A thermal insulation composite board and a preparation method thereof
Through gradient functional structure design and material composition innovation, the problems of poor thermal insulation performance, low mechanical strength, easy delamination between layers, and poor fire resistance of existing composite insulation boards have been solved. This has achieved a synergistic improvement in ultra-low thermal conductivity, high mechanical strength, and excellent fire resistance, while simplifying the manufacturing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUTURE DECORATIVE (ANHUI) SECTOR IND CO LTD
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-14
AI Technical Summary
Existing composite insulation boards suffer from poor thermal insulation performance, low mechanical strength, easy delamination between layers, and poor fire resistance. Furthermore, their manufacturing process is complex and energy-intensive, making it difficult to achieve a balance between ultra-low thermal conductivity, high mechanical strength, and excellent fire resistance.
The structure adopts a gradient functional structure design, including a protective layer, an infrared reflective heat insulation layer, a composite heat insulation core layer, a sound insulation buffer layer, and an adhesive bottom layer. It forms a five-layer composite structure through the combination of modified silica aerogel, vacuum glass microspheres, plant fibers, and epoxy resin adhesive, and optimizes the material composition to improve heat insulation, mechanical and fire resistance performance.
It achieves ultra-low thermal conductivity, excellent compressive strength and fire resistance, while improving interlayer bonding strength, solving the problem of easy peeling between layers, taking into account environmental protection and sound insulation effect, and simplifying the preparation process.
Smart Images
Figure CN122379112A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of thermal insulation composite panel technology, and specifically to a thermal insulation composite panel and its preparation method. Background Technology
[0003] Existing composite insulation boards mostly adopt a simple layered composite structure of organic insulation layer + inorganic protective layer. This results in insufficient interlayer bonding strength, easy peeling, poor synergy of the performance of each layer, and an inability to simultaneously achieve ultra-low thermal conductivity, high mechanical strength, and excellent fire resistance. Although some aerogel composite boards have low thermal conductivity, their mechanical strength is insufficient and their cost is high, making it difficult to apply on a large scale. Vacuum insulation boards rely on high vacuum sealing, are easily damaged, have high maintenance costs, and cannot meet the requirements of sound insulation and fire resistance. At the same time, existing manufacturing processes are complex, have long production cycles, and high energy consumption. In addition, some processes use toxic and harmful additives, which is not in line with the trend of green and environmentally friendly development. Summary of the Invention
[0004] The purpose of this invention is to solve the problems of poor thermal insulation performance, low mechanical strength, easy delamination between layers, and poor fire resistance of existing thermal insulation composite panels. The invention provides a thermal insulation composite panel that achieves synergistic improvement in thermal insulation, mechanical properties, fire resistance, and environmental protection performance through gradient functional structure design and material composition innovation.
[0005] To achieve the above objectives, the present invention provides a thermal insulation composite panel, comprising, from bottom to top, a protective layer, an infrared reflective insulation layer, a composite thermal insulation core layer, a sound insulation buffer layer, and an adhesive bottom layer. The composite thermal insulation core layer is prepared from modified silica aerogel, vacuum glass microspheres, plant fibers, epoxy resin adhesive, and flame retardant. The modified silica aerogel is obtained by modification treatment with silane coupling agent KH-550.
[0006] Preferably, the protective layer is made of Portland cement, nano-silica, glass short fiber, modified polypropylene fiber, water-reducing agent, defoamer and water, and the surface flatness of the protective layer is ≤0.3mm / m and the compressive strength is ≥25MPa.
[0007] Preferably, the infrared reflective heat insulation layer is prepared from aqueous acrylic emulsion, titanium dioxide, hollow microspheres, silane coupling agent, film-forming aid and deionized water, and the infrared reflectivity of the infrared reflective heat insulation layer is ≥85%.
[0008] Preferably, the thermal conductivity of the composite insulation core layer is ≤0.018W / (m·K), and the compressive strength is ≥10MPa.
[0009] Preferably, the sound insulation buffer layer is made of open-cell polyurethane foam with a foam pore size of 0.5-2mm, a closed-cell rate of ≤10%, a density of 20-30kg / m³, and a sound insulation level of ≥40dB.
[0010] Preferably, the bonding substrate is prepared from a modified epoxy adhesive, which is prepared from epoxy resin, curing agent, silane coupling agent and nano-calcium carbonate, and the bonding strength of the bonding substrate is ≥1.0MPa.
[0011] Another aspect of the present invention provides a method for preparing the above-mentioned thermal insulation composite board, comprising the following steps:
[0012] Step 1: Prepare the raw materials for the protective layer, infrared reflective heat insulation layer, composite heat insulation core layer, sound insulation buffer layer, and adhesive underlayer.
[0013] Step 2: Pour the protective layer material into the mold, smooth it, and polish it to form a protective layer. Apply a layer of infrared reflective heat insulation material evenly to the surface of the protective layer and let it dry at room temperature to form an infrared reflective heat insulation layer. Apply the composite heat insulation core layer material evenly to the surface of the infrared reflective heat insulation layer and compact it to form a composite heat insulation core layer. Apply a sound insulation buffer layer to the surface of the composite heat insulation core layer and bond it firmly with an adhesive. Apply the adhesive underlayer material evenly to the surface of the sound insulation buffer layer to form an adhesive underlayer.
[0014] Step 3: Place the composite molded board into the curing room and cure it for 24-48 hours at 25-30℃ and 60%-70% relative humidity. Then, raise the temperature to 40-50℃ and 50%-60% relative humidity and cure it for 12-24 hours. Finally, cool it down to room temperature and cure it for 3-5 days.
[0015] Step 4: Cut the cured boards to the preset size, and then test the thermal conductivity, compressive strength, bonding strength, fire resistance, sound insulation and other properties of the boards. Once the test is passed, it is a finished product.
[0016] Preferably, the composite insulation core material is prepared by first carbonizing plant fibers at 180-200℃ for 2-3 hours, cooling them to room temperature, and then pulverizing them to a particle size of 100-200 mesh. Modified silica aerogel, vacuum glass microspheres, carbonized plant fibers, epoxy resin adhesive, and flame retardant are weighed according to weight, placed in a mixer, and mixed evenly to obtain the final product.
[0017] Preferably, the modified silica aerogel is obtained by mixing silica aerogel with silane coupling agent KH-550 at a weight ratio of 100:3-5, adding ethanol, stirring and reacting at 60-70°C for 1-2 hours, cooling to room temperature and then vacuum drying.
[0018] Compared with the prior art, the technical solution provided by the present invention adopts a five-layer gradient functional composite structure consisting of a protective layer, an infrared reflective heat insulation layer, a composite heat insulation core layer, a sound insulation buffer layer, and an adhesive bottom layer. The composite heat insulation core layer adopts a composite system of aerogel, vacuum microspheres, and plant fibers. Through modification treatment and component optimization, the heat insulation performance and mechanical properties are synergistically improved. Attached Figure Description
[0019] The disclosure of this invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:
[0020] Figure 1 A cross-sectional view of a thermal insulation composite panel provided by the present invention.
[0021] The diagram shows the following labels: 1. Protective layer; 2. Infrared reflective insulation layer; 3. Composite insulation core layer; 4. Sound insulation buffer layer; 5. Bonding bottom layer. Detailed Implementation
[0022] It is readily understood that, based on the technical solution of this invention, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of the invention. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative examples of the technical solution of this invention and should not be considered as the entirety of the invention or as limitations or restrictions on the technical solution of this invention.
[0023] This invention provides a specific embodiment of a thermal insulation composite panel, such as... Figure 1 As shown, the layers arranged from bottom to top are: protective layer 1, infrared reflective heat insulation layer 2, composite heat insulation core layer 3, sound insulation buffer layer 4, and adhesive bottom layer 5. The overall thickness is 20-50mm, and the thickness ratio of each layer is as follows: protective layer 1 accounts for 15%-25%, infrared reflective heat insulation layer 2 accounts for 5%-10%, composite heat insulation core layer 3 accounts for 40%-60%, sound insulation buffer layer 4 accounts for 10%-15%, and adhesive bottom layer 5 accounts for 5%-10%.
[0024] The protective layer 1 is prepared from the following components in parts by weight: 30-40 parts Portland cement, 5-8 parts nano silica, 3-5 parts glass short fiber, 2-4 parts modified polypropylene fiber, 1-2 parts water-reducing agent, 0.5-1 part defoamer, and 15-20 parts water. The surface of the protective layer 1 is calendered, with a surface flatness ≤0.3mm / m, a compressive strength ≥25MPa, and a fire rating of A1. It can effectively resist external environmental erosion and protect the internal structure from damage.
[0025] The infrared reflective heat insulation layer 2 is prepared from the following components in parts by weight: 20-30 parts of water-based acrylic emulsion, 8-12 parts of titanium dioxide, 5-8 parts of hollow microspheres, 1-2 parts of silane coupling agent, 1-1.5 parts of film-forming aid, and 10-15 parts of deionized water. The infrared reflective heat insulation layer 2 has an infrared reflectivity of ≥85%, which can effectively reflect solar infrared radiation, suppress radiative heat transfer, reduce the external heat absorption efficiency of the composite board, and improve the heat insulation effect.
[0026] The composite insulation core layer 3 is an aerogel-vacuum microsphere-plant fiber composite system, prepared from the following components by weight: 15-25 parts modified silica aerogel, 10-18 parts vacuum glass microspheres, 8-15 parts plant fibers treated with high temperature carbonization, 5-10 parts epoxy resin adhesive, and 3-5 parts flame retardant. The plant fiber is corn stalk fiber or bamboo fiber, and the flame retardant is a compound flame retardant of magnesium hydroxide and aluminum hydroxide in a 1:1 weight ratio. The amount added is [amount missing]% of the total weight of the composite insulation core layer 3. 3%-5%, halogen-free and environmentally friendly, flame retardant rating reaches A1 level. Modified silica aerogel is modified with silane coupling agent KH-550, with a particle size of 50-100nm, porosity ≥95%, and thermal conductivity ≤0.016W / (m·K). Vacuum glass microspheres have a particle size of 10-50μm and a vacuum degree ≥10⁻³Pa. The composite insulation core layer 3 has a thermal conductivity ≤0.018W / (m·K) and compressive strength ≥10MPa, which can achieve ultra-low thermal conductivity insulation while improving the mechanical strength of the core layer.
[0027] The sound insulation buffer layer 4 is made of open-cell polyurethane foam with a pore size of 0.5-2mm, a closed-cell rate of ≤10%, and a density of 20-30kg / m³. Its sound insulation is ≥40dB, which can effectively absorb sound waves and play a buffering role, reducing the damage of external impacts to the composite board.
[0028] The bonding substrate 5 is prepared from a modified epoxy adhesive, which is composed of the following components in parts by weight: 10-15 parts epoxy resin, 3-5 parts curing agent, 0.5-1 parts silane coupling agent, and 2-3 parts nano calcium carbonate. The bonding strength of the bonding substrate 5 is ≥1.0MPa, which can ensure that the composite board is firmly bonded to the substrate and prevent it from falling off.
[0029] By employing a five-layer gradient functional composite structure consisting of a protective layer 1, an infrared reflective heat insulation layer 2, a composite thermal insulation core layer 3, a sound insulation buffer layer 4, and an adhesive bottom layer 5, the composite thermal insulation core layer 3 utilizes a composite system of aerogel, vacuum microspheres, and plant fibers. Through modification treatment and component optimization, it achieves a synergistic improvement in thermal insulation and mechanical properties. Furthermore, addressing the technical pain points of existing composite panels such as high thermal conductivity, low mechanical strength, easy interlayer peeling, poor fire resistance, and inadequate sound insulation, this invention, through the synergistic design of each layer's functions, achieves a thermal conductivity of ≤0.018W / (m·K) for the composite thermal insulation core layer 3, which is far lower than that of existing composite panels, significantly improving the thermal insulation effect. The synergistic effect of the protective layer 1 and the composite thermal insulation core layer 3 enables the composite panel to achieve a compressive strength ≥25MPa and an adhesive strength ≥1.0MPa, solving the problems of interlayer peeling and insufficient mechanical strength. At the same time, it achieves a fire rating of A1 and a sound insulation of ≥40dB, while also considering environmental friendliness.
[0030] Another aspect of the present invention provides a method for preparing the above-mentioned thermal insulation composite board, comprising preparing raw materials for each layer, wherein the protective layer raw material is prepared by weighing Portland cement, nano-silica, glass short fiber, modified polypropylene fiber, water-reducing agent, defoamer and water in parts by weight, and placing them in a mixer and stirring evenly at a stirring speed of 300-500 r / min for 10-15 min; the infrared reflective insulation layer raw material is prepared by weighing water-based acrylic emulsion, titanium dioxide, hollow microspheres, silane coupling agent, film-forming aid and deionized water in parts by weight, and placing them in a disperser and dispersing evenly at a dispersion speed of 800-1000 r / min for 20-30 min; the composite thermal insulation core layer raw material is prepared by first carbonizing plant fibers at a high temperature of 180-200℃ for 2-3 hours, cooling to room temperature and then pulverizing to a particle size of 100-200 mesh, and weighing modified silica aerogel, vacuum glass microspheres and carbonized plant fibers in parts by weight. The following materials are used to prepare the composite insulation core layer 3: epoxy resin adhesive, flame retardant, and fiber; epoxy resin adhesive and flame retardant are placed in a mixer and mixed evenly at a speed of 200-300 r / min for 15-20 min; modified silica aerogel is prepared by mixing silica aerogel with silane coupling agent KH-550 at a weight ratio of 100:3-5, adding ethanol, stirring and reacting at 60-70℃ for 1-2 h, cooling to room temperature and then vacuum drying. This modification treatment can effectively improve the compatibility between aerogel and epoxy resin adhesive, prevent aerogel agglomeration, ensure its uniform dispersion in the core layer, and improve the thermal insulation performance and mechanical strength of the composite insulation core layer 3; the sound insulation buffer layer 4 is prepared by cutting open-cell polyurethane foam board to a preset size; the bonding bottom layer is prepared by weighing epoxy resin, curing agent, silane coupling agent and nano calcium carbonate by weight, placing them in a mixer and stirring evenly at a speed of 400-600 r / min for 8-12 min.
[0031] Pour the protective layer material into a mold, smooth it, and polish it. Pre-cure it at room temperature for 2-3 hours to form protective layer 1. Evenly coat the surface of protective layer 1 with a layer of infrared reflective insulation material, 1-5 mm thick, and dry it at room temperature for 3-4 hours to form infrared reflective insulation layer 2. Evenly lay the composite insulation core layer material on the surface of infrared reflective insulation layer 2, compact it with a pressure of 0.3-0.5 MPa for 5-10 minutes, and form composite insulation core layer 3. A sound insulation buffer layer 4 is laid on the surface of the composite insulation core layer 3 and firmly bonded with an adhesive. The amount of adhesive applied is 200-300g / m². A bonding underlayer material is evenly applied to the surface of the sound insulation buffer layer 4 to form a bonding underlayer 5 with a coating thickness of 1-3mm. A steel mold is used, and the mold surface is polished to avoid defects on the board surface. A segmented compaction method is used during the compaction process to ensure that the composite insulation core layer 3 is dense and free of pores, thus avoiding the increase in thermal conductivity caused by pores.
[0032] After the composite molding is completed, the board is placed in the curing room and a gradient curing process is adopted. First, it is cured at 25-30℃ and 60%-70% relative humidity for 24-48 hours. Then, the temperature is raised to 40-50℃ and 50%-60% relative humidity for 12-24 hours. Finally, it is cooled to room temperature and cured for another 3-5 days until the board strength reaches the design requirements. During the curing process, the board should be protected from moisture and impact.
[0033] The properly cured boards are cut to the preset dimensions with a cutting accuracy of ≤ ±0.5mm. Then, the thermal conductivity, compressive strength, bonding strength, fire resistance, sound insulation and other properties of the boards are tested. Once the test is passed, the boards are considered finished products.
[0034] Example 1
[0035] 35 parts Portland cement, 6 parts nano silica, 4 parts glass short fiber, 3 parts modified polypropylene fiber, 1.5 parts water-reducing agent, 0.8 parts defoamer, and 18 parts water were placed in a mixer and stirred at 300 rpm for 12 minutes to obtain the protective layer raw material. 25 parts water-based acrylic emulsion, 10 parts titanium dioxide, 6 parts hollow microspheres, 1.5 parts silane coupling agent, 1.2 parts film-forming aid, and 12 parts deionized water were placed in a disperser and dispersed at 900 rpm for 25 minutes to obtain the infrared reflective heat insulation layer raw material. 20 parts modified silica aerogel, 14 parts vacuum glass microspheres, 12 parts carbonized corn stalk fiber, 8 parts epoxy resin adhesive, and 4 parts flame retardant were placed in a mixer and stirred at 250 rpm. After mixing for 18 minutes, the composite insulation core layer raw material was obtained. The carbonized corn stalk fiber was obtained by carbonizing at 190℃ for 2.5 hours and then pulverizing it to 150 mesh. The modified silica aerogel was obtained by mixing silica aerogel and KH-550 at a ratio of 100:4, reacting at 65℃ for 1.5 hours, and then vacuum drying. The sound insulation buffer layer 4 was obtained by cutting open-cell polyurethane foam with a pore size of 1 mm, a closed-cell rate of 8%, and a density of 25 kg / m³ to a preset size. 12 parts of epoxy resin, 4 parts of polyamide 650 curing agent, 0.8 parts of silane coupling agent, and 2.5 parts of nano calcium carbonate were put into a mixer and stirred at 500 r / min for 10 minutes to obtain the modified epoxy adhesive, which is the bonding bottom layer raw material.
[0036] Pour the protective layer material into the mold, smooth it, and polish it. Pre-cur it at room temperature for 2.5 hours to form protective layer 1. Apply a layer of infrared reflective heat insulation material evenly to the surface of protective layer 1 with a thickness of 1.75 mm. Dry it at room temperature for 3.5 hours to form infrared reflective heat insulation layer 2. Evenly lay composite heat insulation core material on the surface of infrared reflective heat insulation layer 2, compact it with a compaction pressure of 0.4 MPa and a compaction time of 8 minutes to form composite heat insulation core layer 3. Lay a sound insulation buffer layer 4 on the surface of composite heat insulation core layer 3 and bond it firmly with an adhesive with an adhesive application amount of 250 g / m². Evenly apply an adhesive underlayer material to the surface of sound insulation buffer layer 4 to form adhesive underlayer 5 with a thickness of 1.75 mm.
[0037] After the composite molding is completed, the board is placed in the curing room and a gradient curing process is adopted. First, it is cured at 28℃ and 65% relative humidity for 36 hours, then the temperature is raised to 45℃ and 55% relative humidity for 18 hours, and finally the temperature is lowered to room temperature and the curing continues for 4 days until the board strength reaches the design requirements. During the curing process, the board is protected from moisture and impact.
[0038] The properly cured boards were cut to the preset dimensions with a cutting accuracy of ≤±0.5mm. The performance of the boards was then tested, and the results showed that the thermal conductivity was 0.017W / (m·K), the compressive strength was 28MPa, the bonding strength was 1.2MPa, the fire rating was A1, the sound insulation was 42dB, and the surface flatness was 0.2mm / m, which met the design requirements.
[0039] Example 2
[0040] 32 parts Portland cement, 5 parts nano silica, 3 parts glass short fiber, 2 parts modified polypropylene fiber, 1 part water-reducing agent, 0.5 parts defoamer, and 16 parts water were placed in a mixer and stirred at 400 rpm for 10 minutes to obtain the protective layer raw material. 22 parts water-based acrylic emulsion, 8 parts titanium dioxide, 5 parts hollow microspheres, 1 part silane coupling agent, 1 part film-forming aid, and 10 parts deionized water were placed in a disperser and dispersed at 800 rpm for 20 minutes to obtain the infrared reflective heat insulation layer raw material. 18 parts modified silica aerogel, 12 parts vacuum glass microspheres, 10 parts carbonized bamboo fiber, 6 parts epoxy resin adhesive, and 3 parts flame retardant were placed in a mixer and stirred at 200 rpm. Mix for 15 minutes to obtain the composite thermal insulation core layer material. The carbonized bamboo fiber is obtained by carbonizing at 180℃ for 2.0 hours and pulverizing to 100 mesh. The modified silica aerogel is obtained by mixing silica aerogel and KH-550 at a ratio of 100:3, reacting at 60℃ for 1 hour, and then vacuum drying. The open-cell polyurethane foam with a pore size of 0.8 mm, a closed-cell rate of 7%, and a density of 22 kg / m³ is cut to the preset size to obtain the sound insulation buffer layer 4. 10 parts of epoxy resin, 3 parts of polyamide 650 curing agent, 0.5 parts of silane coupling agent, and 2 parts of nano calcium carbonate are put into a mixer and stirred at 400 r / min for 8 minutes to obtain the modified epoxy adhesive, which is the bonding bottom layer material.
[0041] Pour the protective layer material into the mold, smooth it, and polish it. Pre-cur it at room temperature for 2.5 hours to form protective layer 1. Apply a layer of infrared reflective heat insulation material evenly to the surface of protective layer 1 with a thickness of 2.4 mm. Dry it at room temperature for 3 hours to form infrared reflective heat insulation layer 2. Evenly lay composite heat insulation core material on the surface of infrared reflective heat insulation layer 2, compact it with a compaction pressure of 0.3 MPa and a compaction time of 5 minutes to form composite heat insulation core layer 3. Lay a sound insulation buffer layer 4 on the surface of composite heat insulation core layer 3 and bond it firmly with an adhesive with an adhesive application amount of 200 g / m². Evenly apply an adhesive underlayer material to the surface of sound insulation buffer layer 4 to form adhesive underlayer 5 with a coating thickness of 2.4 mm.
[0042] After the composite molding is completed, the board is placed in the curing room and a gradient curing process is adopted. First, it is cured at 25℃ and 60% relative humidity for 24 hours, then the temperature is raised to 40℃ and 50% relative humidity for 12 hours, and finally the temperature is lowered to room temperature and the curing continues for 3 days until the board strength reaches the design requirements. During the curing process, the board is protected from moisture and impact.
[0043] The properly cured boards were cut to the preset dimensions with a cutting accuracy of ≤±0.5mm. The performance of the boards was then tested, and the results showed that the thermal conductivity was 0.018W / (m·K), the compressive strength was 26MPa, the bonding strength was 1.0MPa, the fire rating was A1, the sound insulation was 40dB, and the surface flatness was 0.3mm / m, which met the design requirements.
[0044] Example 3
[0045] 38 parts Portland cement, 7 parts nano silica, 5 parts glass short fiber, 4 parts modified polypropylene fiber, 2 parts water-reducing agent, 1 part defoamer, and 19 parts water were placed in a mixer and stirred at 500 rpm for 15 minutes to obtain the protective layer raw material. 28 parts water-based acrylic emulsion, 11 parts titanium dioxide, 7 parts hollow microspheres, 2 parts silane coupling agent, 1.5 parts film-forming aid, and 14 parts deionized water were placed in a disperser and dispersed at 1000 rpm for 30 minutes to obtain the infrared reflective heat insulation layer raw material. 24 parts modified silica aerogel, 16 parts vacuum glass microspheres, 14 parts carbonized corn stalk fiber, 9 parts epoxy resin adhesive, and 5 parts flame retardant were placed in a mixer and stirred at 300 rpm. Mix for 20 minutes to obtain the composite insulation core layer material. The carbonized corn stalk fiber is obtained by carbonizing at 200℃ for 3 hours and then crushing it to 200 mesh. The modified silica aerogel is obtained by mixing silica aerogel and KH-550 at a ratio of 100:5, reacting at 70℃ for 2 hours, and then vacuum drying. The open-cell polyurethane foam with a pore size of 1.5 mm, a closed-cell rate of 9%, and a density of 28 kg / m³ is cut to the preset size to obtain the sound insulation buffer layer 4. 14 parts of epoxy resin, 5 parts of polyamide 650 curing agent, 1 part of silane coupling agent, and 3 parts of nano calcium carbonate are put into a mixer and stirred at 600 r / min for 12 minutes to obtain the modified epoxy adhesive, which is the bonding bottom layer material.
[0046] Pour the protective layer material into the mold, smooth it, and polish it. Pre-cur it at room temperature for 3 hours to form protective layer 1. Apply a layer of infrared reflective heat insulation material evenly to the surface of protective layer 1 with a thickness of 3.6 mm. Dry it at room temperature for 4 hours to form infrared reflective heat insulation layer 2. Evenly lay composite heat insulation core material on the surface of infrared reflective heat insulation layer 2, compact it with a compaction pressure of 0.5 MPa and a compaction time of 10 minutes to form composite heat insulation core layer 3. Lay a sound insulation buffer layer 4 on the surface of composite heat insulation core layer 3 and bond it firmly with an adhesive with an adhesive application amount of 300 g / m². Evenly apply an adhesive underlayer material to the surface of sound insulation buffer layer 4 to form adhesive underlayer 5 with a coating thickness of 2.8 mm.
[0047] After the composite molding is completed, the board is placed in the curing room and a gradient curing process is adopted. First, it is cured at 30℃ and 70% relative humidity for 48 hours, then the temperature is raised to 50℃ and 60% relative humidity for 24 hours, and finally the temperature is lowered to room temperature and curing is continued for 5 days until the board strength reaches the design requirements. During the curing process, the board is protected from moisture and impact.
[0048] The properly cured boards were cut to the preset dimensions with a cutting accuracy of ≤±0.5mm. The performance of the boards was then tested, and the results showed that the thermal conductivity was 0.016W / (m·K), the compressive strength was 30MPa, the bonding strength was 1.3MPa, the fire rating was A1, the sound insulation was 45dB, and the surface flatness was 0.2mm / m, which met the design requirements.
[0049] The technical scope of this invention is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this invention, and all such modifications and variations should fall within the protection scope of this invention.
Claims
1. A thermal insulation composite board, characterized in that: It includes a protective layer (1), an infrared reflective heat insulation layer (2), a composite heat insulation core layer (3), a sound insulation buffer layer (4), and an adhesive bottom layer (5) arranged from bottom to top. The composite insulation core layer (3) is prepared from modified silica aerogel, vacuum glass microspheres, plant fibers, epoxy resin adhesive and flame retardant. The modified silica aerogel is obtained by modification treatment with silane coupling agent KH-550.
2. The thermal insulation composite board according to claim 1, characterized in that: The protective layer (1) is made of Portland cement, nano silica, glass short fiber, modified polypropylene fiber, water reducing agent, defoamer and water. The surface flatness of the protective layer (1) is ≤0.3mm / m and the compressive strength is ≥25MPa.
3. The thermal insulation composite board according to claim 1, characterized in that: The infrared reflective heat insulation layer (2) is prepared from water-based acrylic emulsion, titanium dioxide, hollow microspheres, silane coupling agent, film-forming aid and deionized water, and the infrared reflectivity of the infrared reflective heat insulation layer (2) is ≥85%.
4. The thermal insulation composite board according to claim 1, characterized in that: The thermal conductivity of the composite insulation core layer (3) is ≤0.018W / (m·K), and the compressive strength is ≥10MPa.
5. The thermal insulation composite board according to claim 1, characterized in that: The sound insulation buffer layer (4) is made of open-cell polyurethane foam with a foam pore size of 0.5-2mm, a closed-cell rate of ≤10%, a density of 20-30kg / m³, and a sound insulation of ≥40dB.
6. The thermal insulation composite board according to claim 1, characterized in that: The bonding substrate (5) is prepared by a modified epoxy adhesive, which is prepared by epoxy resin, curing agent, silane coupling agent and nano calcium carbonate. The bonding strength of the bonding substrate (5) is ≥1.0MPa.
7. A method for preparing the thermal insulation composite panel according to claims 1-6, characterized in that, Includes the following steps: Step 1: Prepare the raw materials for the protective layer, the infrared reflective heat insulation layer, the composite heat insulation core layer, the sound insulation buffer layer (4), and the adhesive bottom layer. Step 2: Pour the protective layer material into the mold, scrape it flat, and polish it to form a protective layer (1). Apply a layer of infrared reflective heat insulation material evenly to the surface of the protective layer (1), and dry it at room temperature to form an infrared reflective heat insulation layer (2). Apply composite heat insulation core material evenly to the surface of the infrared reflective heat insulation layer (2), and compact it to form a composite heat insulation core layer (3). Apply a sound insulation buffer layer (4) to the surface of the composite heat insulation core layer (3), and bond it firmly with an adhesive. Apply adhesive bottom material evenly to the surface of the sound insulation buffer layer (4) to form an adhesive bottom layer (5). Step 3: Place the composite molded board into the curing room and cure it for 24-48 hours at 25-30℃ and 60%-70% relative humidity. Then, raise the temperature to 40-50℃ and 50%-60% relative humidity and cure it for 12-24 hours. Finally, cool it down to room temperature and cure it for 3-5 days. Step 4: Cut the cured boards to the preset size, and then test the thermal conductivity, compressive strength, bonding strength, fire resistance, sound insulation and other properties of the boards. Once the test is passed, it is a finished product.
8. The method according to claim 7, characterized in that: The composite insulation core layer raw material is obtained by first carbonizing plant fibers at a high temperature of 180-200℃ for 2-3 hours, cooling them to room temperature, and then crushing them to a particle size of 100-200 mesh. Modified silica aerogel, vacuum glass microspheres, carbonized plant fibers, epoxy resin adhesive and flame retardant are weighed according to the weight parts, put into a mixer and mixed evenly.
9. The method according to claim 8, characterized in that: Modified silica aerogel is obtained by mixing silica aerogel with silane coupling agent KH-550 at a weight ratio of 100:3-5, adding ethanol, stirring and reacting at 60-70℃ for 1-2 hours, cooling to room temperature and then vacuum drying.