Cutting and separating structure for TF card chip package

Abstract

The application belongs to the technical field of TF card chip packaging processing equipment, and particularly relates to a cutting and separating structure for TF card chip packaging, which comprises a base frame, a rack, an X-axis module, a suction mechanism, a dust removal mechanism, a Y-axis module, a Z-axis module, an angle adjusting mechanism and a laser cutting head. The suction mechanism comprises a vacuum suction table, a suction frame, a vacuum pump and an air extraction pipe. The dust removal mechanism comprises a dust removal shaft, an activated carbon plate, a blanking pipe, a flexible filter screen and a dust collection bucket. The cutting and separating structure for TF card chip packaging provided by the application drives the activated carbon plate to rotate by using the airflow of the vacuum pump. On the one hand, the activated carbon plate adsorbs superfine dust, and on the other hand, the activated carbon plate cleans the flexible filter screen by beating, so as to avoid filter material blockage, improve the adsorption force of the vacuum suction hole, effectively avoid the invasion of debris into the gear and rack transmission mechanism, improve the transmission precision, collect the debris in the dust collection bucket through the blanking pipe, and realize the integration of adsorption, filtration, self-cleaning and collection.

Description

Technical Field

[0001] This invention belongs to the technical field of TF card chip packaging and processing equipment, and particularly relates to a cutting and separating structure for TF card chip packaging. Background Technology

[0002] As TF cards evolve towards miniaturization and high-density packaging, laser cutting technology has become a core process for TF card chip packaging and separation due to its advantages such as high cutting precision and small heat-affected zone. However, the laser cutting process generates a large number of ultrafine metal debris, resin dust, and oxide particles (with particle sizes as low as below 0.3μm). These debris have extremely strong adhesion and agglomeration properties, which can clog vacuum adsorption holes (traditional adsorption hole diameters are typically 0.3-0.8mm), leading to decreased adsorption force, workpiece displacement, and intrusion into the gear and rack transmission mechanism, accelerating tooth surface wear and reducing repeatability. Summary of the Invention

[0003] The purpose of this invention is to provide a cutting and separation structure for TF card chip packaging, which aims to solve the technical problem that the debris generated during the processing of traditional TF card chip packaging laser cutting equipment will block the vacuum adsorption hole, resulting in the weakening of adsorption force, workpiece displacement, and intrusion into the gear and rack transmission mechanism, accelerating tooth surface wear and reducing repeatability accuracy.

[0004] To achieve the above objectives, the present invention provides a TF card chip packaging cutting and separation structure, including a base frame, a frame, an X-axis module, an adsorption mechanism, a dust removal mechanism, a Y-axis module, a Z-axis module, an angle adjustment mechanism, and a laser cutting head. The frame is fixed to the side of the base frame, the X-axis module is fixed to the base frame, the adsorption mechanism is fixed to the X-axis module, the dust removal mechanism is fixed to the adsorption mechanism, the Y-axis module is fixed to the frame, the Z-axis module is fixed to the Y-axis module, the angle adjustment mechanism is fixed to the Z-axis module, and the laser cutting head is fixed to the angle adjustment mechanism.

[0005] The adsorption mechanism includes a vacuum adsorption stage, an adsorption frame, a vacuum pump, and an exhaust pipe. The vacuum adsorption stage is fixed to the X-axis module, the adsorption frame is fixed to the bottom side of the vacuum adsorption stage, the vacuum pump is fixed to the adsorption frame, and one end of the exhaust pipe is fixed to the vacuum adsorption stage and the other end is fixed to the vacuum pump.

[0006] The dust removal mechanism includes a dust removal shaft, an activated carbon plate, a feeding pipe, a flexible filter screen, and a dust collection bin. The dust removal shaft is rotatably connected to the exhaust pipe, the activated carbon plate is fixed to the dust removal shaft, one end of the feeding pipe is connected to the exhaust pipe, and the other end is connected to the dust collection bin.

[0007] As an optional embodiment of the present invention, one end of the flexible filter screen is connected to the feed pipe and the other end is connected to the exhaust pipe, and the dust collection bin is disposed on the adsorption frame; the activated carbon plate is disposed at the connection between the exhaust pipe and the feed pipe, and one end is in contact with the flexible filter screen; the activated carbon plate rotates in the exhaust pipe through the airflow generated by the vacuum pump, and beats the flexible filter screen in the exhaust pipe, causing the debris on the flexible filter screen to fall into the feed pipe, and the dust collection bin collects the debris in the feed pipe.

[0008] As an optional embodiment of the present invention, the vacuum adsorption stage is provided with a plurality of vacuum adsorption holes, which are evenly arranged on the vacuum adsorption stage; the activated carbon plate is provided with a plurality of holes and is evenly fixed to the dust removal shaft.

[0009] As an optional embodiment of the present invention, the X-axis module includes an X-axis bracket, an X-axis motor, an X-axis gear, an X-axis rack, an X-axis slide rail, and an X-axis slider. The X-axis bracket is fixed to the vacuum adsorption stage, the X-axis motor is fixed to the X-axis bracket, the X-axis gear is fixed to the X-axis motor and meshes with the X-axis rack; the X-axis rack and the X-axis slide rail are sequentially fixed to the base frame, and the X-axis slider is slidably connected to the X-axis slide rail and fixedly connected to the vacuum adsorption stage.

[0010] As an optional embodiment of the present invention, the Y-axis module includes a Y-axis bracket, a Y-axis motor, a Y-axis gear, a Y-axis rack, a Y-axis slide rail, and a Y-axis slider. The Y-axis bracket is fixed to the Y-axis slider and the Z-axis module, respectively. The Y-axis motor is fixed to the Y-axis bracket, and the Y-axis gear is fixed to the Y-axis motor and meshes with the Y-axis rack. The Y-axis rack and the Y-axis slide rail are sequentially fixed to the base frame, and the Y-axis slider is slidably connected to the Y-axis slide rail.

[0011] As an optional embodiment of the present invention, the Z-axis includes a Z-axis plate, a Z-axis motor, a Z-axis gear, a Z-axis rack, a Z-axis slide rail, and a Z-axis slider. The Z-axis plate is fixed to the Z-axis slider. The Z-axis motor is fixed to the Z-axis plate, and the Z-axis gear is fixed to the Z-axis motor and meshes with the Z-axis rack. The Z-axis rack and the Z-axis slide rail are sequentially fixed to the Y-axis bracket, and the Z-axis slider is slidably connected to the Z-axis slide rail.

[0012] As an optional embodiment of the present invention, the angle adjustment mechanism includes a first angle adjustment frame, a first angle adjustment motor, a second angle adjustment frame, and a second angle adjustment motor. The first angle adjustment frame is fixed to the Z-axis plate, and the first angle adjustment motor is fixed to the first angle adjustment frame. The second angle adjustment frame is fixed to the first angle adjustment motor, and the second angle adjustment motor is fixed to the second angle adjustment frame.

[0013] The above-mentioned technical solutions in the TF card chip packaging cutting and separation structure provided in the embodiments of the present invention have at least one of the following technical effects:

[0014] The TF card chip packaging cutting and separation structure provided in this application uses a vacuum pump airflow to drive the activated carbon plate to rotate. On the one hand, the activated carbon plate adsorbs ultrafine dust, and on the other hand, the flexible filter screen is cleaned by the beating action to avoid filter material blockage, improve the adsorption force of the vacuum adsorption holes, and effectively prevent debris from entering the gear and rack transmission mechanism, thereby improving the transmission accuracy. The debris is collected in the dust collection bin through the feeding pipe, realizing the integration of adsorption-filtration-self-cleaning-collection. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a perspective view of the cutting and separating structure for TF card chip packaging provided in an embodiment of the present invention.

[0017] Figure 2 This is a perspective view of the cutting and separating structure for TF card chip packaging provided in an embodiment of the present invention.

[0018] Figure 3 This is a perspective view of the cutting and separating structure for TF card chip packaging provided in an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the internal structure of the dust removal mechanism for the cutting and separating structure of TF card chip packaging provided in an embodiment of the present invention.

[0020] Figure 5 for Figure 1 A magnified view of a portion of point A in the middle.

[0021] Figure 6 for Figure 2 A magnified view of a section at point B.

[0022] Figure 7 for Figure 3 A magnified view of a section at point C.

[0023] The following are the labeling elements in the figure:

[0024] 1. Base frame; 2. Frame; 3. X-axis module; 4. Adsorption mechanism; 5. Dust removal mechanism; 6. Y-axis module; 7. Z-axis module; 8. Angle adjustment mechanism; 9. Laser cutting head;

[0025] 31. X-axis support; 32. X-axis motor; 34. X-axis rack; 35. X-axis slide rail; 36. X-axis slider;

[0026] 41. Vacuum adsorption stage; 42. Adsorption rack; 43. Vacuum pump; 44. Evacuation pipe;

[0027] 411. Vacuum adsorption pores;

[0028] 51. Dust collector shaft; 52. Activated carbon plate; 53. Feed pipe; 54. Flexible filter screen; 55. Dust collection bin;

[0029] 61. Y-axis bracket; 62. Y-axis motor; 64. Y-axis rack; 65. Y-axis slide rail; 66. Y-axis slider;

[0030] 71. Z-axis plate; 72. Z-axis motor; 74. Z-axis rack; 75. Z-axis slide rail; 76. Z-axis slider;

[0031] 81. First angle adjustment frame; 82. First angle adjustment motor; 83. Second angle adjustment frame; 84. Second angle adjustment motor. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0036] In one embodiment of the present invention, such as Figures 1-7 As shown, a cutting and separation structure for TF card chip packaging is provided, including a base frame 1, a frame 2, an X-axis module 3, an adsorption mechanism 4, a dust removal mechanism 5, a Y-axis module 6, a Z-axis module 7, an angle adjustment mechanism 8, and a laser cutting head 9. The frame 2 is fixed to the side of the base frame 1, the X-axis module 3 is fixed to the base frame 1, the adsorption mechanism 4 is fixed to the X-axis module 3, the dust removal mechanism 5 is fixed to the adsorption mechanism 4, the Y-axis module 6 is fixed to the frame 2, the Z-axis module 7 is fixed to the Y-axis module 6, the angle adjustment mechanism 8 is fixed to the Z-axis module 7, and the laser cutting head 9 is fixed to the angle adjustment mechanism 8.

[0037] The adsorption mechanism 4 includes a vacuum adsorption stage 41, an adsorption frame 42, a vacuum pump 43, and a suction pipe 44. The vacuum adsorption stage 41 is fixed to the X-axis module 3, the adsorption frame 42 is fixed to the bottom side of the vacuum adsorption stage 41, the vacuum pump 43 is fixed to the adsorption frame 42, and one end of the suction pipe 44 is fixed to the vacuum adsorption stage 41, and the other end is fixed to the vacuum pump 43. Preferably, the vacuum pump 43 is an oil-free diaphragm pump to avoid oil contamination of the chip.

[0038] The dust removal mechanism 5 includes a dust removal shaft 51, an activated carbon plate 52, a feeding pipe 53, a flexible filter screen 54, and a dust collection bin 55. The dust removal shaft 51 is rotatably connected to the exhaust pipe 44, and the activated carbon plate 52 is fixed to the dust removal shaft 51. One end of the feeding pipe 53 is connected to the exhaust pipe 44, and the other end is connected to the dust collection bin 55. The flexible filter screen 54 is preferably made of polytetrafluoroethylene (PTFE), which has the advantages of high temperature resistance and non-adhesive dust. The pore size of the filter holes on the flexible filter screen 54 is 1-3 μm, and the filter holes are hexagonal.

[0039] In another embodiment of the present invention, one end of the flexible filter screen 54 is connected to the feed pipe 53 and the other end is connected to the exhaust pipe 44. The dust collection bin 55 is disposed on the adsorption rack 42. The activated carbon plate 52 is disposed at the connection between the exhaust pipe 44 and the feed pipe 53, and one end is in contact with the flexible filter screen 54. The activated carbon plate 52 rotates in the exhaust pipe 44 by the airflow generated by the vacuum pump 43, and beats the flexible filter screen 54 in the exhaust pipe 44. The debris on the flexible filter screen 54 falls into the feed pipe 53, and the dust collection bin 55 collects the debris in the feed pipe 53.

[0040] In another embodiment of the present invention, the vacuum adsorption stage 41 is provided with a plurality of vacuum adsorption holes 411, which are uniformly arranged on the vacuum adsorption stage 41; the activated carbon plate 52 is provided with a plurality of holes and is uniformly fixed to the dust removal shaft 51.

[0041] In another embodiment of the present invention, the X-axis module 3 includes an X-axis bracket 31, an X-axis motor 32, an X-axis gear, an X-axis rack 34, an X-axis slide rail 35, and an X-axis slider 36. The X-axis bracket 31 is fixed to the vacuum adsorption stage 41, the X-axis motor 32 is fixed to the X-axis bracket 31, the X-axis gear is fixed to the X-axis motor 32 and meshes with the X-axis rack 34; the X-axis rack 34 and the X-axis slide rail 35 are sequentially fixed to the base frame 1, and the X-axis slider 36 is slidably connected to the X-axis slide rail 35 and fixedly connected to the vacuum adsorption stage 41.

[0042] In another embodiment of the present invention, the Y-axis module 6 includes a Y-axis bracket 61, a Y-axis motor 62, a Y-axis gear, a Y-axis rack 64, a Y-axis slide rail 65, and a Y-axis slider 66. The Y-axis bracket 61 is fixed to the Y-axis slider 66 and the Z-axis module 7, respectively. The Y-axis motor 62 is fixed to the Y-axis bracket 61, and the Y-axis gear is fixed to the Y-axis motor 62 and meshes with the Y-axis rack 64. The Y-axis rack 64 and the Y-axis slide rail 65 are fixed to the base frame 1 in sequence, and the Y-axis slider 66 is slidably connected to the Y-axis slide rail 65.

[0043] In another embodiment of the present invention, the Z-axis includes a Z-axis plate 71, a Z-axis motor 72, a Z-axis gear, a Z-axis rack 74, a Z-axis slide rail 75, and a Z-axis slider 76. The Z-axis plate 71 is fixed to the Z-axis slider 76; the Z-axis motor 72 is fixed to the Z-axis plate 71; the Z-axis gear is fixed to the Z-axis motor 72 and meshes with the Z-axis rack 74; the Z-axis rack 74 and the Z-axis slide rail 75 are sequentially fixed to the Y-axis bracket 61; and the Z-axis slider 76 is slidably connected to the Z-axis slide rail 75.

[0044] In another embodiment of the present invention, the angle adjustment mechanism 8 includes a first angle adjustment frame 81, a first angle adjustment motor 82, a second angle adjustment frame 83, and a second angle adjustment motor 84. The first angle adjustment frame 81 is fixed to the Z-axis plate 71, and the first angle adjustment motor 82 is fixed to the first angle adjustment frame 81; the second angle adjustment frame 83 is fixed to the first angle adjustment motor 82, and the second angle adjustment motor 84 is fixed to the second angle adjustment frame 83. The laser cutting head 9 can adjust the cutting angle through the first angle adjustment motor 82 and the second angle adjustment motor 84.

[0045] The cutting and separating structure for TF card chip packaging provided in this application operates as follows:

[0046] Workpiece fixing: Place the TF card chip package (size ≤50×30mm) on the surface of the vacuum adsorption stage 41, start the vacuum pump 43, and generate negative pressure through the adsorption hole (adsorption pressure ≥-80kPa) to firmly fix the workpiece.

[0047] Positioning and angle adjustment: According to the cutting path, the X-axis and Y-axis modules 6 move in concert to send the workpiece to the cutting start position, the Z-axis module 7 adjusts the height of the laser cutting head 9 (cutting spacing 0.1-0.5mm), and the angle adjustment mechanism 8 adjusts the laser beam incident angle according to the cutting requirements;

[0048] Laser cutting: The laser cutting head 9 (power 100-500W, spot diameter 0.1mm) is started and cuts along the preset path. During the cutting process, the debris generated is sucked into the air extraction pipe 44 with the airflow.

[0049] Debris handling: The airflow (velocity ≥15m / s) in the extraction pipe 44 impacts the activated carbon plate 52, driving the dust removal shaft 51 to rotate at a speed of 30-50r / min. During the rotation, the activated carbon plate 52 performs two functions: ① adsorbs ultrafine dust and volatile organic compounds in the airflow; ② periodically beats the flexible filter screen 54 to prevent dust from caking on the filter material surface; the debris that is beaten off falls into the dust collection bin 55 through the feed pipe 53.

[0050] Operation completed: After cutting, the laser cutting head 9 is turned off, the X-axis, Y-axis, and Z-axis modules 7 are reset, the vacuum pump 43 stops working, the processed TF card chip is removed, and the dust collection bin 55 is cleaned regularly before repeating the operation.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A cutting and separating structure for TF card chip packaging, characterized in that, The device includes a base frame, a frame, an X-axis module, an adsorption mechanism, a dust removal mechanism, a Y-axis module, a Z-axis module, an angle adjustment mechanism, and a laser cutting head. The frame is fixed to the side of the base frame, the X-axis module is fixed to the base frame, the adsorption mechanism is fixed to the X-axis module, the dust removal mechanism is fixed to the adsorption mechanism, the Y-axis module is fixed to the frame, the Z-axis module is fixed to the Y-axis module, the angle adjustment mechanism is fixed to the Z-axis module, and the laser cutting head is fixed to the angle adjustment mechanism. The adsorption mechanism includes a vacuum adsorption stage, an adsorption frame, a vacuum pump, and an exhaust pipe. The vacuum adsorption stage is fixed to the X-axis module, the adsorption frame is fixed to the bottom side of the vacuum adsorption stage, the vacuum pump is fixed to the adsorption frame, and one end of the exhaust pipe is fixed to the vacuum adsorption stage and the other end is fixed to the vacuum pump. The dust removal mechanism includes a dust removal shaft, an activated carbon plate, a feeding pipe, a flexible filter screen, and a dust collection bin. The dust removal shaft is rotatably connected to the exhaust pipe, the activated carbon plate is fixed to the dust removal shaft, one end of the feeding pipe is connected to the exhaust pipe, and the other end is connected to the dust collection bin.

2. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, One end of the flexible filter screen is connected to the feed pipe, and the other end is connected to the exhaust pipe. The dust collection bin is installed on the adsorption rack. The activated carbon plate is installed at the connection between the exhaust pipe and the feed pipe, and one end is in contact with the flexible filter screen. The activated carbon plate rotates in the exhaust pipe due to the airflow generated by the vacuum pump, and beats the flexible filter screen in the exhaust pipe. The debris on the flexible filter screen falls into the feed pipe, and the dust collection bin collects the debris in the feed pipe.

3. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, The vacuum adsorption stage is provided with multiple vacuum adsorption holes, which are evenly arranged on the vacuum adsorption stage; multiple activated carbon plates are provided and evenly fixed to the dust removal shaft.

4. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, The X-axis module includes an X-axis bracket, an X-axis motor, an X-axis gear, an X-axis rack, an X-axis slide rail, and an X-axis slider. The X-axis bracket is fixed to the vacuum adsorption stage, the X-axis motor is fixed to the X-axis bracket, the X-axis gear is fixed to the X-axis motor and meshes with the X-axis rack; the X-axis rack and the X-axis slide rail are sequentially fixed to the base frame, and the X-axis slider is slidably connected to the X-axis slide rail and fixedly connected to the vacuum adsorption stage.

5. The cutting and separating structure for TF card chip packaging according to claim 4, characterized in that, The Y-axis module includes a Y-axis bracket, a Y-axis motor, a Y-axis gear, a Y-axis rack, a Y-axis slide rail, and a Y-axis slider. The Y-axis bracket is fixed to the Y-axis slider and the Z-axis module, respectively. The Y-axis motor is fixed to the Y-axis bracket, and the Y-axis gear is fixed to the Y-axis motor and meshes with the Y-axis rack. The Y-axis rack and the Y-axis slide rail are sequentially fixed to the base frame, and the Y-axis slider is slidably connected to the Y-axis slide rail.

6. The cutting and separating structure for TF card chip packaging according to claim 5, characterized in that, The Z-axis includes a Z-axis plate, a Z-axis motor, a Z-axis gear, a Z-axis rack, a Z-axis slide rail, and a Z-axis slider. The Z-axis plate is fixed to the Z-axis slider. The Z-axis motor is fixed to the Z-axis plate. The Z-axis gear is fixed to the Z-axis motor and meshes with the Z-axis rack. The Z-axis rack and Z-axis slide rail are sequentially fixed to the Y-axis bracket. The Z-axis slider is slidably connected to the Z-axis slide rail.

7. The cutting and separating structure for TF card chip packaging according to claim 1, characterized in that, The angle adjustment mechanism includes a first angle adjustment frame, a first angle adjustment motor, a second angle adjustment frame, and a second angle adjustment motor. The first angle adjustment frame is fixed to the Z-axis plate, and the first angle adjustment motor is fixed to the first angle adjustment frame. The second angle adjustment frame is fixed to the first angle adjustment motor, and the second angle adjustment motor is fixed to the second angle adjustment frame.

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