Cold storage semiconductor vehicle-mounted cooling and heating box system based on multiple refrigerant branches and vehicle

Abstract

This invention discloses a vehicle-mounted refrigerant storage semiconductor-based cold and warm box system and vehicle based on multiple refrigerant branches. The system includes: a main refrigerant circuit, which comprises a compressor, a condenser, a first expansion valve, and an air conditioning evaporator to form an air conditioning refrigeration circuit; a cold and warm box module, integrating a cold storage unit, a thermoelectric semiconductor module, and a heat exchange structure; a first refrigerant branch and a second refrigerant branch connected in parallel from the condenser outlet, which respectively pass through a second expansion valve and a plate heat exchanger, and a third expansion valve and the hot-end heat exchanger of the thermoelectric semiconductor module before returning to the compressor suction port; the cold storage unit can exchange heat with the plate heat exchanger and / or the cold end of the thermoelectric semiconductor module to store cold energy. This invention deeply integrates the cold and warm box with the vehicle's air conditioning system, utilizing refrigerant branches to assist semiconductor heat dissipation and to charge the cold storage unit, significantly improving system energy efficiency and integration.

Description

Technical Field

[0001] This invention relates to the field of vehicle thermal management technology, and in particular to a cold storage semiconductor vehicle-mounted cooling and heating box system and vehicle based on multiple refrigerant branches. Background Technology

[0002] With the increasing demands for intelligent and comfortable vehicles, in-vehicle refrigerators and heaters (such as those in the armrest compartment) have become standard equipment in mid-to-high-end models. Currently, in-vehicle refrigerators and heaters on the market are mainly divided into semiconductor cooling / heating types and independent compressor refrigerant types.

[0003] Semiconductor-based cooling / heating systems utilize the Peltier effect of thermoelectric semiconductor modules (TECs) to achieve cooling or heating through different current flows. They offer advantages such as simple structure, fast response, and no vibration or noise. However, their coefficient of performance (COP) is relatively low, their cooling capacity is small, and improper heat dissipation can negatively impact performance. Independent compressor refrigerant systems feature a built-in small compressor, offering a large cooling capacity and, while their COP is somewhat improved compared to systems with thermoelectric modules, they are more complex, occupy more space, and are more expensive.

[0004] In existing vehicle thermal management systems, the air conditioning system (including compressor, condenser, and evaporator) and the onboard refrigerator / heater are usually independent systems. This results in low system integration, a large number of parts, increased vehicle weight, and inadequate energy management. In particular, the independently set onboard refrigerator / heater system has relatively low energy efficiency, and the waste heat generated by the independent operation of the refrigerator / heater is directly discharged into the cabin, causing some pollution to the in-vehicle environment. Summary of the Invention

[0005] The purpose of this invention is to provide a vehicle-mounted cooling and heating box system and vehicle based on a multi-refrigerant branch cold storage semiconductor, in order to solve the problems of low integration and low energy efficiency caused by the independent operation of the vehicle-mounted cooling and heating box and the vehicle's air conditioning refrigeration circuit in the prior art. The invention utilizes the high-efficiency refrigerant circulation of the air conditioning system to assist the semiconductor module in heat dissipation, thereby improving the working energy efficiency ratio of the vehicle-mounted cooling and heating box.

[0006] To solve the above-mentioned technical problems, the embodiments of the present invention provide a technical solution as follows: A multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cooling and heating box system, comprising: a main refrigerant circuit, which includes a compressor, a condenser, a first expansion valve, and an air conditioning evaporator connected in sequence through pipelines, and returning to the compressor to form an air conditioning refrigeration circuit; a cooling and heating box module, wherein the cooling and heating box module integrates a cold storage unit, a thermoelectric semiconductor module, and a heat exchange structure, wherein the hot end of the thermoelectric semiconductor module is provided with a hot end heat exchanger, and the cold end exchanges heat with the air inside the cooling and heating box through the heat exchange structure to regulate the temperature inside the box; from the... The condenser outlet of the main refrigerant circuit is connected in parallel to a first refrigerant branch and a second refrigerant branch; one end of the first refrigerant branch is connected to the condenser outlet via a pipeline, and sequentially connected to a second expansion valve and a plate heat exchanger, while the other end is connected to the suction port of the compressor; one end of the second refrigerant branch is connected to the condenser outlet via a pipeline, and sequentially connected to a third expansion valve and the hot-end heat exchanger of the thermoelectric semiconductor module, while the other end is connected to the suction port of the compressor; wherein, the cold storage unit can store cold energy by exchanging heat with the plate heat exchanger and / or with the cold end of the thermoelectric semiconductor module.

[0007] Furthermore, the heat exchange structure includes fins corresponding to the cold end, and a fan for forcing airflow. The fan is used to force the air inside the heating / cooling box to exchange heat with the heat exchange surface of the thermoelectric semiconductor module and the cold storage unit.

[0008] Furthermore, the cold storage unit includes a phase change material and is thermally coupled to the plate heat exchanger, for charging the cold storage unit with cold through the plate heat exchanger when the second expansion valve is opened.

[0009] Furthermore, it also includes a control device and a temperature sensor integrated into the cooling / warming box module. The control device is electrically connected to the main refrigerant circuit, the cooling / warming box module, the first refrigerant branch, and the second refrigerant branch, and is used to control the working mode of the cooling / warming box system according to user instructions or sensor signals.

[0010] Furthermore, the operating mode includes a deep cooling mode: when the compressor is working, the first expansion valve, the second expansion valve, and the third expansion valve are all open, a portion of the refrigerant enters the air conditioning evaporator to cool the cab, another portion of the refrigerant enters the plate heat exchanger to charge the cold storage unit, and a third portion of the refrigerant flows through the hot end heat exchanger of the thermoelectric semiconductor module to cool its hot end, while the cold end of the thermoelectric semiconductor module releases cold energy to cool the air inside the cabin.

[0011] Furthermore, the operating mode includes a semiconductor refrigeration mode: the compressor operates, the first expansion valve and the second expansion valve are closed, and only the third expansion valve is opened. The refrigerant flows through the hot end heat exchanger of the thermoelectric semiconductor module to cool its hot end, and the cold end of the thermoelectric semiconductor module releases cold energy to achieve cooling inside the box.

[0012] Furthermore, the operating mode includes a heat preservation mode: when the compressor stops, the first refrigerant branch and the second refrigerant branch are shut down, and the internal temperature of the heating and cooling box is maintained solely by the release of cold energy from the cold storage unit.

[0013] Furthermore, the hot-end heat exchanger of the thermoelectric semiconductor module is a microchannel heat exchanger or an independent plate heat exchanger, and thermally conductive adhesive is filled between it and the hot end of the thermoelectric semiconductor module; the second expansion valve and the third expansion valve are electronic expansion valves or thermal expansion valves.

[0014] Embodiments of the present invention also provide a vehicle including a multi-refrigerant branch-based on-board cooling and heating box system for cold storage semiconductors as described in any of the preceding claims.

[0015] The present invention provides a multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cooling and heating box system and vehicle. Compared with existing technologies, it seamlessly integrates the traditional independent vehicle-mounted cooling and heating box into the vehicle's thermal management system through multiple refrigerant branches. This reduces the need for separate radiators or complex air ducts, effectively simplifying the structure of the cooling and heating module, reducing the number of parts, and thus saving weight and space. The high-efficiency refrigerant circulation of the air conditioning cooling circuit assists in the heat dissipation of the semiconductor module, solving the heat dissipation bottleneck of the semiconductor module and significantly improving its operating energy efficiency ratio. Simultaneously, the first refrigerant branch is used to charge the cold storage unit, and the introduction of the cold storage unit realizes the transfer and reuse of energy in time and space, effectively extending the heat preservation time of the cooling and heating box when the compressor is off. In particular, through the cooperation of the compressor and the expansion valves of each branch, multiple modes such as deep cooling, semiconductor cooling, heat preservation, and heating can be achieved to meet the needs of users in different scenarios. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings do not constitute a limitation on scale.

[0017] Figure 1 This is a schematic diagram of the framework structure of a vehicle-mounted cold and warm box system based on multiple refrigerant branches in an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached diagram: 10. Main refrigerant circuit; 11. First refrigerant branch; 12. Second refrigerant branch; 1. Compressor; 2. Condenser; 3. First expansion valve; 4. Air conditioning evaporator; 5. Second expansion valve; 6. Plate heat exchanger; 7. Third expansion valve; 8. Cooler / heater box module; 81. Thermoelectric semiconductor module; 82. Cold storage unit; 83. Heat exchange structure; 831. Fins; 832. Fan; 84. Temperature sensor. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the various embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0020] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] like Figure 1 As shown, one embodiment of the present invention relates to a cold storage semiconductor vehicle-mounted cooling and heating box system based on multiple refrigerant branches, including: a main refrigerant circuit 10, which includes a compressor 1, a condenser 2, a first expansion valve 3 and an air conditioning evaporator 4 connected in sequence through pipelines, and returns to the compressor 1 to form an air conditioning refrigeration circuit.

[0022] The air conditioning compressor 1 discharges high-temperature and high-pressure gaseous refrigerant, which enters the condenser 2 and is cooled into high-pressure liquid refrigerant. The liquid refrigerant is throttled and depressurized by the first expansion valve 3 and then enters the air conditioning evaporator 4 to absorb heat and evaporate, providing cool air to the cab. It then returns to the suction port of the compressor 1 to complete the air conditioning refrigeration cycle.

[0023] A tee connector is installed on the high-pressure liquid pipeline between the outlet of condenser 2 and the first expansion valve 3, and two branches are connected in parallel, namely the first refrigerant branch 11 and the second refrigerant branch 12. One end of the first refrigerant branch 11 is connected to the outlet of condenser 2 through a pipeline, and is connected to the second expansion valve 5 and the plate heat exchanger 6 in sequence. The other end is connected to the suction port of compressor 1. The liquid refrigerant enters the plate heat exchanger 6 through the second expansion valve 5. After absorbing heat in the plate heat exchanger 6, the refrigerant evaporates and returns to the suction port of compressor 1 through the pipeline.

[0024] One end of the second refrigerant branch 12 is connected to the outlet of the condenser 2 through a pipeline, and is sequentially connected to the third expansion valve 7 and the hot end heat exchanger of the thermoelectric semiconductor module 81. The other end is connected to the suction port of the compressor 1. The liquid refrigerant enters the hot end heat exchanger of the thermoelectric semiconductor module 81 through the third expansion valve 7. After absorbing the heat at the hot end, the refrigerant evaporates and returns to the suction port of the compressor 1.

[0025] Preferably, the hot end heat exchanger of the thermoelectric semiconductor module 81 is a microchannel heat exchanger or an independently set plate heat exchanger, and thermally conductive adhesive is filled between it and the hot end of the thermoelectric semiconductor module 81; optionally, the second expansion valve 5 and the third expansion valve 7 are electronic expansion valves or thermal expansion valves.

[0026] The vehicle-mounted heated and cooled box system also includes a heated and cooled box module 8, which integrates a cold storage unit 82, a thermoelectric semiconductor module 81, and a heat exchange structure 83. The hot end of the thermoelectric semiconductor module 81 is equipped with a hot-end heat exchanger, and the cold end exchanges heat with the air inside the heated and cooled box through the heat exchange structure 83 to regulate the temperature inside the box. Preferably, the cold storage unit 82 is a sealed container filled with a phase change material, such as paraffin-based or hydrated salt phase change material, and is thermally coupled to the refrigerant side of the plate heat exchanger 6. For example, the two can be bonded together with thermally conductive adhesive or connected by an internal coil for heat exchange. When the second expansion valve 5 is opened, the cold storage unit 82 is charged with cold through the plate heat exchanger 6. The cold storage unit can store cold energy by exchanging heat with the plate heat exchanger 6 and / or with the cold end of the thermoelectric semiconductor module.

[0027] In one example, the heat exchange structure 83 corresponding to the thermoelectric semiconductor module 81 includes fins 831 corresponding to the cold end, and a fan 832 for forced airflow. The fins 831 can accelerate heat conduction, and the fan 832 can force the air inside the hot and cold box to exchange heat with the heat exchange surface of the thermoelectric semiconductor module and the cold storage unit 82; causing it to flow through the surface of the cold end fins 831 and the cold storage unit 82 of the thermoelectric semiconductor module 81, thereby achieving heat dissipation at the hot end and regulating the temperature of the air inside the box.

[0028] In one example, the refrigerant box system also includes a control device and a temperature sensor 84 integrated into the refrigerant box module 8. The control device is electrically connected to the main refrigerant circuit 10, the refrigerant box module 8, the first refrigerant branch 11, and the second refrigerant branch 12, and is used to control the operating mode of the refrigerant box system according to user commands or sensor signals. The control device automatically switches the operating mode of the refrigerant box system or starts / stops relevant valve groups and fans 832 according to user preset modes, signals from the internal temperature sensor 84, and vehicle operating status such as engine and compressor 1 start / stop, vehicle speed, etc.

[0029] Depending on the usage requirements, the operating modes of the multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cold and warm box system provided by this invention include at least one of the following: deep cooling mode, semiconductor cooling mode, and heat preservation mode.

[0030] In one example, taking summer as an example, the user can select rapid cooling via the control panel, and the heating and cooling box system enters deep cooling mode: the control device starts the compressor 1 and opens the first expansion valve 3, the second expansion valve 5, and the third expansion valve 7. A portion of the refrigerant enters the air conditioning evaporator 4 to cool the cab, and the cab air conditioning cools normally; at the same time, a second portion of the refrigerant absorbs heat from the cold storage unit 82 in the plate heat exchanger 6 through the first refrigerant branch 11, causing the phase change material to solidify and store cold; a third portion of the refrigerant enters the hot end heat exchanger of the thermoelectric semiconductor module 81 through the second refrigerant branch 12, absorbs heat from the hot end of the thermoelectric semiconductor module 81, significantly reduces the hot end temperature, and causes the cold end temperature to drop rapidly. The fan 832 blows cold air into the box to cool the air inside; in this mode, the heating and cooling box can drop to 0°C within minutes. Tests show that the cooling energy efficiency ratio of the heating and cooling box can reach more than 1.2, which is significantly higher than the energy efficiency ratio of 0.6 of the existing heating and cooling boxes that independently use the thermoelectric semiconductor module 81.

[0031] When the vehicle is in motion and only requires cooling of the in-cabin compartment without the need for cabin air conditioning, the in-cabin compartment system can select to execute a semiconductor cooling mode: the control device closes the first expansion valve 3 and the second expansion valve 5, and only opens the third expansion valve 7. The compressor 1 continues to operate, and the refrigerant flows only through the hot-end heat exchanger of the thermoelectric semiconductor module 81 in the second branch, cooling the hot end of the thermoelectric semiconductor module 81. The thermoelectric semiconductor module 81 then operates, generating cooling at its cold end, which is blown into the compartment by the fan 832, achieving cooling inside the compartment. This mode reduces the overall load on the vehicle's in-cabin compartment system while maintaining the efficient operation of the in-cabin compartment module 8, resulting in a significantly improved energy efficiency ratio compared to existing in-cabin compartment systems with an independent compressor 1.

[0032] When the vehicle is parked and the engine is off, compressor 1 stops working, and the refrigerant box system can select to execute the insulation mode: the control device closes all expansion valves, that is, closes the first refrigerant branch 11 and the second refrigerant branch 12. At this time, the refrigerant box relies on the phase change material solidified in the cold storage unit 82 to release cold energy and exchange heat with the air inside the refrigerant box to maintain the internal temperature of the refrigerant box at a low temperature. Preferably, the temperature sensor 84 monitors the internal temperature in real time. When the temperature rises back to the set threshold, the vehicle can use low-voltage electric start to activate the thermoelectric semiconductor module 81 and the fan 832 for low-power supplemental cooling to extend the insulation time.

[0033] The status of actuators such as the expansion valve, compressor 1, and thermoelectric semiconductor module 81 under each operating mode is summarized in Table 1, Operating Mode - Actuator Status Table: Table 1 Operating Mode - Actuator Status Table One embodiment of the present invention relates to a vehicle, including the above-mentioned multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cooling and heating box system. By integrating the cooling and heating box module with the vehicle's air conditioning refrigeration circuit, the efficient sharing of cooling and heating energy between the air conditioning refrigeration system and the cooling and heating box module is realized, as well as the integration of waste heat emission channels. This is beneficial to improving energy utilization, simplifying the structure of the cooling and heating box module, and miniaturizing the cooling and heating box module to reduce the impact on the in-vehicle environment during its use.

[0034] The present invention provides a multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cooling and heating box system and vehicle, which seamlessly integrates the traditional independent vehicle-mounted cooling and heating box into the vehicle's thermal management system through multiple refrigerant branches. This reduces the need for separate radiators or complex air ducts, effectively simplifying the structure of the cooling and heating module, reducing the number of parts, and thus saving weight and space. The high-efficiency refrigerant circulation of the air conditioning cooling circuit assists in the heat dissipation of the semiconductor module, solving the heat dissipation bottleneck of the semiconductor module and significantly improving its operating energy efficiency ratio. Simultaneously, the first refrigerant branch is used to charge the cold storage unit, and the introduction of the cold storage unit realizes the transfer and reuse of energy in time and space, effectively extending the heat preservation time of the cooling and heating box when the compressor is off. In particular, through the cooperation of the compressor and the expansion valves of each branch, multiple modes such as deep cooling, semiconductor cooling, heat preservation, and heating can be achieved to meet the needs of users in different scenarios.

[0035] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. A multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cooling / heating box system, characterized in that, include: The main refrigerant circuit (10) includes a compressor (1), a condenser (2), a first expansion valve (3) and an air conditioning evaporator (4) connected in sequence by pipelines, and returns to the compressor (1) to form an air conditioning refrigeration circuit; The cold and warm box module (8) integrates a cold storage unit (82), a thermoelectric semiconductor module (81) and a heat exchange structure (83). The hot end of the thermoelectric semiconductor module (81) is provided with a hot end heat exchanger. The cold end exchanges heat with the air inside the cold and warm box through the heat exchange structure (83) to regulate the temperature inside the box. A first refrigerant branch (11) and a second refrigerant branch (12) are connected in parallel from the outlet of the condenser (2) of the main refrigerant circuit (10); One end of the first refrigerant branch (11) is connected to the outlet of the condenser (2) through a pipeline, and is connected in sequence to the second expansion valve (5) and the plate heat exchanger (6), while the other end is connected to the suction port of the compressor (1); One end of the second refrigerant branch (12) is connected to the outlet of the condenser (2) through a pipeline, and is sequentially connected to the third expansion valve (7) and the hot end heat exchanger of the thermoelectric semiconductor module (81), while the other end is connected to the suction port of the compressor (1); The cold storage unit (82) can store cold energy by exchanging heat with the plate heat exchanger (6) and / or with the cold end of the thermoelectric semiconductor module (81).

2. The vehicle-mounted cold and warm box system based on multi-refrigerant branches according to claim 1, characterized in that, The heat exchange structure (83) includes fins (831) corresponding to the cold end, and a fan (832) for forced airflow. The fan (832) is used to force the air inside the heating and cooling box to exchange heat with the heat exchange surface of the thermoelectric semiconductor module (81) and the cold storage unit (82).

3. The vehicle-mounted cold and warm box system based on multi-refrigerant branches according to claim 1, characterized in that, The cold storage unit (82) contains a phase change material and is thermally coupled to the plate heat exchanger (6) for charging the cold storage unit (82) through the plate heat exchanger (6) when the second expansion valve (5) is opened.

4. The vehicle-mounted cold and warm box system based on multi-refrigerant branches according to claim 1, characterized in that, It also includes a control device and a temperature sensor (84) integrated into the heating and cooling box module (8). The control device is electrically connected to the main refrigerant circuit (10), the heating and cooling box module (8), the first refrigerant branch (11), and the second refrigerant branch (12), and is used to control the working mode of the heating and cooling box system according to user instructions or sensor signals.

5. The vehicle-mounted cold and warm box system based on multi-refrigerant branches according to claim 4, characterized in that, The working mode includes a deep cooling mode: the compressor (1) is working, the first expansion valve (3), the second expansion valve (5) and the third expansion valve (7) are all open, a part of the refrigerant enters the air conditioning evaporator (4) to cool the cab, another part of the refrigerant enters the plate heat exchanger (6) to charge the cold storage unit (82), and a third part of the refrigerant flows through the hot end heat exchanger of the thermoelectric semiconductor module (81) to cool its hot end, and the cold end of the thermoelectric semiconductor module (81) releases cold energy to cool the air inside the box.

6. The vehicle-mounted cold storage semiconductor system based on multiple refrigerant branches according to claim 4, characterized in that, The working mode includes a semiconductor refrigeration mode: the compressor (1) is working, the first expansion valve (3) and the second expansion valve (5) are closed, and only the third expansion valve (7) is opened. The refrigerant flows through the hot end heat exchanger of the thermoelectric semiconductor module (81) to cool its hot end. The cold end of the thermoelectric semiconductor module (81) releases cold energy to realize the refrigeration inside the box.

7. The vehicle-mounted cold storage semiconductor system based on multiple refrigerant branches according to claim 4, characterized in that, The working mode includes a heat preservation mode: when the compressor (1) stops, the first refrigerant branch (11) and the second refrigerant branch (12) are closed, and the cold energy is released only by the cold storage unit (82) to maintain the internal temperature of the cold and warm box.

8. The vehicle-mounted cold and warm box system based on multi-refrigerant branches according to claim 1, characterized in that, The heat exchanger at the hot end of the thermoelectric semiconductor module (81) is a microchannel heat exchanger or an independent plate heat exchanger, and thermally conductive adhesive is filled between it and the hot end of the thermoelectric semiconductor module (81); the second expansion valve (5) and the third expansion valve (7) are electronic expansion valves or thermal expansion valves.

9. A vehicle, characterized in that, Including the multi-refrigerant branch-based cold storage semiconductor vehicle-mounted cold and warm box system as described in any one of claims 1-8.

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