A system and method for measuring the thermal conductivity of a material of a compressor component

Abstract

The application discloses a kind of material thermal conductivity measurement system and method of compressor parts.Therein, measurement system includes: temperature measuring test piece, the material of temperature measuring test piece is same with the material of part, temperature measuring test piece is provided with multiple temperature measuring points;Temperature measuring device, temperature measuring device is configured to be placed in the hot furnace of heat treatment device, temperature measuring device includes mounting ring and multiple temperature sensors, mounting ring is used to bear temperature measuring test piece, and temperature sensor is used to measure the temperature of temperature measuring point;Processing device, with temperature sensor signal connection, configured to determine target thermal conductivity according to the measurement information of temperature sensor.Thereby, target thermal conductivity determined according to temperature measuring test piece can be equivalent to target thermal conductivity of part in the same heat treatment whole process, improve the measurement precision of the material thermal conductivity of part, in turn, it is favorable to improve the accuracy of simulation result.

Description

Technical Field

[0001] This application relates to the field of compressor parts technology, and in particular to a system and method for measuring the thermal conductivity of compressor parts. Background Technology

[0002] With the development of numerical simulation technology, simulating heat treatment processes using computer simulation has become an important method in the scientific research field. This method can save a lot of experimental costs and time, while providing more comprehensive and accurate data support.

[0003] In the process of simulating the temperature field of heat treatment, finite element analysis technology is used to accurately simulate the temperature field of the workpiece during the heat treatment process, so as to predict and optimize the heat treatment process, which can reduce the risk of deformation and cracking, and improve product quality and production efficiency.

[0004] In heat treatment simulations, thermal conductivity, as a fundamental thermophysical property, directly affects the accuracy of the simulation results. Since the thermal conductivity varies among different materials and at different temperatures, the thermal conductivity input based on empirical values ​​will differ from the actual thermal conductivity under real-world conditions, thus impacting the simulation results. Therefore, how to conduct in-depth research on the accuracy of the input thermal conductivity through actual measurements is a pressing technical problem that needs to be solved. Summary of the Invention

[0005] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This section of the application is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] This application aims to address at least one of the technical problems existing in the prior art or related technologies.

[0007] An embodiment of this application provides a material thermal conductivity measurement system for compressor parts, comprising: a temperature measuring test piece, the material of which is the same as that of the part, and the temperature measuring test piece having multiple temperature measuring points; a temperature measuring device configured to be placed in a furnace of a heat treatment apparatus, the temperature measuring device including a mounting ring and multiple temperature sensors, the mounting ring for supporting the temperature measuring test piece, and the temperature sensors for measuring the temperature of the measuring points; and a processing device connected to the temperature sensors and configured to determine a target thermal conductivity based on the measurement information from the temperature sensors.

[0008] For example, the temperature measurement test piece is a cylinder with a hemispherical structure at one end. The temperature measurement test piece is provided with a temperature measurement groove corresponding to the temperature measurement point, and the temperature sensor is arranged at the temperature measurement point through the temperature measurement groove. The temperature measurement point includes a sampling point and a verification point of equal depth. The sampling point includes a first sampling point that coincides with the center of the hemispherical structure and a second sampling point located on the surface of the hemispherical structure. The verification point is located at the midpoint of the line connecting the first sampling point and the second sampling point.

[0009] For example, the temperature measuring device further includes: a fixing ring connected to the mounting ring and located on the side of the mounting ring away from the temperature measuring test piece, the mounting ring being located at the end of the temperature measuring test piece away from the hemispherical structure; a protective cover connected to the side of the fixing ring away from the mounting ring, the protective cover, the fixing ring, and the temperature measuring test piece forming a heat-insulating space; and a wire limiting component located within the heat-insulating space, constrained by the protective cover and the temperature measuring test piece, the wire limiting component having a wire passage space, a first wire passage hole being opened at the relative position of the protective cover and the wire limiting component, the connecting wire passing through the first wire passage hole and the wire passage space to be electrically connected to the temperature sensor.

[0010] For example, the wire limiting component includes: a limiting block with a wedge-shaped through groove; and a wire clamping block with a wedge-shaped protrusion having a through hole in the middle. The wedge-shaped protrusion has multiple opening slots on the side wall of the through hole. The wedge-shaped protrusion is movably embedded in the wedge-shaped through groove. The limiting block and the wire clamping block together form a wire passage space.

[0011] For example, the temperature measuring device further includes: a support block and a base connected to the protective cover, the support block being located between the base and the protective cover and avoiding the first wire hole, the base, the support block, and the protective cover forming a protective space communicating with the wire hole.

[0012] For example, the processing device is configured to: retrieve the thermal conductivity parameter of the pre-stored temperature field control equation based on the measurement information of the temperature sensor at the sampling point; substitute the retrieved thermal conductivity parameter into the temperature field control equation and determine the calculated temperature of the verification point; and determine the retrieved thermal conductivity parameter as the target thermal conductivity and the measured temperature of the verification point as the detection temperature of the temperature sensor at the verification point, based on the fact that the difference between the calculated temperature and the measured temperature of the verification point meets the preset requirements.

[0013] For example, the axial length of the temperature measuring test piece is greater than or equal to twice the diameter of the hemispherical structure; and / or, a first insulation element is arranged in the insulation space; and / or, a second insulation element is arranged between the limiting block and the clamping block.

[0014] An embodiment of this application also provides a method for measuring the thermal conductivity of a compressor component, utilizing the thermal conductivity measurement system for compressor components described in any of the foregoing claims. The method includes: The temperature measuring device carrying the temperature measuring test piece is placed in the hot furnace of the heat treatment device for heat treatment; The processing device inverts the thermal conductivity parameters of the pre-stored temperature field control equation based on the measurement information of the temperature sensor at the sampling point. It then substitutes the inverted thermal conductivity parameters into the temperature field control equation and determines the calculated temperature of the verification point. Based on the fact that the difference between the calculated temperature and the measured temperature at the verification point meets the preset requirements, the inverted thermal conductivity parameters are determined as the target thermal conductivity, and the measured temperature at the verification point is the detection information of the temperature sensor at the verification point.

[0015] For example, the method further includes: Based on the one-dimensional unsteady heat conduction differential equation in spherical coordinates, and defining the material as isotropic, without internal heat sources, and with thermophysical parameters constant within a small temperature range, the origin is taken as the center of the hemispherical structure of the temperature measurement test piece, and the radial coordinate r increases from 0 to the outer radius R. The temperature field governing equation is established as follows: Where: T is temperature, t is time, ρ is material density, c is specific heat capacity, and λ is thermal conductivity.

[0016] For example, the steps for ensuring that the difference between the calculated temperature and the measured temperature at the verification point meets preset requirements include: The root mean square relative error function between the calculated and measured temperatures at the verification point is established as follows: The preset requirement is that ε is less than or equal to 15%; where: To verify the temperature detected by the temperature sensor at the verification point, The calculated temperature at the verification point, Let ε be the i-th time point, ε be the relative error, and N be the total number of samples.

[0017] The embodiments of this application provide a material thermal conductivity measurement system and method for compressor parts, including a temperature-measuring test piece, a temperature-measuring device, and a processing device. The temperature-measuring device and the temperature-measuring test piece it carries are placed together in a furnace of a heat treatment apparatus. Using the temperature sensor of the temperature-measuring device, the temperature-time change history of multiple temperature points on the test piece can be monitored in real time and synchronously throughout the entire heat treatment process. Thus, the processing device can determine the target thermal conductivity of the test piece based on the transient temperature data of multiple temperature points measured by the temperature sensor. Since the material of the temperature-measuring test piece is the same as that of the part, the target thermal conductivity determined based on the temperature-measuring test piece can be equated to the target thermal conductivity of the part throughout the same heat treatment process. Compared with the prior art that determines the target thermal conductivity of the part based on empirical values, this significantly improves the accuracy of the target thermal conductivity of the part. Therefore, based on the target thermal conductivity determined by the temperature measuring test piece, temperature measuring device, and processing device under actual working conditions, and by feeding back and updating the material model of the heat treatment simulation software, the simulation software can ultimately predict the internal temperature field distribution of compressor parts in the actual heat treatment process with high accuracy, providing a precise basis for process optimization and making it suitable for widespread application.

[0018] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. Wherein: Figure 1 One of the structural schematic diagrams of the temperature measuring test piece provided in the embodiments of this application is shown; Figure 2 One of the cross-sectional views of the temperature measuring test specimen provided in the embodiments of this application is shown; Figure 3 A second schematic diagram of the structure of the temperature measuring test piece provided in an embodiment of this application is shown; Figure 4 The third schematic diagram of the structure of the temperature measuring test piece provided in the embodiments of this application is shown; Figure 5 One of the structural schematic diagrams of the temperature measuring test piece and temperature measuring device provided in the embodiments of this application is shown; Figure 6One of the cross-sectional views of the temperature measuring test specimen and temperature measuring device provided in the embodiments of this application is shown; Figure 7 One of the structural schematic diagrams of the mounting ring provided in the embodiments of this application is shown; Figure 8 A second schematic diagram of the mounting ring provided in an embodiment of this application is shown; Figure 9 One of the cross-sectional views of the mounting ring provided in an embodiment of this application is shown; Figure 10 One of the structural schematic diagrams of the fixing ring provided in the embodiments of this application is shown; Figure 11 A second schematic diagram of the structure of the fixing ring provided in an embodiment of this application is shown; Figure 12 One of the cross-sectional views of the retaining ring provided in an embodiment of this application is shown; Figure 13 One of the structural schematic diagrams of the protective cover provided in an embodiment of this application is shown; Figure 14 A second schematic diagram of the structure of the protective cover provided in an embodiment of this application is shown; Figure 15 One of the cross-sectional views of the protective cover provided in an embodiment of this application is shown; Figure 16 One of the structural schematic diagrams of the limiting block provided in the embodiments of this application is shown; Figure 17 A second schematic diagram of the structure of the limiting block provided in an embodiment of this application is shown; Figure 18 One of the structural schematic diagrams of the wire clamping block provided in the embodiments of this application is shown; Figure 19 A second schematic diagram of the wire clamping block provided in an embodiment of this application is shown; Figure 20 One of the cross-sectional views of the clamping block provided in an embodiment of this application is shown; Figure 21 One of the structural schematic diagrams of the support block provided in the embodiments of this application is shown; Figure 22 A second schematic diagram of the structure of the support block provided in an embodiment of this application is shown; Figure 23 One of the cross-sectional views of the support block provided in an embodiment of this application is shown; Figure 24 A schematic diagram of the structure of a base provided in an embodiment of this application is shown; Figure 25 A second schematic diagram of the structure of the base provided in an embodiment of this application is shown; Figure 26 One of the cross-sectional views of the base provided in an embodiment of this application is shown; Figure 27 One of the schematic diagrams of the measurement system provided in this application, located inside a hot furnace, is shown. Figure 28 One of the flowcharts of a method for measuring the thermal conductivity of a compressor component provided in an embodiment of this application is shown.

[0020] in, Figures 1 to 27 The correspondence between the reference numerals and component names in the attached drawings is as follows: 100 Temperature measurement test piece, 110 Temperature measurement point, 111 First sampling point, 112 Second sampling point, 113 Verification point, 120 Hemispherical structure, 130 Temperature measurement groove, 140 Annular boss, 200 Temperature measurement device, 210 Mounting ring, 220 Temperature sensor, 230 Fixing ring, 240 Protective cover, 241 First wire passage hole, 250 Limiting block, 251 Wedge-shaped through groove, 260 Wire clamping block, 261 Wedge-shaped protrusion, 262 Through hole, 263 Opening groove, 270 Support block, 280 Base, 300 Processing device, 400 Hot furnace, 500 Tray. Detailed Implementation

[0021] The following description provides numerous specific details to offer a more thorough understanding of the technical solutions provided in this application. However, it will be apparent to those skilled in the art that the technical solutions provided in this application can be implemented without one or more of these details.

[0022] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0023] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art.

[0024] like Figure 1 , Figure 5 , Figure 6 , Figure 27 As shown in the first aspect of this application, an embodiment provides a material thermal conductivity measurement system for compressor parts, comprising: a temperature measuring test piece 100, the material of which is the same as that of the part, and the temperature measuring test piece 100 having a temperature measuring point 110; a temperature measuring device 200, configured to be placed in a furnace 400 of a heat treatment apparatus, the temperature measuring device 200 including a mounting ring 210 and a plurality of temperature sensors 220, the mounting ring 210 for supporting the temperature measuring test piece 100, and the temperature sensors 220 for measuring the temperature of the temperature measuring point 110; and a processing device 300, signal-connected to the temperature sensors 220, configured to determine a target thermal conductivity based on the measurement information from the temperature sensors 220.

[0025] The thermal conductivity measurement system for compressor parts provided in this application includes a temperature-measuring test piece 100, a temperature-measuring device 200, and a processing device 300. The temperature-measuring device 200 and the temperature-measuring test piece 100 it carries can be placed together in the furnace 400 of a heat treatment apparatus. Using the temperature sensor 220 of the temperature-measuring device 200, the temperature-time change history of multiple temperature measurement points 110 of the temperature-measuring test piece 100 can be monitored in real time and synchronously throughout the entire heat treatment process. Thus, the processing device 300 can determine the target thermal conductivity of the temperature-measuring test piece 100 based on the transient temperature data of the multiple temperature measurement points 110 measured by the temperature sensor 220. Since the material of the temperature-measuring test piece 100 is the same as the material of the part, the target thermal conductivity determined based on the temperature-measuring test piece 100 can be equated to the target thermal conductivity of the part throughout the same heat treatment process. Compared with the prior art that determines the target thermal conductivity of the part based on empirical values, this greatly improves the accuracy of the target thermal conductivity of the part. Therefore, based on the target conductivity determined by the temperature measuring test piece 100, temperature measuring device 200 and processing device 300 under actual working conditions, the feedback is updated to the material model of the heat treatment simulation software. After correction, the simulation software can finally predict the internal temperature field distribution of compressor parts in the actual heat treatment process with high accuracy, providing a precise basis for process optimization and suitable for widespread application.

[0026] Furthermore, since the temperature test piece is smaller in size than the compressor parts, the temperature measuring device 200 can support the temperature test piece 100, and the temperature measuring device 200 and the temperature test piece 100 can be placed together in the furnace 400 of the heat treatment device. Compared with the large parts that are inconvenient to measure the temperature under actual working conditions, the convenience of temperature measurement is improved.

[0027] Furthermore, such as Figure 27 As shown, the temperature measuring device 200 can be placed in the hot furnace 400, and the temperature sensor 220 is connected to the processing device 300, so that the entire measurement system can work stably in a high temperature and rapid cooling environment, and data can be collected synchronously to ensure good measurement accuracy.

[0028] The temperature sensor 220 can be at least one of a thermocouple, a resistance temperature detector (RTD), or an infrared sensor. The number of temperature measurement points 110 can be multiple, and these points can be located at various key positions (such as near the surface, the core, or random locations) inside and on the surface of the temperature-measuring test piece 100, to improve the accuracy of the target thermal conductivity measurement.

[0029] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments provided in this application, the temperature measuring test piece 100 is a cylinder, one end of which is a hemispherical structure 120. The temperature measuring test piece 100 is provided with a temperature measuring groove 130 corresponding to the temperature measuring point 110. The temperature sensor 220 is arranged at the temperature measuring point 110 through the temperature measuring groove 130. The temperature measuring point 110 includes sampling points and verification points 113 of equal depth. The sampling points include a first sampling point 111 that coincides with the center of the hemispherical structure 120 and a second sampling point 112 located on the surface of the hemispherical structure 120. The verification point 113 is located at the midpoint of the line connecting the first sampling point 111 and the second sampling point 112.

[0030] This embodiment provides the specific structure of the temperature measuring test piece 100. The temperature measuring test piece 100 is a cylinder with a hemispherical structure 120 at one end. To reduce the influence of temperature changes on non-measuring surfaces, the size of the portion of the temperature measuring test piece 100 exposed to the actual heat treatment environment is required to be greater than or equal to twice the diameter of the hemispherical structure 120. Figure 3 As shown, the axial length of the temperature measuring test piece 100 is H, and the radius of the hemispherical structure 120 is R. H is greater than or equal to 4R, that is, the axial length of the temperature measuring test piece 100 is greater than or equal to twice the diameter of the hemispherical structure 120.

[0031] The temperature measurement point 110 may include multiple sampling points and verification points 113 of equal depth, where depth refers to the axial direction. Specifically, the first sampling point 111 is located at the center of the hemispherical structure 120, and the second sampling point 112 is located on or near the surface of the hemispherical structure 120. The verification point 113 may be located at the midpoint of the line connecting the first sampling point 111 and the second sampling point 112. That is, the second sampling point 112 and the verification point 113 are at the same depth as the center of the hemispherical structure to ensure good measurement accuracy.

[0032] The temperature measuring test piece 100 has a temperature measuring groove 130 connected to the temperature measuring point 110. The temperature sensor 220 is arranged at the temperature measuring point 110 through the temperature measuring groove 130. For example, the temperature measuring thermocouple is arranged at the first sampling point 111, the second sampling point 112 and the verification point 113 through the temperature measuring groove 130, and the temperature measuring data is collected through the temperature measuring thermocouple.

[0033] like Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, in some embodiments provided in this application, the temperature measuring device 200 further includes: a fixing ring 230, which is connected to the mounting ring 210 and located on the side of the mounting ring 210 away from the temperature measuring test piece 100, and the mounting ring 210 is located at the end of the temperature measuring test piece 100 away from the hemispherical structure 120; a protective cover 240, which is connected to the side of the fixing ring 230 away from the mounting ring 210, and the protective cover 240, the fixing ring 230, and the temperature measuring test piece 100 together form a heat insulation space; and a wire limiting assembly, which is located in the heat insulation space and is limited by the protective cover 240 and the temperature measuring test piece 100. The wire limiting assembly is provided with a wire passage space, and a first wire passage hole 241 is opened at the relative position of the protective cover 240 and the wire limiting assembly. The connecting wire passes through the first wire passage hole 241 and the wire passage space and is electrically connected to the temperature sensor 220.

[0034] This embodiment provides the specific structure of a temperature measuring device 200. The temperature measuring device 200 includes a mounting ring 210, a fixing ring 230, a protective cover 240, and a wire limiting assembly. A temperature measuring test piece 100 is mounted on the mounting ring 210 and connected to the mounting ring 210 via the fixing ring 230, thereby locking and fixing the mounting ring 210, fixing ring 230, and temperature measuring test piece 100. The protective cover 240 and fixing ring 230 are connected, creating space between the protective cover 240 and the temperature measuring test piece 100 for installing the wire limiting assembly. The connecting wire can be connected to the temperature sensor 220 via the wire limiting assembly. It is understood that the connecting wire can extend to the outside of the temperature measuring device 200 and the outside of the furnace 400, allowing the connecting wire to signal-connect to the processing device 300 outside the furnace 400, enabling the processing device 300 to receive and process the temperature measurement signal collected by the temperature sensor 220 in real time. It is understood that in some examples, the processing device 300 may be located inside the furnace.

[0035] Among them, such as Figure 7 , Figure 8 , Figure 9As shown, the main function of the mounting ring 210 is to hold the temperature measuring test piece 100. Specifically, an annular boss 140 is provided on the periphery of the end of the temperature measuring test piece 100 away from the hemispherical structure 120. The mounting ring 210 is fitted onto the outside of the temperature measuring test piece 100 from the end of the hemispherical structure 120 and abuts against the annular boss 140. It can be understood that the stop size of the mounting ring 210 corresponds to the outer diameter of the hemispherical structure 120 of the temperature measuring test piece 100, and a clearance fit is sufficient.

[0036] Among them, such as Figure 10 , Figure 11 , Figure 12 As shown, after the fixing ring 230 is connected to the mounting ring 210 by bolts, the mounting ring 210, the fixing ring 230, and the temperature measuring test piece 100 are tightly connected together. Figure 13 , Figure 14 , Figure 15 As shown, the protective cover 240 is used to connect the fixed ring 230, the mounting ring 210, and the temperature measuring test piece 100 together, and to leave space with the fixed ring 230 and the temperature measuring test piece 100 to install the wire limiting component. The fixed ring 230 is provided with a first wire passage hole 241, which facilitates the connection of the wire through the wire limiting component and the first wire passage hole 241 to the temperature sensor 220.

[0037] The fixing ring 230, the protective cover 240 and the temperature measuring test piece 100 together form a heat insulation space. A first heat insulation component, such as heat insulation cotton, can be added inside the heat insulation space to reduce the heat on the end face of the temperature measuring test piece 100, thereby reducing the impact of end face heat transfer on the temperature measurement results and improving measurement accuracy.

[0038] like Figure 16 , Figure 17 , Figure 18 , Figure 19 , Figure 20 As shown, in some embodiments provided in this application, the wire limiting component includes: a limiting block 250, which is provided with a wedge-shaped through groove 251; and a wire clamping block 260, which is provided with a wedge-shaped protrusion 261 having a through hole 262 in the middle. The wedge-shaped protrusion 261 has multiple opening grooves 263 on the side wall of the through hole 262. The wedge-shaped protrusion 261 is movably embedded in the wedge-shaped through groove 251. The limiting block 250 and the wire clamping block 260 together form a wire passage space.

[0039] This embodiment provides a specific structure of the wire limiting assembly. The wire limiting assembly includes a limiting block 250 and a wire clamping block 260. The limiting block 250 and the wire clamping block 260 are used together, and their main function is to install the temperature sensor 220 or its connecting wire, so that the temperature sensor 220 can be fixed to the temperature measuring point 110 position in the temperature measuring tank 130.

[0040] The clamping block 260 is provided with a wedge-shaped protrusion 261 with a through hole 262 in the middle. The wedge-shaped protrusion 261 has a circumferential sampling of multiple open slots 263. The wedge-shaped protrusion 261 can be movably inserted into the wedge-shaped through slot 251 of the limiting block 250. The clamping block 260 and the limiting block 250 together form a wire passage space, so that the connecting wire passes through the wire passage space and the first wire passage hole 241 on the protective cover 240 and is electrically connected to the temperature sensor.

[0041] like Figure 6 As shown, the limiting block 250 is located on the side of the clamping block 260 near the temperature measuring test piece 100. During the connection between the protective cover 240 and the fixing ring 230, the wedge-shaped protrusion 261 moves towards the temperature measuring test piece 100 in the wedge-shaped through groove 251. The groove wall of the wedge-shaped through groove 251 contacts the outer surface of the wedge-shaped protrusion 261, which will squeeze and reduce the opening of the opening groove 263. When the protective cover 240 and the fixing ring 230 are installed in place, the opening of the opening groove 263 is smaller or closed, clamping the connecting wire in the through hole 262. Thus, it can be ensured that the temperature sensor 220 is reliably and stably maintained at the temperature measuring point position, ensuring temperature measuring accuracy.

[0042] Furthermore, the limiting block 250 and the clamping block 260 are fitted together by wedge-shaped surfaces, and a second insulation component is disposed between the limiting block 250 and the clamping block 260. Through the wedge-shaped structure and the second insulation component, the connection wire is simultaneously insulated and clamped. Specifically, the second insulation component can be insulation cotton, which has clearance to allow the connection wire to pass through smoothly.

[0043] like Figure 5 , Figure 6 , Figure 21 , Figure 22 , Figure 23 , Figure 24 , Figure 25 , Figure 26 , Figure 27 As shown, in some embodiments provided in this application, the temperature measuring device 200 further includes: a support block 270 and a base 280 connected to the protective cover 240. The support block 270 is located between the base 280 and the protective cover 240 and avoids the first wire hole 241. The base 280, the support block 270, and the protective cover 240 together form a protective space that communicates with the wire hole.

[0044] In this embodiment, bolts pass through the support block 270 and the base 280, connecting to the protective cover 240. The temperature measuring device 200 can be placed into the furnace 400 of the heat treatment apparatus via the base 280. Specifically, the base 280 can be supported on the tray 500 inside the furnace 400, thereby allowing the tray 500 to support the entire temperature measuring device 200 and the temperature-measuring test piece 100 via the base 280. It is understood that the processing device 300 can be located inside the furnace 400, supported on the tray 500, or the processing device 300 can be located outside the furnace 400, interacting with the temperature sensor 220 inside the furnace 400.

[0045] Since the two ends of the support block 270 are connected to the base 280 and the protective cover 240 respectively, a protective space is formed between the base 280 and the protective cover 240. This space is used to protect the part of the connecting wire that extends to the outside of the protective cover 240, preventing the connecting wire from getting caught on or dragged by other foreign objects, which could cause the temperature sensor 220 to move or be damaged. This ensures good measurement accuracy, improves the service life of the temperature sensor 220, and thus improves the service life and measurement accuracy of the measurement system.

[0046] In some embodiments provided in this application, the processing device 300 is configured to: invert the thermal conductivity parameters of the pre-stored temperature field control equation based on the measurement information of the temperature sensor 220 at the sampling point; substitute the inverted thermal conductivity parameters into the temperature field control equation and determine the calculated temperature of the verification point 113; based on the fact that the difference between the calculated temperature and the measured temperature of the verification point 113 meets the preset requirements, determine the inverted thermal conductivity parameters as the target thermal conductivity, and the measured temperature of the verification point 113 as the detection information of the temperature sensor 220 at the verification point 113.

[0047] The processing device 300 contains a pre-stored temperature field control equation. Specifically, based on the one-dimensional unsteady-state heat conduction differential equation in spherical coordinates, the material is defined as isotropic, without internal heat sources, and with its thermal properties constant within a small temperature range. Taking the center of the hemispherical structure 120 of the temperature measuring test piece 100 as the origin, and the radial coordinate r increasing from 0 to the outer radius R, the temperature field control equation is established as follows: Where: T is temperature (K or °C), t is time (s), ρ is material density (kg / m³), c is specific heat capacity J / (kg·K); λ is thermal conductivity (W / (m·K)).

[0048] In this embodiment, the processing device 300 inputs the measurement information from the temperature sensor 220 at the sampling point into the temperature field control equation to obtain the thermal conductivity parameter. Then, the obtained thermal conductivity parameter is substituted back into the temperature field control equation, and the calculated temperature of the verification point 113 is recalculated. Next, it is determined whether the difference between the calculated temperature and the measured temperature at the verification point 113 meets a preset requirement, where the measured temperature at the verification point 113 is the temperature measured by the temperature sensor 220 at the verification point 113. If the difference between the calculated temperature and the measured temperature at the verification point 113 meets the preset requirement, it indicates that the obtained thermal conductivity data is reliable and can be used for subsequent numerical simulations. Therefore, the obtained thermal conductivity parameter can be determined as the target thermal conductivity, i.e., the thermal conductivity of the part.

[0049] like Figure 28 As shown in the embodiments of this application, a method for measuring the thermal conductivity of compressor parts is also provided. Utilizing the thermal conductivity measurement system for compressor parts from any of the foregoing embodiments, the method includes: Step 2810: Place the temperature measuring device carrying the temperature measuring test piece into the hot furnace of the heat treatment device for heat treatment.

[0050] In this embodiment, a temperature-measuring test piece 100 made of the same material as the part is mounted on a temperature-measuring device 200, and the testing device, along with the temperature-measuring test piece 100, is placed in a heat treatment furnace 400 for heat treatment. The actual heat treatment conditions of the temperature-measuring test piece 100 can be the same as those of the part; the temperature-measuring test piece 100 will undergo the entire heat treatment process of heating, holding, and cooling along with the furnace 400. Thus, by determining the thermal conductivity of the temperature-measuring test piece 100, which is made of the same material and under the same actual conditions, the thermal conductivity of the part can be indirectly determined, improving the accuracy of the part's thermal conductivity determination.

[0051] Step 2820: The processing device inverts the thermal conductivity parameters of the pre-stored temperature field control equation based on the measurement information of the temperature sensor at the sampling point, substitutes the inverted thermal conductivity parameters into the temperature field control equation, and determines the calculated temperature of the verification point. Based on the fact that the difference between the calculated temperature and the measured temperature of the verification point meets the preset requirements, the inverted thermal conductivity parameters are determined as the target thermal conductivity, and the measured temperature of the verification point is the detection information of the temperature sensor at the verification point.

[0052] The processing device 300 contains a pre-stored temperature field control equation. Specifically, based on the one-dimensional unsteady-state heat conduction differential equation in spherical coordinates, the material is defined as isotropic, without internal heat sources, and with its thermal properties constant within a small temperature range. Taking the center of the hemispherical structure 120 of the temperature measuring test piece 100 as the origin, and the radial coordinate r increasing from 0 to the outer radius R, the temperature field control equation is established as follows: Where: T is temperature (K or °C), t is time (s), ρ is material density (kg / m³), c is specific heat capacity J / (kg·K); λ is thermal conductivity (W / (m·K)).

[0053] In this embodiment, the processing device 300 inputs the measurement information from the temperature sensor 220 at the sampling point into the temperature field control equation to obtain the thermal conductivity parameter. Then, the obtained thermal conductivity parameter is substituted back into the temperature field control equation, and the calculated temperature of the verification point 113 is recalculated. Next, it is determined whether the difference between the calculated temperature and the measured temperature at the verification point 113 meets a preset requirement, where the measured temperature at the verification point 113 is the temperature measured by the temperature sensor 220 at the verification point 113. If the difference between the calculated temperature and the measured temperature at the verification point 113 meets the preset requirement, it indicates that the obtained thermal conductivity data is reliable and can be used for subsequent numerical simulations. Therefore, the obtained thermal conductivity parameter can be determined as the target thermal conductivity, i.e., the thermal conductivity of the part.

[0054] In some embodiments provided in this application, the step of ensuring that the difference between the calculated temperature and the measured temperature at the verification point meets a preset requirement includes: establishing the root mean square relative error function of the calculated temperature and the measured temperature at the verification point as follows: The preset requirement is that ε is less than or equal to 15%; where: To verify the temperature detected by the temperature sensor at the verification point, The calculated temperature at the verification point, Let ε be the i-th time point, ε be the relative error, and N be the total number of samples.

[0055] In this embodiment, the difference between the calculated temperature and the measured temperature of verification point 113 is compared by establishing a root mean square relative error function between the calculated temperature and the measured temperature of verification point 113. When the root mean square relative error ε between the calculated temperature and the measured temperature of verification point 113 is less than or equal to 15%, it indicates that the thermal conductivity data obtained by inversion is reliable, and the thermal conductivity parameter obtained by inversion can be determined as the target thermal conductivity.

[0056] In some embodiments, the method further includes: sending a prompt message if the difference between the calculated temperature and the measured temperature at the verification point does not meet a preset requirement.

[0057] In this embodiment, if the difference between the calculated temperature and the measured temperature at verification point 113 does not meet the preset requirements, such as ε>15%, the measurement system can send a prompt message indicating that there may be a fault in the measurement system. This fault could be poor contact of the temperature sensor 220, a malfunction of the temperature sensor 220, etc. The user can check and troubleshoot the fault and then retest until the difference between the calculated temperature and the measured temperature at verification point 113 meets the preset requirements.

[0058] Furthermore, the preset requirement of ε being less than or equal to 15% is determined by comprehensively considering the error sources in the table below. In some embodiments, the preset requirement may also be ε being less than or equal to other values.

[0059] Table 1. Analysis of the sources and contributions of errors in thermal conductivity measurement.

[0060] The method for measuring the thermal conductivity of compressor parts provided in this application involves placing a temperature measuring device 200 and a temperature measuring test piece 100 made of the same material as the part in a furnace 400 of a heat treatment device for heat treatment. The actual working conditions of the heat treatment of the temperature measuring test piece 100 can be the same as those of the part. Thus, during the entire heat treatment process, the treatment device 300 can monitor the temperature-time change history of the first sampling point 111, the second sampling point 112, and the verification point 113 of the temperature measuring test piece 100 in real time and synchronously through the temperature sensor 220. Based on these in-situ measured multi-point transient temperature data, an inverse heat conduction problem solving algorithm is used to obtain the thermal conductivity parameters of the temperature field control equation pre-existing in the processing device 300 through inversion. The obtained thermal conductivity parameters are then substituted back into the temperature field control equation, and the calculation temperature of verification point 113 is determined. Then, based on whether the difference between the calculated temperature and the measured temperature of verification point 113 meets the preset requirements, it is determined whether the obtained thermal conductivity parameters are the target thermal conductivity. In this way, the thermal conductivity value of the material under the current specific heat treatment process state can be calculated, thereby improving the measurement accuracy of the target thermal conductivity.

[0061] Understandably, the measured target thermal conductivity under actual operating conditions is fed back and updated into the material model of the heat treatment simulation software. After correction, the simulation software can ultimately predict the internal temperature field distribution of compressor parts with high accuracy during the actual heat treatment process, providing a precise basis for process optimization. This device can operate stably in high-temperature rapid cooling environments and collect data synchronously, making it suitable for widespread application.

[0062] In this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise expressly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can mean a fixed connection, a detachable connection, or an integral connection; "link" can mean a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0063] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0064] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0065] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A system for measuring the thermal conductivity of materials used in compressor parts, characterized in that, include: A temperature measuring test piece, wherein the material of the temperature measuring test piece is the same as that of the part, and the temperature measuring test piece is provided with multiple temperature measuring points; A temperature measuring device is configured to be placed in the furnace of a heat treatment apparatus. The temperature measuring device includes a mounting ring and multiple temperature sensors. The mounting ring is used to support the temperature measuring test piece, and the temperature sensors are used to measure the temperature of the measuring point. The processing device is connected to the temperature sensor signal and configured to determine the target thermal conductivity based on the measurement information from the temperature sensor.

2. The material thermal conductivity measurement system for compressor parts according to claim 1, characterized in that, The temperature measuring test piece is a cylinder with a hemispherical structure at one end. The temperature measuring test piece is provided with a temperature measuring groove corresponding to the temperature measuring point, and the temperature sensor is arranged at the temperature measuring point through the temperature measuring groove. The temperature measurement point includes a sampling point and a verification point of equal depth. The sampling point includes a first sampling point that coincides with the center of the hemispherical structure and a second sampling point located on the surface of the hemispherical structure. The verification point is located at the midpoint of the line connecting the first sampling point and the second sampling point.

3. The material thermal conductivity measurement system for compressor parts according to claim 2, characterized in that, The temperature measuring device also includes: A fixing ring is connected to the mounting ring and is located on the side of the mounting ring away from the temperature measuring test piece. The mounting ring is located at the end of the temperature measuring test piece away from the hemispherical structure. A protective cover is attached to the side of the fixing ring away from the mounting ring, and the protective cover, the fixing ring, and the temperature measuring test piece together form a heat insulation space; The wire limiting component is located within the heat insulation space and is constrained by the protective cover and the temperature measuring test piece. The wire limiting component is provided with a wire passage space. A first wire passage hole is opened at the position opposite to the protective cover and the wire limiting component. The connecting wire passes through the first wire passage hole and the wire passage space and is electrically connected to the temperature sensor.

4. The material thermal conductivity measurement system for compressor parts according to claim 3, characterized in that, The wire limiting component includes: The limiting block is equipped with a wedge-shaped through groove; The wire clamping block has a wedge-shaped protrusion with a through hole in the middle. The wedge-shaped protrusion has multiple opening slots on the side wall of the through hole. The wedge-shaped protrusion is movably embedded in the wedge-shaped through slots. The limiting block and the wire clamping block together form the wire passage space.

5. The material thermal conductivity measurement system for compressor parts according to claim 3, characterized in that, The temperature measuring device also includes: A support block and a base are connected to the protective cover. The support block is located between the base and the protective cover and avoids the first wire hole. The base, the support block, and the protective cover together form a protective space that communicates with the wire hole.

6. The material thermal conductivity measurement system for compressor parts according to claim 2, characterized in that, The processing device is configured as follows: Based on the measurement information from the temperature sensor at the sampling point, the thermal conductivity parameters of the pre-stored temperature field control equation are retrieved. Substitute the thermal conductivity parameters obtained from the inversion into the temperature field control equation, and determine the calculated temperature of the verification point; Based on the fact that the difference between the calculated temperature and the measured temperature at the verification point meets the preset requirements, the thermal conductivity parameter obtained by inversion is determined as the target thermal conductivity, and the measured temperature at the verification point is the detection temperature of the temperature sensor at the verification point.

7. The material thermal conductivity measurement system for compressor parts according to claim 4, characterized in that, The axial length of the temperature measuring test piece is greater than or equal to twice the diameter of the hemispherical structure; and / or; A first insulation component is arranged within the heat-insulating space; And / or, A second heat-insulating component is arranged between the limiting block and the clamping block.

8. A method for measuring the thermal conductivity of a compressor component, characterized in that, The method, using the material thermal conductivity measurement system for compressor parts as described in any one of claims 1 to 7, comprises: The temperature measuring device carrying the temperature measuring test piece is placed in the hot furnace of the heat treatment device for heat treatment; The processing device retrieves the thermal conductivity parameter of the pre-stored temperature field control equation based on the measurement information from the temperature sensor at the sampling point. It then substitutes the retrieved thermal conductivity parameter into the temperature field control equation and determines the calculated temperature of the verification point. If the difference between the calculated temperature and the measured temperature at the verification point meets a preset requirement, the retrieved thermal conductivity parameter is determined as the target thermal conductivity, and the measured temperature at the verification point is the detection information from the temperature sensor at the verification point.

9. The method for measuring the thermal conductivity of compressor parts according to claim 8, characterized in that, The method further includes: Based on the one-dimensional unsteady heat conduction differential equation in spherical coordinates, and defining the material as isotropic, without internal heat sources, and with thermal properties constant within a small temperature range, the temperature field control equation is established with the center of the hemispherical structure of the temperature measuring test piece as the origin, and the radial coordinate r increasing from 0 to the outer radius R: Where: T is temperature, t is time, ρ is material density, c is specific heat capacity, and λ is thermal conductivity.

10. The method for measuring the thermal conductivity of compressor parts according to claim 8, characterized in that, The step of ensuring that the difference between the calculated temperature and the measured temperature based on the verification point meets the preset requirements includes: The root mean square relative error function for the calculated and measured temperatures at the verification point is established as follows: The preset requirement is that ε is less than or equal to 15%; where: The temperature detected by the temperature sensor at the verification point. The calculated temperature of the verification point. Let ε be the i-th time point, ε be the relative error, and N be the total number of samples.

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