A PCB board warping time sequence control method and system based on scene matching and material state grading

Abstract

This invention discloses a PCB board warpage timing control method based on scenario matching and material state classification, comprising the following steps: constructing a full-attribute database of the substrate board, which includes basic information, state attributes, and initial warpage data; establishing an application scenario-warpage impact model to obtain the quantitative relationship between initial warpage, application scenario, and final warpage; verifying the effectiveness of the pressing and baking process and optimizing parameters; modeling the timeliness and rebound law after pressing and baking; integrating the above data and models, and implementing dynamic adjustment strategies in the production planning and execution stages. This invention's PCB board warpage timing control method based on scenario matching and material state classification significantly improves product reliability by controlling the entire PCB board warpage process through measures such as matching customer scenarios, differentiated management of material states, precise implementation of shaping processes, and systematic management of rebound risks. This invention also provides a PCB board warpage timing control system based on scenario matching and material state classification.

Images