Method for manufacturing display panel, display panel and display device

Abstract

The application discloses a display panel preparation method, a display panel and a display device, and relates to the technical field of display. The display panel preparation method of the application comprises the following steps: forming an isolation dam layer on a first substrate; forming a bonding layer on a second substrate; adding cholesteric liquid crystal; aligning and bonding the second substrate and the first substrate; and performing low-temperature and low-pressure curing treatment. The display panel preparation method of the application forms a separation structure for separating sub-pixels through the bonding layer and the isolation dam layer, completely separates cholesteric liquid crystal of different colors in each sub-pixel area, and effectively prevents liquid crystal color mixing.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display panel, and a display device. Background Technology

[0002] Cholesteric liquid crystal electronic paper (CLC) displays, as an important branch of reflective display technology, possess unique bistable characteristics, enabling them to maintain images for extended periods without external power, achieving extremely low energy consumption. This makes them suitable for applications requiring ultra-low power consumption and long-lasting display, such as IoT tags, electronic shelf labels, and wearable devices. Simultaneously, their reflective display panels provide a paper-like visual experience, with no backlighting or flicker, strong readability under bright light, and excellent viewing angle characteristics. Horizontally arranged RGB cholesteric color electronic paper uses side-by-side red, green, and blue cholesteric liquid crystal units to achieve color display. The bank structure, used to physically separate the three colors of liquid crystal, plays a crucial role in defining pixel units and preventing color crosstalk during liquid crystal flow. However, when the polymer bank structure, formed by photolithography, is bonded to the upper substrate, micro-gaps can easily form due to surface flatness or alignment deviations. These gaps allow the flowing liquid crystal to leak into each other, causing severe color crosstalk and display color mixing problems. Summary of the Invention

[0003] The purpose of this application is to provide a method for manufacturing a display panel, a display panel, and a display device. By forming a separation structure for separating sub-pixels through an adhesive layer and an isolation dam layer, different colors of cholesteric liquid crystals are completely isolated in each sub-pixel area, effectively preventing liquid crystal color crosstalk.

[0004] This application discloses a method for manufacturing a display panel, including the following steps: An isolation dam layer is formed on the first substrate; An adhesive layer is formed on the second substrate; Add cholesteric phase liquid crystal; Alignment and bonding of the second substrate and the first substrate; and Low-temperature and low-pressure curing treatment.

[0005] Optionally, the step of forming an isolation dam layer on the first substrate includes: An insulating material is coated on the first substrate; Solvent removal treatment is performed on the insulating material coated on the first substrate; The isolation material on the first substrate is exposed and developed to form an isolation dam layer.

[0006] Optionally, the method for manufacturing the display panel further includes the step of: UV curing of the isolation dam layer; Perform drying treatment.

[0007] Optionally, the step of forming an adhesive layer on the second substrate includes: Apply adhesive material to the second substrate; Solvent removal treatment is performed on the adhesive material coated on the second substrate; The adhesive material on the second substrate is exposed to form an adhesive layer.

[0008] Optionally, the method for manufacturing the display panel further includes the step of: The adhesive layer is cured with ultraviolet light; Perform drying treatment.

[0009] Optionally, the low-temperature, low-pressure curing process includes: The second and first substrates to be bonded are heated to between 50°C and 70°C for 30 to 60 minutes, and a pressure of 1 kPa to 10 kPa is maintained during the process.

[0010] Optionally, both the isolation dam layer and the adhesive layer include a low-temperature cationic initiator; The low-temperature cationic initiator is used to react the isolation dam layer and the adhesive layer during low-temperature and low-pressure curing to form an interpenetrating network structure at the bonding interface of the isolation dam layer and the adhesive layer.

[0011] Optionally, vacuum drying can be used to remove the solvent.

[0012] This application also discloses a display panel, including a second substrate, a first substrate, cholesteric liquid crystal and a separation structure, wherein the second substrate is disposed correspondingly to the first substrate, and a separation structure is provided between the second substrate and the first substrate, and the separation structure is filled with cholesteric liquid crystal. The separation structure includes an isolation dam layer disposed on a first substrate and an adhesive layer disposed on a second substrate. The isolation dam layer and the adhesive layer are manufactured using the display panel manufacturing method described above, and an interpenetrating network structure is formed at the bonding interface of the isolation dam layer and the adhesive layer.

[0013] This application also discloses a display device, including a driving circuit and a display panel as described above, wherein the driving circuit drives the display panel.

[0014] The method for manufacturing a display panel in this application involves preparing an adhesive layer on a second substrate and an isolation dam layer on a first substrate. The adhesive layer and the isolation dam layer are then cured at low temperature and low pressure to form a separation structure for separating sub-pixels. This avoids the problem of liquid crystal leakage due to gaps caused by surface flatness or alignment deviations during bonding when preparing a separation structure on a single glass substrate, which can lead to color crosstalk and display color mixing. The separation structure formed in this application can completely isolate cholesteric liquid crystals of different colors within each sub-pixel area, effectively preventing liquid crystal color crosstalk. Attached Figure Description

[0015] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any creative effort. In the drawings: Figure 1 This is a flowchart illustrating the specific steps of a method for manufacturing a display panel according to the first embodiment of this application. Figure 2 This is a schematic diagram of the structure of a display panel according to a second embodiment of this application; Figure 3 This is a schematic diagram of the structure of a display device according to the third embodiment of this application.

[0016] Among them, 100 is a display panel; 110 is a second substrate; 120 is a first substrate; 130 is a cholesteric liquid crystal; 140 is an isolation dam layer; 150 is an adhesive layer; 160 is a TFT device layer; 200 is a driving circuit; and 300 is a display device. Detailed Implementation

[0017] It should be understood that the terminology, specific structural and functional details used herein are merely for describing particular embodiments and are representative. However, this application may be implemented in many alternative forms and should not be construed as being limited to the embodiments set forth herein.

[0018] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of technical features indicated. Therefore, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0019] In addition, terms such as “center,” “horizontal,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” that indicate orientation or positional relationship are based on the orientation or relative positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] like Figure 1 As shown, as a first embodiment of this application, a method for manufacturing a display panel is disclosed, including the following steps: S1: An isolation dam (bank) layer is formed on the first substrate; Specifically, a TFT device layer (specific structure not shown in the figure) is fabricated on the first substrate. The TFT device layer includes M1 (first metal layer), GI (gate insulating layer), ACT (active layer / channel layer), M2 (second metal layer), Pass (passivation layer), etc. An isolation dam layer is fabricated on the pass layer to separate sub-pixels. S2: An adhesive layer is formed on the second substrate; Specifically, an adhesive layer is prepared on the second substrate, which is combined with the isolation dam layer on the first substrate to form a separation structure for separating sub-pixels; S3: Added cholesteric phase liquid crystal; Specifically, inkjet printing equipment is used to precisely print cholesteric liquid crystals reflecting different colors onto the sub-pixel areas divided by the isolation dam layer; S4: Align and bond the second substrate and the first substrate; Specifically, in a vacuum environment, the second substrate and the first substrate are precisely aligned and bonded to ensure that the adhesive layer of the second substrate corresponds precisely to the isolation dam layer of the first substrate, so as to carry out subsequent low temperature and low pressure curing treatment, so that the adhesive layer of the second substrate and the isolation dam layer of the first substrate react to form a separation structure. S5: Low-temperature and low-pressure curing treatment; Specifically, the second and first substrates are cured at low temperature and low pressure to activate the components in the isolation dam layer and adhesive layer to react and form a separation structure.

[0023] The method for fabricating the display panel of this application involves preparing an adhesive layer on a second substrate and an isolation dam layer on a first substrate. The adhesive layer and the isolation dam layer are then cured at low temperature and low pressure to form a separation structure for separating sub-pixels. This avoids the problem of liquid crystal leakage due to gaps caused by surface flatness or alignment deviations during bonding when preparing a separation structure on a single glass substrate, which can lead to color crosstalk and display color mixing. The separation structure of this application can completely isolate cholesteric liquid crystals of different colors within each sub-pixel area, effectively preventing liquid crystal color crosstalk. It should be noted that the first substrate is a lower glass substrate, which is the substrate substrate in the array substrate. A TFT device layer is first prepared on the first substrate, and then an isolation dam layer is prepared on the passivation layer in the TFT device layer. The second substrate is an upper glass substrate.

[0024] Furthermore, step S1 specifically includes: S10: Apply an insulating material onto the first substrate; S11: Remove solvent from the insulating material coated on the first substrate; Specifically, the solvent in the insulating material is removed by vacuum drying at a temperature between 30°C and 40°C, a vacuum degree between 5 kPa and 10 kPa, and a time between 15 min and 30 min. S12: Expose and develop the isolation material on the first substrate to form an isolation dam layer; Specifically, the isolation material after solvent removal is exposed and developed to leave isolation dam structures. The isolation dam structures can include various shapes such as squares and inverted trapezoids, and each pair of adjacent isolation dam structures corresponds to a sub-pixel. The height of the isolation dam structures in the isolation dam layer is between 2 μm (micrometers) and 8 μm, and the width of the isolation dam structures is between 5 μm and 20 μm. The shape of the isolation dam structures can include various shapes such as squares and inverted trapezoids (inverted trapezoidal structures are beneficial for liquid crystal spreading in inkjet printing, reduce air bubble retention, and increase the contact area with the adhesive layer, thereby enhancing the interfacial bonding strength). Each pair of adjacent isolation dam structures corresponds to a sub-pixel, that is, cholesteric liquid crystal fills the space between two adjacent isolation dam structures. Multiple isolation dam structures are combined to form an isolation dam layer.

[0025] Furthermore, step S1 also includes: S13: Curing the isolation dam layer formed after exposure and development with ultraviolet light (UV); Specifically, the isolation dam layer formed after exposure and development is subjected to full irradiation with maskless ultraviolet light to transform the composition of the isolation dam layer and form a stable film layer. The transformation of the composition of the isolation dam layer refers to the transformation of acrylate double bonds. When the acrylate double bond transformation rate reaches more than 90%, it can be determined that the ultraviolet curing of the isolation dam layer is complete. S14: Perform drying treatment; Specifically, the first substrate is dried at 40°C for 20 minutes to remove moisture and residual solvent, ensuring that the isolation dam layer of the first substrate is dry before being bonded to the adhesive layer of the second substrate, which facilitates low-temperature and low-pressure curing. Furthermore, step S2 specifically includes: S20: Apply adhesive material to the second substrate; S21: Remove solvent from the adhesive material coated on the second substrate; Specifically, the adhesive material is dried by vacuum drying to remove the solvent. The temperature is maintained between 30°C and 40°C, the vacuum degree is maintained between 5 kPa and 10 kPa, and the time lasts for 15 min to 20 min. S22: Expose and develop the adhesive material of the second substrate to form an adhesive layer; Specifically, the adhesive material after solvent removal is exposed and developed to leave the adhesive structure. The adhesive structure is set in correspondence with the isolation dam structure to form a separation structure for separating sub-pixels. The shape of the adhesive structure includes various shapes such as square and inverted trapezoid, and it is set in correspondence with the isolation dam structure. The height of the adhesive structure is between 1 and 3 micrometers, and the width of the adhesive structure is between 10 and 20 micrometers. Multiple adhesive structures are combined to form an adhesive layer. Furthermore, step S2 also includes: S23: UV curing of the adhesive layer; Specifically, the adhesive layer formed after exposure and development is cured again by ultraviolet light to ensure that the adhesive layer reacts and forms a stable film layer. S24: Perform drying treatment; Specifically, the second substrate is dried at 40°C for 20 minutes to remove moisture and residual solvent, ensuring that the adhesive layer of the second substrate is dry before being bonded to the isolation dam layer of the first substrate, which facilitates low-temperature and low-pressure curing. Furthermore, step S5 specifically includes: S50: Heat the second substrate and the first substrate to between 50°C and 70°C for 30 min to 60 min, while maintaining a uniform pressure of 1 kPa to 10 kPa. Specifically, the second and first substrates, after being bonded together, undergo a low-temperature and low-pressure curing process. The low temperature is between 50°C and 70°C, and the time is between 30 minutes and 60 minutes. During this period, a uniform pressure between 1 kPa and 10 kPa is maintained to cure the adhesive layer of the second substrate and the isolation dam layer of the first substrate to form a separation structure.

[0026] The separating material and adhesive material in this embodiment are constructed using the steps and components described below, so that when the separating layer formed by the separating material and the adhesive layer formed by the adhesive material are cured at low temperature and low pressure, they can catalyze the reaction of the components in the separating layer and the adhesive layer to form a separating structure to achieve sealing between sub-pixels and prevent liquid crystal color mixing between sub-pixels.

[0027] Specifically, the separating material includes a base resin, epoxy resin, reactive diluent, free radical photoinitiator, low-temperature cationic initiator, leveling agent, defoamer, neutralizing agent, and solvent; the base resin comprises 45 wt% to 55 wt% by mass, the epoxy resin comprises 9 wt% to 15 wt% by mass, the reactive diluent comprises 7 wt% to 10 wt% by mass, the free radical photoinitiator comprises 1 wt% to 2 wt% by mass, the low-temperature cationic initiator comprises 0.3 wt% to 1.2 wt% by mass, the leveling agent and the defoamer comprise 0.8 wt% to 1.5 wt% by mass, the neutralizing agent comprises 0.2 wt% to 0.8 wt% by mass, and the solvent comprises 10 wt% to 20 wt% by mass. The main resin is an alicyclic epoxy acrylate, with acrylate double bonds used for UV curing and epoxy groups used for low-temperature thermosetting and interfacial bonding. The epoxy resin is an alicyclic epoxy resin to provide a large number of epoxy groups, participating in cationic polymerization to form a strong ether bond network. The reactive diluent is dipropylene glycol diacrylate, used to reduce system viscosity, facilitate coating, and participate in free radical polymerization, reducing UV curing shrinkage. The free radical photoinitiator is 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, used to absorb ultraviolet light, generate free radicals, and initiate rapid polymerization of acrylate double bonds, achieving curing and shaping of the isolation dam layer. The low-temperature cationic initiator is a low-temperature thermally activated thionium salt, operating at 50°C to 70°C. The decomposition process generates protic acids, which initiate cationic ring-opening polymerization of epoxy groups, playing a crucial role in low-temperature interfacial bonding. The leveling agent and defoamer are used to ensure the uniformity of the film during coating. The neutralizing agent is epoxy-based polydimethylsiloxane, which reacts with the residual trace protic acids generated by the decomposition of the low-temperature cationic initiator to neutralize the residual acids and prevent them from penetrating into the isolation dam layer and contacting the cholesteric liquid crystal, thus avoiding abnormal orientation and performance degradation of the cholesteric liquid crystal. Simultaneously, the neutralizing agent itself contains epoxy groups, which can participate in the polymerization reaction without additional residue. The solvent is ethyl acetate and propylene glycol methyl ether acetate, with a mass ratio between 7:3 and 8:2, used to dissolve the resin and achieve a uniform and smooth thin-layer coating. The preparation process of the aforementioned separating material is as follows: Ethyl acetate and propylene glycol methyl ether acetate solvent were premixed at room temperature by magnetic stirring at a speed of 200 rpm to 300 rpm for 10 min. Add alicyclic epoxy acrylate, heat to between 30°C and 40°C, and continue stirring at the aforementioned speed for 1.5 to 2 hours until it is completely dissolved and no gel is formed; Add alicyclic epoxy resin, maintain the aforementioned rotation speed and temperature, and maintain for 0.5h to 1.5h; Add the reactive diluent dipropylene glycol diacrylate, maintain the aforementioned rotation speed, cool down to between 25°C and 30°C, and maintain for 0.5h to 1h to dissolve the main resin and epoxy resin in the separating material components; Add leveling agent and defoamer, maintain the aforementioned temperature, and slowly and in multiple stages increase the rotation speed to 800 rpm to 1000 rpm, maintaining this for 0.5 hours; Under yellow light or light-protected conditions, add the photoinitiator 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, maintain the aforementioned rotation speed and temperature, and sustain for 0.5h to 1.5h. Add the neutralizing agent epoxy polydimethylsiloxane, maintain the aforementioned temperature, slowly reduce the rotation speed to 400 rpm to 600 rpm, and maintain for 0.5 h; Under nitrogen protection, add low-temperature thermally activated thionium salt, maintain the aforementioned temperature and rotation speed, and continue for 0.5 hours; Vacuum degassing for 0.5 hours to remove dissolved gases / bubbles; A 0.45-micron PTEE filter membrane was used to filter under nitrogen pressure to remove gel particles and impurities, resulting in a separator material with a viscosity of 10 to 30 mPa·s. The separator material was then coated onto a first substrate to form a separator layer.

[0028] Specifically, the adhesive material comprises a film-forming resin, an epoxy resin, a reactive diluent, a free radical photoinitiator, a low-temperature cationic initiator, a toughening agent, a leveling agent, a defoamer, a neutralizing agent, and a solvent. The film-forming resin has a mass percentage between 45 wt% and 55 wt%, the epoxy resin has a mass percentage between 9 wt% and 15 wt%, the reactive diluent has a mass percentage between 7 wt% and 10 wt%, the free radical photoinitiator has a mass percentage between 1 wt% and 2 wt%, the low-temperature cationic initiator has a mass percentage between 0.3 wt% and 1.2 wt%, the toughening agent has a mass percentage between 2 wt% and 5 wt%, the leveling agent and the defoamer have a mass percentage between 0.8 wt% and 1.5 wt%, the neutralizing agent has a mass percentage between 0.2 wt% and 0.8 wt%, and the solvent has a mass percentage between 10 wt% and 20 wt%. The film-forming resin is an epoxy-modified methacrylic acid resin, used to provide a main chain structure similar to the separator material to ensure compatibility. The epoxy groups in the side chains copolymerize with the epoxy groups in the separator material under acid catalysis to achieve chemical bonding. The epoxy resin is an alicyclic epoxy resin, used to provide a large number of epoxy groups to participate in cationic polymerization to form a strong ether bond network. The reactive diluent is isobornyl acrylate, which serves as a monofunctional reactive diluent for the adhesive material, adjusting the system viscosity and participating in UV curing. The rigid rings of isobornyl acrylate generate a steric hindrance effect during polymerization, effectively reducing the curing shrinkage rate and thus avoiding interface cracking or debonding due to shrinkage stress. The free radical photoinitiator is 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, used to absorb ultraviolet light, generate free radicals, and initiate the rapid polymerization of acrylate double bonds to achieve curing and shaping of the adhesive layer. The low-temperature cationic initiator is a low-temperature thermally activated thioonium salt, which decomposes at 50°C to 70°C to produce protic acids, initiating cationic ring-opening polymerization of epoxy groups. It plays a crucial role in low-temperature interfacial bonding, forming an interpenetrating whole with the epoxy groups at the top of the isolation dam layer. The toughening agent is an aliphatic polyurethane acrylate, used to improve the coating's flexibility, absorb thermomechanical stress generated during bonding and use, and prevent interfacial brittle cracking. The leveling agent and the defoamer ensure film uniformity during coating. The neutralizing agent is epoxy-based polydimethylsiloxane, used to react with residual trace amounts of protic acids produced by the decomposition of the low-temperature cationic initiator, neutralizing the residual acid and preventing it from penetrating into the adhesive layer and contacting the cholesteric liquid crystal, which could lead to abnormal cholesteric liquid crystal orientation and performance degradation. Simultaneously, the neutralizing agent itself contains epoxy groups, allowing it to participate in the polymerization reaction without additional residue. The solvent is ethyl acetate and propylene glycol methyl ether acetate, with a mass ratio between 7:3 and 8:2, used to dissolve the resin and achieve a uniform and smooth thin-layer coating. The preparation process of the aforementioned adhesive material is as follows: Ethyl acetate and propylene glycol methyl ether acetate solvent were premixed at room temperature by magnetic stirring, with the stirring speed maintained between 200 rpm and 300 rpm, and the stirring was continued for 10 min. The toughening agent (aliphatic polyurethane acrylate) is premixed and stirred evenly with an active diluent (isoborneol acrylate) to obtain a premixed solution. The premixed solution and epoxy modified methacrylic resin are added, and the temperature is raised to between 30°C and 40°C. The mixture is stirred at the aforementioned speed for 1.5 to 2 hours until it is completely dissolved and no gel is formed. Add alicyclic epoxy resin, maintain the aforementioned rotation speed and temperature, and maintain for 1.5h to 2h; Add reactive diluent (isobornyl acrylate), maintain the aforementioned rotation speed, cool to between 25°C and 30°C, and maintain for 0.5 h to 1 h; Add leveling agent and defoamer, reduce the rotation speed to between 800 rpm and 1000 rpm, and maintain for 0.5 hours; Add the photoinitiator 2,4,6-trimethylbenzoyl-diphenylphosphine oxide under yellow light or light-protected conditions, and maintain the aforementioned rotation speed and temperature for 0.5 h to 1 h. Add the neutralizing agent epoxy polydimethylsiloxane, maintain the aforementioned temperature, slowly reduce the rotation speed to between 400 rpm and 600 rpm, and maintain for 0.5 h; Under nitrogen protection, add low-temperature thermally activated thionium salt, maintain the aforementioned temperature and rotation speed, and continue for 0.5 hours; Vacuum degassing for 0.5 hours to remove dissolved gases / bubbles; A 0.45-micron PTEE filter membrane was used to filter under nitrogen pressure to remove gel particles and impurities, resulting in an adhesive material with a viscosity of 30 mPa·s to 40 mPa·s. The prepared adhesive material was then coated onto a second substrate to form an adhesive layer. The display panel fabrication method of this embodiment involves preparing adhesive and insulating materials through the above-described fabrication process. Following the steps of the above-described display panel fabrication method, an adhesive layer is formed on a second substrate, and an insulating dam layer is formed on a first substrate. A stable pattern is formed by UV curing while fully preserving the epoxy groups. Then, the second substrate and the first substrate are bonded together, followed by step S5, a low-temperature, low-pressure curing treatment. This activates the low-temperature cationic initiator (low-temperature thermally activated thionium salt) in the insulating dam layer and the low-temperature cationic initiator (low-temperature thermally activated thionium salt) in the adhesive layer, generating proton acids. These proton acids simultaneously catalyze the insulating dam layer. The epoxy groups in the adhesive layer undergo a copolymerization reaction, resulting in the growth of a continuous interpenetrating network structure at the bonding interface between the isolation dam layer and the adhesive layer, achieving intrinsic chemical bonding and sealing. In summary, the display panel fabrication method of this application constructs an interpenetrating network structure at the bonding interface between the isolation dam layer and the adhesive layer through low-temperature thermally activated interfacial chemical bonding counting, achieving a seal between the isolation dam layer and the adhesive layer. This avoids the problems of liquid crystal leakage caused by gaps due to surface flatness or alignment deviations during bonding when fabricating the separation structure on a single glass substrate, which can lead to color crosstalk and display color mixing issues. The epoxy groups mentioned above mainly originate from alicyclic epoxy acrylates and alicyclic epoxy resins in the isolation dam layer, and epoxy-modified methacrylate resins and alicyclic epoxy resins in the adhesive layer.

[0029] like Figure 2 As shown, as a second embodiment of this application, a display panel is disclosed. The display panel includes a second substrate 110, a first substrate 120, cholesteric liquid crystal 130, and a separation structure. The second substrate 110 and the first substrate 120 are correspondingly disposed, and a separation structure is provided between the second substrate 110 and the first substrate 120. The separation structure is filled with cholesteric liquid crystal 130. The separation structure includes an isolation dam layer 140 disposed on the first substrate 120 and an adhesive layer 150 disposed on the second substrate 110. The isolation dam layer 140 and the adhesive layer 150 are manufactured using the display panel manufacturing method described in the above embodiment. A TFT device layer 160 is further provided between the isolation dam layer 140 and the first substrate 120.

[0030] The display panel of this application forms a separation structure for separating sub-pixels by preparing an adhesive layer on a second substrate and an isolation dam layer on a first substrate. The adhesive layer and the isolation dam layer are cured at low temperature and low pressure to form a separation structure for separating sub-pixels. This avoids the problem of liquid crystal leakage due to gaps caused by surface flatness or alignment deviation during bonding when preparing a separation structure on a single glass substrate, which can lead to color crosstalk and display color mixing. The separation structure formed in this application can completely isolate cholesteric liquid crystals of different colors in each sub-pixel area, effectively preventing liquid crystal color crosstalk.

[0031] like Figure 3 As shown, as a third embodiment of this application, a display device 300 is disclosed. The display device 300 includes a driving circuit 200 and a display panel 100 as described in the above embodiment. The driving circuit 200 drives the display panel 100 to be set.

[0032] The display device of this application forms a separation structure for separating sub-pixels by preparing an adhesive layer on a second substrate and an isolation dam layer on a first substrate. The adhesive layer and the isolation dam layer are cured at low temperature and low pressure to form a separation structure for separating sub-pixels. This avoids the problem of liquid crystal leakage due to gaps caused by surface flatness or alignment deviation during bonding when preparing a separation structure on a single glass substrate, which can lead to color crosstalk and display color mixing. The separation structure formed in this application can completely isolate cholesteric liquid crystals of different colors in each sub-pixel area, effectively preventing liquid crystal color crosstalk.

[0033] It should be noted that the limitations on each step involved in this solution are not considered as limiting the order of steps, provided that they do not affect the implementation of the specific solution. The steps listed first can be executed first, later, or even simultaneously. As long as this solution can be implemented, it should be considered to fall within the scope of protection of this application.

[0034] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0035] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A method for manufacturing a display panel, characterized in that, Including the following steps: An isolation dam layer is formed on the first substrate; An adhesive layer is formed on the second substrate; Add cholesteric phase liquid crystal; Align and bond the second substrate and the first substrate; as well as Low-temperature and low-pressure curing treatment.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming an isolation dam layer on the first substrate includes: An insulating material is coated on the first substrate; Solvent removal treatment is performed on the insulating material coated on the first substrate; The isolation material on the first substrate is exposed and developed to form an isolation dam layer.

3. The method for manufacturing a display panel according to claim 2, characterized in that, It also includes the following steps: UV curing of the isolation dam layer; Perform drying treatment.

4. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming an adhesive layer on the second substrate includes: Apply adhesive material to the second substrate; Solvent removal treatment is performed on the adhesive material coated on the second substrate; The adhesive material on the second substrate is exposed to form an adhesive layer.

5. The method for manufacturing a display panel according to claim 4, characterized in that, It also includes the following steps: The adhesive layer is cured with ultraviolet light; Perform drying treatment.

6. The method for manufacturing a display panel according to claim 1, characterized in that, The steps of the low-temperature and low-pressure curing process include: The second and first substrates to be bonded are heated to between 50°C and 70°C for 30 to 60 minutes, and a pressure of 1 kPa to 10 kPa is maintained during the process.

7. The method for manufacturing a display panel according to claim 1, characterized in that, Both the isolation dam layer and the adhesive layer include a low-temperature cationic initiator; The low-temperature cationic initiator is used to react the isolation dam layer and the adhesive layer during low-temperature and low-pressure curing to form an interpenetrating network structure at the bonding interface of the isolation dam layer and the adhesive layer.

8. The method for manufacturing a display panel according to claim 2, characterized in that, The solvent was removed by vacuum drying.

9. A display panel, characterized in that, It includes a second substrate, a first substrate, cholesteric liquid crystal, and a separation structure. The second substrate is disposed correspondingly to the first substrate, and a separation structure is provided between the second substrate and the first substrate. The separation structure is filled with cholesteric liquid crystal. The separation structure includes an isolation dam layer disposed on a first substrate and an adhesive layer disposed on a second substrate. The isolation dam layer and the adhesive layer are manufactured using the display panel manufacturing method as described in any one of claims 1 to 8, and an interpenetrating network structure is formed at the bonding interface of the isolation dam layer and the adhesive layer.

10. A display device, characterized in that, It includes a driving circuit and a display panel as described in claim 9, wherein the driving circuit drives the display panel.

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