Method, device and equipment for detecting quality of wire crimping in distribution network construction and medium

Abstract

Embodiments of the present application provide a kind of network construction wire crimping quality detection method, device, equipment and medium, belong to electric power distribution network construction detection field.The method comprises: the surface of the ultrasonic probe is attached to the crimping head to be measured, and test clamp is clamped at the two ends of crimping head.Detection is triggered to start, so that main control board controls ultrasonic probe to carry out internal scanning and receives reflected echo signal, and the analog signal output by test clamp is collected through ADC interface;Linear conversion is carried out to obtain contact resistance value, and the internal state information of reflected echo signal is analyzed;Call pre-stored distribution network construction wire crimping standard threshold, based on contact resistance value and internal state information, using lightweight AI double-index fusion determination algorithm, determine detection result.Through the double-mode detection structure of integrated probe and test clamp, combined with lightweight AI double-index fusion determination algorithm, the internal state of distribution network wire crimping head and contact resistance are realized Dual-dimensional quantitative detection.

Description

Technical Field

[0001] This invention relates to the field of power distribution network construction and testing technology, specifically to a method, device, equipment, and medium for testing the crimping quality of conductors during power distribution network construction. Background Technology

[0002] In the construction of distribution network lines, the crimping of conductors and cable joints is a core process, and the quality of crimping directly determines the reliability of line operation. Currently, the inspection of crimping quality in distribution network construction mainly relies on manual visual inspection of the appearance, which cannot detect problems such as core wire misalignment, gaps, and insufficient crimping depth inside the crimp. At the same time, there is a lack of quantitative testing of the contact resistance of crimped joints, resulting in a large number of substandard crimped joints being put into operation, which in turn causes faults such as joint overheating, burnout, and line tripping, becoming a high-frequency safety hazard for the operation of distribution network lines.

[0003] Existing crimping quality testing equipment is mostly large-scale professional instruments, which are only suitable for power engineering laboratories / large-scale construction scenarios. They have drawbacks such as large size, high cost, complex operation, and inability to be used on-site. In addition, they require professional technicians to operate and cannot detect internal conditions or provide quantitative data on contact resistance, leading to technical problems such as missed detections and misjudgments. Summary of the Invention

[0004] The purpose of this invention is to provide a method, device, equipment, and medium for detecting the quality of wire crimping in power distribution network construction. By integrating a dual-mode detection structure of ultrasonic probe and test clip, and combining the lightweight AI dual-index fusion judgment algorithm built into the main control board, a two-dimensional non-destructive quantitative detection of the internal state and contact resistance of power distribution network wire crimp joints is achieved.

[0005] To achieve the above objectives, embodiments of the present invention provide a method for detecting the quality of conductor crimping during power distribution network construction, comprising: The ultrasonic probe is attached to the surface of the pressure connector to be tested, and the test clip is clamped at both ends of the pressure connector to ensure good contact between the detection circuit and the scanning surface. This triggers the start of the test, so that the main control board controls the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as to acquire the analog signal output by the test clip through the ADC interface. The contact resistance value is obtained by linear conversion of the analog signal, and the internal state information of the crimp is obtained by analysis and processing of the reflected echo signal. The pre-stored standard threshold for wire crimping in power distribution network construction is invoked. Based on the contact resistance value and the internal state information, a lightweight AI dual-index fusion judgment algorithm is used to determine the detection result.

[0006] Optionally, the contact resistance value can be obtained by linearly converting the analog signal according to the following formula:

[0007] In the formula, The analog voltage value acquired by the ADC. The reference voltage for the ADC is denoted by , and K is the scaling factor pre-calibrated using a standard resistor.

[0008] Optionally, the calibration process for the scaling factor includes: Use standard resistors Connect the measurement circuit to measure the corresponding ADC output value. ,but .

[0009] Optionally, the reflected echo signal is analyzed and processed to obtain the internal state information of the crimping, including: Determine the arrival time and amplitude of the reflected echo, and calculate the distance between the ultrasonic probe and the reflecting interface based on the arrival time of the reflected echo. If an abnormal reflective interface is detected and the distance between the ultrasonic probe and the reflective interface deviates from the theoretical value by more than the preset deviation threshold, it is determined to be a core wire offset. If the echo amplitude decreases by more than a preset attenuation threshold compared to the reference value, a gap is determined to exist. If a secondary reflection occurs in the reflected echo and the reflection amplitude decays gradually, the crimping depth is determined to be insufficient.

[0010] Optionally, the lightweight AI dual-index fusion judgment algorithm adopts a dual-branch input and logic threshold fusion structure, including: The contact resistance value processing branch is used to linearly convert the analog quantities acquired by the ADC to obtain the contact resistance values. The ultrasonic internal state processing branch is used to extract time and amplitude features from the reflected echo signal; An internal status flag vector S = [s1, s2, s3] is generated by comparing the crimping standards of the distribution network construction conductors, where s1 is the gap flag, s2 is the core wire offset flag, and s3 is the crimping depth compliance flag. The fusion decision layer uses logical AND operations to perform decision fusion on the output of the contact resistance numerical processing branch and the ultrasonic internal state processing branch.

[0011] Optionally, the judgment logic of the lightweight AI dual-indicator fusion judgment algorithm is as follows:

[0012] In the formula, R is the contact resistance value, R th The contact resistance threshold; When the result is non-compliant, the following non-compliance factors are mapped: If R>R th If so, it indicates that the contact resistance exceeds the standard; If the gap is not equal to 0, then mark that there is a gap inside; If the offset is not equal to 0, then mark the core wire offset; If the pressing depth is not equal to 1, then the pressing depth is insufficient. When multiple non-compliant factors exist simultaneously, they should be combined and labeled.

[0013] Secondly, the present invention also provides a device for detecting the quality of conductor crimping during power distribution network construction, comprising: Handheld housing; An ultrasonic probe is disposed outside the handheld housing and connected to the handheld housing via a retractable cable. It is used to fit against the surface of the pressure connector to be tested, emit ultrasonic waves and receive reflected echo signals. The test clip, connected to the handheld housing via a retractable test cable, is used to clamp the two ends of the crimp connector and collect the simulated contact resistance signal of the crimp connector. The main control board is located inside the handheld housing and is electrically connected to the ultrasonic probe and the test clip, respectively. It is used to control the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as to collect the analog signal output by the test clip. Optionally, the main control board includes: A contact resistance calculation unit is used to perform linear conversion on the analog signal to obtain the contact resistance value; An ultrasonic feature extraction unit is used to analyze and process the reflected echo signal to obtain internal state information of the crimping, including whether there is a gap, core wire misalignment, and insufficient crimping depth. Storage unit, used to pre-store standard threshold values ​​for wire crimping in power distribution network construction; The lightweight AI dual-index fusion judgment unit is used to output the detection result based on the contact resistance value and the internal state information, combined with the standard threshold for wire crimping in power distribution network construction. The display unit is disposed on the surface of the handheld housing and electrically connected to the main control board, and is used to display the detection results in real time. A Bluetooth transmission unit is located inside the handheld housing and is electrically connected to the main control board, used to wirelessly transmit the detection results to an external terminal. The power supply unit is located inside the handheld housing and is electrically connected to the main control board and each power-consuming unit to provide working power.

[0014] Thirdly, the present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps of the above-described method for detecting the crimping quality of power distribution network construction conductors.

[0015] Fourthly, the present invention also provides a storage medium storing a computer program thereon, wherein the computer program, when executed by a processor, implements the steps of the above-described method for detecting the crimping quality of power distribution network construction conductors.

[0016] Through the above technical solution, by integrating an ultrasonic probe and a test clip into a dual-mode detection structure, and combining the lightweight AI dual-index fusion judgment algorithm built into the main control board, a two-dimensional non-destructive quantitative detection of the internal state and contact resistance of the distribution network conductor crimping joint is realized.

[0017] Other features and advantages of the embodiments of the present invention will be described in detail in the following detailed description section. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a flowchart of a method for detecting the quality of wire crimping in power distribution network construction, provided by an embodiment of the present invention; Figure 2 This is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0019] Various embodiments of this disclosure will be described more fully in the following detailed description. This disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of this disclosure to the specific embodiments disclosed herein, but rather this disclosure should be understood to cover all adjustments, equivalents, and / or alternatives falling within the spirit and scope of the various embodiments of this disclosure.

[0020] In the following, the terms “comprising” or “may include”, which may be used in various embodiments of this disclosure, indicate the presence of the disclosed functions or operations and do not limit the addition of one or more functions or operations. Furthermore, as used in various embodiments of this disclosure, the terms “comprising,” “having,” and their cognates are intended only to indicate a specific feature, number, step, operation, or combination of the foregoing and should not be construed as primarily excluding the presence of one or more other features, numbers, steps, operations, or combinations of the foregoing, or the possibility of adding one or more features, numbers, steps, operations, or combinations of the foregoing.

[0021] In various embodiments of this disclosure, the expression "or" or "at least one of A and / or B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A and / or B" may include A, may include B, or may include both A and B.

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] See Figure 1 The diagram shows a flowchart of a method for detecting the quality of conductor crimping during power distribution network construction in a specific embodiment, including the following steps: Step 100: Attach the ultrasonic probe to the surface of the pressure connector to be tested, and clamp the test clip at both ends of the pressure connector to ensure good contact between the detection circuit and the scanning surface. Trigger the start of the test so that the main control board controls the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as acquire the analog signal output by the test clip through the ADC interface.

[0024] Specifically, the contact resistance signal acquisition process includes: the main control board sends an enable signal to the contact resistance detection module (AT518L) through the GPIO port to start working; the weak voltage signal at both ends of the crimp connector acquired by the test clamp is amplified and processed internally by the module, and then outputs an analog voltage signal to the PA0 pin (ADC1_IN0 channel) of the main control board; the main control board continuously acquires the analog signal 10 times at a 12-bit resolution and a 100Hz sampling frequency, converts it into a digital quantity through the ADC module, and stores it in the buffer.

[0025] The ultrasonic scanning signal acquisition process includes: the main control board outputs 10 40kHz square wave pulses through the PB5 pin (TRIG) to trigger the ultrasonic probe (TCT40-16R / T) to emit ultrasonic waves. The ultrasonic waves propagate inside the crimp connector and generate reflected echoes when they encounter different medium interfaces (such as core wires, gaps, and pipe walls). After receiving the echo signals, the probe inputs the echo signals (analog signals) to the main control board through the PB6 pin (ECHO). The main control board continuously acquires the echo signals at a sampling rate of 1MHz to obtain a complete echo waveform array, which is then stored in memory.

[0026] Step 101: Perform linear conversion on the analog signal to obtain the contact resistance value, and analyze and process the reflected echo signal to obtain the internal state information of the crimping.

[0027] Specifically, the contact resistance value is obtained by linearly converting the analog signal according to the following formula:

[0028] In the formula, The analog voltage value acquired by the ADC. The reference voltage for the ADC is denoted by , and K is the scaling factor pre-calibrated using a standard resistor.

[0029] The calibration process for the proportionality coefficient includes: Use standard resistors Connect the measurement circuit to measure the corresponding ADC output value. ,but .

[0030] In one specific embodiment, when analyzing and processing the reflected echo signal to obtain the internal state information of the crimping in step 101, the following steps can be performed: S1010: Determine the arrival time and amplitude of the reflected echo, and calculate the distance between the ultrasonic probe and the reflecting interface based on the arrival time of the reflected echo.

[0031] S1011: If an abnormal reflective interface is detected and the distance between the ultrasonic probe and the reflective interface deviates from the theoretical value by more than the preset deviation threshold, it is determined to be a core wire offset.

[0032] S1012: If the echo amplitude decreases by more than a preset attenuation threshold compared to the reference value, it is determined that a gap exists.

[0033] S1013: If a secondary reflection occurs in the reflected echo and the reflection amplitude decays gradually, the crimping depth is determined to be insufficient.

[0034] In one specific implementation, when performing step 101, the following steps can be performed: Contact resistance measurement: The main control board continuously samples 10 times with 12-bit resolution using an ADC, and the average value is obtained after removing the maximum and minimum values. Substitute into the formula Where K is the value through a standard resistor. The coefficients obtained during calibration are measured during calibration. ,calculate In addition, considering temperature drift compensation, a temperature sensor is introduced to measure the ambient temperature T, and K is corrected accordingly. , This is the temperature coefficient.

[0035] Ultrasonic internal state recognition: After the main control board triggers the ultrasonic probe, it acquires the echo signal at a sampling rate of 1MHz to obtain the echo waveform array s[n], and extracts the following features: First wave arrival time The echo start point is determined based on threshold detection, and the distance between the probe and the outer surface of the crimp connector is calculated. ,like If the deviation from the theoretical value exceeds 5%, it indicates that the probe is not in close contact.

[0036] Internal reflection wave detection: In Then, search for significant peaks and record the time of each peak. and amplitude Calculate the distances between each reflecting interface: .

[0037] Core wire offset determination: If there is a reflection interface distance The deviation from the theoretical position of the core wire exceeds And amplitude If the value exceeds the noise threshold, it is determined to be core wire misalignment, and the misalignment amount is specified. .

[0038] Gap determination: Calculate the echo amplitude attenuation rate ,in, This is the reference amplitude when there are no gaps. If a gap exists, its size is inversely proportional to η.

[0039] Determining insufficient crimping depth: Analyze the characteristics of multiple reflections. If a significant secondary reflection occurs after the crimping area and the amplitude decays slowly, then the secondary reflection amplitude is insufficient. If the time interval between the second reflections matches the crimping depth characteristics, then the crimping depth is determined to be insufficient.

[0040] Comprehensive feature vector construction: quantize the above features as follows: The input judgment logic is compared with the preset threshold, and the final result is output.

[0041] Step 102: Call the pre-stored standard threshold for wire crimping in power distribution network construction, and determine the detection result based on the contact resistance value and the internal state information using a lightweight AI dual-index fusion judgment algorithm.

[0042] Preferably, the pre-stored standard threshold for crimping of power distribution network construction conductors is set as follows: a contact resistance of ≤50μΩ is considered qualified, and ultrasonic scanning shows no gaps, no offset, and the crimping depth meets the standard.

[0043] In one specific implementation, the lightweight AI dual-index fusion judgment algorithm adopts a dual-branch input and logic threshold fusion structure, including: The contact resistance value processing branch is used to linearly convert the analog quantities acquired by the ADC to obtain the contact resistance values. The ultrasonic internal state processing branch is used to extract time and amplitude features from the reflected echo signal; An internal status flag vector S = [s1, s2, s3] is generated by comparing the crimping standards of the distribution network construction conductors, where s1 is the gap flag, s2 is the core wire offset flag, and s3 is the crimping depth compliance flag. The fusion decision layer uses logical AND operations to perform decision fusion on the output of the contact resistance numerical processing branch and the ultrasonic internal state processing branch.

[0044] In one specific implementation, the determination logic of the lightweight AI dual-indicator fusion determination algorithm is as follows:

[0045] In the formula, R is the contact resistance value, R th The contact resistance threshold; When the result is non-compliant, the following non-compliance factors are mapped: If R>R th If so, it indicates that the contact resistance exceeds the standard; If the gap is not equal to 0, then mark that there is a gap inside; If the offset is not equal to 0, then mark the core wire offset; If the pressing depth is not equal to 1, then the pressing depth is insufficient. When multiple non-compliant factors exist simultaneously, they should be combined and labeled.

[0046] In one specific implementation, the construction and optimization process of the lightweight AI dual-index fusion judgment algorithm includes the following steps: Step A: Determine the acceptable contact resistance threshold R based on GB / T 9327-2008 standard. th =50μΩ; Step B: Construct a crimp connector sample library, collect typical samples including qualified products and those with void defects, core wire misalignment defects, and insufficient crimping depth defects, and obtain the echo characteristic parameters of each sample through ultrasonic scanning. Step C: Determine the gap threshold η th Offset determination threshold Δd th The crimping depth determination parameter β was calibrated and optimized, with the optimization goal of maximizing the consistency between the detection results and the actual defect type. Step D: Evaluate the accuracy of the judgment using cross-validation and then solidify the optimized threshold parameters into the program memory of the STM32F103C8T6 main control board; Step E: During the actual testing process, if the test results deviate from the sampling results of the construction party by more than the allowable range, enter the calibration mode via Bluetooth or button to dynamically update the calibration coefficients and judgment thresholds.

[0047] In this embodiment, by integrating an ultrasonic probe and a test clip into a dual-mode detection structure, and combining it with the lightweight AI dual-index fusion judgment algorithm built into the main control board, a two-dimensional non-destructive quantitative detection of the internal state and contact resistance of the distribution network conductor crimping joint is achieved.

[0048] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0049] The following are embodiments of the device for detecting the crimping quality of power distribution network construction conductors provided in this disclosure. It belongs to the same inventive concept as the detection method for the crimping quality of power distribution network construction conductors in the above embodiments. For details not described in detail in the embodiments of the detection system for the crimping quality of power distribution network construction conductors, please refer to the embodiments of the detection method for the crimping quality of power distribution network construction conductors described above.

[0050] A device for testing the quality of conductor crimping during power distribution network construction includes: Handheld housing; An ultrasonic probe is disposed outside the handheld housing and connected to the handheld housing via a retractable cable. It is used to fit against the surface of the pressure connector to be tested, emit ultrasonic waves and receive reflected echo signals. The test clip, connected to the handheld housing via a retractable test cable, is used to clamp the two ends of the crimp connector and collect the simulated contact resistance signal of the crimp connector. The main control board is located inside the handheld housing and is electrically connected to the ultrasonic probe and the test clip, respectively. It is used to control the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as to collect the analog signal output by the test clip. Preferably, the main control board includes: A contact resistance calculation unit is used to perform linear conversion on the analog signal to obtain the contact resistance value; An ultrasonic feature extraction unit is used to analyze and process the reflected echo signal to obtain internal state information of the crimping, including whether there is a gap, core wire misalignment, and insufficient crimping depth. Storage unit, used to pre-store standard threshold values ​​for wire crimping in power distribution network construction; The lightweight AI dual-index fusion judgment unit is used to output the detection result based on the contact resistance value and the internal state information, combined with the standard threshold for wire crimping in power distribution network construction. The display unit is disposed on the surface of the handheld housing and electrically connected to the main control board, and is used to display the detection results in real time. A Bluetooth transmission unit is located inside the handheld housing and is electrically connected to the main control board, used to wirelessly transmit the detection results to an external terminal. The power supply unit is located inside the handheld housing and is electrically connected to the main control board and each power-consuming unit to provide working power.

[0051] This handheld, portable device weighs ≤800g, boasts a battery life of ≥10 hours, and an IP54 protection rating, making it suitable for outdoor power distribution network construction environments characterized by strong sunlight, humidity, and dust. Its magnetic probe and test clip design eliminates the need for fixing or complex wiring; simply attach the probe for testing. The entire process for testing a single crimped joint takes ≤15 seconds, significantly improving on-site testing efficiency. Equipped with an AI dual-index fusion judgment algorithm, it automatically compares against standard thresholds, directly outputting pass / fail results and indicating the cause of any issues. Basic construction personnel do not require specialized electronics / testing skills; a single click completes the testing, solving the problem of complex operation associated with existing professional equipment.

[0052] In one embodiment, the device is a handheld portable structure with dimensions ≤22cm×10cm×6cm, weight ≤800g, and an IP54 protection rating. It is suitable for outdoor power distribution network construction in environments with strong light, humidity, and dust. The hardware consists of five core parts: a power supply module, a core detection module, a control and display module, a data transmission module, and an auxiliary connection module. Each module is independent yet works in conjunction with the others. The STM32F103C8T6 main control board is the core for data acquisition, processing, judgment, and output.

[0053] The power supply module uses two 2600mAh 18650 rechargeable lithium batteries connected in series, paired with a dual-cell lithium battery protection board (overcharge / over-discharge / short circuit protection), and is regulated by an LM1117-3.3V / 5V dual-channel step-down module to supply power to modules with different voltage requirements; it supports power bank / vehicle / 220V fast charging, with a single charge providing ≥10 hours of battery life, meeting the needs of all-day on-site operation.

[0054] The ultrasonic testing submodule uses a TCT40-16R / T 40kHz miniature magnetic ultrasonic probe and a matching drive module. It non-destructively scans the internal structure of the crimp connector and can accurately identify three core problems: core wire gap, core wire misalignment, and insufficient crimping depth. The scanning signal is processed by the main control board and converted into internal status judgment results. The magnetic probe design does not require fixing; it can be used for testing simply by placing it against the crimp connector, improving on-site operation efficiency.

[0055] The micro-ohm contact resistance detection submodule uses the AT518L contact resistance detection module, with a range of 0-200μΩ and an accuracy of ±0.01μΩ. It is suitable for the low resistance detection requirements of the power grid crimp connector, directly collects the contact resistance quantification data of the crimp connector, and does not require secondary calibration. The detection data is transmitted to the main control board after being converted from analog to digital by ADC.

[0056] The control and display module uses the STM32F103C8T6 minimum system board as its control core and is equipped with a lightweight AI algorithm to receive, process, and fuse data from the dual detection modules. It features a 2.8-inch TFT SPI backlit color screen (320*240 resolution) that supports outdoor strong light mode and displays contact resistance values, ultrasonic scanning results, comprehensive judgment results, and the cause of the problem in real time. It is also equipped with a 3-button silicone splash-proof button board to enable power-on, one-button detection, and data saving functions, making it easy to operate.

[0057] The data transmission and storage module integrates an HC-08 low-power Bluetooth 5.0 module with a baud rate of 9600, enabling wireless transmission of test data to a mobile phone and one-click generation of electronic test reports; it is equipped with an STM32 built-in EEPROM, supporting local storage of ≥2000 test records, including test values, judgment results, and test counts, which are not lost when power is off, and the data is traceable.

[0058] The auxiliary connection module is equipped with two copper high-voltage anti-detachment magnetic test clips (opening ≥20mm), which are compatible with all specifications of crimp connectors / wires in power distribution networks, with good conductivity and tight fit; it comes with two 3-meter copper core insulated telescopic test lines with anti-breakage connector design, telescopic storage, and suitable for long-distance on-site testing; the equipment shell is made of ABS material 3D printed / mold molded, with anti-slip rubber grip, reserved test line, charging port, and probe interface, and embedded silicone sealing ring to improve waterproofing.

[0059] It supports local storage of ≥2000 test records and generates electronic test reports via Bluetooth transmission, enabling the storage, transmission, and traceability of test data. This solves the problems of no data, unclear responsibilities, and difficult management in traditional testing. It can be connected to the power distribution network construction quality management platform to achieve digital management and control of crimping construction quality.

[0060] For example, the selection of components for each module is shown in Table 1 below: Table 1: Component Selection

[0061] In one specific implementation, the hardware assembly and wiring are carried out as follows: 1. Power supply circuit assembly: Two 18650 lithium batteries are connected in series to the protection board. The output terminals of the protection board are connected to LM1117-3.3V and LM1117-5V step-down modules respectively. The 3.3V power supply is provided to the main control board, color screen and keypad, and the 5V power supply is provided to the ultrasonic module, contact resistor module and Bluetooth module. All modules share a common ground (GND) to avoid floating ground.

[0062] 2. Core Module Wiring: Centered on the STM32F103C8T6 main control board, connect the following pins precisely, without complex wiring: Contact resistance module: VCC-5V, GND-GND, OUT-PA0 (ADC1_IN0); Ultrasonic modules: VCC-5V, GND-GND, TRIG-PB5, ECHO-PB6; Color screen: VCC-3.3V, GND-GND, SCK-PA5, MOSI-PA7, RES-PB0, DC-PB1, BL-PB2, CS-PA4; Bluetooth module: VCC-5V, GND-GND, TX-PA10, RX-PA9; Keypad: VCC-3.3V, GND-GND, KEY1-PC0, KEY2-PC1, KEY3-PC2.

[0063] 3. Auxiliary module assembly: The magnetic test clamp is connected to the test end of the contact resistance module, and the telescopic test line is soldered to prevent breakage; the ultrasonic probe is connected to the ultrasonic module through an extension line, with sufficient wiring length reserved; after soldering all external interfaces, they are insulated and wrapped, and a silicone sealing ring is embedded in the shell. After assembly, the PCB board is fixed with screws to complete the overall hardware assembly of the equipment.

[0064] In one specific implementation, software burning and debugging are carried out as follows: 1. Compilation environment: The Keil uVision5 compilation environment is used, and the STM32F103C8T6 chip package and supporting driver libraries (adc.h / lcd.h / usart.h / ultrasonic.h / key.h, etc.) are installed in advance.

[0065] 2. Program burning: Import the core AI judgment program and driver library into Keil5. After compiling without errors, burn the program to the main control board through the USB to TTL module (CH340). Before burning, short-circuit BOOT0=1 and BOOT1=0. After burning, restore BOOT0=0.

[0066] 3. Accuracy calibration: The contact resistance module is calibrated using 50μΩ / 100μΩ standard resistors, and the linear conversion parameters in the program are adjusted to ensure that the detection error is ≤±3%; the ultrasonic module is calibrated using qualified / unqualified power grid crimp connector samples, and the AI ​​algorithm judgment threshold is optimized to ensure that the scanning results are consistent with the actual results.

[0067] (iv) On-site implementation 1. Equipment preparation: Fully charge the device, power it on and wait for all modules to initialize and the standby interface to be displayed; turn on Bluetooth on your mobile phone, search for and connect to the HC-08 Bluetooth module (default password 0000 / 1234).

[0068] 2. Testing Operation: Clamp the magnetic test clips to both ends of the crimp connector, and ensure the ultrasonic magnetic probe is in close contact with the surface of the crimp connector (without gaps). Press the "Test" button, and the equipment will automatically complete data acquisition, scanning, and judgment. The test results will be displayed on the screen after ≤15 seconds.

[0069] 3. Data processing: The test results are synchronously transmitted to the mobile phone via Bluetooth to generate an electronic test report, which includes contact resistance values, ultrasonic scan results, and comprehensive judgment results; test records are automatically stored locally, and key records can be manually saved by pressing a button.

[0070] 4. Fault rework: If the test result is unqualified, the specific cause of the problem will be marked on the screen. The construction personnel can immediately rework the crimping joint, and then test it again until it is qualified, so as to realize the "crimping-testing-rework" closed loop on site.

[0071] In one specific implementation, equipment maintenance and upkeep are carried out as follows: 1. After using the equipment, promptly clean the dust and oil stains from the test clips and ultrasonic probe surfaces to keep the contact surfaces clean; 2. Avoid dropping or bumping the equipment. After outdoor use, wipe the outer casing promptly to keep it dry and prevent water and dust from entering; 3. Avoid overcharging and over-discharging the lithium battery. If the equipment is not used for a long period, charge it once every 3 months to maintain battery activity; 4. Regularly calibrate the equipment using a standard resistor and crimp connector template to ensure stable testing accuracy. The calibration cycle is once every 3 months.

[0072] It can detect all specifications of conductors and cable crimpers in 10kV / 0.4kV distribution networks, covering all distribution network crimping scenarios such as clamp crimping, intermediate joint crimping, and branch joint crimping. It is applicable to construction in urban areas, rural areas, and industrial parks, with strong compatibility and no scene limitations.

[0073] In one specific implementation, the overall workflow of the equipment is as follows: Upon powering on the device, the main control board and all modules complete initialization, and the standby interface displays "Crimping Test Ready." Press the test button to begin. Attach the magnetic test clips to both ends of the crimp connector, and place the ultrasonic magnetic probe against the surface of the crimp connector. Press the test button, and the device automatically starts: contact resistance acquisition → ultrasonic internal scanning → AI dual-index fusion judgment. After judgment, the color screen displays the contact resistance value, ultrasonic scan results, and comprehensive judgment result (pass / fail) in real time. If unqualified, the specific reason is noted. The test data is automatically transmitted to the mobile phone via Bluetooth, generating an electronic test report, and simultaneously stored locally in the EEPROM. Upon completion of the test, the screen displays a message indicating that the record has been saved. Press the test button to proceed to the next test, enabling continuous and rapid testing.

[0074] Figure 2 This is a schematic diagram of the hardware structure of an electronic device that implements various embodiments of the present invention.

[0075] The method for detecting the crimping quality of power distribution network construction conductors provided in this application embodiment can be applied to electronic devices. Those skilled in the art will understand that the electronic device structure involved in the embodiments of this invention does not constitute a limitation on the electronic device. An electronic device may include more or fewer components than illustrated, or combine certain components, or have different component arrangements. In the embodiments of this invention, electronic devices include, but are not limited to, laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic devices may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the embodiments of this application described and / or claimed herein.

[0076] Electronic devices may include processors, external memory interfaces, internal memory, universal serial bus (USB) interfaces, charging management modules, power management modules, batteries, wireless communication modules, audio modules, speakers, microphones, sensor modules, buttons, cameras, displays, and SIM card interfaces, etc.

[0077] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device. In other embodiments of this application, the electronic device may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0078] A processor may include one or more processing units, such as: a central processing unit (CPU), an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, memory, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors.

[0079] The processor can serve as the nerve center and command center of an electronic device. The controller can generate operation control signals based on the instruction opcode and timing signals to control the fetching and execution of instructions.

[0080] The processor may also include memory for storing instructions and data. In some embodiments, the memory in the processor is a cache memory. This memory can store instructions or data that the processor has just used or that are used repeatedly. If the processor needs to use the instruction or data again, it can retrieve it directly from this memory. This avoids repeated accesses, reduces processor latency, and thus improves system efficiency.

[0081] An external storage interface (ESI) can be used to connect external memory cards, such as microSD cards, to expand the storage capacity of electronic devices. The external memory card communicates with the processor through the ESI to perform data storage functions, such as saving music and video files on the external memory card.

[0082] Internal memory can be used to store computer executable program code, which includes instructions. The processor executes various functional applications and data processing of electronic devices by running the instructions stored in internal memory. Internal memory can include a program storage area and a data storage area. Internal memory can include high-speed random access memory, and can also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc.

[0083] Wireless communication functionality in electronic devices can be achieved through antennas, wireless communication modules, modem processors, and baseband processors.

[0084] Wireless communication modules can provide solutions for wireless communication applications in electronic devices, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies.

[0085] Electronic devices can implement audio functions through audio modules, speakers, receivers, microphones, headphone jacks, and application processors.

[0086] Electronic devices can achieve shooting functions through ISPs, cameras, video codecs, GPUs, displays, and application processors.

[0087] Electronic devices can achieve display functions through GPUs, displays, and application processors.

[0088] A GPU is a microprocessor for image processing, connected to the display screen and application processor. GPUs are used to perform mathematical and geometric calculations for graphics rendering. A processor may include one or more GPUs, which execute program instructions to generate or modify display information.

[0089] A display screen is used to display images, videos, etc. A display screen includes a display panel.

[0090] The storage medium provided in this application stores a program product that enables a method for detecting the quality of wire crimping during power distribution network construction.

[0091] The method for detecting the crimping quality of power distribution network construction conductors includes: attaching an ultrasonic probe to the surface of the crimping joint to be tested, and clamping the test clips at both ends of the crimping joint to ensure good contact between the detection circuit and the scanning surface, triggering the start of detection, so that the main control board controls the ultrasonic probe to perform internal scanning and receive reflected echo signals, and acquires the analog signals output by the test clips through the ADC interface; performing linear conversion on the analog signals to obtain the contact resistance value, analyzing and processing the reflected echo signals to obtain the internal state information of the crimping; calling the pre-stored standard threshold for power distribution network construction conductor crimping, and based on the contact resistance value and the internal state information, using a lightweight AI dual-index fusion judgment algorithm to determine the detection result.

[0092] In some possible implementations, the subject matter of this disclosure, namely, "Method and System for Detecting the Crimping Quality of Conductors in Distribution Network Construction," can be implemented as a program product comprising program code. When the program product is run on a terminal device, the program code causes the terminal device to perform the steps described in the "Exemplary Methods" section of this specification according to various exemplary embodiments of this disclosure.

[0093] The storage medium disclosed herein may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0094] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for detecting the quality of conductor crimping during power distribution network construction, characterized in that, include: The ultrasonic probe is attached to the surface of the pressure connector to be tested, and the test clip is clamped at both ends of the pressure connector to ensure good contact between the detection circuit and the scanning surface. This triggers the start of the test, so that the main control board controls the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as to acquire the analog signal output by the test clip through the ADC interface. The contact resistance value is obtained by linear conversion of the analog signal, and the internal state information of the crimp is obtained by analysis and processing of the reflected echo signal. The pre-stored standard threshold for wire crimping in power distribution network construction is invoked. Based on the contact resistance value and the internal state information, a lightweight AI dual-index fusion judgment algorithm is used to determine the detection result.

2. The method for detecting the quality of conductor crimping in power distribution network construction according to claim 1, characterized in that, The contact resistance value is obtained by linearly converting the analog signal according to the following formula: In the formula, The analog voltage value acquired by the ADC. The reference voltage for the ADC is denoted by , and K is the scaling factor pre-calibrated using a standard resistor.

3. The method for detecting the quality of conductor crimping in power distribution network construction according to claim 2, characterized in that, The calibration process for the proportionality coefficient includes: Use standard resistors Connect the measurement circuit to measure the corresponding ADC output value. ,but .

4. The method for detecting the quality of conductor crimping in power distribution network construction according to claim 1, characterized in that, The internal state information of the crimping is obtained by analyzing and processing the reflected echo signal, including: Determine the arrival time and amplitude of the reflected echo, and calculate the distance between the ultrasonic probe and the reflecting interface based on the arrival time of the reflected echo. If an abnormal reflective interface is detected and the distance between the ultrasonic probe and the reflective interface deviates from the theoretical value by more than the preset deviation threshold, it is determined to be a core wire offset. If the echo amplitude decreases by more than a preset attenuation threshold compared to the reference value, a gap is determined to exist. If a secondary reflection occurs in the reflected echo and the reflection amplitude decays gradually, the crimping depth is determined to be insufficient.

5. The method for detecting the quality of conductor crimping in power distribution network construction according to claim 4, characterized in that, The lightweight AI dual-index fusion judgment algorithm adopts a dual-branch input and logic threshold fusion structure, including: The contact resistance value processing branch is used to linearly convert the analog quantities acquired by the ADC to obtain the contact resistance values. The ultrasonic internal state processing branch is used to extract time and amplitude features from the reflected echo signal; An internal status flag vector S = [s1, s2, s3] is generated by comparing the crimping standards of the distribution network construction conductors, where s1 is the gap flag, s2 is the core wire offset flag, and s3 is the crimping depth compliance flag. The fusion decision layer uses logical AND operations to perform decision fusion on the output of the contact resistance numerical processing branch and the ultrasonic internal state processing branch.

6. The method for detecting the quality of conductor crimping in power distribution network construction according to claim 5, characterized in that, The judgment logic of the lightweight AI dual-indicator fusion judgment algorithm is as follows: In the formula, R is the contact resistance value, R th The contact resistance threshold; When the result is non-compliant, the following non-compliance factors are mapped: If R>R th If so, it indicates that the contact resistance exceeds the standard; If the gap is not equal to 0, then mark that there is a gap inside; If the offset is not equal to 0, then mark the core wire offset; If the pressing depth is not equal to 1, then the pressing depth is insufficient. When multiple non-compliant factors exist simultaneously, they should be combined and labeled.

7. A device for detecting the quality of conductor crimping during power distribution network construction, characterized in that, include: Handheld housing; An ultrasonic probe is disposed outside the handheld housing and connected to the handheld housing via a retractable cable. It is used to fit against the surface of the pressure connector to be tested, emit ultrasonic waves and receive reflected echo signals. The test clip, connected to the handheld housing via a retractable test cable, is used to clamp the two ends of the crimp connector and collect the simulated contact resistance signal of the crimp connector. The main control board, located inside the handheld housing, is electrically connected to the ultrasonic probe and the test clip, and is used to control the ultrasonic probe to perform internal scanning and receive the reflected echo signal, as well as to acquire the analog signal output by the test clip.

8. The device for detecting the crimping quality of conductors in power distribution network construction according to claim 7, characterized in that, The main control board includes: A contact resistance calculation unit is used to perform linear conversion on the analog signal to obtain the contact resistance value; An ultrasonic feature extraction unit is used to analyze and process the reflected echo signal to obtain internal state information of the crimping, including whether there is a gap, core wire misalignment, and insufficient crimping depth. Storage unit, used to pre-store standard threshold values ​​for wire crimping in power distribution network construction; The lightweight AI dual-index fusion judgment unit is used to output the detection result based on the contact resistance value and the internal state information, combined with the standard threshold for wire crimping in power distribution network construction. The display unit is disposed on the surface of the handheld housing and electrically connected to the main control board, and is used to display the detection results in real time. A Bluetooth transmission unit is located inside the handheld housing and is electrically connected to the main control board, used to wirelessly transmit the detection results to an external terminal. The power supply unit is located inside the handheld housing and is electrically connected to the main control board and each power-consuming unit to provide working power.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the steps of the method for detecting the crimping quality of power distribution network construction conductors as described in any one of claims 1 to 6.

10. A storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the method for detecting the crimping quality of power distribution network construction conductors as described in any one of claims 1 to 6.

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