Radiographic imaging device

Abstract

Disclosed is a radiation imaging apparatus. The radiation imaging apparatus includes a radiation sensor configured to convert incident radiation into an electric signal, and a housing configured to enclose the radiation sensor, wherein a holding portion shaped as a recess is formed in a back surface of the housing, the back surface being located on a side opposite to a radiation incident surface of the housing, and a member having a thermal conductivity lower than that of the back surface is arranged at a position corresponding to the holding portion in the back surface.

Description

[0001] This application is a divisional application of the invention patent application filed on July 26, 2019, with application number 201910683198.0 and invention title "Radiation Imaging Device". Technical Field

[0002] This invention relates to a radiation imaging apparatus. Background Technology

[0003] In recent years, devices that acquire digital images using semiconductor sensors (radiation sensors) have been increasingly used as radiographic imaging devices for medical imaging diagnostics and non-destructive examinations. Given this, improved operational efficiency has been achieved due to the ability to immediately examine the acquired images, unlike when images are acquired using traditional photographic film. Furthermore, the use of radiation sensors allows for imaging unaffected by changes in radiation exposure, as images acquired using radiation sensors possess a very wide dynamic range.

[0004] A radiographic imaging apparatus using a radiation sensor includes a circuit board (integrated circuit) for controlling imaging operations and processing radiographic images, and this circuit board acts as a heat source. If the heat generated by this heat source causes the temperature of the radiation sensor to be nonuniform across its surface, there is a concern that unevenness will appear in the image. Therefore, it is necessary to effectively dissipate the heat to the outside of the effective area of ​​the radiation sensor. Japanese Patent Application Publication No. 09-288184 discloses a structure that suppresses the increase in temperature of the radiation sensor by providing a heat-conducting member for thermally connecting the heat-generating part to the housing.

[0005] Furthermore, due to further reductions in the size and weight of imaging devices, portable imaging devices have also been put into practical use. Imaging can be performed in any orientation, and such portable imaging devices are preferred for, for example, radiographic imaging in general wards or outdoors. Japanese Patent Application Publication No. 2017-067564 proposes a structure in which a holding portion is formed in a recess in a surface opposite to the radiation incident surface, allowing the portable device to be advantageously held.

[0006] In recent years, there have been instances where power consumption during imaging has increased due to the enhanced functionality of imaging devices. In such cases, if the heat generated within the imaging device is released into its housing, the housing temperature may further rise, raising concerns that the operator or the subject being examined may experience discomfort while handling the device. In particular, discomfort may arise if a part of the imaging device becomes hot after prolonged handling. Summary of the Invention

[0007] In view of the aforementioned problems, this disclosure provides a structure for a radiographic imaging apparatus with good handleability, which makes the operator and the subject to be examined feel less discomfort.

[0008] According to one aspect of the present invention, a radiation imaging apparatus is provided, the radiation imaging apparatus comprising: a radiation sensor configured to convert incident radiation into an electrical signal; and a housing configured to surround the radiation sensor, wherein a retaining portion formed as a recess is formed in a back surface of the housing, the back surface being located on a side opposite to the radiation incident surface of the housing, and a member having a lower thermal conductivity than the back surface is arranged at a position corresponding to the retaining portion in the back surface.

[0009] According to another aspect of the present invention, a radiation imaging apparatus is provided, the radiation imaging apparatus comprising: a radiation sensor configured to convert incident radiation into an electrical signal; and a housing configured to surround the radiation sensor, wherein a holding portion formed as a recess is formed in a back surface of the housing, the back surface being located on a side opposite to the radiation incident surface of the housing, and a member having a lower thermal conductivity than the back surface is arranged to cover the recess.

[0010] Further features of the invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0011] Figure 1 An example configuration of a radiation imaging system according to Embodiment 1 is shown.

[0012] Figure 2A and Figure 2B An example configuration of a radiation imaging apparatus according to Embodiment 1 is shown.

[0013] Figure 3A and Figure 3B An example of the structure of the holding part according to Embodiment 1 is shown.

[0014] Figure 4A and Figure 4B An example of the structure of the holding part according to Embodiment 2 is shown.

[0015] Figure 5A and Figure 5B An example of the structure of the holding part according to Embodiment 3 is shown. Detailed Implementation

[0016] In the following description, embodiments of the invention will be described in detail with reference to the accompanying drawings. However, the details of the dimensions and structures described in the embodiments are not limited to those described in the text and drawings. Note that in this specification, radiation includes not only X-rays, but also alpha rays, beta rays, gamma rays, particle beams, cosmic rays, etc.

[0017] Example 1 Configuration of a radiation imaging system Figure 1 An example configuration of a radiographic imaging system 10 according to Embodiment 1 is shown. The radiographic imaging system 10 is a system for imaging digital radiographic images (hereinafter referred to as "radiographic images") and performing inspections (imaging) based on an inspection form that includes multiple inspection information items. The inspection information includes imaging protocol information, which defines parameter information or imaging implementation information to be used during imaging or image processing, and imaging environment information (such as sensor type or imaging orientation). The inspection information includes information specifying the inspection form or, based on the inspection form, the radiographic image, such as the inspection ID and receipt number.

[0018] The radiographic imaging system 10 includes a radiographic imaging device 100, a radiographic generation control unit 31, a radiographic imaging control unit 20, a display unit 21, an operation unit 22, and a radiographic source 30. The radiographic source 30 serves as a radiographic generation unit. That is, in this embodiment, the radiographic source 30 is an X-ray tube, and it irradiates the subject 40 to be imaged (i.e., the subject to be examined) with radiation (here, X-rays). The radiographic generation control unit 31 controls the generation of radiation based on an imaging scheme, according to the control of the radiographic imaging control unit 20. Specifically, the radiographic generation control unit 31 applies voltage to the radiographic source 30 to generate radiation according to imaging conditions corresponding to the imaging scheme (e.g., parameters such as tube current, tube voltage, and irradiation time).

[0019] The radiographic imaging control unit 20 monitors and controls the radiographic imaging processing based on the imaging scheme. The radiographic imaging control unit 20 also performs image processing on the radiographic images obtained from the radiographic imaging device 100. Image processing includes tone processing, frequency processing, etc., and is performed using image processing parameters according to the imaging scheme. The display unit 21 displays information such as system status to the operator. The display unit 21 may be, for example, a monitor. For example, the display unit 21 may display a checklist received from an external source or a checklist created by the operator of the radiographic imaging device 100. The operation unit 22 receives instructions from the operator. The operation unit 22 may be, for example, a keyboard, a mouse, or various buttons. For example, the operator may input operation instructions to the radiographic imaging device 100 via the operation unit 22. The radiographic imaging device 100 detects the radiation that has passed through the subject 40 to be imaged as a charge corresponding to the transmitted radiation dose, generates a radiographic image as image data, and transmits the radiographic image to the radiographic imaging control unit 20.

[0020] Configuration of radiation imaging device Figure 2A and Figure 2B The configuration of the radiation imaging apparatus 100 according to Embodiment 1 is shown. Figure 2A This is a perspective view of the radiation imaging apparatus 100 according to this embodiment, viewed from the radiation incident surface. Figure 2B It is obtained along line A-A' Figure 2A A cross-sectional view. The housing of the radiation imaging device 100 consists of a front housing 110, a rear housing 120, and a radiation transmission plate 130. To ensure strength against drops, impacts, etc., and to reduce the load during transport, the front housing 110 and rear housing 120 may be made of low-density materials (such as aluminum, magnesium alloys, or CFRP) to reduce the weight of the radiation imaging device. The radiation transmission plate 130 is made of, for example, CFRP. Indicators 131 and 132 for indicating the reading center and reading area in the sensor panel 140 are provided on the radiation transmission plate 130.

[0021] The radiation imaging device 100 has a switch 133, a status display unit 134, a wireless communication unit 135, and a wired communication connection unit 136 on its side. The radiation imaging device 100 also includes a battery 145. The battery 145 can be removable so that it can be replaced with a rechargeable battery when the remaining battery capacity is low. The radiation imaging device 100 uses power supplied from the battery 145 to perform imaging operations and can be used in wireless mode by communicating with the radiation imaging control unit 20 from the wireless communication unit 135 using the built-in antenna 146. If the wireless connection is poor, wired communication can be performed alternatively by connecting a cable (not shown) to the wired communication connection unit 136. Power can also be supplied wiredly when, for example, the remaining capacity of the battery 145 is insufficient. The switch 133 can be used to perform operations such as turning the power on and off of the radiation imaging device 100, switching imaging states (ready state), etc. The status display unit 134 displays the power on / off status, the remaining capacity of the battery 145, etc., through light color, on / flash / off states, etc.

[0022] A sensor panel (radiation sensor) 140 for converting incident radiation into charge signals (electrical signals) is arranged inside the radiation imaging apparatus 100, in which photoelectric conversion elements are formed on a glass substrate. A phosphor 141 for converting radiation into visible light is disposed on the surface of the sensor panel 140 on the side of the photoelectric conversion elements. CsI and the like are preferably used as the phosphor 141. The phosphor 141 emits light due to radiation irradiating the radiation of the radiation imaging apparatus 100, and the photoelectric conversion elements of the sensor panel 140 convert the emitted light into a small amount of charge signals. These charge signals are used to form an image. Note that the method for converting radiation into charge signals is not limited to the methods mentioned above, and, for example, a direct conversion type sensor, such as a-Se, which directly converts radiation into charge signals, can be used alternatively. The charge signals generated (acquired) in the sensor panel 140 are connected to an integrated circuit 151 via a flexible plate 142, which is contained on the flexible plate 142. Integrated circuit 151 amplifies a small amount of charge signal and performs an A / D conversion on it, thus turning the charge signal into a digital image signal. These digital image signals are further processed within circuit board 143 and transmitted to the radiation imaging control unit 20.

[0023] A rigid base 144 is adhered to the sensor panel 140 on the side opposite the radiation incident surface to support the sensor panel 140, preventing deformation or breakage due to externally applied loads, vibrations during transportation, etc. Furthermore, a radiation insulating member (not shown) is attached to the base 144 as needed to, for example, suppress radiation degradation on the circuit board 143 and / or remove scattered radiation from the rear side of the radiation imaging device 100. The radiation insulating member is made of a high-density material (such as molybdenum, iron, or lead). A cushioning material 160 is suitably provided between the housing of the radiation imaging device 100 and the components provided therein, achieving the effect of dispersing externally applied loads and cushioning impacts. The cushioning material 160 is, for example, a porous material made of silicone or polyurethane, or a material made of silicone gel, etc.

[0024] During radiographic imaging, the integrated circuit 151 and circuit board 143, as electronic components that process the charge signals (electrical signals) obtained from the sensor panel 140, generate heat, and their temperature may increase. If the temperature of the integrated circuit 151 and circuit board 143 increases excessively, there is a concern that the circuit may be damaged, and if the temperature of the sensor panel 140 is not uniform across its surface, there is a concern that non-uniformity may appear in the image. For this reason, the heat needs to be transferred to the housing and dissipated to the outside of the radiographic imaging apparatus 100. Therefore, heat conduction members 152 are arranged between the integrated circuit 151 and the rear housing 120, and between the circuit board 143 and the rear housing 120. As each heat conduction member 152, silicone rubber sheets, thermally conductive grease, thermal radiation adhesives, etc., are used.

[0025] The radiation imaging device 100 according to this embodiment has the following structure: in this structure, a gripping portion is provided in the back surface (rear housing 120 side) to improve the portability of the device, each of the gripping portions having a recessed form. The back surface is made of a uniform material. Figure 3A and Figure 3B An example of the structure of the holding portion in the back of the radiation imaging apparatus 100 according to this embodiment is shown. Figure 3A This is a perspective view taken from the rear of the radiation imaging device 100, and Figure 3B This is a schematic cross-sectional view of the cross-sectional structure of the holding part.

[0026] like Figure 3AAs shown, a recessed grip portion 300 is provided on the back of the radiographic imaging device 100 according to this embodiment, near the side of the housing. By arranging the grip portion near the side, the radiographic imaging device 100 can be gripped in various orientations and is therefore easily manipulated. Considering the typical size of a human hand, the gripability of the grip portion 300 is increased by configuring a portion of each grip portion 300, or its deepest region, within 60 mm of the corresponding nearest side of the housing. Moreover, the depth of the recess of each grip portion 300 is greater than the depth of the radiographic imaging device at its center of mass in its thickness direction, or greater than or equal to half the thickness of the radiographic imaging device 100, which can be considered substantially the same as the depth at the center of mass. In this embodiment, the thickness of the imaging device is 13 mm to 16 mm to conform to the standard dimensions of a general imaging cassette as defined by JIS Z 4905. In this case, the maximum depth can be greater than 6.5 mm to 8.0 mm. Furthermore, in the surfaces forming the recesses of each gripping portion 300, the gripping surface 301 opposite to the nearest side (i.e., the surface portion closest to the side) can form an angle of 120° or less relative to the back surface of the housing. Therefore, a retaining force can be applied without relying on friction.

[0027] As mentioned above, heat within the X-ray imaging device 100 is transferred to be released to the rear housing 120. Therefore, the temperature of the rear surface of the X-ray imaging device 100 may increase. Specifically, each of the grip surfaces 301 is likely to be touched when the X-ray imaging device 100 is manipulated (since fingers are always hooked onto them), so if the operator and / or the subject being examined feels a high temperature on the grip surface 301, then the operator and / or the subject being examined are likely to experience discomfort. In this embodiment, a non-thermally conductive sheet 310 having a lower thermal conductivity than the rear housing 120 is attached to each grip surface 301, which acts as at least one of the surfaces forming a recess in the grip portion 300. Rubber sheets, resin sheets, porous material sheets, etc., are used as the non-thermally conductive sheet 310. Even if the temperature increases by the same amount, the sensed temperature can be reduced if the grip portion 300 is contacted via a material with low thermal conductivity. Furthermore, the heat resistance between the rear housing 120 and the non-thermal conductive sheet 310 can reduce the temperature of the contact area. These effects reduce discomfort when the finger hook is on the grip surface 301.

[0028] As described above, this embodiment can provide a radiographic imaging device with good handleability and a structure that causes less discomfort to the operator and / or the subject to be examined.

[0029] Example 2 This embodiment will describe a structural example of a gripping portion that has better gripability than the gripping portion in Embodiment 1 and can reduce discomfort when manipulated. The differences from Embodiment 1 will be described below. Figure 4A and Figure 4B The structure of the holding portion provided on the back side of the radiation imaging apparatus 100 according to this embodiment is shown. Figure 4A This is a perspective view taken from the rear of the radiation imaging device 100, and Figure 4B This is a schematic cross-sectional view of the cross-sectional structure of the holding part.

[0030] In this embodiment, in order to form a gripping surface 401 of a recess to be gripped in the housing of the radiographic imaging device 100, a gripping member 410 is used as a predetermined gripping portion forming member made of a material having a lower thermal conductivity than the rear housing 120. The gripping member 410 can be made of a material such as resin or rubber, which has a lower thermal conductivity than the rear housing 120. By using a gripping member 410 made of this type of material, similar to Embodiment 1, the sensible temperature can be reduced when using the radiographic imaging device 100. The gripping member 410 is attached to the rear housing 120, for example, via thermally insulating double-sided tape 420. Alternatively, a thermally insulating sheet can be used instead of the double-sided tape 420. Compared to Embodiment 1, the distance of the heat conduction path from the rear housing 120 to each gripping surface 401 can be easily ensured, thus easily reducing the temperature of the gripping surface 401. Note that the gripping member 410 can extend to the side of the radiographic imaging device 100. In this case, not only the gripping surface 401 but also the parts that may be touched by hands when gripped are made of a material with low thermal conductivity, so the discomfort felt by the operator and / or the subject to be examined can be further reduced.

[0031] Since the materials used to form the rear housing 120 (such as aluminum, magnesium, or CFR) are typically processed using molds by means of die casting, pressing, etc., they cannot be formed into complex shapes or so-called undercut shapes that cannot be released from the mold. By providing the gripping member 410 as a separate component, it is possible to form relatively freely an R-shape that allows the fingers holding the gripping member 410 to be easily hooked, or a shape with concave and convex portions. Moreover, if the gripping member 410 is made of a rubber material, the friction when gripped increases, while if the gripping member 410 is made of a soft material, it can deform in response to the fingers. In these respects, by attaching the gripping member 410 as a separate component from the rear housing 120, gripability can be improved compared to Embodiment 1.

[0032] As described above, this embodiment can provide a radiographic imaging device that can further reduce discomfort felt by the operator and / or the subject being examined, while improving handleability.

[0033] Example 3 This embodiment will describe the relationship between the constituent elements of the radiation imaging apparatus 100 in the structure in which the holding component is provided. Figure 5A and Figure 5B An example of the structure of the holding portion provided on the back side of the radiation imaging apparatus 100 according to this embodiment is shown. Figure 5A This is a perspective view taken from the rear of the radiation imaging device 100, and Figure 5B This is a schematic cross-sectional view of the cross-sectional structure of the holding part.

[0034] In this embodiment, a gripping member 530 is used to form a recess to be gripped in the housing of the radiographic imaging device 100. The gripping member 530 is secured by thermally insulating double-sided tape 540 so as to be embedded into an opening provided in the rear housing 120. As mentioned in Embodiment 2, the gripping member 530 can be made of resin, rubber, or the like. That is, the gripping member 530 is made of a non-conductive material. For this reason, the gripping member 530 does not have the effect of shielding the opening provided in the rear housing 120, and may cause electromagnetic stress from outside the device to enter the interior of the device. If such electromagnetic stress manifests as noise in the radiographic image signal or the control signal used for imaging operation, it may cause image noise, malfunctions, etc. In particular, the charge signal read from the sensor panel 140 for forming the image is a very small signal and is easily affected by electromagnetic stress.

[0035] Considering these factors, the radiographic imaging apparatus 100 according to this embodiment is configured such that the aforementioned electromagnetic stress does not reach the portion of the charge signal before it is amplified and undergoes A / D conversion. Specifically, in the radiographic imaging apparatus 100 according to this embodiment, no gripping member 530 or opening in the rear housing 120 into which the gripping member 530 is to be embedded is provided near the flexible plate 142 for connecting the charge signal to the circuit board (i.e., for connecting the integrated circuit 151 to the sensor panel 140) and the integrated circuit 151 for amplifying the charge signal and performing A / D conversion thereon. In this embodiment, the gripping member 530 is provided near two opposing sides, and the flexible plate 142 and the integrated circuit 151 are arranged near the side perpendicular to these sides. The integrated circuit 151, which generates a large amount of heat, is deployed away from the gripping portion 300, thus further reducing discomfort felt by the operator and / or the subject to be examined. Similarly, the circuit boards that generate a lot of heat are arranged in areas away from the grip portion 300 (e.g., near a side different from the side closest to the grip portion 300, or near the side furthest from the grip portion 300), thus further reducing discomfort felt by the operator and / or the subject to be examined.

[0036] Furthermore, the antenna 146 can also be provided near any of the gripping members 530. Specifically, the gripping member 530 and the opening in the rear housing 120 into which the gripping member 530 is to be embedded are provided near the side where the antenna 146 is arranged. Wireless communication using the antenna 146 is performed between the radiographic imaging device 100 and an external device via a wireless communication unit 135 provided in the housing. The wireless communication unit 135 is formed by providing an opening in a housing made of conductive material and attaching a non-conductive cover thereto. Here, by providing the gripping member 530 near the antenna 146, wireless communication can be performed not only via the wireless communication unit 135 but also via the area surrounding the gripping member 530, thus increasing communication stability. It is also possible to configure the device without providing the wireless communication unit 135 and perform wireless communication only via the area surrounding the gripping member 530. By arranging the antenna 146, which generates a small amount of heat, in the region near the grip portion 300 (e.g., near the same side as the grip portion 300, or near the side closest to the grip portion 300), it is also helpful to arrange the circuit board, which generates a large amount of heat, in the region far from the grip portion (e.g., near the side different from the grip portion 300, or near the side farthest from the grip portion 300). The non-thermally conductive sheet 310 can be formed near the side of the housing closest to the antenna.

[0037] Furthermore, the housing of the radiographic imaging apparatus 100, comprising the front housing 110, the rear housing 120, the radiation transmission plate 130, and the gripping member 530, can be fixed to the internal base 144 at a portion of the gripping member 530. In this embodiment, the housing is fixed using screws 550. Alternatively, the fixing method can be any method including adhesive and the use of rivets. As a result of the integration of the housing and internal components via the gripping member 530 made of a non-conductive material, a configuration can be achieved where external electrical stresses (such as electrostatic discharge) are not conducted to the interior. By arranging screws 550 made of a highly thermally conductive material on the gripping surface and in the area from the gripping surface to the side of the device—that is, outside the area that may be touched when operating the device—discomfort felt by the operator and / or the subject to be examined can also be reduced.

[0038] As described above, this embodiment can provide a radiographic imaging device that is resistant to external electromagnetic stress and electrostatic discharge, and is capable of stable wireless communication, while reducing discomfort felt by the operator and / or the subject being examined.

[0039] Although the above embodiment employs a configuration where the sensor panel 140 and electronic circuitry such as the integrated circuit 151 and circuit board 143 are surrounded by a front housing 110 and a rear housing 120, alternatively, these components can be surrounded by a single housing. Furthermore, the shape of the recess forming each grip portion is not limited to the shape shown in the figures. For example, the shape of the recess forming each grip portion may be a shape without a surface parallel to the back of the housing.

[0040] While the invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be given the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A radiation imaging device, characterized in that, include: A radiation sensor configured to convert incident radiation into an electrical signal; as well as A housing configured to surround the radiation sensor. The housing has a retaining portion shaped as a recess on its back side, opposite to the radiation incident surface. The gripping portion is formed by a gripping portion forming member that is separate from the rear housing constituting the back side, and The holding portion forming member has a thermal conductivity lower than that of the rear shell.

2. A radiation imaging device, characterized in that, include: A radiation sensor configured to convert incident radiation into an electrical signal; as well as A housing configured to surround the radiation sensor. The housing has a retaining portion shaped as a recess on its back side, opposite to the radiation incident surface. The gripping portion is formed by a gripping portion forming member that is separate from the rear housing constituting the back side. The gripping portion forming member is formed of resin material or rubber material, and The rear housing is formed of aluminum, magnesium alloy or CFRP.

3. The radiation imaging apparatus according to claim 1 or 2, characterized in that, A portion of the gripping part, or the deepest part of the gripping part, is formed within 60 mm of the side of the housing closest to the gripping part.

4. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The depth of the recess in the holding portion is greater than the depth of the centroid of the radiation imaging device in its thickness direction.

5. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The depth of the recess in the holding portion is greater than or equal to half the thickness of the radiation imaging device.

6. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The thickness of the radiation imaging device is 13 mm to 16 mm.

7. The radiation imaging apparatus according to claim 6, characterized in that, The maximum depth of the recess in the gripping portion is 6.5 mm to 8.0 mm.

8. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The holding portion forming component has an undercut shape.

9. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The gripping portion has a finger-holding surface that forms an angle of 120° or less relative to the back surface.

10. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The holding portion forming member includes an R shape.

11. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The gripping part forming component has a concave-convex shape that can be hooked by fingers.

12. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The rear housing is provided with an opening, and The holding portion is formed by fitting a component into the opening.

13. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The holding portion forming member is fixed to the radiation imaging device via a thermally insulating member.

14. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The gripping component is attached to the rear housing via double-sided adhesive tape.

15. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The gripping portions are formed near two opposite sides of the four sides on the back.

16. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The gripping portion forming member has a recessed area and an extension area extending from the recessed area toward the nearest of the four sides of the back surface.

17. The radiation imaging apparatus according to claim 1 or 2, characterized in that, Also includes: An antenna for wireless communication is provided inside the housing. The gripping portion is formed near the side of the housing closest to the antenna.

18. The radiation imaging apparatus according to claim 1 or 2, characterized in that, An integrated circuit for amplifying the electrical signal obtained by the radiation sensor and performing A / D conversion thereon is arranged near the side of the four sides of the back surface that is different from the side on which the gripping portion is formed.

19. The radiation imaging apparatus according to claim 1 or 2, characterized in that, Also includes: Electronic components configured to process the electrical signals obtained by the radiation sensor. A heat-conducting component is provided between the electronic component and the housing.

20. The radiation imaging apparatus according to claim 1 or 2, characterized in that, Also includes: An internal base configured to support the radiation sensor. The holding portion forms a component that contacts the internal base.

21. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The housing is constructed by combining multiple components, including the rear housing and the radiation transmission plate.

22. The radiation imaging apparatus according to claim 1 or 2, characterized in that, The housing has at least one selected from the group consisting of an indicator for indicating the reading center, an indicator for indicating the reading area, a switch, a status display unit, a wireless communication unit, and a wired communication connection unit.

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