Legume flour dough compositions and methods of providing cooked food products using the same

Abstract

The present disclosure generally relates to a dough composition comprising one or more pulse flours present in a total amount ranging from 40 to 70 wt% based on the weight of the dough composition; a film-forming starch present in an amount ranging from 5 to 20 wt% based on the weight of the dough composition, the film-forming starch having a amylopectin content of at least 80 wt%, a RVA final viscosity of no more than 900 centipoise after 1 hour at 25°C, and a RVA peak to breakdown time of no more than 500 s at 25°C; one or more oils or fats present in a total amount ranging from 5 to 30 wt% based on the weight of the dough composition; and water present in an amount ranging from 10 to 40 wt% based on the weight of the dough composition.

Description

1. Technical Field This disclosure generally relates to dough compositions, methods of their preparation, and methods of their use. 2. Background Technology In recent years, both the healthy eating and special diet segments within the baking and snack categories have seen growth. This includes increased interest in allergy-friendly foods, particularly gluten-free options. One way to offer gluten-free baked goods and snacks is to replace regular wheat flour in the dough with gluten-free flour.

[0003] Many gluten-free flours lack the viscoelasticity of wheat flour; in fact, the gluten in wheat flour is the primary cause of these viscoelastic properties. This makes it difficult to form a sticky, pliable, and non-sticky dough from gluten-free flour, and therefore, gluten-free dough can be particularly difficult to process into baked goods and snacks. This is especially true for the sheeting process used to make thin sheets for products such as crackers.

[0004] Therefore, there is a need in the art for improved dough compositions to provide gluten-free baked goods and snacks. Summary of the Invention

[0005] In one aspect, this disclosure provides a dough composition comprising: One or more legume flours, present in a total amount ranging from 40 to 70% by weight based on the weight of the dough composition; Film-forming starch, present in an amount ranging from 5-20% by weight based on the weight of the dough composition, has the following properties: At least 80% by weight of amylopectin content, The final RVA viscosity, not exceeding 900 centipoise, after 1 hour at 25°C, and At 25°C, the time from the RVA peak to disintegration is no more than 500 s. One or more oils or fats, present in a total amount ranging from 5-30% by weight based on the weight of the dough composition; and Water is present in an amount ranging from 10 to 40% by weight based on the weight of the dough composition.

[0006] Another aspect of this disclosure provides a method for preparing (e.g., as described herein) a dough composition. The method includes: Combining one or more types of bean flour and film-forming starch to provide a dry mixture; The dry mixture is combined with one or more oils or fats to provide a dough precursor; and The raw dough precursor is mixed with water to provide a dough composition.

[0007] Another aspect of this disclosure provides a dough composition prepared by the methods described herein.

[0008] Another aspect of this disclosure provides a method for providing baked food products using (e.g., as described herein) a raw dough composition. The method includes: Provide a dough composition (e.g., by preparing a dough composition as described herein); Shape the raw dough composition into the desired shape; and The raw dough composition is baked to provide a baked food product. Attached Figure Description

[0009] The accompanying drawings are included to provide a further understanding of the methods and composition of this disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments of this disclosure and, together with the description, serve to explain the principles and operation of this disclosure.

[0010] Figure 1 This is a schematic diagram of the pattern used for the textural analysis of the dough composition described in this article.

[0011] Figure 2 This is a structural analysis diagram of the dough composition described in this article.

[0012] Figure 3 This is a compression and viscosity diagram of the dough composition described in this article.

[0013] Figure 4 This is a graph showing the average stack height of baked goods made from the dough composition described in this article.

[0014] Figure 5A These are sensory results of baked products made from the dough composition described in this article.

[0015] Figure 5B This is an image of a baked product made from the dough composition described in this article.

[0016] Figure 6 This is a graph showing the dough elasticity of the dough composition described in this article relative to baking expansion. Detailed Implementation

[0017] This disclosure relates to dough, methods of its preparation and use, and baked goods products prepared from the dough. As mentioned above, gluten-free dough lacks the cohesiveness, flexibility, and non-stickiness common to wheat-based dough, which is important for forming baked goods products. Soft, flexible, and non-sticky dough is desirable for easier machinability, higher levels of baking rise, and a crisp texture.

[0018] The inventors have noted that legume flours are particularly useful in the preparation of gluten-free foods. For example, chickpea flour is a non-networked flour that tends to provide short-textured doughs that are pasty, sticky, and of low strength. Such doughs typically cannot be well sheeted using conventional equipment. Additionally, chickpea flour typically has low water holding capacity when it has a fine particle size and low protein content (e.g., <15%). Many other legume flours exhibit similar disadvantages in dough processing, especially if the flour has a fine particle size. Therefore, the inventors have determined that developing baked goods and snacks based on legume flours requires different approaches to provide the desired dough texture and enable more robust manufacturing processes.

[0019] Here, the inventors have discovered a dough composition that deviates from typical gluten-free dough rheology to provide a soft, pliable, and non-sticky dough. In particular, the inventors have found that using a relatively high oil content in conjunction with film-forming starch can improve the pliability and sheetability of legume-based doughs (e.g., non-gluten-free doughs). This dough can provide an expanded, light, and crunchy texture in the finished product.

[0020] Therefore, in one aspect, this disclosure provides a dough composition comprising one or more bean flours present in a total amount ranging from 40 to 70% by weight based on the weight of the dough composition; film-forming starch present in an amount ranging from 5 to 20% by weight based on the weight of the dough composition; one or more oils or fats present in a total amount ranging from 5 to 30% by weight based on the weight of the dough composition; and water present in an amount ranging from 10 to 50% by weight based on the weight of the dough composition.

[0021] As used herein, the amount of material in the dough composition does not include inclusions, i.e., larger particulate materials such as seeds, nuts, fruits, and chocolate chips. As used herein, inclusions are materials having a particle size of at least 300 micrometers, at least 400 micrometers, or at least 500 micrometers (i.e., other than bean flour or other materials specifically mentioned herein).

[0022] While many gluten-free flours are available, the inventors have found that bean flour is particularly useful in the dough compositions described herein. As those skilled in the art will understand, finely ground bean flour has a low water capacity (i.e., regardless of protein content), which can result in a sticky dough when water is added. Advantageously, the inventors have found that adding a relatively large amount of oil or fat and a relatively small amount of water can overcome the low water holding capacity typically associated with bean flour.

[0023] One or more bean flours used in the dough composition may be selected from a variety of bean flours known in the art. For example, in the various embodiments described herein, one or more bean flours include (or are) one or more pulse flours. For example, in various particularly desirable embodiments, one or more bean flours include (or are) chickpea flour. However, other bean flours, such as pea flour and lentil flour, may be used in addition to chickpea flour, or used in place of chickpea flour.

[0024] Besides bean flour (or even a substitute for bean flour), a variety of other bean flours can be used. For example, in various embodiments, one or more bean flours include one or more of peanut flour and cashew flour. In various embodiments, the one or more bean flours include one or more bean flours. For example, in some embodiments, one or more bean flours include (or are) soybean flour. However, the inventors have discovered that excellent dough compositions can be prepared without using large amounts of soy flour. In various embodiments, the dough composition contains no more than 10% by weight of soy flour, for example, no more than 5% by weight of soy flour. In some embodiments, the dough composition does not contain soy flour.

[0025] In some embodiments described herein, the soybean flour used in the dough composition has a fine particle size. In some embodiments as described herein, the soybean flour has a particle size in the range of 1-50 micrometers. 50 Granularity. As used in this article, d 50 The particle size is a median particle size, meaning that, as measured by laser diffraction, 50% of the particles have a larger particle size and 50% have a smaller particle size. In the various embodiments described herein, the bean flour has a di in the range of 5-50 micrometers, or 10-50 micrometers, or 1-35 micrometers, or 5-35 micrometers, or 10-35 micrometers. 50 Particle size. In the various embodiments described herein, the bean flour has a particle size in the range of 1-30 micrometers, for example 5-30 micrometers, 10-30 micrometers, or 1-25 micrometers, or 5-25 micrometers, or 10-25 micrometers.50 Particle size. The inventors discovered that small-particle flours, such as those described herein, can be particularly difficult to treat as sticky dough due to their hydration and water retention mechanisms. Therefore, using a relatively high amount of oil / fat and a relatively low amount of water, as described herein, is particularly useful for these types of flours.

[0026] In some embodiments as described herein, in addition to having a relatively fine particle size, bean flour also has a relatively narrow particle size distribution. In various embodiments, the d of bean flour... 10 The value is d 50 At least 15% of the value, for example, d 50 At least 15% of the value, or d 50 The value is at least 20%. In various embodiments, the d of bean flour 90 The value does not exceed d 50 10 times the value, for example, no more than d 50 7 times the value, or not exceeding d 50 Five times the value.

[0027] Of course, those skilled in the art will understand that large-particle-size bean flour may alternatively find beneficial uses in the dough compositions disclosed herein.

[0028] In various embodiments, the legume flour used in the compositions of this disclosure has a relatively low fat content. For example, in various embodiments, one or more legume flours have a total oil / fat content of no more than 7% by weight, such as no more than 5% by weight, or no more than 3% by weight.

[0029] As described above, one or more bean flours are present in the dough composition in a total amount ranging from 40-70% by weight based on the weight of the dough composition. For example, in various embodiments described herein, one or more bean flours are present in a total amount ranging from 40-65% by weight, or 40-60% by weight, or 40-55% by weight, or 40-50% by weight based on the weight of the dough composition. In various embodiments, one or more bean flours are present in a total amount ranging from 45-70% by weight, or 45-65% by weight, or 45-60% by weight, or 45-55% by weight, or 45-50% by weight based on the weight of the dough composition. In some embodiments described herein, one or more bean flours are present in a total amount ranging from 50-70% by weight based on the weight of the dough composition. For example, in various embodiments, one or more bean flours are present in a total amount ranging from 50-65% by weight, or 50-60% by weight, or 50-55% by weight based on the weight of the dough composition.

[0030] The inventors have determined that chickpea flour is a particularly desirable legume flour for use in the compositions described herein. Therefore, in various embodiments as further described herein, chickpea flour is present in a total amount ranging from 25-65% by weight (e.g., 25-60% by weight, or 25-55% by weight, or 25-50% by weight) based on the weight of the dough composition. In various embodiments, chickpea flour is present in a total amount ranging from 40-70% by weight (e.g., 40-65% by weight, or 40-60% by weight, or 40-55% by weight, or 40-50% by weight) based on the weight of the dough composition. In various embodiments, chickpea flour is present in a total amount ranging from 50-70% by weight (e.g., 50-65% by weight, or 50-60% by weight, or 50-55% by weight) based on the weight of the dough composition.

[0031] Film-forming starch components provide improved viscoelastic properties to dough compositions. As understood by those skilled in the art, many gluten-free flours (such as those based on beans) are non-network-forming flours. Therefore, when water is added to these flours, the resulting dough lacks cohesion and elasticity. To provide better viscoelastic properties to dough compositions and to compensate for the non-network-forming properties of bean flour, the inventors found that including film-forming starch in the dough composition is particularly advantageous. Film-forming starch rapidly absorbs water and then breaks down, and as the starch breaks down, it provides greater extensibility and elasticity to the dough. This helps to form an extended network of materials to provide binding properties to the dough, similar to the function of gluten in wheat flour-based doughs.

[0032] As used herein, “film-forming starch” is a starch that meets three criteria: an amylopectin content of at least 80% by weight, an RVA peak-and-breakdown time of no more than 500 s at 25°C, and an RVA final viscosity of no more than 900 centipoise after 1 hour at 25°C. If a starch meets these three requirements, it is considered a “film-forming starch” for the purposes of this disclosure.

[0033] The film-forming starch used in the compositions of this disclosure has an amylopectin content of at least 80% by weight. Those skilled in the art will understand that amylopectin content is quantified as a percentage of total starch sugars in the “starch” material, and therefore excludes any protein or water present. For example, in various embodiments, the film-forming starch has an amylopectin content of at least 85% by weight, such as at least 90% by weight. In various embodiments, the film-forming starch has an amylopectin content of at least 95% by weight, such as at least 99% by weight. Not wishing to be bound by theory, the inventors speculate that the high branching of amylopectin helps to support air cell formation and expansion during baking by increasing plastic deformation.

[0034] The film-forming starch used in the compositions of this disclosure has a final RVA viscosity of no more than 900 centipoise after 1 hour at 25°C. The final RVA viscosity was measured using a Rapid ViscoAnalyzer (RVA) at a stirring rate of 160 rpm using a starch slurry containing 5 wt% starch solids in 1,3-propanediol and a pH 6.5 phosphate buffer containing 1 wt% NaCl. The slurry was prepared by mixing 1.6 g of starch (dry solids) with 4.5 g of 1,3-propanediol in an RVA cup and stirring until smooth and lump-free. A pH 6.5 phosphate buffer containing 1 wt% NaCl was added to provide 32 g of total mass, and the RVA test was started immediately; the temperature was kept constant at 25°C, and the stirring rate of the RVA instrument was 160 rpm. Viscosity was monitored continuously, and the viscosity value after one hour was the final RVA viscosity. In various embodiments, the film-forming starch has a final RVA viscosity of no more than 800 centipoise, for example, no more than 750 centipoise or no more than 700 centipoise, after 1 hour at 25°C. In various embodiments, the film-forming starch has a final RVA viscosity of no more than 650 centipoise, for example, no more than 600 centipoise, after 1 hour at 25°C. In various embodiments, the film-forming starch has a final RVA viscosity of no more than 550 centipoise, for example, no more than 500 centipoise, after 1 hour at 25°C. However, it may be desirable for the film-forming starch to have a certain residual viscosity. Therefore, in various embodiments, the final RVA viscosity of the film-forming starch after 1 hour at 25°C is at least 25 centipoise, for example, at least 50 centipoise. In various embodiments, the final RVA viscosity of the film-forming starch after 1 hour at 25°C is at least 75 centipoise, for example, at least 100 centipoise.

[0035] Furthermore, the film-forming starch used in the compositions of this disclosure also has an RVA peak-to-disintegration time of no more than 500 s at 25°C. As those skilled in the art will understand, in an RVA test, many starches will have a viscosity peak followed by viscosity disintegration. In the film-forming starch of this invention having such a peak, the "peak-to-disintegration time" is the time it takes to reach the peak viscosity in an RVA test. In the case of no peak, but rather a substantially constant viscosity or a substantially monotonically decreasing viscosity, the peak-to-disintegration time is considered to be zero seconds.

[0036] Therefore, the film-forming starch suitable for the dough compositions described herein can be fully hydrated in the dough without requiring maturation within the dough itself. Various types of starch can be used. In various embodiments, the film-forming starch is pregelatinized starch. In other embodiments, the film-forming starch is cold-water-swelling starch.

[0037] Starch materials can also be characterized by their solubility and sedimentation volume, each determined at 25°C. As used herein, sedimentation volume is the volume occupied by 1 g of starch in 100 g (i.e., total volume, including starch) of a salt buffer solution (1% sodium chloride in a phosphate buffer solution at pH 6.5, containing ~2% by weight 1,3-propanediol). This value is also referred to in the art as “swelling volume.” The sedimentation volume of starch described herein was determined by mixing 5 g (dry solids) of starch with 10 g of 1,3-propanediol, and then adding a phosphate buffer solution at pH 6.5 containing 1% by weight sodium chloride to bring the total mass to 102 g. The mixture was stirred with a glass rod for 6 minutes at room temperature, and then allowed to stand for another 20 minutes at room temperature. 20 g of the resulting paste was added to a total volume of 100 mL with a phosphate buffer solution at pH 6.5 containing 1% by weight sodium chloride, and the mixture was sealed. After 24 hours, at 25°C, the volume occupied by the starch precipitate (i.e., as read in the graduated cylinder) is the sedimentation volume of 1 g of starch, expressed in mL / g. The amount of soluble starch was quantified by taking 30 mL of this supernatant and adjusting it to pH 0.09 with concentrated HCl, then autoclaving it at 121°C for 15 minutes. After cooling, the solution was adjusted to pH 6.3 with concentrated NaOH, and then brought to a final volume of 50 mL with pH 6.5 phosphate buffer. The concentration of dextrose in the solution was measured, for example, using an instrumental analyzer such as a glucose analyzer provided by YSI Inc. The dextrose concentration in the supernatant can be algebraically converted to the percentage of starch solubles (i.e., by weight).

[0038] In various embodiments, the film-forming starch has a soluble percentage of at least 20% by weight, for example, at least 40% by weight or at least 60% by weight. In the various embodiments described herein, the sedimentation volume of the film-forming starch is at least 50 mL / g, at least 55 mL / g, or at least 60 mL / g. In various embodiments, the sum of the soluble percentage (in weight%) and sedimentation volume (in mL / g) of the film-forming starch is at least 50, for example, at least 55 or at least 60. Of course, other values ​​of these parameters are also suitable in various cases.

[0039] There are no particular limitations on the source of the film-forming starch, and many film-forming starches known to those skilled in the art would be acceptable for use therein. For example, film-forming starch can be produced from waxy corn, potatoes, or cassava. In some embodiments as described herein, the film-forming starch is produced from corn (e.g., waxy corn).

[0040] Film-forming starches can possess a variety of other properties. For example, various chemical modifications may be required to impart specific properties to the starch. Examples of chemical modifications include, for example, acid modification (which can reduce viscosity); bleaching, oxidation, chemical inhibition, such as with phosphates or adipates; and substitution via acetylation, hydroxypropylation, hydroxyethylation, octenyl succinate, and carboxymethylation. The inventors note that in many cases, such chemical modifications are not necessary, and the film-forming starch used in the products and methods described herein can be so-called clean-label starch. For example, certain physical methods can be used to inhibit starch, although in this case, a low degree of inhibition is desired to maintain swelling properties.

[0041] A variety of film-forming starches are suitable for the compositions and methods disclosed herein. Examples include starches sold under the model numbers MERIGEL 300; MERIGEL 301; X-PAND'R; X-PAND'R 305 NG; X-PAND'R 612; X-PAND'R 683; and X-PAND'R SC, all of which are available from Tate & Lyle Solutions USA LLC.

[0042] As described above, the dough composition includes 5-20% by weight of film-forming starch based on the weight of the dough composition. For example, in the various embodiments described herein, the amount of film-forming starch present is 5-15% by weight, or 5-10% by weight, or 10-20% by weight, or 10-15% by weight based on the weight of the dough composition.

[0043] The dough composition also includes one or more oils or fats. As mentioned above, the use of oils or fats can help provide a soft, non-sticky dough. As used herein, oils are fatty acid glycerides that are at least 50% by weight liquid at 23°C, while fats are fatty acid glycerides that are less than 50% by weight liquid at 23°C. In some embodiments described herein, one or more oils or fats comprise one or more oils. In some embodiments described herein, one or more oils or fats are one or more oils. The one or more fats can be selected from a variety of non-animal-based oils or fats. For example, in some embodiments described herein, one or more oils or fats are independently selected from rapeseed oil, soybean oil, grapeseed oil, flaxseed oil, vegetable oil, corn oil, sunflower oil, safflower oil, olive oil, avocado oil, and peanut oil. In some embodiments described herein, one or more oils or fats are rapeseed oil or vegetable oil. In some embodiments described herein, the dough composition includes one oil or fat. In some embodiments in which the dough composition includes one oil or fat, the oil or fat may be canola oil. In other embodiments described herein, the dough composition includes at least two oils or fats. In various embodiments as further described herein, one or more oils or fats are one or more oils that are at least 50% by weight liquid at 23°C, or even materials that are substantially entirely liquid at 23°C.

[0044] As described above, one or more oils or fats are present in the dough composition in a total amount ranging from 5 to 30% by weight based on the weight of the dough composition. For example, in some embodiments described herein, one or more oils or fats are present in a total amount ranging from 5 to 25% by weight, 5 to 20% by weight, or 5 to 14% by weight based on the weight of the dough composition. In various embodiments described herein, one or more oils or fats are present in a total amount ranging from 10 to 30% by weight, 10 to 25% by weight, 10 to 20% by weight, or 10 to 14% by weight based on the weight of the dough composition. In various embodiments described herein, one or more oils or fats are present in a total amount ranging from 14 to 30% by weight, 14 to 25% by weight, or 14 to 20% by weight based on the weight of the dough composition. In various embodiments described herein, one or more oils or fats are present in a total amount ranging from 20 to 30% by weight based on the weight of the dough composition (e.g., 20 to 25% by weight, or 25 to 30% by weight).

[0045] The dough compositions described herein also include water. The inventors have noted that one or more oils or fats can provide a significant amount of the desired texture to the dough, and therefore require relatively little water to provide elasticity. The inventors have noted that the use of relatively little water is particularly desirable because of the significant amount of bean flour present; bean flour readily provides a sticky dough with excess water. “Water” is calculated as the amount of water added as water itself, plus water present in other components such as milk and other dairy products, eggs, and syrups.

[0046] Within these guidelines, there are no particular limitations on the amount of water used, and it can be added in an amount sufficient to provide the desired texture of the dough. As described above, the dough composition includes water present in an amount ranging from 10 to 40% by weight based on the weight of the dough composition. For example, in the various embodiments described herein, water is present in an amount ranging from 20 to 40% by weight, or 25 to 40% by weight based on the weight of the dough composition. In some embodiments described herein, water is present in an amount ranging from 10 to 35% by weight (e.g., 15 to 35% by weight, or 20 to 35% by weight, or 25 to 35% by weight) based on the weight of the dough composition. In some embodiments described herein, water is present in an amount ranging from 10 to 40% by weight (e.g., 15 to 40% by weight, or 20 to 40% by weight, or 25 to 40% by weight) based on the weight of the dough composition. In some embodiments as described herein, water is present in an amount ranging from 10 to 35% by weight (e.g., 15 to 35% by weight, or 20 to 35% by weight, or 25 to 35% by weight) based on the weight of the dough composition.

[0047] In some embodiments, film-forming starch and one or more bean flours are present in the dough composition at a weight ratio of at least 0.1:1. For example, in various embodiments, film-forming starch and one or more bean flours are present at a weight ratio of at least 0.15:1 or at least 0.2:1. In some embodiments as described herein, film-forming starch and one or more bean flours are present at a weight ratio ranging from 0.1:1 to 0.3:1. For example, in various embodiments, film-forming starch and one or more bean flours are present at a weight ratio ranging from 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1, or 0.15:1 to 0.3:1, or 0.15:1 to 0.25:1, or 0.15:1 to 0.20:1, or 0.2:1 to 0.3:1.

[0048] In some embodiments, one or more oils or fats and one or more bean flours are present in a weight ratio of at least 0.05:1 or at least 0.1:1. For example, in the various embodiments described herein, one or more oils or fats and one or more bean flours are present in a weight ratio ranging from 0.05:1 to 0.3:1, or 0.05:1 to 0.25:1, or 0.05:1 to 0.2:1, or 0.1:1 to 0.3:1, or 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1.

[0049] In some embodiments as described herein, water and one or more bean flours are present in a weight ratio of at least 0.4:1, at least 0.5:1, or at least 0.6:1. For example, in various embodiments as described herein, water and one or more bean flours are present in a weight ratio ranging from 0.4:1 to 0.7:1, or 0.4:1 to 0.6:1, or 0.5:1 to 0.7:1, or 0.5:1 to 0.6:1.

[0050] In some embodiments of this disclosure as described herein, the dough composition further comprises an emulsifier. In some embodiments described herein, the emulsifier has a hydrophilic-lipophilic balance (HLB) ratio of at least 3 (e.g., at least 5 or at least 7). As understood by those skilled in the art, the HLB ratio is a measure of the balance between the hydrophilic and hydrophobic properties of an emulsifier, with higher values ​​corresponding to hydrophilic compounds and lower values ​​corresponding to hydrophobic compounds. In some embodiments, the emulsifier has an HLB ratio in the range of 1-7, and in various embodiments described herein, the emulsifier has an HLB ratio of 2-7, or 3-7, or 1-6, or 2-6, or 3-6, or 1-5, or 2-5, or 3-5. In some embodiments described herein, the emulsifier comprises lecithin. For example, in some embodiments, the emulsifier comprises sunflower lecithin, soybean lecithin, or egg lecithin. In some embodiments described herein, the emulsifier is a lecithin selected from sunflower lecithin, soybean lecithin, or egg lecithin. In some embodiments of this disclosure, the emulsifier comprises soy lecithin. In some embodiments as described herein, the emulsifier is soy lecithin. In various embodiments described herein, the emulsifier may be present in a mass ratio of emulsifier to one or more oils or fats in the range of 1:50-1:10, 1:40-1:10, 1:30-1:10, 1:50-1:15, 1:40-1:15, 1:30-1:15, 1:50-1:20, 1:40-1:20, or 1:30-1:20.

[0051] In some embodiments described herein, the dough composition further comprises one or more gluten-free non-leguminous flours. For example, in some embodiments described herein, one or more gluten-free non-leguminous flours are each independently selected from potato flour, corn flour, rice flour, sorghum flour, buckwheat flour, oat flour, quinoa flour, teff flour, amaranth flour, cassava flour, and arrowroot flour. In some embodiments, one or more gluten-free non-leguminous flours are present in the raw dough composition in a total amount not exceeding 20% ​​by weight based on the weight of the dry dough composition. For example, in various embodiments, one or more gluten-free non-leguminous flours are present in the dough composition in a total amount not exceeding 15% by weight, or not exceeding 10% by weight, or not exceeding 5% by weight based on the weight of the dough composition.

[0052] In some embodiments as described herein, the dough composition is a gluten-free dough composition (i.e., substantially gluten-free). Therefore, in some embodiments, the dough composition does not include a significant amount (e.g., or any amount) of gluten-containing components. For example, in various embodiments, the dough composition contains no more than 1% by weight of gluten on a dry solids basis, such as no more than 0.5% by weight or no more than 0.25% by weight of gluten on a dry solids basis.

[0053] In some embodiments described herein, the dough composition further comprises an effective amount of a leavening agent. The leavening agent may be selected from a variety of leavening agents known in the art. In some embodiments, the leavening agent includes a chemical leavening agent. For example, a chemical leavening agent may be selected from bicarbonates, such as sodium bicarbonate, potassium bicarbonate, or ammonium bicarbonate. In some embodiments, the leavening agent is a chemical leavening agent, such as a bicarbonate, such as sodium bicarbonate, potassium bicarbonate, or ammonium bicarbonate. In some embodiments, the leavening agent further comprises one or more acids. For example, in some embodiments, the leavening agent further comprises tartaric acid, monocalcium phosphate, or sodium aluminum sulfate. In other embodiments, the leavening agent comprises yeast. For example, in some embodiments described herein, the leavening agent is yeast. In various embodiments described herein, the leavening agent is present in an effective amount not exceeding 1% by weight, not exceeding 0.6% by weight, or not exceeding 0.4% by weight, based on the weight of the dough composition. In other embodiments described herein, the dough composition is substantially yeast-free.

[0054] In some embodiments as described herein, the dough composition further comprises sodium chloride. For example, in various embodiments described herein, sodium chloride is present in an amount ranging from up to 3% by weight, up to 2.5% by weight, up to 2% by weight, or up to 1.5% by weight based on the weight of the dough composition.

[0055] In some embodiments described herein, the dough composition further comprises one or more additional components. For example, the dough composition may further comprise stabilizing additives, pH balancing additives, viscosity modifiers, and flavor additives.

[0056] In some embodiments described herein, one or more bean flours, film-forming starches, one or more oils or fats, water, emulsifiers (if present), leavening agents (if present), and salt (if present) constitute at least 90% by weight of the dough composition. For example, in various embodiments described herein, one or more bean flours, film-forming starches, one or more oils or fats, water, emulsifiers (if present), leavening agents (if present), and salt (if present) constitute at least 95% by weight, or at least 98% by weight, or at least 99% by weight of the dough composition.

[0057] As mentioned above, one of the ideal properties of a dough composition is to provide a soft dough that is easily processed. The softness / firmness of the dough compositions described herein can be quantified by the total compression work of the dough. As used herein, the total compression work of the dough is determined according to the Miller Dough Test, as described in the following examples. In some embodiments described herein, the dough composition has a firmness measured by the total compression work, wherein the total compression work is at least 5000 g·mm. For example, in various embodiments, the dough composition has a firmness measured by the total compression work, wherein the total compression work is in the range of 5000 to 15000 g·mm, or 5000 to 10000 g·mm, or 5000 to 7500 g·mm, or 5500 to 15000 g·mm, or 5500 to 10000 g·mm, or 5500 to 7500 g·mm.

[0058] In addition to providing a soft dough, the dough compositions described herein are also non-sticky. The non-stickiness / adhesion of the dough compositions described herein can be quantified by the total adhesive work of the dough. As used herein, the total adhesive work of the dough is also measured according to the Miller dough test described in the following examples. In some embodiments as described herein, the dough composition has viscous properties measured by total adhesive work, wherein the total adhesive work is at least -5000 g·mm. For example, in various embodiments, the dough composition has viscous properties measured by total adhesive work, wherein the total adhesive work is in the range of -5000 to -1000 g·mm, or -4500 to -1000 g·mm, or -4000 to -1000 g·mm, or -5000 to -1500 g·mm, or -4500 to -1500 g·mm, or -4000 to -1500 g·mm.

[0059] The dough composition described herein also expands during baking to provide a light and crisp texture to the baked product. In some embodiments described herein, when sheeted to 1.10 mm and baked in a combined radiant convection oven with the following procedure, the dough composition expands to at least twice (e.g., at least three times, or at least four times) its unbaked height: at 150°C for 2 minutes; linearly ramping to 225°C over 2 minutes; and at 225°C for 2 minutes. For example, in various embodiments, when sheeted to 1.10 mm as described above and baked, the dough composition expands to 2 to 5 times (e.g., 3 to 5 times, or 2 to 4 times, or 3 to 4 times) its unbaked height. In some embodiments described herein, when sheeted to 1.10 mm and baked as described above, the dough composition exhibits a high perception of crispiness.

[0060] Another aspect of this disclosure provides a method for preparing a dough composition, such as the dough composition described herein. The method includes combining one or more legume flours and film-forming starches to provide a dry mixture; combining the dry mixture with one or more oils or fats to provide a dough precursor; and mixing the dough precursor with water to provide a dough composition. One or more legume flours, film-forming starches, one or more oils or fats, and water may be used as described herein with respect to the dough composition. Those skilled in the art can use conventional dough preparation techniques to provide the dough of this disclosure.

[0061] As described above, this method requires mixing one or more types of bean flour and film-forming starch to provide a dry mixture. The dry mixture may also include any other dry components, such as salt, seasonings, flavorings, or leavening agents. The dry mixture can be mixed until substantially homogeneous.

[0062] The method also includes combining the dry mixture with one or more oils or fats to provide a dough precursor. In some embodiments, combining the dry mixture with one or more oils or fats includes adding one or more oils or fats to the dry mixture while mixing the dry mixture. In some embodiments, combining the dry mixture with one or more oils or fats includes mixing until the dry mixture and one or more oils or fats are uniformly incorporated.

[0063] The method also includes mixing a dough precursor with water to provide a dough composition. In some embodiments, combining the dough precursor with water includes adding water to the dough precursor while mixing it. In some embodiments, combining the dough precursor with water includes mixing until the dough precursor and water are uniformly incorporated.

[0064] As will be understood by those skilled in the art, additional additives (e.g., leavening agents, sodium chloride, stabilizers, pH balancing agents, viscosity modifiers, or flavoring additives) may be added at appropriate times. Furthermore, the dough composition may be combined with one or more inclusions, such as seeds, nuts, or fruits; these become part of the shaped and cooked dough composition, but as stated above, they are not used to calculate the weight proportions of the various materials in the dough composition itself.

[0065] As described above, this method provides a dough composition. In some embodiments, the dough composition is as described herein. Therefore, another aspect of this disclosure provides a dough composition prepared by the method described herein.

[0066] Another aspect of this disclosure provides a method for providing a cooked food product using (e.g., as described herein) a raw dough composition. The method includes providing a raw dough composition; shaping the raw dough composition into a desired shape; and cooking (e.g., by baking) the raw dough composition to provide the cooked food product. In some embodiments described herein, providing the raw dough composition is achieved by preparing the raw dough composition described herein.

[0067] As described above, the method includes shaping a raw dough composition into a desired shape. In some embodiments, shaping the raw dough composition includes rolling, sheeting, folding, stamping, and / or cutting the raw dough composition. In some embodiments as described herein, the desired shape is sheet-like. For example, the desired shape may be a rectangular sheet, a square sheet, a triangular sheet, an oval sheet, or a circular sheet. As those skilled in the art will understand, the sheet has a height that is smaller than the length and width of the shape. However, the length and width are not particularly limited. Here, those skilled in the art can also use various conventional techniques to shape the raw dough composition.

[0068] The method also includes cooking the dough composition. In some embodiments, cooking the dough composition includes heating the dough at a temperature for a sufficient time (e.g., fully) to cook it. Cooking can be, for example, baking. In various embodiments described herein, baking is performed at a temperature in the range of 100-250°C, 150-250°C, or 200-250°C, and in some embodiments, baking is performed for at least 2 minutes (e.g., at least 3 minutes). For example, in various embodiments described herein, baking is performed for a time in the range of 2-20 minutes, 2-10 minutes, 2-5 minutes, 3-20 minutes, 3-10 minutes, or 3-5 minutes. Of course, those skilled in the art will understand that other cooking techniques, such as frying, can be used to cook the shaped dough composition, and that conventional techniques can be used to cook the dough.

[0069] The cooked food products described herein can take many forms. In some embodiments described herein, the baked food products are crackers, pastries, biscuits, pie crusts, baked pizza dough, or pretzels. For example, in some embodiments described herein, the baked food is a cracker.

[0070] Another aspect of this disclosure is a cooked food product comprising cooked dough as a cooked food product of the raw dough composition described herein.

[0071] Example The following examples illustrate specific embodiments of the compositions and methods of this disclosure and their various uses. They are presented for illustrative purposes only and should not be considered as limiting the scope of this disclosure.

[0072] Example 1. Preparation of raw dough Several types of soybean flour-based doughs described herein were prepared, and their firmness and stickiness were evaluated. To prepare the doughs, flour, starch, and other small amounts of dry ingredients were added to a mixing bowl. Then, oil and lecithin were added to the mixing bowl and mixed with the dry ingredients at low speed for 30 seconds using a Hobart A120 planetary mixer with a flat mixer. An aqueous solution of ammonium bicarbonate was then added to the mixer, and mixing was continued at low speed for 120 seconds and then at medium speed for 90 seconds. The prepared dough compositions are detailed in the table below.

[0073] Table 1

[0074] In Table 1, the chickpea flour used in all compositions is ARTESA 10 chickpea flour from Tate & Lyle, except for composition 5, which uses a different chickpea flour. The film-forming starch used in all compositions is XPANDR 612 starch from Tate & Lyle, which has a final RVA viscosity of approximately 249 centipoise after 1 hour at 25°C, an RVA peak-to-disintegration time of approximately 150 s at 25°C, and an amylopectin content of 95-100% by weight. It is approximately 100% soluble.

[0075] Example 2. Characterization of raw dough The dough composition of Example 1 was examined to quantify the firmness and stickiness of the dough. These qualities were determined using a Stable MicroSystems TA-85 texture analyzer and a Miller Short Dough Test. The analyzer settings used for the test are described in Table 2.

[0076] Table 2

[0077] use Figure 1 The pattern shown involves measuring each dough sample three times to avoid edge effects.

[0078] The results of the texture analysis are shown in Figure 2 and Figure 3 In. Figure 2 The figure shows the trajectory of the resistance of the dough composition over time. Positive peaks correspond to firmness and can be quantified as the positive area of ​​the curve (i.e., compression work). Negative peaks correspond to the stickiness of the dough and can be quantified as the negative area of ​​the curve (i.e., adhesion work). Figure 3 Showing by Figure 2 The total compressive work and total adhesive work are calculated from the curves.

[0079] Texture analysis revealed that small adjustments had a greater effect when starting with firm, stiff dough, while large adjustments had a significantly reduced effect on already soft, stretchy dough. A greater effect was observed in the differences between dough compositions 1 and 2, but much smaller effects were observed between dough compositions 2, 3, 6, and even 7.

[0080] The effect of lecithin was more significant than expected. The same dough prepared with and without lecithin (dough composition 3) behaved quite differently. Dough without lecithin was stiffer (peak and compression work) and stickier (adhesion work) than dough with lecithin. Not bound by theory, the inventors believe that lecithin provides a better and more uniform oil distribution. Soy lecithin has a low HLB value and is inherently more lipophilic; however, the inventors believe that improved performance can be obtained by using emulsifiers with much higher HLB values, which are essentially more hydrophilic in the case of oil-in-water emulsions.

[0081] according to Figure 2 None of these doughs are considered sticky because the workability of water is limited. The highest fat levels result in the least sticky dough. The lecithin-free dough has slightly lower fat content, which could explain some of the increased stickiness, but it could also be due to how well the fat is distributed throughout the dough.

[0082] The dough composition 5 also exhibits lower viscosity. The chickpea flour used in this dough is unseparated chickpea flour, which has different water and oil holding capacities than ARTESA 10 flour.

[0083] Example 3. Shaping and Baking The dough composition described in Example 1 was sheeted and baked. Initially, pre-sheets were prepared using a Rondo reversible sheeter until sheets of approximately 3.5 mm were obtained. The dough sheets were then cut into 11 mm wide strips and transferred to the R-Tech finishing line to provide a final thickness of 1.00 mm.

[0084] The dough composition was then baked in a combined radiant convection oven following this procedure: approximately 2 minutes at about 150°C; a linear ramp-up to approximately 225°C over approximately 2 minutes; and approximately 2 minutes at approximately 225°C. Total and top heat in zones 1 and 2 were reduced to allow expansion before solidification in zones 3 and 4, with zone 5 controlling color. Conveyor speed, roller speed, and gap settings were monitored and adjusted during baking to maintain a final sheet thickness of 1.10 mm. The total baking time was 3.6 minutes, with an oven belt speed of 1.62 m / min. The baked dough was cooled for at least one hour and sealed in foil bags before characterization.

[0085] Example 4. Characterization of baking dough To measure the baking rise of each dough composition, the stack height of the baked dough was measured. Measuring the stack height of unevenly bubbly cookies is a challenging task due to the randomness between fragments and the way cookies are stacked, moved, and stabilized. For measurement, five cookies were stacked on top of each other, each cookie face up. The stack height was measured using a height gauge, and the results were normalized by the weight of the stack. Figure 4 The figure shows the average of five piles for each baked dough (normalized by pile weight).

[0086] Example 5. Sensory characteristics of baked dough The baked dough samples described in Example 3 were then evaluated by a blinded panel, and each sample was scored for perceived hardness and fracturability.

[0087] Only hardness and brittleness were rated, as they are most closely related to what consumers perceive as crunchiness and crispiness. Results are as follows... Figure 5A As shown. Hardness is defined as the force required to compress the product, with Ritz crackers as the lower limit anchored at three, and Wheat Thin as the upper limit anchored at seven. Brittleness is defined by how the sample breaks into fragments. The lower limit is defined as breaking into many small pieces, and the upper limit is defined as cleanly breaking in half. The anchors used are Cheez-it, assigned six and a half, and Wheat Thin, assigned eight.

[0088] Crispness and crunchiness are complex measures. Hardness and crispness are related to these properties, but are more readily defined and measured consistently. A general trend has been observed with increasing fat levels, as softness increases, followed by expansion and crispness, as... Figure 5A As shown by the lines in the diagram. Vertically stacked products with the same brittleness / fragility can have different levels of hardness / brittleness, but can also have different fat content and dough softness.

[0089] Baking dough samples 3 (containing lecithin), 4 (not containing lecithin), and 5 (containing different flours) with equal fat content fell into very different regions on the texture map.

[0090] Figure 5B This is a picture of baking dough sample 1, which has low factorability (and high crispness).

[0091] Summarize It is well known that chickpea flour retains water through wetting, capillary action, and the water-retaining properties of its components, including proteins, dietary fiber, and fats. The inventors noted that ARTESA 10 chickpea flour has a very fine particle size, making it particularly sensitive to water. The densely packed particles reduce the voids available for capillary water absorption. The fine grinding of the flour also separates the proteins from the starch, allowing the proteins to hydrate and dissolve. Both reduced capillary water absorption and protein dissolution contribute to viscosity. However, the inventors noted that even if simply reducing the amount of water could provide a dough that can be sheeted and processed, this could result in a hard, brittle, and / or glassy product, which is generally undesirable.

[0092] The inventors discovered that increasing dough softness by adding fat and optionally an emulsifier (along with relatively little water) can mitigate this sensitivity, resulting in a soft and non-sticky dough with good machinability. The dough is extensible with low levels of dough memory, springback, and elasticity. Replacing water with higher levels of oil can increase dough softness while maintaining non-stickiness. The amount of water is kept to the minimum required to functionalize film-forming starch into a dissolved, flexible film. Otherwise, higher water levels would result in a sticky texture and make the dough difficult to process with too much soluble starch or the low water-holding capacity of chickpea flour. Therefore, a balance between the water-holding capacity (WHC) and oil-holding capacity (OHC) of film-forming starch and chickpea flour can produce dough softness without the stickiness required for good machinability and baking rise. To compare dough softness and elasticity with baking rise, the dough elasticity measured in Example 2 and the baking rise measured in Example 4 are plotted on the same graph, as shown below. Figure 6 As shown.

[0093] from Figure 6 As can be seen, increasing the softness to a certain point maximizes the baking expansion, as shown in dough composition 6. Figure 6 The peak of the arc curve (exceeding this value) indicates that, beyond this value, a decrease in swelling is expected due to the destruction of the starch matrix's oil / fat and / or reduced starch solubility and membrane elasticity. Within the same general region, a high level of crispness is also achieved on either side of this peak, with more or less swelling, such as... Figure 6As indicated by the box, this area is very firm, allowing for a wide range of oil / fat content. The stack height per unit mass of product conforms to the following assumptions: an increased level of softness contributes to the perceived baking rise and firmness or crispness. Fat content and the resulting dough texture can be used as targets for desired appearance and rise levels. The combination of vegetable oil and soy lecithin increases the effectiveness of dough softening and baking rise, which increases perceived crispness. Vegetable oil content in the range of 14-20% of flour weight results in the highest levels of baking rise and a perceived crispness. Vegetable oil content in the range of 20-30% of flour weight results in a high crispness perception but reduces baking rise caused by starch matrix disruption or reduced starch dissolution and membrane elasticity. When the vegetable oil content is below 14% of flour weight, a harder, firmer dough is produced with reduced baking rise and a harder, crunchier texture.

[0094] Film-forming starch improves dough cohesion and baking leavening in soy-based snacks, similar to those made with other substrates. It can also be used to regenerate some of the viscoelasticity required for proper sheeting. Film-forming starch provides binding, extensibility, and leavening properties in dough compositions, regardless of whether it is made from chickpea flour or other bean flours.

[0095] It should be understood that the embodiments and implementations described herein are for illustrative purposes only, and various modifications or variations will be made by those skilled in the art based on them, and such modifications or variations will be incorporated into the spirit and scope of this application and the appended claims. All publications, patents and patent applications cited herein are incorporated by reference.

[0096] Further aspects of this disclosure are provided by the embodiments listed below, which can be combined in any number and in any logically or technically inconsistent combination.

[0097] Implementation Method 1. A dough composition comprising: One or more types of bean flour, present in a total amount ranging from 40 to 70% by weight based on the weight of the dough composition; Film-forming starch, present in an amount ranging from 5-20% by weight based on the weight of the dough composition, the film-forming starch having At least 80% by weight of amylopectin content, The final RVA viscosity, not exceeding 900 centipoise, after 1 hour at 25°C, and At 25°C, the time from the RVA peak to disintegration is no more than 500 s. One or more oils or fats, present in a total amount ranging from 5-30% by weight based on the weight of the dough composition; and Water is present in an amount ranging from 10 to 40% by weight based on the weight of the dough composition.

[0098] Implementation Method 2. The dough composition according to Implementation Method 1, wherein one or more bean flours comprise (or are) one or more bean flours.

[0099] Implementation Method 3. The dough composition according to Implementation Method 1 or Implementation Method 2, wherein one or more legume flours comprise (or are) chickpea flour.

[0100] Embodiment 4. A dough composition according to any one of Embodiments 2-3, wherein one or more bean flours comprise one or more of pea flour and lentil flour.

[0101] Embodiment 5. The dough composition according to any one of Embodiments 1-4, wherein one or more bean flours include one or more of peanut flour and cashew flour.

[0102] Embodiment 6. A dough composition according to any one of Embodiments 1-5, wherein one or more bean flours comprise one or more bean flours.

[0103] Embodiment 7. The dough composition according to Embodiment 6, wherein one or more soybean flours comprise (or are) soybean flour.

[0104] Embodiment 8. The dough composition according to any one of Embodiments 1-6, having no more than 10% by weight of soybean flour, for example, no more than 5% by weight of soybean flour.

[0105] Embodiment 9. A dough composition according to any one of Embodiments 1-8, wherein the dough composition comprises a legume flour (e.g., chickpea flour).

[0106] Embodiment 10. A dough composition according to any one of Embodiments 1-9, wherein the dough composition comprises at least two (e.g., at least three) types of bean flour.

[0107] Embodiment 11. A dough composition according to any one of Embodiments 1-10, wherein one or more bean flours have a d50 particle size in the range of 1-50 micrometers, for example 5-50 micrometers, or 10-50 micrometers, or 1-35 micrometers, or 5-35 micrometers, or 10-35 micrometers.

[0108] Embodiment 12. A dough composition according to any one of Embodiments 1-10, wherein one or more bean flours have a d500 particle size in the range of 1-30 micrometers, for example 5-30 micrometers, 10-30 micrometers, or 1-25 micrometers, or 5-25 micrometers, or 10-25 micrometers.

[0109] Embodiment 13. A dough composition according to any one of Embodiments 1-12, wherein one or more bean flours have a total oil / fat content of not more than 7% by weight, for example not more than 5% by weight, or not more than 3% by weight.

[0110] Embodiment 14. The dough composition according to any one of Embodiments 1-13, wherein the d10 value of the bean flour is at least 10% of the d50 value, for example at least 15% of the d50 value, or at least 20% of the d50 value.

[0111] Embodiment 15. The dough composition according to any one of Embodiments 1-14, wherein the d90 value of the bean flour is at most 10 times the d50 value, for example at most 7 times the d50 value, or at most 5 times the d50 value.

[0112] Embodiment 16. A dough composition according to any one of Embodiments 1-15, wherein one or more bean flours are present in a total amount in the range of 40-65% by weight (e.g., 40-60% by weight, or 40-55% by weight, or 40-50% by weight) based on the weight of the dough composition.

[0113] Embodiment 17. A dough composition according to any one of Embodiments 1-15, wherein one or more bean flours are present in a total amount in the range of 45-70% by weight (e.g., 45-65% by weight, or 45-60% by weight, or 45-55% by weight, or 45-50% by weight) based on the weight of the dough composition.

[0114] Embodiment 18. A dough composition according to any one of Embodiments 1-15, wherein one or more bean flours are present in a total amount in the range of 50-70% by weight (e.g., 50-65% by weight, or 50-60% by weight, or 50-55% by weight) based on the weight of the dough composition.

[0115] Embodiment 19. A dough composition according to any one of Embodiments 1-18, wherein chickpea flour is present in a total amount in the range of 25-65% by weight (e.g., 25-60% by weight, or 25-55% by weight, or 25-50% by weight) based on the weight of the dough composition.

[0116] Embodiment 20. A dough composition according to any one of Embodiments 1-18, wherein chickpea flour is present in a total amount in the range of 40-70% by weight (e.g., 40-65% by weight, or 40-60% by weight, or 40-55% by weight, or 40-50% by weight) based on the weight of the dough composition.

[0117] Embodiment 21. A dough composition according to any one of Embodiments 1-15 and 18, wherein chickpea flour is present in a total amount in the range of 50-70% by weight (e.g., 50-65% by weight, or 50-60% by weight, or 50-55% by weight) based on the weight of the dough composition.

[0118] Embodiment 22. The dough composition according to any one of Embodiments 1-21, wherein the film-forming starch has a content of at least 85% by weight, for example, at least 90% by weight of amylopectin.

[0119] Embodiment 23. A dough composition according to any one of Embodiments 1-21, wherein the film-forming starch has a content of at least 95% by weight, for example, at least 99% by weight of amylopectin.

[0120] Embodiment 24. A dough composition according to any one of Embodiments 1-23, wherein the film-forming starch has an RVA final viscosity of not more than 800 centipoise, for example not more than 750 centipoise or not more than 700 centipoise, after 1 hour at 25°C.

[0121] Embodiment 25. A dough composition according to any one of Embodiments 1-23, wherein the film-forming starch has an RVA final viscosity of not more than 650 centipoise, for example, not more than 600 centipoise, after 1 hour at 25°C.

[0122] Embodiment 26. A dough composition according to any one of Embodiments 1-23, wherein the film-forming starch has an RVA final viscosity of not more than 550 centipoise, for example, not more than 500 centipoise, after 1 hour at 25°C.

[0123] Example 27. A dough composition according to any one of Examples 1-26, wherein the film-forming starch has an RVA final viscosity of at least 25 centipoise, for example, at least 50 centipoise, after 1 hour at 25°C.

[0124] Example 28. A dough composition according to any one of Examples 1-26, wherein the film-forming starch has an RVA final viscosity of at least 75 centipoise, for example, at least 100 centipoise, after 1 hour at 25°C.

[0125] Embodiment 29. A dough composition according to any one of Embodiments 1-28, wherein the film-forming starch has an RVA peak to disintegration time of not more than 450 s, for example, not more than 400 s, at 25°C.

[0126] Embodiment 30. A dough composition according to any one of Embodiments 1-28, wherein the film-forming starch has an RVA peak to disintegration time of not more than 350 s, for example, not more than 300 s, at 25°C.

[0127] Embodiment 31. The dough composition according to any one of Embodiments 1-30, wherein the film-forming starch is pregelatinized starch.

[0128] Embodiment 32. The dough composition according to any one of Embodiments 1-30, wherein the film-forming starch is a cold-water swellable starch.

[0129] Embodiment 33. A dough composition according to any one of Embodiments 1-32, wherein the film-forming starch has a soluble percentage of at least 20% by weight, for example at least 40% by weight, or at least 60% by weight.

[0130] Embodiment 34. A dough composition according to any one of Embodiments 1-33, wherein the film-forming starch has a sedimentation volume of at least 50 mL / g, for example at least 55 mL / g or at least 60 mL / g.

[0131] Embodiment 35. A dough composition according to any one of Embodiments 1-34, wherein the sum of the soluble percentage (in weight %) and sedimentation volume (in mL / g) of the film-forming starch is at least 50, for example at least 55, or at least 60.

[0132] Embodiment 36. A dough composition according to any one of Embodiments 1-35, wherein the film-forming starch is made from waxy corn, potato or cassava (e.g., waxy corn).

[0133] Embodiment 37. A dough composition according to any one of Embodiments 1-36, wherein the film-forming starch is chemically modified (e.g., wherein the film-forming starch is acid-modified (which can reduce viscosity); bleached, oxidized, chemically inhibited, for example with phosphate or adipate; substituted via acetylation, hydroxypropylation, hydroxyethylation, octenyl succinate or carboxymethylation).

[0134] Embodiment 38. The dough composition according to any one of Embodiments 1-36, wherein the film-forming starch is a clean label starch.

[0135] Embodiment 239. A dough composition according to any one of Embodiments 1-38, wherein the film-forming starch is present in an amount in the range of 5-15% by weight (e.g., 5-10% by weight) based on the weight of the dough composition.

[0136] Embodiment 40. A dough composition according to any one of Embodiments 1-38, wherein the film-forming starch is present in an amount in the range of 10-20% by weight (e.g., 10-15% by weight) based on the weight of the dough composition.

[0137] Embodiment 41. A dough composition according to any one of Embodiments 1-40, wherein one or more oils or fats comprise (or are) one or more oils.

[0138] Embodiment 42. The dough composition according to any one of Embodiments 1-40, wherein one or more oils or fats are independently selected from rapeseed oil, soybean oil, grapeseed oil, flaxseed oil, vegetable oil, corn oil, sunflower oil, safflower oil, olive oil, avocado oil, and peanut oil.

[0139] Embodiment 43. The dough composition according to any one of Embodiments 1-40, wherein one or more oils or fats are rapeseed oil or vegetable oil.

[0140] Embodiment 44. A dough composition according to any one of Embodiments 1-43, wherein the dough composition comprises an oil or fat (e.g., rapeseed oil).

[0141] Embodiment 45. A dough composition according to any one of Embodiments 1-43, wherein the dough composition contains at least two kinds of oils or fats.

[0142] Embodiment 46. A dough composition according to any one of Embodiments 1-45, wherein one or more oils or fats are present in a total amount in the range of 5-25% by weight (e.g., 5-20% by weight, or 5-14% by weight) based on the weight of the dough composition.

[0143] Embodiment 47. A dough composition according to any one of Embodiments 1-45, wherein one or more oils or fats are present in a total amount in the range of 10-30% by weight (e.g., 10-25% by weight, 10-20% by weight, or 10-14% by weight) based on the weight of the dough composition.

[0144] Embodiment 48. A dough composition according to any one of Embodiments 1-45, wherein one or more oils or fats are present in a total amount in the range of 14-30% by weight (e.g., 14-25% by weight, or 14-20% by weight) based on the weight of the dough composition.

[0145] Embodiment 49. A dough composition according to any one of Embodiments 1-45, wherein one or more oils or fats are present in a total amount in the range of 20-30% by weight (e.g., 20-25% by weight, or 25-30% by weight) based on the weight of the dough composition.

[0146] Embodiment 50. A dough composition according to any one of Embodiments 1-49, wherein water is present in an amount in the range of 15-40% by weight (e.g., 20-40% by weight, or 25-40% by weight) based on the weight of the dough composition.

[0147] Embodiment 51. A dough composition according to any one of Embodiments 1-49, wherein water is present in an amount in the range of 10-35% by weight (e.g., 15-35% by weight, or 20-35% by weight, or 25-35% by weight) based on the weight of the dough composition.

[0148] Embodiment 52. A dough composition according to any one of Embodiments 1-49, wherein water is present in an amount in the range of 10-30% by weight (e.g., 15-30% by weight, or 20-30% by weight, or 25-30% by weight) based on the weight of the dough composition.

[0149] Embodiment 53. A dough composition according to any one of Embodiments 1-49, wherein water is present in an amount in the range of 10-25% by weight (e.g., 15-25% by weight, or 20-25% by weight) based on the weight of the dough composition.

[0150] Embodiment 54. A dough composition according to any one of Embodiments 1-53, wherein the film-forming starch is present in a weight ratio of at least 0.1:1 (e.g., at least 0.15:1 or 0.2:1) to one or more legume flours.

[0151] Embodiment 55. The dough composition according to any one of Embodiments 1-53, wherein the film-forming starch is present in a weight ratio of one or more legume flours in the range of 0.1:1 to 0.3:1 (e.g., 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1, or 0.15:1 to 0.3:1, or 0.15:1 to 0.25:1, or 0.15:1 to 0.20:1, or 0.2:1 to 0.3:1).

[0152] Embodiment 56. A dough composition according to any one of Embodiments 1-55, wherein one or more oils or fats are present with one or more bean flours in a weight ratio of at least 0.05:1 (e.g., at least 0.1:1).

[0153] Embodiment 57. A dough composition according to any one of Embodiments 1-55, wherein one or more oils or fats are present with one or more bean flours in a weight ratio of 0.05:1 to 0.3:1 (e.g., 0.05:1 to 0.25:1, or 0.05:1 to 0.2:1, or 0.1:1 to 0.3:1, or 0.1:1 to 0.25:1, or 0.1:1 to 0.2:1).

[0154] Embodiment 58. A dough composition according to any one of Embodiments 1-57, wherein water is present in a weight ratio of at least 0.4:1 (e.g., at least 0.5:1 or at least 0.6:1) to one or more bean flours.

[0155] Embodiment 59. A dough composition according to any one of Embodiments 1-57, wherein water is present in a weight ratio of one or more bean flours in the range of 0.4:1 to 0.7:1 (e.g., 0.4:1 to 0.6:1, or 0.5:1 to 0.7:1, or 0.5:1 to 0.6:1).

[0156] Embodiment 60. The dough composition according to any one of Embodiments 1-59 further comprises an emulsifier having an HLB ratio of at least 3, at least 5, or at least 7.

[0157] Embodiment 61. The dough composition according to any one of Embodiments 1-59 further comprises an emulsifier having an HLB ratio in the range of 1-7, for example, 2-7, 3-7, 1-6, 2-6, 3-6, 1-5, 2-5, or 3-5.

[0158] Embodiment 62. The dough composition according to Embodiment 61, wherein the emulsifier includes (or is) lecithin (e.g., sunflower lecithin, soybean lecithin or egg lecithin).

[0159] Embodiment 63. The dough composition according to Embodiment 61, wherein the emulsifier comprises (or is) soybean lecithin.

[0160] Embodiment 64. The dough composition according to any one of Embodiments 60-63, wherein the emulsifier is present in a mass ratio of emulsifier to oil or fat in the range of 1:50-1:10, for example in the range of 1:40-1:10, or 1:30-1:10, or 1:50-1:15, or 1:40-1:15, or 1:30-1:15, or 1:50-1:20, or 1:40-1:20, or 1:30-1:20.

[0161] Embodiment 65. A dough composition according to any one of Embodiments 1-64, wherein the dough composition further comprises one or more gluten-free non-leguminous flours.

[0162] Implementation Method 66. The dough composition according to Implementation Method 65, wherein one or more gluten-free non-leguminous flours are each independently selected from potato flour, corn flour, rice flour, sorghum flour, buckwheat flour, oat flour, quinoa flour, teff flour, amaranth flour, cassava flour, and arrowroot flour.

[0163] Embodiment 67. A dough composition according to Embodiment 65 or Embodiment 66, wherein one or more gluten-free non-leguminous flours are present in the dough composition in a total amount not exceeding 20% ​​by weight (e.g., not exceeding 15% by weight, or not exceeding 10% by weight, or not exceeding 5% by weight) based on the weight of the dough composition.

[0164] Embodiment 68. A dough composition according to any one of Embodiments 1-67, wherein the dough composition contains no more than 1% by weight of gluten on a dry solids basis, for example, no more than 0.5% by weight of gluten, or no more than 0.25% by weight of gluten.

[0165] Embodiment 69. The dough composition according to any one of Embodiments 1-68 further comprises an effective amount of leavening agent.

[0166] Embodiment 70. The dough composition according to Embodiment 69, wherein the leavening agent comprises (or) a chemical leavening agent, such as a bicarbonate, such as sodium bicarbonate, potassium bicarbonate or ammonium bicarbonate.

[0167] Embodiment 71. The dough composition according to Embodiment 70, wherein the leavening agent further comprises one or more acids, such as tartaric acid, monocalcium phosphate, or sodium aluminum sulfate.

[0168] Implementation Method 72. The dough composition according to Implementation Method 69, wherein the leavening agent comprises (or is) yeast.

[0169] Embodiment 73. A dough composition according to any one of Embodiments 69-72, wherein the leavening agent is present in an effective amount not exceeding 1% by weight (e.g., not exceeding 0.6% by weight, or not exceeding 0.4% by weight) based on the weight of the dough composition.

[0170] Embodiment 74. A dough composition according to any one of Embodiments 1-71 and 73, wherein the dough composition is substantially free of yeast.

[0171] Embodiment 75. The dough composition according to any one of Embodiments 1-74, further comprising sodium chloride.

[0172] Embodiment 76. The dough composition according to Embodiment 75, wherein sodium chloride is present in an amount of up to 3% by weight based on the weight of the dough composition, for example up to 2.5% by weight, or up to 2% by weight, or up to 1.5% by weight.

[0173] Embodiment 77. A dough composition according to any one of Embodiments 1-76, wherein the dough composition further comprises one or more additional components (e.g., stabilizing additives, pH balancing additives, viscosity modifiers, and flavoring additives).

[0174] Embodiment 78. A dough composition according to any one of Embodiments 1-77, wherein one or more bean flours, film-forming starch, one or more oils or fats, water, emulsifier (if present), leavening agent (if present), and sodium chloride (if present) account for at least 90% by weight (e.g., at least 95% by weight, or at least 98% by weight, or at least 99% by weight) of the dough composition.

[0175] Embodiment 79. A dough composition according to any one of Embodiments 1-78, wherein the dough composition has a firmness measured by total compression work, wherein the total compression work is at least 5000 g·mm.

[0176] Embodiment 80. A dough composition according to any one of Embodiments 1-79, wherein the dough composition has a firmness measured by total compression work, wherein the total compression work is in the range of 5000-15000 g·mm (e.g., in the range of 5000-10000 g·mm, or 5000-7500 g·mm, or 5500-15000 g·mm, or 5500-10000 g·mm, or 5500-7500 g·mm).

[0177] Example 81. A dough composition according to any one of Examples 1-80, wherein the dough composition has viscosity as measured by total adhesive work, wherein the total adhesive work is at least -5000 g·mm.

[0178] Embodiment 82. A dough composition according to any one of Embodiments 1-80, wherein the dough composition has a viscosity measured by total adhesive work, wherein the total adhesive work is in the range of -5000 to -1000 g·mm (e.g., in the range of -4500 to -1000 g·mm, or -4000 to -1000 g·mm, or -5000 to -1500 g·mm, or -4500 to -1500 g·mm, or -4000 to -1500 g·mm).

[0179] Embodiment 83. A dough composition according to any one of Embodiments 1-82, wherein, when sheeted to 1.10 mm and baked in a combined radiant convection oven having the following procedure, the dough composition expands to at least twice (e.g., at least three times, or at least four times) the unbaked height of the dough composition: at 150°C for 2 minutes; linearly ramped to 225°C within 2 minutes; at 225°C for 2 minutes.

[0180] Embodiment 84. A dough composition according to any one of Embodiments 1-82, wherein, when sheeted to 1.10 mm and baked in a radiant convection combined oven having the following procedure, the dough composition expands to 2-5 times (e.g., 3-5 times, or 2-4 times, or 3-4 times) the unbaked height of the dough composition: at 150°C for 2 minutes; linearly ramped to 225°C within 2 minutes; at 225°C for 2 minutes.

[0181] Embodiment 85. The dough composition according to any one of Embodiments 1-84, wherein the dough composition has a high crispness when sheeted to 1.10 mm and baked in a combined radiative convection oven having the following procedure: 150°C for 2 minutes; linearly ramped to 225°C within 2 minutes; 225°C for 2 minutes.

[0182] Embodiment 86. A method for preparing a dough composition (e.g., any one of Embodiments 1-85), the method comprising: Combining one or more types of bean flour and film-forming starch to provide a dry mixture; Combining a dry mixture with one or more oils or fats to provide a dough precursor; and The dough precursor is combined with water to provide a dough composition.

[0183] Implementation Method 87. The method according to Implementation Method 86, wherein one or more types of bean flour are as described in any one of Implementation Methods 2-21.

[0184] Embodiment 88. The method according to Embodiment 76 or Embodiment 87, wherein the film-forming starch is as described in any one of Embodiments 22-40.

[0185] Embodiment 89. The method according to any one of Embodiments 76-78, wherein one or more oils or fats are as described in any one of Embodiments 41-49.

[0186] Implementation 90. The method according to any one of Implementations 86-89, wherein the water is as described in any one of Implementations 50-54.

[0187] Embodiment 91. The method according to any one of Embodiments 86-90, wherein combining the dry mixture with one or more oils or fats comprises mixing the dry mixture with one or more oils or fats until uniformly incorporated.

[0188] Embodiment 92. The method according to any one of Embodiments 86-91, wherein combining the dough precursor with water includes adding water to the dough precursor when mixing the dough precursor.

[0189] Embodiment 93. The method according to any one of Embodiments 86-92, wherein combining the dough precursor with water comprises mixing until the dough precursor and water are uniformly incorporated.

[0190] Embodiment 94. The method according to any one of Embodiments 86-93, wherein the method further comprises including one or more additional additives (e.g., leavening agents, stabilizing additives, pH balancing additives, viscosity modifiers, or flavoring additives) in the dough composition.

[0191] Embodiment 95. The method according to any one of Embodiments 86-94, wherein the dough composition is as described in any one of Embodiments 1-85.

[0192] Embodiment 96. A raw dough composition prepared by any one of Embodiments 86-95.

[0193] Implementation 97. A method for providing cooked food products using a raw dough composition, the method comprising: Provide a dough composition (e.g., a dough composition of any one of embodiments 1-85 and 96, or a dough composition prepared by any one of embodiments 86-95); Shape the dough composition into the desired shape; and (For example, by baking) cook raw dough compositions to provide cooked food products.

[0194] Embodiment 98. The method according to Embodiment 97, wherein shaping the dough composition includes rolling, folding, punching or cutting the dough composition.

[0195] Implementation 99. The method according to Implementation 97 or Implementation 98, wherein the desired shape is sheet-like (e.g., rectangular sheet, square sheet, triangular sheet, oval sheet or circular sheet).

[0196] Embodiment 100. The method according to any one of Embodiments 97-99, wherein cooking the raw dough composition includes heating the raw dough at a temperature and time sufficient to fully cook the raw dough.

[0197] Embodiment 101. The method according to any one of Embodiments 97-100, wherein cooking is performed at a temperature in the range of 100-250°C (e.g., 150-250°C or 200-250°C).

[0198] Implementation 102. The method according to implementation 101, wherein the baking is performed for at least 2 minutes (e.g., at least 3 minutes).

[0199] Implementation 103. The method according to Implementation 101, wherein the baking is performed for a time ranging from 2 to 20 minutes (e.g., 2 to 10 minutes, or 2 to 5 minutes, or 3 to 20 minutes, or 3 to 10 minutes, or 3 to 5 minutes).

[0200] Embodiment 104. A cooked food product comprising cooked dough, said cooked dough being a raw dough composition of any one of Embodiments 1-85 or 86, or a cooked food product of raw dough prepared according to any one of Embodiments 76-85.

[0201] Implementation method 105. The method or cooked food product according to any one of implementation methods 97-104, wherein the cooked food product is a baked food product.

[0202] Implementation 106. The method or cooked food product according to any one of Implementations 97-104, wherein the cooked food product is a crispy biscuit, a puff pastry, a biscuit, a pie crust, baked pizza dough, or a pretzel (e.g., a crispy biscuit).

[0203] Embodiment 107. This disclosure generally relates to a dough composition comprising one or more legume flours present in a total amount ranging from 40 to 70% by weight based on the weight of the dough composition; film-forming starch present in a total amount ranging from 5 to 20% by weight based on the weight of the dough composition, said film-forming starch having an amylopectin content of at least 80% by weight, an RVA final viscosity of no more than 900 centipoise after 1 hour at 25°C, and an RVA peak-to-disintegration time of no more than 500 seconds at 25°C; one or more oils or fats present in a total amount ranging from 5 to 30% by weight based on the weight of the dough composition; and water present in a total amount ranging from 10 to 40% by weight based on the weight of the dough composition.

[0204] The details shown herein are by way of example and are merely for illustrative discussion of preferred embodiments of the invention, and are given to provide a description of the principles and conceptual aspects of various embodiments of this disclosure that are considered most useful and readily understood. In this regard, no attempt is made to show the structural details of this disclosure in greater detail except as necessary for a basic understanding of it; the description, taken in conjunction with the accompanying drawings and / or examples, makes it clear to those skilled in the art how several forms of this disclosure can be implemented in practice. Therefore, it should be understood that the aspects described herein are not limited to particular embodiments, apparatuses, or configurations, and thus can certainly be varied, before the disclosed processes and apparatus are described. It should also be understood that the terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting unless specifically defined herein.

[0205] Unless otherwise stated herein or clearly contradicted by the context, the terms “a,” “an,” “the,” and similar designations used in the context of describing this disclosure (especially in the context of the following claims) shall be interpreted to cover both singular and plural forms. The numerical ranges listed herein are merely shorthand for individually referring to each individual value falling within the range. Unless otherwise stated herein, each individual value is incorporated into the specification as if it were individually listed herein. It should also be understood that the endpoints of each range are meaningful both relative to and independent of the other endpoint.

[0206] Unless otherwise stated herein or clearly contradicted by the context, all methods described herein may be performed in any suitable order of steps. The use of any and all instances or exemplary language (e.g., “such as”) provided herein is intended only to better illustrate this disclosure and not to limit the scope of this disclosure as otherwise claimed. Nothing in this specification should be construed as implying that any unclaimed element is essential for implementing this disclosure.

[0207] Unless the context explicitly requires otherwise, throughout the specification and claims, the terms “comprise”, “comprising,” etc., should be interpreted in a inclusive sense, not an exclusive or exhaustive sense; that is, in the sense of “including but not limited to.” The use of singular or plural terms also includes both singular and plural forms, respectively. Furthermore, the terms “herein,” “above,” and “below,” and similar terms, when used in this application, should refer to the entire application and not any specific part thereof.

[0208] As will be understood by those skilled in the art, each embodiment disclosed herein may include, consist substantially of, or be composed of the elements, steps, ingredients, or components specifically stated herein. As used herein, the transitional terms “comprise” or “comprises” mean, but are not limited to, and allow the inclusion, even in substantial quantities, of unspecified elements, steps, ingredients, or components. The transitional phrase “consisting of” excludes any unspecified elements, steps, ingredients, or components. The transitional phrase “consisting substantially of” limits the scope of the embodiment to the specified elements, steps, ingredients, or components, as well as those elements, steps, ingredients, or components that do not substantially affect the embodiment.

[0209] Unless otherwise stated, the numerical parameters set forth in the specification and appended claims are approximate values ​​and may vary depending on the desired characteristics sought to be obtained in this disclosure. At least, and without attempting to limit the application of the doctrine of equivalence to the scope of the claims, each numerical parameter should be interpreted at least based on the reported numerical value of significant figures and by applying ordinary rounding techniques.

[0210] Although the wide range of numerical values ​​and parameters described in this disclosure are approximate, the values ​​described in the specific embodiments are reported as accurately as possible. However, any numerical value inherently contains some errors, which are necessarily caused by the standard deviation found in their respective test measurements.

[0211] The grouping of alternative elements or embodiments disclosed herein should not be construed as limiting. Each member of a group may be cited and claimed individually or in any combination with other members of the group or other elements found herein. It is contemplated that one or more members of a group may be included in or removed from the group for convenience and / or patentability reasons. When any such inclusion or removal occurs, this specification is considered to contain the modified group, thereby satisfying the written description of all Markush groups used in the appended claims.

[0212] This document describes some embodiments of the present disclosure, including the best mode known to the inventors for carrying out the present disclosure. Of course, variations of these described embodiments will become apparent to those skilled in the art after reading the foregoing description. The inventors expect those skilled in the art to appropriately employ these variations, and the inventors intend to practice the present disclosure in ways different from those specifically described herein. Therefore, this disclosure includes all modifications and equivalents of the subject matter recited in the appended claims as permitted by applicable law. Furthermore, unless otherwise stated herein or clearly contradicted by the context, this disclosure covers any combination of the foregoing elements in all possible variations.

[0213] Furthermore, it should be understood that the embodiments disclosed herein are illustrative of the principles of this disclosure. Other modifications that may be employed are also within the scope of this disclosure. Therefore, alternative configurations of this disclosure can be utilized in accordance with the teachings of this document by way of example rather than limitation. Thus, this disclosure is not limited to what is precisely shown and described.

Claims

1. A dough composition comprising: One or more types of bean flour, present in a total amount ranging from 40 to 70% by weight based on the weight of the dough composition; Film-forming starch, present in an amount ranging from 5-20% by weight based on the weight of the dough composition, the film-forming starch having At least 80% by weight of amylopectin content, The final RVA viscosity, not exceeding 900 centipoise, after 1 hour at 25°C, and At 25°C, the time from the RVA peak to disintegration is no more than 500 s. One or more oils or fats, present in a total amount ranging from 5 to 30% by weight based on the weight of the dough composition; as well as Water is present in an amount ranging from 10 to 40% by weight based on the weight of the dough composition.

2. The dough composition as described in claim 1, wherein, One or more types of bean flour contain one or more types of bean flour.

3. The dough composition as described in claim 1, wherein, One or more types of legume flour include chickpea flour.

4. The dough composition as described in claim 1, wherein, Soybean flour has a d value in the range of 1-50 micrometers. 50 granularity.

5. The dough composition as claimed in claim 1, wherein, d of bean flour 10 The value is d 50 The value is at least 15%, and the d of bean flour 90 The value does not exceed d 50 Seven times the value.

6. The dough composition of claim 1, wherein, One or more types of bean flour are present in a total amount ranging from 50 to 70% by weight based on the weight of the dough composition.

7. The dough composition of claim 1, wherein, Film-forming starch has an RVA final viscosity of 75-700 centipoise after 1 hour at 25°C.

8. The dough composition of claim 1, wherein, Film-forming starch has an RVA peak time of no more than 350 s at 25°C to disintegration.

9. The dough composition of claim 1, wherein, Film-forming starch is either pregelatinized starch or starch that has been swollen in cold water.

10. The dough composition of claim 1, wherein, The film-forming starch has a total of at least 50, for example at least 55, or at least 60 percent of solubles (in weight %) and sedimentation volume (in mL / g).

11. The dough composition of claim 1, wherein, Film-forming starch is a clean label starch.

12. The dough composition of claim 1, wherein, Film-forming starch is present in an amount ranging from 10 to 20% by weight based on the weight of the dough composition.

13. The dough composition of claim 1, wherein, One or more oils or fats include (or are) one or more oils, such as rapeseed oil or vegetable oil.

14. The dough composition of claim 1, wherein, One or more oils or fats are present in total amounts ranging from 10 to 30% by weight based on the weight of the dough composition.

15. The dough composition of claim 1, wherein, Water is present in an amount ranging from 10 to 30% by weight based on the weight of the dough composition.

16. The dough composition of claim 1, wherein, Film-forming starch is present in a weight ratio of 0.1:1 to 0.3:1 with one or more types of legume flour.

17. The dough composition of claim 1, wherein, One or more oils or fats are present with one or more soybean flours in a weight ratio ranging from 0.05:1 to 0.3:

1.

18. The dough composition of claim 1, wherein, Water is present in a weight ratio of one or more types of bean flour in the range of 0.4:1 to 0.7:

1.

19. The dough composition of claim 1, further comprising an emulsifier having an HLB ratio in the range of 1-7.

20. The dough composition of claim 19, wherein, Emulsifiers include lecithin (such as sunflower lecithin, soybean lecithin, or egg lecithin).

21. The dough composition of claim 1, wherein, The dough composition also contains one or more gluten-free non-leguminous flours.

22. The dough composition of claim 1, wherein, The dough composition contains no more than 0.5% by weight of gluten.

23. The dough composition of claim 1, wherein, One or more bean flours, film-forming starch, one or more oils or fats, water, emulsifier (if present), leavening agent (if present), and sodium chloride (if present) constitute at least 90% by weight of the raw dough composition.

24. A method of providing a cooked food product using a dough composition, the method comprising: Provides a dough composition according to any one of claims 1-23; Shape the dough composition into the desired shape; and (For example, by baking) cook raw dough compositions to provide cooked food products.

25. The method of claim 24, wherein, Prepared food products include crackers, puff pastries, biscuits, pie crusts, baked pizza dough, or pretzels (such as crackers).

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