A magnetron sputtering coating device

Abstract

The application discloses a magnetron sputtering coating device, which comprises a workpiece chamber, a cathode vacuum chamber communicated with the workpiece chamber, a rotating cathode mechanism comprising a rotating seat and a plurality of plane cathodes, the plurality of plane cathodes are arranged in a ring shape on the rotating seat, each plane cathode is provided with a cathode contact, and the surface of each plane cathode is provided with a target material, a power supply mechanism comprising a power supply, a conductive contact and a telescopic assembly, the power supply is electrically connected with the conductive contact, the telescopic assembly is used for driving the conductive contact to contact or separate from the cathode contact, and a rotating driving mechanism is used for driving the rotating seat to rotate. The magnetron sputtering coating device has the advantages that the rotating multi-target position design and the contact type power supply switching are adopted, the structure design is compact, the sputtering target material can be quickly replaced in one vacuum cycle, the cathode or the target material does not need to be repeatedly broken and replaced, and the continuous production efficiency of multilayer film coating is improved.

Description

Technical Field

[0001] This invention belongs to the field of physical vapor deposition technology, specifically relating to a magnetron sputtering coating apparatus. Background Technology

[0002] Magnetron sputtering is an important method for preparing metal thin films, alloy thin films, compound thin films, and multilayer film structures, and is widely used in semiconductor manufacturing, optical coating, flat panel displays, functional coatings, and new energy materials. In processes requiring alternating deposition or composite coating of multiple different targets, existing magnetron sputtering equipment mainly employs the following two technical solutions: Option 1: Multiple independent cathodes arranged side-by-side. Multiple independent magnetron sputtering cathodes are fixedly installed along a straight line within a vacuum chamber. Each cathode is equipped with its own magnet assembly, target material, cooling water circuit, shielding cover, and power interface. During operation, the process control system selects one cathode to be powered on; when material needs to be changed, the power supply to the current cathode is turned off and another cathode is turned on. This option results in a large vacuum chamber volume, a large equipment footprint, high manufacturing costs, and low utilization of most cathodes.

[0003] Option 2: Manual target replacement with a single cathode. The equipment is equipped with only one magnetron sputtering cathode. When different materials need to be deposited, the vacuum chamber must be broken, the target manually replaced, and the vacuum re-evacuated. This option results in process interruption, low production efficiency, substrate contamination, and high energy and time costs.

[0004] Existing technologies make it difficult to achieve low-cost continuous coating of multiple materials in a compact space. Therefore, how to provide a device that can maintain a vacuum state, has a compact spatial layout, and can quickly switch between different target materials for coating is a technical problem that needs to be solved in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a magnetron sputtering coating apparatus to solve the aforementioned problems existing in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a magnetron sputtering coating apparatus, comprising: The workpiece chamber is used to hold the workpiece to be plated. The cathode vacuum chamber is connected to the workpiece chamber. The rotating cathode mechanism is rotatably disposed in the cathode vacuum chamber. It includes a rotating base and multiple planar cathodes. The multiple planar cathodes are arranged in a ring on the rotating base. Each planar cathode is provided with a cathode contact and a target material is provided on the surface of each planar cathode. A power supply mechanism includes a power source, conductive contacts, and a telescopic assembly, wherein the power source is electrically connected to the conductive contacts, and the telescopic assembly is used to drive the conductive contacts to contact or separate from the cathode contacts; and A rotary drive mechanism is used to drive the rotating seat to rotate so that a selected planar cathode faces the workpiece to be plated.

[0007] As an optional embodiment of the above technical solution, the rotating seat includes an inlet pipe, a distribution plate, a connecting pipe, a collecting plate, and an outlet pipe. One end of the inlet pipe is used to input coolant, and the other end of the inlet pipe is connected to the distribution plate. Multiple connecting pipes arranged in a ring are provided between the distribution plate and the collecting plate. The connecting pipe is connected to the planar cathode. One end of the outlet pipe is connected to the collecting plate, and the other end of the outlet pipe is used to output coolant.

[0008] As an optional implementation of the above technical solution, a vacuum rotary sealing seat is provided between the liquid inlet pipe and the inner wall of the cathode vacuum chamber, and between the liquid outlet pipe and the inner wall of the cathode vacuum chamber.

[0009] As an optional implementation of the above technical solution, both the end of the inlet pipe away from the diverter and the end of the outlet pipe away from the collector are provided with rotary joints.

[0010] As an optional implementation of the above technical solution, the rotary drive mechanism includes a drive motor and a transmission assembly, wherein the drive motor is connected to the liquid inlet pipe through the transmission assembly.

[0011] As an optional implementation of the above technical solution, the transmission assembly includes a drive pulley, a synchronous belt, and a synchronous pulley. The drive pulley is mounted on the output shaft of the drive motor, and the synchronous pulley is mounted on the inlet pipe. The drive pulley and the synchronous pulley are connected by a synchronous belt.

[0012] As an optional implementation of the above technical solution, the drive motor has a built-in encoder for positioning and controlling the rotation angle of the rotating seat.

[0013] As an optional implementation of the above technical solution, an insulating pad is provided between the rotating seat and the planar cathode.

[0014] As an optional implementation of the above technical solution, the telescopic component includes an actuator cylinder, the movable end of which is connected to a conductive contact.

[0015] As an optional implementation of the above technical solution, the workpiece cavity is provided with a drive wheel assembly, which is used to drive the workpiece to be plated to perform reciprocating linear motion in the main workpiece movement cavity.

[0016] As an optional implementation of the above technical solution, the rotating base is provided with five planar cathodes arranged in a ring, and the target material on the surface of each planar cathode is different.

[0017] The beneficial effects of this invention are as follows: 1. This invention features a compact structure with multiple planar cathodes bearing targets arranged in a ring on a rotating base. This design effectively reduces the volume of the cathode vacuum chamber and the equipment footprint, thereby lowering manufacturing costs. The rotary drive mechanism drives the rotating base to rotate, and the telescopic component drives the conductive contacts to switch on and off. This allows for rapid replacement of the sputtering target within a single vacuum cycle, eliminating the need for repeated vacuuming to replace the cathode or target. This significantly shortens the time required for multilayer film deposition, improves the continuous production efficiency of multilayer film deposition, and avoids the risk of contamination caused by repeated exposure of the chamber.

[0018] 2. The rotating base has a cooling liquid circulation path consisting of an inlet pipe, a distribution plate, a connecting pipe, a collector plate, and an outlet pipe. This allows for continuous cooling of each planar cathode while it is rotating, ensuring the heat dissipation requirements of the planar cathodes during long-term sputtering.

[0019] 3. The rotary drive mechanism adopts closed-loop control with a drive motor and encoder, which can accurately control the indexing position of the rotary seat and ensure accurate alignment between the cathode contacts and conductive contacts of each planar cathode; the telescopic component drives the conductive contacts by executing the cylinder, and the power is disconnected when the planar cathode is switched, and is only connected at the sputtering station, which is safe and reliable.

[0020] 4. Coolant is introduced through a mechanical seal rotating structure, and an insulating pad provides electrical insulation, ensuring the stability and sealing of the equipment during long-term continuous operation.

[0021] 5. The cathode vacuum chamber and the workpiece chamber are designed as separate units, which optimizes the spatial structure while meeting the requirements of multi-target sputtering, making it particularly suitable for compact coating production lines. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a magnetron sputtering coating apparatus in one embodiment of the present invention; Figure 2 This is a schematic diagram of the side layout structure of the workpiece chamber and the cathode vacuum chamber in one embodiment of the present invention.

[0023] In the diagram: 1-Workpiece chamber; 2-Workpiece to be plated; 3-Cathode vacuum chamber; 4-Rotating cathode mechanism; 5-Power supply mechanism; 6-Rotating drive mechanism; 11-Drive wheel assembly; 401-Planar cathode; 402-Cathode contact; 403-Inlet pipe; 404-Diverter plate; 405-Connecting pipe; 406-Collector plate; 407-Outlet pipe; 408-Vacuum rotary seal seat; 409-Rotary joint; 410-Insulating pad; 51-Power supply; 52-Conductive contact; 53-Actuating cylinder; 61-Drive motor; 62-Drive pulley; 63-Synchronous belt; 64-Synchronous pulley. Detailed Implementation

[0024] like Figure 1 and Figure 2 As shown, this embodiment provides a magnetron sputtering coating apparatus, which mainly includes a workpiece chamber 1, a cathode vacuum chamber 3, a rotating cathode mechanism 4, a power supply mechanism 5, and a rotating drive mechanism 6. The workpiece chamber 1 is used to accommodate the workpiece 2 to be coated, and a drive wheel assembly 11 may be provided inside it. The drive wheel assembly 11 is used to drive the workpiece 2 to be coated to perform reciprocating linear motion in the workpiece chamber 1 to ensure that the sputtered material is uniformly deposited on the surface of the workpiece.

[0025] like Figure 2 As shown, the cathode vacuum chamber 3 is located at the top of the workpiece chamber 1 and is connected to the workpiece chamber 1. A rotating cathode mechanism 4 is rotatably mounted inside the cathode vacuum chamber 3. It includes a rotating base and multiple planar cathodes 401 arranged in a ring on the rotating base, each planar cathode 401 being independent of the others. A target material is fixed to the outer surface of each planar cathode 401, and the target material for each planar cathode 401 can be set to different materials according to process requirements. Each planar cathode 401 is provided with a cathode contact 402, which is used to connect a power supply 51 to the planar cathode 401. When the rotating base rotates inside the cathode vacuum chamber 3, different planar cathodes 401 can be switched to face the workpiece 2 to be plated.

[0026] like Figure 1 As shown, the power supply mechanism 5 includes a power source 51, conductive contacts 52, and a telescopic assembly. The power source 51 and conductive contacts 52 are electrically connected via wires to provide the electrical energy required for sputtering. The telescopic assembly is mounted on the wall of the cathode vacuum chamber 3 or on a fixed bracket, and the conductive contacts 52 are connected to the movable end of the telescopic assembly. The telescopic assembly can drive the conductive contacts 52 to move between a working position and a disconnected position. In the working position, the conductive contacts 52 contact the cathode contacts 402 on the planar cathode 401 currently facing the workpiece, achieving electrical conduction. In the disconnected position, the conductive contacts 52 retract and separate from the cathode contacts 402, thereby not interfering with the rotation of the rotating cathode mechanism 4.

[0027] The rotary drive mechanism 6 applies a rotary driving force to the rotary seat, causing the rotary seat to rotate around its own axis, thereby causing the multiple planar cathodes 401 arranged on it to rotate together. By rotating a selected planar cathode 401 to face the workpiece 2 to be plated, the target material is switched.

[0028] The magnetron sputtering coating apparatus of the present invention features a rotary multi-target design and contact-type power supply switching. Its compact structure effectively reduces equipment size and cost, and improves the process flexibility and production efficiency of multi-material coating. It is particularly suitable for scientific research and compact production line applications.

[0029] To achieve cooling of the planar cathode 401, a coolant (cooling water) flow path is provided inside the rotating base. For example... Figure 1 As shown, specifically, the rotating base includes an inlet pipe 403, a distribution plate 404, a connecting pipe 405, a collector plate 406, and an outlet pipe 407. The inlet pipe 403 extends along the axis of the rotating base, with one end connected to an external coolant supply line via a rotary joint 409 for inputting coolant; the other end of the inlet pipe 403 extends into the cathode vacuum chamber 3 and communicates with the inner cavity of the distribution plate 404, which distributes the coolant to each connecting pipe 405. Multiple connecting pipes 405 are arranged in a ring, with both ends connected to the distribution plate 404 and the collector plate 406 respectively. The coolant inside the connecting pipes 405 can carry away the heat from the planar cathode 401 and then collect in the collector plate 406. One end of the outlet pipe 407 is connected to the collector plate 406, and the other end of the outlet pipe 407 extends along the axis of the rotating seat and passes through the side wall of the cathode vacuum chamber 3. It is connected to the external return pipe through the rotary joint 409 and is used to output the coolant after heat exchange.

[0030] Preferably, a vacuum rotary sealing seat 408 is installed at both the point where the liquid inlet pipe 403 enters the wall of the cathode vacuum chamber 3 and at the point where the liquid outlet pipe 407 exits the wall of the cathode vacuum chamber 3. The vacuum rotary sealing seat 408 is used to allow the liquid inlet pipe 403 and the liquid outlet pipe 407 to rotate freely relative to the cavity wall while ensuring the cavity is sealed.

[0031] In one specific embodiment, the rotary drive mechanism 6 includes a drive motor 61 and a transmission assembly. The drive motor 61 is fixedly mounted outside the cathode vacuum chamber 3, and the transmission assembly transmits the rotational power of the drive motor 61 to the liquid inlet pipe 403, thereby realizing the rotational switching of the planar cathode 401. Figure 1As shown, specifically, the transmission assembly includes a drive pulley 62, a synchronous belt 63, and a synchronous pulley 64. The drive pulley 62 is fixedly mounted on the output shaft of the drive motor 61, and the synchronous pulley 64 is fixedly fitted onto the liquid inlet pipe 403. The drive pulley 62 and the synchronous pulley 64 are connected by the synchronous belt 63. When the drive motor 61 operates, it drives the synchronous pulley 64 to rotate, thereby driving the rotating base and the planar cathode 401 mounted on it to rotate together. The drive motor 61 integrates an encoder, which is used to detect and provide feedback on the rotation angle of the rotating base, achieving positioning control and rotating the required planar cathode 401 and target material to the corresponding sputtering position.

[0032] Insulating pads 410 are sandwiched between the rotating base and the mounting surfaces of each planar cathode 401. The insulating pads 410 electrically insulate the planar cathode 401 from the rotating base and the coolant flow path inside the rotating base. Specifically, insulating pads 410 are provided between the planar cathode 401 and the flow distribution plate 404 and the flow collection plate 406 respectively to ensure electrical insulation between the planar cathode 401 and the cavity wall of the cathode vacuum chamber 3.

[0033] like Figure 1 As shown, in one specific embodiment, the telescopic assembly includes an actuating cylinder 53. The cylinder body of the actuating cylinder 53 is fixed to the side wall of the cathode vacuum chamber 3, and the movable end of the actuating cylinder 53 is fixedly connected to the conductive contact 52. By controlling the air intake and exhaust of the actuating cylinder 53, the conductive contact 52 can be driven to extend or retract, thereby completing the connection and disconnection between the conductive contact 52 and the cathode contact 402.

[0034] In one specific embodiment, five planar cathodes 401 are uniformly arranged in a ring on the rotating base, and the target material on the surface of each planar cathode 401 is different. By driving the rotating base to rotate through the rotation drive mechanism 6, the five target materials can be switched, realizing the deposition of multiple thin films of different materials in the same vacuum cycle.

[0035] In use, the magnetron sputtering coating apparatus of the present invention places the workpiece 2 to be coated on the drive wheel assembly 11 of the workpiece chamber 1, and the workpiece 2 reciprocates linearly under the drive of the drive wheel assembly 11. The drive motor 61 drives the rotating seat to rotate through the transmission assembly, and the encoder provides real-time feedback of the angle signal, rotating the selected first planar cathode 401 to the sputtering position facing the workpiece 2. Subsequently, the actuator cylinder 53 drives the conductive contact 52 to extend and contact the cathode contact 402 of the current position planar cathode 401, connecting the power supply circuit. The power supply 51 supplies power to the planar cathode 401 through the conductive contact 52, and the working gas is introduced into the cathode vacuum chamber 3 and the workpiece chamber 1 to generate glow discharge. Target atoms are sputtered out and deposited on the surface of the reciprocating workpiece 2, completing a coating layer. When a different target material needs to be replaced, the power supply 51 is turned off, and the actuator cylinder 53 drives the conductive contact 52 to retract and separate from the cathode contact 402. The rotary drive mechanism 6 is restarted, rotating the rotating seat by a predetermined indexing angle, causing the planar cathode 401, which holds the next target material, to rotate to the sputtering position. The conductive contact 52 extends again to contact the cathode contact 402, allowing for sputtering deposition of the next target material. This cycle can be repeated to achieve continuous deposition of multiple film layers without breaking the vacuum.

[0036] Compared with existing technologies, the magnetron sputtering coating apparatus provided by this technical solution has the following advantages: 1. This invention features a compact structure by arranging multiple planar cathodes 401 with target materials in a ring on a rotating base. This design effectively reduces the volume of the cathode vacuum chamber 3 and the equipment footprint, thereby lowering the equipment manufacturing cost. The rotary drive mechanism 6 drives the rotating base to rotate, and the telescopic component drives the conductive contacts 52 to switch on and off. This allows for rapid replacement of the sputtering target material within a single vacuuming cycle, eliminating the need for repeated vacuuming to replace the cathode or target material. This significantly shortens the time required for multilayer film deposition, improves the continuous production efficiency of multilayer film deposition, and avoids the risk of contamination caused by repeated exposure of the chamber.

[0037] 2. The rotating base has a cooling liquid circulation path consisting of an inlet pipe 403, a distribution plate 404, a connecting pipe 405, a collector plate 406, and an outlet pipe 407. This allows for continuous cooling of each planar cathode 401 during rotation, ensuring the heat dissipation requirements of the planar cathode 401 during long-term sputtering.

[0038] 3. The rotary drive mechanism 6 adopts a closed-loop control of drive motor 61 and encoder, which can accurately control the indexing position of the rotary seat and ensure accurate alignment between the cathode contact 402 and conductive contact 52 of each planar cathode 401; the telescopic component drives the conductive contact 52 to move by the actuator cylinder 53. When the planar cathode 401 is switched, the power supply 51 is disconnected and only connected at the sputtering station, which is safe and reliable.

[0039] 4. Coolant is introduced through a mechanical seal rotating structure, and the insulating gasket 410 provides electrical insulation, ensuring the stability and sealing of the equipment during long-term continuous operation.

[0040] 5. The cathode vacuum chamber 3 and the workpiece chamber 1 adopt a separate layout, which optimizes the spatial structure while meeting the sputtering requirements of multiple targets, making it particularly suitable for compact coating production lines.

[0041] In the description of this invention, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. They can refer to fixed connections, detachable connections, or integral connections; they can be mechanical or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this invention. Furthermore, the specific features and structures described in the embodiments are included in at least one implementation method. Those skilled in the art can combine features from different implementation methods without contradiction. The scope of protection of this invention is not limited to the specific implementation methods described above. Based on the basic technical concept of this invention, implementation methods that can be conceived by those skilled in the art without creative effort are all within the scope of protection of this invention.

Claims

1. A magnetron sputtering coating apparatus, characterized in that, include: Workpiece chamber (1) is used to accommodate the workpiece to be plated (2); The cathode vacuum chamber (3) is connected to the workpiece chamber (1); The rotating cathode mechanism (4) is rotatably disposed in the cathode vacuum chamber (3). It includes a rotating seat and multiple planar cathodes (401). The multiple planar cathodes (401) are arranged in a ring on the rotating seat. Each planar cathode (401) is provided with a cathode contact (402). Each planar cathode (401) has a target material on its surface. A power supply mechanism (5) includes a power source (51), conductive contacts (52), and a telescopic assembly, wherein the power source (51) is electrically connected to the conductive contacts (52), and the telescopic assembly is used to drive the conductive contacts (52) to contact or separate from the cathode contacts (402); and A rotary drive mechanism (6) is used to drive the rotary seat to rotate so that a selected planar cathode (401) faces the workpiece (2) to be plated.

2. The magnetron sputtering coating apparatus according to claim 1, characterized in that, The rotating base includes an inlet pipe (403), a distribution plate (404), a connecting pipe (405), a collection plate (406), and an outlet pipe (407). One end of the inlet pipe (403) is used to input coolant, and the other end of the inlet pipe (403) is connected to the distribution plate (404). Multiple connecting pipes (405) arranged in a ring are provided between the distribution plate (404) and the collection plate (406). The connecting pipes (405) are connected to the planar cathode (401). One end of the outlet pipe (407) is connected to the collection plate (406), and the other end of the outlet pipe (407) is used to output coolant.

3. The magnetron sputtering coating apparatus according to claim 2, characterized in that, Vacuum rotary sealing seats (408) are provided between the liquid inlet pipe (403) and the inner wall of the cathode vacuum chamber (3) and between the liquid outlet pipe (407) and the inner wall of the cathode vacuum chamber (3).

4. The magnetron sputtering coating apparatus according to claim 2, characterized in that, Rotary joints (409) are provided at the end of the inlet pipe (403) away from the diverter plate (404) and the end of the outlet pipe (407) away from the collector plate (406).

5. The magnetron sputtering coating apparatus according to claim 2, characterized in that, The rotary drive mechanism (6) includes a drive motor (61) and a transmission assembly. The drive motor (61) is connected to the inlet pipe (403) through the transmission assembly. The transmission assembly includes a drive pulley (62), a synchronous belt (63), and a synchronous pulley (64). The drive pulley (62) is mounted on the output shaft of the drive motor (61), and the synchronous pulley (64) is mounted on the inlet pipe (403). The drive pulley (62) and the synchronous pulley (64) are connected by the synchronous belt (63).

6. The magnetron sputtering coating apparatus according to claim 5, characterized in that, The drive motor (61) has a built-in encoder for positioning control of the rotation angle of the rotating seat.

7. The magnetron sputtering coating apparatus according to claim 1, characterized in that, An insulating pad (410) is provided between the rotating seat and the planar cathode (401).

8. The magnetron sputtering coating apparatus according to claim 1, characterized in that, The telescopic assembly includes an actuating cylinder (53), the movable end of which is connected to a conductive contact (52).

9. The magnetron sputtering coating apparatus according to claim 1, characterized in that, The workpiece chamber (1) is provided with a drive wheel assembly (11), which is used to drive the workpiece (2) to be plated to make reciprocating linear motion in the main workpiece movement chamber.

10. The magnetron sputtering coating apparatus according to claim 1, characterized in that, The rotating base is provided with five planar cathodes (401) arranged in a ring, and the target material on the surface of each planar cathode (401) is different.

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