Flexible integrated circuit board processing apparatus and process
By using flexible integrated circuit board processing equipment with multiple hinge plates and a pushing mechanism, the stress is gradually released and the angle is precisely controlled during multiple bending processes. This solves the problems of low bending efficiency and high stress in existing technologies and improves the forming quality of flexible circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAMEN XINGKE ELECTRONICS CO LTD
- Filing Date
- 2026-06-16
- Publication Date
- 2026-07-14
Smart Images
Figure CN122379009A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board processing technology, and in particular to a flexible integrated circuit board processing equipment and process. Background Technology
[0002] After production, existing flexible integrated circuit boards (FPCs) require bending processing according to the application scenario. For example, patent document CN222897367U discloses a bending fixture for flexible integrated circuit boards, including a base plate, on which first sliders are slidably connected on both sides, and a moving mechanism for driving the first sliders to slide is fixedly connected to the base plate. The first sliders are provided with a fixing mechanism for fixing the flexible integrated circuit board, and connecting plates are rotatably connected on both sides of the base plate. The base plate is provided with a second groove, in which a second slider is slidably connected. A bending block is fixedly connected to the second slider. The two connecting plates can adjust the bending angle, and the flexible integrated circuit board can be bent by pushing the bending block.
[0003] However, the aforementioned bending fixture can only form one bending angle at a time. For flexible integrated circuit boards that require multiple bending angles (such as Z-shaped or stepped bending), multiple clamping and bending are required, resulting in low processing efficiency. At the same time, the bending process can easily cause large residual stress in the flexible integrated circuit board, with large and unpredictable springback, which often leads to the final forming angle not meeting the requirements. Summary of the Invention
[0004] Therefore, it is necessary to provide a flexible integrated circuit board processing equipment and process to address the technical problems of low bending efficiency and the generation of large residual stress that affects the forming angle.
[0005] The above objectives are achieved through the following technical solutions: A flexible integrated circuit board processing device includes a base plate, a first bending member, a second bending member, a pressing mechanism, and a pushing mechanism. The base plate is placed horizontally, and a first fixing plate and a second fixing plate are spaced apart on the base plate. The first bending member is hinged between the first fixing plate and the second fixing plate, and the first bending member includes at least three first hinge plates that are sequentially hinged along the length direction of the flexible integrated circuit board, and the first hinge plates are perpendicular to the base plate. The second bending member is hinged to the base plate, and the second bending member includes at least three second hinge plates that are sequentially hinged along the length direction of the flexible integrated circuit board, and the second hinge plates are perpendicular to the base plate. The pressing mechanism is used to press and fix the two ends of the flexible integrated circuit board along its length direction to the first and second fixing plates respectively. One side of a fixed plate and a second fixed plate; the pushing mechanism is simultaneously connected to the first bending member and the second bending member, and is used to drive the middle parts of the first bending member and the second bending member to swing and deform horizontally on the base plate respectively; the pushing mechanism has a first state and a second state. In the first state, the pushing mechanism drives the first bending member to swing towards the second bending member, so that the first bending member and the second bending member jointly clamp the flexible integrated circuit board and perform a first bending on the flexible integrated circuit board; in the second state, the pushing mechanism drives the first bending member and the second bending member to swing synchronously and perform a second bending on the flexible integrated circuit board, thereby forming two bending angles on the flexible integrated circuit board.
[0006] Furthermore, the pressing mechanism includes a first cylinder and a second cylinder. The first cylinder corresponds to the first fixed plate and is used to press one end of the flexible integrated circuit board onto the first fixed plate. The second cylinder corresponds to the second fixed plate and is used to press the other end of the flexible integrated circuit board onto the second fixed plate.
[0007] Furthermore, elastic sleeves are fitted at the hinge positions of two adjacent second hinge plates and two adjacent first hinge plates, and the elastic sleeves are fitted onto the surface of the first hinge plate or the second hinge plate.
[0008] Furthermore, the length directions of both the first hinge plate and the second hinge plate are consistent with the length direction of the flexible integrated circuit board; the second hinge plate includes a first hinge unit and a second hinge unit that are slidably connected along its length direction, one end of the first hinge unit is retractably disposed inside the second hinge unit, and a tension spring is connected between the first hinge unit and the second hinge unit, the tension spring having a tendency to pull the first hinge unit back into the second hinge unit.
[0009] Furthermore, the initial lengths of the first and second bent parts are the same, and both are equal to the length of the flexible integrated circuit board.
[0010] Furthermore, there are three of each of the first and second hinge plates, with each first hinge plate corresponding to one of the second hinge plates, and the length of each first hinge plate is equal to that of the corresponding second hinge plate.
[0011] Furthermore, the three first hinge plates are sequentially divided into a first plate, a second plate, and a third plate. The first plate is hinged to the first fixed plate, and the third plate is hinged to the second fixed plate. The three second hinge plates are sequentially divided into a fourth plate, a fifth plate, and a sixth plate. The fourth plate is hinged to the third fixed plate, and the sixth plate is hinged to the fourth fixed plate. A limiting plate is also fixedly provided on the base plate, which is used to limit the maximum swing angle of the fourth plate.
[0012] Furthermore, the pushing mechanism includes a third cylinder and a fourth cylinder. The third plate is provided with a first slide rail extending along its length direction. The extended end of the third cylinder is slidably disposed in the first slide rail, so that the extension and retraction of the third cylinder can push the third plate to move synchronously. The sixth plate is provided with a second slide rail extending along its length direction. The output end of the fourth cylinder is slidably disposed in the second slide rail, so that the extension and retraction of the fourth cylinder can push the sixth plate to move synchronously.
[0013] Furthermore, in the initial state, the plane containing the fourth plate and the plane containing the fifth plate form an obtuse angle; the fifth plate and the sixth plate are disposed on the same plane.
[0014] A flexible integrated circuit board processing technology, using the aforementioned flexible integrated circuit board processing equipment, includes the following steps: S1. Place the flexible integrated circuit board between the first bending member and the second bending member, and use the clamping mechanism to clamp and fix both ends of the flexible integrated circuit board. S2. Start the push mechanism to enter the first state, so that the first bending member moves towards the second bending member until the first bending member and the second bending member jointly clamp the flexible integrated circuit board to complete one bending. S3. Start the push mechanism to enter the second state, so that the first bending member and the second bending member swing synchronously to perform a second bending on the flexible integrated circuit board in the clamping state; S4. After bending is completed, reset the pushing mechanism, release the clamping mechanism, and remove the bent flexible integrated circuit board.
[0015] The beneficial effects of this invention are: The flexible integrated circuit board processing equipment and process provided by the present invention, firstly, by setting a first bending member hinged by three first hinge plates and a second bending member hinged by three second hinge plates, the first bending member and the second bending member can clamp the flexible integrated circuit board, and in conjunction with the two states of the push mechanism, realize one clamping and two bending. Finally, the flexible integrated circuit board can form two bending angles in one bending operation. At the same time, the stress is gradually released and rebalanced during the two bending processes, reducing the springback of the flexible integrated circuit board after bending, so that its forming angle meets the requirements.
[0016] Secondly, since both ends of the flexible integrated circuit board are pressed and fixed respectively, by designing the second hinge plate as a telescopic structure, there will be no relative displacement between the hinge position on the second bending member and the second bending angle of the flexible integrated circuit board when the flexible circuit board is bent twice, thereby reducing the pressure wear on the flexible integrated circuit board and improving the bending forming quality of the flexible integrated circuit board.
[0017] Third, by setting an elastic sleeve at the hinge position, the flexible integrated circuit board can be prevented from being pinched. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of a flexible integrated circuit board processing equipment provided in an embodiment of the present invention (the corresponding push mechanism is in its initial state). Figure 2 for Figure 1 A top-down view; Figure 3 for Figure 1 A side view diagram; Figure 4 for Figure 3 Schematic diagram of the AA section; Figure 5 for Figure 1 Another state diagram (corresponding to the jacking mechanism being in the second state); Figure 6 for Figure 5 A top-down view; Figure 7 for Figure 5 A side view diagram; Figure 8 for Figure 7 Schematic diagram of the BB section; Figure 9 for Figure 8 Enlarged view of the structure at point X; Figure 10 for Figure 8 Enlarged view of the structure at point Y.
[0019] in: 100. Base plate; 101. First cylinder; 102. Second cylinder; 1031. First fixing plate; 1032. Second fixing plate; 1033. Third fixing plate; 1034. Fourth fixing plate; 104. Fourth cylinder; 105. Third cylinder; 106. First bending component; 1061. First slide rail; 107. Second bending component; 1071. Second slide rail; 108. Limiting plate; 109. Flexible integrated circuit board; 110. Elastic sleeve; 111. First hinge unit; 112. Tension spring; 113. Square column; 114. Mounting hole; 115. Second hinge unit. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0021] The component designations used in this document, such as "first" and "second," are merely for distinguishing the described objects and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.
[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0023] like Figures 1 to 10 As shown, an embodiment of the present invention provides a flexible integrated circuit board processing equipment (hereinafter referred to as processing equipment), including a base plate 100, a first bending member 106, a second bending member 107, a pressing mechanism and a pushing mechanism; the base plate 100 is placed horizontally, and a first fixing plate 1031 and a second fixing plate 1032 are spaced apart on the base plate 100.
[0024] The base plate 100 is also provided with a third fixing plate 1033 and a fourth fixing plate 1034 at intervals. The first fixing plate 1031 is arranged adjacent to the third fixing plate 1033, and the second fixing plate 1032 is arranged adjacent to the fourth fixing plate 1034.
[0025] The first bending member 106 is hinged between the first fixing plate 1031 and the second fixing plate 1032. The first bending member 106 includes at least three first hinge plates that are sequentially hinged along the length of the flexible integrated circuit board 109. The first hinge plates are perpendicular to the base plate 100.
[0026] The second bending member 107 is located on one side of the first bending member 106 and is hinged to the base plate 100. One end of the second bending member 107 is hinged to the third fixing plate 1033 and the other end is hinged to the fourth fixing plate 1034. The second bending member 107 includes at least three second hinge plates that are sequentially hinged along the length of the flexible integrated circuit board 109 and are perpendicular to the base plate 100.
[0027] The clamping mechanism is used to clamp and fix the two ends of the flexible integrated circuit board 109 along its length to one side of the first fixing plate 1031 and the second fixing plate 1032, respectively.
[0028] The pushing mechanism is simultaneously connected to the first bending member 106 and the second bending member 107, and is used to drive the middle portions of the first bending member 106 and the second bending member 107 to swing and deform horizontally on the base plate 100, respectively. The pushing mechanism has a first state and a second state. In the first state, the pushing mechanism drives the first bending member 106 to swing towards the second bending member 107, so that the first bending member 106 and the second bending member 107 jointly clamp the flexible integrated circuit board 109 and bend the flexible integrated circuit board 109 once. In the second state, the pushing mechanism drives the first bending member 106 and the second bending member 107 to swing synchronously and bend the flexible integrated circuit board 109 a second time, thereby forming two bending angles on the flexible integrated circuit board 109.
[0029] Specifically, the base plate 100 is provided with mounting holes 114, and the base plate 100 can be installed on the ground by bolts passing through the mounting holes 114. In other embodiments, four first and second hinge plates can be provided, and two sets of pushing mechanisms can be configured to perform three bends, forming three bending angles on the flexible integrated circuit board 109. Alternatively, the number of first and second hinge plates can be automatically adjusted according to the number of bending angles.
[0030] The flexible integrated circuit board processing equipment of the present invention, by setting a first bending member 106 hinged by three first hinge plates and a second bending member 107 hinged by three second hinge plates, can clamp the flexible integrated circuit board 109. With the cooperation of the two states of the push mechanism, it can realize one clamping and two bending. The final bending operation can make the flexible integrated circuit board 109 form two bending angles. At the same time, the stress is gradually released and rebalanced during the two bending processes, reducing the springback of the flexible integrated circuit board 109 after bending and making its forming angle meet the requirements.
[0031] Furthermore, the clamping mechanism includes a first cylinder 101 and a second cylinder 102. The first cylinder 101 corresponds to the first fixed plate 1031 and is used to press one end of the flexible integrated circuit board 109 onto the first fixed plate 1031. The second cylinder 102 corresponds to the second fixed plate 1032 and is used to press the other end of the flexible integrated circuit board 109 onto the second fixed plate 1032. Specifically, the first cylinder 101 and the second cylinder 102 are respectively fixedly mounted on the base plate 100 by brackets. By using the first cylinder 101 and the second cylinder 102 to independently press both ends of the flexible integrated circuit board 109, the structure is simple, the response is fast, and the clamping force is adjustable.
[0032] Furthermore, elastic sleeves 110 are fitted at the hinge positions of two adjacent second hinge plates and two adjacent first hinge plates, and the elastic sleeves 110 are fitted against the surface of the first or second hinge plates. Specifically, the elastic sleeves 110 are rubber sleeves or silicone sleeves. Elastic sleeves 110 are provided at the hinge positions of the first fixing plate 1031 with the first hinge plate, the second fixing plate 1032 with the first hinge plate, the third fixing plate 1033 with the second hinge plate, and the fourth fixing plate 1034 with the second hinge plate. The elastic sleeves 110 can prevent the flexible integrated circuit board 109 from being pinched at the hinge positions.
[0033] Furthermore, the length directions of both the first and second hinge plates are consistent with the length direction of the flexible integrated circuit board. The second hinge plate includes a first hinge unit 111 and a second hinge unit 115 slidably connected along its length direction. One end of the first hinge unit 111 is retractably disposed inside the second hinge unit 115, and a tension spring 112 connects the first hinge unit 111 and the second hinge unit 115. The tension spring 112 has a tendency to pull the first hinge unit 111 back into the second hinge unit 115. The first hinge unit 111 is a rod-shaped structure, and the second hinge unit 115 is a cylindrical structure.
[0034] Since both ends of the flexible integrated circuit board 109 are pressed and fixed respectively, by designing the second hinge plate as a telescopic structure, when the flexible integrated circuit board 109 is bent twice, there will be no relative displacement between the hinge position on the second bending member 107 and the second bending angle of the flexible integrated circuit board 109, thereby reducing the pressure wear on the flexible integrated circuit board 109 and improving the bending forming quality of the flexible integrated circuit board 109.
[0035] Furthermore, the initial lengths of the first bending member 106 and the second bending member 107 are the same, and both are equal to the length of the flexible integrated circuit board 109. In this way, the entire length of the flexible integrated circuit board 109 can be supported and constrained during bending, preventing warping or uneven bending at any position.
[0036] Furthermore, three of each of the first and second hinge plates are provided, with one first hinge plate corresponding to one second hinge plate, and the lengths of each first hinge plate and its corresponding second hinge plate are equal. This facilitates the formation of two bending angles between the first and second hinge plates. The specific lengths of the first and second hinge plates can be designed as needed.
[0037] Furthermore, the three first hinge plates are sequentially divided into a first plate, a second plate, and a third plate. The first plate is hinged to the first fixed plate 1031, and the third plate is hinged to the second fixed plate 1032. The three second hinge plates are sequentially divided into a fourth plate, a fifth plate, and a sixth plate. The fourth plate is hinged to the third fixed plate 1033, and the sixth plate is hinged to the fourth fixed plate 1034. A limiting plate 108 is also fixedly provided on the base plate 100, which is used to limit the maximum swing angle of the fourth plate. The hinge axes of the first plate and the first fixed plate 1031, the third plate and the second fixed plate 1032, the fourth plate and the third fixed plate 1033, and the sixth plate and the fourth fixed plate 1034 are all fixedly provided on the base plate 100. The hinge axes between the first and second plates, the second and third plates, the fourth and fifth plates, and the fifth and sixth plates can all slide relative to the base plate 100, thus forming two bending angles through movement. The limiting plate 108 can prevent the second bending member 107 from swinging excessively and can precisely control the bending angle of a single bending.
[0038] Furthermore, the pushing mechanism includes a third cylinder 105 and a fourth cylinder 104. The third plate is provided with a first slide rail 1061 extending along its length. The extended end of the third cylinder 105 is slidably disposed within the first slide rail 1061, so that the extension and retraction of the third cylinder 105 can push the third plate to move synchronously. The sixth plate is provided with a second slide rail 1071 extending along its length. The output end of the fourth cylinder 104 is slidably disposed within the second slide rail 1071, so that the extension and retraction of the fourth cylinder 104 can push the sixth plate to move synchronously. Both the third cylinder 105 and the fourth cylinder 104 are fixedly disposed on the base plate 100 by square posts 113. The output end of the third cylinder 105 is provided with a first slide rod, which is slidably disposed within the first slide rail 1061. The output end of the fourth cylinder 104 is provided with a second slide rod, which is slidably disposed within the second slide rail 1071.
[0039] Furthermore, in the initial state, the plane containing the fourth plate and the plane containing the fifth plate form an obtuse angle, and the fifth and sixth plates are disposed on the same plane. The angles formed between the plane containing the first plate and the plane containing the second plate, as well as the angles formed between the plane containing the second plate and the plane containing the third plate, can be freely set. The angle formed between the plane containing the fourth plate and the plane containing the fifth plate is the first bending angle, and the angle formed between the plane containing the fifth plate and the plane containing the sixth plate after bending is the second bending angle.
[0040] Based on the above embodiments, the usage principle and working process of the embodiments of the present invention are as follows: In the initial state, such as Figures 1 to 4 As shown, the first bending member 106 and the second bending member 107 are in the unfolded position. At this time, the angle formed between the plane containing the fourth plate and the plane containing the fifth plate is an obtuse angle γ, and the fifth plate and the sixth plate are located on the same plane. The flexible integrated circuit board 109 is placed between the first bending member 106 and the second bending member 107, with its two ends located on the first fixing plate 1031 and the second fixing plate 1032, respectively. The first cylinder 101 and the second cylinder 102 are activated to press and fix the two ends of the flexible integrated circuit board 109.
[0041] Then, the third cylinder 105 is activated. The extended end of the third cylinder 105 slides within the first slide rail 1061 via the first slide rod, pushing the third plate to move. This causes the first bending member 106 to swing as a whole towards the second bending member 107 under the push of the third cylinder 105. During this process, the first plate gradually approaches the fourth plate, the second plate gradually approaches the fifth plate, and the third plate gradually approaches the sixth plate, until the first bending member 106 and the second bending member 107 together clamp the flexible integrated circuit board 109 and form a bend. At this time, the angle γ formed by the plane where the fourth plate is located and the plane where the fifth plate is located is the first bending angle.
[0042] Subsequently, as Figures 5 to 8 As shown, while maintaining the clamping state of the first cylinder 101 and the second cylinder 102, the fourth cylinder 104 is activated. The extended end of the fourth cylinder 104 slides within the second slide rail 1071 via the second slide rod, pushing the sixth plate to move. Simultaneously, the third cylinder 105 retracts synchronously, causing the third plate to move towards its initial position. This causes the first bending member 106 and the second bending member 107 to swing synchronously, forming a secondary bending angle between the plane of the second plate and the plane of the third plate (or between the fifth plate and the sixth plate) on top of the existing first bending angle. Since the two bending angles are formed in two stages, the stress inside the flexible integrated circuit board 109 material is gradually released, effectively reducing the amount of springback. Furthermore, during the swinging process of the second bending member 107, the tension spring 112 in the second hinge plate allows the first hinge unit 111 to move relative to the second hinge unit 115, thereby automatically adapting to the length change of the flexible integrated circuit board 109 during the secondary bending, reducing friction and wear. The elastic sleeve 110 limits the maximum rotation angle at each hinge position to prevent the flexible integrated circuit board 109 from being pinched.
[0043] Finally, after bending is completed, the third cylinder 105 and the fourth cylinder 104 reset, causing the first bending component 106 and the second bending component 107 to return to their initial state. The first cylinder 101 and the second cylinder 102 release, and the flexible integrated circuit board 109, which has been formed into two bent angles, is removed.
[0044] A flexible integrated circuit board processing technology, using the aforementioned flexible integrated circuit board processing equipment, includes the following steps: S1. Place the flexible integrated circuit board 109 between the first bending member 106 and the second bending member 107, and use the pressing mechanism to press and fix both ends of the flexible integrated circuit board 109. S2. Start the push mechanism to enter the first state, so that the first bending member 106 moves towards the second bending member 107 until the first bending member 106 and the second bending member 107 jointly clamp the flexible integrated circuit board 109 and complete one bending. S3. Start the push mechanism to enter the second state, so that the first bending member 106 and the second bending member 107 swing synchronously to perform a second bending on the flexible integrated circuit board 109 in the clamping state. S4. After bending is completed, reset the pushing mechanism, release the clamping mechanism, and take out the bent flexible integrated circuit board 109.
[0045] Furthermore, in step S1, activating the first cylinder 101 and the second cylinder 102 can press and fix both ends of the flexible integrated circuit board 109 onto the first fixing plate 1031 and the second fixing plate 1032, respectively.
[0046] Further, in step S2, the third cylinder 105 is activated, causing the first bending member 106 to move toward the second bending member 107.
[0047] Further, in step S3, the third cylinder 105 and the fourth cylinder 104 are activated, causing the third cylinder 105 to retract and the fourth cylinder 104 to extend, causing the first bending member 106 and the second bending member 107 to swing synchronously.
[0048] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0049] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.
Claims
1. A flexible integrated circuit board processing equipment, characterized in that, include: A base plate, which is placed horizontally, and a first fixing plate and a second fixing plate are provided at intervals on the base plate; The first bending member is hinged between the first fixed plate and the second fixed plate. The first bending member includes at least three first hinge plates that are sequentially hinged along the length direction of the flexible integrated circuit board. The first hinge plates are perpendicular to the bottom plate. The second bending member is hinged to the base plate and includes at least three second hinge plates that are sequentially hinged along the length of the flexible integrated circuit board. The second hinge plates are perpendicular to the base plate. A clamping mechanism is used to clamp and fix the two ends of the flexible integrated circuit board along its length to one side of the first fixing plate and the second fixing plate, respectively. A pushing mechanism is connected to both the first bending member and the second bending member, and is used to drive the middle parts of the first bending member and the second bending member to swing and deform in the horizontal direction on the base plate respectively. The pushing mechanism has a first state and a second state. In the first state, the pushing mechanism drives the first bending member to swing towards the second bending member, so that the first bending member and the second bending member jointly clamp the flexible integrated circuit board and bend the flexible integrated circuit board once. In the second state, the pushing mechanism drives the first bending member and the second bending member to swing synchronously and bend the flexible integrated circuit board a second time, thereby forming two bending angles on the flexible integrated circuit board.
2. The flexible integrated circuit board processing equipment according to claim 1, characterized in that, The pressing mechanism includes a first cylinder and a second cylinder. The first cylinder corresponds to the first fixed plate and is used to press one end of the flexible integrated circuit board onto the first fixed plate. The second cylinder corresponds to the second fixed plate and is used to press the other end of the flexible integrated circuit board onto the second fixed plate.
3. The flexible integrated circuit board processing equipment according to claim 2, characterized in that, Elastic sleeves are fitted at the hinge positions of two adjacent second hinge plates and two adjacent first hinge plates, and the elastic sleeves are fitted onto the surface of the first hinge plate or the second hinge plate.
4. The flexible integrated circuit board processing equipment according to claim 1, characterized in that, The length directions of the first hinge plate and the second hinge plate are both consistent with the length direction of the flexible integrated circuit board; the second hinge plate includes a first hinge unit and a second hinge unit that are slidably connected along its length direction, one end of the first hinge unit is retractably disposed inside the second hinge unit, and a tension spring is connected between the first hinge unit and the second hinge unit, the tension spring having a tendency to pull the first hinge unit back into the second hinge unit.
5. The flexible integrated circuit board processing equipment according to claim 1, characterized in that, The initial lengths of the first and second bent parts are the same, and both are equal to the length of the flexible integrated circuit board.
6. The flexible integrated circuit board processing equipment according to claim 5, characterized in that, There are three of each of the first and second hinge plates. The first hinge plate and the second hinge plate correspond one-to-one, and the length of each first hinge plate and the corresponding second hinge plate is equal.
7. The flexible integrated circuit board processing equipment according to claim 6, characterized in that, The three first hinge plates are sequentially divided into a first plate, a second plate, and a third plate. The first plate is hinged to the first fixed plate, and the third plate is hinged to the second fixed plate. The three second hinge plates are sequentially divided into a fourth plate, a fifth plate, and a sixth plate. The fourth plate is hinged to the third fixed plate, and the sixth plate is hinged to the fourth fixed plate. A limiting plate is also fixedly provided on the base plate. The limiting plate is used to limit the maximum swing angle of the fourth plate.
8. The flexible integrated circuit board processing equipment according to claim 7, characterized in that, The pushing mechanism includes a third cylinder and a fourth cylinder. The third plate is provided with a first slide rail extending along its length direction. The extended end of the third cylinder is slidably disposed in the first slide rail, so that the extension and retraction of the third cylinder can push the third plate to move synchronously. The sixth plate is provided with a second slide rail extending along its length direction. The output end of the fourth cylinder is slidably disposed in the second slide rail, so that the extension and retraction of the fourth cylinder can push the sixth plate to move synchronously.
9. The flexible integrated circuit board processing equipment according to claim 8, characterized in that, In the initial state, the plane containing the fourth plate and the plane containing the fifth plate form an obtuse angle; the fifth plate and the sixth plate are disposed on the same plane.
10. A flexible integrated circuit board processing technology, employing the flexible integrated circuit board processing equipment according to any one of claims 1 to 9, characterized in that, Includes the following steps: S1. Place the flexible integrated circuit board between the first bending member and the second bending member, and use the clamping mechanism to clamp and fix both ends of the flexible integrated circuit board. S2. Start the push mechanism to enter the first state, so that the first bending member moves towards the second bending member until the first bending member and the second bending member jointly clamp the flexible integrated circuit board to complete one bending. S3. Start the push mechanism to enter the second state, so that the first bending member and the second bending member swing synchronously to perform a second bending on the flexible integrated circuit board in the clamping state; S4. After bending is completed, reset the pushing mechanism, release the clamping mechanism, and remove the bent flexible integrated circuit board.