Conductive high-speed wire taping mechanism

Abstract

The application provides a conductive high-speed wire adhesive taping mechanism, which comprises a mounting frame, an adhesive tape supply disc, an adhesive tape pulling module, an adhesive tape clamping and positioning module, an adhesive tape cutting module and an adhesive taping and absorbing module. The adhesive tape pulling module is used for pulling out the adhesive tape on the adhesive tape supply disc. The adhesive tape clamping and positioning module is used for clamping and positioning the adhesive tape. The adhesive tape cutting module is used for cutting the adhesive tape. The adhesive taping and absorbing module comprises an adhesive taping and moving driving assembly, an adhesive taping and overturning driving assembly and adhesive taping and absorbing clamps. The adhesive taping and absorbing clamps are provided with first absorbing holes for absorbing the adhesive tape. The adhesive tape between the adhesive tape clamping and positioning module and the adhesive tape pulling module is absorbed by the two adhesive taping and absorbing clamps in the open absorbing position. The adhesive taping and moving driving assembly drives the adhesive taping and overturning driving assembly and the adhesive taping and absorbing clamps to move to the adhesive taping station together with the cut adhesive tape, so that the adhesive taping and overturning driving assembly drives the two adhesive taping and absorbing clamps to overturn to the clamping position to clamp the conductive high-speed wire and adhere the adhesive tape to the conductive high-speed wire.

Description

Technical Field

[0001] This invention relates to the field of data transmission cable manufacturing, and more particularly to a conductive high-speed wire adhesive application mechanism. Background Technology

[0002] In the field of high-speed cables for data centers, high-speed cables, as dedicated cables for high-speed data transmission, are widely used in many key areas such as data centers, artificial intelligence servers, intelligent vehicles, and communication equipment due to their core characteristics of high bandwidth, low latency, and strong anti-interference. They are the core transmission carrier that ensures the efficient and stable operation of various devices.

[0003] High-speed cables contain multiple conductive high-speed wires. During the production process of high-speed cables, in order to facilitate subsequent transfer and processing, after the wire feeding mechanism completes the wire feeding operation of multiple conductive high-speed wires, all conductive high-speed wires need to be positioned and integrated together by applying adhesive tape to ensure the relative position of the multiple conductive high-speed wires is stable, thus laying the foundation for subsequent production processes.

[0004] Currently, the industry standard for adhesive placement of high-speed conductive lines is as follows: An adhesive placement mechanism is installed at corresponding positions above and below each high-speed conductive line. The upper mechanism cuts the tape from the roll to the required length and applies the cut tape to the upper surface of each high-speed conductive line. The lower mechanism simultaneously performs the tape cutting and application, applying the tape to the lower surface of each high-speed conductive line. It is required that the tape above and below the high-speed conductive lines precisely align and adhere, thus achieving adhesive placement and positioning for all high-speed conductive lines and completing the entire adhesive placement process.

[0005] However, the above-mentioned conventional adhesive application method has obvious defects and shortcomings in practical applications: First, this method requires the additional setting of two independent adhesive application mechanisms, and each adhesive application mechanism requires a corresponding roll of adhesive tape, which undoubtedly increases the manufacturing cost of the equipment and the subsequent maintenance cost, and is not conducive to improving production efficiency; Second, the operating accuracy requirements of the two adhesive application mechanisms are extremely high. If there is a slight positional deviation during the equipment installation and debugging process, the adhesive tape above the conductive high-speed line and the adhesive tape below it will not be able to achieve effective corresponding bonding, and thus cannot stably position all the conductive high-speed lines together, which seriously affects the smooth progress of subsequent production processes, and may even lead to substandard product quality.

[0006] Based on the problems existing in the prior art, it is necessary to provide at least one conductive high-speed wire bonding mechanism that is low in cost and can ensure that the tape effectively bonds all conductive high-speed wires together, so as to solve the pain points of high cost and difficulty in guaranteeing bonding accuracy of the existing bonding method. Summary of the Invention

[0007] The purpose of this invention is to provide a low-cost conductive high-speed wire bonding mechanism that ensures that the tape effectively bonds all conductive high-speed wires together.

[0008] To achieve the above objectives, the present invention provides a conductive high-speed wire adhesive application mechanism, including a mounting frame, a tape supply reel, a tape pulling module, a tape clamping and positioning module, a tape cutting module, and an adsorption and application module. The mounting frame is provided with an adhesive application station for applying adhesive to the conductive high-speed wire. The tape supply reel is rotatably connected to the mounting frame and is used for supplying tape for winding. The tape pulling module is disposed on the mounting frame and is used to pull out the tape from the tape supply reel. The tape clamping and positioning module is mounted on the mounting frame and located between the tape supply tray and the tape pulling module. The tape clamping and positioning module is used to clamp and position the tape. The tape cutting module is mounted on the mounting frame and is used to cut the tape located between the tape clamping and positioning module and the tape pulling module. The adsorption and application module includes an application movement drive assembly, an application flipping drive assembly, and adsorption and application grippers. The application movement drive assembly is mounted on the mounting frame. An adhesive application flipping drive assembly is disposed on the adhesive application moving drive assembly. Two adsorption adhesive application claws are symmetrically connected to the adhesive application flipping drive assembly. Each adsorption adhesive application claw has a first adsorption hole for adsorbing the adhesive tape. The adhesive application flipping drive assembly drives the two adsorption adhesive application claws to flip. The two adsorption adhesive application claws have an open adsorption position located in the same straight line and a clamping position that is parallel to each other. By adsorbing the adhesive tape located between the adhesive tape clamping positioning module and the adhesive tape pulling module at the open adsorption position, the adhesive application moving drive assembly drives the adhesive application flipping drive assembly and the adsorption adhesive application claws together with the cut adhesive tape to the adhesive application station. This causes the adhesive application flipping drive assembly to drive the two adsorption adhesive application claws to flip to the clamping position, so that the two adsorption adhesive application claws clamp all the conductive high-speed lines located at the adhesive application station and attach the adhesive tape to each conductive high-speed line in a wrapping manner.

[0009] Preferably, the tape-pulling module includes a tape-pulling movement drive assembly, a gripper opening and closing drive assembly, and tape-pulling grippers. The tape-pulling movement drive assembly is disposed on the mounting frame, and the gripper opening and closing drive assembly is disposed on the tape-pulling movement drive assembly. Two tape-pulling grippers are symmetrically connected to the gripper opening and closing drive assembly. The gripper opening and closing drive assembly is used to drive the two tape-pulling grippers to close or open, so that the two tape-pulling grippers can clamp or release the tape. The tape-pulling movement drive assembly is used to drive the gripper opening and closing drive assembly together with the tape-pulling grippers to move, so that the tape-pulling grippers pull the clamped tape from a position close to the tape clamping and positioning module to a position away from the tape clamping and positioning module. Preferably, the tape clamping and positioning module includes a tape clamping and positioning block and a tape pressing assembly. The tape clamping and positioning block is fixed on the mounting frame. The tape clamping and positioning block has a positioning groove for the tape to pass through. One inner side of the positioning groove is a tape positioning surface. The tape clamping and positioning block has a second suction hole on the tape positioning surface for adsorbing the tape. The tape pressing assembly is disposed on the tape clamping and positioning block. The tape pressing assembly is used to pass through the positioning groove and press and position the tape on the tape positioning surface. Preferably, the conductive high-speed wire adhesive application mechanism further includes a tape straightening module, which is disposed on the mounting frame and movably inserted into the tape clamping and positioning block. By moving the tape straightening module along the direction in which the tape exits the positioning groove, the tape exiting the positioning groove is straightened, so that the tape pulling module can clamp the tape. Preferably, the tape straightening module includes a tape straightening movement drive assembly and tape straightening blocks. Two tape straightening blocks are symmetrically arranged and linearly movable on the tape clamping and positioning block. Each of the two tape straightening blocks has a tape straightening limiting groove on its opposite side for limiting the tape. The tape straightening limiting groove communicates with the positioning groove. The tape straightening movement drive assembly is mounted on the mounting frame. The output end of the tape straightening movement drive assembly is connected to the tape straightening block. The tape straightening movement drive assembly drives the tape straightening block to move linearly along the direction in which the tape passes through the positioning groove, so that the tape straightening block straightens the tape through the tape straightening limiting groove. Preferably, the tape straightening and moving drive assembly includes a straightening drive cylinder, a first straightening connecting block, a straightening swing rod, and a second straightening connecting block. The straightening drive cylinder is mounted on the mounting frame, and its output end is connected to the first straightening connecting block. The middle portion of the straightening swing rod is rotatably connected to the mounting frame, and one end of the straightening swing rod has a first movable groove. The straightening swing rod is fitted onto the first straightening connecting block through the first movable groove. The other end of the straightening lever is provided with a second movable groove. The straightening lever is sleeved on the second straightening connecting block through the second movable groove. The two tape straightening blocks are respectively fixedly connected to the second straightening connecting block. The straightening drive cylinder drives the first straightening connecting block to move linearly, so that the first straightening connecting block pushes the straightening lever to rotate, so that the straightening lever drives the second straightening connecting block and the two tape straightening blocks to move linearly together. Preferably, the tape cutting module includes a tape cutting and flipping drive assembly, a first cutting assembly, and a second cutting assembly. The tape cutting and flipping drive assembly is disposed on the mounting bracket. The first cutting assembly and the second cutting assembly are respectively connected to the tape cutting and flipping drive assembly. The tape cutting and flipping drive assembly is used to drive the first cutting assembly and the second cutting assembly to flip in a direction that moves closer to or further away from each other, so as to cut or loosen the tape. Preferably, the adhesive application moving drive assembly includes an adhesive application rotating drive mechanism, an adhesive application screw, an adhesive application nut, and an adhesive application slider. The adhesive application rotating drive mechanism is mounted on the mounting frame, the adhesive application screw is rotatably connected to the mounting frame, the output end of the adhesive application rotating drive mechanism is connected to the adhesive application screw, and the adhesive application rotating drive mechanism is used to drive the adhesive application screw to rotate. The adhesive application nut is sleeved on the adhesive application screw and threadedly engaged with the adhesive application screw. The adhesive application slider is slidably mounted on the mounting frame and fixedly connected to the adhesive application nut. The adhesive application flipping drive assembly is mounted on the adhesive application slider. Preferably, the adhesive application flipping drive assembly includes an adhesive application flipping fixing component, an adhesive application telescopic drive cylinder, and an adhesive application pushing component. The adhesive application flipping fixing component is disposed on the adhesive application moving drive assembly, the adhesive application telescopic drive cylinder is disposed on the adhesive application flipping fixing component, and the adhesive application pushing component is linearly movable and passes through the adhesive application flipping fixing component. The output end of the adhesive application telescopic drive cylinder is connected to the adhesive application pushing component. The two adsorption adhesive application grippers are symmetrically rotatably connected to the adhesive application flipping fixing component. The adsorption adhesive application grippers are provided with sliding slots, and the adhesive application pushing component is provided with sliding pins that are respectively inserted into the sliding slots of the two adsorption adhesive application grippers. The adhesive application telescopic drive cylinder drives the adhesive application pushing component to move linearly, so that the adhesive application pushing component drives the two adsorption adhesive application grippers to flip through the sliding pins. Preferably, the conductive high-speed wire adhesive application mechanism further includes adhesive application clamping and positioning modules. Two adhesive application clamping and positioning modules are symmetrically arranged on the mounting frame, and there is a positioning space between the two adhesive application clamping and positioning modules for the conductive high-speed wire to pass through. The two adhesive application clamping and positioning modules are used to clamp and position the conductive high-speed wire located in the positioning space, so as to facilitate the adhesive application module to apply adhesive to the conductive high-speed wire. Compared with the prior art, the conductive high-speed wire adhesive application mechanism of the present invention utilizes the coordinated operation of the adhesive application module's adhesive application moving drive component, adhesive application flipping drive component, and two symmetrically arranged adhesive application grippers. The two adhesive application grippers first adsorb the tape pulled out by the tape pulling module and positioned by the tape clamping and positioning module at the open adsorption position. After being cut by the tape cutting module, the adhesive application moving drive component moves the entire assembly to the adhesive application station. Then, the adhesive application flipping drive component drives the two adhesive application grippers to flip to the clamping position, clamping all the conductive high-speed wires while simultaneously applying the tape in a ring-like manner to each conductive high-speed wire, eliminating the need for... By relying on the precise alignment of two sets of adhesive application mechanisms, the structural design avoids the problem of misalignment between the upper and lower adhesive tapes, ensuring that the tape can stably and comprehensively adhere to all conductive high-speed lines. This guarantees the smooth operation of subsequent production processes, improves product quality stability, and significantly reduces equipment costs. There is no need to set up two independent sets of adhesive application mechanisms; the adhesive application operation for all conductive high-speed lines can be completed with just one set of conductive high-speed line adhesive application mechanism of this invention. Furthermore, only one tape feeder is needed for tape winding, eliminating the need for two tape rolls. This effectively reduces equipment manufacturing costs and subsequent maintenance costs, significantly improving production efficiency. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of the conductive high-speed wire adhesive application mechanism of the present invention.

[0011] Figure 2 This is a front view of the conductive high-speed wire adhesive application mechanism of the present invention.

[0012] Figure 3 This is a three-dimensional structural diagram of the adsorption adhesive module of the present invention.

[0013] Figure 4 This is a partial structural diagram of the adsorption adhesive module of the present invention when the adsorption adhesive grippers are in the open adsorption position.

[0014] Figure 5 This is a partial structural diagram of the adhesive adsorption module of the present invention when the adhesive adsorption grippers are in the clamping position.

[0015] Figure 6 yes Figure 5 Enlarged view of point A in the middle.

[0016] Figure 7 This is a three-dimensional structural diagram of the tape-pulling module of the present invention.

[0017] Figure 8 This is a connection structure diagram of the tape clamping and positioning module and the tape straightening module of the present invention.

[0018] Figure 9 This is a three-dimensional structural diagram of the tape straightening module of the present invention.

[0019] Figure 10 This is a three-dimensional structural diagram of the tape cutting module of the present invention before cutting tape.

[0020] Figure 11 This is a three-dimensional structural diagram of the tape cutting module of the present invention when cutting tape. Detailed Implementation

[0021] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0022] Please see Figures 1 to 5This invention provides a conductive high-speed wire adhesive application mechanism 100, including a mounting frame 1, a tape supply tray 2, a tape pulling module 3, a tape clamping and positioning module 4, a tape cutting module 5, and an adsorption and application module 6. The mounting frame 1 is provided with an adhesive application station 11 for applying adhesive to conductive high-speed wires; the tape supply tray 2 is rotatably connected to the mounting frame 1 and is used to supply tape 21 for winding; the tape pulling module 3 is disposed on the mounting frame 1 and is used to pull out the tape 21 from the tape supply tray 2; the tape clamping module 6... Positioning module 4 is mounted on mounting frame 1 and located between tape feeding tray 2 and tape pulling module 3. Tape clamping positioning module 4 is used to clamp and position tape 21. Tape cutting module 5 is mounted on mounting frame 1 and used to cut tape 21 located between tape clamping positioning module 4 and tape pulling module 3. Adhesive adsorption module 6 includes adhesive adsorption moving drive assembly 61, adhesive adsorption flipping drive assembly 62, and adhesive adsorption gripper 63. Adhesive adsorption moving drive assembly 61 is mounted on mounting frame 1, adhesive adsorption flipping drive assembly 62 is mounted on mounting frame 1, and adhesive adsorption flipping drive assembly 63 is used to clamp and position tape 21. Placed on the adhesive application moving drive assembly 61, two adsorption adhesive application claws 63 are symmetrically connected to the adhesive application flipping drive assembly 62. Each adsorption adhesive application claw 63 has a first adsorption hole 631 for adsorbing the adhesive tape 21. The adhesive application flipping drive assembly 62 drives the two adsorption adhesive application claws 63 to flip. The two adsorption adhesive application claws 63 have an open adsorption position 64 located in the same straight line and a clamping position 65 parallel to each other. The two adsorption adhesive application claws 63 adsorb the adhesive tape located in the open adsorption position 64. The tape 21 between the positioning module 4 and the tape pulling module 3 allows the tape cutting module 5 to cut the tape 21. The tape application moving drive component 61 then drives the tape application flipping drive component 62 and the adsorption tape application grippers 63, along with the tape 21, to move to the tape application station 11. This causes the tape application flipping drive component 62 to drive the two adsorption tape application grippers 63 to flip to the clamping position 65, so that the two adsorption tape application grippers 63 clamp all the conductive high-speed wires located at the tape application station 11 and attach the tape 21 to each conductive high-speed wire in a circumferential manner. The conductive high-speed wire tape application mechanism 100 of the present invention, through the coordinated cooperation of various components, achieves circumferential tape application of conductive high-speed wires with a single mechanism, replacing the existing two-set tape application mechanism setup. This reduces equipment costs, avoids the problem of tape adhesion deviation, and ensures tape application stability and reliability.

[0023] Please see Figure 1In one embodiment, the conductive high-speed wire adhesive applicator 100 further includes a tape guide roller assembly 7. The tape guide roller assembly 7 is disposed on the mounting frame 1 and located between the tape supply tray 2 and the tape clamping and positioning module 4. The tape guide roller assembly 7 guides the tape 21 located between the tape supply tray 2 and the tape clamping and positioning module 4. This tape guide roller assembly 7 guides the tape 21 smoothly from the tape supply tray 2 to the tape clamping and positioning module 4, preventing the tape 21 from shifting, wrinkling, or wearing during transmission, thus ensuring smooth tape transmission.

[0024] Specifically, in one embodiment, the tape guide roller assembly 7 includes a guide fixing shaft 71, a guide roller 72, and guide limiting members 73. The guide fixing shaft 71 is fixed on the mounting frame 1. The guide roller 72 is rotatably sleeved on the guide fixing shaft 71 and is used to contact the tape 21 and guide the tape 21. Two guide limiting members 73 are respectively sleeved on the guide fixing shaft 71 and located on both sides of the guide roller 72. The two guide limiting members 73 are used to limit the tape 21 on the guide roller 72. The guide roller 72 reduces the friction between itself and the tape 21 by rotating. The guide limiting members 73 on both sides can limit the front-to-back position of the tape 21 on the guide roller 72, preventing the tape 21 from deviating from the preset transmission path and further improving the accuracy of tape 21 guidance.

[0025] Please see Figure 1 , Figure 2 and Figure 7 In one embodiment, the tape pulling module 3 includes a tape pulling moving drive assembly 31, a gripper opening and closing drive assembly 32, and tape pulling grippers 33. The tape pulling moving drive assembly 31 is disposed on the mounting frame 1, and the gripper opening and closing drive assembly 32 is disposed on the tape pulling moving drive assembly 31. The two tape pulling grippers 33 are symmetrically connected to the gripper opening and closing drive assembly 32. The gripper opening and closing drive assembly 32 is used to drive the two tape pulling grippers 33 to close or open, so that the two tape pulling grippers 33 can grip or release the tape 21. The tape pulling moving drive assembly 31 is used to drive the gripper opening and closing drive assembly 32 together with the tape pulling grippers 33 to move, so that the tape pulling grippers 33 pull the gripped tape 21 from a position close to the tape clamping and positioning module 4 to a position away from the tape clamping and positioning module 4. The gripper opening and closing drive assembly 32 enables flexible opening and closing of the tape gripper 33, ensuring stable gripping and releasing of the tape 21. The tape pulling drive assembly 31 can drive the tape gripper 33 to move linearly, thereby pulling the tape 21 from near the tape clamping and positioning module 4 to a preset length, meeting the tape application length requirements of conductive high-speed lines of different specifications, and providing a suitable length of tape 21 for subsequent cutting processes.

[0026] Specifically, in one embodiment, the tape-pulling drive assembly 31 includes a tape-pulling rotary motor 311, a tape-pulling drive wheel 312, a tape-pulling driven wheel 313, and a tape-pulling synchronous transmission member 314. The tape-pulling rotary motor 311 is mounted on the mounting frame 1. The tape-pulling drive wheel 312 and the tape-pulling driven wheel 313 are rotatably connected to the mounting frame 1 at intervals. The tape-pulling synchronous transmission member 314 is wound around the tape-pulling drive wheel 312 and the tape-pulling driven wheel 313. The gripper opening and closing drive assembly 32 is connected to the tape-pulling synchronous transmission member 314 and is slidably mounted on the mounting frame 1. The tape-pulling drive wheel 312 is driven to rotate by the tape-pulling rotary motor 311, so that the gripper opening and closing drive assembly 32 can slide through the tape-pulling synchronous transmission member 314 under the cooperative action of the tape-pulling driven wheel 313. Among them, the tape-pulling rotary motor 311 can realize forward and reverse rotation control, which makes it easy for the tape-pulling gripper 33 to reset after completing the tape-pulling action, thereby improving the cyclic operation efficiency of the equipment.

[0027] Specifically, in one embodiment, the gripper opening and closing drive assembly 32 includes a gripper opening and closing sliding member 321 and a gripper cylinder 322. The mounting bracket 1 is provided with a first slide rail 12. The gripper opening and closing sliding member 321 is slidably disposed on the first slide rail 12 and is fixedly connected to the tape pulling synchronous transmission member 314. The gripper cylinder 322 is disposed on the gripper opening and closing sliding member 321. Two tape pulling grippers 33 are symmetrically connected to the gripper cylinder 322. The gripper cylinder 322 is used to drive the two tape pulling grippers 33 to close or open.

[0028] Please see Figure 1 and Figure 8 In one embodiment, the tape clamping and positioning module 4 includes a tape clamping and positioning block 41 and a tape pressing assembly 42. The tape clamping and positioning block 41 is fixed on the mounting frame 1. The tape clamping and positioning block 41 is provided with a positioning groove 411 through which the tape 21 passes. One of the inner surfaces of the positioning groove 411 is a tape positioning surface 411a. The tape clamping and positioning block 41 is provided with a second adsorption hole 412 on the tape positioning surface 411a for adsorbing the tape 21. The tape pressing assembly 42 is disposed on the tape clamping and positioning block 41. The tape pressing assembly 42 is used to pass through the positioning groove 411 and press and position the tape 21 on the tape positioning surface 411a. The positioning groove 411 provides a preset path for the tape 21 to pass through. The tape positioning surface 411a is used to define the bonding reference of the tape 21. The second adsorption hole 412 can adsorb the tape 21 through negative pressure. With the pressing action of the tape pressing component 42, the tape 21 is positioned in a dual manner, ensuring that the tape 21 is fixed in position during the cutting process and avoiding displacement. This provides a guarantee for the subsequent adsorption and application module 6 to accurately adsorb the tape 21.

[0029] Specifically, in one embodiment, the tape clamping assembly 42 includes a tape clamping and moving drive mechanism 421 and a tape clamping block 422. The tape clamping and moving drive mechanism 421 is disposed on the tape clamping and positioning block 41, and the tape clamping block 422 is disposed in the positioning groove 411. The output end of the tape clamping and moving drive mechanism 421 passes through the tape clamping and positioning block 41 and is connected to the tape clamping block 422. The tape clamping and moving drive mechanism 421 is used to drive the tape clamping block 422 to move, so that the tape clamping block 422 clamps and positions the tape 21 on the tape positioning surface 411a or releases the tape 21. The tape clamping and moving drive mechanism 421 can realize the linear movement of the tape clamping block 422. The tape clamping block 422 cooperates with the tape positioning surface 411a to tightly clamp the tape 21, ensuring the stability of the tape 21's positioning. At the same time, it can quickly reset when the tape 21 needs to be released, without affecting the normal transmission of the tape 21.

[0030] Specifically, in one embodiment, the tape clamp 422 has a plurality of teeth 422a protruding from its side for pressing the tape 21. The teeth 422a can increase the friction between the tape clamp 422 and the tape 21, further improving the pressing effect and preventing the tape 21 from slipping under the pressed state. At the same time, the teeth 422a can avoid causing large-area damage to the surface of the tape 21, protecting the adhesive side of the tape 21 and ensuring that the tape 21 can be tightly adhered to the conductive high-speed line when applying adhesive later.

[0031] Please see Figure 1 , Figure 8 and Figure 9 In one embodiment, the conductive high-speed wire adhesive applicator 100 further includes a tape straightening module 8. The tape straightening module 8 is disposed on the mounting frame 1 and movably inserted through the tape clamping and positioning block 41. By moving the tape straightening module 8 along the direction in which the tape 21 exits the positioning groove 411, the tape 21 exiting the positioning groove 411 is straightened, so that the tape pulling module 3 can clamp the tape 21. The tape straightening module 8 can eliminate problems such as lifting and bending that may occur when the tape 21 exits the positioning groove 411, straightening the tape 21 flat and ensuring that the tape pulling module 3 can accurately clamp the tape 21, avoiding clamping deviation caused by the bending of the tape 21, which would affect subsequent tape pulling, cutting and adhesive application processes.

[0032] Specifically, in one embodiment, the tape straightening module 8 includes a tape straightening movement drive assembly 81 and a tape straightening block 82. The two tape straightening blocks 82 are symmetrically arranged and linearly movable on the tape clamping positioning block 41. Each of the two tape straightening blocks 82 has a tape straightening limiting groove 821 on its opposite side for limiting the tape 21. The tape straightening limiting groove 821 is connected to the positioning groove 411. The tape straightening movement drive assembly 81 is mounted on the mounting frame 1. The output end of the tape straightening movement drive assembly 81 is connected to the tape straightening block 82. The tape straightening movement drive assembly 81 is used to drive the tape straightening block 82 to move linearly along the direction in which the tape 21 passes through the positioning groove 411, so that the tape straightening block 82 straightens the tape 21 through the tape straightening limiting groove 821. Two symmetrically arranged tape straightening blocks 82, together with tape straightening limiting grooves 821, can limit and straighten the tape 21 from both sides, ensuring that the tape 21 is flat and without deviation. The tape straightening moving drive component 81 can precisely control the moving distance and speed of the tape straightening blocks 82, adapting to the straightening needs of tapes 21 of different lengths and widths, and improving the straightening effect.

[0033] Specifically, in one embodiment, the tape cutting module 5 is located below the tape clamping and positioning module 4, and the tape pulling module 3 is located below the tape cutting module 5; the upper end of the tape straightening block 82 is connected to the tape straightening moving drive assembly 81, the lower end of the tape straightening block 82 passes through the tape clamping and positioning block 41 and is inserted into the positioning groove 411, and the tape straightening limiting groove 821 is arranged on the lower end of the tape straightening block 82, and the tape of the two tape straightening blocks 82... The straightening limiting groove 821 can limit the tape 21 to the tape positioning surface 411a. After the adsorption and adhesive application module 6 completes the application of the cut tape 21 to the conductive high-speed line and resets it, the tape straightening moving drive component 81 drives the two tape straightening blocks 82 to move down, thereby straightening the tape 21 that extends below the positioning groove 411, so that the tape pulling module 3 can rise and clamp the tape 21, thereby causing the tape pulling module 3 to pull the tape 21 down.

[0034] Specifically, in one embodiment, the tape straightening and moving drive assembly 81 includes a straightening drive cylinder 811, a first straightening connecting block 812, a straightening swing rod 813, and a second straightening connecting block 814. The straightening drive cylinder 811 is mounted on the mounting frame 1, and its output end is connected to the first straightening connecting block 812. The middle part of the straightening swing rod 813 is rotatably connected to the mounting frame 1, and one end of the straightening swing rod 813 is provided with a first movable groove 813a. The straightening swing rod 813 is sleeved on the first straightening connecting block 814 through the first movable groove 813a. On the connecting block 812, the other end of the straightening lever 813 is provided with a second movable groove 813b. The straightening lever 813 is sleeved on the second straightening connecting block 814 through the second movable groove 813b. The two tape straightening blocks 82 are respectively fixedly connected to the second straightening connecting block 814. The straightening drive cylinder 811 drives the first straightening connecting block 812 to move linearly, so that the first straightening connecting block 812 pushes the straightening lever 813 to rotate, so that the straightening lever 813 drives the second straightening connecting block 814 and the two tape straightening blocks 82 to move linearly together.

[0035] Please see Figure 1 , Figure 10 and Figure 11 In one embodiment, the tape cutting module 5 includes a tape cutting and flipping drive assembly 51, a first cutting assembly 52, and a second cutting assembly 53. The tape cutting and flipping drive assembly 51 is mounted on the mounting frame 1. The first cutting assembly 52 and the second cutting assembly 53 are respectively connected to the tape cutting and flipping drive assembly 51. The tape cutting and flipping drive assembly 51 is used to drive the first cutting assembly 52 and the second cutting assembly 53 to flip in a direction that moves closer to or further away from each other, so as to cut or loosen the tape 21. The tape cutting and flipping drive assembly 51 can be an existing flipping drive cylinder. One of the first cutting assembly 52 and the second cutting assembly 53 adopts a cutting blade structure, while the other of the first cutting assembly 52 and the second cutting assembly 53 adopts a cutting table structure that cooperates with the cutting blade structure, but it is not limited thereto.

[0036] Please see Figure 1 and Figure 3 In one embodiment, the adhesive application moving drive assembly 61 includes an adhesive application rotation drive mechanism 611, an adhesive application screw 612, an adhesive application nut 613, and an adhesive application slider 614. The adhesive application rotation drive mechanism 611 is mounted on the mounting frame 1. The adhesive application screw 612 is rotatably connected to the mounting frame 1. The output end of the adhesive application rotation drive mechanism 611 is connected to the adhesive application screw 612. The adhesive application rotation drive mechanism 611 is used to drive the adhesive application screw 612 to rotate. The adhesive application nut 613 is sleeved on the adhesive application screw 612 and threadedly engaged with the adhesive application screw 612. The adhesive application slider 614 is slidably mounted on the mounting frame 1 and is fixedly connected to the adhesive application nut 613. The adhesive application flip drive assembly 62 is mounted on the adhesive application slider 614.

[0037] Specifically, in one embodiment, the adhesive application rotation drive mechanism 611 includes an adhesive application rotary motor 611a, an adhesive application drive wheel 611b, an adhesive application driven wheel 611c, and an adhesive application synchronous transmission member 611d. The adhesive application rotary motor 611a is mounted on the mounting bracket 1. The adhesive application drive wheel 611b is fixedly connected to the output end of the adhesive application rotary motor 611a. The adhesive application rotary motor 611a is used to drive the adhesive application drive wheel 611b to rotate. The adhesive application driven wheel 611c is fixedly connected to the adhesive application screw member 612. The adhesive application synchronous transmission member 611d is wound around the adhesive application drive wheel 611b and the adhesive application driven wheel 611c.

[0038] Specifically, in one embodiment, the mounting bracket 1 is provided with a second slide rail 13, and the adhesive application slider 614 is slidably mounted on the second slide rail 13. The second slide rail 13 provides stable sliding support for the adhesive application slider 614, reduces the friction during the movement of the adhesive application slider 614, and ensures that it slides smoothly without jamming.

[0039] Please see Figures 3 to 6 In one embodiment, the adhesive application flipping drive assembly 62 includes an adhesive application flipping fixing member 621, an adhesive application telescopic drive cylinder 622, and an adhesive application pushing member 623. The adhesive application flipping fixing member 621 is disposed on the adhesive application moving drive assembly 61, the adhesive application telescopic drive cylinder 622 is disposed on the adhesive application flipping fixing member 621, and the adhesive application pushing member 623 is linearly movable and passes through the adhesive application flipping fixing member 621. The output end of the adhesive application telescopic drive cylinder 622 is connected to the adhesive application pushing member 623. Next, two adhesive-adhesive grippers 63 are symmetrically rotatably connected to the adhesive-adhesive flipping fixing component 621. Each adhesive-adhesive gripper 63 has a sliding groove 632, and the adhesive-adhesive pushing component 623 has sliding pins 623a that are respectively inserted into the sliding grooves 632 of the two adhesive-adhesive grippers 63. The adhesive-adhesive pushing component 623 is driven to move linearly by the adhesive-adhesive telescopic drive cylinder 622, causing the adhesive-adhesive pushing component 623 to drive the two adhesive-adhesive grippers 63 to flip via the sliding pins 623a. The adhesive-adhesive flipping drive component 62 adopts the principle of converting linear motion into flipping motion. It has a simple structure and reliable operation, effectively controlling the flipping angle of the adhesive-adhesive grippers 63, ensuring that the two adhesive-adhesive grippers 63 can switch between the open adhesion position 64 and the clamping position 65, achieving precise adhesion of the tape 21 and stable clamping and application of the conductive high-speed line.

[0040] Please see Figure 1In one embodiment, the conductive high-speed wire adhesive application mechanism 100 further includes adhesive application clamping and positioning modules 9. Two adhesive application clamping and positioning modules 9 are symmetrically arranged on the mounting frame 1, and there is a positioning space between the two adhesive application clamping and positioning modules 9 for the conductive high-speed wire to pass through. The two adhesive application clamping and positioning modules 9 are used to clamp and position the conductive high-speed wire located in the positioning space, so as to facilitate the adhesive application module 6 to apply adhesive to the conductive high-speed wire. The adhesive application clamping and positioning modules 9 can accurately clamp and position the conductive high-speed wire, ensuring that the conductive high-speed wire is fixed in position during the adhesive application process, avoiding displacement and shaking, thereby ensuring that the tape 21 can be evenly and tightly attached to each conductive high-speed wire, improving the adhesive application quality, and at the same time providing a stable positioning reference for the clamping action of the adhesive application claw 63.

[0041] Specifically, in one embodiment, the adhesive clamping and positioning module 9 includes an adhesive clamping drive cylinder 91 and an adhesive clamping block 92. The adhesive clamping drive cylinder 91 is disposed on the mounting bracket 1, and the output end of the adhesive clamping drive cylinder 91 is connected to the adhesive clamping block 92. The adhesive clamping drive cylinder 91 is used to drive the adhesive clamping block 92 to move, so that the adhesive clamping block 92 clamps the conductive high-speed wire.

[0042] Please see Figures 1 to 11 The working principle of the conductive high-speed wire adhesive applicator 100 of the present invention is as follows: First, the tape 21 roll is wound onto the tape feed tray 2. After being guided by the tape guide roller assembly 7, the tape 21 passes through the positioning groove 411 of the tape clamping positioning block 41. The tape pulling drive assembly 31 drives the jaw opening and closing drive assembly 32, together with the tape pulling jaws 33, to move upward to a position close to the tape clamping positioning block 41. The jaw opening and closing drive assembly 32 of the tape pulling module 3 drives the two tape pulling jaws 33 to retract and clamp the tape 21. The tape pulling drive assembly 31 then drives the jaw opening and closing drive assembly 32, together with the tape pulling jaws 33, to move downward, removing the tape 21 from the tape clamping positioning module. The tape 21 is pulled out to the preset length at four points; then, the tape clamping and moving drive mechanism 421 of the tape clamping and positioning module 4 drives the tape clamping block 422 to move, pressing and positioning the tape 21 on the tape positioning surface 411a. At the same time, the second suction hole 412 on the tape positioning surface 411a generates negative pressure to suction the tape 21, achieving dual positioning of the tape 21; the adhesive application moving drive assembly 61 drives the adhesive application flipping drive assembly 62 and the suction adhesive application claw 63 to move, and the two suction adhesive application claws 63 of the suction adhesive application module 6 are in the open suction position 64, suctioning the tape 21 through the first suction hole 631; after that, the tape cutting module 5 cuts the tape... The cutting and flipping drive assembly 51 drives the first cutting assembly 52 and the second cutting assembly 53 to move closer and flip together, cutting the tape 21 located between the tape clamping and positioning module 4 and the tape pulling module 3. After cutting, the adhesive application moving drive assembly 61 drives the adhesive application flipping drive assembly 62 and the adsorption adhesive application gripper 63 to move together with the tape 21 to the adhesive application station 11. At this time, the adhesive application clamping driving cylinder 91 of the adhesive application clamping and positioning module 9 drives the adhesive application clamping block 92 to move, clamping and positioning all the conductive high-speed wires located in the positioning space. Finally, the adhesive application telescopic drive cylinder 622 of the adhesive application flipping drive assembly 62 drives the adhesive application... The adhesive pusher 623 moves linearly, driving the two adsorption adhesive clamps 63 to flip to the clamping position 65 via the sliding pin 623a. While clamping all the conductive high-speed wires, the adsorbed adhesive tape 21 is attached to each conductive high-speed wire in a ring shape, completing one adhesive application action. After the adhesive application is completed, each module resets in sequence. The adhesive tape straightening moving drive component 81 of the adhesive tape straightening module 8 drives the two adhesive tape straightening blocks 82 to move down. The adhesive tape 21 extending from the positioning groove 411 is straightened through the adhesive tape straightening limiting groove 821, making it easier for the subsequent adhesive tape pulling module 3 to clamp and prepare for the next adhesive application cycle, realizing continuous and efficient adhesive application of conductive high-speed wires.

[0043] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A conductive high-speed wire adhesive application mechanism, characterized in that, include: Mounting frame, the mounting frame is provided with an adhesive application station for applying adhesive to conductive high-speed lines; A tape feeder is rotatably connected to the mounting frame and is used for feeding tape for winding. A tape pulling module is provided on the mounting frame and is used to pull out the tape from the tape supply tray. A tape clamping and positioning module is provided on the mounting frame and located between the tape supply tray and the tape pulling module. The tape clamping and positioning module is used to clamp and position the tape. A tape cutting module, which is disposed on the mounting frame and used to cut the tape located between the tape clamping and positioning module and the tape pulling module; An adhesive application module is provided, comprising an adhesive application movement drive assembly, an adhesive application flipping drive assembly, and adhesive application grippers. The adhesive application movement drive assembly is mounted on a mounting bracket, and the adhesive application flipping drive assembly is mounted on the adhesive application movement drive assembly. Two adhesive application grippers are symmetrically connected to the adhesive application flipping drive assembly. Each adhesive application gripper has a first adsorption hole for adsorbing the adhesive tape. The adhesive application flipping drive assembly drives the two adhesive application grippers to flip. The two adhesive application grippers have an open adsorption position located in a straight line and are parallel to each other. The clamping position; by means of the two adsorption adhesive grippers adsorbing the tape located between the tape clamping positioning module and the tape pulling module at the open adsorption position, the adhesive application moving drive component drives the adhesive application flipping drive component and the adsorption adhesive grippers together with the cut tape to the adhesive application station, thereby causing the adhesive application flipping drive component to drive the two adsorption adhesive grippers to flip to the clamping position, so that the two adsorption adhesive grippers clamp all the conductive high-speed lines located at the adhesive application station and attach the tape to each conductive high-speed line in a wrapping manner.

2. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, The tape-pulling module includes a tape-pulling movement drive assembly, a gripper opening and closing drive assembly, and tape-pulling grippers. The tape-pulling movement drive assembly is mounted on the mounting frame, and the gripper opening and closing drive assembly is mounted on the tape-pulling movement drive assembly. Two tape-pulling grippers are symmetrically connected to the gripper opening and closing drive assembly. The gripper opening and closing drive assembly drives the two tape-pulling grippers to close or open, so that the two tape-pulling grippers can clamp or release the tape. The tape-pulling movement drive assembly drives the gripper opening and closing drive assembly together with the tape-pulling grippers to move, so that the tape-pulling grippers pull the clamped tape from a position close to the tape clamping and positioning module to a position away from the tape clamping and positioning module.

3. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, The tape clamping and positioning module includes a tape clamping and positioning block and a tape pressing assembly. The tape clamping and positioning block is fixed on the mounting frame. The tape clamping and positioning block has a positioning groove for the tape to pass through. One inner side of the positioning groove is a tape positioning surface. The tape clamping and positioning block has a second suction hole on the tape positioning surface for adsorbing the tape. The tape pressing assembly is disposed on the tape clamping and positioning block. The tape pressing assembly is used to pass through the positioning groove and press and position the tape on the tape positioning surface.

4. The conductive high-speed wire adhesive application mechanism according to claim 3, characterized in that, It also includes a tape straightening module, which is disposed on the mounting frame and movably inserted into the tape clamping and positioning block. By moving the tape straightening module along the direction in which the tape passes through the positioning groove, the tape passing through the positioning groove is straightened so that the tape pulling module can clamp the tape.

5. The conductive high-speed wire adhesive application mechanism according to claim 4, characterized in that, The tape straightening module includes a tape straightening movement drive assembly and tape straightening blocks. Two tape straightening blocks are symmetrically arranged and linearly movable on the tape clamping and positioning block. Each of the two tape straightening blocks has a tape straightening limiting groove on its opposite side for limiting the tape. The tape straightening limiting groove is connected to the positioning groove. The tape straightening movement drive assembly is mounted on the mounting frame. The output end of the tape straightening movement drive assembly is connected to the tape straightening block. The tape straightening movement drive assembly drives the tape straightening block to move linearly along the direction in which the tape passes through the positioning groove, so that the tape straightening block straightens the tape through the tape straightening limiting groove.

6. The conductive high-speed wire adhesive application mechanism according to claim 5, characterized in that, The tape straightening and moving drive assembly includes a straightening drive cylinder, a first straightening connecting block, a straightening swing rod, and a second straightening connecting block. The straightening drive cylinder is mounted on the mounting frame, and its output end is connected to the first straightening connecting block. The middle part of the straightening swing rod is rotatably connected to the mounting frame, and one end of the straightening swing rod is provided with a first movable groove. The straightening swing rod is sleeved on the first straightening connecting block through the first movable groove. The other end of the straightening lever is provided with a second movable groove. The straightening lever is sleeved on the second straightening connecting block through the second movable groove. The two tape straightening blocks are respectively fixedly connected to the second straightening connecting block. The first straightening connecting block is driven to move linearly by the straightening drive cylinder, so that the first straightening connecting block pushes the straightening lever to rotate, so that the straightening lever drives the second straightening connecting block and the two tape straightening blocks to move linearly together.

7. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, The tape cutting module includes a tape cutting and flipping drive assembly, a first cutting assembly, and a second cutting assembly. The tape cutting and flipping drive assembly is disposed on the mounting frame. The first cutting assembly and the second cutting assembly are respectively connected to the tape cutting and flipping drive assembly. The tape cutting and flipping drive assembly is used to drive the first cutting assembly and the second cutting assembly to flip in a direction that moves closer to or further away from each other in order to cut or loosen the tape.

8. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, The adhesive application moving drive assembly includes an adhesive application rotation drive mechanism, an adhesive application screw, an adhesive application nut, and an adhesive application slider. The adhesive application rotation drive mechanism is mounted on the mounting frame. The adhesive application screw is rotatably connected to the mounting frame. The output end of the adhesive application rotation drive mechanism is connected to the adhesive application screw. The adhesive application rotation drive mechanism drives the adhesive application screw to rotate. The adhesive application nut is sleeved on the adhesive application screw and threadedly engaged with it. The adhesive application slider is slidably mounted on the mounting frame and fixedly connected to the adhesive application nut. The adhesive application flipping drive assembly is mounted on the adhesive application slider.

9. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, The adhesive application flipping drive assembly includes an adhesive application flipping fixing component, an adhesive application telescopic drive cylinder, and an adhesive application pushing component. The adhesive application flipping fixing component is disposed on the adhesive application moving drive assembly, the adhesive application telescopic drive cylinder is disposed on the adhesive application flipping fixing component, and the adhesive application pushing component is linearly movable and passes through the adhesive application flipping fixing component. The output end of the adhesive application telescopic drive cylinder is connected to the adhesive application pushing component. The two adsorption adhesive application claws are symmetrically rotatably connected to the adhesive application flipping fixing component. The adsorption adhesive application claws are provided with sliding slots, and the adhesive application pushing component is provided with sliding pins that are respectively inserted into the sliding slots of the two adsorption adhesive application claws. The adhesive application telescopic drive cylinder drives the adhesive application pushing component to move linearly, so that the adhesive application pushing component drives the two adsorption adhesive application claws to flip through the sliding pins.

10. The conductive high-speed wire adhesive application mechanism according to claim 1, characterized in that, It also includes an adhesive clamping and positioning module. Two adhesive clamping and positioning modules are symmetrically arranged on the mounting frame. There is a positioning space between the two adhesive clamping and positioning modules for the conductive high-speed line to pass through. The two adhesive clamping and positioning modules are used to clamp and position the conductive high-speed line located in the positioning space, so that the adhesive adsorption module can apply adhesive to the conductive high-speed line.

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