A dynamic regulation method of a photovoltaic welding strip copper wire dual-phase cooling flow field

Abstract

The application discloses a dynamic regulation method for a photovoltaic welding strip copper wire dual-phase cooling flow field. The method comprises the following steps: temperature monitoring of a cooling environment, obtaining temperature data of the photovoltaic welding strip copper wire and a liquid cooling device respectively, calculating the required cooling load required by the copper wire in the current motion state to reach the preset cooling target; determining the cooling air flow dynamic state according to the spatial distribution characteristics of the required cooling load, and executing the first air cooling regulation to realize the global cooling uniformity control; obtaining the cooling medium heat exchange real-time data of the liquid cooling device, predicting the heat load trend and adjusting the flow state of the cooling medium; obtaining the humidity and temperature distribution data of the cooling environment, estimating the water vapor condensation state, and executing the second air cooling regulation to remove the local condensed water. The application realizes uniform cooling of the copper wire, actively manages the heat load of the liquid cooling system, and removes the condensed water in time, thereby improving the cooling efficiency and the copper wire surface quality, and being suitable for the wire drawing post-cooling process in the photovoltaic welding strip production.

Description

Technical Field

[0001] This invention relates to the field of welding processing, and in particular to a method for dynamic control of the two-phase cooling flow field of copper wire in photovoltaic welding strips. Background Technology

[0002] Photovoltaic welding ribbon is a key material for current collection in photovoltaic modules, and its copper wire requires drawing during production. After drawing, the copper wire is at a high temperature and needs timely cooling to prevent surface oxidation. Existing cooling methods typically employ separate air cooling or liquid cooling operations, with cooling parameters largely relying on operator experience and lacking quantitative calculations of the actual cooling requirements of the copper wire. This easily leads to two situations: first, insufficient cooling capacity, resulting in incomplete cooling of the copper wire and an excessively thick oxide layer on the surface, affecting conductivity; second, over-cooling, causing energy waste.

[0003] Furthermore, existing cooling methods struggle to differentiate and control the temperature distribution of the copper wires based on spatial variations. They often employ uniform airflow or uniform immersion, resulting in inconsistent cooling rates across different areas of the copper wires and significant localized temperature differences. These temperature differences further lead to uneven oxide layer thickness distribution on the copper wire surface, creating resistance hotspots during subsequent soldering or use, thus reducing the reliability of photovoltaic modules.

[0004] In liquid cooling systems, the cooling medium absorbs heat along its flow path through the heat exchange pipes, causing the medium temperature in the downstream area to rise and the heat exchange capacity to decrease. Current technologies lack real-time monitoring and trend prediction of the actual heat exchange status of the cooling medium. When the accumulated heat in a localized area exceeds the heat dissipation capacity, the cooling medium is prone to overheating, leading to the failure of the entire liquid cooling system and its inability to continuously meet cooling requirements.

[0005] Furthermore, during the cooling process, when the ambient humidity is high and the copper wire temperature is below the dew point, water vapor will condense on the surface of the copper wire, forming condensate. Existing cooling methods typically neglect the removal of condensate, causing it to adhere to the copper wire surface for a long time, triggering electrochemical corrosion, resulting in rust spots or pitting on the copper wire surface, severely reducing conductivity and product yield.

[0006] Therefore, how to quantitatively determine cooling demand, spatially differentiate and regulate cooling airflow, actively manage the heat load of the liquid cooling system, and promptly remove condensate are the technical problems that urgently need to be solved in the current photovoltaic ribbon copper wire cooling process. Summary of the Invention

[0007] To address at least one of the aforementioned problems, embodiments of the present invention provide a method for dynamically controlling the two-phase cooling flow field of copper wire in photovoltaic solder ribbons, comprising: Temperature monitoring of the cooling environment is performed to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device. Based on the temperature data, the required cooling load for the photovoltaic solder ribbon copper wire to achieve the preset cooling target under the current motion state is calculated. Based on the spatial distribution characteristics of the required cooling load in the cooling environment, the cooling airflow dynamic state inside the cooling environment is determined; based on the cooling airflow dynamic state, a first air-cooling regulation is executed to adjust the working state of the air-cooling device in order to achieve global cooling uniformity control. Acquire real-time heat exchange data of the cooling medium in the liquid cooling device; predict the heat load trend of the liquid cooling device based on the real-time heat exchange data; and adjust the flow state of the cooling medium based on the heat load trend. The system acquires real-time humidity and temperature distribution data of the cooling environment to estimate the water vapor condensation state of the cooling environment. Based on the water vapor condensation state, it performs a second air-cooling control to adjust the airflow delivery state of the air-cooling device to the photovoltaic solder ribbon copper wire, in order to achieve local condensate removal control.

[0008] In one embodiment, the temperature monitoring of the cooling environment to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device includes: The cooling environment is subjected to thermal infrared imaging to obtain a global thermal infrared image of the cooling environment; the first temperature data of the photovoltaic solder ribbon copper wire and the liquid cooling device are extracted from the global thermal infrared image. Acquire the second temperature data from the distributed temperature sensing device inside the cooling environment; perform temperature correction based on the first temperature data and the second temperature data to obtain the temperature spatial distribution data of the photovoltaic welding strip copper wire and the liquid cooling device respectively.

[0009] In one embodiment, the step of performing temperature correction based on the first temperature data and the second temperature data of the photovoltaic solder ribbon copper wire to obtain the temperature spatial distribution data of the photovoltaic solder ribbon copper wire includes: Step A1: Establish a three-dimensional spatial coordinate system for the cooling environment, and denote the spatial position of any point on the copper wire of the photovoltaic solder ribbon as... ,in , , These represent the coordinates of the point in the length, width, and height directions of the cooling environment, respectively. Step A2: Based on the thermal infrared image, extract the spatial position of the photovoltaic solder ribbon copper wire. First temperature data at the location Cooling ambient air temperature Thickness of oxide layer on copper wire surface and relative humidity Determine the location in this space infrared true temperature equivalent at the location The infrared true temperature equivalent refers to the value that is equivalent to the true surface temperature of the copper wire after compensation for ambient temperature, oxide layer thickness and humidity. Step A3: Obtain the second temperature data from the distributed temperature sensing device. Adaptive weighted fusion is performed with the aforementioned infrared true temperature equivalent to obtain the same spatial position on the copper wire. Dual-source symbiotic temperature distribution (Unit: °C), where , The total number of distributed temperature sensing devices; the dual-source co-existing temperature distribution refers to the spatial temperature data generated jointly by infrared heat source and sensor heat source information. Step A3 specifically includes A31-34: Step A31: Based on the spatial location of each sensor The coordinates of the point and the spatial point on the current copper wire The three-dimensional distance and the actual temperature measured by the sensor Raw temperature measurement at sensor coordinates using an infrared camera The absolute value of the deviation is used to determine the position of each sensor at the current spatial point. Fusion weights at the point ; Step A32: Based on the thickness of the oxide layer on the copper wire surface and ambient relative humidity Determine the adaptive fusion coefficients This is used to balance the contribution weights of infrared and sensor data; Step A33: Based on the sensor fusion weights determined above... Adaptive fusion coefficient Sensor measured temperature and infrared true temperature equivalent The final spatial location is determined by weighted average. Dual-source symbiotic temperature distribution ; Step A34: Calculate the dual-source co-occurrence temperature distribution. This data represents the spatial distribution of temperature of copper wire in photovoltaic solder ribbons.

[0010] In one embodiment, calculating the required cooling load of the photovoltaic solder ribbon copper wire under its current operating state based on the temperature data includes: Based on the temperature spatial distribution data of the photovoltaic solder ribbon copper wire and the liquid cooling device, as well as the heat conduction properties between the photovoltaic solder ribbon copper wire and the liquid cooling device, a dynamic model of heat exchange between the photovoltaic solder ribbon copper wire and the liquid cooling device is constructed. Based on the heat exchange dynamic model, the required cooling load for the photovoltaic welding ribbon copper wire to reach the preset cooling target at the current wire drawing speed is calculated.

[0011] In one embodiment, calculating the required cooling load for the photovoltaic solder ribbon copper wire to reach the preset cooling target at the current wire drawing speed, based on the heat exchange dynamic model, includes: Based on the structural and dimensional changes of the photovoltaic welding strip copper wire under the current wire drawing operation and the current wire drawing linear speed, the heat exchange dynamic model is modified. Based on the modified heat exchange dynamic model, the amount of heat absorbed by the liquid cooling device in the refrigeration cycle per unit time required for the photovoltaic welding ribbon copper wire to reach the preset cooling target temperature is calculated, and this heat value is taken as the required cooling load.

[0012] In one embodiment, determining the cooling airflow dynamic state within the cooling environment based on the spatial distribution characteristics of the required cooling load within the cooling environment includes: Based on the three-dimensional spatial distribution of the required cooling load in the cooling environment, the target heat removal rate of each grid area in the cooling environment is generated. The three-dimensional spatial distribution of the required cooling load is allocated according to the actual spatial path of the copper wire in the cooling environment: the total required cooling load is divided by the total length of the copper wire in the cooling environment at the current moment to obtain the heat required to be removed per unit length, and then the target heat removal rate that the grid should bear is calculated based on the length of the copper wire contained in each grid. Based on the target heat removal rate, the dynamic state of the cooling airflow inside the cooling environment is determined; wherein, the dynamic state of the cooling airflow includes the global velocity distribution of the cooling airflow inside the cooling environment.

[0013] In one embodiment, based on the cooling airflow dynamic state, performing a first air-cooling regulation to adjust the operating state of the air-cooling device includes: The airflow rate and temperature of the air-cooling device are adjusted according to the cooling airflow dynamic state and the airflow delivery operation mode of the air-cooling device inside the cooling environment.

[0014] In one embodiment, acquiring real-time heat exchange data of the cooling medium in the liquid cooling device, and predicting the heat load trend of the liquid cooling device based on the real-time heat exchange data, includes: The temperature change data of the cooling medium in the liquid cooling device is obtained throughout the entire flow path. Based on the temperature change data and the specific heat capacity of the cooling medium, the heat exchange data of the cooling medium throughout the entire flow path is determined. The heat exchange data includes the real-time heat exchange rate of each interval under the entire flow path, which is expressed as the amount of heat absorbed by the cooling medium in that interval per unit time. Based on the actual heat exchange data, the heat load trend of the entire flow path is predicted; wherein, the heat load trend refers to the heat accumulation trend of each interval under the entire flow path.

[0015] In one embodiment, adjusting the flow state of the cooling medium according to the heat load trend includes: Based on the heat load trend, determine the abnormal heat accumulation intervals under the entire flow path; Based on the distribution location of all abnormal heat accumulation intervals within the entire flow path, adjust the flow velocity of the cooling medium within the entire flow path.

[0016] In one embodiment, acquiring real-time water vapor data of the cooling environment to estimate the water vapor condensation state of the cooling environment specifically includes: Obtain real-time humidity distribution data and temperature distribution data of the cooling environment; Based on the actual humidity distribution data and the actual temperature distribution data, the water vapor condensation state of the cooling environment is determined; wherein, the water vapor condensation state includes the location where water vapor condensation occurs.

[0017] The beneficial effects of the above-mentioned technical solutions provided in the embodiments of the present invention include at least the following: The technical solutions provided in this invention quantitatively determine the required cooling load by monitoring the temperature of the cooling environment, thus avoiding insufficient or excessive cooling. They match the cooling airflow according to the spatial distribution characteristics of the required cooling load, achieving uniform cooling of the copper wire and reducing oxide layer thickness differences caused by uneven cooling. By predicting the heat load trend of the liquid cooling device and adjusting the flow state of the cooling medium, they proactively prevent local overheating of the cooling medium, ensuring the continuous heat dissipation capacity of the liquid cooling system. Furthermore, by estimating the water vapor condensation state and implementing local airflow control, they promptly remove condensate from the surface of the copper wire, preventing electrochemical corrosion. In summary, this invention systematically improves the efficiency and uniformity of cooling of photovoltaic solder ribbon copper wires from four aspects: quantitative cooling demand, spatial differentiation of airflow, proactive liquid cooling heat load control, and timely condensate removal, ensuring the conductivity of the copper wires and product yield.

[0018] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0019] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic flowchart of a method for dynamically controlling the two-phase cooling flow field of a photovoltaic ribbon copper wire provided in an embodiment of the present invention. Detailed Implementation

[0021] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0022] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "far," "near," "front," and "rear," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] like Figure 1As shown in the figure, an embodiment of the present invention provides a method for dynamic control of the two-phase cooling flow field of a photovoltaic solder ribbon copper wire, comprising the following steps: Temperature monitoring of the cooling environment is performed to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device. Based on the temperature data, the required cooling load for the photovoltaic solder ribbon copper wire to achieve the preset cooling target under the current motion state is calculated. Based on the spatial distribution characteristics of the required cooling load in the cooling environment, the cooling airflow dynamic state inside the cooling environment is determined; based on the cooling airflow dynamic state, a first air-cooling regulation is executed to adjust the working state of the air-cooling device in order to achieve global cooling uniformity control. Acquire real-time heat exchange data of the cooling medium in the liquid cooling device; predict the heat load trend of the liquid cooling device based on the real-time heat exchange data; and adjust the flow state of the cooling medium based on the heat load trend. The system acquires real-time humidity and temperature distribution data of the cooling environment to estimate the water vapor condensation state of the cooling environment. Based on the water vapor condensation state, it performs a second air-cooling control to adjust the airflow delivery state of the air-cooling device to the photovoltaic solder ribbon copper wire, in order to achieve local condensate removal control.

[0025] The first air-cooling control is used for global cooling uniformity control, while the second air-cooling control is used for local condensate removal control. The two control targets and adjustment strategies are different. When water vapor condensation exists in the cooling environment and there is uneven cooling, the second air-cooling control is executed first to ensure that the copper wire surface is dry. The uneven cooling refers to the situation where the relative deviation between the actual heat removal rate and the target heat removal rate in each grid area of ​​the cooling environment exceeds a preset threshold, such as 15%. When there is no water vapor condensation, the first air-cooling control is executed alone.

[0026] The beneficial effects of the above technical solution are as follows: By monitoring the temperature of the cooling environment, the temperature data of the photovoltaic welding ribbon copper wire and the liquid cooling device are obtained, and the required cooling load for the copper wire to reach the preset cooling target under the current motion state is calculated. The cooling demand can be quantitatively determined, providing a basis for the subsequent coordinated control of air cooling and liquid cooling, and avoiding insufficient or excessive cooling caused by setting cooling parameters based on experience.

[0027] The cooling airflow dynamic state is determined based on the spatial distribution characteristics of the demand cooling load, and the first air cooling control is executed to match the delivery of cooling airflow with the cooling demand of each local area of ​​the copper wire. This is conducive to achieving uniform cooling of the entire surface of the copper wire and reducing local temperature differences and oxide layer thickness differences caused by uneven cooling.

[0028] By acquiring real-time data on the heat exchange of the cooling medium in a liquid cooling system, predicting heat load trends, and adjusting the flow state of the cooling medium accordingly, the system can proactively address the risk of heat accumulation in the liquid cooling system, prevent local overheating of the cooling medium, and ensure that the heat dissipation capacity of the liquid cooling system continuously meets the cooling requirements.

[0029] The system acquires the humidity and temperature distribution of the cooling environment, estimates the water vapor condensation state, and executes a second air-cooling control. When condensate appears on the surface of the copper wire, it can locally remove it by adjusting the airflow delivery state, avoiding long-term adhesion of condensate that could cause electrochemical corrosion of the copper wire, and ensuring the surface quality and conductivity of the copper wire.

[0030] The technical solutions of each claim are described below with reference to multiple embodiments.

[0031] First Embodiment The temperature monitoring of the cooling environment to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device can be implemented as follows: The cooling environment is subjected to thermal infrared imaging to obtain a global thermal infrared image of the cooling environment; the first temperature data of the photovoltaic solder ribbon copper wire and the liquid cooling device are extracted from the global thermal infrared image. Acquire the second temperature data from the distributed temperature sensing device inside the cooling environment; perform temperature correction based on the first temperature data and the second temperature data to obtain the temperature spatial distribution data of the photovoltaic welding strip copper wire and the liquid cooling device respectively.

[0032] The working principle of this embodiment is as follows: Thermal infrared imaging can acquire a global temperature distribution image of the cooling environment, from which first temperature data can be extracted for the area where the photovoltaic solder ribbon copper wire is located and the area where the liquid cooling device (i.e., the coolant tank) is located. These data reflect infrared radiation temperature and may be affected by factors such as the surface condition of the copper wire and the ambient temperature, resulting in certain errors. To obtain a more accurate spatial temperature distribution, this embodiment also utilizes second temperature data collected by distributed temperature sensing devices pre-distributed within the cooling environment (e.g., along the copper wire and near the liquid cooling device). Since the sensors are in direct contact with the object being measured or are very close to the object, their measurements are relatively accurate but have limited spatial coverage. Temperature correction is performed on the first and second temperature data, which essentially uses the accurate values ​​of the sensors to calibrate the measured values ​​of the infrared image, or obtains a high-confidence temperature value for each spatial location through data fusion. After correction, the obtained spatial temperature distribution data of the photovoltaic solder ribbon copper wire and the liquid cooling device can truly reflect the thermal state within the cooling environment, laying the foundation for subsequent calculation of the required cooling load.

[0033] The beneficial effects of this embodiment are: by combining thermal infrared imaging with distributed temperature sensing, the global temperature distribution is obtained, and the local accurate values ​​of the sensors are used for correction, avoiding the disadvantage of single infrared measurement being susceptible to interference, thereby obtaining highly reliable temperature spatial distribution data, providing accurate input for subsequent cooling regulation.

[0034] Second Embodiment The step of performing temperature correction based on the first and second temperature data of the photovoltaic solder ribbon copper wire to obtain the temperature spatial distribution data of the photovoltaic solder ribbon copper wire can be implemented as follows: Step A1: Establish a three-dimensional spatial coordinate system for the cooling environment, and denote the spatial position of any point on the copper wire of the photovoltaic solder ribbon as... ,in , , These represent the coordinates of the point in the length, width, and height directions of the cooling environment, respectively. Step A2: Based on the thermal infrared image, extract the spatial position of the photovoltaic solder ribbon copper wire. First temperature data at the location Cooling ambient air temperature Thickness of oxide layer on copper wire surface (This information can be obtained using an eddy current thickness gauge) and ambient relative humidity. (Unit: %), determine the spatial location. infrared true temperature equivalent at the location The infrared true temperature equivalent refers to the value that is equivalent to the true surface temperature of the copper wire after compensation for ambient temperature, oxide layer thickness and humidity. Specifically, the calculation formula can be: ; in, The ambient temperature coupling coefficient is dimensionless, ranging from 0.05 to 0.20. It is obtained using the blackbody calibration method, where the blackbody temperature is set to 50℃, 100℃, 150℃, and 200℃. The deviation between the infrared measurement value and the actual temperature at each temperature point is measured, and then calculated. And take the arithmetic mean; The coefficient representing the comprehensive influence of oxide layer humidity is expressed in units such as ℃ / μm, and its value ranges from 0.1 to 0.3. The method for obtaining this coefficient is as follows: copper wire samples with different oxide layer thicknesses are prepared, and the infrared deviation is measured under the same ambient temperature and humidity. The slope is obtained through linear fitting. The humidity adjustment factor is dimensionless and ranges from 0.2 to 0.5. It is obtained by changing the ambient humidity with a fixed oxide layer thickness and performing linear regression on the relative humidity deviation and infrared deviation. The specific values ​​of the above parameters are all constants that have been pre-calibrated and stored in the control system. in, Essentially, it represents the amount (in °C) of underestimation in infrared thermometry caused by a unit increase in the thickness of the oxide layer on the copper wire surface per unit length (1 μm) at a reference relative humidity (50%). It reflects the attenuation capability of the oxide layer itself on infrared radiation signals and is the fundamental intensity coefficient of the oxide layer's influence in infrared temperature compensation. When When the oxide layer term in the above compensation formula is simplified to That is, the compensation amount is directly proportional to the oxide layer thickness, and the proportionality coefficient is... . The larger the value, the more severe the interference of the oxide layer on infrared thermometry, requiring greater positive compensation. This coefficient was obtained by preparing copper wire samples with different oxide layer thicknesses, measuring the infrared deviation under constant temperature and humidity (50% RH) conditions, and then performing linear fitting.

[0035] Essentially, this represents the dimensionless sensitivity (to adjusting for infrared thermometry deviations caused by the oxide layer when humidity deviates from the baseline value (50%). It reflects the ability of changes in ambient relative humidity to amplify or reduce the attenuation effect of the oxide layer. Actual ambient humidity is often not equal to 50%, and humidity changes alter the water vapor content in the air, thus affecting the attenuation of infrared signals in the atmosphere. When humidity increases, the additional attenuation of the infrared signal due to water vapor is superimposed on the attenuation caused by the oxide layer, requiring a proportional increase in the total compensation; the opposite is true when humidity decreases. The formula... The strength of this regulation was controlled: The larger the value, the more sensitive the humidity deviation is to the modulation of the oxide layer compensation amount. This coefficient is obtained by measuring the change in infrared deviation under a fixed oxide layer thickness by varying the ambient humidity and then performing linear regression.

[0036] Step A3: Obtain the second temperature data from the distributed temperature sensing device. Adaptive weighted fusion is performed with the aforementioned infrared true temperature equivalent to obtain the same spatial position on the copper wire. Dual-source symbiotic temperature distribution (Unit: °C), where , This represents the total number of distributed temperature sensing devices. The unit is ℃; the dual-source co-occurrence temperature distribution refers to the spatial temperature data generated jointly by infrared heat source and sensor heat source information, specifically including A31-34: Step A31: Based on the spatial location of each sensor The coordinates of the point and the spatial point on the current copper wire The three-dimensional distance and the actual temperature measured by the sensor Raw temperature measurement at sensor coordinates using an infrared camera The absolute value of the deviation is used to determine the position of each sensor at the current spatial point. Fusion weights at the point ; Specifically, the calculation formula is as follows: ; in, The radius of influence in space is fixed at 0.2 m. The method for obtaining this radius is as follows: it is determined based on the actual spacing of the distributed temperature sensors in the cooling environment, and is taken as half of the average distance between adjacent sensors. The deviation sensitivity coefficient is expressed in °C. -1 The value ranges from 0.5 to 1.5. The method for obtaining the value is as follows: collect 100 sets of sensor and infrared temperature deviation data, and calculate the standard deviation of the deviation. ,make If the value exceeds the range, the boundary value will be used. The allowable deviation threshold, in °C, ranges from 2 to 5. It is obtained by taking the maximum allowable surface temperature non-uniformity of the photovoltaic welding ribbon copper wire and the measurement accuracy. It is preferred to take 3 °C by default, but it can also be manually set within the range during production debugging. All the above fixed parameters are preset constants.

[0037] The physical meaning of the above weighting formula is: the greater the spatial distance, the lower the weight (Gaussian decay); after the absolute value of the deviation between the sensor and the original infrared temperature exceeds the allowable threshold, the weight decreases exponentially, and the larger the deviation, the smaller the weight; when the deviation does not exceed the allowable threshold, the weight is slightly higher than the benchmark value, thereby strengthening the contribution of reliable sensors and suppressing the contribution of unreliable sensors. Step A32: Based on the thickness of the oxide layer on the copper wire surface and ambient relative humidity Determine the adaptive fusion coefficients This is used to balance the contribution weights of infrared and sensor data; Specifically, the calculation formula is as follows: ; in, The baseline fusion coefficient is set to 1.0. The maximum allowable oxide layer thickness, for example, 5 μm, is determined according to the conductivity process specifications of the photovoltaic solder ribbon copper wire. When the oxide layer thickness exceeds... The electrical conductivity decreases significantly over time; Step A33: Based on the sensor fusion weights determined above... Adaptive fusion coefficient Sensor measured temperature and infrared true temperature equivalent The final spatial location is determined by weighted average. Dual-source symbiotic temperature distribution The unit is ℃; Specifically, the calculation formula is as follows: ; Step A34: Calculate the dual-source co-occurrence temperature distribution. This data represents the spatial distribution of temperature of copper wire in photovoltaic solder ribbons.

[0038] The working principle of this embodiment is as follows: First, the surface temperature of the copper wire measured by the infrared camera is used as the initial value. However, this value is easily affected by ambient temperature, the oxide layer on the surface of the copper wire, and moisture in the air, resulting in deviations. Therefore, three compensation terms are introduced in step A2: The first term is ambient temperature compensation, which uses the difference between the ambient temperature and the infrared measurement value multiplied by a coefficient α for linear correction. When the ambient temperature is lower than the copper wire temperature, this term is negative, which can appropriately reduce the infrared reading. The second term is oxide layer compensation, as the oxide layer attenuates the infrared signal, leading to a lower measured value; therefore, a product term of β and the oxide layer thickness is added. The third term is humidity correction, as when the relative humidity deviates from 50%, the attenuation effect of moisture on the infrared signal is enhanced or weakened; the compensation amplitude is adjusted by a γ factor. Through these three compensation terms, the true infrared temperature equivalent is obtained, making it closer to the true surface temperature of the copper wire.

[0039] Then, step A3 fuses the measured values ​​from the distributed temperature sensors with the true infrared temperature equivalent. The influence of each sensor at different spatial locations is determined by two weighting factors: first, spatial distance weight—the farther the sensor is from the current point, the less meaningful its measurement is, using Gaussian exponential decay; second, deviation penalty weight—if the deviation between the sensor's measured value and the original infrared measurement exceeds the allowable threshold Δ0, the sensor is considered to have unreliable data due to poor contact, heat sink effect, etc., and the larger the deviation, the heavier the penalty, using exponential decay. Ultimately, the weight of each sensor is the product of these two exponents.

[0040] In addition, the weighting coefficients of infrared data in the entire fusion process need to be adaptively adjusted based on the thickness of the copper wire oxide layer and the ambient humidity. The reliability of infrared measurements decreases when the oxide layer is thick or the humidity is too high / too low. A decrease in the exponent makes the fusion result more dependent on sensor data; conversely, an increase in the exponent increases the infrared weight.

[0041] Finally, the temperature values ​​of each sensor are multiplied by their respective weights and summed, then the infrared true temperature equivalent is multiplied by [the weight]. Dividing by the sum of all weights yields the fused dual-source co-occurrence temperature distribution. This temperature distribution combines the advantages of both measurement sources, exhibiting high accuracy and spatial resolution.

[0042] The beneficial effects of this embodiment are: by using infrared compensation and dual-source weighted fusion, the interference of environment, oxide layer and humidity in thermal infrared measurement is eliminated. At the same time, the sensor data is used to make up for the local error of infrared measurement, which ultimately improves the reliability of the output three-dimensional temperature spatial distribution data of copper wire, and provides an accurate basis for subsequent demand cooling load calculation and condensation judgment.

[0043] Third Embodiment The step of calculating the required cooling load of the photovoltaic solder ribbon copper wire under the current operating state based on the temperature data may specifically include: Based on the temperature spatial distribution data of the photovoltaic solder ribbon copper wire and the liquid cooling device, as well as the heat conduction properties between the photovoltaic solder ribbon copper wire and the liquid cooling device, a dynamic model of heat exchange between the photovoltaic solder ribbon copper wire and the liquid cooling device is constructed. Based on the heat exchange dynamic model, the required cooling load for the photovoltaic welding ribbon copper wire to reach the preset cooling target at the current wire drawing speed is calculated.

[0044] The working principle of this embodiment is as follows: After obtaining the temperature spatial distribution of the copper wire and the liquid cooling device, it is necessary to determine the amount of heat required to cool the copper wire from its current temperature to the target temperature. Since heat exchange occurs between the copper wire and the liquid cooling device through air gaps, convection, and other means, the heat transfer process between them can be described using a dynamic heat exchange model. This model needs to consider the temperature distribution of the copper wire and the liquid cooling device, as well as the thermal conductivity of the two (including the thermal conductivity of air, the convective heat transfer coefficient, and geometric distance). After constructing the model, the current wire drawing linear velocity (which determines the flow rate of the copper wire entering the cooling zone and the heat input) and the preset target cooling temperature are input. The model can then calculate the amount of heat that the liquid cooling device needs to absorb per unit time, which is the required cooling load.

[0045] The beneficial effects of this embodiment are: by establishing a dynamic heat exchange model, the required cooling capacity can be quantitatively calculated based on real-time temperature data and process parameters, avoiding the blindness of setting cooling parameters based on experience, and providing a quantitative basis for subsequent cooling airflow and medium control.

[0046] Fourth embodiment The step of calculating the required cooling load for the photovoltaic solder ribbon copper wire to reach the preset cooling target at the current wire drawing speed, based on the heat exchange dynamic model, may specifically include: Based on the structural and dimensional changes of the photovoltaic welding strip copper wire under the current wire drawing operation and the current wire drawing linear speed, the heat exchange dynamic model is modified. Based on the modified heat exchange dynamic model, the amount of heat required for the photovoltaic welding ribbon copper wire to reach the preset cooling target temperature is calculated by the liquid cooling device in the refrigeration cycle per unit time, and this heat value is taken as the required cooling load. The required cooling load only includes the heat portion that the liquid cooling device needs to handle. The heat removed by the air cooling device has already been met separately through the subsequent control of the cooling airflow dynamics, and the two are not calculated repeatedly.

[0047] The working principle of this embodiment is as follows: During the wire drawing process, the copper wire generates additional heat during plastic deformation (deformation work is converted into heat energy). This heat does not exist when the wire drawing operation is not performed. Therefore, the heat source term in the basic heat exchange dynamic model needs to be modified. Specifically, the volume of newly formed copper wire entering the cooling zone per unit time is calculated based on the current wire drawing speed and the cross-sectional area of ​​the copper wire. Then, based on the copper wire density, specific heat capacity, and the temperature drop required to reduce the current temperature to the target temperature, the heat power that needs to be removed from this portion of the copper wire is calculated. This power is added to the model as a new heat source term, replacing the original empirical heat source term. The modified model can more accurately reflect the actual heat generation during the wire drawing process. Then, the modified model is run to obtain the portion of heat that the liquid cooling device needs to handle, which is the required cooling load. It should be noted that this required cooling load only refers to the heat that the liquid cooling device needs to absorb. The portion that the air cooling device is responsible for removing will be met separately in the subsequent cooling airflow control, and the two are not calculated repeatedly.

[0048] The beneficial effects of this embodiment are: it takes into account the impact of heat generated by plastic deformation during the wire drawing process on the cooling demand, making the calculation of the required cooling load more in line with the actual working conditions, and avoiding insufficient or wasted cooling capacity.

[0049] Fifth embodiment Determining the cooling airflow dynamic state within the cooling environment based on the spatial distribution characteristics of the required cooling load in the cooling environment may specifically include: Based on the three-dimensional spatial distribution of the required cooling load in the cooling environment, the target heat removal rate of each grid area in the cooling environment is generated. The three-dimensional spatial distribution of the required cooling load is allocated according to the actual spatial path of the copper wire in the cooling environment: the total required cooling load is divided by the total length of the copper wire in the cooling environment at the current moment to obtain the heat required to be removed per unit length, and then the target heat removal rate that the grid should bear is calculated based on the length of the copper wire contained in each grid. Based on the target heat removal rate, the dynamic state of the cooling airflow inside the cooling environment is determined; wherein, the dynamic state of the cooling airflow includes the global velocity distribution of the cooling airflow inside the cooling environment.

[0050] The working principle of this embodiment is as follows: the required cooling load is a total value, but the copper wires are distributed along a spatial path in the cooling environment. The temperature of the copper wires at different locations may vary, and the required local cooling capacity also differs. To achieve uniform cooling of the entire copper wire, the total required cooling load needs to be distributed to various local areas according to the spatial path of the copper wires. The specific distribution method is as follows: first, calculate the heat required to be removed per unit length of copper wire (total required cooling load divided by the total length of copper wire). Then, for each spatial grid, count the length of copper wire contained in that grid, and multiply the two to obtain the target heat removal rate that the grid should bear. After obtaining the target heat removal rate for each grid, the airflow velocity required to maintain the removal rate can be deduced by combining the forced convection heat transfer principle. After calculating for all grids, the global velocity distribution of cooling airflow within the entire cooling environment is obtained.

[0051] The beneficial effect of this embodiment is that it precisely distributes the total cooling demand to various locations in the space, enabling the subsequent air-cooling device to provide differentiated airflow for different areas, thereby achieving global uniform cooling and avoiding local overcooling or insufficient cooling.

[0052] Sixth Embodiment Based on the cooling airflow dynamic state, a first air-cooling control is performed to adjust the operating state of the air-cooling device, which may specifically include: The airflow rate and temperature of the air-cooling device are adjusted according to the cooling airflow dynamic state and the airflow delivery operation mode of the air-cooling device inside the cooling environment.

[0053] The working principle of this embodiment is as follows: the dynamic state of the cooling airflow provides the required airflow rate distribution for each spatial location. Actual air-cooled devices typically consist of multiple independently adjustable air outlets (nozzles), each with a specific range for airflow speed and temperature adjustment. This embodiment determines the output parameters of each nozzle based on the target airflow rate distribution and the actual adjustability of the nozzles using a control algorithm (e.g., optimal allocation based on mapping relationships), ensuring that the overall airflow field approximates the target distribution as closely as possible. Simultaneously, the airflow temperature can also be adjusted as needed by regulating the power of the cooling elements or the ratio of hot to cold air.

[0054] The beneficial effect of this embodiment is that it transforms the theoretically calculated cooling airflow demand into executable commands for the actual air-cooling device, thereby achieving the first air-cooling regulation for global cooling uniformity control.

[0055] Seventh Embodiment Obtaining real-time heat exchange data of the cooling medium in the liquid cooling device, and predicting the heat load trend of the liquid cooling device based on the real-time heat exchange data, may specifically include: The temperature change data of the cooling medium in the liquid cooling device is acquired throughout the entire flow path. Based on the temperature change data and the specific heat capacity of the cooling medium, the real-time heat exchange data of the cooling medium throughout the entire flow path is determined. The real-time heat exchange data includes the real-time heat exchange rate of each interval under the entire flow path, which is expressed as the amount of heat absorbed by the cooling medium in that interval per unit time. Furthermore, the sum of the real-time heat exchange rates of each interval under the entire flow path is used to compare and verify with the required cooling load. When the deviation between the two exceeds 10%, the flow rate of the cooling medium in the liquid cooling device is adjusted. Based on the actual heat exchange data, the heat load trend of the entire flow path is predicted; wherein, the heat load trend refers to the heat accumulation trend of each interval under the entire flow path.

[0056] The working principle of this embodiment is as follows: the cooling medium (such as coolant) of the liquid cooling device circulates in the heat exchange pipes, absorbing heat transferred by the copper wires along the way. By setting temperature sensors in different sections of the heat exchange pipes, the temperature change of the cooling medium along the flow path can be obtained. Knowing the specific heat capacity and flow rate (or velocity) of the cooling medium, the heat absorbed per unit time in each section can be calculated, i.e., the real-time heat exchange rate. The total heat actually removed by the liquid cooling device is obtained by summing the real-time heat exchange rates of all sections. This value should be basically consistent with the required cooling load; if the deviation exceeds 10%, it indicates that the flow rate of the cooling medium may be unsuitable and the flow rate needs to be adjusted. In addition, based on the historical heat exchange rate data of each section, time series prediction methods (such as linear extrapolation, moving average, etc.) can be used to predict the heat accumulation trend of each section in the future, thereby determining which sections are likely to experience heat accumulation.

[0057] The beneficial effect of this embodiment is that by monitoring the heat exchange of the cooling medium in real time, it is possible to promptly detect whether the heat dissipation capacity of the liquid cooling device matches the requirements and predict the risk of local overheating, thus providing a basis for subsequent flow state adjustments.

[0058] Eighth embodiment Adjusting the flow state of the cooling medium according to the heat load trend can specifically include: Based on the heat load trend, determine the abnormal heat accumulation intervals under the entire flow path; Based on the distribution location of all abnormal heat accumulation intervals within the entire flow path, adjust the flow velocity of the cooling medium within the entire flow path.

[0059] The working principle of this embodiment is as follows: Based on the heat load trend prediction results, if the heat accumulation in a certain range is expected to exceed a preset threshold in the future, this range is marked as an abnormal heat accumulation range. These abnormal ranges are usually caused by poor local heat exchange conditions or insufficient cooling medium flow rate. To eliminate the abnormality, it is necessary to increase the flow rate of the cooling medium in these ranges to enhance convective heat transfer capacity and remove the accumulated heat in a timely manner. Adjustment can be achieved by controlling the speed of the circulating pump or adjusting the valve opening on the pipeline to optimize the flow rate distribution throughout the flow path.

[0060] The beneficial effects of this embodiment are: by actively increasing the flow rate of the cooling medium in abnormal sections, it is possible to prevent local overheating, maintain uniform heat dissipation of the liquid cooling device as a whole, and improve the reliability of the cooling system.

[0061] Ninth Embodiment Obtaining real-time water vapor data of the cooling environment to estimate the water vapor condensation state of the cooling environment may specifically include: Obtain real-time humidity distribution data and temperature distribution data of the cooling environment; Based on the actual humidity distribution data and the actual temperature distribution data, the water vapor condensation state of the cooling environment is determined; wherein, the water vapor condensation state includes the location where water vapor condensation occurs.

[0062] The working principle of this embodiment is as follows: In a cooling environment, when the temperature at a certain location is lower than the dew point temperature of the air at that location, water vapor in the air will condense into liquid water and adhere to a solid surface (such as the surface of a copper wire). To determine whether condensation has occurred, it is necessary to obtain the humidity distribution and temperature distribution of the cooling environment. The humidity distribution can be measured using a distributed humidity sensor, and the temperature distribution can utilize the spatial temperature distribution data obtained in the first embodiment. The dew point temperature is a function of humidity and temperature, and can be calculated from the ambient temperature and relative humidity using the Magnus empirical formula. The measured temperature at each point on the copper wire surface is compared with the dew point temperature at that point. If the measured temperature is lower than the dew point temperature and the temperature difference exceeds a certain threshold (e.g., 0.5℃), it is determined that water vapor condensation has occurred at that point, and the coordinates of that location are recorded to form a condensation area distribution map.

[0063] The beneficial effect of this embodiment is that it can locate the position where condensation occurs on the surface of the copper wire in real time, providing accurate spatial information for subsequent targeted removal of condensate.

[0064] Tenth Embodiment Based on the water vapor condensation state, a second air-cooling control is performed to adjust the airflow delivery state of the air-cooling device to the photovoltaic solder ribbon copper wire, which may specifically include: Based on the water vapor condensation state, determine the surface area of ​​the photovoltaic welding ribbon copper wire with attached condensate; Based on the surface area, the airflow direction and rate of the air-cooling device for the photovoltaic solder ribbon copper wire are adjusted.

[0065] The working principle of this embodiment is as follows: Based on the condensation location determined in the ninth embodiment, it is possible to identify which surface areas on the copper wire are covered with condensate. If this condensate remains for a long time, it will cause electrochemical corrosion on the surface of the copper wire, affecting product quality. Therefore, it is necessary to use the adjustable nozzles in the air-cooling device to locally dry these areas. Specific measures include: adjusting the orientation of the nozzles so that the airflow direction is perpendicular to the surface of the copper wire and points towards the condensation area; at the same time, increasing the local airflow rate in this area, even temporarily exceeding the upper limit of the rate required for conventional cooling, to accelerate the evaporation of the condensate. Once the condensate is completely dry, the nozzles return to their normal operating state.

[0066] The beneficial effects of this embodiment are: it achieves rapid removal of condensate at specific points, avoids the risk of electrochemical corrosion, and, since it is a local intervention, it does not affect the normal cooling of other areas.

[0067] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. This disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims. Thus, if these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A method for dynamically controlling the two-phase cooling flow field of copper wire in photovoltaic welding ribbon, characterized in that, include: Temperature monitoring of the cooling environment was conducted to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device. Based on the temperature data, calculate the required cooling load for the photovoltaic welding ribbon copper wire to reach the preset cooling target under the current motion state; Based on the spatial distribution characteristics of the required cooling load in the cooling environment, the cooling airflow dynamic state inside the cooling environment is determined; based on the cooling airflow dynamic state, a first air-cooling regulation is executed to adjust the working state of the air-cooling device in order to achieve global cooling uniformity control. Acquire real-time heat exchange data of the cooling medium in the liquid cooling device; predict the heat load trend of the liquid cooling device based on the real-time heat exchange data; and adjust the flow state of the cooling medium based on the heat load trend. The system acquires real-time humidity and temperature distribution data of the cooling environment to estimate the water vapor condensation state of the cooling environment. Based on the water vapor condensation state, it performs a second air-cooling control to adjust the airflow delivery state of the air-cooling device to the photovoltaic solder ribbon copper wire, in order to achieve local condensate removal control.

2. The method for dynamically controlling the two-phase cooling flow field of the photovoltaic welding ribbon copper wire as described in claim 1, characterized in that, The temperature monitoring of the cooling environment to obtain temperature data for the photovoltaic solder ribbon copper wire and the liquid cooling device includes: The cooling environment is subjected to thermal infrared imaging to obtain a global thermal infrared image of the cooling environment; the first temperature data of the photovoltaic solder ribbon copper wire and the liquid cooling device are extracted from the global thermal infrared image. Acquire the second temperature data from the distributed temperature sensing device inside the cooling environment; perform temperature correction based on the first temperature data and the second temperature data to obtain the temperature spatial distribution data of the photovoltaic welding strip copper wire and the liquid cooling device respectively.

3. The method for dynamic control of the two-phase cooling flow field of the photovoltaic welding ribbon copper wire as described in claim 2, characterized in that, Temperature corrections are performed on the first and second temperature data of the photovoltaic solder ribbon copper wire to obtain the spatial temperature distribution data of the photovoltaic solder ribbon copper wire, including: Step A1: Establish a three-dimensional spatial coordinate system for the cooling environment, and denote the spatial position of any point on the copper wire of the photovoltaic solder ribbon as... ,in , , These represent the coordinates of the point in the length, width, and height directions of the cooling environment, respectively. Step A2: Based on the thermal infrared image, extract the spatial position of the photovoltaic solder ribbon copper wire. First temperature data at the location Cooling ambient air temperature Thickness of oxide layer on copper wire surface and relative humidity Determine the location in this space infrared true temperature equivalent at the location The infrared true temperature equivalent refers to the value that is equivalent to the true surface temperature of the copper wire after compensation for ambient temperature, oxide layer thickness and humidity. Step A3: Obtain the second temperature data from the distributed temperature sensing device. Adaptive weighted fusion is performed with the aforementioned infrared true temperature equivalent to obtain the same spatial position on the copper wire. Dual-source symbiotic temperature distribution ,in , The total number of distributed temperature sensing devices; the dual-source co-existing temperature distribution refers to the spatial temperature data generated jointly by infrared heat source and sensor heat source information. Step A3 specifically includes A31-34: Step A31: Based on the spatial location of each sensor The coordinates of the point and the spatial point on the current copper wire The three-dimensional distance and the actual temperature measured by the sensor Raw temperature measurement at sensor coordinates using an infrared camera The absolute value of the deviation is used to determine the position of each sensor at the current spatial point. Fusion weights at the point ; Step A32: Based on the thickness of the oxide layer on the copper wire surface and ambient relative humidity Determine the adaptive fusion coefficients This is used to balance the contribution weights of infrared and sensor data; Step A33: Based on the sensor fusion weights determined above... Adaptive fusion coefficient Sensor measured temperature and infrared true temperature equivalent The final spatial location is determined by weighted average. Dual-source symbiotic temperature distribution ; Step A34: Calculate the dual-source co-occurrence temperature distribution. This data represents the spatial distribution of temperature of copper wire in photovoltaic solder ribbons.

4. The method for dynamic control of the two-phase cooling flow field of the copper wire in photovoltaic welding ribbon as described in claim 1, characterized in that, The step of calculating the required cooling load of the photovoltaic solder ribbon copper wire under the current operating state based on the temperature data includes: Based on the temperature spatial distribution data of the photovoltaic solder ribbon copper wire and the liquid cooling device, as well as the heat conduction properties between the photovoltaic solder ribbon copper wire and the liquid cooling device, a dynamic model of heat exchange between the photovoltaic solder ribbon copper wire and the liquid cooling device is constructed. Based on the heat exchange dynamic model, the required cooling load for the photovoltaic welding ribbon copper wire to reach the preset cooling target at the current wire drawing speed is calculated.

5. The method for dynamic control of the two-phase cooling flow field of the copper wire in photovoltaic welding ribbon as described in claim 4, characterized in that, The step of calculating the required cooling load for the photovoltaic solder ribbon copper wire to reach the preset cooling target at the current wire drawing speed, based on the heat exchange dynamic model, includes: Based on the structural and dimensional changes of the photovoltaic welding strip copper wire under the current wire drawing operation and the current wire drawing linear speed, the heat exchange dynamic model is modified. Based on the modified heat exchange dynamic model, the amount of heat absorbed by the liquid cooling device in the refrigeration cycle per unit time required for the photovoltaic welding ribbon copper wire to reach the preset cooling target temperature is calculated, and this heat value is taken as the required cooling load.

6. The method for dynamic control of the two-phase cooling flow field of the copper wire in photovoltaic welding ribbon as described in claim 1, characterized in that, The step of determining the cooling airflow dynamic state within the cooling environment based on the spatial distribution characteristics of the required cooling load in the cooling environment includes: Based on the three-dimensional spatial distribution of the required cooling load in the cooling environment, the target heat removal rate of each grid area in the cooling environment is generated. The three-dimensional spatial distribution of the required cooling load is allocated according to the actual spatial path of the copper wire in the cooling environment: the total required cooling load is divided by the total length of the copper wire in the cooling environment at the current moment to obtain the heat required to be removed per unit length, and then the target heat removal rate that the grid should bear is calculated based on the length of the copper wire contained in each grid. Based on the target heat removal rate, the dynamic state of the cooling airflow inside the cooling environment is determined; wherein, the dynamic state of the cooling airflow includes the global velocity distribution of the cooling airflow inside the cooling environment.

7. The method for dynamic control of the two-phase cooling flow field of the photovoltaic welding ribbon copper wire as described in claim 6, characterized in that, Based on the cooling airflow dynamic state, a first air-cooling control is performed to adjust the operating state of the air-cooling device, including: The airflow rate and temperature of the air-cooling device are adjusted according to the cooling airflow dynamic state and the airflow delivery operation mode of the air-cooling device inside the cooling environment.

8. The method for dynamic control of the two-phase cooling flow field of the photovoltaic welding ribbon copper wire as described in claim 1, characterized in that, Acquiring real-time heat exchange data of the cooling medium in the liquid cooling device, and predicting the heat load trend of the liquid cooling device based on the real-time heat exchange data, includes: The temperature change data of the cooling medium in the liquid cooling device is obtained throughout the entire flow path. Based on the temperature change data and the specific heat capacity of the cooling medium, the heat exchange data of the cooling medium throughout the entire flow path is determined. The heat exchange data includes the real-time heat exchange rate of each interval under the entire flow path, which is expressed as the amount of heat absorbed by the cooling medium in that interval per unit time. Based on the actual heat exchange data, the heat load trend of the entire flow path is predicted; wherein, the heat load trend refers to the heat accumulation trend of each interval under the entire flow path.

9. The method for dynamically controlling the two-phase cooling flow field of the copper wire in photovoltaic welding ribbon as described in claim 8, characterized in that, Adjusting the flow state of the cooling medium according to the heat load trend includes: Based on the heat load trend, determine the abnormal heat accumulation intervals under the entire flow path; Based on the distribution location of all abnormal heat accumulation intervals within the entire flow path, adjust the flow velocity of the cooling medium within the entire flow path.

10. The method for dynamically controlling the two-phase cooling flow field of the copper wire in photovoltaic welding ribbon as described in claim 1, characterized in that, Obtaining real-time water vapor data of the cooling environment to estimate the water vapor condensation state of the cooling environment specifically includes: Obtain real-time humidity distribution data and temperature distribution data of the cooling environment; Based on the actual humidity distribution data and the actual temperature distribution data, the water vapor condensation state of the cooling environment is determined; wherein, the water vapor condensation state includes the location where water vapor condensation occurs.

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