A computer heat dissipation performance optimization method, a heat dissipation module and a side-over computer

Abstract

The application provides a computer heat dissipation performance optimization method, a heat dissipation module and a side turning computer, and relates to the field of computer heat dissipation performance optimization. The computer heat dissipation performance optimization method comprises the following steps: S1, collecting the running state data of the computer through a sensor and a system interface to form time series data, wherein the state data comprises CPU temperature, CPU load, GPU temperature, GPU load, environment temperature and working state parameters of the heat dissipation module. The computer heat dissipation performance optimization method provided by the application learns the relationship between the historical temperature and load of the computer CPU and GPU and the future temperature rise through the setting of an optimization model, realizes accurate temperature prediction and intelligent control of the heat dissipation module, does not need to passively control the use state of the heat dissipation module by setting a fixed threshold, can adaptively, in advance and accurately control heat dissipation, and thus realizes the analysis and optimization of the heat dissipation performance of the CPU and GPU of the computer.

Description

Technical Field

[0001] This invention relates to the field of computer heat dissipation performance optimization, and in particular to a computer heat dissipation performance optimization method, heat dissipation module, and side-flipping computer. Background Technology

[0002] With the continuous advancement of integrated circuit technology and the increasing demand for computing power, the integration and power density of computer core processors (CPU, GPU) have significantly improved. The overheating problem caused by high heat flux density has become increasingly prominent. High temperature will not only trigger the chip to automatically reduce frequency, resulting in a significant drop in computing performance, but also accelerate the aging of components and reduce system stability and lifespan.

[0003] Meanwhile, portable computers (laptops) are evolving towards thinner, lighter, multi-screen, and more integrated designs, resulting in compact internal spaces. Traditional passive cooling systems struggle to handle the dynamic heat generation under complex operating conditions. Especially in special applications such as dustproof and waterproofing, the thermal design must balance structural sealing with environmental adaptability, further increasing the difficulty of thermal management.

[0004] Therefore, the existing computer cooling methods, which rely on detecting the computer's temperature and controlling the operation of cooling components such as fans based on temperature thresholds, are insufficient to handle dynamic heat generation under complex operating conditions. There is still room for further optimization of computer cooling performance by combining computer load data and heat dissipation data with intelligent algorithms to achieve advance control of heat dissipation intensity.

[0005] Therefore, it is necessary to provide a method for optimizing computer heat dissipation performance, a heat dissipation module, and a side-flipping computer to solve the above-mentioned technical problems. Summary of the Invention

[0006] This invention provides a method for optimizing computer heat dissipation performance, which solves the problem of how to use computer load data and heat dissipation data, combined with intelligent algorithms, to pre-regulate heat dissipation intensity and optimize heat dissipation performance.

[0007] To address the aforementioned technical problems, this invention provides a method for optimizing computer heat dissipation performance, comprising the following steps: S1. Collect computer operating status data through sensors and system interfaces to form time series data, wherein the status data includes CPU temperature, CPU load, GPU temperature, GPU load, ambient temperature, and working status parameters of the heat dissipation module. S2. Normalize the time series data and use a denoising algorithm to remove outliers and interference signals from the data to construct data samples; S3. Build a lightweight deep learning model, import the data samples into the deep learning model, and optimize the model parameters through multiple iterations of training to obtain the optimized model. S4. Deploy the optimization model to the computer system. The optimization model can obtain the status data of the CPU, GPU and environment in real time, and has the authority to adjust the heat dissipation module. S5. The optimization model predicts the temperature values ​​of the CPU and GPU within a preset time period based on the current state data and historical time series of the CPU and GPU, and adjusts the working state of the heat dissipation module in advance according to the predicted structure.

[0008] Preferably, in S5, the temperature values ​​of the CPU and GPU are predicted within the next 2 to 5 seconds.

[0009] The present invention also provides a heat dissipation module for CPU and GPU heat dissipation in a method for optimizing computer heat dissipation performance; Includes: bottom cover; Two heat-conducting components are installed at intervals on the bottom cover. Each heat-conducting component includes a fan, a heat-conducting pipe, a heat exchange structure, a micro pump, and a heat-conducting block. The interior of the heat-conducting pipe is divided into two heat-conducting cavities by a partition plate 1. The interior of the heat-conducting block is divided into two cavities by a partition plate 3. A gap is left between the partition plate 3 and the inner wall of the heat-conducting block, and one end of each of the two heat-conducting cavities is respectively connected to the two cavities. The heat exchange structure includes multiple heat exchange blocks and multiple conduits. The interior of each heat exchange block is divided into a flow guide cavity 1 and a flow guide cavity 2 by a partition 2. The flow guide cavity 1 and the flow guide cavity 2 of adjacent heat exchange blocks are connected by corresponding conduits. The other ends of the two heat guide cavities are respectively connected to the flow guide cavity 1 and the flow guide cavity 2 of the heat guide block located on the outermost side. The input and output ends of the micro pump are respectively connected to the flow guide cavity one and flow guide cavity two of the other heat-conducting block located on the outermost side; A fan, the fan's outlet being horizontally oriented towards the heat exchange structure, and the fan's inlet being aligned with the air inlet hole on the bottom cover.

[0010] Preferably, the conduits between adjacent heat exchange blocks are arranged in an alternating pattern of high and low heights.

[0011] Preferably, the heat dissipation module further includes a filter screen, which is disposed at the bottom of the bottom cover and aligned with the air inlet.

[0012] Preferably, the heat dissipation module further includes an electric push cylinder and a sealing component. The electric push cylinder is mounted on the mounting plate of the bottom cover. The output end of the electric push cylinder is connected to the housings of the two fans respectively through a connecting plate. The fans are slidably mounted on the bottom cover. A cleaning port is provided at the bottom of the fan outlet. The sealing component is used to block the cleaning port or the fan outlet.

[0013] Preferably, the mounting plate is equipped with two sets of sliding rods, and the fan is fitted onto the corresponding set of sliding rods via a connecting sleeve.

[0014] Preferably, the sealing component includes a sealing plate, a rotating shaft, and a gear. The sealing plate is rotatably mounted inside the air outlet of the fan via the rotating shaft. The gear is mounted on the rotating shaft and located outside the fan. A toothed plate is suspended above the gear, and the toothed plate meshes with the gear. In the initial state, the sealing plate blocks the cleaning port. After the gear and the toothed plate are fully engaged, the sealing plate rotates ninety degrees to block the air outlet of the fan.

[0015] Preferably, the heat dissipation module further includes a cleaning component, which includes a sealing plate, a connecting arm, and a cleaning head. The bottom cover has a strip-shaped hole, the sealing plate covers the strip-shaped hole, the top end of the sealing plate is connected to the output end of the electric push cylinder through a connecting frame, one end of the connecting arm passes through the strip-shaped hole and is connected to the sealing plate, and the cleaning head is installed at the other end of the connecting arm and contacts one end of the filter screen.

[0016] The present invention also provides a side-flipping computer, including a main unit, a display screen and a heat dissipation module, wherein the display screen is connected to the main unit and electrically connected to the main unit, and a side-flipping screen is connected to the display screen and electrically connected to the main unit. The bottom of the host unit is provided with a mounting cavity, and the heat dissipation module is installed in the mounting cavity. The mounting cavity is connected to an air outlet. The two heat pipes in the heat dissipation module pass through the bottom of the host unit and extend into the interior of the host unit, so that the two heat conduction blocks are respectively attached to the CPU and GPU inside the host unit. The air outlet is aligned with the heat exchange structure.

[0017] Compared with related technologies, the computer heat dissipation performance optimization method provided by the present invention has the following beneficial effects: This invention provides a method for optimizing computer heat dissipation performance. By setting an optimization model to learn the relationship between the historical temperature, load, and future temperature rise of the computer's CPU and GPU, it can achieve accurate temperature prediction and intelligent control of the heat dissipation module. It does not require passively controlling the usage status of the heat dissipation module by setting a fixed threshold. It can adaptively, proactively, and accurately control heat dissipation, thereby analyzing and optimizing the heat dissipation performance of the computer's CPU and GPU. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the heat dissipation module provided by the present invention; Figure 2 This is a schematic diagram of the structure of the heat-conducting component provided by the present invention; Figure 3 A partial cross-sectional view of the heat-conducting component provided by the present invention; Figure 4 A bottom view of the heat dissipation module provided by the present invention; Figure 5 A schematic diagram of the heat exchange structure provided by the present invention; Figure 6 A schematic diagram of the cleaning port and air inlet provided by the present invention; Figure 7 for Figure 1 Enlarged view of point A in the middle; Figure 8 This is a schematic diagram of the working state of the fan provided by the present invention, wherein, Figure 8 Image (a) shows a schematic diagram of the fan in cooling mode. Figure 8 (b) is a schematic diagram of the fan in a clean state; Figure 9 This is a schematic diagram of the structure of the cleaning component provided by the present invention; Figure 10 A schematic diagram of the structure of the side-flipping computer provided by the present invention; Figure 11 A schematic diagram of the mounting cavity provided by the present invention; Figure 12 A schematic diagram illustrating the assembly of the heat dissipation module provided by the present invention with a side-flipping computer; Figure 13 This is a schematic diagram of the unfolded side-flip computer display screen provided by the present invention.

[0019] Numbering on the map: 1. Bottom cover; 11. Mounting plate; 111. Slide rod; 101. Air inlet; 102. Strip hole; 2. Thermal conductive components; 21. Fan; 22. Heat pipe; 23. Heat exchange structure; 24. Micro pump; 25. Thermal block; 211. Connecting sleeve; 212. Cleaning port; 251. Partition three; 221. Partition 1; 222. Heat conduction cavity 1; 223. Heat conduction cavity 2; 231. Heat exchange block; 232. Second baffle plate; 233. Guide tube; 201. Flow guide cavity one; 202. Flow guide cavity two; 3. Electric push cylinder; 31. Connecting plate; 4. Sealing component; 41. Sealing plate; 42. Rotating shaft; 43. Gear; 5. Filter screen; 6. Toothed plate; 7. Sweeping component; 71. Sealing plate; 72. Connecting arm; 73. Sweeping head; 8. Main unit; 81. Mounting cavity; 82. Air outlet; 9. Display screen; 91. Flip-up screen. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] This invention provides a method for optimizing computer heat dissipation performance.

[0022] In one embodiment of the present invention, the method for optimizing computer heat dissipation performance includes the following steps: S1. Collect computer operating status data through sensors and system interfaces to form time series data, wherein the status data includes CPU temperature, CPU load, GPU temperature, GPU load, ambient temperature, and working status parameters of the heat dissipation module. S2. Normalize the time series data and use a denoising algorithm to remove outliers and interference signals from the data to construct data samples; S3. Build a lightweight deep learning model, import the data samples into the deep learning model, and optimize the model parameters through multiple iterations of training to obtain the optimized model. S4. Deploy the optimization model to the computer system. The optimization model can obtain the status data of the CPU, GPU and environment in real time, and has the authority to adjust the heat dissipation module. S5. The optimization model predicts the temperature values ​​of the CPU and GPU within a preset time period based on the current state data and historical time series of the CPU and GPU, and adjusts the working state of the heat dissipation module in advance according to the predicted structure.

[0023] By setting up an optimization model to learn the relationship between the historical temperature, load, and future temperature rise of the computer's CPU and GPU, it can achieve accurate temperature prediction and intelligent control of the heat dissipation module. It does not need to passively control the usage status of the heat dissipation module by setting a fixed threshold. It can adaptively, proactively, and accurately control heat dissipation, thereby analyzing and optimizing the heat dissipation performance of the computer's CPU and GPU.

[0024] Preferably, in S5, the temperature values ​​of the CPU and GPU are predicted within the next 2 to 5 seconds.

[0025] In S1, time series data is collected from the past 3 to 5 seconds of historical sequence, allowing the model to learn from the past state and further judge the future temperature pattern; In S2, the data is normalized and scaled to between 0 and 1 to facilitate neural network computation; the data sample structure is constructed, such as the input: data from the previous t time step; Tags: Temperatures at times t+1, t+2, and t+3, and the optimal operating state of the heat dissipation module.

[0026] S3 uses a lightweight network suitable for embedded devices, preferably an LSTM (Long Short-Term Memory) model; tasks include: temperature prediction (temperature in the next 2-5 seconds) and heat dissipation decision (predicting the optimal working state of the heat dissipation module).

[0027] During training, a large amount of data is fed in to allow the model to learn; for example, the temperature will rise rapidly under high load, and the power of the heat dissipation module needs to be increased in advance when the temperature rises rapidly; when the ambient temperature is high, the heat dissipation module needs to be more aggressive; and different heat dissipation strategies are used for different thermal scenarios.

[0028] In S4, the trained model is preferably deployed to the computer's EC (Embedded Controller) or BIOS (Basic Input Output System), which enables real-time, low-latency, and highly reliable intelligent heat dissipation control. The optimized model in S5 can read CPU temperature, GPU temperature, load, and ambient temperature every second / every 100ms. Based on historical patterns, it predicts whether overheating will occur and controls the working status of the heat dissipation module. The present invention also provides a heat dissipation module.

[0029] Please see Figures 1 to 4 A heat dissipation module for CPU and GPU heat dissipation in a method for optimizing computer heat dissipation performance; Includes: bottom cover 1; Two heat-conducting components 2 are installed at intervals on the bottom cover 1. Each heat-conducting component 2 includes a fan 21, a heat-conducting pipe 22, a heat exchange structure 23, a micro pump 24, and a heat-conducting block 25. The interior of the heat-conducting pipe 22 is divided into two heat-conducting cavities by a partition 1 221, and the interior of the heat-conducting block 25 is divided into two cavities by a partition 3 251. The partition 3 251 is spaced from the inner wall of the heat-conducting block 25, and one end of each of the two heat-conducting cavities is respectively connected to the two cavities. The heat exchange structure 23 includes multiple heat exchange blocks 231 and multiple conduits 233. The interior of each heat exchange block 231 is divided into a first flow channel 201 and a second flow channel 202 by a partition 232. The first flow channel 201 and the second flow channel 202 of adjacent heat exchange blocks 231 are connected by corresponding conduits 233. The other ends of the two heat exchange chambers are connected to the first flow channel 201 and the second flow channel 202 of the outermost heat exchange block 25. The input and output ends of the micro pump 24 are respectively connected to the flow guide cavity 201 and flow guide cavity 202 of the other heat-conducting block 25 located on the outermost side; Fan 21, the air outlet of the fan 21 is horizontally oriented toward the heat exchange structure 23, and the air inlet of the fan 21 is aligned with the air inlet hole 101 on the bottom cover 1.

[0030] Two heat-conducting components 2 respectively dissipate heat from the CPU and GPU. Heat-conducting blocks 25 in the two components 2 are attached to the CPU and GPU respectively, and the heat generated by the CPU and GPU is dissipated by the heat-conducting blocks 25. One end of the heat pipe 22 is fixedly connected to the heat-conducting block 25, and the other end is fixedly connected to the corresponding heat exchange block 231. Both the heat-conducting block 25 and the heat exchange block 231 are hollow. For ease of understanding and description, as follows... Figure 3 The two heat-conducting cavities are positioned as heat-conducting cavity one 222 and heat-conducting cavity two 223, wherein heat-conducting cavity one 222 is connected to flow-guiding cavity one 201, and heat-conducting cavity two 223 is connected to flow-guiding cavity two 202; coolant is provided inside the heat-conducting block 25, heat-conducting pipe 22, and heat exchange block 231.

[0031] When the heat dissipation module is working, the heat conduction block 25 conducts the heat generated by the CPU and GPU, and the heat conduction pipe 22 conducts it to the heat exchange block 231 of the heat exchange structure 23. The fan 21 operates and the cold air quickly carries away the heat conducted to the heat conduction block 25. The heat dissipation module optimizes the power of the fan 21 based on the temperature rise of the computer's CPU and GPU, thereby controlling the heat dissipation performance. When it is determined that the temperature is about to rise too high and exceed the upper limit of the CPU and GPU's operating temperature (such as exceeding 55~70℃), the micro pump 24 can be activated. When the micro pump 24 is working, the coolant flows from one cavity inside the heat conduction block 25 through heat conduction cavity 222 and flow guide cavity 201 into the input end of the micro pump 24, and then from the output end of the micro pump 24 through flow guide cavity 202 and heat conduction cavity 223 into another cavity of the heat conduction block 25. The coolant can quickly carry the heat on the heat conduction block 25 to the heat exchange block 231, and the fan 21 blows out cold air to quickly remove the carried heat, improving the heat dissipation effect. The circulating water cooling, in conjunction with the heat conduction block 25, heat conduction pipe 22 and heat exchange structure 23, can further accelerate heat dissipation.

[0032] Furthermore, by setting up the cavities inside the heat-conducting block 25, heat-conducting pipe 22 and heat exchange block 231, a circulating water path can be formed in conjunction with the micro pump 24, eliminating the need for additional circulating water pipes and simplifying the structure.

[0033] Among them, the heat-conducting block 25, the heat-conducting pipe 22 and the heat exchange block 231 are made of metal heat-conducting material, preferably copper.

[0034] A gap is left between the partition plate 251 and the inner wall of the heat-conducting block 25, such as... Figure 3 This connects the two cavities within the heat-conducting block 25, allowing the coolant to circulate.

[0035] The number of air inlets 101 on the bottom cover 1 corresponds to the number of fans 21.

[0036] The heat dissipation module of the present invention is preferably used in laptops with high sealing requirements, such as military applications and fields with field operation requirements. It utilizes the heat conduction block 25 to conduct heat in contact with the CPU and GPU, and the fan 21 and other parts can be separated from the circuit board, thereby ensuring the sealing treatment of the circuit board part. For details, please refer to the side-flipping computer section below, which will not be described in detail here.

[0037] Preferably, a transition cylinder is provided, with its inlet and outlet ends connected to the flow guide cavity 201 of the heat exchange block 231 and the input end of the micro pump 24, respectively. The transition cylinder stores coolant to ensure sufficient coolant.

[0038] Please see Figure 5 In a preferred embodiment, the conduits 233 between adjacent heat exchange blocks 231 are arranged in an alternating pattern of high and low heights.

[0039] By staggering the heights of the conduits 233 between adjacent heat exchange blocks 231, the coolant can enter from the top of one heat exchange block 231 and then from the bottom to another heat exchange block 231, and so on. This allows the coolant to come into more full contact with the heat exchange blocks 231, thereby improving the heat exchange efficiency.

[0040] Please see Figure 4 In this embodiment, the heat dissipation module further includes a filter 5, which is disposed at the bottom of the bottom cover 1 and aligned with the air inlet 101.

[0041] By setting up filter 5, impurities such as dust, lint, and debris can be filtered out, preventing these impurities from entering the fan 21 and affecting its operation. This also prevents impurities from adhering to the heat pipe 22 and the heat exchange block 231, thus affecting the heat exchange efficiency.

[0042] Please see Figure 1In a preferred embodiment, the heat dissipation module further includes an electric push cylinder 3 and a sealing component 4. The electric push cylinder 3 is mounted on the mounting plate 11 of the bottom cover 1. The output end of the electric push cylinder 3 is connected to the housings of the two fans 21 respectively through a connecting plate 31. The fans 21 are slidably mounted on the bottom cover 1. A cleaning port 212 is provided at the bottom of the air outlet of the fans 21. The sealing component 4 is used to block the cleaning port 212 or the air outlet of the fans 21.

[0043] The fan 21 includes a main body (i.e., the main body of the motor, fan blades, etc. that generate air) and a housing. The main body is installed inside the housing. The housing has an air inlet and an air outlet. When the main body is working, the airflow enters through the air inlet and exits through the air outlet. The cleaning port 212 is located at the bottom of the housing and inside the air outlet.

[0044] When the fan 21 is used for heat dissipation, the sealing part 4 blocks the cleaning port 212, the fan 21 works, and the airflow blows from the air outlet to the heat exchange block 231, carrying away the heat; When the fan 21 is in cleaning mode, the sealing part 4 blocks the air outlet, and the cleaning port 212 is opened. At this time, when the fan 21 is working, the airflow is discharged downward through the cleaning port 212. At the same time, the electric push cylinder 3 pulls the fan 21 to move, so that the cleaning port 212 moves along one end of the filter screen 5 to the other end, and performs uniform back-blowing cleaning of the filter screen 5 to prevent impurities from adhering to the filter screen 5, affecting the air intake of the fan 21, and thus affecting the heat dissipation efficiency. This allows you to set up regular cleaning. The length of the power supply line for fan 21 meets the distance requirements for fan 21 to move.

[0045] Please see Figure 1 As an optional embodiment, the mounting plate 11 is equipped with two sets of sliding rods 111, and the fan 21 is sleeved on the corresponding set of sliding rods 111 through a connecting sleeve 211.

[0046] Each set of slide rods 111 consists of two parts. Connecting sleeves 211 are provided on both sides of the fan housing 21 and are fitted onto the slide rods 111 to form a sliding assembly. In conjunction with the electric push cylinder 3, the fan 21 is limited in both the horizontal and vertical directions, ensuring the stability of the fan 21 during operation.

[0047] The connecting plate 31 is fixedly connected to the connecting sleeve 211 of the two fans 21, and the electric push cylinder 3 is fixedly connected to the connecting plate 31.

[0048] As another alternative to this embodiment, multiple slide rails can be installed on the bottom cover 1, and slide sleeves can be provided on both sides of the fan 21, with the slide sleeves and slide rails assembled to form a sliding connection.

[0049] Please see Figure 3 , Figure 6 and Figure 7 As an optional embodiment, the sealing component 4 includes a sealing plate 41, a rotating shaft 42, and a gear 43. The sealing plate 41 is rotatably mounted in the air outlet of the fan 21 via the rotating shaft 42. The gear 43 is mounted on the rotating shaft 42 and located outside the fan 21. A toothed plate 6 is suspended above the gear 43, and the toothed plate 6 meshes with the gear 43. In the initial state, the sealing plate 41 blocks the cleaning port 212. After the gear 43 and the toothed plate 6 are fully engaged, the sealing plate 41 rotates ninety degrees to block the air outlet of the fan 21.

[0050] When the sealing component 4 moves with the fan 21, such as Figure 8 In step (a), gear 43 first interacts with gear plate 6, causing shaft 42 to rotate. Shaft 42 then rotates sealing plate 41 ninety degrees, blocking the air outlet of fan 21. At this time, airflow can flow downward through cleaning port 212, such as... Figure 8 In section (b), the airflow direction of the fan 21 can be switched during the process of the electric push cylinder 3 moving the fan 21, so that the fan 21 can be switched from the heat dissipation state to the cleaning state, simplifying the structure and saving the power of the corresponding computer equipment.

[0051] When the sealing plate 41 is rotated 90 degrees, the cleaning port 212 is close to or just aligned with the air inlet 101.

[0052] Subsequently, when the electric push cylinder 3 pushes the fan 21 to its original position, the gear 43 interacts with the toothed plate 6 again, causing the sealing plate 41 to seal the cleaning port 212 again.

[0053] like Figure 7 One end of the toothed plate 6 is fixedly connected to the bottom cover 1 via a connecting block.

[0054] Preferably, a protrusion is provided on the top of the inner wall of the air outlet of the fan 21, and a magnetic block is provided on the protrusion. The sealing plate 41 is a metal block that can be attracted to the magnetic block. When the sealing plate 41 blocks the air outlet of the fan 21, it can be attracted to the magnetic block to improve the stability of the blockage. Alternatively, a rubber sleeve can be installed on the rotating shaft 42 to increase friction with the fan 21 housing, so that it will not rotate randomly without being subjected to external force.

[0055] As another alternative in this embodiment, the gear 43 in the sealing component 4 can be replaced with a drive motor. The drive motor is mounted on the housing of the fan 21 via an assembly plate, and the rotating shaft 42 is connected to the output shaft of the drive motor.

[0056] Please see Figure 9 As an optional embodiment of the present invention, the heat dissipation module further includes a cleaning component 7, which includes a sealing plate 71, a connecting arm 72, and a cleaning head 73. The bottom cover 1 has a strip-shaped hole 102, and the sealing plate 71 covers the strip-shaped hole 102. The top end of the sealing plate 71 is connected to the output end of the electric push cylinder 3 through a connecting frame. One end of the connecting arm 72 passes through the strip-shaped hole 102 and is connected to the sealing plate 71. The cleaning head 73 is installed at the other end of the connecting arm 72 and contacts one end of the filter screen 5.

[0057] When cleaning the filter screen 5, the electric push cylinder 3 pulls the fan 21 to move, which in turn drives the cleaning component 7 to move. The cleaning head 73 in the cleaning component 7 cleans the filter screen 5, causing the impurities attached to the filter screen 5 to loosen and fall off. Combined with the airflow blown out from the cleaning port 212 to back-blow the filter screen 5, the filter screen 5 can be cleaned more easily and thoroughly.

[0058] The cleaning head 73 is equipped with soft bristles and interacts with the filter 5 before the cleaning port 212. There are two cleaning components 7 and two strip-shaped holes 102, corresponding to the two air inlets 101. When not cleaned, the sealing plate 71 can block the strip hole 102 to maintain a tight seal. The present invention also provides a side-flipping computer.

[0059] Please see Figures 10 to 13 A side-flipping computer includes: a main unit 8, a display screen 9, and a heat dissipation module. The display screen 9 is connected to the main unit 8 and electrically connected to the main unit 8. A side-flipping screen 91 is connected to the display screen 9 and electrically connected to the main unit 8. The bottom of the host unit 8 is provided with a mounting cavity 81, and the heat dissipation module is installed in the mounting cavity 81. The mounting cavity 81 is connected to an air outlet 82. The two heat pipes 22 in the heat dissipation module pass through the bottom of the host unit 8 and extend into the interior of the host unit 8, so that the two heat conduction blocks 25 are respectively attached to the CPU and GPU inside the host unit 8. The air outlet 82 is aligned with the heat exchange structure 23.

[0060] The main unit 8 includes core hardware such as an integrated motherboard, CPU, GPU, memory, hard drive, battery, heat dissipation system, and input devices, and is the computing and control center of the whole machine. The display unit 9 is used for image output and human-computer interaction display. In this case, the flip computer means that the computer has a flip screen 91.

[0061] The side-flipping computer provided by this invention is mainly used in military applications or fields requiring outdoor use; it possesses moisture-proof, mildew-proof, and salt spray-proof capabilities, and further extends to waterproof, dustproof, and vibration-shock-proof features. It can operate stably for extended periods in harsh environments such as humid heat, salt spray, mold, sand, and rain. Therefore, the computer requires high sealing performance. Figure 11 A separate mounting cavity 81 is provided at the bottom of the main unit 8 housing. The heat dissipation module is installed in the mounting cavity 81. The bottom cover 1 is installed at the bottom of the main unit 8 by bolts, so that the heat dissipation module and the circuit module are separated and located in different cavities. This allows the cavity of the circuit module to be sealed, eliminating the need for air inlet 101 and air outlet 82 for heat dissipation.

[0062] like Figure 12 After installation, the heat exchange structure 23 is aligned with the air outlet 82, and the air outlet of the fan 21 faces the air outlet 82. The heat pipe 22 penetrates through the bottom of the main unit 8 and enters the cavity where the circuit module is installed, and the two heat conduction blocks 25 are attached to the CPU and GPU respectively. The heat pipe 22 and the main unit 8 are sealed together.

[0063] Furthermore, the side-flipping computer casing is made of high-strength aluminum alloy CNC unibody molding, making the entire machine sealed, drop-resistant, and vibration-resistant. The motherboard, screen, hard drive, and interfaces are all reinforced with three levels of reinforcement, shock absorption, anti-loosening, and adhesive. Electrically, it features wide temperature range, high insulation, electromagnetic leakage prevention, and safe grounding. All joint surfaces of the casing are reinforced with waterproof rubber strips to create a sealed chamber, completely enclosing the motherboard, screen, and hard drive within a sealed space. The motherboard and function boards are all coated with silicone conformal adhesive to form a transparent protective film. It adopts a side-flipping dual-screen structure, allowing for flexible opening and closing and multi-angle operation in scenarios such as vehicle, field, and cabin, balancing display area and portability. It is equipped with a rich array of interfaces: USB / HDMI, Gigabit Ethernet, RS232, RS485, fiber optic, and aviation connectors. It is suitable for professional applications such as command and control, data acquisition, communication networking, and field testing. The keyboard and touchpad are waterproofed, with a water channel and outlet under the keyboard for direct drainage of incoming water. The main unit 8 and the display unit 9 are designed with vibration-damping corner protectors around their perimeter. The corner protectors are made of silicone rubber, which has excellent vibration damping, buffering and weather resistance.

[0064] The specific structure of the heat dissipation module is as described in the above embodiments. Since the side-flipping computer adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0065] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for optimizing computer heat dissipation performance, characterized in that, Includes the following steps: S1. Collect computer operating status data through sensors and system interfaces to form time series data, wherein the status data includes CPU temperature, CPU load, GPU temperature, GPU load, ambient temperature, and working status parameters of the heat dissipation module. S2. Normalize the time series data and use a denoising algorithm to remove outliers and interference signals from the data to construct data samples; S3. Build a lightweight deep learning model, import the data samples into the deep learning model, and optimize the model parameters through multiple iterations of training to obtain the optimized model. S4. Deploy the optimization model to the computer system. The optimization model can obtain the status data of the CPU, GPU and environment in real time, and has the authority to adjust the heat dissipation module. S5. The optimization model predicts the temperature values ​​of the CPU and GPU within a preset time period based on the current state data and historical time series of the CPU and GPU, and adjusts the working state of the heat dissipation module in advance according to the predicted structure.

2. The method for optimizing computer heat dissipation performance according to claim 1, characterized in that, The S5 predicts the temperature values ​​of the CPU and GPU within the next 2 to 5 seconds.

3. A heat dissipation module, characterized in that, Used for cooling the CPU and GPU in the computer heat dissipation performance optimization method as described in any one of claims 1-2; Includes: bottom cover; Two heat-conducting components are installed at intervals on the bottom cover. Each heat-conducting component includes a fan, a heat-conducting pipe, a heat exchange structure, a micro pump, and a heat-conducting block. The interior of the heat-conducting pipe is divided into two heat-conducting cavities by a partition plate 1. The interior of the heat-conducting block is divided into two cavities by a partition plate 3. A gap is left between the partition plate 3 and the inner wall of the heat-conducting block, and one end of each of the two heat-conducting cavities is respectively connected to the two cavities. The heat exchange structure includes multiple heat exchange blocks and multiple conduits. The interior of each heat exchange block is divided into a flow guide cavity 1 and a flow guide cavity 2 by a partition 2. The flow guide cavity 1 and the flow guide cavity 2 of adjacent heat exchange blocks are connected by corresponding conduits. The other ends of the two heat guide cavities are respectively connected to the flow guide cavity 1 and the flow guide cavity 2 of the heat guide block located on the outermost side. The input and output ends of the micro pump are respectively connected to the flow guide cavity one and flow guide cavity two of the other heat-conducting block located on the outermost side; A fan, the fan's outlet being horizontally oriented towards the heat exchange structure, and the fan's inlet being aligned with the air inlet hole on the bottom cover.

4. A heat dissipation module according to claim 3, characterized in that, The conduits between adjacent heat exchange blocks are arranged in an alternating pattern of varying heights.

5. A heat dissipation module according to claim 4, characterized in that, The heat dissipation module also includes a filter screen, which is disposed at the bottom of the bottom cover and aligned with the air inlet.

6. A heat dissipation module according to claim 5, characterized in that, The heat dissipation module also includes an electric push cylinder and a sealing component. The electric push cylinder is mounted on the mounting plate of the bottom cover. The output end of the electric push cylinder is connected to the housings of the two fans respectively through a connecting plate. The fans are slidably mounted on the bottom cover. A cleaning port is provided at the bottom of the fan outlet. The sealing component is used to block the cleaning port or the fan outlet.

7. A heat dissipation module according to claim 6, characterized in that, Two sets of sliding rods are installed on the mounting plate, and the fan is fitted onto the corresponding set of sliding rods via a connecting sleeve.

8. A heat dissipation module according to claim 7, characterized in that, The sealing component includes a sealing plate, a rotating shaft, and a gear. The sealing plate is rotatably mounted inside the air outlet of the fan via the rotating shaft. The gear is mounted on the rotating shaft and located outside the fan. A toothed plate is suspended above the gear, and the toothed plate meshes with the gear. In the initial state, the sealing plate blocks the cleaning port. After the gear and the toothed plate are fully engaged, the sealing plate rotates ninety degrees to block the air outlet of the fan.

9. A heat dissipation module according to claim 6, characterized in that, The heat dissipation module also includes a cleaning component, which includes a sealing plate, a connecting arm, and a cleaning head. The bottom cover has a strip-shaped hole, and the sealing plate covers the strip-shaped hole. The top end of the sealing plate is connected to the output end of the electric push cylinder through a connecting frame. One end of the connecting arm passes through the strip-shaped hole and is connected to the sealing plate. The cleaning head is installed at the other end of the connecting arm and contacts one end of the filter screen.

10. A tilting computer, characterized in that, It includes a main unit, a display unit, and a heat dissipation module as described in any one of claims 3-9, wherein the display unit is connected to the main unit and electrically connected to the main unit, and a side-flip screen is connected to the display unit and electrically connected to the main unit. The bottom of the host unit is provided with a mounting cavity, and the heat dissipation module is installed in the mounting cavity. The mounting cavity is connected to an air outlet. The two heat pipes in the heat dissipation module pass through the bottom of the host unit and extend into the interior of the host unit, so that the two heat conduction blocks are respectively attached to the CPU and GPU inside the host unit. The air outlet is aligned with the heat exchange structure.

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