Display panel and driving method thereof

Abstract

The present disclosure relates to the technical field of display, and in particular to a display panel and a driving method thereof. The display panel comprises a first substrate, a second substrate, a liquid crystal layer and a temperature measurement structure. The first substrate is provided with a driving chip. The second substrate is provided opposite the first substrate, and the second substrate is provided with an inductive line. The inductive line can be electrically connected to a signal receiving end of the driving chip. The liquid crystal layer is filled between the first substrate and the second substrate. The temperature measurement structure penetrates the liquid crystal layer, and opposite ends of the temperature measurement structure are respectively in abutment with the first substrate and the second substrate. The opposite ends of the temperature measurement structure are also respectively electrically connected to a signal transmitting end of the driving chip and the inductive line. The temperature measurement structure is configured to measure the temperature of the liquid crystal layer. By letting the temperature measurement structure penetrate the liquid crystal layer, real-time and accurate sensing of the real working temperature of the liquid crystal can be achieved, and measurement error can be reduced. By making the opposite ends of the temperature measurement structure in abutment with the first substrate and the second substrate, the temperature measurement structure can be used to strengthen the support of the two substrates.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display panel and its driving method. Background Technology

[0002] At low temperatures, the response speed of liquid crystal materials decreases exponentially, leading to severe ghosting, contrast degradation, and even failure to start up in LCD displays. To improve this, current methods typically involve attaching heating and temperature sensing structures to the surface of the LCD cell to measure its temperature and heat it. However, due to the limited contact area between the heating and temperature sensing structures and the LCD cell, the temperature sensing structure cannot accurately detect the internal temperature of the LCD cell, and the heat generated by the heating structure cannot be directly and evenly released inside the LCD cell. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display panel and its driving method that can achieve real-time and accurate sensing of the actual operating temperature of the liquid crystal, thereby reducing measurement errors.

[0004] This disclosure provides a display panel, including:

[0005] The first substrate is equipped with a driver chip; The second substrate is disposed opposite to the first substrate, and the second substrate is provided with sensing lines, which are electrically connected to the signal receiving end of the driver chip. A liquid crystal layer is filled between the first substrate and the second substrate; A temperature-sensing structure penetrates the liquid crystal layer, and its opposite ends abut against the first substrate and the second substrate, respectively. The opposite ends of the temperature-sensing structure are also electrically connected to the signal transmitting end of the driving chip and the sensing line, respectively. The temperature-sensing structure is configured to measure the temperature of the liquid crystal layer.

[0006] In an exemplary embodiment of this disclosure, the temperature measuring structure includes a temperature measuring element and an insulating layer. The two opposite ends of the temperature measuring element are electrically connected to the signal transmitting end of the driving chip and the induction line, respectively. The insulating layer wraps around the outer periphery of the temperature measuring element. Wherein: the two ends of the temperature measuring element are flush with the two ends of the insulating layer, or the two ends of the temperature measuring element protrude from the two ends of the insulating layer.

[0007] In an exemplary embodiment of this disclosure, the temperature measuring structure includes a temperature measuring element and an insulating layer. The two opposite ends of the temperature measuring element are electrically connected to the signal transmitting end of the driving chip and the induction line, respectively. The insulating layer wraps around the outer periphery of the temperature measuring element. The display panel includes a heating structure, which includes a first heating element embedded in the insulating layer and penetrating the liquid crystal layer. The first heating element is spaced apart from the temperature measuring element, and its opposite ends are electrically connected to the signal transmitting end and the signal receiving end of the driving chip, respectively. The first heating element is configured to generate heat according to the temperature measurement data of the temperature measuring element, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than a preset temperature.

[0008] In one exemplary embodiment of this disclosure, the first heating element is an open annular shape and is disposed around a portion of the outer periphery of the temperature measuring element.

[0009] In one exemplary embodiment of this disclosure, the heating structure includes a second heating element, which is disposed on the second substrate and located on the side of the liquid crystal layer opposite to the first substrate; One end of the second heating element is electrically connected to one end of the first heating element near the second substrate, and the other end is electrically connected to the signal receiving end of the driving chip. The second heating element is configured to generate heat according to the temperature measurement data, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than the preset temperature.

[0010] In an exemplary embodiment of this disclosure, the display panel includes an excitation line disposed on the first substrate, one end of the excitation line being electrically connected to the signal transmitting end of the driving chip, and the other end being electrically connected to the end of the first heating element and the temperature measuring element near the first substrate. The signal receiving end of the driver chip includes switchable heating mode and temperature measurement mode: In the temperature measurement mode, the signal receiving end of the driving chip receives the signal from the sensing line and stops receiving the signal from the heating structure. The current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the excitation line, the temperature measuring element and the sensing line to drive the temperature measuring element to perform temperature measurement. In the heating mode, the signal receiving end of the driving chip receives the signal from the heating structure and stops receiving the signal from the induction line. The signal transmitting end of the driving chip applies current to the heating structure according to the temperature measurement data of the temperature measuring element. The current returns to the signal receiving end of the driving chip through the excitation line, the first heating element and the second heating element to drive the heating structure to generate heat.

[0011] In an exemplary embodiment of this disclosure, the display panel includes a display area and a non-display area surrounding the outer periphery of the display area, the liquid crystal layer and the temperature sensing structure are disposed within the display area; the second substrate includes a common electrode; the display panel further includes: A common ground line is provided on the first substrate; The first pad is located in the display area and is disposed on the side of the first substrate near the second substrate. The temperature measuring element and the first heating element are both electrically connected to the excitation line through the first pad. The second pad is located in the display area and is disposed on the side of the second substrate close to the first substrate. The temperature measuring element is electrically connected to the sensing line through the second pad, and the first heating element is electrically connected to the second heating element through the second pad. The first edge pad is located in the non-display area and is disposed on the side of the first substrate close to the second substrate. The driver chip and the common ground line are both electrically connected to the first edge pad. The second edge pad is located in the non-display area and is disposed on the side of the second substrate close to the first substrate. The induction line, the second heating element and the common electrode are all electrically connected to the second edge pad. A frame adhesive is located in the non-display area, and its opposite ends are connected to the first substrate and the second substrate; the frame adhesive contains conductive particles, which are configured to enable electrical conduction between the first edge pad and the second edge pad.

[0012] In one exemplary embodiment of this disclosure, the display panel includes a display area, the display area including a pixel opening area and a non-pixel opening area disposed around the outer periphery of the pixel opening area; The liquid crystal layer is located at least in the pixel opening region, and the temperature measuring structure is located in the non-pixel opening region.

[0013] This disclosure provides a driving method for a display panel, the driving method being used for the aforementioned display panel, the display panel including alternating display periods and non-display periods, the display panel displaying normally during the display periods; the non-display periods include temperature measurement periods; The driving method includes: During the temperature measurement period, the current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the temperature measuring structure and the sensing line, so as to drive the temperature measuring structure to perform temperature measurement.

[0014] In one exemplary embodiment of this disclosure, the display panel further includes a heating structure, the opposite ends of which are electrically connected to the signal transmitting end and the signal receiving end of the driving chip; the non-display period also includes a heating period, after which the display panel enters the heating period; The driving method further includes: If the temperature measurement data of the temperature measuring structure is lower than the preset temperature during the temperature measurement period: when entering the heating period, the driving chip applies current to the heating structure to drive the heating structure to generate heat; If the temperature measurement data of the temperature measuring structure is not lower than the preset temperature during the temperature measurement period: when entering the heating period, the driving chip stops applying current to the heating structure so that the heating structure stops generating heat.

[0015] In one exemplary embodiment of this disclosure, the display panel includes an excitation line disposed on the first substrate. One end of the excitation line is electrically connected to the signal transmitting end of the driving chip, and the other end is electrically connected to the end of the first heating element and the temperature measuring structure near the first substrate. The signal receiving end of the driving chip includes a switchable heating mode and a temperature measuring mode. The driving method further includes: During the temperature measurement period, the signal receiving end of the driving chip is in the temperature measurement mode. The signal receiving end of the driving chip receives the signal from the induction line and stops receiving the signal from the heating structure. The current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the excitation line, the temperature measurement structure and the induction line. During the heating period, the signal receiving end of the driving chip switches to the heating mode, receives the signal from the heating structure, and stops receiving the signal from the induction line. The current applied by the signal transmitting end of the driving chip flows to the heating structure through the excitation line and returns to the signal receiving end of the driving chip.

[0016] The technical solutions provided in this disclosure have at least the following advantages: This embodiment of the invention allows the temperature sensing structure to penetrate the liquid crystal layer, enabling direct contact between the temperature sensing structure and the interior of the liquid crystal layer. This allows for direct detection of the internal temperature of the liquid crystal layer. Since the temperature sensing structure and the interior of the liquid crystal layer are in the same thermal environment, it achieves real-time and accurate sensing of the actual operating temperature of the liquid crystal. This reduces or avoids measurement errors caused by only detecting the surface temperature of the liquid crystal layer, and allows for more accurate acquisition of the actual temperature of the liquid crystal layer. This provides a reliable basis for subsequent temperature adjustment of the liquid crystal layer based on the temperature measurement data of the temperature sensing structure, maintaining the response speed of the liquid crystal material in the liquid crystal layer, and thus ensuring that the display panel can maintain a stable display effect in low-temperature environments.

[0017] Furthermore, by having the two ends of the temperature measuring structure abut against the first and second substrates, the temperature measuring structure can strengthen the support for the first and second substrates, improve the problem of deformation of the first and second substrates caused by the internal and external pressure difference of the display panel, reduce the risk of uneven display of the display panel, and also help maintain the uniformity of the liquid crystal layer thickness, further improving the display stability of the display panel.

[0018] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0021] Figure 1 A cross-sectional structural schematic diagram of a display panel according to an embodiment of the present disclosure is shown.

[0022] Figure 2 It shows Figure 1 A cross-sectional schematic diagram of the temperature measurement structure.

[0023] Figure 3 It shows Figure 2 Top view of the temperature measuring structure.

[0024] Figure 4 It shows Figure 1 An example diagram showing the distribution of induction lines on the second substrate side.

[0025] Figure 5 A schematic cross-sectional view of the display panel in an embodiment of this disclosure is shown.

[0026] Figure 6 It shows Figure 5 A cross-sectional schematic diagram of the temperature measuring structure and the first heating element.

[0027] Figure 7 It shows Figure 6 Top view of the temperature measuring structure and the first heating element.

[0028] Figure 8 It shows Figure 5 An example diagram showing the distribution of the induction lines and the second heating element on the second substrate side.

[0029] Figure 9 This diagram illustrates an example of the distribution of the sensing lines and the second heating element of the mobile phone on the second substrate side in an embodiment of this disclosure.

[0030] Figure 10 A timing diagram of the display panel in an embodiment of this disclosure is shown.

[0031] Figure 11 A flowchart illustrating the operation of the display panel in an embodiment of this disclosure is shown.

[0032] Explanation of reference numerals in the attached figures: 1. First substrate; 11. First pad; 12. First edge pad; 21. Substrate; 221. Color resist block; 222. Light-shielding block; 23. Second pad; 24. Second edge pad; 31. Sensing line; 32. Insulating layer; 33. Temperature measuring element; 34. First heating element; 35. Second heating element; 4. Frame adhesive; 41. Conductive microparticles. Detailed Implementation

[0033] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0034] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0035] The present disclosure will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0036] like Figure 1As shown, this disclosure provides a display panel, which may include: a first substrate 1, a second substrate, a liquid crystal layer, and a temperature sensing structure. The first substrate 1 is provided with a driving chip, and the second substrate is disposed opposite to the first substrate 1. The second substrate is provided with a sensing line 31, which is electrically connected to the signal receiving end of the driving chip. The liquid crystal layer fills the space between the first substrate 1 and the second substrate. The temperature sensing structure penetrates the liquid crystal layer, with its opposite ends abutting against the first substrate 1 and the second substrate, respectively. The opposite ends of the temperature sensing structure are also electrically connected to the signal transmitting end of the driving chip and the sensing line 31, respectively. The temperature sensing structure is configured to measure the temperature of the liquid crystal layer; that is, the temperature sensing structure can measure the temperature of the liquid crystal layer under the drive of the driving chip.

[0037] This disclosure allows the temperature sensing structure to penetrate the liquid crystal layer, enabling direct contact between the structure and the interior of the liquid crystal layer. This allows for direct detection of the internal temperature of the liquid crystal layer, as the temperature sensing structure and the interior of the liquid crystal layer are in the same thermal environment. This achieves real-time and accurate sensing of the actual operating temperature of the liquid crystal, reducing or avoiding measurement errors caused by only detecting the surface temperature of the liquid crystal layer. It enables more accurate acquisition of the actual temperature of the liquid crystal layer, providing a reliable basis for subsequent temperature adjustment of the liquid crystal layer based on the temperature measurement data of the temperature sensing structure. This maintains the response speed of the liquid crystal material in the liquid crystal layer, thereby ensuring that the display panel can maintain a stable display effect in low-temperature environments.

[0038] Furthermore, by having the two ends of the temperature measuring structure abut against the first substrate 1 and the second substrate, the temperature measuring structure can strengthen the support for the first substrate 1 and the second substrate, improve the problem of deformation of the first substrate 1 and the second substrate caused by the internal and external pressure difference of the display panel, reduce the risk of uneven display of the display panel, and also help maintain the uniformity of the liquid crystal layer thickness, further improving the display stability of the display panel.

[0039] like Figures 2 to 4 As shown, in some embodiments, the temperature measuring structure may include a temperature measuring element 33 and an insulating layer 32. The two ends of the temperature measuring element 33 are electrically connected to the signal transmitting end of the driving chip and the sensing line 31, respectively. The insulating layer 32 wraps around the outer periphery of the temperature measuring element 33. The temperature measuring element 33 is configured to measure the temperature of the liquid crystal layer under the drive of the driving chip. The insulating layer 32 has insulating properties, which can reduce or avoid electrical signal interference from other surrounding conductive structures, ensuring the accuracy of the temperature measurement data output by the temperature measuring element 33. It also prevents direct contact between the temperature measuring element 33 and the liquid crystal layer, reducing or avoiding adverse effects of the temperature measuring element 33 on the electrical properties and display effect of the liquid crystal material. This achieves accurate temperature measurement while maintaining the normal display performance of the display panel.

[0040] For example, the temperature sensing element 33 may adopt a conductive core structure, and the material used to make it may include materials such as platinum (Pt) or nickel (Ni) that have a high temperature coefficient of resistance and whose resistance value changes linearly with temperature, so that the temperature sensing element 33 can be used as a temperature sensitive element.

[0041] In this disclosure, the opposite ends of the insulating layer 32 can abut against the first substrate 1 and the second substrate to strengthen the support for the first substrate 1 and the second substrate.

[0042] The insulating layer 32 can be made of materials with good insulation and structural hardness, such as photosensitive resin. While achieving electrical isolation between the temperature measuring element 33 and the surrounding conductive structures such as liquid crystal, it can also provide mechanical support for the first substrate 1 and the second substrate.

[0043] In some embodiments, the opposite ends of the temperature sensing element 33 can be flush with the opposite ends of the insulating layer 32. In this case, the insulating layer 32 can completely cover the outer peripheral surface of the temperature sensing element 33 to improve the problem of electrical signal interference from other surrounding conductive structures to the temperature sensing element 33. The end face of the temperature sensing element 33 near the first substrate 1 is exposed to facilitate electrical connection with the driver chip. For details, please refer to... Figure 2 As shown.

[0044] However, this disclosure is not limited to this. The two ends of the temperature measuring element 33 can be made to protrude from the two ends of the insulating layer 32. The protruding part of the temperature measuring element 33 relative to the insulating layer 32 can be directly electrically connected to the driver chip. This eliminates the need to set an additional wiring structure on the end face of the temperature measuring element 33 for electrical connection with the driver chip or the sensing line 31, thus simplifying the connection process.

[0045] It should be noted that the display panel may include a display area and a non-display area. The display panel displays the image in the display area, and the non-display area is arranged around the perimeter of the display area. The liquid crystal layer and temperature sensing structure are located within the display area.

[0046] The display area may include pixel aperture areas and non-pixel aperture areas, with the non-pixel aperture areas surrounding the outer periphery of the pixel aperture areas. The liquid crystal layer is located at least in the pixel aperture areas to enable image display on the display panel, while the temperature sensing structure is located in the non-pixel aperture areas to avoid occupying the pixel aperture areas and to ensure the pixel aperture ratio of the display panel.

[0047] In some embodiments, the temperature measuring structure can be located within a non-pixel opening area to avoid occupying the pixel opening area and to ensure the pixel aperture ratio and display resolution of the display panel.

[0048] For example, such as Figure 1 and Figure 4As shown, the second substrate may include a substrate 21 and a color resist layer. The color resist layer may include multiple color resist blocks 221 and multiple light-shielding blocks 222. The color resist blocks 221 can be used to filter different colors of light to achieve color display of the display panel. For example, the color resist blocks 221 may include red color resist block 221 (R), green color resist block 221 (G), and blue color resist block 221 (B), and the three colors of color resist blocks 221 can be arranged in an array at intervals. The light-shielding blocks 222 have light-shielding properties and are located between two adjacent color resist blocks 221 to improve the problem of color crosstalk between two adjacent color resist blocks 221. The light-shielding blocks 222 are located entirely within the non-pixel opening area. The orthogonal projection of the temperature measuring structure on the color resist layer can be located on the light-shielding blocks 222, so as to hide the temperature measuring structure by utilizing the light-shielding block 222's opaque property.

[0049] In some embodiments, the display panel may include multiple temperature measuring structures, which are connected in parallel and arranged in an array to improve the overall heating efficiency and heating uniformity of the display panel.

[0050] For example, multiple temperature measuring structures can be distributed throughout the entire display area and evenly arranged. Each temperature measuring element 33 can be independently connected to a sensing line 31. By scanning and reading the temperature of each temperature measuring structure position one by one, a high-resolution temperature distribution cloud map is constructed, which is suitable for high-end displays with extremely high requirements for temperature uniformity.

[0051] However, this disclosure also allows for the uniform placement of multiple temperature sensing structures within a localized display area of ​​the display panel, with each structure positioned at a certain interval (e.g., every 5-10 pixel rows / columns) to monitor the temperature of only critical areas of the display panel. This significantly reduces the number of traces and pads on one side of the second substrate, lowering process complexity and cost, making it suitable for consumer products. Furthermore, the density of the temperature sensing structures in the display panel is not limited and can be freely selected based on product positioning.

[0052] like Figures 5 to 8 As shown, in some embodiments, the display panel may include a heating structure, which may include a first heating element 34. The first heating element 34 is disposed through the liquid crystal layer and spaced apart from the temperature measuring element 33. The opposite ends of the first heating element 34 are electrically connected to the signal transmitting end and the signal receiving end of the driving chip, respectively. The first heating element 34 is configured to generate heat according to the temperature measurement data of the temperature measuring element 33, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than a preset temperature.

[0053] It should be noted that the "preset temperature" mentioned above refers to the minimum critical temperature at which the liquid crystal can function properly. When the ambient temperature is below this critical temperature, the response speed of the liquid crystal slows down, which in turn leads to poor display problems such as ghosting and lag in the display image.

[0054] This disclosure uses the first heating element 34 to heat the liquid crystal layer in a timely manner, maintaining the temperature of the liquid crystal layer at or above a preset temperature, so as to ensure that the liquid crystal maintains good flow response characteristics and ensure the display effect of the display panel in low temperature environment.

[0055] Compared to related technologies that directly attach an additional thermal film between the backlight module and the display panel, this disclosure allows the first heating element 34 to penetrate through the liquid crystal layer, enabling it to directly contact the interior of the liquid crystal layer and directly heat it without penetrating the multi-layer optical film and substrate between the backlight module and the liquid crystal layer. This shortens the heat conduction path, thereby improving the thermal response rate, reducing the energy consumption of the heating structure, reducing or eliminating electrical interference of the display driving signal, and achieving real-time, accurate, and in-situ sensing of the operating temperature of the liquid crystal layer.

[0056] The first heating element 34 in this disclosure is in direct contact with the interior of the liquid crystal layer, which can improve the situation where a significant temperature gradient is formed when the heat of the heating film is transferred from the outer surface of the liquid crystal layer to the interior. This can improve the problem of regional differences in response speed caused by temperature differences in the liquid crystal at different locations in the liquid crystal layer, thereby improving the overall display uniformity of the display panel.

[0057] In addition, while the first heating element 34 penetrates the liquid crystal layer, its entire structure remains between the first substrate 1 and the second substrate, thus avoiding the problem of the first heating element 34 being attached to the surface of the liquid crystal layer, which would increase the overall thickness of the display panel and make it easier to achieve a thinner and lighter display panel.

[0058] In some embodiments, the first heating element 34 may be embedded in the insulating layer 32 to reduce the space occupied by the liquid crystal layer and improve the pixel aperture ratio of the display panel.

[0059] The two ends of the first heating element 34 can be flush with the two ends of the insulating layer 32, or they can protrude from the two ends of the insulating layer 32 to facilitate electrical connection with the driving chip.

[0060] The first heating element 34 and the temperature measuring element 33 can be isolated by the insulating layer 32 to reduce or avoid interference from the first heating element 34 to the temperature measuring result of the temperature measuring element 33, ensuring that the temperature measuring element 33 can accurately collect the actual temperature of the liquid crystal layer. However, it is not limited to this. The first heating element 34 and the temperature measuring element 33 can also be separated by an insulating material other than the insulating layer 32 (such as a deposited SiO2 thin layer) to achieve complete electrical isolation in the vertical direction (i.e., the direction from the first substrate 1 to the second substrate).

[0061] Furthermore, such as Figures 6 to 7 As shown, the first heating element 34 may be in the shape of an open ring and be arranged around a portion of the outer periphery of the temperature measuring element 33.

[0062] It should be noted that the cross-sectional size of the insulating layer 32 is relatively small in order to reduce the occupation of the pixel opening area of ​​the display panel. When the first heating element 34 and the temperature measuring element 33 are arranged side by side (for example, both the first heating element 34 and the temperature measuring element 33 are cylindrical and arranged side by side), in order to ensure a safe distance between them, it is necessary to either increase the cross-sectional size of the insulating layer 32 or reduce the cross-sectional size of the first heating element 34 and the temperature measuring element 33. If the cross-sectional size of the insulating layer 32 is increased, it will lead to the occupation of the pixel opening area of ​​the display panel, thereby reducing the pixel aperture ratio of the display panel. If the cross-sectional size of the first heating element 34 is reduced, the heating area of ​​the first heating element 34 will be insufficient, making it difficult to quickly heat the liquid crystal layer to a suitable temperature in a low-temperature environment. If the cross-sectional size of the temperature measuring element 33 is reduced, the temperature measuring sensitivity of the temperature measuring element 33 will be reduced, making it impossible to accurately capture the temperature changes of the liquid crystal layer, affecting the accuracy of temperature control.

[0063] To solve the above-mentioned technical problems, this disclosure arranges the first heating element 34 in an open annular shape around the temperature measuring element 33. The first heating element 34 can share the radial space with the temperature measuring element 33, which improves the space utilization rate. It does not require increasing the cross-sectional size of the insulating layer 32, nor does it require reducing the cross-sectional size of the first heating element 34 and the temperature measuring element 33. This ensures that the first heating element 34 has a sufficient heating area to maintain heating efficiency, and also ensures the temperature measuring sensitivity of the temperature measuring element 33. At the same time, it does not occupy additional space in the pixel opening area, thus avoiding the problem of decreased pixel opening rate.

[0064] The insulating layer 32, the first heating element 34, and the temperature measuring element 33 can be regarded as an integral structural unit. This structural unit can simultaneously achieve high-precision temperature sensing and efficient heating, realize closed-loop temperature control of the display panel, and increase the functional density without increasing the space occupation.

[0065] like Figure 5 , Figure 6 and Figure 8 As shown, when the two ends of the first heating element 34 and the temperature measuring element 33 are connected to other structures, they can be connected to other structures from different directions. This improves the wiring congestion problem at the connection end, reduces the process difficulty caused by the same-side lead arrangement, and avoids the risk of short circuit caused by the small lead spacing when connected on the same side. It improves the rationality of the internal wiring of the display panel and the yield of finished products, and does not increase the process complexity in the manufacturing process. It is naturally compatible with the wiring requirements of existing display panels.

[0066] The first heating element 34 is arranged in an open ring around the outer periphery of the temperature measuring element 33, which can make the temperature around the temperature measuring element 33 more uniform and the measured temperature more representative. At the same time, it can increase the contact area with the interior of the liquid crystal layer, thereby transferring heat to different directions inside the liquid crystal layer, improving the uniformity of the temperature inside the liquid crystal layer, and thus improving the accuracy of the temperature measurement results of the temperature measuring element 33.

[0067] Compared to the scheme of setting the first heating element 34 as a fully enclosed ring, this disclosure makes the first heating element 34 an open ring, which can facilitate the outward dissipation of heat and improve the problem of heat accumulation between the first heating element 34 and the temperature measuring element 33, which causes local overheating of the temperature measuring line, interferes with the real-time temperature measurement accuracy of the temperature measuring line, and leads to temperature detection distortion.

[0068] In the manufacturing process, the temperature measuring element 33 can be fabricated first, and then the first heating element 34 with an open ring shape can be formed by electroplating through a semi-enclosed mask. Compared with the more complex photolithography and insulation isolation process required for the first heating element 34 and the temperature measuring element 33 to be arranged side by side, this disclosure arranges the first heating element 34 in an open ring shape around the outer periphery of the temperature measuring element 33, which makes the overall manufacturing process simple and the alignment accuracy requirement moderate.

[0069] For example, the temperature measuring element 33 can be in the shape of a uniform cylinder, the first heating element 34 can be in the shape of an open annulus, and the insulating layer 32 can be a cylindrical or frustum-shaped structure covering the outer periphery of the temperature measuring element 33 and the first heating element 34. The central axes of the temperature measuring element 33, the first heating element 34 and the insulating layer 32 can coincide.

[0070] The wall thickness of the first heating element 34 can be in the range of 1.0μm to 1.5μm, for example: 1.0μm, 1.1μm, 1.2μm, 1.3μm, 1.4μm, 1.5μm, etc., and can be determined according to the actual situation.

[0071] The wall thickness of the insulating layer 32 can be in the range of 10μm to 12μm, for example: 10μm, 10.5μm, 11μm, 11.5μm, 12μm, etc., and can be determined according to the actual situation.

[0072] In some embodiments, the heating structure may include a second heating element 35, which is disposed on the second substrate and located on the side of the liquid crystal layer opposite to the first substrate 1. One end of the second heating element 35 is electrically connected to the end of the first heating element 34 near the second substrate, and the other end is electrically connected to the signal receiving end of the driving chip. The second heating element 35 is configured to generate heat according to the temperature measurement data of the temperature measuring element 33, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than a preset temperature.

[0073] By providing a second heating element 35, this disclosure can further improve the heating efficiency of the liquid crystal layer. Especially in scenarios with large display panel sizes, it can reduce the temperature difference between different areas of the liquid crystal layer, ensure uniform temperature across the entire liquid crystal layer, and avoid display abnormalities caused by substandard temperatures in some areas.

[0074] For example, the materials used to prepare the first heating element 34 and the second heating element 35 can be low resistivity materials such as copper or aluminum. While converting some electrical energy into Joule heat to heat the liquid crystal layer, it can also reduce its own voltage drop and improve heating efficiency.

[0075] The second heating element 35 can be distributed in a continuous grid or planar pattern on the second substrate to cover the entire display area and achieve uniform heating of the display area.

[0076] Furthermore, such as Figure 8 As shown, the second heating element 35 can be located in a non-pixel opening area to avoid occupying the pixel opening area.

[0077] When the display panel has multiple temperature sensing structures, it can also be equipped with multiple first heating elements 34, each corresponding to a temperature sensing structure. Multiple first heating elements 34 can be connected in parallel with second heating elements 35. The driving chip can drive all the parallel-connected first heating elements 34 or all the temperature sensing structures uniformly. When the driving chip applies voltage, current can simultaneously flow through all the parallel-connected first heating elements 34 and / or all the parallel-connected temperature sensing structures. All the parallel-connected first heating elements 34 share the same voltage (current), and all the parallel-connected temperature sensing structures share the same voltage (current), achieving uniform heating and / or uniform temperature measurement across the entire surface.

[0078] In some embodiments, the second heating element 35 and the sensing line 31 may be arranged side by side on the same layer in the same non-pixel opening area, but are not limited thereto. The second heating element 35 and the sensing line 31 may also be arranged in different non-pixel opening areas or on different layers.

[0079] Taking a second substrate comprising a color resist layer, and the color resist layer comprising a light-shielding block 222 disposed between two adjacent color resist blocks 221, with the light-shielding block 222 located in a non-pixel opening area as an example: when the width of the light-shielding block 222 is sufficient (e.g., width not less than 10μm), the second heating element 35 and the sensing line 31 can be arranged side by side on the same layer, with their orthogonal projections on the color resist layer located on the same light-shielding block 222, and the two parallel to each other while maintaining a safe distance. This design features neat wiring, is easy to implement by photolithography, and the second heating element 35 and the sensing line 31 can be completed in the same process, resulting in high process efficiency.

[0080] When the width of the light-shielding block 222 is small: the second heating element 35 and the sensing line 31 can be arranged on different layers with an insulating structure between them; alternatively, the second heating element 35 and the sensing line 31 can be staggered on the same layer, with their orthogonal projections on the color resist layer located on adjacent light-shielding blocks 222, so that the second heating element 35 and the sensing line 31 are not on the same horizontal plane or below the same light-shielding block 222. This design can improve the short-circuit risk caused by insufficient linewidth of the second heating element 35 and the sensing line 31, make full use of vertical space or the area of ​​adjacent light-shielding blocks 222, and is suitable for situations where the width of the light-shielding block 222 is narrow (e.g., less than 8μm) or the process precision is limited.

[0081] In some embodiments, the display panel may include an excitation line disposed on the first substrate 1. One end of the excitation line is electrically connected to the signal transmitting end of the driving chip, and the other end is electrically connected to the end of the first heating element 34 and the temperature measuring element 33 near the first substrate 1, so as to transmit the current applied by the driving chip to the first heating element 34 and the temperature measuring element 33.

[0082] Specifically, the excitation line can be connected to the temperature control port in the signal transmitting end of the driver chip.

[0083] The signal receiving end of the driver chip includes switchable heating mode and temperature measurement mode. In temperature measurement mode: the signal receiving end of the driver chip receives the signal from the induction line 31 and stops receiving signals from the heating structure. The current applied by the signal transmitting end of the driver chip returns to the signal receiving end of the driver chip via the excitation line, the temperature measuring element 33, and the induction line 31 to drive the temperature measuring element 33 to measure the temperature. In heating mode: the signal receiving end of the driver chip receives the signal from the heating structure and stops receiving signals from the induction line 31. The signal transmitting end of the driver chip applies current to the heating structure according to the temperature measurement data from the temperature measuring element 33. The current returns to the signal receiving end of the driver chip via the excitation line, the first heating element 34, and the second heating element 35 to drive the heating structure to generate heat.

[0084] This disclosure achieves functional separation of heating and temperature measurement on the second substrate side by electrically connecting the first heating element 34 and the temperature measuring element 33 near one end of the first substrate 1 to the same excitation line. The excitation line can simultaneously serve as the input channel for both the first heating element 34 and the temperature measuring element 33. The mode of the signal receiving end of the driving chip is switched by time-division driving, and the temperature measuring element 33 and the first heating element 34 form different circuits on one side of the second substrate. That is, the heating function and the temperature measurement function are independent of each other on the second substrate side and do not interfere with each other.

[0085] Compared to the technical solution where the first heating element 34 and the temperature measuring element 33 are electrically connected to the driving chip through different traces at the ends of the first substrate 1, this disclosure can reduce the number of traces on the first substrate 1, thereby reducing the wiring density of the first substrate 1, reducing the probability of signal interference between traces, and reserving more layout space for other functional components.

[0086] It should be noted that the excitation lines in this disclosure can be non-TP traces (i.e., non-touch panel traces, or dummy lines) of the first substrate 1 in the display area. These dummy lines are in a floating or fixed potential state during normal display driving.

[0087] This disclosure utilizes the existing dummy lines on the first substrate 1 as excitation lines, eliminating the need to fabricate dedicated excitation traces on the first substrate 1 or to add additional pins to the driver chip. This avoids occupying additional wiring area and does not increase the fabrication process of the first substrate 1 or the design difficulty of the driver chip. It can complete the processing using the existing substrate and driver chip fabrication processes, without increasing the overall manufacturing cost of the display panel. At the same time, it can fully reuse existing idle traces and improve the utilization rate of the internal space of the display panel.

[0088] Furthermore, it should be noted that the sensing line 31 and the second heating element 35 can be connected to the same signal receiving end of the driver chip, but are not limited thereto. The sensing line 31 and the second heating element 35 can also be connected to different signal receiving ends of the driver chip. In either case, the driver chip can switch between heating mode and temperature measurement mode to achieve time-division multiplexing of temperature measurement and heating of the liquid crystal layer.

[0089] In some embodiments, the display panel may include a first pad 11 located in the display area and disposed on the side of the first substrate 1 near the second substrate. The temperature sensing element 33 and the first heating element 34 are both electrically connected to the excitation line via the first pad 11. The first pad 11 provides a connection point for the temperature sensing element 33 and the first heating element 34. Both the temperature sensing element 33 and the first heating element 34 can be shorted to the first pad 11, and both are at the same potential on one side of the first substrate 1.

[0090] In some embodiments, the display panel may include a second pad 23 located in the display area and disposed on the side of the second substrate close to the first substrate 1. The temperature measuring element 33 is electrically connected to the sensing line 31 through the second pad 23, and the first heating element 34 is electrically connected to the second heating element 35 through the second pad 23.

[0091] In some embodiments, the display panel may include a first edge pad 12, which is located in the non-display area and disposed on the side of the first substrate 1 near the second substrate, and the driver chip is electrically connected to the first edge pad 12.

[0092] In some embodiments, the display panel may include a second edge pad 24, which is located in the non-display area and disposed on the side of the second substrate close to the first substrate 1. The sensing line 31 and the second heating element 35 are both electrically connected to the second edge pad 24.

[0093] It should be understood that the first pad 11, the second pad 23, the first edge pad 12 and the second edge pad 24 can serve as conductive connection points between lines (or components) to achieve stable electrical signal conduction, improve the problem of easy breakage and poor contact when fine traces are directly connected, and can be used for cross-substrate interconnection between traces.

[0094] The first pad 11, the second pad 23, the first edge pad 12 and the second edge pad 24 can be set to one or more. When multiple pads are set, they should be arranged at intervals between adjacent pads.

[0095] For example, when the display panel includes multiple temperature measuring structures, multiple first pads 11 and second pads 23 can be provided. The first pads 11 and the second pads 23 correspond one-to-one with the temperature measuring structures. The first pads 11 are located between the first substrate 1 and the corresponding temperature measuring structure, and the second pads 23 are located between the second substrate and the corresponding temperature measuring structure.

[0096] In this disclosure, one end of the sensing line 31 can extend to the alignment area of ​​the temperature measuring structure to form a first pad 11 for contact with the temperature measuring structure, and the other end can converge and extend to the non-display area at the edge of the display panel (specifically, it can be limited to the bonding area within the non-display area) to form a second edge pad 24.

[0097] In some embodiments, the second substrate may include a common electrode that may be electrically connected to the second edge pad 24.

[0098] The display panel may also include a common ground wire, which is disposed on the first substrate 1 and electrically connected to the first edge pad 12. The common ground wire can be used to lead out the electrical signal of the common electrode to ground, so as to avoid the residual signal on the common electrode from interfering with the normal operation of the induction line 31 and the heating structure, and to ensure the operational stability of the temperature measurement and heating functions.

[0099] In some embodiments, the display panel may further include a frame adhesive 4 located in the non-display area, with its opposite ends connected to the first substrate 1 and the second substrate. Conductive particles 41 may be disposed within the frame adhesive 4, and the conductive particles 41 are configured to enable electrical conduction between the first edge pad 12 and the second edge pad 24.

[0100] For example, the conductive particles 41 may be made of a metal with good conductivity, such as gold (Au). The conductive particles 41 can be uniformly mixed into the frame adhesive 4, and after the first substrate 1 and the second substrate are laminated together, electrical conduction is achieved between the second edge pad 24 on the second substrate and the first edge pad 12 on the first substrate 1, forming a complete current return path.

[0101] This disclosure allows for the selective growth of metal on the first substrate 1 at the first pad 11 corresponding to the temperature sensing structure location via electroplating or chemical plating. The metal material is deposited on the surface of the first pad 11 and grows upwards to form a temperature sensing element 33. The height of the temperature sensing element 33 can be controlled within a suitable range (e.g., slightly higher than the design value of the final insulating layer 32) to ensure sufficient contact height after subsequent finishing. The temperature sensing element 33 is electrically connected to the excitation line via the first pad 11.

[0102] Next, a layer of photosensitive resin can be coated onto the entire surface of the first substrate 1, completely covering all temperature sensing elements 33. Exposure is performed using a photomask, with a light-transmitting area designed on the mask corresponding to the position of each temperature sensing element 33. After exposure, the photosensitive resin at the end of the temperature sensing element 33 (specifically, the end of the temperature sensing element 33 closest to the second substrate) and in the surrounding area undergoes a cross-linking reaction. During development, the photosensitive resin in the unexposed areas is removed, leaving a photosensitive resin structure surrounding the outside of each temperature sensing element 33, forming the initial shape of the insulating layer 32. Simultaneously, the developing solution removes the photosensitive resin covering the end of the temperature sensing element 33, initially exposing the end face of the temperature sensing element 33.

[0103] If photosensitive resin residue remains on the end face of the temperature sensor 33 after development, or if its height exceeds the required cell thickness, a slight full-surface etching can be performed using oxygen plasma etching. During the etching process, the photosensitive resin and the end face of the temperature sensor 33 are thinned simultaneously. However, since the temperature sensor 33 is made of metal, it has strong etching resistance, ultimately resulting in a well-formed temperature sensing structure with a flat exposed end face of the temperature sensor 33 and the insulation layer 32 precisely controlled within a suitable height range. After finishing, the end face of the temperature sensor 33 can be slightly higher than or flush with the insulation layer 32 to ensure good contact with the sensing line 31 and the driver chip.

[0104] After the second substrate is fabricated, an ITO thin film (i.e., indium tin oxide thin film) is deposited on the surface of the second substrate and patterned into a sensing line 31 by photolithography. This ensures that the sensing line 31 can be located in the non-pixel opening area. The second pad 23 is set in the area that is aligned with the first pad 11 (or the temperature sensing structure).

[0105] During the assembly of the first substrate 1 and the second substrate, conductive microparticles 41 are mixed into the frame adhesive 4. After the assembly is pressed together, the temperature sensing element 33 and the sensing line 31 are precisely aligned and contacted through the second pad 23, while the conductive microparticles 41 in the non-display area connect the second edge pad 24 to the first edge pad 12.

[0106] The display panel in this disclosure can be applied to products such as mobile phones, etc. Figure 9 As shown, a blind hole can be provided at the top of the phone to allow light to pass through the front-facing camera. The sensing line 31 and the second heating element 35 on the second substrate can be arranged in the display area of ​​the phone. Both the sensing line 31 and the second heating element 35 are connected to the corresponding first pad 11 on the second substrate and ultimately connected to the second edge pad 24 at the bottom of the phone for temperature measurement and heating of the liquid crystal layer. The arrangement of the sensing line 31 and the second heating element 35 avoids obstructing the light from the front-facing camera.

[0107] This disclosure provides a driving method for a display panel, which can be used in a display panel. The display panel may include: a first substrate 1, a second substrate, a liquid crystal layer, and a temperature sensing structure. The first substrate 1 is provided with a driving chip, and the second substrate is disposed opposite to the first substrate 1. The second substrate is provided with a sensing line 31, which is electrically connected to the signal receiving end of the driving chip. The liquid crystal layer fills the space between the first substrate 1 and the second substrate. The temperature sensing structure penetrates through the liquid crystal layer, and its opposite ends abut against the first substrate 1 and the second substrate, respectively. The opposite ends of the temperature sensing structure are also electrically connected to the signal transmitting end of the driving chip and the sensing line 31, respectively. The temperature sensing structure is configured to measure the temperature of the liquid crystal layer.

[0108] The display panel also includes alternating display periods and non-display periods (such as frame blanking periods or standby periods). That is, a display period can be followed by a non-display period, and a non-display period can be followed by a display period. The display panel displays normally during the display period, and the non-display period includes the temperature measurement period (T1).

[0109] The driving method may include: during the temperature measurement period, the current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the temperature measuring structure and the sensing line 31 to drive the temperature measuring structure to perform temperature measurement, thereby facilitating the understanding of the temperature of the liquid crystal layer and providing a reliable basis for adjusting the temperature of the liquid crystal layer based on the temperature measurement data of the temperature measuring structure.

[0110] Specifically, the driver chip can initiate the entire temperature measurement process of the liquid crystal layer during the vertical blanking (V-Blanking) or horizontal blanking (H-Blanking) period after the end of each frame display (i.e., the display period). At this time, there is no grayscale voltage output on the data lines, the scan lines are turned off, and the entire display area is in a non-driving state.

[0111] This disclosure avoids the impact on the displayed image during the display period by using temperature sampling during non-display periods, thus ensuring the stability of the display panel's image display during the display period.

[0112] In some embodiments, the display panel may further include a heating structure, the opposite ends of which are electrically connected to the signal transmitting end and signal receiving end of the driver chip. The non-display period may also include a heating period (T2), after which the display panel enters the heating period, as detailed in [reference needed]. Figure 10 As shown.

[0113] The driving method may also include: if the temperature measurement data of the temperature measuring structure is lower than the preset temperature during the temperature measurement period: when entering the heating period, the driving chip applies current to the heating structure to drive the heating structure to generate heat.

[0114] If the temperature measurement data of the temperature measuring structure is not lower than the preset temperature during the temperature measurement period, the driving chip stops applying current to the heating structure when the heating period begins, so that the heating structure stops generating heat.

[0115] This disclosure utilizes non-display periods to heat the liquid crystal layer, thus avoiding any impact on the displayed image during the display period and ensuring the stability of the display panel's image display. By setting the heating period after the temperature measurement period, the operating temperature of the liquid crystal layer can be adjusted in a timely manner based on real-time temperature measurement data from the temperature measurement structure, maintaining the response speed of the liquid crystal material in the liquid crystal layer, and thereby ensuring that the display panel can maintain a stable display effect in low-temperature environments. This disclosure utilizes non-display periods to perform temperature measurement and heating operations in a time-sharing manner, preventing the two from occurring simultaneously and thus mitigating the problem of mutual interference.

[0116] In some embodiments, the display panel may include excitation lines disposed on the first substrate 1, one end of which is electrically connected to the signal transmitting end of the driving chip, and the other end is electrically connected to the end of the first heating element 34 and the temperature measuring structure near the first substrate 1. The signal receiving end of the driving chip includes switchable heating mode and temperature measuring mode.

[0117] The driving method may also include: during the temperature measurement period, the signal receiving end of the driving chip is in temperature measurement mode, the signal receiving end of the driving chip receives the signal of the induction line 31 and stops receiving the signal of the heating structure, and the current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the excitation line, the temperature measurement structure and the induction line 31, so as to realize the temperature measurement of the liquid crystal layer.

[0118] During the heating period, the signal receiving end of the driver chip switches to the heating mode, receives the signal from the heating structure, and stops receiving the signal from the induction line 31. The current applied by the signal transmitting end of the driver chip flows to the heating structure through the excitation line and returns to the signal receiving end of the driver chip, so as to realize the heating of the liquid crystal layer.

[0119] This disclosure achieves functional separation of heating and temperature measurement on the second substrate side by electrically connecting the first heating element 34 and the temperature measuring element 33 near one end of the first substrate 1 to the same excitation line. The excitation line can simultaneously serve as the input channel for both the first heating element 34 and the temperature measuring element 33. The mode of the signal receiving end of the driving chip is switched by time-division driving, and the temperature measuring element 33 and the first heating element 34 form different circuits on one side of the second substrate. That is, the heating function and the temperature measurement function are independent of each other on the second substrate side and do not interfere with each other.

[0120] Compared to the technical solution where the first heating element 34 and the temperature measuring element 33 are electrically connected to the driving chip through different traces at the ends of the first substrate 1, this disclosure can reduce the number of traces on the first substrate 1, thereby reducing the wiring density of the first substrate 1, reducing the probability of signal interference between traces, and reserving more layout space for other functional components.

[0121] For example, such as Figure 11 As shown, the specific workflow of the display panel in this disclosure may include: the display panel starts working and is electrically initialized, and then it is determined whether the display panel has entered a non-display period. When the display panel is in a display period (i.e., not in a non-display period), it returns to the previous step to re-determine. When the display panel is in the temperature measurement period of a non-display period: the signal receiving end of the driver chip is configured to temperature measurement mode (e.g., constant current source output mode) and a small measurement current (e.g., 50μA) is applied to the excitation line. The current path at this time is as follows: signal transmitting end of the driver chip → excitation line → first pad 11 → temperature measuring element 33 → second pad 23 → sensing line 31 → second edge pad 24 → conductive particle 41 → first edge pad 12 → signal receiving end of the driver chip (e.g., the ADC sampling port inside the driver chip, also known as the analog-to-digital converter sampling port). By measuring the total resistance of the circuit and subtracting the parasitic resistance, the resistance value of the temperature measuring element 33 is calculated, and then the temperature (T) of the liquid crystal layer can be calculated. At this time, although the first heating element 34 is also connected to the first pad 11, the signal receiving end of the driver chip is in temperature measurement mode, so the signal receiving end of the driver chip stops receiving the signal of the second heating element 35. The second heating element 35 connected to the end of the first heating element 34 near the second substrate is open (the heating circuit is not closed), so no current flows through the second heating element 35.

[0122] When the display panel is in the heating period during non-display periods: if the temperature measurement period T is lower than the preset temperature (e.g., -10℃), during the heating period of the same non-display period, the signal transmitter of the driver chip switches to heating mode (e.g., heating voltage output mode), applying a heating voltage (e.g., 5V~12V) to the excitation line, and the heating structure obtains current and generates heat. The current path at this time is as follows: signal transmitter of the driver chip → excitation line → first pad 11 → first heating element 34 → second pad 23 → second heating element 35 → second edge pad 24 → second edge pad 24 → conductive particle 41 → first edge pad 12 → common ground line → signal receiver of the driver chip. Current flows through the heating structure, generating Joule heating, which raises the temperature of the liquid crystal layer. Specifically: when current flows through the first heating element 34, it utilizes the metal resistance of its own material to generate Joule heating, directly heating the surrounding liquid crystal; simultaneously, when current flows through the second heating element 35, it generates a surface heating effect, achieving uniform heating of the entire surface of the liquid crystal layer. Although the temperature sensing element 33 is also connected to the first pad 11 at this time, because the signal receiving end of the driver chip is in heating mode, it stops receiving the signal from the sensing line 31. The sensing line 31 is in a high-resistance state, and the temperature sensing element itself has a large resistance, resulting in only a weak leakage current, which does not affect the heating efficiency. If the temperature measurement period T is not lower than the preset temperature, the operating temperature of the liquid crystal layer is considered to be normal, and heating is not required. During the heating period of the same non-display period, the driver chip stops applying current to the heating structure so that the heating structure stops heating. After a non-display period, the display panel can enter the next display period.

[0123] The driver chip can alternately perform temperature measurement and heating operations, and dynamically adjust the duty cycle or amplitude of the heating voltage according to the real-time temperature measurement data, so that the temperature of the display panel is maintained within the set working range (such as 20℃±5℃), thereby forming a closed-loop control.

[0124] In the description of this specification, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise expressly specified.

[0125] Furthermore, it should be noted that terms such as "upper," "lower," "left," and "right" are used only for distinction and convenience of description, and do not impose any positional limitations on the embodiments of the present invention. For example, "upper" in practice can refer to "lower," "left," or "right." In this disclosure, unless otherwise explicitly specified and limited, terms such as "assembly" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0126] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0127] Although embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and description of the present disclosure should fall within the scope of the patent coverage of the present disclosure.

Claims

1. A display panel, characterized in that, include: The first substrate is equipped with a driver chip; The second substrate is disposed opposite to the first substrate, and the second substrate is provided with sensing lines, which are electrically connected to the signal receiving end of the driver chip. A liquid crystal layer is filled between the first substrate and the second substrate; A temperature-sensing structure penetrates the liquid crystal layer, and its opposite ends abut against the first substrate and the second substrate, respectively. The opposite ends of the temperature-sensing structure are also electrically connected to the signal transmitting end of the driving chip and the sensing line, respectively. The temperature-sensing structure is configured to measure the temperature of the liquid crystal layer.

2. The display panel according to claim 1, characterized in that, The temperature measuring structure includes a temperature measuring element and an insulating layer. The two opposite ends of the temperature measuring element are electrically connected to the signal transmitting end of the driving chip and the induction line, respectively. The insulating layer is wrapped around the outer periphery of the temperature measuring element. Wherein: the two ends of the temperature measuring element are flush with the two ends of the insulating layer, or the two ends of the temperature measuring element protrude from the two ends of the insulating layer.

3. The display panel according to claim 1, characterized in that, The temperature measuring structure includes a temperature measuring element and an insulating layer. The two opposite ends of the temperature measuring element are electrically connected to the signal transmitting end of the driving chip and the induction line, respectively. The insulating layer is wrapped around the outer periphery of the temperature measuring element. The display panel includes a heating structure, which includes a first heating element embedded in the insulating layer and penetrating the liquid crystal layer. The first heating element is spaced apart from the temperature measuring element, and its opposite ends are electrically connected to the signal transmitting end and the signal receiving end of the driving chip, respectively. The first heating element is configured to generate heat according to the temperature measurement data of the temperature measuring element, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than a preset temperature.

4. The display panel according to claim 3, characterized in that, The first heating element is an open ring and is arranged around a portion of the outer periphery of the temperature measuring element.

5. The display panel according to claim 3, characterized in that, The heating structure includes a second heating element, which is disposed on the second substrate and located on the side of the liquid crystal layer opposite to the first substrate. One end of the second heating element is electrically connected to one end of the first heating element near the second substrate, and the other end is electrically connected to the signal receiving end of the driving chip. The second heating element is configured to generate heat according to the temperature measurement data, so as to raise the temperature of the liquid crystal layer when the temperature measurement data is lower than the preset temperature.

6. The display panel according to claim 5, characterized in that, The display panel includes an excitation line disposed on the first substrate. One end of the excitation line is electrically connected to the signal transmitting end of the driving chip, and the other end is electrically connected to the end of the first heating element and the temperature measuring element near the first substrate. The signal receiving end of the driver chip includes switchable heating mode and temperature measurement mode: In the temperature measurement mode, the signal receiving end of the driving chip receives the signal from the sensing line and stops receiving the signal from the heating structure. The current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the excitation line, the temperature measuring element and the sensing line to drive the temperature measuring element to perform temperature measurement. In the heating mode, the signal receiving end of the driving chip receives the signal from the heating structure and stops receiving the signal from the induction line. The signal transmitting end of the driving chip applies current to the heating structure according to the temperature measurement data of the temperature measuring element. The current returns to the signal receiving end of the driving chip through the excitation line, the first heating element and the second heating element to drive the heating structure to generate heat.

7. The display panel according to claim 6, characterized in that, The display panel includes a display area and a non-display area surrounding the outer periphery of the display area; the liquid crystal layer and the temperature sensing structure are disposed within the display area; the second substrate includes a common electrode; the display panel further includes: A common ground line is provided on the first substrate; The first pad is located in the display area and is disposed on the side of the first substrate near the second substrate. The temperature measuring element and the first heating element are both electrically connected to the excitation line through the first pad. The second pad is located in the display area and is disposed on the side of the second substrate close to the first substrate. The temperature measuring element is electrically connected to the sensing line through the second pad, and the first heating element is electrically connected to the second heating element through the second pad. The first edge pad is located in the non-display area and is disposed on the side of the first substrate close to the second substrate. The driver chip and the common ground line are both electrically connected to the first edge pad. The second edge pad is located in the non-display area and is disposed on the side of the second substrate close to the first substrate. The induction line, the second heating element and the common electrode are all electrically connected to the second edge pad. A frame adhesive is located in the non-display area, and its opposite ends are connected to the first substrate and the second substrate; the frame adhesive contains conductive particles, which are configured to enable electrical conduction between the first edge pad and the second edge pad.

8. The display panel according to claim 1, characterized in that, The display panel includes a display area, which includes a pixel aperture area and a non-pixel aperture area surrounding the outer periphery of the pixel aperture area; The liquid crystal layer is located at least in the pixel opening region, and the temperature measuring structure is located in the non-pixel opening region.

9. A driving method for a display panel, characterized in that, The driving method is used in the display panel as described in claim 1, wherein the display panel includes alternating display periods and non-display periods, and the display panel displays normally during the display periods; The non-display period includes the temperature measurement period; The driving method includes: During the temperature measurement period, the current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the temperature measuring structure and the sensing line, so as to drive the temperature measuring structure to perform temperature measurement.

10. The driving method according to claim 9, characterized in that, The display panel further includes a heating structure, the two opposite ends of which are electrically connected to the signal transmitting end and the signal receiving end of the driving chip; the non-display period also includes a heating period, after which the display panel enters the heating period; The driving method further includes: If the temperature measurement data of the temperature measuring structure is lower than the preset temperature during the temperature measurement period: when entering the heating period, the driving chip applies current to the heating structure to drive the heating structure to generate heat; If the temperature measurement data of the temperature measuring structure is not lower than the preset temperature during the temperature measurement period: when entering the heating period, the driving chip stops applying current to the heating structure so that the heating structure stops generating heat.

11. The driving method according to claim 10, characterized in that, The display panel includes excitation lines disposed on the first substrate. One end of the excitation line is electrically connected to the signal transmitting end of the driving chip, and the other end is electrically connected to the end of the first heating element and the temperature measuring structure near the first substrate. The signal receiving end of the driving chip includes switchable heating mode and temperature measuring mode. The driving method further includes: During the temperature measurement period, the signal receiving end of the driving chip is in the temperature measurement mode. The signal receiving end of the driving chip receives the signal from the induction line and stops receiving the signal from the heating structure. The current applied by the signal transmitting end of the driving chip returns to the signal receiving end of the driving chip through the excitation line, the temperature measurement structure and the induction line. During the heating period, the signal receiving end of the driving chip switches to the heating mode, receives the signal from the heating structure, and stops receiving the signal from the induction line. The current applied by the signal transmitting end of the driving chip flows to the heating structure through the excitation line and returns to the signal receiving end of the driving chip.

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