Method, apparatus and medium for gas flow calibration in semiconductor processing equipment

Abstract

The application discloses a kind of gas flow regulation method, equipment and medium in semiconductor processing equipment, it is related to flow control technical field, including, to gas supply passage is segmented and arranged, segmented gas supply passage is generated and vacuum leak detection is executed, leakage position is obtained, leakage position is connected in series along gas supply direction, and leakage path table is generated;According to leakage path table, drive regulation gas is sequentially switched between segmented gas supply passage, and the front section of segmented gas supply passage is closed after each switching, and the rear section of segmented gas supply passage is continued, and the gas guide change before and after switching is arranged as segmented difference table;Leakage influence section and gas guide change abnormal section are screened from segmented difference table, and leakage influence section and gas guide change abnormal section are cross-locked, and regulation position table is generated.The application is associated with locking leakage influence section and gas guide change abnormal section, so that the whole gas flow regulation process has better continuity, accuracy and execution stability.

Description

Technical Field

[0001] This invention relates to the field of flow control technology, and in particular to a method, device and medium for adjusting gas flow in a semiconductor processing device. Background Technology

[0002] As semiconductor manufacturing technology continues to evolve towards higher precision, higher integration, and higher stability, the requirements for gas supply control accuracy, gas path cleanliness, and gas delivery continuity in semiconductor processing equipment are constantly increasing. Around equipment installation, commissioning, maintenance, calibration, and process operation assurance, gas flow rate calibration in semiconductor processing equipment has gradually become a fundamental step affecting thin film deposition, etching reactions, chamber pressure control, and process repeatability. Existing related technologies typically combine gas supply path division, vacuum leak detection, pressure gauge connection verification, flow controller adjustment, and process gas continuity verification to verify and adjust the equipment's gas supply status, ensuring the matching and stability between the gas flow rate calibration results and process execution conditions in semiconductor processing equipment.

[0003] However, existing gas flow calibration technologies in semiconductor processing equipment are mostly based on decentralized detection and local correction. They often lack a unified judgment mechanism for the correlation between leakage path, gas guide changes and calibration position. This makes it difficult to accurately correspond the leakage impact range and abnormal gas guide position, which can easily cause calibration position identification errors and thus affect the stability of subsequent valve opening and closing rearrangement, connection correction and overall flow calibration results. Summary of the Invention

[0004] In view of the aforementioned existing problems, the present invention is proposed.

[0005] Therefore, the present invention provides a gas flow calibration method in a semiconductor processing device to solve the problem that it is difficult to accurately correspond between the leakage impact range and the abnormal gas conduction location.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] In a first aspect, the present invention provides a method for adjusting gas flow rate in a semiconductor processing apparatus, comprising,

[0008] The gas supply path is segmented and organized to generate segmented gas supply paths and vacuum leak detection is performed to obtain the leak location. The leak locations are connected in series along the gas supply direction to generate a leak path table. The gas supply path is a continuous gas delivery path in the semiconductor processing equipment used to deliver calibration gas and process gas. The gas supply direction is the direction in which calibration gas and process gas are continuously delivered from front to back in the gas supply path.

[0009] According to the leakage path table, the calibration gas is driven to switch between the segmented gas supply channels one by one. After each switch, the front section of the segmented gas supply channel is shut off and the rear section of the segmented gas supply channel is resumed. The changes in gas delivery before and after the switch are compiled into a segmented difference table.

[0010] The leakage-affected sections and abnormal gas flow sections are screened out from the segment difference table, and the leakage-affected sections and abnormal gas flow sections are cross-locked to generate an adjustment position table;

[0011] The valve opening and closing sequence of the segmented gas supply passages is rearranged according to the calibration position table. The sealing parts, pressure gauge connection parts and flow controller adjustment parts of the segmented gas supply passages are corrected. The process gas flow calibration is then performed on the rearranged segmented gas supply passages to generate flow calibration results.

[0012] In a preferred embodiment of the gas flow rate adjustment method in the semiconductor processing equipment of the present invention, the method for obtaining the leakage location specifically involves...

[0013] Divide the gas supply path into sections where the connectivity changes and locate the segment positions;

[0014] The continuous gas delivery path between two adjacent segment locations is defined as the segmented gas supply path, and the segmented gas supply paths are arranged according to the gas supply direction.

[0015] In the segmented gas supply channels after the layout is completed, the leak detection state is switched segment by segment, and vacuum leak detection is performed on the segmented gas supply channels in the leak detection state to determine the segmented leak detection location.

[0016] The leak detection points are connected in series according to the gas supply direction, and the leak detection points in adjacent gas supply channels are sequentially verified to obtain the leak location.

[0017] As a preferred embodiment of the gas flow rate adjustment method in the semiconductor processing equipment of the present invention, wherein: the gas flow rate changes before and after the switching are arranged into a segmented difference table, specifically,

[0018] Arrange the leak locations in the leak path table in the switching sequence according to the gas supply direction, and determine the switching segment gas supply path, the front segment gas supply path and the rear segment gas supply path according to the switching sequence.

[0019] Introduce calibration gas into the switching section gas supply passage, and after the calibration gas enters the switching section gas supply passage, open the subsequent section gas supply passage to form a switching state from the switching section gas supply passage to the subsequent section gas supply passage.

[0020] To shut down the front section gas supply path during the switching state while keeping the rear section gas supply path open, the gas guiding changes of the front section gas supply path, the switching section gas supply path, and the rear section gas supply path are arranged in sequence according to the switching order.

[0021] Based on the changes in air delivery after the arrangement, distinguish between the air delivery state before and after the switch, and register the air delivery state before and after the switch into the corresponding segmented air supply path to generate a segmented difference table.

[0022] In a preferred embodiment of the gas flow rate adjustment method in the semiconductor processing equipment of the present invention, the switching state from the initial segmented gas supply path to the subsequent segmented gas supply path specifically refers to:

[0023] Keep the front-end segmented gas supply passage closed, and introduce the calibration gas into the switching segmented gas supply passage;

[0024] After the calibration gas enters the gas supply passage of the switching section, the ventilation path of the gas supply passage of the switching section is kept open.

[0025] The ventilation path is opened during the period when the ventilation path is kept open during the switching of the segmented gas supply path.

[0026] The switching process is carried out in parallel with the front segment gas supply passage closed, the switching segment gas supply passage being introduced, and the rear segment gas supply passage being opened, forming a switching state from the switching segment gas supply passage to the rear segment gas supply passage.

[0027] In a preferred embodiment of the gas flow rate calibration method in the semiconductor processing equipment of the present invention, the generation of the calibration position table specifically involves...

[0028] Identify the continuously occurring leakage-affected sections in both the pre- and post-switching gas flow states.

[0029] The affected sections of the continuous leaks are extended to the previous section of the gas supply path and the next section of the gas supply path, respectively.

[0030] The gas supply path before and after the switching of the previous segment gas supply path are compared and judged item by item. Based on the judgment result of abnormal gas supply changes, the abnormal gas supply path is found in the previous segment gas supply path and the next segment gas supply path.

[0031] Place the leak-affected section and the abnormal gas flow section on the same segmented gas supply path for same-segment alignment. Move the sections that have not been aligned on the same segmented gas supply path to the previous and next segmented gas supply paths for adjacent-segment alignment to obtain the same-segment alignment position and adjacent-segment alignment position.

[0032] Connect the alignment positions of the same segment and the alignment positions of adjacent segments according to the gas supply direction to form the adjustment positions, and generate the adjustment position table.

[0033] As a preferred embodiment of the gas flow rate calibration method in the semiconductor processing equipment of the present invention, the same segment alignment is to place the leakage-affected segment and the abnormal gas flow change segment in the same segment position in the same segmented gas supply path for corresponding verification.

[0034] The adjacent segment alignment involves moving the segments that have not been aligned on the same segmented gas supply path to the corresponding segments in the preceding and following segmented gas supply paths for corresponding verification.

[0035] In a preferred embodiment of the gas flow rate adjustment method in the semiconductor processing equipment of the present invention, the sealing portion, pressure gauge connection portion, and flow controller adjustment portion of the modified segmented gas supply path are specifically:

[0036] Arrange the adjustment positions in the adjustment position table in the opening and closing sequence according to the gas supply direction, and rearrange the opening and closing sequence of the valves in the segmented gas supply passage according to the opening and closing sequence.

[0037] Close the valves on the segmented air supply passage in front of the adjustment position according to the rearranged valve opening and closing sequence, and separate the segmented air supply passage where the adjustment position is located from the adjacent segmented air supply passages to form an independent air supply state for the segmented air supply passage where the adjustment position is located.

[0038] In independent ventilation mode, loosen the sealing part connector corresponding to the adjustment position, remove the seal in the sealing part and install a new seal, then tighten the sealing part connector to complete the sealing part reinstallation.

[0039] Disassemble the pressure gauge connection corresponding to the calibration position, adjust the pressure gauge connection direction and connection tightness, and complete the correction of the pressure gauge connection.

[0040] Adjust the opening and ventilation relationships of the flow controller adjustment parts corresponding to the calibration position, and complete the correction of the sealing parts, pressure gauge connection parts and flow controller adjustment parts of the segmented air supply passage.

[0041] As a preferred embodiment of the gas flow rate calibration method in the semiconductor processing equipment of the present invention, the process gas flow calibration is a calibration action in which process gas is introduced into the rearranged segmented gas supply path, and the gas supply sequence and gas supply state of the process gas are calibrated according to the continuous delivery state of the segmented gas supply path.

[0042] In a second aspect, the present invention provides a computer device including a memory and a processor, wherein the memory stores a computer program, wherein the computer program, when executed by the processor, implements any step of the gas flow calibration method in the semiconductor processing device as described in the first aspect of the present invention.

[0043] Thirdly, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, it implements any step of the gas flow rate calibration method in the semiconductor processing apparatus as described in the first aspect of the present invention.

[0044] The beneficial effects of this invention are as follows: by associating and locking the leakage-affected section with the abnormal gas flow section, a more consistent calibration position determination result can be formed in complex gas supply channels, making the abnormal location in the gas flow calibration process clearer, the calibration direction more focused, and the subsequent correction basis more stable; the calibration position table formed thereby can not only improve the systematicness and verifiability of gas supply channel abnormal identification, but also enhance the connection between valve body opening and closing rearrangement, sealing part correction, pressure gauge connection part correction, and flow controller adjustment part correction, so that the entire gas flow calibration process has better continuity, accuracy and execution stability. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a flowchart of a gas flow rate calibration method in a semiconductor processing device.

[0047] Figure 2 This is a flowchart for the segmented switching of gases.

[0048] Figure 3 This is a flowchart for adjusting the position cross-locking.

[0049] Figure 4 The flowchart for traffic tuning is as follows. Detailed Implementation

[0050] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0051] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0052] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0053] Reference Figures 1-4 As one embodiment of the present invention, this embodiment provides a gas flow rate adjustment method in a semiconductor processing device, comprising the following steps:

[0054] S1. The gas supply path is segmented and organized to generate segmented gas supply paths and perform vacuum leak detection to obtain the leak location. The leak locations are connected in series along the gas supply direction to generate a leak path table. The gas supply path is a continuous gas delivery path used to transport calibration gas and process gas in semiconductor processing equipment. The gas supply direction is the direction in which calibration gas and process gas are continuously transported from front to back in the gas supply path.

[0055] S1.1. Divide the gas supply path into sections where the connectivity changes, and locate the segment positions. Specifically,

[0056] Based on the gas supply direction, check the gas delivery relationship segment by segment along the gas supply path. Mark the positions that can cause the gas delivery relationship to switch, split, merge, disconnect or transfer as candidate segment positions. Candidate segment positions include the connection position where the valve body is located, the connection position where the sealing part is located, the connection position of the pressure gauge, the inlet connection position and outlet connection position of the flow controller adjustment part, as well as the transfer position in the gas supply path from one continuous gas delivery path to another.

[0057] The connectivity between adjacent candidate segment locations is compared. If the connectivity remains unchanged, no further segmentation is made. If the connectivity changes from open to closed, from closed to open, from a single path to a branch path, from a branch path to a converging path, or from a straight connection to a connection affected by valve opening and closing, the corresponding change boundary is determined as the segment location. When the same physical connection area corresponds to multiple change boundaries, the connection boundary where the connectivity change occurs first is taken as the segment location, and the subsequent connection boundary is incorporated into the next continuous gas delivery path to avoid duplicate segmentation of the same connection area. Locations where no connectivity change is found remain in the original continuous gas delivery path, thus completing the segment location.

[0058] S1.2. The continuous gas transport path between two adjacent segment locations is determined as the segmented gas supply path, and the segmented gas supply paths are arranged according to the gas supply direction, specifically as follows:

[0059] Based on the gas supply direction, read the positions of two adjacent segments, take the position of the previous segment as the starting boundary of the segmented gas supply path, and take the position of the next segment as the ending boundary of the segmented gas supply path; the position of the previous segment is located upstream of the current gas delivery path along the gas supply direction, and is used as the segment position of the starting boundary of the segmented gas supply path; the position of the next segment is located downstream of the current gas delivery path along the gas supply direction, and is used as the segment position of the ending boundary of the segmented gas supply path.

[0060] When there is continuous connection between the current segment position and the next segment position, and no other segment positions exist, the gas delivery path between the previous segment position and the next segment position is determined as a segmented gas supply path. Other segment positions are those located between the current segment position and the next segment position that have been marked due to changes in the connection relationship. When there is no continuous connection between the current segment position and the next segment position, the gas delivery path between the previous segment position and the next segment position is not determined as a segmented gas supply path, and the connection interruption position is used as the new segment position to re-cut the path. When there are other segment positions between the current segment position and the next segment position, the gas delivery path is re-cut according to the other segment positions, and the corresponding segmented gas supply paths are determined respectively.

[0061] After all the segmented gas supply paths are determined, starting from the beginning of the gas supply path where the calibration gas enters, the connection relationship of each segmented gas supply path is registered one by one according to the forward continuous delivery direction of the calibration gas and process gas in the gas supply path. When the starting segment position of the next segmented gas supply path is consistent with the ending segment position of the previous segmented gas supply path, it is determined to be a sequential arrangement. When there are branch paths, the segmented gas supply paths that maintain the main connection relationship along the forward continuous delivery direction are listed as the current priority, and the segmented gas supply paths that deviate from the main connection relationship are listed next to the corresponding priority, thus finally forming segmented gas supply paths arranged according to the gas supply direction.

[0062] S1.3. In the segmented gas supply path after arrangement, switch the leak detection state segment by segment, and perform vacuum leak detection on the segmented gas supply path in the leak detection state to determine the segmented leak detection location, specifically,

[0063] Leak detection status is switched sequentially along the already arranged segmented gas supply paths. Only one segmented gas supply path is allowed to enter the leak detection state at a time, while the other segmented gas supply paths remain isolated. The switching method corresponding to the leak detection state is to open the ventilation paths related to leak detection at both ends of the current segmented gas supply path, and close the non-leak detection ventilation paths in the front segmented gas supply path, the rear segmented gas supply path, and the side branch segmented gas supply path adjacent to the current segmented gas supply path, so that the vacuum effect range is limited to the current segmented gas supply path.

[0064] When vacuum leak detection is carried out, the leak response of each valve body connection, sealing part connection, pressure gauge connection, inlet connection of flow controller adjustment part, outlet connection of flow controller adjustment part, and pipeline transition point in the current segmented air supply path is checked. If the leak response remains stable and no leak indication appears, the current detection position is not recorded as the segmented leak detection position. If a leak indication appears in the leak response, the corresponding position is determined as the segmented leak detection position.

[0065] When there are multiple leak indications in the same segmented gas supply path, the multiple segmented leak detection locations are registered according to the gas supply direction. When no leak indication appears, the current segmented gas supply path is recorded as a no-segmented leak detection location.

[0066] S1.4 Connect the segmented leak detection points in series according to the gas supply direction, and verify the segmented leak detection points in adjacent gas supply channels to obtain the leak location, specifically,

[0067] According to the gas supply direction, the segmented leak detection positions in each segmented gas supply path are sorted sequentially. The leak detection position at the end of the previous segmented gas supply path is connected and verified with the leak detection position at the beginning of the next segmented gas supply path. During the connection verification, it is checked whether there is an actual gas transmission connection between the end of the previous segmented gas supply path and the beginning of the next segmented gas supply path. If there is an actual gas transmission connection and the leak detection positions on both sides are located on adjacent sides of the connection boundary, the leak detection positions on both sides are identified as sequentially connected and registered in series. If there is no actual gas transmission connection between the leak detection positions on both sides, or if the leak detection positions on both sides are located in adjacent segmented gas supply paths but there is an undetected leak connection in between, they are not identified as sequentially connected, and the leak detection positions on both sides retain their original registered positions.

[0068] After all sequential relationships are verified, the segmented leak detection locations that have formed sequential relationships are merged and organized into continuous leak locations, while the segmented leak detection locations that have not formed sequential relationships are retained separately, and finally the leak locations are obtained.

[0069] S1.5 Connect the leak locations that are sequentially connected along the gas supply direction to form a continuous leak path. Write the continuous leak path into the corresponding path sequence and position correspondence to form a leak path table.

[0070] The leakage path table is a tabular record that records the location of the leak, the segment of the gas supply path where the leak is located, the sequential relationship between the leak locations, and the arrangement of continuous leakage paths according to the gas supply direction.

[0071] S2. Drive the adjustment gas according to the leakage path table to switch between the segmented gas supply channels one by one, and after each switch, shut off the front section of the segmented gas supply channel and resume the back section of the segmented gas supply channel. Arrange the changes in gas delivery before and after the switch into a segmented difference table.

[0072] S2.1 Arrange the leak locations in the leak path table according to the gas supply direction in a switching sequence, and determine the switching segment gas supply path, the front segment gas supply path, and the rear segment gas supply path according to the switching sequence, specifically as follows:

[0073] Based on the path order and position correspondence of each leak location in the leak path table, leak locations located on the front side are arranged first and leak locations located on the back side are arranged last according to the gas supply direction. When two leak locations are on the same continuous leak path, the order of arrangement from upstream leak location to downstream leak location is used as the switching order.

[0074] When two leak locations are located on different continuous leak paths, the leak location in the continuous leak path that connects to the end of the calibration gas entry point is listed first, and the leak location in the continuous leak path that connects to the end of the calibration gas entry point is listed second.

[0075] After the switching sequence is determined, the leakage location corresponding to the current position is read one by one. The segmented gas supply path that carries the current leakage location is determined as the switching segmented gas supply path. The segmented gas supply path corresponding to the leakage location that is directly adjacent to the current leakage location and is located in the previous position in the switching sequence is determined as the front segmented gas supply path. The segmented gas supply path corresponding to the leakage location that is directly adjacent to the current leakage location and is located in the next position in the switching sequence is determined as the rear segmented gas supply path.

[0076] When the current leak location is at the beginning of the switching sequence, no separate front-end segmented gas supply path is set up; only the switching segmented gas supply path and the rear segmented gas supply path are determined. When the current leak location is at the end of the switching sequence, no separate rear segmented gas supply path is set up; only the front-end segmented gas supply path and the switching segmented gas supply path are determined.

[0077] S2.2. Introduce calibration gas into the switching section gas supply passage, and after the calibration gas enters the switching section gas supply passage, open the subsequent section gas supply passage, forming a switching state from the switching section gas supply passage to the subsequent section gas supply passage. Specifically,

[0078] S2.2.1 Keep the front-end segmented gas supply passage closed, and introduce the calibration gas into the switching segmented gas supply passage; after the calibration gas enters the switching segmented gas supply passage, keep the ventilation path of the switching segmented gas supply passage open; while the switching segmented gas supply passage keeps the ventilation path open, open the ventilation path of the rear-end segmented gas supply passage.

[0079] S2.2.2 The switching process is carried out in parallel with the front-end segmented gas supply passage closed, the switching segmented gas supply passage being introduced, and the rear-end segmented gas supply passage open, forming a switching state from the switching segmented gas supply passage to the rear-end segmented gas supply passage. Specifically,

[0080] After keeping the valve corresponding to the front segment gas supply passage in the closed position, the forward gas delivery connection between the front segment gas supply passage and the switching segment gas supply passage is cut off, and the adjustment gas only enters along the switching segment gas supply passage. After a continuous gas guiding passage is formed inside the switching segment gas supply passage, the valve corresponding to the rear segment gas supply passage is opened, so that a backward connection is formed between the end of the switching segment gas supply passage and the beginning of the rear segment gas supply passage. At this time, if the front segment gas supply passage does not guide gas, the switching segment gas supply passage guides gas continuously, and the rear segment gas supply passage has been connected to guide gas, and all three states are met simultaneously, the process of the adjustment gas transitioning from the switching segment gas supply passage to the rear segment gas supply passage is considered as the switching has started.

[0081] If the front segment gas supply path resumes gas flow, or the rear segment gas supply path fails to continue gas flow, it is not considered that a switching state has been established. The front segment remains closed, and the gas connection between the switching segment gas supply path and the rear segment gas supply path is adjusted until the front segment has no gas flow, the switching segment has gas flow, and the rear segment has gas flow simultaneously. Only then is the switching state from the switching segment gas supply path to the rear segment gas supply path determined.

[0082] S2.3. For the switching state, shut down the front section gas supply path while keeping the rear section gas supply path open. Arrange the gas guiding changes of the front section gas supply path, the switching section gas supply path, and the rear section gas supply path in sequence according to the switching order, specifically as follows:

[0083] Once the switching state is established, the front-end segmented gas supply passage is kept in a closed state, preventing the calibration gas from flowing back to the front-end segmented gas supply passage, while the rear-end segmented gas supply passage remains in a continuous gas guiding state.

[0084] The changes in gas supply were checked one by one for the front-end segmented gas supply path, the switching segmented gas supply path, and the rear-end segmented gas supply path. The front-end segmented gas supply path was recorded as changing from having gas supply to having no gas supply. The switching segmented gas supply path was recorded as continuously introducing calibration gas and maintaining gas supply continuity. The rear-end segmented gas supply path was recorded as changing from having no gas supply to having gas supply connected.

[0085] After the gas flow changes of the three segmented gas supply paths are verified, the first segmented gas supply path is placed first, the switching segmented gas supply path is placed in the middle, and the last segmented gas supply path is placed last, according to the switching order. The corresponding gas flow changes are written into their respective order. If the first segmented gas supply path is not closed, the last segmented gas supply path is not resumed, or the gas flow of the switching segmented gas supply path is interrupted, the corresponding gas flow changes are not included in the current arrangement. Instead, the current switching status is maintained and the verification continues until the first segment is closed, the switching segment is resumed, and the last segment is resumed, and the sequential arrangement is completed.

[0086] S2.4. Based on the changes in air delivery after the arrangement, distinguish between the air delivery state before and after the switch, and register the air delivery state before and after the switch in the corresponding segmented air supply path to generate a segmented difference table. Specifically,

[0087] In the completed gas guiding changes, when the front segment gas supply passage is still connected to the forward gas delivery before the switching is launched, the switching segment gas supply passage is responsible for the current gas guiding, and the rear segment gas supply passage has not yet been connected to guide gas, the corresponding gas guiding performance is identified as the gas guiding state before the switching.

[0088] When the front-end segmented gas supply path has been shut down, the switching segmented gas supply path continues to supply gas, and the rear-end segmented gas supply path has been connected to supply gas, the corresponding gas supply behavior is identified as the gas supply status after the switching.

[0089] After confirming the pre-switch and post-switch air guiding states of the front-end segmented air supply path, the switching segmented air supply path, and the rear-end segmented air supply path, write the switching sequence, segmented air supply path name, pre-switch air guiding state, and post-switch air guiding state into the same corresponding position to form a one-to-one correspondence between the front and rear states in the difference registration result. Segmented air supply paths whose front and rear states can correspond are directly written in, while segmented air supply paths whose front and rear states cannot correspond are marked separately with the missing state position. All difference registration results are arranged continuously in the switching sequence to form a segmented difference table.

[0090] The segmented difference table is a tabular record that records the changes in the air supply state before and after the switching of the front segmented air supply path, the switching segmented air supply path, and the rear segmented air supply path in the order of switching.

[0091] S3. Screen out the leakage-affected sections and abnormal gas flow sections from the segment difference table, and cross-lock the leakage-affected sections and abnormal gas flow sections to generate an adjustment position table.

[0092] S3.1 Identify the continuously occurring leakage-affected sections in both the pre- and post-switching gas guiding states. Specifically,

[0093] Following the switching sequence, unfold each segmented gas supply path in the segmented difference table sequentially. For each segmented gas supply path, check the pre-switching and post-switching gas supply states side-by-side. If both the pre-switching and post-switching gas supply states simultaneously exhibit gas supply obstruction, gas supply interruption, delayed gas supply, or deviation of the gas supply direction from the original sequential relationship, the corresponding segmented gas supply path is identified as a leakage-affected segment. A leakage-affected segment is a segmented gas supply path in which the same type of gas supply anomaly occurs in both the pre-switching and post-switching gas supply states, and is used to characterize the continuous impact of the leak location on the gas supply continuity of the segmented gas supply path.

[0094] If the same segmented gas supply path only exhibits an abnormality in the gas delivery state before the switchover and the gas delivery state returns to normal after the switchover, or only exhibits an abnormality in the gas delivery state after the switchover while the gas delivery state remained normal before the switchover, the corresponding segmented gas supply path will not be directly identified as a leakage-affected segment, but will be reserved as a location to be further verified. If the previous segmented gas supply path has already been identified as a leakage-affected segment and the subsequent segmented gas supply path continues to exhibit the same type of gas delivery abnormality in both the gas delivery state before and after the switchover, the previous segmented gas supply path and the subsequent segmented gas supply path will be combined and regarded as a continuously occurring leakage-affected segment, until the subsequent segmented gas supply path no longer exhibits the same type of gas delivery abnormality.

[0095] Among them, the location to be checked is the gas guiding status before and after the switching of the next segmented gas supply path. After checking the gas guiding status in parallel, it is compared with the gas guiding abnormality type of the next segmented gas supply path. If the gas guiding abnormality type is continuous and consistent, it is included in the continuously occurring leakage-affected section. If the gas guiding abnormality type is not continuous and consistent, it is not identified as a leakage-affected section.

[0096] S3.2. Extend the affected sections of the continuously occurring leaks to the preceding and following gas supply paths respectively; compare and determine the pre-switch gas guiding state and post-switch gas guiding state of the preceding and following gas supply paths item by item, and identify the abnormal gas guiding sections in the preceding and following gas supply paths based on the abnormal gas guiding change determination results. Specifically,

[0097] The initial segment of the gas supply path of the continuously occurring leakage-affected section is determined as the forward extension position, and the final segment of the gas supply path of the continuously occurring leakage-affected section is determined as the backward extension position. The segment of the gas supply path directly connected to the forward extension position and the segment of the gas supply path directly connected to the backward extension position are selected as the objects for judging abnormal changes in gas conduction.

[0098] The gas supply path before and after the switching of the corresponding segment gas supply path is compared item by item. If the gas supply path changes from continuous to discontinuous in terms of continuity, shifts back and forth in the gas supply connection position, expands to the adjacent segment gas supply path in the gas supply interruption position, or is inconsistent with the switching sequence in terms of gas supply restoration sequence, the corresponding segment gas supply path is determined to be an abnormal gas supply path.

[0099] After comparing the gas guiding state before and after the switching of the corresponding segmented gas supply path item by item, the corresponding segmented gas supply path is determined to be an abnormal gas guiding section only when at least one of the following situations occurs: the gas guiding changes from sequential to non-sequential; the gas guiding connection position shifts forward or backward; the gas guiding interruption position extends to the adjacent segmented gas supply path; or the gas guiding restoration order is inconsistent with the switching order. If none of the above situations occur, the corresponding segmented gas supply path is not determined to be an abnormal gas guiding section, and only the adjacency relationship between the previous segmented gas supply path, the next segmented gas supply path and the continuously occurring leakage-affected sections is retained.

[0100] Among them, the first segment gas supply passage is a segment gas supply passage that is directly adjacent to the starting segment position of the forward extension position along the gas supply direction and is located on the upstream side of the continuously appearing leakage-affected section; the upstream segment gas supply passage is a segment gas supply passage that is located in the previous sequence position of the current segment gas supply passage after the segment gas supply passages are arranged according to the gas supply direction, and the ending segment position and the starting segment position of the current segment gas supply passage meet the connection verification conditions.

[0101] The next segmented gas supply passage is a segmented gas supply passage that is directly adjacent to the end segment of the backward extension along the gas supply direction and is located on the downstream side of the continuously occurring leakage-affected segment; the downstream segmented gas supply passage is a segmented gas supply passage that is located one position after the current segmented gas supply passage after the segmented gas supply passages are arranged according to the gas supply direction, and the starting segment position and the ending segment position of the current segmented gas supply passage meet the connection verification conditions.

[0102] The sequential verification condition is that there is an actual gas delivery connection between two adjacent gas supply channels, and the end position of the previous gas supply channel can be directly connected to the beginning position of the next gas supply channel along the gas supply direction.

[0103] It should be noted that a segmented gas supply path is defined by the position of the previous segment as the starting boundary and the position of the next segment as the ending boundary, and the length of the actual continuous gas transport path connecting the starting boundary and the ending boundary is used as the quantitative basis.

[0104] S3.3. Place the leak-affected section and the abnormal gas flow section on the same segmented gas supply path for same-segment alignment. Move the sections that have not been aligned on the same segmented gas supply path to the preceding and following segmented gas supply paths for adjacent-segment alignment, obtaining the same-segment alignment position and the adjacent-segment alignment position. Specifically,

[0105] Place the segment location corresponding to the leak-affected section and the segment location corresponding to the abnormal gas flow section side by side in the same segmented gas supply path. Check one by one whether the segment location corresponding to the leak-affected section and the segment location corresponding to the abnormal gas flow section fall at the same segment location. If they fall at the same segment location, the corresponding segment location is identified as the same segment alignment location.

[0106] When the segment position corresponding to the leak-affected section and the segment position corresponding to the abnormal gas flow change section do not fall in the same segment position within the same segmented gas supply path, the corresponding segment position is not directly discarded. Instead, the segment position that has not completed the same-segment alignment is retained. Then, according to the gas supply direction, the segment position that has not completed the same-segment alignment is moved to the corresponding segment position in the previous segmented gas supply path and the next segmented gas supply path, respectively, where the connection relationship with the original segment position is consistent, and the verification continues. When the corresponding segment position in the previous segmented gas supply path or the next segmented gas supply path forms a positional correspondence with the segment position corresponding to the leak-affected section, the corresponding segment position is identified as the adjacent segment alignment position. When neither the previous segmented gas supply path nor the next segmented gas supply path forms a positional correspondence, the segment position that has not completed the same-segment alignment is retained as an unlocked position and is not included in the same-segment alignment position or adjacent segment alignment position.

[0107] Among them, the same-segment alignment is to place the leakage-affected segment and the abnormal gas flow segment in the same segment position in the same segmented gas supply path for corresponding verification.

[0108] Adjacent segment alignment involves moving segments that have not yet been aligned on the same gas supply path to their corresponding positions in the preceding and following gas supply paths for verification.

[0109] S3.4. Connect the alignment positions of the same segment and adjacent segments according to the gas supply direction to form adjustment positions, and generate an adjustment position table, specifically as follows:

[0110] After placing the same-segment alignment position and the adjacent-segment alignment position in the same sequence, first check the positional relationship according to the gas supply direction. The alignment position located at the front is placed in the front position, and the alignment position located at the back is placed in the back position. When the same-segment alignment position and the adjacent-segment alignment position fall in the same segmented gas supply path, arrange them according to their actual front and back positions in the segmented gas supply path. When the actual front and back positions are consistent, prioritize retaining the same-segment alignment position directly corresponding to the leak-affected segment, and register the adjacent-segment alignment position as an auxiliary verification position.

[0111] Among them, the alignment position of the same segment comes from the direct overlap of the leakage-affected segment and the abnormal gas flow segment at the same segment position, while the alignment position of the adjacent segment comes from the corresponding position of the consistent connection between the front and rear segments in the gas supply path. Therefore, the alignment position of the same segment and the alignment position of the adjacent segment may fall in the same segment gas supply path.

[0112] When there is a continuous sequential relationship between adjacent alignment positions, the adjacent alignment positions are connected in series to form the same adjustment position. When there is no continuous sequential relationship between adjacent alignment positions, the corresponding alignment positions are retained as independent adjustment positions. After all adjustment positions are connected in series, the gas supply direction sequence, the gas supply path of the segment, and the corresponding alignment type of each adjustment position are written into the same corresponding position and arranged continuously according to the gas supply direction to form an adjustment position table.

[0113] The calibration position table is a tabular record that records the alignment positions of the same section, adjacent sections, the section of the gas supply path where the calibration position is located, and the corresponding alignment type, in accordance with the gas supply direction. It is used to guide the subsequent rearrangement of the valve body opening and closing sequence and the correction of the parts.

[0114] S4. Rearrange the valve opening and closing sequence of the segmented gas supply passage according to the calibration position table, correct the sealing parts, pressure gauge connection parts and flow controller adjustment parts of the segmented gas supply passage, and perform process gas flow calibration on the rearranged segmented gas supply passage to generate flow calibration results.

[0115] S4.1 Arrange the adjustment positions in the adjustment position table in an opening and closing sequence according to the gas supply direction, and rearrange the opening and closing sequence of the valves in the segmented gas supply path according to the opening and closing sequence. Specifically,

[0116] Arrange the calibration positions in the calibration position table according to the gas supply direction, with the calibration positions located in front of the gas supply direction in the first position and the calibration positions located behind the gas supply direction in the last position. When there are multiple calibration positions on the same segmented gas supply path, arrange them according to the forward continuous delivery order of calibration gas and process gas in the segmented gas supply path.

[0117] After determining the order of adjustment positions, the front valve body, the valve body where the adjustment position is located, and the rear valve body corresponding to each adjustment position are listed in the corresponding order. Then, the valve body action relationship is rewritten in the order of "closing the front valve body first, adjusting the valve body where the adjustment position is located, and opening the rear valve body last". This order is used to first cut off the front return path, then stabilize the independent ventilation relationship of the gas supply passage in the current adjustment position, and finally restore the rear continuous ventilation relationship. This avoids cross-flow of gas between the front and rear during the adjustment gas rearrangement process, so that the next adjustment position can enter the corresponding valve body action only after the previous adjustment position has completed the sealing and separation.

[0118] When two adjacent adjustment positions share the same valve body, the shared valve body is kept at the end position of the previous adjustment position and is not written repeatedly in the subsequent adjustment position to avoid the same valve body being repeatedly opened and closed in adjacent positions.

[0119] After all the valve body action relationships corresponding to the sequence are rewritten, a valve body opening and closing sequence that is consistent with the order before and after the adjustment position is formed.

[0120] S4.2. Close the valves on the segmented air supply passages before the adjustment position according to the rearranged valve opening and closing sequence, and separate the segmented air supply passages where the adjustment position is located from the adjacent segmented air supply passages, forming an independent air supply state for the segmented air supply passages where the adjustment position is located. Specifically,

[0121] Read the corresponding position of the current adjustment position in the valve body opening and closing sequence, switch the valve body located in front of the current adjustment position and directly connected to the gas supply passage of the current adjustment position to the closed position, so as to stop the forward gas delivery connection between the front gas supply passage and the gas supply passage of the current adjustment position.

[0122] After the front valve is closed, check whether there is still air flow between the current adjustment position segment air supply passage and the previous segment air supply passage, the next segment air supply passage, and the side branch segment air supply passage. If there is still air flow, continue to close the corresponding connecting valves in the valve opening and closing sequence until there is no longer a direct air flow between the current adjustment position segment air supply passage and the adjacent segment air supply passage.

[0123] If the gas supply path within the segment where the current calibration position is located remains connected, and gas from adjacent segments cannot enter the segment where the current calibration position is located, the segment where the current calibration position is located is considered to be in an independent ventilation state. If the gas supply connection at the front end is not interrupted and adjacent segments can still directly guide gas into the segment where the current calibration position is located, it is not considered to have formed an independent ventilation state.

[0124] S4.3. With independent ventilation enabled, loosen the sealing component connector corresponding to the adjustment position, remove the original seal and install a new one, then tighten the sealing component connector to complete the reinstallation of the sealing component. Specifically,

[0125] After confirming the independent ventilation status, gradually loosen the sealing component connection corresponding to the adjustment position, so that the sealing component connection changes from a compressed state to a detachable state, and then separate the sealing component connection from the sealing part to expose the installation position of the sealing part.

[0126] When removing the seal, check the seal for damage, deformation, misalignment, or indentation residue by comparing it with the sealing boundary. If any of these conditions exist, remove the original seal directly. If none of these conditions exist, but the seal is still located at the corresponding adjustment position, remove the original seal and retain the original installation direction of the sealing part as a reference for reinstallation.

[0127] When installing a new seal, ensure that it falls completely into the original installation position along the contact boundary of the sealing part. When the edge of the seal is consistent with the contact boundary of the sealing part, reinstall the sealing part connector and gradually tighten it until the sealing part connector is back to the tightened state and the new seal does not lift, shift, or pinch. Only then is the reinstallation of the sealing part considered complete. If the new seal does not fall into the original installation position or lifts, shifts, or pinches after tightening, the reinstallation of the sealing part is not considered complete.

[0128] S4.4. Disassemble the pressure gauge connection corresponding to the calibration position, adjust the pressure gauge connection direction and tightness, and complete the pressure gauge connection correction. Specifically,

[0129] When the independent ventilation state remains unchanged, disconnect the pressure gauge connection corresponding to the calibration position from the segmented air supply path to expose the pressure gauge interface, connector, and pressure gauge installation orientation. Then check whether the pressure gauge sensing end is facing the actual ventilation direction of the current segmented air supply path. If the pressure gauge sensing end deviates from the actual ventilation direction, rotate the pressure gauge connection direction to realign the pressure gauge sensing end with the actual ventilation direction of the current segmented air supply path. Once the pressure gauge sensing end is aligned with the actual ventilation direction, retain only the current connection direction and do not adjust it further.

[0130] After confirming the connection direction, tighten the connectors at the pressure gauge connection point again. If the pressure gauge body does not become loose, misaligned, or misaligned after tightening the connectors, the connection tightness is considered to have met the correction conditions. If the connectors are still loose, misaligned, or misaligned after tightening, continue to adjust the tightness of the connectors and the installation orientation of the pressure gauge until the pressure gauge connection direction is consistent with the actual ventilation direction and the connection tightness is stable. The correction of the pressure gauge connection point is then considered complete.

[0131] S4.5 Adjust the opening and ventilation relationships of the flow controller adjustment parts corresponding to the calibration positions, and complete the correction of the sealing parts, pressure gauge connection parts, and flow controller adjustment parts of the segmented air supply passage. Specifically,

[0132] Adjust the opening and ventilation relationships of the flow controller adjustment parts corresponding to the calibration position. When adjusting the opening relationship, match the current opening and closing position of the flow controller adjustment parts with the independent ventilation state of the segmented air supply passage where the calibration position is located. When the current opening of the flow controller adjustment parts causes air obstruction in the segmented air supply passage where the calibration position is located, gradually increase the opening along the air guiding direction. When the current opening of the flow controller adjustment parts causes cross-flow between adjacent segmented air supply passages, gradually decrease the opening along the air guiding direction until the segmented air supply passage where the calibration position is located maintains continuous air guiding and there is no cross-flow between adjacent segmented air supply passages.

[0133] When adjusting the ventilation relationship, compare the inlet connection position and outlet connection position of the flow controller adjustment part with the front and rear connection direction of the current segmented air supply path. If the inlet connection position is inconsistent with the upstream air guiding direction or the outlet connection position is inconsistent with the downstream air guiding direction, readjust the air guiding connection direction of the flow controller adjustment part. If the inlet connection position is consistent with the upstream air guiding direction and the outlet connection position is consistent with the downstream air guiding direction, retain the current ventilation relationship and do not change it.

[0134] Once the flow controller adjustment is completed, the air supply path within the section where the adjustment is located is continuously ventilated, the pressure gauge connection remains stable, and the sealing parts are not loose. At this point, the correction of the sealing parts, pressure gauge connection parts, and flow controller adjustment parts of the section air supply path is considered complete. If any part still experiences obstruction, cross-contamination, loosening, or displacement, the correction is not considered complete.

[0135] S4.6 Perform process gas flow calibration on the rearranged segmented gas supply path and generate flow calibration results, specifically as follows:

[0136] When the rearranged segmented gas supply passages are used for process gas flow calibration, the process gas is first introduced into each segmented gas supply passage in sequence from the starting end of the gas supply direction according to the valve opening and closing sequence. Then, the process gas is checked segment by segment along the gas supply direction to see if it can continuously enter the next segmented gas supply passage from the previous segmented gas supply passage.

[0137] When the process gas continues to flow continuously within the current segmented gas supply path, completes the connection with the next segmented gas supply path, and there is no backflow, crossflow, or interruption between adjacent segmented gas supply paths, the current segmented gas supply path is considered to be normally connected. When the process gas is obstructed, delayed, crossflow occurs between upstream and downstream, or is interrupted in any segmented gas supply path, the corresponding position is considered to be an abnormal connection position.

[0138] After all the segmented gas supply paths have been checked one by one, the normally functioning segmented gas supply paths, the abnormal locations, and the corresponding gas supply sequence and status are written into the corresponding positions in the results to form the flow calibration results.

[0139] Among them, process gas flow calibration is a calibration action that involves introducing process gas into the rearranged segmented gas supply path and calibrating the gas supply sequence and state according to the continuous delivery state of the segmented gas supply path.

[0140] This embodiment also provides a computer device applicable to the gas flow calibration method in a semiconductor processing device, comprising: a memory and a processor; the memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions to implement the gas flow calibration method in a semiconductor processing device as proposed in the above embodiment.

[0141] The computer device can be a terminal, comprising a processor, memory, communication interface, display screen, and input devices connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, carrier networks, NFC (Near Field Communication), or other technologies. The display screen can be an LCD screen or an e-ink screen. The input devices can be a touch layer covering the display screen, buttons, a trackball, or a touchpad on the computer device's casing, or an external keyboard, touchpad, or mouse.

[0142] This embodiment also provides a storage medium storing a computer program that, when executed by a processor, implements the gas flow calibration method in a semiconductor processing device as described in the above embodiments. The storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Red-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0143] In summary, this invention, by associating and locking the leakage-affected section with the abnormal gas flow change section, can form a more consistent calibration position determination result in complex gas supply channels. This makes the anomaly location during the gas flow calibration process clearer, the calibration direction more focused, and the subsequent correction basis more stable. The resulting calibration position table not only improves the systematicness and verifiability of gas supply channel anomaly identification, but also enhances the connection between valve body opening and closing rearrangement, sealing part correction, pressure gauge connection part correction, and flow controller adjustment part correction, giving the entire gas flow calibration process better continuity, accuracy, and execution stability.

[0144] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A method for adjusting gas flow rate in a semiconductor processing device, characterized in that: include, The gas supply path is segmented and organized to generate segmented gas supply paths and vacuum leak detection is performed to obtain the leak location. The leak locations are connected in series along the gas supply direction to generate a leak path table. The gas supply path is a continuous gas delivery path in the semiconductor processing equipment used to deliver calibration gas and process gas. The gas supply direction is the direction in which calibration gas and process gas are continuously delivered from front to back in the gas supply path. According to the leakage path table, the calibration gas is driven to switch between the segmented gas supply channels one by one. After each switch, the front section of the segmented gas supply channel is shut off and the rear section of the segmented gas supply channel is resumed. The changes in gas delivery before and after the switch are compiled into a segmented difference table. The leakage-affected sections and abnormal gas flow sections are screened out from the segment difference table, and the leakage-affected sections and abnormal gas flow sections are cross-locked to generate an adjustment position table; The valve opening and closing sequence of the segmented gas supply passages is rearranged according to the calibration position table. The sealing parts, pressure gauge connection parts and flow controller adjustment parts of the segmented gas supply passages are corrected. The process gas flow calibration is then performed on the rearranged segmented gas supply passages to generate flow calibration results.

2. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 1, characterized in that: The location of the leak is specifically as follows: Divide the gas supply path into sections where the connectivity changes and locate the segment positions; The continuous gas delivery path between two adjacent segment locations is defined as the segmented gas supply path, and the segmented gas supply paths are arranged according to the gas supply direction. In the segmented gas supply channels after the layout is completed, the leak detection state is switched segment by segment, and vacuum leak detection is performed on the segmented gas supply channels in the leak detection state to determine the segmented leak detection location. The leak detection points are connected in series according to the gas supply direction, and the leak detection points in adjacent gas supply channels are sequentially verified to obtain the leak location.

3. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 1, characterized in that: The changes in airflow before and after the switching are compiled into a segmented difference table, specifically as follows: Arrange the leak locations in the leak path table in the switching sequence according to the gas supply direction, and determine the switching segment gas supply path, the front segment gas supply path and the rear segment gas supply path according to the switching sequence. Introduce calibration gas into the switching section gas supply passage, and after the calibration gas enters the switching section gas supply passage, open the subsequent section gas supply passage to form a switching state from the switching section gas supply passage to the subsequent section gas supply passage. To shut down the front section gas supply path during the switching state while keeping the rear section gas supply path open, the gas guiding changes of the front section gas supply path, the switching section gas supply path, and the rear section gas supply path are arranged in sequence according to the switching order. Based on the changes in air delivery after the arrangement, distinguish between the air delivery state before and after the switch, and register the air delivery state before and after the switch into the corresponding segmented air supply path to generate a segmented difference table.

4. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 3, characterized in that: The switching state from the initial segmented gas supply path to the subsequent segmented gas supply path specifically refers to the following: Keep the front-end segmented gas supply passage closed, and introduce the calibration gas into the switching segmented gas supply passage; After the calibration gas enters the gas supply passage of the switching section, the ventilation path of the gas supply passage of the switching section is kept open. The ventilation path is opened during the period when the ventilation path is kept open during the switching of the segmented gas supply path. The switching process is carried out in parallel with the front segment gas supply passage closed, the switching segment gas supply passage being introduced, and the rear segment gas supply passage being opened, forming a switching state from the switching segment gas supply passage to the rear segment gas supply passage.

5. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 1, characterized in that: The generation of the calibration position table specifically involves... Identify the continuously occurring leakage-affected sections in both the pre- and post-switching gas flow states. The affected sections of the continuous leaks are extended to the previous section of the gas supply path and the next section of the gas supply path, respectively. The gas supply path before and after the switching of the previous segment gas supply path are compared and judged item by item. Based on the judgment result of abnormal gas supply changes, the abnormal gas supply path is found in the previous segment gas supply path and the next segment gas supply path. Place the leak-affected section and the abnormal gas flow section on the same segmented gas supply path for same-segment alignment. Move the sections that have not been aligned on the same segmented gas supply path to the previous and next segmented gas supply paths for adjacent-segment alignment to obtain the same-segment alignment position and adjacent-segment alignment position. Connect the alignment positions of the same segment and the alignment positions of adjacent segments according to the gas supply direction to form the adjustment positions, and generate the adjustment position table.

6. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 5, characterized in that: The aforementioned same-segment alignment involves placing the leakage-affected segment and the abnormal gas flow segment in the same segment position within the same segmented gas supply path for corresponding verification. The adjacent segment alignment involves moving the segments that have not been aligned on the same segmented gas supply path to the corresponding segments in the preceding and following segmented gas supply paths for corresponding verification.

7. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 1, characterized in that: The modified segmented gas supply path's sealing parts, pressure gauge connection parts, and flow controller adjustment parts are specifically as follows: Arrange the adjustment positions in the adjustment position table in the opening and closing sequence according to the gas supply direction, and rearrange the opening and closing sequence of the valves in the segmented gas supply passage according to the opening and closing sequence. Close the valves on the segmented air supply passage in front of the adjustment position according to the rearranged valve opening and closing sequence, and separate the segmented air supply passage where the adjustment position is located from the adjacent segmented air supply passages to form an independent air supply state for the segmented air supply passage where the adjustment position is located. In independent ventilation mode, loosen the sealing part connector corresponding to the adjustment position, remove the seal in the sealing part and install a new seal, then tighten the sealing part connector to complete the sealing part reinstallation. Disassemble the pressure gauge connection corresponding to the calibration position, adjust the pressure gauge connection direction and connection tightness, and complete the correction of the pressure gauge connection. Adjust the opening and ventilation relationships of the flow controller adjustment parts corresponding to the calibration position, and complete the correction of the sealing parts, pressure gauge connection parts and flow controller adjustment parts of the segmented air supply passage.

8. The gas flow rate adjustment method in the semiconductor processing equipment as described in claim 1, characterized in that: The process gas flow calibration is an adjustment action that involves introducing process gas into the rearranged segmented gas supply path and calibrating the gas supply sequence and state according to the continuous delivery state of the segmented gas supply path.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, it implements the steps of the gas flow rate adjustment method in the semiconductor processing device according to any one of claims 1 to 8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by the processor, it implements the steps of the gas flow rate adjustment method in the semiconductor processing device according to any one of claims 1 to 8.

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