Power conversion apparatus and power supply system

Abstract

The application discloses a power conversion device and a power supply system. The power conversion device comprises a box body, a power conversion circuit, a filter circuit and a radiator. The box body comprises a first accommodating cavity and at least one second accommodating cavity. The power conversion circuit comprises a first circuit board and a power conversion device fixedly connected to a first mounting surface of the first circuit board. The first circuit board is fixedly connected to a first bottom wall of the first accommodating cavity through a fixing piece. The first mounting surface faces the first bottom wall. The filter circuit comprises a second circuit board and a filter device fixedly connected to a second mounting surface of the second circuit board. The second circuit board is fixedly connected to a second bottom wall of the second accommodating cavity through a first conductive piece. The second mounting surface faces away from the second bottom wall. The first bottom wall and the second bottom wall are located on the same side of the box body. The first bottom wall is recessed in the direction of the first accommodating cavity relative to the second bottom wall. The radiator is arranged on the outside of the box body corresponding to the first bottom wall. The power conversion device is miniaturized, and the filtering effect of the filter circuit is improved.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and more specifically, to a power conversion device and a power supply system. Background Technology

[0002] As one of the main components of a power supply system, the miniaturization of power conversion equipment is crucial for the power density of the booster system. Reducing the overall height of the unit is an effective way to achieve miniaturization.

[0003] In related technologies, the circuitry (including power conversion circuitry and filtering circuitry) within power conversion equipment is typically laid out in an inverted manner relative to the heat sink to reduce the overall height of the device. However, this layout reduces the filtering effect of the filtering circuitry. Summary of the Invention

[0004] This application provides a power conversion device and a power supply system. The various aspects involved in this application embodiment are described below.

[0005] In a first aspect, a power conversion device is provided, comprising: a housing, including a first receiving cavity and at least one second receiving cavity; a power conversion circuit, including a first circuit board and a power conversion device fixedly connected to a first mounting surface in the first circuit board, the first circuit board being fixedly connected to a first bottom wall of the first receiving cavity by a fastener, the first mounting surface facing the first bottom wall; a filtering circuit, including a second circuit board and a filtering device fixedly connected to a second mounting surface in the second circuit board, the second circuit board being fixedly connected to a second bottom wall of the second receiving cavity by a first conductive element, the second mounting surface facing away from the second bottom wall, wherein the first bottom wall and the second bottom wall are located on the same side of the housing, the first bottom wall being recessed towards the first receiving cavity relative to the second bottom wall; and a heat sink disposed on the outer side of the housing corresponding to the first bottom wall.

[0006] In some embodiments, the second circuit board is provided with a first connection interface and a second connection interface, the filter device includes a first filter device and a second filter device, the first filter device is connected to the first connection interface and the first connection interface is used to connect to an input source, the second filter device is connected to the second connection interface and the second connection interface is used to connect to an output source.

[0007] In some embodiments, the second circuit board includes a second input circuit board and a second output circuit board, the first connection interface is disposed on the second input circuit board and the first filter element is located on the second mounting surface of the second input circuit board, the second connection interface is disposed on the second output circuit board and the second filter element is located on the second mounting surface of the second output circuit board.

[0008] In some embodiments, the second circuit board and the first circuit board are arranged along a second direction.

[0009] In some embodiments, the second input circuit board and the second output circuit board are located on opposite sides of the first circuit board.

[0010] In some embodiments, the second input circuit board and the second output circuit board are located on the same side of the first circuit board and are arranged along a third direction.

[0011] In some embodiments, the at least one second receiving cavity is a second receiving cavity for receiving the second circuit board, and the second receiving cavity is arranged along the second direction with the first receiving cavity.

[0012] In some embodiments, the at least one second receiving cavity is two second receiving cavities for receiving the second input circuit board and the second output circuit board respectively, and the two second receiving cavities are located on both sides of the first receiving cavity.

[0013] In some embodiments, the power conversion device includes a power transistor and a capacitor, and the first bottom wall includes a first bottom wall corresponding to the power transistor and a first bottom wall corresponding to the capacitor. The first bottom wall corresponding to the power transistor is recessed toward the first circuit board relative to the first bottom wall corresponding to the capacitor.

[0014] In some embodiments, the end face of the radiator away from the first bottom wall does not exceed the outer end face of the housing corresponding to the second bottom wall.

[0015] In some embodiments, the first circuit board and the second circuit board are connected by a second conductive element.

[0016] In some embodiments, the second conductive element includes a stud.

[0017] In some embodiments, the filtering device includes a first filtering device and a second filtering device, and the second conductive device includes a first group of second conductive devices corresponding to the first filtering device and a second group of second conductive devices corresponding to the second filtering device, wherein the number of second conductive devices in the first group of second conductive devices and the number of second conductive devices in the second group of second conductive devices are both at least two.

[0018] In some embodiments, the first conductive element is a stud.

[0019] In some embodiments, the length of the first conductive element ranges from 0.3cm to 3cm.

[0020] In some embodiments, the power conversion device is an inverter.

[0021] In a second aspect, a power supply system is provided, including the power conversion device as described in the first aspect.

[0022] In the power conversion device provided in this application embodiment, the overall height can be reduced by inverting the power conversion circuit 420. Simultaneously, since the power conversion circuit 420 and the filter circuit 430 are separated into different boards, and the filter component 432 is mounted on the second mounting surface 433 of the second circuit board 331 with the second mounting surface facing away from the second bottom wall 415, the second circuit board 331 can be mounted close to the second bottom wall 415. This not only helps to shorten the length of the first conductive component 480 used to fix and connect the second circuit board, thus reducing the high-frequency grounding impedance of the filter circuit, but also isolates the filter component 432 from the second bottom wall 415 through the second circuit board 331, thereby breaking the near-field coupling path and reducing port noise. Therefore, the power conversion device 400 provided in this application embodiment achieves miniaturization while improving the filtering effect of the filter circuit. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the architecture of a power conversion device in related technologies.

[0024] Figure 2 yes Figure 1 A schematic diagram of the coupling path of the power conversion device in the diagram.

[0025] Figure 3 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application.

[0026] Figure 4 This is a schematic diagram of the structure of a power conversion device provided in another embodiment of this application.

[0027] Figure 5 yes Figure 4 A top view of a power conversion device.

[0028] Figure 6 yes Figure 4 Another top view schematic diagram of the power conversion device in the diagram.

[0029] Figure 7 This is a schematic diagram of the structure of a power conversion device provided in another embodiment of this application.

[0030] Figure 8 yes Figure 5 A schematic diagram of the layout of the power conversion equipment in the diagram.

[0031] Figure 9 yes Figure 6A schematic diagram of the layout of the power conversion equipment in the diagram.

[0032] Figure 10 yes Figure 7 A schematic diagram of the layout of the power conversion equipment in the diagram. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application should fall within the scope of protection of the present application.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] Power conversion equipment, as a core component of power supply systems, is mainly used to convert and regulate the form of electrical energy, such as converting alternating current (AC) to direct current (DC), DC voltage boosting / scaling (DC / DC), and / or DC to alternating current (DC / AC), to meet the specific voltage, current, and frequency requirements of different loads. With the rapid development of electronic devices towards high performance, high integration, and portability, higher demands are being placed on the size, weight, and efficiency of power supply systems.

[0036] This application does not specifically limit the type of power conversion device, as long as the power conversion device has power conversion function. For example, the power conversion device can be one or more of the following: inverter, power conversion system (PCS), rectifier, and optimizer, etc. Among them, the inverter can be a single-phase inverter or a three-phase inverter.

[0037] It should be noted that, for ease of description, the height direction (or depth direction) of the power conversion device is defined as the first direction. Two directions perpendicular to the first direction and approximately horizontal are defined as the second and third directions, respectively. The second and third directions can be perpendicular to each other, forming two axes of the horizontal plane. Specifically, the first, second, and third directions are the Z, X, and Y directions, respectively (see [reference needed]). Figures 1-10In the context of circuit boards, directional terms such as "top" and "bottom" refer to the first direction unless otherwise specified. The term "mounting surface" refers to the surface on the circuit board that primarily supports and solders electronic components.

[0038] To facilitate understanding of the miniaturization design of existing power conversion devices, the following section will combine... Figure 1 Existing power conversion devices are described by way of example.

[0039] like Figure 1 As shown, the power conversion device 100 mainly includes a circuit board 110, a housing 120, a heat sink 130, and a cover plate 140. For example, the circuit board 110 is a printed circuit board (PCB). Power conversion devices 111 and filtering devices 112 are mounted on the circuit board 110. The devices on the circuit board 110 can be arranged in an inverted manner relative to the heat sink 130. For details, see [link to details]. Figure 1 The receiving cavity 121 includes a first receiving cavity 123 and a second receiving cavity 124. The bottom wall of the first receiving cavity 123 (i.e., the first bottom wall 125) is recessed towards the first receiving cavity 123 compared to the bottom wall of the second receiving cavity 124 (i.e., the second bottom wall 126). Based on this, the height h1 (or depth) of the first receiving cavity 123 is less than the height h2 (or depth) of the second receiving cavity 124. The power conversion device 111 is located in the first receiving cavity 123 and faces the first bottom wall 125, the filtering device 112 is located in the second receiving cavity 124 and faces the second bottom wall 126, and the heat sink 130 is located on the outside of the housing corresponding to the first bottom wall 125.

[0040] This layout allows for a lower overall height of the power conversion device 100, which is equivalent to miniaturization in the height direction of the power conversion device 100. This is beneficial for improving the overall power density of the system, saving space, reducing structural costs, and enhancing deployment flexibility.

[0041] However, this layout has the following problems: part of the circuit board 110 needs to be mounted on the second bottom wall 126 through the filter component 112. This results in the conductor 150 used to mount this part of the circuit board 110 being relatively long. Typically, the length of the conductor 150 ranges from 5cm to 15cm. Since this conductor 150 is equivalent to a grounding component, from the perspective of the electrical characteristics of the grounding path, a longer grounding component ( Figure 1The conductive component 150 introduces a significant parasitic inductance, which greatly increases the high-frequency grounding impedance of the filter circuit. This hinders the effective discharge of noise current and reduces the filtering effect of the filter circuit. Furthermore, both the power conversion device 111 and the filter device 112 face the bottom wall and are very close to the cavity bottom. From the perspective of the physical mechanism of electromagnetic field coupling, the close distance between the power conversion device 111 and the first bottom wall 125 results in a large distributed capacitance (hereinafter referred to as the first distributed capacitance), and the close distance between the second bottom wall 126 and the filter device 112 results in a large distributed capacitance (hereinafter referred to as the second distributed capacitance). This exacerbates the near-field coupling of the port electromagnetic interference (EMI) circuit, leading to increased port noise. The coupling path formed by the first and second distributed capacitances can be found in [reference needed]. Figure 2 The dashed lines in the diagram indicate this. It should be noted that, to more clearly show the coupling path, [the text is incomplete]. Figure 2 The 130 radiator has been omitted, but that does not mean that the 130 radiator does not exist.

[0042] In summary, the miniaturization design methods in related technologies exacerbate near-field coupling of the filter circuit at the port, leading to increased port noise and increased grounding impedance of the filter circuit, thereby reducing the product's electromagnetic compatibility (EMC) performance.

[0043] In view of this, a power conversion device according to an embodiment of this application is proposed. The following is in conjunction with... Figure 3 The power conversion device 300 provided in the embodiments of this application will be described in detail. See also Figure 3 The power conversion device 300 mainly includes a housing 310, a power conversion circuit 320, a filter circuit 330, and a heat sink 340.

[0044] The enclosure 310 can be used to provide structural support, electromagnetic shielding and grounding reference, and the enclosure 310 has an internal cavity 311, or in other words, the enclosure 310 includes the cavity 311. The cavity 311 is used to install various circuit boards and devices, and the cavity 311 can be constructed to have different depths according to installation requirements.

[0045] Specifically, the receiving cavity 311 includes a first receiving cavity 312 and at least one second receiving cavity 313. The first receiving cavity 312 is used to receive the power conversion circuit 320, and the second receiving cavity 313 is used to receive the filter circuit 330. The first receiving cavity 312 and the second receiving cavity 313 may be defined by the inner wall of the housing 310, which includes the side walls and the bottom wall of the housing 310. The bottom wall of the housing 310 specifically includes the first bottom wall 314 of the first receiving cavity 312 and the second bottom wall 315 of the second receiving cavity 313. The first bottom wall 314 of the first receiving cavity 312 can be understood as the bottom wall corresponding to or the bottom wall of the first receiving cavity 312. The second bottom wall 315 of the second receiving cavity 313 can be understood as the bottom wall corresponding to or the bottom wall of the second receiving cavity 313.

[0046] The first bottom wall 314 and the second bottom wall 315 are located on the same side of the housing 310, which is the side where the bottom wall of the housing 310 is located. The first bottom wall 314 is recessed relative to the second bottom wall 315 towards the first receiving cavity. That is, with the second bottom wall 315 as a reference, the first bottom wall 314 is recessed along the direction towards the interior space of the first receiving cavity (i.e.,...). Figure 3 The first receiving cavity 312 is further recessed in the Z direction. This will make the dimension h1 of the first receiving cavity 312 in the Z direction smaller than the dimension h2 of the second receiving cavity 313 in the Z direction, or in other words, the depth h1 of the first receiving cavity 312 is smaller than the depth h2 of the second receiving cavity 313.

[0047] In this embodiment, the enclosure 310 is grounded, and the material of the enclosure 310 is not specifically limited in this embodiment. For example, the enclosure 310 can be made of a conductive grounding material, such as a metallic material, like aluminum alloy or steel plate. Alternatively, the enclosure 310 can be made of an insulating material and coated with a conductive grounding material, such as a non-metallic sheet, ceramic, or engineering plastic.

[0048] The power conversion circuit 320 is the core component that generates the power conversion function, used to realize the conversion and regulation of electrical energy. During its operation, it generates switching loss heat and electromagnetic noise. The power conversion circuit 320 includes a first circuit board 321 and a power conversion device 322 mounted on the first circuit board 321.

[0049] The first circuit board 321 is fixedly connected to the first bottom wall 314 of the first receiving cavity 312 by a fastener 360. The fastener 360 may be, for example, a screw, stud, clip, pin header, etc. The length of the fastener 360 ranges from 3cm to 5cm. The first circuit board 321 includes a first mounting surface 323 and a third mounting surface, which are two surfaces arranged back to back. The first mounting surface 323 faces the first bottom wall 314, and the third mounting surface faces the top of the first receiving cavity 312, or in other words, the third mounting surface is away from the first bottom wall 314.

[0050] The power conversion device 322 is an electronic device used to perform the conversion and regulation of electrical energy. All power conversion devices are connected to the first mounting surface 323 of the first circuit board 321; or, in other words, all power conversion devices are mounted on the first mounting surface 323 of the first circuit board 321 and extend away from the first mounting surface 323. This mounting method makes the power conversion device 322 essentially in an "inverted" or "reverse-pulled" state, with its heat-generating body closer to the first bottom wall 314.

[0051] The filter circuit 330 is used to filter out high-frequency harmonics and noise generated during power conversion, preventing them from being conducted or radiated to the outside through its connection interface (or port), and also suppressing external interference from entering through the connection interface. The filter circuit 330 is sensitive to thermal and electromagnetic interference, and its filtering efficiency depends on a low-impedance grounding path, which includes a first conductive element for mounting the filter circuit. Specifically, the filter circuit 330 includes a second circuit board 331 and a filter element 332 mounted on the second circuit board 331.

[0052] The second circuit board 331 is electrically connected to the first circuit board 321 and is fixedly mounted on the second bottom wall 315 of the second receiving cavity 313 via a first conductive element 380. The first conductive element 380 can be understood as a grounding connector used to form a low-impedance grounding path for the second circuit board 331. The second circuit board 331 includes a second mounting surface 333 and a fourth mounting surface, which are two surfaces arranged back-to-back. Specifically, the fourth mounting surface faces the second bottom wall 315, and the second mounting surface 333 faces the top of the second receiving cavity 313, or in other words, the second mounting surface 333 faces away from the second bottom wall 315.

[0053] The filter element 332 is a device used to perform filtering. The filter element 332 is located on the second mounting surface 333 of the second circuit board 331, or in other words, the filter element 332 is fixedly connected to the second mounting surface 333 of the second circuit board 331 and extends in a direction away from the second mounting surface 333.

[0054] The heat sink 340 is disposed on the outside of the housing 310. Specifically, the heat sink 340 is disposed on the outer side of the housing corresponding to the first bottom wall 314. The outer side of the housing corresponding to the first bottom wall 314 is the wall surface of the bottom plate of the first receiving cavity 312 facing outwards from the housing 310, and the first bottom wall 314 is the wall surface of the bottom plate of the first receiving cavity 312 facing inwards from the housing 310. The heat sink 340 typically has a finned structure to increase the heat dissipation area, and its material can be a metal, such as aluminum alloy. The heat generated by the power conversion device 322 is conducted through the first circuit board 321 to the first bottom wall 314, and then conducted outwards through the first bottom wall 314 to the heat sink 340. Finally, the heat sink 340's fins dissipate heat into the environment through convection and radiation, thus achieving heat dissipation.

[0055] Based on the above structure, the embodiments of this application can reduce the overall height by inverting the power conversion circuit 320 (i.e., placing the power conversion device 322 on the first mounting surface 323 of the first circuit board 321 with the first mounting surface facing the first bottom wall 314). Simultaneously, since the power conversion circuit 320 and the filter circuit 330 are separated into different boards, and the filter device 332 is mounted on the second mounting surface 333 of the second circuit board 331 with the second mounting surface facing away from the second bottom wall 315, the second circuit board 331 can be mounted close to (or recessed) the second bottom wall 315. This not only helps to shorten the length of the first conductive element 380 used to fix and connect the second circuit board 331, thus reducing the high-frequency grounding impedance of the filter circuit 330, but also effectively reduces the distributed capacitance between the filter device 332 and the second bottom wall 315 by separating the filter device 332 from the second bottom wall 315 through the second circuit board 331, thereby disconnecting the near-field coupling path and reducing port noise. In summary, the power conversion device 300 provided by the embodiments of this application achieves miniaturization while improving the filtering effect of the filter circuit.

[0056] As described above, the second circuit board 331 is fixedly mounted on the second bottom wall 315 of the second receiving cavity 313 via the first conductive element 380. This application embodiment does not specifically limit the type of the first conductive element 380, as long as it is conductive and can be used to fix the second circuit board 331. For example, the first conductive element 380 can be a screw, stud, clip, pin header, etc. Preferably, the first conductive element 380 can be a stud, which not only fixes the second circuit board 331 but also provides reliable support for it, thereby improving the stability of the filtering circuit.

[0057] In this embodiment, based on the configuration of the second circuit board 331, the length of the first conductive element 380 can range from 0.3cm to 3cm. That is, when the first conductive element 380 is a stud, the length of the stud can range from 0.3cm to 3cm. It can be seen that, compared to the length of the conductive element 150 used to connect the filter circuit in the prior art, the length of the first conductive element 380 used to mount the second circuit board 331 (i.e., the circuit board of the filter circuit 330) in this embodiment is significantly reduced. Therefore, the high-frequency grounding impedance of the filter circuit 330 is effectively reduced, thereby improving the filtering effect of the filter circuit 330.

[0058] In some embodiments, such as Figure 4 and Figure 7 As shown, the power conversion device 322 may include a power transistor 324 and a capacitor 325. The power transistor 324 may include, for example, one or more of the following: an insulated-gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), a silicon carbide MOSFET, or a gallium nitride high electron mobility transistor (GaNHEMT). The capacitor 325 may include, for example, one or more of the following: a bus electrolytic capacitor and a modular capacitor. In some embodiments, such as... Figure 4 and Figure 7 As shown, when the power conversion device 322 includes a power transistor 324 and a capacitor 325, the first receiving cavity can be stepped, and the first bottom wall 314 can be formed in a two-tiered form with varying heights. Specifically, the first bottom wall 314 includes a first bottom wall 314 corresponding to the power transistor 324 and a first bottom wall 314 corresponding to the capacitor 325. The first bottom wall 314 corresponding to the power transistor 324 is recessed towards the first circuit board relative to the first bottom wall 314 corresponding to the capacitor 325. Based on this, the fixing member 360 for mounting the first circuit board 321 can correspondingly include a short fixing member 361 located in the area where the power transistor 324 is located and a long fixing member 362 located in the area where the capacitor 325 is located. The length of the long fixing member 362 ranges from 5cm to 15cm, and the length of the short fixing member 361 ranges from 3cm to 5cm. That is, the length of the fixing member 360 ranges from 3cm to 15cm. By setting the first bottom wall 314 in a two-stage form and recessing the first bottom wall 314 corresponding to the power transistor 324 toward the first circuit board relative to the first bottom wall 314 corresponding to the capacitor 325, not only can the capacitor 325 for power conversion be set on the first circuit board 321 to avoid the parasitic inductance caused by the separate design of the capacitor 325 and the power transistor 324, but also more space can be provided on the first circuit board 321 for the bottom wall corresponding to the power transistor 324 to leave for the heat sink 340, thereby increasing the area of ​​the heat sink 340, which is beneficial to the heat dissipation of the main heat-generating device, the power transistor 324.

[0059] As mentioned above, the filter circuit 330 is used to filter out high-frequency harmonics and noise generated during power conversion, preventing them from being conducted or radiated to the outside through its connection interface. It also suppresses external interference from entering through the connection interface. In some embodiments, such as... Figures 5-7 As shown, the second circuit board 331 is provided with a first connection interface 334 and a second connection interface 335. The first connection interface 334 can also be called an input interface, used to connect an external input source, and the second connection interface 335 can also be called an output interface, used to connect an output source. The filtering component 332 is specifically divided into a first filter component 336 and a second filter component 337, or in other words, the filtering component 332 includes the first filter component 336 and the second filter component 337. The first filter component 336 is electrically connected to the first connection interface 334, forming an input filtering network. The second filter component 337 is electrically connected to the second connection interface 335, forming an output filtering network. The first filter component 336 and the circuit board on which it is mounted together form an input filtering circuit, and the second filter component 337 and the circuit board on which it is mounted together form an output filtering circuit. This arrangement allows both input and output noise to be filtered independently and specifically, further improving the EMC filtering effect.

[0060] In some embodiments, the input source is a DC source, and the output source is an AC source or a load using AC power. In this case, the power conversion device 322 is used to convert DC power to AC power. In other embodiments, the input source is an AC source, and the output source is a DC source. In this case, the power conversion device 322 is used to convert AC power to DC power. The DC source can be, for example, a photovoltaic module and / or an energy storage battery, and the AC source can be, for example, the power grid.

[0061] Given that the filter component 332 includes the first filter component 336 and the second filter component 337, the second circuit board 331 described above can be a single integrally formed board or two or more physically separated sub-boards (referred to as sub-boards). As an example, such as Figure 5 As shown, the second circuit board 331 is a single board, that is, the first filter component 336 and the second filter component 337 can be arranged on the same circuit board.

[0062] As another example, the second circuit board 331 can be a separate board; for example, the second circuit board 331 can be two independent circuit boards, with the first filter component 336 arranged on one circuit board and the second filter component 337 arranged on the other circuit board. As a concrete example, such as... Figure 6 and Figure 7As shown, the second circuit board 331 may include a second input circuit board 338 and a second output circuit board 339. A first connection interface 334 is disposed on the second input circuit board 338, while a first filtering component 336 is centrally mounted on the second mounting surface of the second input circuit board 338. A second connection interface 335 is disposed on the second output circuit board 339, while a second filtering component 337 is centrally mounted on the second mounting surface 333 of the second output circuit board 339. Both the second input circuit board 338 and the second output circuit board 339 are independently mounted on the second bottom wall 315. This arrangement improves layout flexibility, facilitates adaptation based on the positions of the input and output terminals, and also benefits production and maintenance.

[0063] There are several ways to optimize the layout of the power conversion circuit 320 and the filter circuit 330 on the horizontal plane. For example, see... Figures 5-7 In one layout shown, regardless of whether the second circuit board 331 is a single board or a multi-board, the second circuit board 331 and the first circuit board 321 are arranged along a second direction. Based on this, as... Figures 8-10 As shown, the power conversion circuit and the filter circuit are basically arranged side by side. Therefore, the power conversion device 322 and the filter device 332 are not stacked vertically. This avoids vertical stacking and is the basis for reducing the overall height of the device.

[0064] Furthermore, in Figure 7 In the layout variation shown, when the second circuit board 331 is a split board, that is, when the second circuit board 331 includes a second input circuit board 338 and a second output circuit board 339, the second input circuit board 338 and the second output circuit board 339 can be located on opposite sides of the first circuit board 321 along the second direction. For example, the second input circuit board 338 is located on the left side of the first circuit board 321, and the second output circuit board 339 is located on the right side of the first circuit board 321. Alternatively, the second input circuit board 338 is located on the right side of the first circuit board 321, and the second output circuit board 339 is located on the left side of the first circuit board 321. Based on this, a layout can be constructed where the power conversion circuit is in the center, and the input filter circuit and the output filter circuit are located on opposite sides (see...). Figure 10 This ensures a clear and symmetrical electrical connection path, allowing input and output cables to be introduced and exited from both sides without interference.

[0065] Further, see Figure 6Another layout variation shown, where the second circuit board 331 is a separate board, i.e., when the second circuit board 331 includes a second input circuit board 338 and a second output circuit board 339, can also be located on the same side of the first circuit board 321. In this case, the second input circuit board 338 and the second output circuit board 339 can be arranged along a third direction. For example, both can be located on the left side of the first circuit board 321, and the second input circuit board 338 and the second output circuit board 339 can be arranged sequentially in the front-to-back direction (third direction). Based on this, a layout of "power conversion circuit and filtering circuit (including input filtering circuit and output filtering circuit) on both sides" can be constructed (see...). Figure 9 This layout is suitable for application scenarios where input and output ports need to be located on the same side of the device, which helps to simplify external wiring.

[0066] As mentioned above, the second receiving cavity 313 is used to receive the filter circuit 330. Given that the second circuit board 331 in the filter circuit 330 can be a single board or multiple boards, and the arrangement of the second circuit board 331 is also quite diverse, the number and arrangement of the second receiving cavities 313 can vary based on the changes in the number and arrangement of the second circuit board 331.

[0067] As an example, such as Figures 3-4 As shown, at least one second receiving cavity in the power conversion device 300 can be a single second receiving cavity 313, and this single second receiving cavity 313 is arranged along a second direction with the first receiving cavity 312. For example, when the second circuit board 331 is the aforementioned single board and a single second circuit board 331 and a first circuit board 321 can be arranged along a second direction, at least one second receiving cavity in the power conversion device 300 can be a single second receiving cavity, and this single second receiving cavity 313 is arranged along a second direction with the first receiving cavity 312. As another example, when the second circuit board 331 includes a second input circuit board 338 and a second output circuit board 339, the second input circuit board 338 and the second output circuit board 339 are located on the same side of the first circuit board 321, and the second circuit board 331 and the first circuit board 321 can be arranged along a second direction, at least one second receiving cavity in the power conversion device 300 can be a single second receiving cavity, and this single second receiving cavity 313 is arranged along a second direction with the first receiving cavity 312. By setting at least one second receiving cavity as a second receiving cavity, the structure of the housing 310 can be simplified, thereby simplifying the overall cost.

[0068] As yet another example, such as Figure 7As shown, at least one second receiving cavity in the power conversion device 300 can be two second receiving cavities 313, and the two second receiving cavities 313 are respectively located on both sides of the first receiving cavity 312. Specifically, when the second circuit board 331 includes a second input circuit board 338 and a second output circuit board 339, and the second input circuit board 338 and the second output circuit board 339 are located on both sides of the first circuit board 321, at least one second receiving cavity in the power conversion device 300 is two second receiving cavities 313 respectively used to accommodate the second input circuit board 338 and the second output circuit board 339, and the two second receiving cavities 313 are respectively located on both sides of the first receiving cavity 312. By setting at least one second receiving cavity as two second receiving cavities 313 respectively located on both sides of the first receiving cavity 312, it is possible to help achieve the layout of "the power conversion circuit is in the center, and the input filter circuit and the output filter circuit are arranged on both sides", which is beneficial to improving the anti-interference of the filter circuit.

[0069] To ensure the compactness of the aforementioned staggered layout, the size design of the heatsink 340 is crucial. In some embodiments, see... Figure 3 , Figure 4 as well as Figure 7 The end face of the radiator 340 away from the first bottom wall 314 does not exceed the outer end face of the housing corresponding to the second bottom wall 315. In other words, when the radiator 340 is installed on the outer end face of the housing corresponding to the first bottom wall 314, the end face of the radiator 340 away from the first bottom wall 314 (i.e., the bottom end face of the radiator 340 in the z-direction) will not protrude beyond the outer end face of the housing corresponding to the second bottom wall 315, or will only be flush with it. Based on this, it can be seen that the dimension of the radiator 340 in the first direction will not exceed the housing corresponding to the first bottom wall 315. This allows the bottom surface of the housing 310 to remain flat, or the protrusion of the radiator 340 to be limited within the space "reserved" by the shallower portion of the second receiving cavity 311, thereby achieving a compact overall structure in the height direction and avoiding space waste or interference with the mounting surface.

[0070] As mentioned above, the second circuit board 331 can be electrically connected to the first circuit board 321. As one implementation, such as... Figure 3 , Figure 4 as well as Figure 7 As shown, the second circuit board 331 is electrically connected to the first circuit board 321 via a second conductive element 370. The second conductive element 370 can be, for example, a wire, a pin header, or a stud. Of course, the type of the second conductive element 370 is not limited to these and can be changed according to requirements. Electrically connecting the second circuit board 331 to the first circuit board 321 via the second conductive element 370 allows for power current transmission while improving the convenience of installation and maintenance.

[0071] Preferably, the second conductive element 370 may include a stud, which can serve to conduct electricity and / or provide support between the first circuit board 321 and the second circuit board 331. For example, the second conductive element 370 may include both a stud and a wire, with the wire conducting electricity and the stud providing support between the second circuit board 331 and the second circuit board 331. Alternatively, the second conductive element 370 may consist only of a stud, which normally only conducts electricity and does not provide support, but provides auxiliary support when the first conductive element 380 for fixing the second circuit board 331 and / or the fastener 360 for fixing the first circuit board 321 fails. Furthermore, the second conductive element 370 may consist only of a stud, which normally not only conducts electricity but also provides support between the second circuit board 331 and the second circuit board 331.

[0072] As previously described, filter element 332 may include first filter element 336 and second filter element 337. Therefore, in some embodiments, such as... Figures 5-6 As shown, the second conductive element includes a first group of second conductive elements 371 corresponding to the first filter element 336 and a second group of second conductive elements 372 corresponding to the second filter element 337. The number of second conductive elements in the first group of second conductive elements 371 and the number of second conductive elements in the second group of second conductive elements 372 are both at least two.

[0073] In some embodiments, the filtering device 332 includes a filtering capacitor and a filtering inductor. For example, the filtering capacitor may include an X capacitor and / or a Y capacitor. The filtering inductor may include a common-mode inductor for filtering common-mode noise and / or a differential-mode inductor for filtering differential-mode noise.

[0074] As mentioned earlier, the filter circuit includes a filter inductor, which is typically the main heat-generating component. To improve heat dissipation and enhance overall system reliability, in some embodiments, a heat sink can be provided for the filter inductor. The heat sink is usually made of a thermally conductive metal and is shaped to surround the filter inductor. A colloid can also be filled in the gap between the filter inductor and the heat sink; this colloid serves as thermal conductivity and insulation. The colloid can be, for example, silicone rubber or epoxy resin potting compound. The thermally conductive colloid efficiently conducts the heat generated by the filter inductor to the heat sink, while also providing fixation, moisture protection, and insulation for the inductor. The heat sink can be directly fixed to the second circuit board 331 with screws, or its outer surface can contact the inner wall of the housing 310, further transferring heat to the housing 310 for dissipation.

[0075] The power conversion device 300 disclosed herein is particularly suitable as an inverter, such as a photovoltaic grid-connected inverter, for converting direct current generated by photovoltaic modules into alternating current that meets grid requirements. Its compact layout significantly reduces the inverter's thickness, making it easier to install in space-constrained environments and resulting in a more aesthetically pleasing appearance. Simultaneously, excellent EMC and EMI performance ensures compliance with stringent grid connection regulations.

[0076] The assembly method of the power conversion device 300 based on any of the above embodiments may include the following steps. First, the power conversion device is mounted on the first mounting surface 323 of the first circuit board 321, and the filter device 332 is mounted on the second mounting surface 333 of the second circuit board 331. Then, the first circuit board 321 is mounted and fixed to the inner wall of the first bottom wall 314 of the housing 310, ensuring that the first mounting surface 323 faces the bottom of the cavity. Next, the second circuit board 331 is mounted and fixed to the inner wall of the second bottom wall 315 of the housing 310, ensuring that the second mounting surface 333 is opposite to the first mounting surface 323. The corresponding electrical nodes of the first circuit board 321 and the second circuit board 331 are reliably connected using connectors. The heat sink 340 is fixed to the outer wall of the first bottom wall 314. The cover plate 350 of the housing is then mounted.

[0077] In addition, this application embodiment also provides a power supply system, which includes the power conversion device 300 as described above. In the power supply system, the number of power conversion devices 300 can be one or more.

[0078] The above description is merely a preferred embodiment of this disclosure and is not intended to limit the scope of protection of this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

[0079] It should be noted that the elements described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately.

[0080] It should be understood that multiple components and / or parts can be provided by a single integrated component or part. Alternatively, a single integrated component or part can be divided into multiple separate components and / or parts. The use of the public designation "a" or "an" to describe a component or part is not intended to exclude other components or parts.

[0081] It should be understood that although terms such as "first" or "second" may be used in this application to describe various elements, these elements are not defined by these terms, which are only used to distinguish one element from another.

[0082] The scope of protection of this application is not limited to the above embodiments. Any variations or substitutions that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device (300), characterized in that, include: The housing (310) includes a first receiving cavity (312) and at least one second receiving cavity (313). The power conversion circuit (320) includes a first circuit board (321) and a power conversion device (322) fixedly connected to a first mounting surface (323) in the first circuit board (321). The first circuit board (321) is fixedly connected to the first bottom wall (314) of the first receiving cavity (312) by a fastener (360). The first mounting surface (323) faces the first bottom wall (314). The filter circuit (330) includes a second circuit board (331) and a filter component (332) fixedly connected to a second mounting surface (333) in the second circuit board (331). The second circuit board (331) is fixedly connected to the second bottom wall (315) of the second receiving cavity (313) through a first conductive component (380). The second mounting surface (333) is away from the second bottom wall (315). The first bottom wall (314) and the second bottom wall (315) are located on the same side of the housing (310). The first bottom wall (314) is recessed towards the first receiving cavity (312) relative to the second bottom wall (315). The radiator (340) is located on the outside of the housing (310) corresponding to the first bottom wall (314).

2. The power conversion device (300) according to claim 1, characterized in that, The second circuit board is provided with a first connection interface (334) and a second connection interface (335). The filter element (332) includes a first filter element (336) and a second filter element (337). The first filter element (336) is connected to the first connection interface (334) and the first connection interface (334) is used to connect to an input source. The second filter element (337) is connected to the second connection interface (335) and the second connection interface (335) is used to connect to an output source.

3. The power conversion device (300) according to claim 2, characterized in that, The second circuit board (331) includes a second input circuit board (338) and a second output circuit board (339). The first connection interface (334) is disposed on the second input circuit board (338) and the first filter element (336) is located on the second mounting surface (333) of the second input circuit board (338). The second connection interface (335) is disposed on the second output circuit board (339) and the second filter element (337) is located on the second mounting surface (333) of the second output circuit board (339).

4. The power conversion device (300) according to any one of claims 1-3, characterized in that, The second circuit board (331) and the first circuit board (321) are arranged along the second direction.

5. The power conversion device (300) according to claim 3, characterized in that, The second input circuit board (338) and the second output circuit board (339) are located on both sides of the first circuit board (321).

6. The power conversion device (300) according to claim 3, characterized in that, The second input circuit board (338) and the second output circuit board (339) are located on the same side of the first circuit board (321) and the second input circuit board (338) and the second output circuit board (339) are arranged along a third direction.

7. The power conversion device (300) according to claim 4, characterized in that, The at least one second receiving cavity (313) is a second receiving cavity for receiving the second circuit board (331), and the second receiving cavity is arranged along the second direction with the first receiving cavity (312).

8. The power conversion device (300) according to claim 5, characterized in that, The at least one second receiving cavity (313) is two second receiving cavities used to receive the second input circuit board (338) and the second output circuit board (339) respectively, and the two second receiving cavities are located on both sides of the first receiving cavity (312).

9. The power conversion device (300) according to claim 1, characterized in that, The power conversion device (322) includes a power transistor (324) and a capacitor (325). The first bottom wall (314) includes a first bottom wall (314) corresponding to the power transistor (324) and a first bottom wall (314) corresponding to the capacitor (325). The first bottom wall (314) corresponding to the power transistor (324) is recessed toward the first circuit board (321) relative to the first bottom wall (314) corresponding to the capacitor (325).

10. The power conversion device (300) according to claim 1, characterized in that, The end face of the radiator (340) away from the first bottom wall (314) does not exceed the outer end face of the housing (310) corresponding to the second bottom wall (315).

11. The power conversion device (300) according to claim 1, characterized in that, The first circuit board (321) and the second circuit board (331) are connected by a second conductive element (370).

12. The power conversion device (300) according to claim 11, characterized in that, The second conductive element (370) includes a stud.

13. The power conversion device (300) according to claim 11, characterized in that, The filter element (332) includes a first filter element (336) and a second filter element (337). The second conductive element (370) includes a first group of second conductive elements (371) corresponding to the first filter element (336) and a second group of second conductive elements (372) corresponding to the second filter element (337). The number of second conductive elements (370) in the first group of second conductive elements (371) and the number of second conductive elements (370) in the second group of second conductive elements (372) are both at least two.

14. The power conversion device (300) according to claim 1, characterized in that, The first conductive element (380) is a stud.

15. The power conversion device (300) according to claim 14, characterized in that, The length of the first conductive element (380) ranges from 0.3cm to 3cm.

16. The power conversion device (300) according to claim 1, characterized in that, The power conversion device (300) is an inverter.

17. A power supply system, characterized in that, Includes the power conversion device (300) as described in any one of claims 1-16.

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