A high-integration flat panel phased array multifunctional radio frequency module

Abstract

The application discloses a high-integration flat panel phased array multifunctional radio frequency module, which integrates tile type TR assembly, tile type delay assembly, radio frequency transceiving network, radio frequency coupling calibration network, power supply network, beam control network and small radio frequency interconnection connector; the module realizes a profile height less than 10 mm, and a single module realizes lightweight design of multifunctional integration; a microwave digital-analog hybrid multilayer printed circuit board is used as a main structure, and functional assemblies are all surface-mounted on the surface of the printed circuit board, so that the active phased array equipment quantity is greatly reduced, and the design requirements of lightweight, low profile and low cost of modern satellite-borne and airborne radars can be met.

Description

Technical Field

[0001] This invention belongs to the field of phased array antennas and relates to a highly integrated planar phased array multifunctional radio frequency module. Background Technology

[0002] Phased array antennas achieve rapid beam scanning and shaping by controlling digital phase shifters and attenuators within the radio frequency (RF) channels. With the rise of satellite communication and spaceborne radar, antenna systems for satellite payloads and ground terminals have gradually evolved from mechanically scanned antennas and one-dimensional phased array antennas to two-dimensional active phased array antennas. The requirements for lightweight and highly integrated phased array antennas are also constantly increasing. Traditional brick-type active phased array antenna systems are composed of multiple independent brick-type TR modules stacked together. Each brick-type TR module integrates the RF link, power supply, and control module, achieving vertical integration and horizontal modular expansion of the RF channels. Brick-type modules have advantages such as high integration, multiple channels, excellent heat dissipation, and modular design for easy assembly and repair. However, they also have disadvantages such as large cross-sectional dimensions, high mass density, and high cost, making it difficult to meet the requirements of lightweight, low-profile, and low-cost modern spaceborne and airborne radars. Planar phased array antennas, on the other hand, are lightweight and have a low cross-sectional area, meeting application requirements. There are generally two forms of planar phased array antenna design. One is to integrate microstrip antennas onto multilayer hybrid printed circuit boards. However, antennas designed in this way often have many layers, are difficult to manufacture, and are costly. In addition, microstrip antennas have low radiation efficiency and poor environmental adaptability. Therefore, for high-performance phased array radars, planar waveguide slot antennas are usually integrated with RF TR components and interconnected through RF connectors. Brick-like components cannot meet the design requirements. It is necessary to design planar RF components with high integration, low profile, lightweight, and capable of multi-channel interconnection with the antenna.

[0003] To address the above issues, there is an urgent need to develop lightweight, low-profile, and low-cost planar multi-channel multi-functional RF modules. A highly integrated solution is needed, which integrates RF components, RF feed networks, power networks, and digital signal networks, comprehensively considering RF performance, power integrity, and signal integrity. The core functions of the phased array are concentrated on a single physical board to optimize performance and reduce manufacturing complexity. The modular design enables unit replication and expands the array aperture. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the present invention provides a highly integrated planar phased array multifunctional radio frequency module.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A highly integrated planar phased array multifunctional RF module includes a microwave hybrid analog-digital multilayer printed circuit board. The front of the board has a surface-mount RF SSMP connector, and the back has a tile-type TR component, a tile-type delay component, and a beam control signal driver chip. The board includes multiple RF signal layers. The transceiver RF signals, receiver RF signals, and coupling RF signals of the tile-type TR component and the tile-type delay component are transmitted to the multiple RF signal layers respectively. The beam control signal driver chip is connected in series and / or in parallel with the tile-type TR component and the tile-type delay component, and outputs a control signal.

[0006] Furthermore, the microwave mixed-signal multilayer printed circuit board includes a first radio frequency signal layer integrating a transceiver signal combining network, a second radio frequency signal layer integrating a receive signal combining network, a third radio frequency signal layer integrating a coupling calibration signal combining network, and also includes a radio frequency main port SSMA connector for radio frequency signal output.

[0007] Furthermore, ground layers are provided on both sides of the radio frequency signal layer to form a stripline structure, and multiple metallized vias for shielding radio frequency signals are provided around the stripline.

[0008] Furthermore, the radio frequency signal layer is equipped with signal transmission lines and Wilkinson power dividers.

[0009] Furthermore, the tile-type TR RF component includes a RF amplifier chip, an amplitude and phase multifunction chip, a low-noise amplifier chip, and a wave control chip that are planarly integrated on the substrate. The substrate of the tile-type TR RF component is provided with TR component BGA package pads as external interfaces, and the outer periphery and top of the substrate are sealed by a metal frame and a metal cover plate.

[0010] Furthermore, the tile-type delay RF component includes a bidirectional amplifier chip, a delay amplifier chip, and a wave control chip that are planarly and laterally integrated on the substrate. The substrate of the tile-type delay RF component is provided with delay component BGA package pads as external interfaces, and the outer periphery and top of the substrate are sealed by a metal frame and a metal cover plate.

[0011] Furthermore, it also includes a point-of-load power supply for providing operating voltage to the tiled TR components, tiled delay components, and waveguide signal driver chips. A double-layer metal power supply layer for power network integration is provided on the microwave mixed-signal multilayer printed circuit board.

[0012] Furthermore, the microwave mixed-signal multilayer printed circuit board is provided with multiple radio frequency (RF) signal holes. The tile-type TR component is connected to the RF signal layer through one or more of these RF signal holes. The tile-type delay component is connected to the RF signal layer through one or more of these RF signal holes. The RF signal layer is connected to the RF main port SSMA connector through one or more of these RF signal holes. The RF SSMP connector is connected to the tile-type TR component through one or more of these RF signal holes.

[0013] Furthermore, the microwave mixed analog-digital multilayer printed circuit board is provided with a low-frequency control interface and multiple digital signal layers. The control signal input from the low-frequency control interface is integrated into the digital signal layer through a wave control signal driving chip, and a reference ground layer is provided between adjacent digital signal layers.

[0014] Furthermore, the microwave hybrid analog-digital multilayer printed circuit board has thirteen stacked layers, including multiple radio frequency (RF) signal layers, multiple power layers, multiple digital signal layers, and multiple ground layers. Multiple ground vias and multiple RF signal vias are provided on the stacked layers. Ground layers are provided on both sides of the RF signal layers, forming a stripline structure. Ground layers are also provided on both sides of the digital signal layers. The multiple ground vias form a quasi-coaxial structure for the RF signal to transition along the stripline structure. An RF main port SSMA connector is provided on the microwave hybrid analog-digital multilayer printed circuit board. The RF main port SSMA connector connects to the quasi-coaxial structure through RF signal vias. The grounding post of the RF main port SSMA connector adopts a through-board soldering design. An RF SSMP connector connects to the tile-type TR component through RF signal vias. The RF SSMP connector has SSMP connector positioning posts. The microwave hybrid analog-digital multilayer printed circuit board has positioning blind holes for SMMP connector positioning post mating installation. Tantalum capacitors are provided on the microwave hybrid analog-digital multilayer printed circuit board, positioned close to the tile-type TR component. The overall cross-sectional height of the multifunctional RF module is less than 10mm.

[0015] In summary, the advantages of this invention are: This invention provides a highly integrated planar phased array multifunctional RF module. This module integrates tile-type TR components, tile-type delay components, RF transceiver networks, RF coupling calibration networks, power networks, beam control networks, and small RF interconnect connectors. The module achieves a profile height of less than 10mm and a lightweight design that integrates multiple functions in a single module. It uses a microwave mixed-signal multilayer printed circuit board as the main structure, with all functional components surface-mounted on the surface of the printed circuit board, which greatly reduces the amount of active phased array equipment and can meet the design requirements of modern spaceborne and airborne radars for lightweight, low profile, and low cost. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the back of a flat-panel phased array multi-functional radio frequency module; Figure 2 This is a front view of a flat-panel phased array multi-functional radio frequency module; Figure 3 This is a cross-sectional schematic diagram of a flat-panel phased array multi-functional radio frequency module; Figure 4 yes Figure 3 An enlarged view of E in the cross-sectional schematic diagram; Figure 5 This is a schematic diagram of a tile-type time delay component package; Figure 6 This is a schematic diagram of a tile-type TR module package; Figure 7 This is a schematic diagram of the signal stack-up of a microwave mixed-signal multilayer printed circuit board.

[0017] The diagram identifies the following components: 1. RF SSMP connector; 2. Microwave mixed-signal multilayer printed circuit board; 3. Tile-type TR module; 4. Tile-type delay module; 5. Low-frequency control interface; 6. RF main port SSMA connector; 7. Waveguide signal driver chip; 8. Point-of-load power supply; 9. M2.5 mounting screw hole; 10. Power interface; 11. Tantalum capacitor; 12. Grounding post; 13. SSMP connector positioning post; 14. Delay module BGA package pad distribution; 15. Delay module metal cover plate; 16. Delay module ceramic substrate; 17. Delay module bottom solder ball; 18. TR module metal cover plate; 19. TR module ceramic substrate; 20. TR module bottom solder ball; 21. TR module BGA package pad distribution. Detailed Implementation

[0018] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0019] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0020] In this embodiment of the invention, all directional indicators (such as up, down, left, right, front, back, lateral, longitudinal, etc.) are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0021] Due to installation errors and other reasons, the parallel relationship referred to in the embodiments of the present invention may actually be an approximate parallel relationship, and the perpendicular relationship may actually be an approximate perpendicular relationship.

[0022] This invention provides a highly integrated planar phased array multifunctional RF module. The module integrates a tile-type TR component 3, a tile-type delay component 4, an RF transceiver network for the twelfth RF signal layer, a receiving channel network for the tenth RF signal layer, an RF coupling calibration network for the eighth RF signal layer, power networks for the third and sixth power layers, beam control networks for the second and fourth digital signal layers, and a miniature RF SSMP connector 1. The module uses a microwave mixed-signal multilayer printed circuit board 2 as its main structure. The miniature RF SSMP connector 1 is surface-mounted on the front of the printed circuit board, while the tile-type TR component 3, the tile-type delay component 4, the point-of-load power supply 8, and the beam control signal driver chip 7 are surface-mounted on the back of the printed circuit board. The module's RF signal main port uses a miniaturized RF main port SSMA connector 6, and the low-frequency control interface 5 and power interface 10 use J30J connectors.

[0023] like Figure 7 As shown, the microwave mixed-signal multilayer printed circuit board is divided into 13 signal layers. The twelfth RF signal layer is used for the RF feed network design of the transceiver channel; the tenth RF signal layer is used for the RF feed network design of the receiver channel; and the eighth RF signal layer is used for the coupling and calibration RF signal network design. Each RF signal layer has two ground planes, forming a stripline structure for transmitting RF signals. The stripline is surrounded by metallized vias (first, third, and fifth ground holes) to shield the RF signals, prevent leakage, and increase isolation. The twelfth RF signal layer of the transceiver channel of the multilayer printed circuit board designs the transceiver signal transmission lines and a symmetrical Wilkinson power divider network. The equal-length transmission lines ensure channel amplitude and phase consistency. The tenth RF signal layer of the receiver channel of the multilayer printed circuit board designs the receiver signal transmission lines and a symmetrical Wilkinson power divider network. The equal-length transmission lines also ensure channel amplitude and phase consistency. The eighth RF signal layer of the multilayer printed circuit board (PCB) coupling calibration channel is designed with transmit and receive signal transmission lines, a single-section stripline coupler, and a symmetrical Wilkinson power divider network. The equal-length transmission lines ensure channel amplitude and phase consistency. For the microwave mixed-signal multilayer PCB 2, considering both total weight and warpage of the large dimensions, the thickness after lamination is controlled to 2.9 mm. To achieve lightweight requirements, the PCB 2 controls the maximum thickness while reducing the copper plating ratio, and also controls the metal thickness of the second and fourth digital signal layers.

[0024] like Figure 6 As shown, the tile-type TR RF module 3 uses a TR module ceramic substrate 19 to planarly integrate RF amplifier chips, amplitude and phase multifunction chips, low-noise amplifier chips, and wave control chips. The TR module ceramic substrate 19 is preferably made of LTCC alumina ceramic material. A metal frame and a TR module metal cover plate 18 are used to seal the outer periphery and top of the TR module ceramic substrate 19 to ensure airtightness and electromagnetic shielding performance. The external interface is the TR module BGA package pad distribution 21, which interconnects with the outside through the bottom solder balls 20 of the TR module. The tile-type TR module adopts a dual RF channel design, which is replicated as the smallest basic unit. It can be mass-produced automatically, achieving high efficiency and low cost production. At the same time, the miniaturized planar packaging technology achieves an ultra-low profile height, with a profile height of 4.55mm after surface mounting, meeting the requirements of lightweight, low profile, low cost, and high integration. The transceiver RF signal of the tile-type TR component 3 is transmitted to the transceiver signal combining network in the twelfth RF signal layer through the first RF signal aperture; the receiver RF signal of the tile-type TR component 3 is transmitted to the receiver RF signal combining network in the tenth receiver RF signal layer through the second RF signal aperture; and the coupling RF signal of the tile-type TR component 3 is transmitted to the coupling signal combining network in the eighth RF signal layer through the third RF signal aperture.

[0025] like Figure 5 As shown, the tile-type delay RF component 4 uses a delay component ceramic substrate 16 to planarly integrate bidirectional amplifier chips, delay amplifier chips, and wave control chips. The delay component ceramic substrate 16 is preferably made of LTCC alumina ceramic material. A metal frame and a delay component metal cover plate 15 are used to seal the outer periphery and top of the delay component ceramic substrate 16 to ensure airtightness and electromagnetic shielding performance. The external interface is the delay component BGA package pad distribution 14, which interconnects with the outside through the solder balls 17 at the bottom of the delay component. The tile-type delay component adopts a dual RF channel design and is replicated as the smallest basic unit. It can be mass-produced automatically, achieving high efficiency and low cost production. At the same time, the miniaturized planar packaging technology achieves an ultra-low profile height of 3.3mm, meeting the requirements of lightweight, low profile, low cost, and high integration. The transceiver RF signal of the tile-type delay component 4 is transmitted to the transceiver signal combining network in the twelfth RF signal layer through the first RF signal aperture; the receiver RF signal of the tile-type delay component 4 is transmitted to the receiver signal combining network in the tenth RF signal layer through the second RF signal aperture.

[0026] The multi-functional RF module integrates a point-of-load power supply 8, which converts the power supply signal input from the J30J interface 10 into the operating voltage for components such as the tile-type TR component 3, the tile-type delay component 4, and the wave control signal driver chip 7. The power network is integrated on two thick metal power layers of a multilayer printed circuit board, corresponding to the sixth and third power layers in the stack-up. The power plane design meets power integrity requirements. The module integrates a tantalum capacitor 11 to meet the operating conditions of the array pulse for energy storage. The tantalum capacitor 11 is placed close to the tile-type TR component 3. The multi-functional RF module integrates a wave control signal driver chip 7, which outputs control signals such as clock, data, latch, transmit control, and interface control signals, which are connected to the tile-type TR component 3 and the tile-type delay component 4 on the module in different series and parallel configurations. The control signal is input through the low-frequency control interface 5, and after being driven by the wave control signal to the chip 7, it is integrated into the two digital signal layers of the multilayer printed circuit board 2, corresponding to the second and fourth digital signal layers in the stack-up, respectively. The control signal routing fully considers signal integrity, and a reference ground layer is designed between each control signal layer.

[0027] The multi-functional RF module comprises three RF signal layers, corresponding to the twelfth, tenth, and eighth RF signal layers in the stack-up diagram. It integrates a transceiver signal combining network, a receive signal combining network, and a coupling calibration signal combining network. The signals are combined by the combining networks and then output to the main port connectors, corresponding to three RF main port SSMA connectors 6. The RF signal transitions from the inner stripline to a coaxial structure formed by the third, fourth, and fifth ground vias, and connects to the SSMA connector pads through the fourth RF signal via. Considering connection reliability, the grounding post 12 of the RF main port SSMA connector 6 adopts a through-board soldering design.

[0028] A small, lightweight surface-mount RF SSMP connector 1 for multi-functional RF module arrays is used for interconnection with external antennas. After surface mounting, the height of the RF SSMP connector 1 is controlled to 2.45mm. The RF SSMP connector 1 connects to the RF pads of the tile-type TR component 3 through the fourth and third RF signal vias. The RF signal vias are surrounded by coaxial ground vias (third, fourth, and fifth) to ensure electromagnetic signal transmission and simulate electromagnetic signal leakage. The RF SSMP connector 1 is equipped with SSMP connector positioning posts 13. Each RF SSMP connector 1 has a corresponding positioning blind hole designed on the microwave mixed-signal multilayer printed circuit board 2 of the multi-functional RF module. The SSMP connector positioning post 13 mates with the positioning blind hole to meet high-precision positioning requirements and achieve lossless mating interconnection with external antennas. After the multi-functional RF module is mounted, its cross-sectional height is determined by the height of the RF SSMP connector 1, the height of the tile-type TR component 3, and the thickness of the multi-layer printed circuit board 2, with a total cross-sectional height of less than 10mm. The microwave digital-analog hybrid multi-layer printed circuit board 2 is provided with 39 M2.5 screw holes 9, which are used for mounting the multi-functional RF module to the structural components through the M2.5 screw holes 9.

[0029] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention.

Claims

1. A highly integrated planar phased array multifunctional radio frequency module, characterized in that, The invention includes a microwave mixed-signal multilayer printed circuit board. The front of the board has a surface-mount RF SSMP connector, and the back has a tile-type TR component, a tile-type delay component, and a beam control signal driver chip. The board includes multiple RF signal layers. The transceiver RF signals, receiver RF signals, and coupling RF signals of the tile-type TR component and the tile-type delay component are transmitted to the multiple RF signal layers respectively. The beam control signal driver chip is connected in series and / or in parallel with the tile-type TR component and the tile-type delay component, and outputs a control signal.

2. The highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, The microwave hybrid digital-analog multilayer printed circuit board includes a first radio frequency signal layer integrating a transceiver signal combining network, a second radio frequency signal layer integrating a receive signal combining network, a third radio frequency signal layer integrating a coupling and calibration signal combining network, and also includes a radio frequency main port SSMA connector for radio frequency signal output.

3. The highly integrated planar phased array multifunctional radio frequency module according to claim 2, characterized in that, Ground layers are set on both sides of the radio frequency signal layer to form a stripline structure. Multiple metallized vias for shielding radio frequency signals are set around the stripline.

4. The highly integrated planar phased array multifunctional radio frequency module according to claim 2, characterized in that, The radio frequency signal layer is equipped with signal transmission lines and Wilkinson power dividers.

5. A highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, The tile-type TR RF component includes a RF amplifier chip, an amplitude and phase multifunction chip, a low-noise amplifier chip, and a wave control chip that are planarly integrated on a substrate. The substrate of the tile-type TR RF component is provided with TR component BGA package pads as external interfaces. The outer periphery and top of the substrate are sealed by a metal frame and a metal cover plate.

6. A highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, The tile-type delay RF component includes a bidirectional amplifier chip, a delay amplifier chip, and a wave control chip that are planarly integrated on a substrate. The substrate of the tile-type delay RF component is provided with delay component BGA package pads as external interfaces. The outer periphery and top of the substrate are sealed by a metal frame and a metal cover plate.

7. A highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, It also includes a point-of-load power supply to provide operating voltage for tiled TR components, tiled delay components, and waveguide signal driver chips. A double-layer metal power supply layer for power network integration is provided on the microwave mixed-signal multilayer printed circuit board.

8. A highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, The microwave mixed analog-digital multilayer printed circuit board is provided with multiple radio frequency (RF) signal holes. The tile-type TR component is connected to the RF signal layer through one or more of the RF signal holes. The tile-type delay component is connected to the RF signal layer through one or more of the RF signal holes. The RF signal layer is connected to the RF main port SSMA connector through one or more of the RF signal holes. The RF SSMP connector is connected to the tile-type TR component through one or more of the RF signal holes.

9. A highly integrated planar phased array multifunctional radio frequency module according to claim 1, characterized in that, The microwave hybrid digital-analog multilayer printed circuit board is provided with a low-frequency control interface and multiple digital signal layers. The control signal input from the low-frequency control interface is integrated into the digital signal layer through a wave control signal driving chip. A reference ground layer is provided between adjacent digital signal layers.

10. A highly integrated planar phased array multifunctional radio frequency module according to any one of claims 1-9, characterized in that, The microwave hybrid analog-digital multilayer printed circuit board has thirteen layers, including multiple radio frequency (RF) signal layers, multiple power layers, multiple digital signal layers, and multiple ground layers. Multiple ground vias and multiple RF signal vias are provided on the layers. Ground layers are provided on both sides of the RF signal layers, forming a stripline structure. Ground layers are also provided on both sides of the digital signal layers. The multiple ground vias form a quasi-coaxial structure for the RF signal to transition along the stripline structure. An RF main port SSMA connector is provided on the microwave hybrid analog-digital multilayer printed circuit board, which connects to the quasi-coaxial structure through RF signal vias. The grounding post of the RF main port SSMA connector adopts a through-board soldering design. An RF SSMP connector connects to a tile-type TR component through RF signal vias. The RF SSMP connector has SSMP connector positioning posts. Positioning blind holes for SSMP connector positioning post mating are provided on the microwave hybrid analog-digital multilayer printed circuit board. Tantalum capacitors are provided on the microwave hybrid analog-digital multilayer printed circuit board, positioned close to the tile-type TR component. The overall cross-sectional height of the multifunctional RF module is less than 10mm.

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