Heat dissipation assembly and data processing device
By setting up a capillary layer and a phase change cavity circulation path inside the heat-conducting shell, the heat dissipation efficiency problem of high heat flux density heating devices is solved, achieving efficient heat dissipation and improved reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LUXSHARE THERMAL TECH (HUIZHOU) CO LTD
- Filing Date
- 2026-04-15
- Publication Date
- 2026-07-14
AI Technical Summary
Existing technologies are insufficient to effectively improve the heat dissipation efficiency of high heat flux density heating devices, leading to a decline in device performance or damage.
By setting a first capillary layer and a second capillary layer inside the heat-conducting shell, and using the connecting part to form a circulation path and a phase change cavity, the circulation mode of the heat exchange medium is increased, thereby realizing the first and second heat dissipation cycles.
It improves heat dissipation efficiency, expands the operating temperature range of the heat dissipation component, meets the heat dissipation requirements of heat source devices when they heat up rapidly, and improves reliability.
Smart Images
Figure CN122387281A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation technology, and more particularly to a heat dissipation component and a data processing device. Background Technology
[0002] Cooling heat-generating devices with higher heat flux densities requires correspondingly more efficient heat dissipation devices. If the heat generated by these devices cannot be dissipated in time, it will affect their performance and may even cause damage. Therefore, improving the heat dissipation efficiency of heat-generating devices is a problem that needs to be solved. Summary of the Invention
[0003] In view of this, embodiments of the present invention provide a heat dissipation component and a data processing device, wherein a first capillary layer and a second capillary layer are connected by a connecting portion to form a circulation path, and a phase change cavity is formed between the first capillary layer and the second capillary layer. This increases the circulation mode of the heat exchange medium within the heat-conducting shell, thereby improving heat dissipation efficiency.
[0004] According to a first aspect of the present invention, a heat dissipation assembly is provided, the heat dissipation assembly comprising: A heat-conducting shell, wherein the inner wall of the heat-conducting shell has a condensation surface and an evaporation surface, and the outer wall of the heat-conducting shell has a contact surface; and The capillary structure includes a first capillary layer, a second capillary layer, and a connecting portion, wherein the first capillary layer is disposed on the evaporation surface, and the second capillary layer is disposed on the condensation surface; The first capillary layer and the second capillary layer are spaced apart and connected by the connecting portion to form a circulation path, and a phase change cavity is formed between the first capillary layer and the second capillary layer.
[0005] Furthermore, the heat-conducting shell includes a first plate, one surface of which forms the contact surface, and the other surface of which forms the evaporation surface; The connecting part includes at least one first connecting post and at least one second connecting post; In the circulation path, the first capillary layer delivers heat exchange medium to the second capillary layer through the second connecting post, and the second capillary layer delivers heat exchange medium to the first capillary layer through the first connecting post.
[0006] Furthermore, the heat-conducting shell includes: A first housing having the evaporation surface and the contact surface; and The second housing is assembled with the first housing to form a working cavity. The second housing has a heat dissipation surface and a condensation surface, which are opposite to each other. The capillary structure is located inside the working cavity.
[0007] Furthermore, both the first connecting post and the second connecting post have through holes; The heat-conducting shell also includes: Multiple support columns are spaced apart in the working cavity. One end of each support column is connected to the first housing and the other end is fixedly connected to the second housing. At least a portion of the multiple support columns pass through the through hole.
[0008] Furthermore, in a cross-sectional direction perpendicular to the axial direction of the first connecting post, the first capillary layer extends outward from the contact surface, and a plurality of the first connecting posts coincide with the contact surface, while at least a portion of the plurality of second connecting posts are offset from the contact surface.
[0009] Furthermore, the first capillary layer includes a plurality of capillary regions in the extension direction, and the plurality of capillary regions include a first capillary region and a second capillary region; A plurality of first connecting posts are connected to the first capillary region, at least a portion of a plurality of second connecting posts are connected to the second capillary region, and the capillary force of the second connecting posts is greater than that of the second capillary region, while the capillary force of the first connecting posts is less than or equal to that of the first capillary region.
[0010] Furthermore, the capillary force in the first capillary region is greater than the capillary force in the second capillary region; and / or The thickness of the first capillary region is less than the thickness of the second capillary region.
[0011] Furthermore, the plurality of capillary regions also includes a third capillary region, which is connected to the first capillary region through the second capillary region; In a cross-sectional direction perpendicular to the axial direction of the first connecting post, the third capillary region is located outside the contact surface, the edge of the contact surface is located in the second capillary region, and a portion of the plurality of second connecting posts is connected to the third capillary region and the capillary force is greater than that of the third capillary region. The capillary force and thickness of the first capillary region, the second capillary region, and the third capillary region increase sequentially.
[0012] Furthermore, the heat-conducting shell has a working cavity, and the capillary structure is located within the working cavity; The first capillary region, the second capillary region, and the third capillary region are all configured as powder structures; The particle size of the first capillary region is 100-150 mesh, the particle size of the second capillary region is 60-100 mesh, and the particle size of the third capillary region is 30-80 mesh; and / or the first capillary region occupies 3%-10% of the working chamber volume, the second capillary region occupies 15%-20% of the working chamber volume, and the third capillary region occupies 25%-30% of the working chamber volume.
[0013] Furthermore, the second capillary layer includes a thermally conductive metal layer and a flow-collecting layer. The thermally conductive metal layer is arranged along the condensation surface. The first connecting post is connected to the thermally conductive metal layer through the flow-collecting layer. The second connecting post is connected to the thermally conductive metal layer. The capillary force of the flow-collecting layer is greater than the capillary force of the thermally conductive metal layer.
[0014] Furthermore, the capillary structure also includes a liquid storage section, which is connected to a plurality of the first connecting columns, and the capillary force of the liquid storage section is greater than or equal to the capillary force of the manifold.
[0015] Furthermore, the liquid storage section is a second plate, which is spaced apart and arranged in parallel between the flow-collecting layer and the first capillary layer; One end of the first connecting post extends from one plate of the second plate toward the flow-collecting layer, and the other end of the first connecting post extends from the other plate of the second plate toward the first capillary layer.
[0016] Furthermore, the liquid storage section is integrally formed with the plurality of first connecting columns; and / or The thermally conductive metal layer has a wire mesh structure, and the flow-passing layer has a powder structure and is integrally sintered with the wire mesh structure.
[0017] Secondly, embodiments of the present invention also provide a data processing apparatus, the data processing apparatus comprising: Data processing unit, including heat source device; According to the heat dissipation assembly described in the first aspect above, the contact surface abuts against the heat source device.
[0018] The heat dissipation assembly and data processing device of this invention have a first capillary layer disposed on the evaporation surface and a second capillary layer disposed on the condensation surface, connected by a connecting portion. This connection portion forms a circulation path with the first and second capillary layers, while a phase change cavity is formed between them. Thus, the heat exchange medium can simultaneously utilize the phase change cavity and the circulation path to achieve a first heat dissipation cycle, and also a second heat dissipation cycle. This increases the circulation speed of the heat exchange medium within the heat-conducting shell, improving heat dissipation efficiency. Furthermore, the content of the heat exchange medium in the first and second heat dissipation cycles differs depending on the temperature of the heat source device, allowing the capillary structure to adjust the circulation mode of the heat exchange medium according to the temperature of the heat source device. This increases the operating temperature range of the heat dissipation assembly, particularly meeting the heat dissipation requirements of the heat source device during rapid temperature rise, and improving the reliability of the heat dissipation assembly. Attached Figure Description
[0019] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which: Figure 1 This is a schematic diagram of one side of the heat dissipation component according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the heat dissipation component on the other side of an embodiment of the present invention; Figure 3 This is an exploded view of the heat dissipation component according to an embodiment of the present invention; Figure 4 This is an assembly diagram of the capillary structure according to an embodiment of the present invention; Figure 5 This is an exploded view of the capillary structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the first capillary layer, connecting part, liquid storage part and flow-collecting layer according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the first capillary region, the first connecting column, the liquid storage section, and the manifold layer according to an embodiment of the present invention. Figure 8 This is an exploded schematic diagram of the first capillary region, the first connecting column, the liquid storage section, and the manifold layer according to an embodiment of the present invention. Figure 9 yes Figure 1 A partial sectional view of section AA in the middle; Figure 10 This is a schematic diagram of the architecture of a data processing device according to an embodiment of the present invention.
[0020] Explanation of reference numerals in the attached figures: 1-Capillary structure; 11-First capillary layer; 111-First capillary region; 112-Second capillary region; 113-Third capillary region; 114-Third clearance hole; 12-Second capillary layer; 121-Heat-conducting metal layer; 1211-First clearance hole; 122-Channel layer; 1221-Second clearance hole; 13-Connecting part; 131-First connecting post; 132-Second connecting post; 133-Through hole; 14-Liquid reservoir; 141-Second plate; 2-Heat-conducting shell; 21-First housing; 22-Second housing; 23-Working cavity; 24-Support column; 251-First plate; 31-Condensation surface; 32-Evaporation surface; 33-Contact surface; 34-Heat dissipation surface; 35-Avoidance surface; 41-Circulation path; 42-Phase change cavity; 5-Data processing unit; 51-Heat source device; 6-Heat dissipation components; 7- Thermal conductive components. Detailed Implementation
[0021] The present invention is described below based on embodiments, but the invention is not limited to these embodiments. In the detailed description of the invention below, certain specific details are described in detail. Those skilled in the art will fully understand the invention even without these detailed descriptions. To avoid obscuring the essence of the invention, well-known methods, processes, flows, elements, and circuits are not described in detail.
[0022] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.
[0023] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".
[0024] In the description of this invention, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0025] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0026] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.
[0027] Figure 1 and Figure 2 This is a schematic diagram of the heat dissipation component 6 in this embodiment. Figure 3 This is an exploded view of the heat dissipation component 6 in this embodiment.
[0028] In some implementations, such as Figures 1-3 As shown, the heat dissipation assembly 6 includes a capillary structure 1 and a heat-conducting shell 2. The capillary structure 1 is disposed inside the heat-conducting shell 2. The capillary structure 1 includes, but is not limited to, powder structure, channel structure or wire mesh structure.
[0029] Figure 4 This is an assembly diagram of capillary structure 1 in this embodiment. Figure 5 This is an exploded view of the capillary structure 1 in this embodiment. Figure 6 This is a schematic diagram of the structure of the first capillary layer 11, the connecting part 13, the liquid storage part 14 and the flow collection layer 122 in this embodiment. The arrows in the figure show the flow direction of the heat exchange medium in the first capillary layer 11. Figure 7 This is a schematic diagram of the structure of the first capillary region 111, the first connecting post 131, the liquid storage section 14, and the flow-collecting layer 122 in this embodiment. Figure 8 This is an exploded view of the first capillary zone 111, the first connecting column 131, the liquid storage section 14, and the confluence layer 122 in this embodiment.
[0030] Further reference Figures 4-5 As shown, the capillary structure 1 includes a first capillary layer 11, a second capillary layer 12, and a connecting portion 13.
[0031] Figure 9 yes Figure 1 A partial cross-sectional view at point AA. The inner wall outline of the heat-conducting shell 2 is shown with a thick solid line. The arrows with thick solid lines at the end indicate the direction of movement of the heat exchange medium in the circulation passage 41, and the arrows with dashed lines at the end indicate the direction of movement of the heat exchange medium in the phase change cavity 42.
[0032] Further reference Figure 3 and Figure 9 As shown, the inner wall of the heat-conducting shell 2 has a condensation surface 31 and an evaporation surface 32, and the outer wall of the heat-conducting shell 2 has a contact surface 33. The condensation surface 31 and the evaporation surface 32 face the inner side of the heat-conducting shell 2, and the contact surface 33 faces the outer side of the heat-conducting shell 2. The contact surface 33 is used to contact the heat source device 51 to dissipate heat from the heat source device 51. A first capillary layer 11 is disposed on the evaporation surface 32, and a second capillary layer 12 is disposed on the condensation surface 31. The first capillary layer 11 and the second capillary layer 12 are spaced apart, and the first capillary layer 11 and the second capillary layer 12 are connected by a connecting part 13 to form a circulation path 41. Furthermore, a phase change cavity 42 is formed between the first capillary layer 11 and the second capillary layer 12.
[0033] Optionally, the heat source device 51 may include, but is not limited to, devices such as CPU, GPU, memory unit, capacitor or resistor.
[0034] Optionally, the heat exchange medium in this embodiment is a phase change medium. This phase change medium can be acetone, ethanol, or water, etc. The heat exchange medium exists in both gas and liquid phases within the heat-conducting shell 2. During the gas-to-liquid phase transition, the heat exchange medium absorbs heat from the heat source device 51 through the contact surface 33. During the liquid-to-gas phase transition, for example, the heat exchange medium in the second capillary layer 12 can release heat to the condensation surface 31, and the heat exchange medium can also flow along the capillary structure 1. Those skilled in the art can select the type of phase change medium and the pressure within the heat-conducting shell 2 according to the operating temperature of the heat source device 51. For example, the heat exchange medium can be configured as water, and the pressure within the heat-conducting shell 2 can be configured as negative pressure, such that the vaporization temperature of water is configured as 38°C.
[0035] Specifically, in this embodiment, the heat exchange medium has a first heat dissipation cycle and a second heat dissipation cycle. In the first heat dissipation cycle, the heat exchange medium in the first capillary layer 11 undergoes a phase change after being heated, and the gaseous phase of the heat exchange medium rises and moves to the phase change cavity 42. Figure 10 (As indicated by the dashed arrow at the middle tail), then condenses into droplets in the second capillary layer 12, and can flow back to the first capillary layer 11 via the connecting part 13 (utilizing part of the circulation path 41). In the second heat dissipation cycle ( Figure 10 (As indicated by the thick solid arrow at the middle and end), the heat exchange medium utilizes the circulation path 41 in this embodiment, allowing it to flow between the first capillary layer 11 and the second capillary layer 12 via the connecting part 13, thereby transferring heat from the contact surface 33 to the condensation surface 31. In the second heat dissipation cycle, the suction force provided by the capillary force difference at different locations in the circulation path 41 can be used to drive the heat exchange medium to move along the circulation path 41. Furthermore, the pressure provided by the volume expansion during vaporization of the heat exchange medium can also be used to propel the heat exchange medium along the circulation path 41.
[0036] It is easy to understand that when the heat source device 51 is configured as a chip used in the field of artificial intelligence, the power consumption and heat flux density of the chip will vary significantly at different stages. At low power consumption (e.g., during the data inference stage), there is more heat exchange medium in the first heat dissipation cycle and less heat exchange medium in the second heat dissipation cycle. Conversely, at high power consumption (e.g., during the model training stage), the amount of heat exchange medium in the second heat dissipation cycle increases, thereby increasing the circulation speed of the heat exchange medium between the condensation surface 31 and the evaporation surface 32, achieving effective heat dissipation of the heat source device 51.
[0037] In summary, in this embodiment, the heat dissipation assembly 6 has a first capillary layer 11 disposed on the evaporation surface 32 and a second capillary layer 12 disposed on the condensation surface 31, connected by a connecting portion 13. This forms a circulation path 41 between the connecting portion 13 and the first and second capillary layers 11 and 12, and a phase change cavity 42 between the first and second capillary layers 11 and 12. Thus, the heat exchange medium can simultaneously utilize the phase change cavity 42 and the circulation path 41 to achieve a first heat dissipation cycle, and the heat exchange medium can also utilize the circulation path 41 to achieve a second heat dissipation cycle. This increases the circulation speed of the heat exchange medium within the heat-conducting shell 2, improving heat dissipation efficiency. Furthermore, the heat source device 51 at different temperatures results in different contents of the heat exchange medium in the first and second heat dissipation cycles, allowing the capillary structure 1 to adjust the circulation mode of the heat exchange medium according to the temperature of the heat source device 51. This increases the operating temperature range of the heat dissipation assembly 6, particularly meeting the heat dissipation requirements of the heat source device 51 during rapid temperature rise, and improving the reliability of the heat dissipation assembly 6.
[0038] In some implementations, such as Figure 9 As shown, the heat-conducting shell 2 includes a first plate 251. This first plate 251 forms a portion of the first shell 21. One surface of the first plate 251 forms a contact surface 33, and the other surface forms an evaporation surface 32. Further referencing... Figure 5 As shown, the connecting part 13 includes at least one first connecting post 131 and at least one second connecting post 132. In the circulation passage 41, the first capillary layer 11 supplies heat exchange medium to the second capillary layer 12 through the second connecting post 132, and the second capillary layer 12 supplies heat exchange medium to the first capillary layer 11 through the first connecting post 131.
[0039] Optionally, in this embodiment, the number of both the first connecting column 131 and the second connecting column 132 is configured to be multiple. The directions of heat exchange medium transfer of the first connecting column 131 and the second connecting column 132 are configured to be opposite, so that the first connecting column 131, the second connecting column 132, the first capillary layer 11 and the second capillary layer 12 form a circulation path 41. This ensures that the heat exchange medium can circulate in the circulation path 41.
[0040] In some implementations, such as Figure 3 and Figure 9 As shown, the heat-conducting shell 2 includes a first shell 21 and a second shell 22. The first shell 21 has an evaporation surface 32 and a contact surface 33. The second shell 22 is assembled with the first shell 21 to form a working cavity 23. The second shell 22 has a heat dissipation surface 34 and a condensation surface 31, with the heat dissipation surface 34 facing away from the condensation surface 31. The capillary structure 1 is located inside the working cavity 23.
[0041] Figure 10 This is a schematic diagram of the architecture of the data processing device in this embodiment.
[0042] Further reference Figure 10 As shown, the data processing device includes a data processing unit 5, a heat dissipation component 6, and a heat conduction component 7. The heat conduction component 7 may be provided with cooling pipes. In this embodiment, the heat dissipation surface 34 is used to abut against the heat conduction component 7, and the heat conduction component 7 is used to exchange heat with the heat dissipation surface 34 to remove the heat absorbed by the condensation surface 31.
[0043] In some implementations, such as Figure 5 , Figure 8 and Figure 9 As shown, both the first connecting post 131 and the second connecting post 132 have through holes 133. The heat-conducting shell 2 also includes a plurality of support posts 24. The plurality of support posts 24 are spaced apart in the working cavity 23, one end of the support post 24 is connected to the first shell 21, and the other end is fixedly connected to the second shell 22, and at least a portion of the plurality of support posts 24 passes through the through holes 133.
[0044] Optionally, in this embodiment, each support post 24 is inserted into a corresponding through hole 133. The support post 24 is used to support the first housing 21 and the second housing 22, preventing the heat dissipation assembly 6 from deforming under the pressure of the data processing device and the heat conduction assembly 7. At the same time, it ensures a stable connection between the first connecting post 131 and the second connecting post 132 and the first capillary layer 11 and the second capillary layer 12.
[0045] In some implementations, such as Figure 5 and Figure 9 As shown, in the cross-sectional direction perpendicular to the axial direction of the first connecting column 131 (e.g.) Figure 5 As indicated by arrow a1 in the diagram, i.e., the cross section is perpendicular to the axial direction of the first connecting post 131, the first capillary layer 11 extends outward from the contact surface 33, and the first connecting post 131 coincides with the contact surface 33, and at least a portion of the plurality of second connecting posts 132 are offset from the contact surface 33.
[0046] Optionally, in this embodiment, the axial directions of the first connecting post 131 and the second connecting post 132 are perpendicular to the contact surface 33. The first connecting post 131 is correspondingly arranged to the contact surface 33 to facilitate the transport of the liquid heat exchange medium in the second capillary layer 12 to the first capillary layer 11, preventing the first capillary layer 11 corresponding to the contact surface 33 from drying out. Conversely, some of the multiple second connecting posts 132 are staggered from the contact surface 33. In the second heat dissipation cycle, as the heat exchange medium moves along the first capillary region 111, it gradually moves away from the contact surface 33, and the temperature of the heat exchange medium gradually decreases, causing the gaseous heat exchange medium to gradually liquefy, so that the first capillary layer 11 away from the contact surface 33 has more liquid heat exchange medium. In this configuration, the staggered arrangement of the second connecting post 132 from the contact surface 33 helps the second connecting post 132 to transport the heat exchange medium to the second capillary layer 12.
[0047] In some implementations, such as Figures 5-6 As shown, the first capillary layer 11 includes multiple capillary regions in the extension direction, including a first capillary region 111 and a second capillary region 112.
[0048] A plurality of first connecting posts 131 are connected to a first capillary region 111, at least a portion of a plurality of second connecting posts 132 are connected to a second capillary region 112, and the capillary force of the second connecting posts 132 is greater than that of the second capillary region 112, while the capillary force of the first connecting posts 131 is less than or equal to that of the first capillary region 111.
[0049] In this embodiment, a gradient capillary assembly is formed by the second connecting post 132 and the second capillary region 112, allowing the heat exchange medium in the second capillary region 112 to overcome gravity and move upwards to the second capillary layer 12. Conversely, the capillary force of the first connecting post 131 can be configured to be the same as that of the first capillary region 111. This allows the heat exchange medium in the second capillary layer 12 to flow from the first connecting post 131 to the first capillary layer 11 by its own gravity. The capillary force of the first connecting post 131 can also be configured to be less than that of the first capillary region 111, thereby accelerating the return flow rate of the heat exchange medium.
[0050] In some implementations, such as Figures 5-6 As shown, the capillary force of the first capillary region 111 is greater than that of the second capillary region 112.
[0051] It is easy to understand that after the heat exchange medium in the first capillary region 111 is heated by the heat source device 51, a phase change occurs, and then vaporization takes place. Part of the gaseous heat exchange medium enters the phase change cavity 42, while the remaining gaseous heat exchange medium moves along the first capillary layer 11 (e.g., ...). Figure 6(As indicated by the arrow in the diagram). During this process, the volume expansion of the heat exchange medium generates a driving force that overcomes the capillary resistance between the first capillary region 111 and the second capillary region 112, as well as the flow resistance in the pores of the first capillary layer 11, thereby propelling the heat exchange medium towards the second capillary region 112. In this configuration, as shown by the arrow... Figure 9 As shown, the heat exchange medium located in the second capillary region 112 can also enter the phase change cavity 42 when the temperature is high, thereby reducing the temperature of the first capillary region 111. Alternatively, it can liquefy when the temperature of the second capillary region 112 is low and move to the second capillary layer 12 through the second connecting column 132.
[0052] It should be noted that when the power consumption of the heat source device 51 decreases, the phase change process of the heat exchange medium slows down, and the heat exchange medium vaporized in the first capillary region 111 mainly enters the phase change cavity 42. Alternatively, when the heat source device 51 stops heating, the heat exchange medium no longer undergoes a phase change. In this case, the greater capillary force of the first capillary region 111 can draw the heat exchange medium from the second capillary region 112, causing the heat exchange medium of the first capillary layer 11 to gradually flow back to the first capillary region 111, thus preventing the first capillary region 111 from drying out.
[0053] In some implementations, such as Figures 5-6 As shown, the thickness of the first capillary region 111 is less than the thickness of the second capillary region 112. In this embodiment, the thinner first capillary region 111 results in lower thermal resistance and a faster temperature response. When the first capillary region 111 is heated, the heat exchange medium in it can vaporize rapidly. In contrast, the thicker second capillary region 112 allows the heat exchange medium to be cooled to a certain extent, facilitating its liquefaction. Simultaneously, the larger volume prevents the second capillary region 112 from reaching saturation. Furthermore, the second capillary region 112 can effectively store the heat exchange medium, allowing the second connecting column 132 to draw it in or directly reverse-transport the stored heat exchange medium to the first capillary region 111.
[0054] In some implementations, such as Figure 5 , Figure 6 and Figure 9 As shown, the multiple capillary regions also include a third capillary region 113, which is connected to the first capillary region 111 via a second capillary region 112. In the radial direction of the first connecting post 131 (e.g.) Figure 5As indicated by arrow a1 in the diagram, the third capillary region 113 is located outside the contact surface 33, and the edge of the contact surface 33 is located in the second capillary region 112. A portion of the plurality of second connecting posts 132 is connected to the third capillary region 113 and has a capillary force greater than that of the third capillary region 113. The capillary force and thickness of the first capillary region 111, second capillary region 112, and third capillary region 113 increase sequentially.
[0055] Specifically, such as Figure 5 and Figure 9 As shown, the first plate 251 has a clearance surface 35 on the side away from the evaporation surface 32. The clearance surface 35 is arranged around the contact surface 33, parallel to the contact surface 33, and closer to the condensation surface 31 relative to the contact surface 33. The side of the second capillary region 112 closest to the first capillary region 111 corresponds to the contact surface 33, and the side of the second capillary region 112 closest to the third capillary region 113 corresponds to the clearance surface 35. When the contact surface 33 abuts against the heat source device 51, the clearance surface 35 is spaced apart from the heat source device 51. As a result, the third capillary region 113 heats up more slowly, and when the heat exchange medium reaches the third capillary region 113 along the first capillary layer 11, the heat exchange medium can be liquefied quickly.
[0056] Optionally, such as Figure 9 As shown, the second capillary region 112 includes a first part and a second part. The second part is configured to correspond to the avoidance surface 35, and the first part is configured to correspond to the contact surface 33, and the thickness of the first part is less than that of the second part.
[0057] Optionally, the capillary force of the second connecting post 132 connected to the third capillary region 113 and the capillary force of the second connecting post 132 corresponding to the second capillary region 112 can be configured to be the same, and the capillary force of each second connecting post 132 is greater than that of the second capillary region 112 and the third capillary region 113.
[0058] Optionally, the plurality of capillary regions may further include at least one fourth capillary region, which extends sequentially outward from the outer edge of the third capillary region 113. Simultaneously, the thickness and capillary force of the plurality of fourth capillary regions gradually increase. Those skilled in the art can select the number of capillary regions based on parameters such as the size of the heat dissipation assembly 6 and the heat flux density of the heat source device 51.
[0059] In some implementations, such as Figure 9As shown, the heat-conducting shell 2 has a working cavity 23, and the capillary structure 1 is located within the working cavity 23. The first capillary layer 11 includes a powder structure (e.g., sintered copper powder). Further, the first capillary region 111, the second capillary region 112, and the third capillary region 113 are configured as powder structures. The particle size of the first capillary region 111 is 100-150 mesh, the particle size of the second capillary region 112 is 60-100 mesh, and the particle size of the third capillary region 113 is 30-80 mesh. In this embodiment, the capillary force of the first capillary region 111, the second capillary region 112, and the third capillary region 113 gradually decreases, while the porosity of the first capillary region 111, the second capillary region 112, and the third capillary region 113 increases sequentially, resulting in a sequential increase in the permeability of the first capillary region 111, the second capillary region 112, and the third capillary region 113. Therefore, reducing the flow resistance of the third capillary zone 113 and the second capillary zone 112 helps the heat exchange medium to reflux.
[0060] In some implementations, such as Figure 9 As shown, the first capillary layer 11 is configured as a powder structure. The first capillary region 111 occupies 3%-10% of the volume of the working chamber 23, the second capillary region 112 occupies 15%-20% of the volume of the working chamber 23, and the third capillary region 113 occupies 25%-30% of the volume of the working chamber 23. This increases the storage capacity of the heat exchange medium in the third capillary region 113 and the second capillary layer 12, and also enables the heat exchange medium to liquefy rapidly.
[0061] Furthermore, such as Figure 9 As shown, the length of the first connecting column 131 is greater than that of the second connecting column 132. Simultaneously, the length of the second connecting column 132 corresponding to the second capillary region 112 is greater than that of the second connecting column 132 corresponding to the third capillary region 113. This reduces the path length of the heat exchange medium when it flows back from the third capillary region 113 and the second capillary region 112 to the second capillary layer 12.
[0062] Optionally, the connection points of the first capillary layer 11, the second capillary layer 12, and the third capillary region 113 can all be provided with a slope. For example, the thickness of the second capillary region 112 gradually increases and connects with the third capillary region 113 (e.g., Figure 9 (As shown by the dashed line I in the diagram). This increases the connecting area of the first capillary region 111, the second capillary region 112, and the third capillary region 113, thereby reducing flow resistance.
[0063] In some implementations, such as Figure 5 and Figure 9As shown, the second capillary layer 12 includes a thermally conductive metal layer 121 and a flow-collecting layer 122. The thermally conductive metal layer 121 is arranged along the condensation surface 31, and the first connecting post 131 is connected to the thermally conductive metal layer 121 through the flow-collecting layer 122. The second connecting post 132 is connected to the thermally conductive metal layer 121, and the capillary force of the flow-collecting layer 122 is greater than the capillary force of the thermally conductive metal layer 121.
[0064] Optionally, the area of the thermally conductive metal layer 121 is larger than that of the manifold 122, and the thermally conductive metal layer 121 is disposed between the manifold 122 and the condensation surface 31. In this embodiment, the thermally conductive metal layer 121 can increase the heat conduction rate, allowing the gaseous heat exchange medium to condense rapidly in the thermally conductive metal layer 121. In addition, the capillary force of the manifold 122 is greater than that of the thermally conductive metal layer 121, allowing the heat exchange medium in the thermally conductive metal layer 121 to quickly converge into the manifold 122, preventing saturation of the thermally conductive metal layer 121. At the same time, it helps the heat exchange medium to flow back to the first connecting column 131 through the manifold 122.
[0065] In some implementations, such as Figures 7-9 As shown, the capillary structure 1 also includes a liquid storage section 14. The liquid storage section 14 is connected to a plurality of first connecting posts 131. The capillary force of the liquid storage section 14 is greater than or equal to the capillary force of the manifold 122.
[0066] As is easily understood, the liquid storage section 14 in this embodiment is used to store the heat exchange medium. During the first heat dissipation cycle, a portion of the heat exchange medium is stored in the liquid storage section 14. The heat exchange medium from the first connecting column 131 flows into the liquid storage section 14, and the heat exchange medium in the liquid storage section 14 also flows into the first capillary layer 11 through the first connecting column 131. This ensures that the heat exchange medium in the liquid storage section 14 is in a dynamic equilibrium state. During the second heat dissipation cycle, the heat exchange medium in the first capillary region 111 decreases, allowing the heat exchange medium in the liquid storage section 14 to be quickly replenished through the first connecting column 131, preventing the first capillary region 111 from drying out.
[0067] In some implementations, such as Figures 7-9 As shown, the liquid storage section 14 is a second plate 141. The second plate 141 is arranged at intervals and parallel between the flow-collecting layer 122 and the first capillary layer 11. One end of the first connecting post 131 extends from one plate of the second plate 141 toward the flow-collecting layer 122, and the other end of the first connecting post 131 extends from the other plate of the second plate 141 toward the first capillary layer 11.
[0068] Optionally, the second plate 141 is a circular plate with a consistent thickness across all regions. Multiple first connecting posts 131 are located on the inner side of the edge of the second plate 141 and are evenly distributed across the circular plate. This allows the second plate 141 to exchange heat exchange media with the multiple first connecting posts 131, ensuring that the flow rate of the heat exchange media in each first connecting post 131 remains as consistent as possible, thereby preventing dry burning in the first capillary region 111. During the second heat dissipation cycle, the heat exchange media in the second plate 141 gradually decreases, allowing the heat exchange media in the connecting portion 13 and the liquid storage portion 14 to reach a new equilibrium. Furthermore, when the heat exchange media switches from the second heat dissipation cycle to the first heat dissipation cycle, the liquid storage portion 14 is re-injected with heat exchange media.
[0069] Optionally, both the first capillary region 111 and the confluence layer 122 are circular plates, and the outer diameters of the first capillary region 111 and the confluence layer 122 are the same as the outer diameter of the second plate 141. Thus, the three circular plates and the plurality of first connecting columns 131 constitute a central component. In the first and second heat dissipation cycles, the central component is used to collect the heat exchange medium of the liquid phase.
[0070] In some implementations, such as Figures 7-8 As shown, the liquid storage section 14 is integrally formed with a plurality of first connecting columns 131. This reduces the flow resistance of the heat exchange medium between the liquid storage section 14 and the first connecting columns 131.
[0071] In some implementations, such as Figure 9 As shown, the thermally conductive metal layer 121 has a wire mesh structure, and the busbar layer 122 has a powder structure and is sintered integrally with the wire mesh structure.
[0072] Specifically, the wire mesh structure can be a copper mesh. The flow manifold 122 is sintered together with the wire mesh structure, so that the powder of the flow manifold 122 is fused with the wire mesh structure. This reduces the flow resistance of the heat exchange medium in the second capillary layer 12.
[0073] Optionally, the capillary force of the liquid storage section 14 is the same as the capillary force of the first connecting post 131. The capillary force of the first connecting post 131 is greater than that of the manifold 122 and less than that of the first capillary region 111. The capillary force of the thermally conductive metal layer 121 is greater than that of the second connecting post 132.
[0074] In some implementations, such as Figure 5 As shown, the thermally conductive metal layer 121 has a plurality of first clearance holes 1211. The busbar layer 122 has a plurality of second clearance holes 1221. Further referring to... Figures 6-8 As shown, the first capillary layer 11 has a plurality of third clearance holes 114. The plurality of third clearance holes 114 are respectively disposed in the first capillary region 111, the second capillary region 112, and the third capillary region 113. Further referring to… Figure 9As shown, one end of the support column 24 located at the first connecting column 131 passes through both the first clearance hole 1211 and the second clearance hole 1221 and is fixedly connected to the second housing 22, while the other end passes through the third clearance hole 114 of the first capillary region 111 and is fixedly connected to the first housing 21. Similarly, one end of the support column 24 located at the second connecting column 132 passes through the first clearance hole 1211 and is fixedly connected to the second housing 22, while the other end passes through the third clearance hole 114 of either the second capillary region 112 or the third clearance hole 114 of the third capillary region 113 and is fixedly connected to the first housing 21.
[0075] In one alternative implementation, such as Figure 10 As shown, the heat dissipation component 6 in the above embodiment can be applied to a data processing device. The data processing device includes a data processing unit 5 and a heat dissipation component 6. The data processing unit 5 includes a heat source device 51, and the contact surface 33 abuts against the heat source device 51.
[0076] Furthermore, the data processing device also includes a heat-conducting component 7. The heat-conducting component 7 is used for heat exchange with the heat dissipation surface 34.
[0077] In summary, the data processing device in this embodiment has a first capillary layer 11 disposed on the evaporation surface 32 and a second capillary layer 12 disposed on the condensation surface 31, connected by a connecting part 13 between the first capillary layer 11 and the second capillary layer 12, forming a circulation path 41 between the connecting part 13 and the first and second capillary layers 11 and 12, respectively. Simultaneously, a phase change cavity 42 is formed between the first and second capillary layers 11 and 12. Thus, the heat exchange medium can simultaneously utilize the phase change cavity 42 and the circulation path 41 to achieve a first heat dissipation cycle, and the heat exchange medium can also utilize the circulation path 41 to achieve a second heat dissipation cycle. This increases the circulation speed of the heat exchange medium within the heat-conducting shell 2, improving heat dissipation efficiency. Furthermore, the heat source device 51 at different temperatures results in different contents of the heat exchange medium in the first and second heat dissipation cycles, allowing the capillary structure 1 to adjust the circulation mode of the heat exchange medium according to the temperature of the heat source device 51. This increases the operating temperature range of the heat dissipation assembly 6, particularly meeting the heat dissipation requirements of the heat source device 51 during rapid temperature rise, and improving the reliability of the heat dissipation assembly 6.
[0078] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. For those skilled in the art, the present invention can be modified and varied in various ways. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of the present invention should be included within the scope of protection of the present invention.
Claims
1. A heat dissipation component, characterized in that, The heat dissipation component includes: A heat-conducting shell, wherein the inner wall of the heat-conducting shell has a condensation surface and an evaporation surface, and the outer wall of the heat-conducting shell has a contact surface; and The capillary structure includes a first capillary layer, a second capillary layer, and a connecting portion, wherein the first capillary layer is disposed on the evaporation surface, and the second capillary layer is disposed on the condensation surface; The first capillary layer and the second capillary layer are spaced apart and connected by the connecting portion to form a circulation path, and a phase change cavity is formed between the first capillary layer and the second capillary layer.
2. The heat dissipation assembly according to claim 1, characterized in that, The heat-conducting shell includes a first plate, one surface of which forms the contact surface and the other surface of which forms the evaporation surface; The connecting part includes at least one first connecting post and at least one second connecting post; In the circulation path, the first capillary layer delivers heat exchange medium to the second capillary layer through the second connecting post, and the second capillary layer delivers heat exchange medium to the first capillary layer through the first connecting post.
3. The heat dissipation assembly according to claim 2, characterized in that, The heat-conducting shell includes: A first housing having the evaporation surface and the contact surface; and The second housing is assembled with the first housing to form a working cavity. The second housing has a heat dissipation surface and a condensation surface, which are opposite to each other. The capillary structure is located inside the working cavity.
4. The heat dissipation assembly according to claim 3, characterized in that, Both the first connecting post and the second connecting post have through holes; The heat-conducting shell also includes: Multiple support columns are spaced apart in the working cavity. One end of each support column is connected to the first housing and the other end is fixedly connected to the second housing. At least a portion of the multiple support columns pass through the through hole.
5. The heat dissipation assembly according to claim 2, characterized in that, In a cross-sectional direction perpendicular to the axial direction of the first connecting post, the first capillary layer extends outward from the contact surface, and a plurality of the first connecting posts coincide with the contact surface, while at least a portion of a plurality of the second connecting posts are offset from the contact surface.
6. The heat dissipation assembly according to claim 5, characterized in that, The first capillary layer includes multiple capillary regions in the extension direction, and the multiple capillary regions include a first capillary region and a second capillary region; A plurality of first connecting posts are connected to the first capillary region, at least a portion of a plurality of second connecting posts are connected to the second capillary region, and the capillary force of the second connecting posts is greater than that of the second capillary region, while the capillary force of the first connecting posts is less than or equal to that of the first capillary region.
7. The heat dissipation assembly according to claim 6, characterized in that, The capillary force in the first capillary region is greater than the capillary force in the second capillary region; and / or The thickness of the first capillary region is less than the thickness of the second capillary region.
8. The heat dissipation assembly according to claim 6, characterized in that, The plurality of capillary regions further includes a third capillary region, which is connected to the first capillary region through the second capillary region; In a cross-sectional direction perpendicular to the axial direction of the first connecting post, the third capillary region is located outside the contact surface, the edge of the contact surface is located in the second capillary region, and a portion of the plurality of second connecting posts is connected to the third capillary region and the capillary force is greater than that of the third capillary region. The capillary force and thickness of the first capillary region, the second capillary region, and the third capillary region increase sequentially.
9. The heat dissipation assembly according to claim 8, characterized in that, The heat-conducting shell has a working cavity, and the capillary structure is located inside the working cavity; The first capillary region, the second capillary region, and the third capillary region are all configured as powder structures; The particle size of the first capillary region is 100-150 mesh, the particle size of the second capillary region is 60-100 mesh, and the particle size of the third capillary region is 30-80 mesh; and / or the first capillary region occupies 3%-10% of the working chamber volume, the second capillary region occupies 15%-20% of the working chamber volume, and the third capillary region occupies 25%-30% of the working chamber volume.
10. The heat dissipation assembly according to claim 5, characterized in that, The second capillary layer includes a thermally conductive metal layer and a flow-collecting layer. The thermally conductive metal layer is arranged along the condensation surface. The first connecting post is connected to the thermally conductive metal layer through the flow-collecting layer. The second connecting post is connected to the thermally conductive metal layer. The capillary force of the flow-collecting layer is greater than the capillary force of the thermally conductive metal layer.
11. The heat dissipation assembly according to claim 10, characterized in that, The capillary structure further includes a liquid storage section, which is connected to a plurality of the first connecting columns, and the capillary force of the liquid storage section is greater than or equal to the capillary force of the manifold.
12. The heat dissipation assembly according to claim 11, characterized in that, The liquid storage section is a second plate, which is spaced apart and arranged in parallel between the flow-collecting layer and the first capillary layer; One end of the first connecting post extends from one plate of the second plate toward the flow-collecting layer, and the other end of the first connecting post extends from the other plate of the second plate toward the first capillary layer.
13. The heat dissipation assembly according to claim 12, characterized in that, The liquid storage section is integrally formed with the plurality of first connecting columns; and / or The thermally conductive metal layer has a wire mesh structure, and the flow-passing layer has a powder structure and is integrally sintered with the wire mesh structure.
14. A data processing apparatus, characterized in that, The data processing device includes: Data processing unit, including heat source device; The heat dissipation assembly according to any one of claims 1-13, wherein the contact surface abuts against the heat source device.