical flow channel to the evaporation surface of the lower plate 2, avoiding "interruption" or local dry spots, and forming a continuous liquid transport network of "first capillary layer 9 → vertical flow channel 6 → second capillary layer 10", which significantly improves the working fluid circulation rate.

[0036] In some preferred embodiments, the plurality of connecting holes 7 are distributed at equal intervals along the length direction on the transverse partition 3 and the longitudinal partition 4, and each connecting hole 7 is located between two adjacent vertical return channels 6.

[0037] In some preferred embodiments, the upper plate 1, lower plate 2, transverse partition 3 and longitudinal partition 4 are all made of copper or copper alloy, and the inner surfaces of the vertical reflux groove 6 and the connecting hole 7 are roughened or have capillary grooves 11. The roughening treatment or capillary grooves 11 can solve the problems of insufficient overall thermal conductivity of the heat spreader and high flow resistance of liquid in the connecting hole 7.

[0038] In some preferred embodiments, the vacuum chamber of the omnidirectional heat exchanger is filled with a phase change medium, such as deionized water, ammonia, or acetone. The specific type of medium is determined based on the applicable environmental range or working environment.

[0039] Deionized water (operating temperature 30-100℃) is suitable for most electronic heat dissipation, with high latent heat and non-toxicity.

[0040] Ammonia (-30-70℃) is suitable for low-temperature environments or refrigeration scenarios, with high vapor pressure and low flow resistance.

[0041] Acetone (0-120℃) is suitable for applications where it does not corrode copper and requires extremely fast temperature response.

[0042] See appendix Figure 10 To more clearly explain and understand the principle and effect of this application, it is assumed that the heat sources in the eight regions (such as eight chips) have different powers, resulting in the temperatures of the eight sub-cavities 5 as shown in Table 1: Table 1 Temperature distribution data for different sub-cavities

[0043] Based on the temperature distribution data of different sub-cavities shown in Table 1 above, the temperature difference relationship is as follows: The temperature difference between B1 (85℃) and A1 (45℃) above it is 40℃; the temperature difference between B3 (78℃) and A3 (72℃) above it is 6℃. The temperature difference between B1 and B2 (63℃) on the right is 22℃; the temperature difference between B3 and B4 (48℃) on the right is 30℃.

[0044] Internal changes and working principle at different temperatures: Initial steady state (temperature distribution formed after heat source startup): The working fluid in each sub-cavity 5 circulates independently: the lower plate 2 absorbs heat - evaporates - the steam rises to the corresponding area of ​​the upper plate 1 → condenses → the condensate flows back to the lower plate 2 along the vertical return channel 6. Due to the temperature difference, the high temperature zone (B1, B3) evaporates strongly and the local pressure increases; the low temperature zone (A1, B4) evaporates weakly and the pressure is lower; the thermal element 8 in each connecting hole 7 senses the temperature of its own sub-cavity 5.

[0045] The opening and closing response of the connecting hole 7 (divided into two directions: transverse partition 3 and longitudinal partition 4): (1) The connecting hole 7 on the transverse partition 3 (connects the upper and lower sub-cavities 5) In this embodiment, the transverse partition 3 is located between the upper and lower rows, and the connecting holes 7 on it (it should be understood that the number of connecting holes 7 can be set according to the situation and the number is not limited) connect the adjacent sub-cavities 5 (such as A1-B1, A2-B2, A3-B3, A4-B4).

[0046] The states of each connecting hole 7 on the transverse partition 3 are as follows: A1-B1 connecting hole 7: Lower cavity B1 is at high temperature (85℃), upper cavity A1 is at low temperature (45℃) → Thermistor 8 expands more on the high temperature side (near B1) and bends towards the low temperature side (near A1) → Connecting hole opens; A2-B2 connecting hole 7: Temperature difference of 5℃ between B2 (63℃) and A2 (58℃) → Insufficient bending or only slightly open → Almost closed; A3-B3 connecting hole: Temperature difference of 6℃ between B3 (78℃) and A3 (72℃) → slightly open; A4-B4 connecting hole: The temperature difference between B4 (48℃) and A4 (52℃) is 4℃ (A4 is slightly higher) → Thermistor 8 is slightly bent towards B4, but in the opposite direction, so the actual opening is very small.

[0047] (2) The connecting hole 7 on the longitudinal partition 4 (connects the left and right adjacent sub-cavities 5 in the same row) The connecting holes 7 on the longitudinal partition 4 connect adjacent left and right sub-cavities 5 in the same row (such as B1-B2, B2-B3, B3-B4; and A1-A2, A2-A3, A3-A4): B1-B2: B1 (85℃) vs B2 (63℃) Temperature difference 22℃ → Connecting hole 7 opens (from B1 to B2); B2-B3: B2 (63℃) vs B3 (78℃) Temperature difference 15℃ → Thermistor 8 bends from the B3 side, opening the B3 → B2 direction (but B2 temperature is lower, the actual fluid can flow from B3 to B2); B3-B4: B3 (78℃) vs B4 (48℃) Temperature difference 30℃ → Connecting hole opens (from B3 to B4); The upper row of connecting holes has a small temperature difference (A1 45℃, A2 58℃, A3 72℃, A4 52℃). Except for the A3-A4 temperature difference of 20℃ (A3→A4), the others are basically closed or slightly open.

[0048] Principles of directional fluid flow and heat / mass exchange: When the thermistor 8 responds to the temperature difference and bends to open the corresponding connecting hole 7, the steam in the high-temperature sub-cavity 5 flows to the low-temperature sub-cavity 5 under pressure and condenses and releases heat. At the same time, the excess condensate in the low-temperature sub-cavity 5 flows back into the high-temperature sub-cavity 5 through the same connecting hole 7 under the action of capillary force and gravity, replenishing the working fluid lost by evaporation in the high-temperature zone. This forms a synergistic dual circulation of "steam forward heat transfer and liquid reverse replenishment", realizing the passive adaptive heat and mass management of the omnidirectional heat exchanger.

[0049] Specifically: Steam migration: High-pressure steam from B1 (85℃) enters A1 (45℃) upwards and B2 (63℃) to the right through the open connecting hole 7. The steam condenses on the upper plate 1 of A1 and B2, releasing latent heat and causing the temperature of A1 and B2 to rise. Steam from B3 (78°C) enters A3 (72°C) upwards through connecting hole 7 and enters B4 (48°C) to the right. A3 and B4 are replenished with heat. Steam from A3 (72°C) can also enter A4 (52°C) to the right through the open A3–A4 connecting hole 7, further dissipating heat.

[0050] Condensate recirculation (to replenish the high-temperature zone) The liquid working fluid generated by the condensation of the upper plate 1 in the low-temperature zone (such as A1, B4, A4) flows downward along its respective vertical return channel 6. When the condensate flows through the connecting hole 7 (which is in the open state), due to the gap formed by the bending of the thermistor 8, the liquid working fluid enters the connecting hole 7 laterally from the vertical return channel 6 under the action of capillary force (capillary groove 11) and gravity, and then flows into the high-temperature sub-cavity 5 opposite (such as B1 or B3).

[0051] Specific path: The condensate flowing back from A1 drips through the A1-B1 connecting hole 7 onto the lower plate 2 of B1, replenishing the liquid film in B1 that has been reduced due to violent evaporation.

[0052] The condensate flowing back from B4 enters the lower plate 2 of B3 through the B3–B4 connecting hole 7 (B4 side).

[0053] The condensate flowing back from A4 enters the lower plate 2 of A3 through the A3–A4 connecting hole 7 (although A3 is at a medium to high temperature, it also needs to be replenished appropriately).

[0054] Dynamic equilibrium process: For example, after B1 transfers heat to A1 and B2, its own temperature begins to decrease; the temperatures of A1 and B2 rise, the temperature difference decreases, and as the temperature difference decreases, the bending amplitude of the thermistor 8 decreases, the opening of the connecting hole 7 decreases, and the exchange flow of steam and liquid decreases. After a period of adaptive adjustment, the temperature of the eight sub-cavities 5 will converge to a narrower range (e.g., 60-68℃), and the maximum temperature difference will decrease from the initial 40℃ to less than 10℃.

[0055] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments that can be applied to other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. An omnidirectional heat exchanger structure, comprising an upper plate and a lower plate that are sealed together, characterized in that, It also includes multiple transverse baffles and multiple longitudinal baffles disposed between the upper plate and the lower plate. The transverse baffles and longitudinal baffles are arranged alternately to divide the internal space between the upper plate and the lower plate into multiple closed sub-cavities. Each transverse baffle and each longitudinal baffle has multiple vertical reflux grooves on its surface, which are used to guide the condensate to flow along the surface of the transverse baffle or the longitudinal baffle. Each transverse baffle and each longitudinal baffle also has multiple connecting holes, which allow adjacent sub-cavities to communicate with each other. Each connecting hole is equipped with a thermistor, which is a three-layer composite structure. The thermistor has one end fixed to the inner wall of the connecting hole and the other end free. The thermistor comprises an active layer, a transition layer, and a passive layer. The coefficient of thermal expansion of the active layer is greater than that of the passive layer. The transition layer is disposed between the active layer and the passive layer. The thermistor can undergo directional bending deformation in response to the temperature difference within its sub-cavity to control the opening and closing of the connecting hole, allowing the reflux fluid in the low-temperature sub-cavity corresponding to the heat source to preferentially flow to the high-temperature sub-cavity. The ratio of the coefficients of thermal expansion of the active layer to that of the passive layer is ≥5:1, and the coefficient of thermal expansion of the active layer is 15 × 10⁻⁶. -6 / K-25×10 -6 / K, the coefficient of thermal expansion of the passive layer is 0.5×10. -6 / K-5×10 -6 / K; The active layer is made of copper, brass, or manganese-nickel-copper alloy; the passive layer is made of Invar alloy or iron-nickel alloy; the transition layer is made of nickel or chromium; the thickness of the transition layer is 0.01mm-0.02mm; the thickness of the active layer and the passive layer are each independently 0.05mm-0.1mm; the inner surfaces of the upper plate and the lower plate are respectively provided with a first capillary layer and a second capillary layer, and the upper and lower ends of each vertical reflux trough are connected to the corresponding first capillary layer and second capillary layer. The first capillary layer and the second capillary layer are used to adsorb and transport the reflux liquid.

2. The omnidirectional temperature distribution plate structure according to claim 1, characterized in that, The connecting hole is an inclined connecting hole, with one end of the connecting hole being higher than the other in the vertical direction, and the angle between its axis and the horizontal plane is 15°-75°.

3. The omnidirectional temperature distribution plate structure according to claim 1, characterized in that, The vertical return channel and the connecting hole intersect perpendicularly, allowing the condensate in the vertical return channel to flow directly into the connecting hole.

4. The omnidirectional heat exchanger structure according to claim 1, characterized in that, The transverse partitions and the longitudinal partitions are arranged perpendicularly to each other to form a grid-like support structure. Multiple sub-cavities are arranged in a matrix. Each sub-cavity is surrounded by adjacent transverse partitions, longitudinal partitions, and the upper and lower plates. Each sub-cavity is also provided with multiple sub-transverse partitions or sub-vertical partitions. The sub-transverse partitions or sub-vertical partitions divide the sub-cavity into multiple sub-chambers. Each sub-transverse partition or sub-vertical partition does not have connecting holes, and each sub-transverse partition or sub-vertical partition also has vertical reflux grooves on its surface.

5. The omnidirectional temperature distribution plate structure according to claim 1, characterized in that, The cross-section of the connecting hole is circular, elliptical, or rectangular, and the shape of the thermal element matches the cross-sectional shape of the connecting hole. The cross-section of the vertical return channel is rectangular, V-shaped, or U-shaped.

6. The omnidirectional temperature distribution plate structure according to claim 1, characterized in that, Multiple connecting holes are evenly distributed along the length of the transverse and longitudinal partitions, and each connecting hole is located between two adjacent vertical return channels.

7. The omnidirectional heat exchanger structure according to claim 1, characterized in that, The upper plate, lower plate, transverse partition, and longitudinal partition are all made of copper or copper alloy, and the inner surfaces of the vertical reflux groove and the connecting hole are roughened or have capillary grooves.

8. The omnidirectional heat exchanger structure according to claim 1, characterized in that, The vacuum chamber of the omnidirectional heat exchanger is filled with a phase change working fluid, which is deionized water, ammonia, or acetone.

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