A composite material damper slow-release hinge and methods of making and using the same

Abstract

The application relates to a composite material damping slow-release hinge and a preparation and use method thereof, and belongs to the technical field of space unfolding mechanisms. The slow-release hinge comprises a first composite material layer A, a second composite material layer B and an intermediate gradient transition layer C; the first composite material layer A is a high glass transition temperature T1 composite material layer; the second composite material layer B is a low glass transition temperature T2 shape memory composite material layer, and T1-T2>40 DEG C; the gradient transition layer C is formed by blending a high Tg resin system used by the A layer and a low Tg resin system used by the B layer in different proportions, so that the glass transition temperature of the gradient transition layer C gradually changes from T1 to T2. Through the arrangement of the first composite material layer A and the second composite material layer B, the synergy of rapid response in the unfolding process and the recovery driving force is realized, and the unfolding speed and the unfolding stability are considered. The gradient transition layer can slow down the mismatch of thermal performance and mechanical performance between different layers, and reduce the stress concentration and interface cracking risk between the layers.

Description

Technical Field

[0001] This invention belongs to the field of space deployment mechanism technology, specifically relating to a composite material slow-release hinge with gradient interface and dynamic bond enhanced damping effect, and more particularly to a composite material hinge and its preparation method that achieves damping energy dissipation and controllable slow-release deployment by combining a high glass transition temperature layer and a low glass transition temperature layer, and introducing a gradient transition layer and dynamic chemical bonding structure between the layers. Background Technology

[0002] Deployable structures are widely used in various spacecraft due to their ability to fold and miniaturize large structures and save rocket launch space. Composite materials, with their advantages of light weight, high specific strength, high specific stiffness, and customizable shape, have become an important material choice for deployable structures. Existing deployable structures are mainly divided into two categories: one type relies on external force to cause elastic deformation of the material and store elastic potential energy. After entering orbit, the constraints are removed, and the structure rapidly deploys based on the stored elastic energy. However, this method involves excessively fast deployment speed, which can easily generate mechanical shocks and vibrations, adversely affecting the spacecraft structure and equipment. The other type uses shape memory polymers or shape memory composite materials for deployment. This type of structure has a relatively smooth deployment process, but it often faces the problem of balancing recovery rate, recovery force, and load-bearing capacity. Under large load conditions, it is prone to insufficient driving force and low deployment efficiency. To reduce the impact during deployment, existing technologies also control the deployment process by adding dampers and decelerators. However, these additional structures mostly increase the complexity and weight of the system, which is not conducive to structural lightweighting and integrated design.

[0003] Therefore, there is an urgent need for a composite material hinge that combines shape recovery driving capability and damping release function, so that it can provide sufficient recovery driving force during deployment, achieve vibration reduction and slow deployment, and at the same time have high interlayer interface bonding strength and service stability. Summary of the Invention

[0004] This invention aims to provide a composite material damping sustained-release hinge and its preparation method. The hinge is designed with two composite materials with significantly different glass transition temperatures: a first composite material layer A is a high-Tg composite material layer, and a second composite material layer B is a low-Tg shape memory composite material layer, with T1-T2 > 40℃. Simultaneously, a gradient layer with a gradually transitioning glass transition temperature is introduced between the two layers, combined with interface coarsening, activation, and dynamic chemical bonding structures. This achieves graded energy release, damping energy dissipation, and interface enhancement during the unfolding process, solving the problems of large unfolding impact, unstable unfolding process, and easy failure of interlayer interfaces in existing technologies.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A composite material damping slow-release hinge, the slow-release hinge comprising a first composite material layer A, a second composite material layer B, and an intermediate gradient transition layer C;

[0007] The first composite material layer A is a high glass transition temperature composite material layer with a glass transition temperature of T1, which is 100℃~200℃;

[0008] The second composite material layer B is a low glass transition temperature shape memory composite material layer with a glass transition temperature of T2, which is 25°C to 80°C, and satisfies T1-T2>40°C;

[0009] The gradient transition layer C is formed by blending the high Tg resin system used in layer A and the low Tg resin system used in layer B in different proportions. At the same time, a diamine curing agent containing disulfide bonds is added at a curing degree of 50-100%. The curing agent is mixed with the resin, and the amount used is 5-30% of the total mass of the high Tg and low Tg resin systems. This results in a gradient resin system with a dynamic covalent structure containing disulfide bonds, which gradually transitions along the thickness direction, so that the glass transition temperature of the gradient transition layer C gradually changes from close to T1 to close to T2.

[0010] Further, the first composite material layer A is prepared by using reinforcing fiber material and a high Tg resin matrix; the reinforcing fiber material is one or more of carbon fiber, glass fiber, or aramid fiber, with 2 to 5 layers; the high Tg resin matrix is ​​one of bismaleimide resin, cyanate ester resin, or a high glass transition temperature epoxy resin system. The resin and curing agent are mixed according to a 100% curing degree ratio, and an accelerator (if any) is added at 0.1wt% to 2wt%. The pre-curing conditions for the first composite material layer A are: pre-curing at 45 to 75°C for 10 to 150 minutes; the complete curing conditions are: pouring the uniformly mixed resin onto the fiber cloth to completely impregnate the fibers, first curing at 60 to 90°C for 1 to 3 hours, then curing at 100 to 140°C for 1 to 6 hours, and finally curing at 130 to 160°C for 1 to 4 hours to achieve complete curing of layer A (layer A does not require pressure for individual curing).

[0011] Furthermore, the second composite material layer B is prepared by using reinforcing fiber material and a low-Tg shape memory resin matrix; the reinforcing fiber material is one or more of carbon fiber, glass fiber, or aramid fiber, with 2 to 15 layers; the low-Tg shape memory resin is a shape memory epoxy resin system, which can be prepared by selecting a long-chain amine curing agent and adjusting the ratio of epoxy resin to curing agent. Pre-curing of the second composite material layer B: The resin and curing agent are prepared according to a stoichiometric ratio of 1 to 6 to 1, and pre-cured at 45 to 75°C for 10 to 150 minutes.

[0012] Furthermore, the gradient transition layer C is composed of 1 to 5 fiber layers, and the ratio of high Tg resin to low Tg resin in each fiber layer changes sequentially, for example, 100:0, 75:25, 50:50, 25:75, 0:100.

[0013] Further, the diamine curing agent containing disulfide bonds is one or more of 4,4′-diaminodiphenyl disulfide, 2,2′-diaminodiphenyl disulfide, cystamine, or L-cystine dimethyl ester.

[0014] A method for preparing the above-mentioned composite material damping sustained-release hinge, wherein the method specifically includes the following three composite methods:

[0015] (1) Composite curing method 1: Pour the uniformly mixed resin onto the fiber cloth, so that the resin completely impregnates the fiber, and pre-cur it in an environment of 45~75℃ for 10~150min. Then, after the pre-cured first composite material layer A, gradient transition layer C and second composite material layer B are laminated in sequence, placed in a mold and pressed for curing. Set the temperature to 60~90℃ and apply initial pressure at 0.5~2MPa to fully fill each fiber layer with resin for 1~5min. Then increase the pressure to 2~15MPa and pressurize at 100~160℃ for 2~6h to obtain an integral composite material, and then cut it to the required size.

[0016] (2) Composite curing method 2: The first composite material layer A (pre-cured in an environment of 45~75℃ for 10~150min) and the second composite material layer B (pre-cured in an environment of 45~75℃ for 10~150min) are only pre-cured, the gradient transition layer C is fully cured, and then the gradient transition layer C is surface treated, and the surface is activated in the interface area after surface treatment.

[0017] (3) Composite curing method 3: Pour the uniformly mixed resin onto the fiber cloth to completely impregnate the fiber. Then cure it in an environment of 60~90℃ for 1~3h, then in an environment of 100~140℃ for 1~6h, and finally in an environment of 130~160℃ for 1~4h to achieve complete curing of layer A (layer A does not need to be pressurized when cured alone). Perform surface treatment in the same way as the gradient transition layer C in composite method 2. Then, combine it with the pre-cured gradient transition layer C and the second composite material layer B for composite curing.

[0018] Furthermore, the surface treatment includes one or more of grinding, sandblasting, and etching, used to improve surface roughness.

[0019] Furthermore, a through-hole or semi-through-hole microporous structure is provided in the interface region. The micropores are circular or oblong, arranged in an array, so that adjacent resin layers can pass through the channels during curing to form a mechanical interlocking structure, thereby improving interlayer bonding strength and peel resistance. Figure 1 and 2 As shown.

[0020] Furthermore, surface activation involves one or more of plasma treatment, chemical grafting treatment, or coupling agent treatment to introduce active groups such as hydroxyl, amino, and carboxyl groups onto the interface surface. These groups can combine with the resin matrix during the curing process, enhancing the bonding ability of the interlayer interface.

[0021] A method for using the composite material damping sustained-release hinge prepared by the above preparation method involves heating the composite material damping sustained-release hinge to a temperature range higher than T2 and lower than T1, and bending it around a predetermined axis to a target angle under the action of external force. Figure 3 As shown in the figure, it is then cooled to a temperature below T2 to fix the temporary shape; when it is reheated to above T2, the second composite material layer B first softens and gradually releases the constraint on the overall structure, and the first composite material layer A provides the recovery driving force, which drives the hinge to recover to the initial shape; at the same time, the gradient transition layer C and the interface dynamic bond structure generate damping energy dissipation during the recovery process, thereby realizing slow release deployment and vibration reduction control.

[0022] Both the first composite material layer A and the second composite material layer B can provide a restoring driving force. However, if it is entirely composed of the second composite material layer B, the restoring driving force is relatively small. If it is entirely composed of the first composite material layer A, the rebound speed is too fast and the vibration is extremely large. Therefore, when the temperature is between T1 and T2, the first composite material layer A acts as an elastic layer, while the second composite material layer B is entirely a shape memory layer.

[0023] It should be noted that the recovery driving force of the first composite material layer A is not necessarily greater than that of the second composite material layer B, because the second composite material layer B consists of 2 to 15 layers, and the number of layers also affects the recovery driving force. The reason for the temperature being between T1 and T2 is that the first composite material layer A is elastic at this temperature. If the temperature is higher than T1, the first composite material layer A also exhibits shape memory effect, resulting in a smaller recovery driving force. The magnitude of the recovery driving force refers to the effect of the same layer of material at different temperatures; the higher the temperature, the smaller the recovery driving force. Therefore, when the heating temperature is not higher than T1, the first composite material layer A is an elastic layer, and its recovery speed is faster and the driving force is greater compared to the first composite material layer A exhibiting a shape memory effect at temperatures higher than T1. Therefore, in shape memory materials, this invention selects a resin system with a higher Tg for some fiber layers, aiming to make a portion of it an elastic layer, resulting in a greater recovery driving force and faster speed compared to a completely shape memory layer. Similarly, it can also be understood that compared to a completely elastic material, introducing some shape memory layers slows down the unfolding speed, thereby improving the stability during the recovery process and reducing impact vibration. The two are synergistically related.

[0024] The advantages of this invention over the prior art are as follows:

[0025] (1) By setting a first composite material layer A and a second composite material layer B with different glass transition temperatures, the present invention achieves the synergy of rapid response and recovery driving force during the deployment process, which is beneficial to balance deployment speed and deployment stability.

[0026] (2) The introduction of a gradient transition layer can alleviate the mismatch between thermal and mechanical properties of different layers, and reduce the risk of interlayer stress concentration and interface cracking.

[0027] (3) By introducing dynamic covalent bonds or supramolecular interactions at the interlayer interface, not only is the interfacial bonding strength enhanced, but the damping energy dissipation capacity can also be improved through the breaking and recombination of reversible bonds.

[0028] (4) By setting microporous structures and mechanical interlocking structures, the interlayer anti-peeling performance and structural integrity can be further improved, and the delamination phenomenon can be reduced.

[0029] (5) The composite material damping release hinge of the present invention has the functions of shape recovery drive, damping release and interface enhancement. It does not require additional independent damping components, has a simple structure and light weight, and is suitable for space deployable antennas, solar arrays and other spacecraft mechanisms that need to be deployed smoothly. Attached Figure Description

[0030] Figure 1 This is a diagram showing the shape and location of the holes in the composite material layer in Example 1.

[0031] Figure 2 This diagram illustrates the shape and location of the holes in the composite material layer.

[0032] Figure 3 This is an assembly rendering of the hinge. Detailed Implementation

[0033] The technical solution of the present invention will be further described below with reference to the accompanying drawings and embodiments, but it is not limited thereto. Any modifications or equivalent substitutions to the technical solution of the present invention that do not depart from the spirit and scope of the technical solution of the present invention should be covered within the protection scope of the present invention.

[0034] Example 1

[0035] Composite curing method 1: The first composite material layer A, the gradient transition layer C, and the second composite material layer B, which have been pre-cured, are laminated in sequence, placed in a mold, and cured by compression molding. A pressure of 0.5~15MPa is applied to obtain an integral composite material, which is then cut to the required size.

[0036] A: A 3-layer carbon fiber composite material, epoxy E51, and anhydride curing agent methyltetrahydrophthalic anhydride, accelerator 2-methylimidazole, are prepared with a Tg1 resin according to the ratio of 100% curing degree. The resin is stirred and mixed under heating at 45~70℃, then vacuum degassing is performed. The resin is then poured onto carbon fiber cloth to completely impregnate it, and then placed in an environment of 60~80℃ for pre-curing.

[0037] B: For a 4-layer carbon fiber composite material, take epoxy E51 and polyetheramine D230, and use an excess of D230. For example, the mass ratio of E51 to D230 is 2:1 to prepare a resin material with a Tg2 (about 60℃). Stir and mix the resin under heating conditions of 45~60℃, then remove air bubbles under vacuum, then pour the resin onto the carbon fiber cloth to completely wet it, and then place it in an environment of 50~60℃ for pre-curing.

[0038] C: Take two layers of carbon fiber cloth, and mix the resins used in A and B at ratios of 75:25 and 25:75 respectively. Simultaneously, use 4,4′-diaminodiphenyl disulfide curing agent to prepare a resin system with a dynamic covalent structure containing disulfide bonds at a cure degree of 75%. Mix this system with the aforementioned high-Tg and low-Tg resins, using 10% of the total mass of the high-Tg and low-Tg resins. Resins with different Tg3 and Tg4 values ​​are obtained (Tg1>Tg3>Tg4>Tg2), and then pre-curing is performed.

[0039] The pre-cured AB and two Cs are stacked in order of Tg gradient and placed under a hot press at 80℃ and 1MPa for 5 minutes to fully fill with resin. After the excess resin flows out, the temperature and pressure are increased to 140℃ and 15MPa for molding and curing for 3 hours.

[0040] It is then demolded and cut into strips of 3cm x 10cm. Holes are punched on both sides for fixing, and a heating film is pasted in the middle for heating deformation and recovery.

[0041] Example 2

[0042] Composite curing method 2: The first composite material layer A and the second composite material layer B are only pre-cured, the gradient transition layer C is fully cured, and then the gradient transition layer C is surface treated and surface activated in the interface area after roughening treatment.

[0043] A: A two-layer carbon fiber composite material, epoxy E51 and anhydride curing agent methyltetrahydrophthalic anhydride, accelerator 2-methylimidazole, are prepared with a Tg1 resin according to the ratio of 100% curing degree. The resin is stirred and mixed under heating at 45~70℃, then vacuum degassing is performed. The resin is then poured onto the carbon fiber cloth to completely wet it, and then placed in an environment of 60~80℃ for pre-curing.

[0044] B: 3-layer carbon fiber composite material, take epoxy E51 and polyetheramine D230, prepare Tg2 resin material according to a certain ratio, stir and mix under heating at 45~60℃, then remove air bubbles under vacuum, then pour the resin onto carbon fiber cloth to completely wet it, and then put it into an environment of 50~60℃ for pre-curing.

[0045] C: Take one layer of carbon fiber cloth. Mix the resins used in A and B in a 50:50 ratio. Use 4,4′-diaminodiphenyl disulfide curing agent to prepare a dynamically covalently structured resin system containing disulfide bonds at 75% cure. Mix this system with the aforementioned high-Tg and low-Tg resins, using 10% of the total mass of the high-Tg and low-Tg resins. Prepare a resin with Tg3 (Tg1>Tg3>Tg2), and then fully cure it. Cure it horizontally in an oven without molding. After curing, punch holes in C, as shown below. Figure 1 As shown, its surface is then sanded with coarse sandpaper and subsequently bombarded with plasma to introduce reactive functional groups such as hydroxyl, carboxyl and amino groups onto its surface, thereby improving the interfacial adhesion.

[0046] The pre-cured AB and the surface-treated C are stacked in the order ACB and placed under a hot press at 80℃ and 1MPa for 5 minutes to fully fill with resin. After the excess resin flows out, the temperature and pressure are increased to 140℃ and 15MPa for molding and curing for 3 hours.

[0047] It is then demolded and cut into strips of 3cm x 10cm. Holes are punched on both sides for fixing, and a heating film is pasted in the middle for heating deformation and recovery.

[0048] Example 3

[0049] Composite curing method 3: The fully cured A layer undergoes surface treatment in the same manner as the gradient transition layer C in composite method 2, and then it is composite cured with the pre-cured gradient transition layer C and the second composite material layer B.

[0050] A: A two-layer carbon fiber composite material, epoxy E51, and an anhydride-based curing agent methyltetrahydrophthalic anhydride, with 2-methylimidazole as the accelerator, was prepared to a Tg1 resin ratio according to a 100% curing degree. The mixture was stirred and homogenized under heating at 45-70℃, followed by vacuum degassing. The resin was then poured onto carbon fiber cloth to completely impregnate it and fully cured in an oven at 80℃ for 3 hours, 140℃ for 6 hours, and 160℃ for 3 hours. After complete curing, the surface was roughened by sanding with coarse sandpaper and then perforated for later use.

[0051] B: 3-layer carbon fiber composite material, take epoxy E51 and polyetheramine D230, prepare Tg2 resin material according to a certain ratio, stir and mix under heating at 45~60℃, then remove air bubbles under vacuum, then pour the resin onto carbon fiber cloth to completely wet it, and then put it into an environment of 50~60℃ for pre-curing.

[0052] C: Take one layer of carbon fiber cloth, and prepare a dynamic covalent structure resin system containing disulfide bonds by mixing the resins used in A and B in a 50:50 ratio with 4,4′-diaminodiphenyl disulfide curing agent at a cure degree of 75%. Mix this system with the aforementioned high-Tg and low-Tg resins, using 10% of the total mass of the high-Tg and low-Tg resins. Prepare resins with different Tg3 values ​​(Tg1>Tg3>Tg2), and then pre-cur them.

[0053] The pre-cured BC and the surface-treated A are stacked in the order of ACB and placed under a hot press at 80℃ and 1MPa for 5 minutes to fully fill with resin. After the excess resin flows out, the temperature and pressure are increased to 140℃ and 15MPa for molding and curing for 3 hours.

[0054] It is then demolded and cut into strips of 3cm x 10cm. Holes are punched on both sides for fixing, and a heating film is pasted in the middle for heating deformation and recovery.

[0055] The specific shaping and usage methods of the composite material damping release hinges obtained in Examples 1-3 are as follows: The composite material damping release hinge is heated to a temperature range higher than T2 and lower than T1, and bent around a predetermined axis to a target angle under the action of external force. Then it is cooled to a temperature lower than T2 to fix the temporary shape. When it is heated again to above T2, the second composite material layer B first softens and gradually releases the constraint effect on the overall structure. The first composite material layer A provides the recovery driving force, which drives the hinge to recover to the initial shape. At the same time, the gradient transition layer C and the interface dynamic bond structure generate damping energy dissipation effect during the recovery process, thereby realizing the slow release deployment and vibration reduction control.

[0056] The following conclusions can be drawn: Low-Tg shape memory materials are relatively stable during the shape recovery process, with almost no impact, but the recovery speed is slow, the recovery time is long, and the recovery driving force is small. High-Tg materials exhibit elasticity at the recovery temperature of low-Tg shape memory materials. Elastic materials have the characteristics of fast recovery speed and large recovery driving force. However, the recovery speed of pure elastic materials is too fast, which causes a huge impact effect. Therefore, the two materials are combined to complement each other's advantages and disadvantages, so as to prepare a new composite material with fast recovery speed, large recovery driving force and stable recovery process. A transition layer is introduced to improve the bonding ability between the two.

Claims

1. A composite material damping sustained-release hinge, characterized in that: The slow-release hinge includes a first composite material layer A, a second composite material layer B, and an intermediate gradient transition layer C; The first composite material layer A is a high glass transition temperature composite material layer with a glass transition temperature of T1, which is 100℃~200℃; The second composite material layer B is a low glass transition temperature shape memory composite material layer with a glass transition temperature of T2, which is 25°C to 80°C, and satisfies T1-T2>40°C; The gradient transition layer C is formed by blending the high Tg resin system used in layer A and the low Tg resin system used in layer B in different proportions. At the same time, a diamine curing agent containing disulfide bonds is added at a curing degree of 50-100%. The curing agent is mixed with the resin, and the amount used is 5-30% of the total mass of the high Tg and low Tg resin systems. This results in a gradient resin system with a dynamic covalent structure containing disulfide bonds, which gradually transitions along the thickness direction, so that the glass transition temperature of the gradient transition layer C gradually changes from close to T1 to close to T2.

2. The composite material damping sustained-release hinge according to claim 1, characterized in that: The first composite material layer A is prepared by using reinforcing fiber material and high Tg resin matrix; the reinforcing fiber material is one or more of carbon fiber, glass fiber or aramid fiber, and the number of layers is 2 to 5; the high Tg resin matrix is ​​one of bismaleimide resin, cyanate ester resin or high glass transition temperature epoxy resin system.

3. The composite material damping sustained-release hinge according to claim 1, characterized in that: The second composite material layer B is prepared by reinforcing fiber material and low Tg shape memory resin matrix; the reinforcing fiber material is one or more of carbon fiber, glass fiber or aramid fiber, with 2 to 15 layers; the low Tg shape memory resin is a shape memory epoxy resin system, which can be prepared by selecting long-chain amine curing agent and adjusting the ratio of epoxy resin to curing agent.

4. The composite material damping sustained-release hinge according to claim 1, characterized in that: The gradient transition layer C consists of 1 to 5 fiber layers, with the ratio of high Tg resin to low Tg resin varying sequentially in each fiber layer.

5. The composite material damping sustained-release hinge according to claim 1, characterized in that: The diamine curing agent containing disulfide bonds is one or more of 4,4′-diaminodiphenyl disulfide, 2,2′-diaminodiphenyl disulfide, cystamine, or L-cystine dimethyl ester.

6. A method for preparing a composite material damping sustained-release hinge according to any one of claims 1 to 5, characterized in that: The method specifically includes the following three combined approaches: (1) Composite curing method 1: Pour the uniformly mixed resin onto the fiber cloth, so that the resin completely impregnates the fiber, and pre-cur it in an environment of 45~75℃ for 10~150min. Then, after the pre-cured first composite material layer A, gradient transition layer C and second composite material layer B are laminated in sequence, placed in a mold and pressed for curing. Set the temperature to 60~90℃ and apply initial pressure at 0.5~2MPa to fully fill each fiber layer with resin for 1~5min. Then increase the pressure to 2~15MPa and pressurize at 100~160℃ for 2~6h to obtain an integral composite material, and then cut it to the required size. (2) Composite curing method 2: The first composite material layer A (pre-cured in an environment of 45~75℃ for 10~150min) and the second composite material layer B (pre-cured in an environment of 45~75℃ for 10~150min) are only pre-cured, the gradient transition layer C is fully cured, and then the gradient transition layer C is surface treated, and the surface is activated in the interface area after surface treatment. (3) Composite curing method 3: Pour the uniformly mixed resin onto the fiber cloth to completely impregnate the fiber. Then cure it in an environment of 60~90℃ for 1~3h, then in an environment of 100~140℃ for 1~6h, and finally in an environment of 130~160℃ for 1~4h to achieve complete curing of layer A. Perform surface treatment in the same way as the gradient transition layer C in composite method 2. Then, composite curing is performed with the pre-cured gradient transition layer C and the second composite material layer B.

7. The method for preparing a composite material damping sustained-release hinge according to claim 6, characterized in that: The surface treatment includes one or more of grinding, sandblasting, and etching.

8. The method for preparing a composite material damping sustained-release hinge according to claim 6, characterized in that: A through or semi-through microporous structure is provided in the interface area, wherein the micropores are round or oblong and are distributed in an array.

9. The method for preparing a composite material damping sustained-release hinge according to claim 6, characterized in that: Surface activation can be one or more of plasma treatment, chemical grafting treatment, or coupling agent treatment.

10. A method of using a composite material damping sustained-release hinge prepared by the preparation method according to any one of claims 6 to 9, characterized in that: The composite material damping release hinge is heated to a temperature range higher than T2 and lower than T1, and then bent around a predetermined axis to a target angle under the action of external force. It is then cooled to a temperature lower than T2 to fix the temporary shape. When it is heated again to above T2, the second composite material layer B softens first and gradually releases its constraint on the overall structure. The first composite material layer A provides the recovery driving force, which drives the hinge to recover to its initial shape. At the same time, the gradient transition layer C and the interface dynamic bond structure generate damping energy dissipation during the recovery process, thereby realizing the slow release deployment and vibration reduction control.

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