A chip packaging structure and a packaging method based on a silicon-based micro-bridge structure

Abstract

The application relates to the technical field of chip packaging structure, in particular to a chip packaging structure based on a silicon-based micro-bridge structure and a packaging method, a containing cavity is arranged in a packaging substrate, a heat dissipation copper pipe is installed in the containing cavity, and a first heat dissipation hole is arranged on the side wall of the heat dissipation copper pipe; in order to avoid external impurities from entering the inner cavity of the packaging substrate from the port of the heat dissipation copper pipe, end structures are arranged at the two ends of the heat dissipation copper pipe, the external impurities are prevented from entering the heat dissipation copper pipe, and the heat dissipation and cooling of the packaging substrate are guaranteed; a connecting fitting is installed in the penetrating groove of the packaging cover, a connecting copper pipe body is inserted into the penetrating groove, and a heat dissipation and cooling effect is provided for the packaging cover; the connecting copper pipe body and the heat dissipation copper pipe are used in cooperation, the heat dissipation and cooling effect of the chip packaging structure is provided, and the stability of the packaging of the packaging substrate and the packaging cover is further improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging structure technology, and in particular to a chip packaging structure and packaging method based on silicon-based microbridge structure. Background Technology

[0002] Chip packaging structure is the bridge connecting the chip to external circuits, directly affecting performance and reliability. Among them, chip packaging based on silicon microbridge structure is an advanced packaging technology that achieves high-density interconnection through small silicon bridges. It is particularly suitable for scenarios with high bandwidth and integration requirements, such as high-performance computing (HPC) and AI chips. It involves embedding small silicon wafers with multiple redistribution layers (RDL) in an organic interposer or substrate, and achieving high-density interconnection between chips through submicron level interconnection.

[0003] Among them, the silicon-based microbridge structure is a classic design for MEMS thermistors (such as thermopile infrared sensors and thermal flow / gas sensors); the "performance-robustness" contradiction: pursuing high sensitivity requires the microbridge to be thinner and longer (better thermal isolation), but this will sacrifice mechanical strength and make it prone to failure during manufacturing or use.

[0004] Therefore, silicon-based microbridge structures are generally integrated with packaging substrates into hybrid packages. However, silicon-based microbridge structures also generate heat during operation, which increases the heat of the chip's packaging substrate and cover plate. Furthermore, the lack of good heat dissipation between the packaging substrate and cover plate can affect chip performance.

[0005] To address these issues, this invention proposes a chip packaging structure and method based on a silicon-based microbridge structure. Summary of the Invention

[0006] The purpose of this invention is to provide a chip packaging structure and packaging method based on silicon-based microbridge structure to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a chip packaging structure based on a silicon-based microbridge structure, comprising a packaging substrate and a packaging cover, and a chip body disposed in the middle of the packaging substrate, with pins disposed on the side of the packaging substrate; A receiving cavity is symmetrically arranged in the packaging substrate, and a communicating groove is provided on the top of the packaging substrate, which is connected to the receiving cavity. The encapsulation cover also has symmetrical through slots; An auxiliary component is provided in the cavity, which provides an auxiliary heat dissipation function for the packaging substrate; A connecting accessory is provided in the through groove, which provides an auxiliary heat dissipation function for the encapsulation cover; This connecting accessory, used in conjunction with auxiliary components, enhances the stability of the connection between the packaging substrate and the packaging cover.

[0008] Preferably, the auxiliary component includes a heat dissipation copper pipe that is inserted into the receiving cavity; Positioning clips are symmetrically fixed at both ends of the heat dissipation copper pipe. These positioning clips are used to connect the end structure.

[0009] Preferably, the opening of the heat dissipation copper pipe is square, and a heat dissipation copper pipe is disposed in the receiving cavity, with the length of the heat dissipation copper pipe and the receiving cavity being equal.

[0010] Preferably, first heat dissipation holes are evenly arranged on the side wall of the heat dissipation copper pipe; A circular groove is provided on one side of the middle section of the heat dissipation copper pipe, and a connecting screw groove is provided on the inner side wall of the heat dissipation copper pipe at a position corresponding to the circular groove.

[0011] Preferably, the end structure includes a connector; Limiting slots are provided on both sides of the connector, and these limiting slots are adapted to and engaged with the positioning pins at the ends of the heat dissipation copper pipes; Ventilation slots are also provided at equal intervals in the connecting body, and connecting holes are uniformly provided in the sidewalls between adjacent ventilation slots.

[0012] Preferably, the end structure further includes a first auxiliary copper sheet welded to one end of the connector and a second auxiliary copper sheet welded to the other end of the connector.

[0013] Preferably, first sidewall grooves are symmetrically arranged on both sides of the first auxiliary copper sheet, and first auxiliary mesh holes are uniformly arranged in the first auxiliary copper sheet; The second auxiliary copper sheet is provided with symmetrical second sidewall grooves on both sides, and the second auxiliary copper sheet is provided with uniform second auxiliary mesh holes. The first sidewall groove, the second sidewall groove, and the limiting groove have the same groove shape; The connector has three sets of ventilation slots, and the first auxiliary mesh on the first auxiliary copper sheet is aligned with the ventilation slot in the middle position. The second auxiliary mesh, located on the second auxiliary copper sheet, is aligned with the two ventilation slots on the side.

[0014] Preferably, the connecting fitting includes a connecting copper tube body; The connecting copper tube is inserted into a through slot in the encapsulation cover; A sidewall thread is provided on the outer side wall of the bottom end of the connecting copper tube body. This sidewall thread is adapted to the connecting screw groove on the inner side of the heat dissipation copper tube for threaded connection.

[0015] Preferably, a second heat dissipation hole is evenly provided on the side wall of the connecting copper tube body, and a tightening head is fixedly provided at the top of the connecting copper tube body; The tightening head is also provided with a connecting cavity that communicates with the connecting copper tube body, and a frustum-shaped end cap is welded and fixed at the top opening of the connecting cavity. The frustum-shaped head is hollow, and a third auxiliary mesh is evenly distributed on its side wall.

[0016] A packaging method for a chip packaging structure based on a silicon-based microbridge structure, the packaging method being described above. S1: Insert the heat dissipation copper pipe into the receiving cavity in the packaging substrate, and align the pipe opening with the side wall of the packaging substrate. S2: Then, attach the end structure to the positioning clip at the end of the heat dissipation copper pipe, and then weld the end structure to fix it. S3: Align the package cover with the package substrate and press them together; S4: Insert the connecting copper tube into the through slot on the encapsulation cover, so that the bottom end of the connecting copper tube enters the heat dissipation copper tube. Then rotate the connecting copper tube so that the side wall thread of its bottom side wall is threadedly connected to the connecting screw slot. Tighten the connecting copper tube and make the tightening head press against the encapsulation cover.

[0017] Compared with the prior art, the beneficial effects of the present invention are: The chip packaging structure based on silicon-based microbridge structure designed in this invention includes symmetrically arranged receiving cavities in the packaging substrate and a communicating groove on the top of the packaging substrate, which communicates with the receiving cavities; symmetrically arranged through grooves in the packaging cover; auxiliary components in the receiving cavities that provide auxiliary heat dissipation for the packaging substrate; and connecting accessories in the through grooves that provide auxiliary heat dissipation for the packaging cover. This solution includes a receiving cavity in the packaging substrate and a heat dissipation copper pipe installed in the receiving cavity. The heat dissipation copper pipe provides auxiliary heat dissipation for the packaging substrate, and a first heat dissipation hole is also provided on the side wall of the heat dissipation copper pipe. Since the two ends of the heat dissipation copper pipe are not sealed, the first heat dissipation hole works in conjunction with the heat dissipation copper pipe to improve the heat dissipation and cooling effect of the packaging substrate. In order to prevent external impurities from entering the inner cavity of the packaging substrate from the port of the heat dissipation copper pipe, this solution also provides end structures at both ends of the heat dissipation copper pipe. While preventing external impurities from entering the heat dissipation copper pipe, it can also ensure the heat dissipation and cooling of the packaging substrate. Based on this, the solution also installs connecting accessories in the through groove of the package cover, that is, the connecting copper tube is inserted into the through groove to provide a heat dissipation and cooling effect for the package cover. In addition, the connecting copper tube and the heat dissipation copper tube are used together to provide heat dissipation and cooling effect for the chip package structure, while also further improving the stability of the package substrate and the package cover, so as to ensure the performance of the chip package structure. Attached Figure Description

[0018] Figure 1 This is an exploded view of the packaging structure of the present invention. Figure 2 This is a schematic diagram of the heat dissipation copper pipe structure connection of the present invention; Figure 3 for Figure 2 Enlarged schematic diagram of the structural connection at point A; Figure 4 This is a partial cross-sectional view of the heat dissipation copper pipe structure connection of the present invention; Figure 5 for Figure 4 Enlarged schematic diagram of the structural connection at point B; Figure 6 This is a schematic diagram of the end structure of the present invention connected to the front side before the explosion; Figure 7 This is a schematic diagram of the end structure of the present invention connected to the exploded back side; Figure 8 This is a schematic diagram of the connection structure of the copper tube body in this invention; Figure 9 This is a partial cross-sectional view of the connection between the copper tube body and the tightening head structure of the present invention; Figure 10 for Figure 9 Enlarged schematic diagram of the structural connection at point C.

[0019] In the figure: 1. Packaging substrate, 11. Connecting groove, 12. Receiving cavity, 2. Pin, 3. Chip body, 4. Packaging cover, 41. Through groove, 501. Heat dissipation copper pipe, 502. Positioning pin, 503. First heat dissipation hole, 504. 505. Connecting screw groove, 601. Limiting groove, 603. Ventilation groove, 604. First auxiliary copper sheet, 605. First side wall groove, 606. First auxiliary mesh, 607. Second auxiliary copper sheet, 608. Second side wall groove, 609. Second auxiliary mesh, 610. Connecting copper pipe, 701. Side wall thread, 702. Second heat dissipation hole, 703. Tightening head, 704. Connecting cavity, 705. Frustum-shaped end cap, 706. Third auxiliary mesh, 707. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below. All other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1-10 A chip packaging structure based on silicon-based microbridge structure includes a packaging substrate 1 and a packaging cover 4, and a chip body 3 disposed in the middle of the packaging substrate 1, with pins 2 disposed on the side of the packaging substrate 1. The encapsulation substrate 1 has symmetrically arranged receiving cavities 12, and a communicating groove 11 is provided on the top of the encapsulation substrate 1, which is connected to the receiving cavity 12; the encapsulation cover 4 also has symmetrically arranged through grooves 41. An auxiliary component is provided in the receiving cavity 12, which provides an auxiliary heat dissipation function for the packaging substrate 1; a connecting accessory is provided in the through groove 41, which provides an auxiliary heat dissipation function for the packaging cover 4. The connecting accessories and auxiliary components here are used together to improve the stability of the connection between the packaging substrate 1 and the packaging cover 4.

[0022] According to the appendix Figure 1 -Appendix Figure 5 As shown, this solution provides a receiving cavity 12 in the packaging substrate 1 and installs a heat dissipation copper pipe 501 in the receiving cavity 12. The heat dissipation copper pipe 501 provides an auxiliary function for heat dissipation of the packaging substrate 1. A first heat dissipation hole 503 is also provided on the side wall of the heat dissipation copper pipe 501. Since the two ends of the heat dissipation copper pipe 501 are not sealed, the first heat dissipation hole 503 is used in conjunction with the heat dissipation copper pipe 501 to improve the heat dissipation and cooling effect of the packaging substrate 1. According to the appendix Figure 6 -Appendix Figure 7 As shown, in order to prevent external impurities from entering the inner cavity of the packaging substrate 1 from the port of the heat dissipation copper pipe 501, this solution also provides end structures at both ends of the heat dissipation copper pipe 501. While preventing external impurities from entering the heat dissipation copper pipe 501, it can also ensure the heat dissipation and cooling of the packaging substrate 1.

[0023] Combined with appendix Figure 1 and appendix Figure 8 -Appendix Figure 10As shown, a connecting accessory is installed in the through groove 41 of the package cover 4, that is, the connecting copper tube 701 is inserted into the through groove 41 to provide a heat dissipation and cooling effect for the package cover 4; on this basis, the connecting copper tube 701 and the heat dissipation copper tube 501 are used together to provide heat dissipation and cooling effect for the chip package structure, and at the same time, they can further improve the stability of the package substrate 1 and the package cover 4 to ensure the use effect of the chip package structure.

[0024] Combined with the appendix Figure 1 -Appendix Figure 7 As shown, the auxiliary component includes a heat dissipation copper pipe 501 that is inserted into the receiving cavity 12; positioning clips 502 are symmetrically fixed at both ends of the heat dissipation copper pipe 501, and the positioning clips 502 are used to connect the end structure; the opening of the heat dissipation copper pipe 501 is square, and a heat dissipation copper pipe 501 is provided in the receiving cavity 12, and the length of the heat dissipation copper pipe 501 and the receiving cavity 12 are equal; first heat dissipation holes 503 are uniformly provided on the side wall of the heat dissipation copper pipe 501.

[0025] That is, the heat dissipation copper pipe 501 is inserted into the receiving cavity 12 in the packaging substrate 1, and the pipe opening of the heat dissipation copper pipe 501 is aligned with the side wall of the packaging substrate 1; then the end structure is clipped onto the positioning clip 502 at the end of the heat dissipation copper pipe 501, and then the end structure is welded and fixed.

[0026] From the appendix Figure 6 -Appendix Figure 7 As can be seen from the content shown, before welding and fixing the end structure to both ends of the heat dissipation copper pipe 501, it is necessary to splice and fix the connector 601, the first auxiliary copper sheet 605, and the second auxiliary copper sheet 608.

[0027] The end structure includes a connector 601; it also includes a first auxiliary copper sheet 605 welded to one end of the connector 601 and a second auxiliary copper sheet 608 welded to the other end of the connector 601; here, a limiting slot 602 is provided on both sides of the connector 601, and the limiting slot 602 is adapted to and engaged with the positioning pin 502 at the end of the heat dissipation copper pipe 501; ventilation slots 603 are also provided at equal intervals in the connector 601, and connecting holes 604 are uniformly provided in the sidewalls between adjacent ventilation slots 603.

[0028] That is, the first auxiliary copper sheet 605 is welded and fixed to one end of the connector 601, and one end of the venting groove 603 in the connector 601 is blocked. The first side wall grooves 606 are symmetrically arranged on both sides of the first auxiliary copper sheet 605, and the first auxiliary mesh holes 607 are evenly arranged in the first auxiliary copper sheet 605. After the first auxiliary copper sheet 605 is welded and fixed, the first side wall grooves 606 on both sides of the first auxiliary copper sheet 605 will be aligned with the limiting grooves 602 on both sides of the connector 601.

[0029] Next, the second auxiliary copper sheet 608 is welded and fixed to the other end of the connector 601 to seal the slot at the other end of the venting groove 603 in the connector 601. Second sidewall grooves 609 are symmetrically arranged on both sides of the second auxiliary copper sheet 608, and second auxiliary mesh holes 610 are evenly arranged in the second auxiliary copper sheet 608. Simultaneously, the second sidewall grooves 609 on both sides of the second auxiliary copper sheet 608 are aligned with the limiting slots 602 on both sides of the connector 601. Then, the end structure is installed at the end of the heat dissipation copper pipe 501, with the second auxiliary copper sheet 608 in the end structure close to the heat dissipation copper pipe 501. That is, the first auxiliary copper sheet 605 and the connector... In the operation of installing the end structure composed of the second auxiliary copper sheet 601 and the second auxiliary copper sheet 608 at the end of the heat dissipation copper pipe 501, the positioning clip 502 at the end of the heat dissipation copper pipe 501 first passes through the second side wall groove 609 of the second auxiliary copper sheet 608, the limiting groove 602 on the side of the connector 601, and the first side wall groove 606 on the side wall of the first auxiliary copper sheet 605 in sequence, until the end of the positioning clip 502 is flush with the end of the first auxiliary copper sheet 605. Then, the gaps where the positioning clip 502 contacts the first side wall groove 606, the second side wall groove 609, and the limiting groove 602 are welded and fixed. After all welding is completed, the installation of the end structure is completed.

[0030] Combined with appendix Figure 3 and appendix Figure 6 -Appendix Figure 7 As shown, the venting grooves 603 in the connector 601 are provided in three sets. The first auxiliary mesh 607 on the first auxiliary copper sheet 605 is aligned with the venting groove 603 in the middle position; the second auxiliary mesh 610 on the second auxiliary copper sheet 608 is aligned with the two venting grooves 603 on the side; that is, the first auxiliary mesh 607 on the first auxiliary copper sheet 605 and the second auxiliary mesh 610 on the second auxiliary copper sheet 608 are staggered.

[0031] The purpose of the first auxiliary mesh 607, the second auxiliary mesh 610, and the connecting hole 604 is to provide a flow and dissipation effect for the heat absorbed by the heat dissipation copper pipe 501 and the heat in the packaging substrate 1, thereby improving its cooling effect. However, the first auxiliary mesh 607 and the second auxiliary mesh 610 are staggered, and the first auxiliary mesh 607 on the first auxiliary copper sheet 605 is aligned with the venting groove 603 located in the middle position. After external gas enters the venting groove 603 located in the middle position from the first auxiliary mesh 607, It will not immediately enter the heat dissipation copper pipe 501 through the second auxiliary mesh 610 on the second auxiliary copper sheet 608. Instead, it will enter the ventilation slots 603 on both sides through the connecting hole 604, and then enter the heat dissipation copper pipe 501 through the second auxiliary mesh 610 on the second auxiliary copper sheet 608. During this process, the connecting hole 604 set in the side wall between the adjacent ventilation slots 603 is equivalent to a filter screen, that is, it provides a blocking effect for external impurities, preventing impurities from directly entering the heat dissipation copper pipe 501 and the packaging substrate 1.

[0032] Combined with the appendix Figure 1 Appendix Figure 5 and appendix Figure 8 -Appendix Figure 10 A circular groove 504 is provided on one side of the middle part of the heat dissipation copper pipe 501, and a connecting screw groove 505 is provided on the inner side wall of the heat dissipation copper pipe 501 at a position corresponding to the circular groove 504.

[0033] When inserting the heat dissipation copper pipe 501 into the receiving cavity 12, the circular groove 504 on the side wall of the heat dissipation copper pipe 501 needs to face upwards. After the heat dissipation copper pipe 501 is fully inserted into the receiving cavity 12, that is, when both ends of the heat dissipation copper pipe 501 are flush with the side wall of the packaging substrate 1, the circular groove 504 provided on one side of the middle part of the heat dissipation copper pipe 501 will be aligned with the connecting groove 11 in the packaging substrate 1.

[0034] Next, the encapsulation cover 4 is aligned with the encapsulation substrate 1 and pressed together. Then, the connecting accessories are installed in the encapsulation cover 4.

[0035] The connecting fittings include a connecting copper tube body 701; the connecting copper tube body 701 is inserted into the through groove 41 in the encapsulation cover 4; a side wall thread 702 is provided on the outer side wall of the bottom end of the connecting copper tube body 701, and the side wall thread 702 is adapted to the connecting thread groove 505 on the inner side of the heat dissipation copper tube 501 for threaded connection; second heat dissipation holes 703 are also evenly provided on the side wall of the connecting copper tube body 701, and a tightening head 704 is fixedly provided on the top end of the connecting copper tube body 701.

[0036] Insert the connecting copper tube 701 into the through groove 41 on the encapsulation cover 4 until the bottom end of the connecting copper tube 701 passes through the round groove 504 and enters the heat dissipation copper tube 501. Then rotate the connecting copper tube 701 so that the side wall thread 702 on its bottom side wall is threadedly connected to the connecting screw groove 505. Tighten the connecting copper tube 701 so that the tightening head 704 presses against the encapsulation cover 4. That is, after the connecting copper tube 701 is tightened, the tightening head 704 at its top end has a pressing effect on the encapsulation cover 4, which helps to ensure the firmness of the connection between the encapsulation cover 4 and the encapsulation substrate 1.

[0037] From the appendix Figure 9 -Appendix Figure 10 As shown, the second heat dissipation hole 703 is provided on the side wall of the connecting copper tube 701 in this solution, mainly to improve the heat dissipation effect on the encapsulation cover 4. Furthermore, a connecting cavity 705 communicating with the connecting copper tube 701 is provided in the tightening head 704, and a frustum-shaped end cap 706 is welded and fixed at the top opening of the connecting cavity 705. This frustum-shaped end cap 706 is hollow, and a third auxiliary mesh 707 is evenly arranged on its side wall. In other words, in addition to providing heat dissipation and cooling to the encapsulation cover 4 by installing the connecting copper tube 701, the second heat dissipation hole 703, the hollow frustum-shaped end cap 706, and the evenly arranged third auxiliary mesh 707 on the frustum-shaped end cap 706 allow external gas to circulate with the hot air inside the connecting copper tube 701, which has a positive effect on improving the cooling effect.

[0038] The frustum-shaped end cap 706 is configured here, with its small end connected to the communicating cavity 705 of the tightening head 704, and its large end located at the top. This means that the large end at the top of the tightening head 704 also has a blocking effect on falling impurities, preventing external vertically falling impurities from directly entering the connecting copper tube body 701. Furthermore, the third auxiliary mesh 707 located on the side wall of the frustum-shaped end cap 706 acts as a filter, preventing external impurities from entering the connecting copper tube body 701 while allowing gas to flow.

[0039] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging structure based on silicon microbridge structure, comprising a packaging substrate (1) and a packaging cover (4), and a chip body (3) disposed in the middle of the packaging substrate (1), with pins (2) disposed on the side of the packaging substrate (1). Its features are: A receiving cavity (12) is symmetrically arranged in the packaging substrate (1), and a communicating groove (11) is provided on the top of the packaging substrate (1), which is connected to the receiving cavity (12). A through groove (41) is also symmetrically provided in the encapsulation cover (4); An auxiliary component is provided in the receiving cavity (12) to provide an auxiliary heat dissipation function for the packaging substrate (1); A connecting fitting is provided in the through groove (41), which provides an auxiliary heat dissipation function for the encapsulation cover (4); The connecting accessory and the auxiliary component are used together to improve the stability of the connection between the packaging substrate (1) and the packaging cover (4); the auxiliary component includes a heat dissipation copper pipe (501) that is inserted into the receiving cavity (12). Positioning clips (502) are symmetrically fixed at both ends of the heat dissipation copper pipe (501), and the positioning clips (502) are used to connect the end structure; first heat dissipation holes (503) are uniformly arranged on the side wall of the heat dissipation copper pipe (501). A circular groove (504) is provided on one side of the middle part of the heat dissipation copper pipe (501), and a connecting screw groove (505) is provided on the inner side wall of the heat dissipation copper pipe (501) at a position corresponding to the circular groove (504); the connecting fitting includes a connecting copper pipe body (701). The connecting copper tube body (701) is inserted into the through groove (41) in the encapsulation cover body (4); A sidewall thread (702) is provided on the outer side wall of the bottom end of the connecting copper tube body (701), and the sidewall thread (702) is adapted to the connecting thread groove (505) on the inner side of the heat dissipation copper tube (501) for thread connection.

2. The chip packaging structure based on silicon-based microbridge structure according to claim 1, characterized in that: The opening of the heat dissipation copper pipe (501) is square. A heat dissipation copper pipe (501) is provided in the receiving cavity (12), and the lengths of the heat dissipation copper pipe (501) and the receiving cavity (12) are equal.

3. The chip packaging structure based on silicon-based microbridge structure according to claim 1, characterized in that: The end structure includes a connector (601). Limiting slots (602) are provided on both sides of the connector (601), and the limiting slots (602) are adapted to and engaged with the positioning pins (502) at the end of the heat dissipation copper pipe (501). Ventilation slots (603) are also provided at equal intervals in the connector (601), and communication holes (604) are uniformly provided in the sidewalls between adjacent ventilation slots (603).

4. The chip packaging structure based on silicon-based microbridge structure according to claim 3, characterized in that: The end structure also includes a first auxiliary copper sheet (605) welded to one end of the connector (601) and a second auxiliary copper sheet (608) welded to the other end of the connector (601).

5. The chip packaging structure based on silicon-based microbridge structure according to claim 4, characterized in that: The first auxiliary copper sheet (605) is provided with symmetrical first side wall grooves (606) on both sides and the first auxiliary mesh (607) is uniformly provided in the first auxiliary copper sheet (605). The second auxiliary copper sheet (608) is provided with symmetrical second sidewall grooves (609) on both sides, and the second auxiliary mesh (610) is uniformly provided in the second auxiliary copper sheet (608). The first sidewall groove (606), the second sidewall groove (609), and the limiting groove (602) have the same groove shape; The venting groove (603) in the connector (601) is provided in three sets, and the first auxiliary mesh (607) provided on the first auxiliary copper sheet (605) is aligned with the venting groove (603) in the middle position; The second auxiliary mesh (610) provided on the second auxiliary copper sheet (608) is aligned with the two ventilation slots (603) located on the side.

6. The chip packaging structure based on silicon-based microbridge structure according to claim 1, characterized in that: The side wall of the connecting copper tube body (701) is also uniformly provided with second heat dissipation holes (703) and a tightening head (704) is fixedly provided at the top of the connecting copper tube body (701). The tightening head (704) is also provided with a connecting cavity (705) that communicates with the connecting copper tube body (701), and a frustum-shaped end cap (706) is welded and fixed at the top opening of the connecting cavity (705). The frustum-shaped end cap (706) is hollow and has a third auxiliary mesh (707) evenly distributed on its side wall.

7. A packaging method for a chip packaging structure based on a silicon-based microbridge structure as described in any one of claims 1-6, characterized in that, The encapsulation method is as follows: S1: Insert the heat dissipation copper pipe (501) into the receiving cavity (12) in the packaging substrate (1), and make the opening of the heat dissipation copper pipe (501) aligned with the side wall of the packaging substrate (1). S2: Then, the end structure is clipped onto the positioning clip (502) at the end of the heat dissipation copper pipe (501), and then the end structure is welded and fixed. S3: Align the encapsulation cover (4) with the encapsulation substrate (1) and press them together; S4: Insert the connecting copper tube body (701) into the through groove (41) on the encapsulation cover (4), and make the bottom end of the connecting copper tube body (701) enter the heat dissipation copper tube (501). Then rotate the connecting copper tube body (701) so that the side wall thread (702) of its bottom side wall is threadedly connected to the connecting screw groove (505). Tighten the connecting copper tube body (701) and make the tightening head (704) press against the encapsulation cover (4).

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