A device control method, an electronic device, and a storage medium

Abstract

The application provides a device control method, an electronic device and a storage medium. The electronic device includes a main chip and a sub-chip. During the sub-chip controls the display screen to display content, the main chip can enter a first wake-up state, and the main chip is set not to execute a first standby process. When the main chip needs to control the display screen to display content, the main chip can no longer execute a wake-up process corresponding to the first standby process, so that the time for waking up the main chip is saved, and the speed of the main chip for controlling the display screen to display content is accelerated.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a device control method, electronic device, and storage medium. Background Technology

[0002] With the development of terminal technology, electronic devices such as mobile phones, tablets, and wearable devices are becoming increasingly complex in function, while their battery life is decreasing. To improve battery life, multiple chips can be pre-installed in electronic devices, such as main chips and sub-chips. The main chip has higher power consumption than the sub-chip, and the main and sub-chips can work in a time-sharing manner to save power. For example, when a sub-chip is processing data, the electronic device 100 can control the main chip to enter standby mode. After the main chip is in standby mode, if it needs to process data, the electronic device 100 can control the main chip to exit standby mode and wake it up. However, waking up the main chip is a time-consuming operation, and how to reduce the switching latency between the main chip and the sub-chip requires further research. Summary of the Invention

[0003] This application provides a device control method, an electronic device, and a storage medium. The electronic device includes a main chip and a sub-chip. While the sub-chip is controlling the display screen to display content, the main chip can enter a first wake-up state. When the main chip needs to control the display screen and display content, the time required to wake up the main chip can be saved, and the speed at which the main chip controls the display screen to display content can be accelerated.

[0004] In a first aspect, this application provides a device control method. The method is applied to an electronic device, which includes a main chip and a sub-chip. The method includes: when the sub-chip controls a display screen to display first content, the sub-chip sends a first instruction to the main chip, the first instruction instructing the main chip to be set to a first wake-up state, wherein when the sub-chip controls the display screen to display the first content, the main chip is in a first standby state or a second wake-up state; in response to the first instruction, after the main chip is in the first wake-up state, the main chip does not execute a first standby procedure; the main chip receives a second instruction sent by the sub-chip, the second instruction instructing the main chip to control the display screen to display content; in response to the second instruction, the main chip controls the display screen to display the second content, and executes a first standby procedure when a first standby event is detected.

[0005] The first wake-up state may be the same as or different from the second wake-up state.

[0006] Using this method, the main chip can enter the first wake-up state in advance. When the main chip needs to control the display screen and display content, it can skip the wake-up process corresponding to the first standby process, saving the time to wake up the main chip, reducing the latency of switching from the sub-chip to the main chip, and speeding up the speed at which the main chip controls the display screen to display the second content.

[0007] In conjunction with the first aspect, in one possible implementation, the second wake-up state is the same as the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: in response to the first instruction, the main chip confirms whether the main chip is in the first wake-up state; if the main chip is in the first wake-up state, the main chip is set not to execute the first standby process; if the main chip is in the first standby state, the main chip executes the first wake-up process, so that the main chip is in the first wake-up state, and after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

[0008] In one possible implementation, the first wake-up state or the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state; the first standby process includes: freezing the process, suspending the device, powering down the CPU or the CPU entering a low-power operating state; the first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and thawing the process.

[0009] In this way, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction sent by the sub-chip, the main chip does not need to execute the first wake-up process again, saving the time of waking up the main chip. For example, it saves the main chip from executing the steps of the CPU entering a non-low-power operating state, the device restoring operation, and the unfreezing process, thus speeding up the speed at which the main chip controls the display to show the second content.

[0010] For example, you can refer to Figure 2I Description in the embodiments.

[0011] In conjunction with the first aspect, in one possible implementation, the second wake-up state is different from the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: in response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state; if the main chip is in the second wake-up state, the main chip executes the second standby process, causing the main chip to be in the first wake-up state; after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process; if the main chip is in the first standby state, the main chip executes the first wake-up process, causing the main chip to be in the first wake-up state; after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

[0012] In one possible implementation, the first standby process includes: the device suspending operation, the CPU being powered off, or the CPU entering a low-power operating state; the second standby process includes: a freeze process; and the first wake-up process includes: the CPU entering a non-low-power operating state and the device resuming operation.

[0013] In one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a frozen state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0014] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a second wake-up process, which includes: unfreezing the processes frozen in the second standby process.

[0015] Thus, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the steps of the CPU entering a non-low-power operating state and the device resuming operation, thus speeding up the process of the main chip controlling the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the processes are in a frozen state, and the CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0016] For example, you can refer to Figure 6 Description in the embodiments.

[0017] In one possible implementation, the first standby process includes: a freezing process and device pausing operation; the first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, a thawing process, the CPU being powered down again, or the CPU re-entering a low-power operating state; the second standby process includes: the CPU being powered down or the CPU entering a low-power operating state.

[0018] In conjunction with the first aspect, in one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0019] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes:

[0020] The main chip executes a second wake-up process, which includes the CPU entering a non-low-power operating state.

[0021] Thus, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the device recovery and unfreezing process steps, speeding up the process of the main chip controlling the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operating state or the CPU is powered down, and the CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0022] For example, you can refer to Figure 7 Description in the embodiments.

[0023] In conjunction with the first aspect, in one possible implementation, the first standby process includes: the device suspends operation; the first wake-up process includes: the CPU enters a non-low-power operating state, the device resumes operation, the CPU is powered down again, or the CPU re-enters a low-power operating state; the second standby process includes: a freeze process, the CPU is powered down, or the CPU enters a low-power operating state.

[0024] In one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operating state, the device is in a resumed operating state, and the process is in a frozen state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0025] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a second wake-up process, which includes: the CPU entering a non-low-power operating state and unfreezing the processes frozen in the second standby process.

[0026] Thus, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state. In the S810, after receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the device recovery steps, speeding up the process of the main chip controlling the display to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operating state or the CPU is powered down, and the processes are also in a frozen state. The CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0027] For example, you can refer to Figure 8 Description in the embodiments.

[0028] In conjunction with the first aspect, in one possible implementation, the main chip does not execute the first standby process, specifically including: the main chip requests a wake-up lock and does not execute the first standby process.

[0029] This is not limited to requesting a wake-up lock to prevent the main chip from executing the first standby process. Other methods can also be used to prevent the main chip from executing the first standby process, and this application does not limit this method.

[0030] In conjunction with the first aspect, in one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip releasing the wake-up lock.

[0031] In this way, while the main chip is controlling the display screen to show the second content, the main chip can execute the first standby process. If no user operation is received within a certain period of time, the main chip can execute the first standby process and remain in the first standby state to save power consumption of the electronic device.

[0032] In conjunction with the first aspect, in one possible implementation, before the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a screen-on configuration process.

[0033] In this way, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state, and has already drawn the image to be displayed and configured the hardware and software parameters. After receiving the second instruction from the sub-chip, the main chip does not need to execute the screen-on configuration process again, saving the time of waking up the main chip and executing the screen-on configuration process, and speeding up the speed at which the main chip controls the display to show the second content.

[0034] For example, you can refer to Figure 3 or Figure 9 Description in the embodiments.

[0035] In conjunction with the first aspect, in one possible implementation, after the main chip executes the screen-on configuration process, the method also includes: the main chip requests a screen-on lock and does not execute the screen-off configuration process.

[0036] This is not limited to requesting a wake-up lock to prevent the main chip from executing the screen-off configuration process. Other methods can also be used to prevent the main chip from executing the screen-off configuration process, and this application does not limit this to such methods.

[0037] In conjunction with the first aspect, in one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip releasing the screen lock.

[0038] In this way, while the main chip is controlling the display screen to show the second content, the main chip can execute the first standby process. If no user operation is received within a certain period of time, the main chip can execute the screen-off configuration process, and the display screen can be turned off to save power consumption of the electronic device.

[0039] In conjunction with the first aspect, in one possible implementation, the screen-on configuration process includes: drawing an image, sending the image to display, powering on the LCD, and setting the display brightness.

[0040] For example, the main chip can be an application processor, and the sub-chip can be a microcontroller unit.

[0041] Secondly, this application provides an electronic device, including a memory, a main chip, and a sub-chip; wherein the main chip, the sub-chip, and the memory are coupled, and the memory is used to store a computer program. When the main chip or the sub-chip executes the computer program, the electronic device performs a device control method provided in any possible implementation of the first aspect.

[0042] Thirdly, this application provides a computer-readable storage medium including instructions that, when executed on an electronic device, cause the electronic device to perform a device control method provided in any possible implementation of the first aspect above.

[0043] Fourthly, this application provides a chip system, which includes a main chip and a sub-chip. The main chip or the sub-chip is used to invoke computer instructions to cause an electronic device to execute a device control method provided in any possible implementation of any of the above aspects.

[0044] Fifthly, this application provides a computer program product containing instructions that, when the computer program product is run on an electronic device, causes the electronic device to execute a device control method provided in any possible implementation of any of the above aspects.

[0045] For a description of the beneficial effects in aspects two through five, please refer to the description of the beneficial effects in aspect one; this application will not repeat them here. Attached Figure Description

[0046] Figure 1 A schematic diagram of the hardware structure of an electronic device 100 is shown;

[0047] Figures 2A-2H This illustration shows a set of diagrams provided in this application, in which the sub-chip switches to the main chip, and the main chip controls the display screen to show the content.

[0048] Figure 2I This paper illustrates a flowchart of a method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0049] Figure 3 This paper illustrates a flowchart of a second method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0050] Figure 4 This application provides a schematic flowchart of a method for a main chip to perform a first service while a sub-chip controls a display screen to display first content.

[0051] Figures 5A-5B A set of schematic diagrams is shown where the display screen turns off after the sub-chip controls the display screen to display the first content;

[0052] Figure 5C A flowchart of a method for the main chip to perform a first service after the display screen is turned off while the sub-chip is controlling the display screen is shown.

[0053] Figure 6 This paper illustrates a flowchart of a third method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0054] Figure 7This paper illustrates a flowchart of a fourth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0055] Figure 8 This paper illustrates a flowchart of a fifth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0056] Figure 9 This paper illustrates a flowchart of a sixth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0057] Figure 10 This application provides another method flowchart for the main chip to perform a first service while the sub-chip controls the display screen to display first content;

[0058] Figure 11 A flowchart of another method is shown whereby the main chip executes the first business function after the display screen is turned off while the sub-chip is controlling the display screen.

[0059] Figure 12 This is a schematic diagram of a device control method provided in this application. Detailed Implementation

[0060] The technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; the word "and / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more than two.

[0061] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0062] The term "user interface (UI)" used in the following embodiments of this application refers to the medium interface through which an application or operating system interacts and exchanges information with a user. It realizes the conversion between the internal form of information and the form that the user can accept. The most common form of user interface is the graphical user interface (GUI), which refers to a user interface related to computer operation displayed in a graphical manner. It can be visual interface elements such as text, icons, buttons, menus, tabs, text boxes, dialog boxes, status bars, navigation bars, and widgets displayed on the screen of a wearable device.

[0063] To facilitate understanding of this application, the technical terms used in the application will be explained first.

[0064] 1. Main chip and sub-chip.

[0065] The main chip and the sub-chip can be connected to communicate with each other. In some embodiments, the main chip and the sub-chip can be located in a single integrated circuit. In other embodiments, the main chip and the sub-chip can be separate and located in different integrated circuits.

[0066] The main chip and the sub-chip can handle different tasks, and they can operate in a time-sharing manner to save power consumption in the electronic device. When the sub-chip is handling a task, the electronic device 100 can control the main chip to enter a standby state. When the main chip is handling a task, the electronic device 100 can control the sub-chip to enter a standby state.

[0067] For example, the main chip can be an application processor (AP), and the sub-chip can be a micro controller unit (MCU).

[0068] The main chip may include a central processing unit (CPU) and components, including but not limited to a graphics processing unit (GPU) and internal memory. Sub-chips may include, but are not limited to, a sensor hub, a GPU, and internal memory.

[0069] For example, internal memory may include static random access memory (SRAM), etc.

[0070] In some embodiments, the main chip and the sub-chip can be packaged on the same chip (or a single chip), which may include a main processing unit and a sub-processing unit. The main chip may be referred to as the main processing unit, and the sub-chip may be referred to as the sub-processing unit. In some embodiments, the main chip and the sub-chip may also be two separate chips, each corresponding to a single chip.

[0071] Electronic devices may also include modems, embedded neural network processors (NPUs), digital signal processors (DSPs), short-range communication modules (such as Wi-Fi communication modules, Bluetooth communication modules, NFC communication modules, etc.), charging management modules, power management modules, batteries, displays, audio modules, cameras, motors, sensors, etc.

[0072] Optionally, the modem, NPU, DSP, and short-range communication module can be integrated into the main chip and / or sub-chip. Components such as the charging management module, power management module, battery, display screen, audio module, camera, motor, and sensors can be located outside the main chip and sub-chip. For example, the battery and main chip can be located on the same circuit board. These components can be connected to the main chip and / or sub-chip, allowing the main chip and / or sub-chip to control them.

[0073] The CPU can serve as the nerve center and command center of an electronic device. Based on the instruction opcode and timing signals, the CPU generates operation control signals to control instruction fetching and execution. The CPU can control the coordinated operation of various functional modules within a chip and can also be used to run application programs.

[0074] A GPU is a microprocessor for image processing, used to perform mathematical and geometric calculations for graphics rendering. A processor may include one or more GPUs, which execute program instructions to generate or modify display information. GPUs are used for rendering images in games, videos, and other applications.

[0075] By drawing inspiration from the structure of biological neural networks, such as the transmission patterns between neurons in the human brain, the NPU can rapidly process input information and continuously learn on its own. Through the NPU, applications such as intelligent cognition in wearable devices can be realized.

[0076] DSPs can convert analog signals into digital signals for processing, and then convert them back into analog signals for output, making them suitable for various applications such as audio, video, and communication.

[0077] In some embodiments, the main chip may further include one or more interfaces, which may include, but are not limited to, any one or more of the following: an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI) interface, a general-purpose input / output (GPIO) interface, a universal serial bus (USB) interface, etc. The GPIO interface can be configured via software. The GPIO interface can be configured as a control signal or as a data signal. In some embodiments, the GPIO interface may also be configured as an I2C interface, an I2S interface, a UART interface, a MIPI interface, etc.

[0078] Generally speaking, the main chip has a stronger data processing capability than the sub-chip, and the main chip's data processing speed is faster than the sub-chip's data processing speed. However, the main chip also consumes more power than the sub-chip.

[0079] 2. Standby process, wake-up process, and screen-on process.

[0080] When the main chip is not processing any business, it can execute a standby process to enter standby mode, thus saving power consumption of electronic devices.

[0081] The standby process may include, but is not limited to, any one or more of the following steps: freezing process, device suspension, CPU entering a low-power operating state, or CPU power-off.

[0082] In this context, "freezing a process" refers to suspending a running process in an electronic device, placing it in a paused state, and saving the process's runtime data. This saved data allows the process to resume execution from its current state after being unfrozen, without interruption. Conversely, placing a process in a paused state means that the process has stopped running and is no longer subject to CPU scheduling.

[0083] Device suspension refers to suspending the device, placing it in a paused state, and saving its operational data. This operational data allows the device to resume operation from its current state without interruption. The device may include, but is not limited to, any one or more of the following: GPU, internal memory, etc. In some embodiments, the device may also include a modem, NPU, DSP short-range communication module (e.g., Wi-Fi communication module, Bluetooth communication module, NFC communication module, etc.).

[0084] The CPU entering a low-power operating state can refer to a state where the CPU is idle even though its power supply is not disconnected. When the CPU enters a low-power operating state, it does not schedule processes on electronic devices.

[0085] CPU power-off can refer to the disconnection of the CPU's power supply. After the CPU is powered off, it will not schedule processes on electronic devices.

[0086] If the main chip includes multiple CPUs, these CPUs can include a main CPU and non-main CPUs. The main CPU can be powered down, and the non-main CPUs can enter a low-power operating state. A non-main CPU can wake up the main CPU and power it back on, allowing it to enter a non-low-power operating state. If the main chip includes only one CPU, this single CPU cannot be powered down. This single CPU can enter a low-power operating state and can respond to interrupts, re-entering a non-low-power operating state. Optionally, the main CPU can include one or more CPUs.

[0087] After the main chip executes the standby process and enters the standby state, if there is a service that the main chip needs to process, the main chip needs to execute the wake-up process, or execute the wake-up process and screen-on configuration process, to exit the standby state and enter the non-standby state, so that the main chip can process the service normally.

[0088] The wake-up process may include, but is not limited to, any one or more of the following steps: the CPU enters a non-low-power operating state, the device resumes operation, and the process is unfrozen.

[0089] Entering a non-low-power operating state can be the reverse of entering a low-power operating state. Entering a non-low-power operating state can mean either the CPU is powered on and enters a non-low-power state, or it can mean the CPU has been powered on, exited an idle state, and entered a non-low-power operating state. After entering a non-low-power operating state, the CPU can schedule processes on the electronic device to perform corresponding operations.

[0090] Resuming device operation can be the reverse of pausing device operation. It means the device exits the paused state and re-enters normal operation. The device can continue operating from its current state based on saved operational data.

[0091] Unfreezing a process can be the reverse of freezing a process. Unfreezing a process means removing it from a suspended state, allowing it to resume normal operation. The process can then continue running based on saved process data and can receive and respond to CPU scheduling.

[0092] The screen-on configuration process refers to the pre-drawing of the image to be displayed and the configuration of the hardware and software parameters for screen activation in an electronic device. After switching to the main chip or sub-chip, the main chip or sub-chip can take over the display screen and control the display screen to display the image based on the drawn image.

[0093] The screen-on configuration process may include, but is not limited to, the following steps: drawing an image, sending the image to the display, powering on the liquid crystal display (LCD), and setting the display brightness.

[0094] Electronic devices can have multiple pre-installed chips, such as a main chip and sub-chips. The main chip has higher power consumption than the sub-chips. The main chip and sub-chips can work in a time-sharing manner to save power. For example, the main chip and sub-chips can handle different tasks. When a sub-chip is handling a task, the electronic device 100 can control the main chip to enter standby mode. When the main chip is handling a task, the electronic device 100 can control the sub-chip to enter standby mode.

[0095] In some embodiments, after the main chip is in standby mode, if the main chip needs to process business, the electronic device 100 can control the main chip to exit standby mode to wake it up. However, waking up the main chip is a time-consuming operation. As explained above, waking up the main chip requires executing a wake-up process, or a wake-up process combined with a screen-on process. Both the wake-up and screen-on processes are time-consuming operations. Only after completing both processes can the electronic device switch to the main chip. In other words, the electronic device needs to wait for a period of time before it can switch from a sub-chip to a main chip, which can cause lag.

[0096] Based on this, this application provides a device control method. The electronic device 100 includes a main chip and a sub-chip. The method includes: when it is confirmed that the sub-chip controls the display screen to display first content, the sub-chip can send a first instruction to the main chip. When the sub-chip controls the display screen to display the first content, the main chip can be in a first standby state or a second wake-up state. In response to the first instruction, the main chip can enter the first wake-up state, and after entering the first wake-up state, it does not execute the first standby process. The main chip receives a second instruction sent by the sub-chip, the second instruction being used to instruct the main chip to control the display screen to display content. In response to the second instruction, the main chip controls the display screen to display the second content, and when a first standby event is detected, it executes the first standby process.

[0097] In this way, the main chip can enter the first wake-up state in advance. When the main chip needs to control the display screen and display content, it does not need to execute the wake-up process corresponding to the first standby process, which can save the time of waking up the main chip and reduce the latency of switching from the sub-chip to the main chip.

[0098] Optionally, after receiving the first instruction from the sub-chip, the main chip can execute the screen-on configuration process. This allows the main chip to execute the screen-on configuration process in advance. After receiving the second instruction from the sub-chip, the main chip also does not need to execute the screen-on configuration process again, saving time.

[0099] Optionally, when it is confirmed that the display screen is controlled by the sub-chip to display the first content, the main chip can also disable interrupts, turn off the clock, etc., to save power consumption of electronic device 100.

[0100] For an explanation of the first wake-up state, first standby state, first wake-up state, and first standby process, please refer to [link / reference]. Figure 2I or Figure 3 or Figure 6 or Figure 7 or Figure 8 The descriptions in the embodiments are not repeated here.

[0101] Figure 1 A schematic diagram of the hardware structure of an electronic device 100 is shown.

[0102] Electronic device 100 may include a chip 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, antenna 1 (not shown), antenna 2 (not shown), a mobile communication module 150, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a sensor module 180, a display screen 194, a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include one or more sensors, such as a gyroscope sensor 180A, a magnetic sensor 180B, an accelerometer sensor 180C, a proximity sensor 180D, a touch sensor 180E, etc. In some embodiments, the sensor module 180 may also include one or more of the following sensors: a pressure sensor, a barometric pressure sensor, a proximity sensor, a fingerprint sensor, a temperature sensor, an ambient light sensor, a bone conduction sensor, etc.

[0103] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0104] The chip 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the chip 110 is a cache memory. This memory can store instructions or data that the chip 110 has just used or that are used repeatedly. If the chip 110 needs to use the instruction or data again, it can directly retrieve it from the memory. This avoids repeated accesses, reduces the waiting time of the chip 110, and thus improves the efficiency of the system. In some embodiments, the chip 110 may include one or more interfaces, such as a universal serial bus (USB) interface.

[0105] USB port 130 is a USB standard compliant interface, specifically a Mini USB port, Micro USB port, or USB Type-C port. USB port 130 can be used to connect a charger to charge electronic device 100, and can also be used for data transfer between electronic device 100 and peripheral devices. It can also be used to connect headphones for audio playback. This interface can also be used to connect other electronic devices, such as AR devices.

[0106] The charging management module 140 receives charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via the USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the electronic device 100. While charging the battery 142, the charging management module 140 can also supply power to the electronic device via the power management module 141.

[0107] The power management module 141 connects the battery 142, the charging management module 140, and the chip 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, supplying power to the chip 110, internal memory 121, display screen 194, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). In some other embodiments, the power management module 141 may also be housed within the chip 110. In other embodiments, the power management module 141 and the charging management module 140 may be housed in the same device.

[0108] The communication function of electronic device 100 can be realized through communication module 150, modem processor and baseband processor, etc.

[0109] In some embodiments, the communication module 150 may include a mobile communication module that can provide wireless communication solutions, including 2G / 3G / 4G / 5G, for use on the electronic device 100. The mobile communication module may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module may be comprised of an antenna 1 ( Figure 1 The mobile communication module (not shown) receives electromagnetic waves and processes them by filtering, amplifying, etc., before transmitting them to a modem processor for demodulation. The mobile communication module can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module can be housed in chip 110. In some embodiments, some functional modules of the mobile communication module and some modules of chip 110 can be housed in the same device.

[0110] In some embodiments, the communication module 150 may include a wireless communication module that can provide solutions for wireless communication applied to the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), and other wireless communication technologies. The wireless communication module may be one or more devices integrating at least one communication processing module. The wireless communication module communicates via antenna 2 ( Figure 1 (Not shown) Receives electromagnetic waves, demodulates and filters the electromagnetic wave signal, and sends the processed signal to chip 110. The wireless communication module can also receive the signal to be transmitted from chip 110, frequency modulate it, amplify it, and convert it into electromagnetic waves for radiation via antenna 2.

[0111] In some embodiments, antenna 1 of electronic device 100 is coupled to a mobile communication module, and antenna 2 is coupled to a wireless communication module, enabling electronic device 100 to communicate with networks and other devices via wireless communication technology. The wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies. The GNSS may include Global Positioning System (GPS), Global Navigation Satellite System (GLONASS), BeiDou Navigation Satellite System (BDS), Quasi-Zenith Satellite System (QZSS), and / or Satellite Based Augmentation Systems (SBAS).

[0112] Electronic device 100 implements display functions through a GPU, a display screen 194, and an application processor. The GPU is a microprocessor for image processing, connecting the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. The main chip may include one or more GPUs, which execute program instructions to generate or modify display information.

[0113] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a miniature LED, a microLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, electronic device 100 may include one or N displays 194, where N is a positive integer greater than 1.

[0114] Internal memory 121 may include one or more random access memory (RAM) and one or more non-volatile memory (NVM).

[0115] The random access memory can be directly read and written by chip 110. It can be used to store executable programs (such as machine instructions) of operating systems or other running programs, as well as user and application data.

[0116] Non-volatile memory can also store executable programs and user and application data, which can be pre-loaded into random access memory for direct reading and writing by chip 110.

[0117] The external memory interface 120 can be used to connect to external non-volatile memory, thereby expanding the storage capacity of the electronic device 100. The external non-volatile memory communicates with the chip 110 through the external memory interface 120 to realize data storage functions. For example, music, video, and other files can be saved in the external non-volatile memory.

[0118] Electronic device 100 can implement audio functions, such as making calls and recording, through audio module 170, speaker 170A, receiver 170B, microphone 170C, and application processor.

[0119] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the chip 110, or some functional modules of the audio module 170 may be located in the chip 110.

[0120] The speaker 170A, also known as a "loudspeaker," is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music or make hands-free calls through the speaker 170A.

[0121] The receiver 170B, also known as the "earpiece," is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a telephone call or voice message, the receiver 170B can be brought close to the ear to listen to the voice.

[0122] Microphone 170C, also known as a "microphone" or "voice transducer," is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can speak by bringing their mouth close to microphone 170C, inputting the sound signal into microphone 170C. Electronic device 100 may have at least one microphone 170C. In some embodiments, electronic device 100 may have two microphones 170C, which, in addition to collecting sound signals, can also perform noise reduction. In other embodiments, electronic device 100 may also have three, four, or more microphones 170C, which can collect sound signals, reduce noise, identify the sound source, and perform directional recording, etc.

[0123] The gyroscope sensor 180A can be used to determine the motion attitude of the electronic device 100. In some embodiments, the gyroscope sensor 180A can determine the angular velocity of the electronic device 100 about three axes (i.e., the x, y, and z axes). The gyroscope sensor 180A can be used for image stabilization. For example, when the shutter is pressed, the gyroscope sensor 180A detects the angle of the shake of the electronic device 100, calculates the distance that the lens module needs to compensate based on the angle, and allows the lens to counteract the shake of the electronic device 100 by moving in the opposite direction, thus achieving image stabilization. The gyroscope sensor 180A can also be used in navigation and motion-sensing game scenarios.

[0124] The magnetic sensor 180B includes a Hall sensor. The electronic device 100 can use the magnetic sensor 180B to detect the opening and closing of the flip cover.

[0125] The accelerometer 180C can detect the magnitude of acceleration of electronic device 100 in various directions (typically three axes). When electronic device 100 is stationary, it can detect the magnitude and direction of gravity. It can also be used to identify the posture of electronic device, and can be applied to applications such as screen orientation switching and pedometers.

[0126] A distance sensor 180D is used to measure distance. The electronic device 100 can measure distance using infrared or laser. In some embodiments, during a shooting scene, the electronic device 100 can utilize the distance sensor 180D to measure distance for rapid focusing.

[0127] Touch sensor 180E, also known as a "touch device," can be located on display screen 194. The touch sensor 180E and display screen 194 together form a touchscreen, also known as a "touchscreen." Touch sensor 180E detects touch operations applied to or near it. The touch sensor can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180E may also be located on the surface of electronic device 100, in a different position than display screen 194.

[0128] In some embodiments, the electronic device 100 may further include one or more of buttons, a motor, and an indicator. Buttons may include a power button, volume buttons, etc. Buttons may be mechanical buttons or touch buttons. The electronic device 100 can receive button input and generate key signal inputs related to user settings and function control of the electronic device 100. The motor may generate vibration cues. The indicator may be an indicator light, which can be used to indicate charging status, battery level changes, and can also be used to indicate messages, missed calls, notifications, etc.

[0129] The SIM card interface 195 is used to connect the SIM card.

[0130] In some embodiments, the electronic device 100 may also not include the SIM card interface 195.

[0131] In some embodiments, chip 110 may include a main chip and a sub-chip.

[0132] For example, the main chip can be an application processor, and the sub-chip can be a microcontroller unit.

[0133] The main chip may include a CPU and devices, which may include, but are not limited to, a GPU and internal memory.

[0134] Sub-chips may include, but are not limited to, Sensor Hub, GPU, and internal memory.

[0135] For example, internal memory may include SRAM, etc.

[0136] In some embodiments, the main chip and the sub-chip can be packaged on the same chip (or a single chip), which may include a main processing unit and a sub-processing unit. The main chip may be referred to as the main processing unit, and the sub-chip may be referred to as the sub-processing unit. In some embodiments, the main chip and the sub-chip may also be two separate chips, each corresponding to a single chip.

[0137] Electronic device 100 may also include a modem, NPU, DSP, short-range communication module (e.g., Wi-Fi communication module, Bluetooth communication module, NFC communication module, etc.), charging management module 140, power management module 141, battery 142, display screen 194, audio module 170, camera, motor, sensor, etc.

[0138] Optionally, the Modem, NPU, DSP, and short-range communication module can be integrated into the main chip and / or sub-chip.

[0139] The charging management module 140, power management module 141, battery 142, display screen 194, audio module 170, camera, motor, sensor, and other devices can be located outside the main chip and sub-chip. The charging management module 140, power management module 141, battery 142, display screen 194, audio module 170, camera, motor, sensor, and other devices can be connected to the main chip and / or sub-chip, and the main chip and / or sub-chip can control the charging management module 140, power management module 141, battery 142, display screen 194, audio module 170, camera, motor, sensor, and other devices.

[0140] The existing wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and the unfreezing process. Among these, the device resuming operation step in the wake-up process is time-consuming, resulting in a longer time to wake up the main chip.

[0141] This application provides two schemes for waking up the main chip. The first scheme involves the electronic device 100 not modifying the existing wake-up process. After the main chip receives the first instruction from the sub-chip, i.e., when the sub-chip is currently controlling the display content, the main chip can execute all steps of the existing standby process, causing the main chip to enter the first wake-up state. When switching to the main chip, the main chip does not need to execute the wake-up process again and can directly control the display content, thereby reducing the latency of the main chip controlling the display content.

[0142] The second approach involves the electronic device 100 improving the existing wake-up process. After the main chip receives the first instruction from the sub-chip (i.e., when the sub-chip is currently controlling the display screen), the main chip can execute some steps of the existing standby process. For example, the main chip can at least execute the device recovery step in the existing wake-up process, allowing it to enter the first wake-up state. When switching to the main chip, the devices in the main chip may at least not execute the device recovery step, thus reducing the latency of the main chip controlling the display screen.

[0143] Optionally, in the second scheme, in addition to executing the device recovery operation step in the existing wake-up process, the main chip can also execute the CPU entering a non-low-power operating state or unfreezing process step in the existing wake-up process.

[0144] The two solutions will now be explained in detail.

[0145] First, we will introduce the specific implementation of the first solution.

[0146] Option 1

[0147] Figures 2A-2H This illustration shows a set of diagrams provided in this application, in which the sub-chip switches to the main chip, and the main chip controls the display screen to show the content.

[0148] Figures 2A-2D An example is shown where electronic device 100 is a mobile phone.

[0149] For example, such as Figure 2A As shown, the electronic device 100 displays an audio playback interface. Figure 2A The audio playback interface shown can be an interface displayed on the screen controlled by the main chip.

[0150] If the first condition is met, the electronic device 100 can enter the screen-off display state and display the screen-off display interface.

[0151] like Figure 2B As shown, after the electronic device 100 can enter the screen-off display state, the electronic device 100 can continue to play audio and display... Figure 2B The always-on display shown here displays information such as the time and the audio being played by the electronic device 100.

[0152] Optionally, after the electronic device 100 enters the screen-off display state, the main chip of the electronic device 100 can enter the first standby state to save power. The electronic device 100 can continue playing audio through the sub-chip and display through the sub-chip. Figure 2B The always-on display interface shown.

[0153] Optionally, the first condition may include, but is not limited to, any of the following: within a first period of time, the electronic device 100 does not receive user operation, or the user presses the power button, etc.

[0154] In some embodiments, after the electronic device 100 can enter the screen-off display state, the electronic device 100 can receive and respond to the user's unlocking operation, causing the electronic device 100 to exit the screen-off display state.

[0155] For example, such as Figure 2C As shown, the electronic device 100 displays an always-on display interface. The electronic device 100 can receive and respond to the user's unlock operation, waking up the main chip and causing it to exit the first standby state and enter the first wake-up state. The electronic device 100 exits the always-on display state and continues displaying... Figure 2D The audio playback interface shown. Figure 2D The audio playback interface shown can be an interface displayed on the screen controlled by the main chip.

[0156] Figures 2E-2H An example is shown where electronic device 100 is a wearable device.

[0157] For example, such as Figure 2E As shown, the electronic device 100 displays a dial interface. Figure 2E The dial interface shown can be an interface displayed on the screen controlled by the main chip.

[0158] If the second condition is met, the electronic device 100 can measure the user's physiological parameters and display the physiological parameter measurement interface.

[0159] For example, a user's physiological parameter could refer to their blood pressure.

[0160] Optionally, the second condition may include, but is not limited to, any of the following: arrival at the scheduled time, user action, etc.

[0161] like Figure 2F As shown, when the electronic device 100 measures a user's blood pressure, the main chip of the electronic device 100 can enter a first standby state to save power. The electronic device 100 can collect sensor data through a sub-chip and display it through the sub-chip. Figure 2F The blood pressure measurement interface shown.

[0162] In some embodiments, after the electronic device 100 displays the blood pressure measurement interface, the electronic device 100 can receive and respond to the user's operation, causing the electronic device 100 to stop displaying the blood pressure measurement interface.

[0163] For example, such as Figure 2GAs shown, the electronic device 100 displays a blood pressure measurement interface. The electronic device 100 can receive and respond to user swiping operations on the blood pressure measurement interface, such as a left swipe. In response to the user's swiping operation, the electronic device 100 can wake up the main chip, causing the main chip to exit the first standby state and enter the first wake-up state. The electronic device 100 stops displaying the blood pressure measurement interface and displays... Figure 2H The dial interface shown. Figure 2H The dial interface shown can be an interface displayed on the screen controlled by the main chip.

[0164] It should be noted that the above Figures 2A-2D , Figures 2E-2H This is merely an illustrative example illustrating two scenarios where the sub-chip switches to the main chip, and the main chip controls the content displayed on the screen. Other scenarios may also be included, but this application does not limit the scope of these scenarios.

[0165] Figure 2I This paper illustrates a flowchart of a first method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0166] Figure 2I The method shown may include, but is not limited to, the following steps:

[0167] S201, the sub-chip controls the display screen to show the first content.

[0168] When the sub-chip controls the display screen to display content, the main chip can switch to the sub-chip, and the sub-chip controls the display screen to display the first content.

[0169] For example, the first content could be Figure 2B The always-on display shown. The first content can also be... Figure 2F The blood pressure measurement interface shown.

[0170] When the display screen is controlled by the sub-chip to display the first content, the main chip can be in a first standby state or a second wake-up state.

[0171] The first standby state can refer to the CPU being in a low-power operating state, or the CPU being powered off, the device being in a suspended operating state, or the process being in a frozen state.

[0172] The second wake-up state can refer to the CPU being in a non-low-power operating state, the device being in a restored operating state, or the process being in a thawed state.

[0173] S202, The sub-chip sends a first instruction to the main chip, which is used to instruct the main chip to be set to the first wake-up state.

[0174] When the sub-chip controls the display screen to display the first content, the sub-chip can send a first instruction to the main chip. The first instruction is used to instruct the main chip to be set to the first wake-up state.

[0175] Optionally, when the main chip switches to the sub-chip and the sub-chip controls the display screen to show the first content, the sub-chip can send a first instruction to the main chip. The first instruction is used to instruct the main chip to be set to the first wake-up state.

[0176] Optionally, when the sub-chip controls the display screen and turns it off, if the sub-chip controls the display screen and turns it on again, the sub-chip can send a first instruction to the main chip. The first instruction is used to instruct the main chip to be set to the first wake-up state.

[0177] exist Figure 2I In this embodiment, the first wake-up state and the second wake-up state are the same. As can be seen from S201, the first standby state and the first wake-up state are two relative states. For example, when the main chip is in the first standby state, the main chip can execute the first wake-up process, causing the main chip to enter the first wake-up state. When the main chip is in the first wake-up state (or the second wake-up state), the main chip can execute the first standby process, causing the main chip to enter the first standby state.

[0178] For an explanation of the first wake-up process, please refer to the description in S204.

[0179] For an explanation of the first standby process, please refer to the description in S205.

[0180] S203. In response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state.

[0181] After receiving the first instruction from the sub-chip, the main chip needs to confirm whether it is in the second wake-up state.

[0182] When the main chip is in the first standby state, it is necessary to wake up the main chip, that is, to execute the first wake-up process and put the main chip in the first wake-up state, and execute S204.

[0183] When the main chip is in the second wake-up state, the first wake-up state and the second wake-up state are the same. The main chip is already in the first wake-up state, so there is no need to wake up the main chip. Execute S205-S210.

[0184] S204. The main chip executes the first wake-up process, which includes: the CPU entering a non-low-power operating state, the device resuming operation, and the unfreezing process.

[0185] After receiving the first instruction from the sub-chip, when the main chip is in the first standby state, the main chip needs to execute the first wake-up process to exit the first standby state and enter the first wake-up state.

[0186] The first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and the unfreezing process.

[0187] Optionally, the main chip needs to first execute the CPU entering a non-low-power operating state step in the first wake-up process, then execute the device recovery operation step, and finally execute the unfreezing process step.

[0188] Since the device recovery and unfreezing processes need to be executed when the CPU is in a non-low-power operating state, the main chip must prioritize executing the CPU entering a non-low-power operating state step in the first wake-up process.

[0189] Optionally, the main chip performs the defrosting process step at the end.

[0190] Optionally, the main chip executes the unfreezing process last. This is because the CPU has already entered a non-low-power operating state. If the main chip executes the unfreezing process before the device recovery process, the CPU can schedule the process while it's in a unfrozen state, increasing the power consumption of the electronic device 100. Therefore, the main chip can execute the unfreezing process last, saving power for the electronic device 100. Secondly, it avoids the possibility of runtime errors caused by the CPU scheduling a process in a unfrozen state before the device has recovered.

[0191] S205, the main chip does not execute the first standby process. The first standby process includes: freezing process, device pausing operation, CPU entering low power state or CPU power off.

[0192] After confirming that the main chip is in the first wake-up state, the main chip does not execute the first standby process, so that the main chip remains in the first wake-up state.

[0193] The first standby process includes: freezing process, device pausing operation, CPU entering a low-power state, or CPU power-off.

[0194] If the main chip includes multiple CPUs, these CPUs can include a main CPU and non-main CPUs. The main CPU can be powered down, and the non-main CPUs can enter a low-power operating state. A non-main CPU can wake up the main CPU and power it back on, allowing it to enter a non-low-power operating state. If the main chip includes only one CPU, this single CPU cannot be powered down. This single CPU can enter a low-power operating state and can respond to interrupts, re-entering a non-low-power operating state. Optionally, the main CPU can include one or more CPUs.

[0195] Optionally, during the first standby process, the process frozen by the main chip can be one or more preset processes, such as application processes and / or kernel processes.

[0196] Optionally, the main chip can request a first wake-up lock, preventing it from executing the first standby process. However, this application does not limit the method of requesting a first wake-up lock; other methods can also be used to prevent the main chip from executing the first standby process.

[0197] S206, First event detected, sub-chip stops displaying first content.

[0198] The first event can be an event triggered by the user or an event received from another device.

[0199] For example, the first event could be Figure 2C The user unlock event shown.

[0200] For example, the first event could also be Figure 2F The slide event shown is for the display screen of electronic device 100.

[0201] For example, the first event could also be a sub-chip receiving an incoming call from another device.

[0202] S207. The sub-chip sends a second instruction to the main chip, which instructs the main chip to control the content displayed on the screen.

[0203] In response to the first event, the sub-chip stops displaying the first content and sends a second instruction to the main chip, which instructs the main chip to control the display screen to display content.

[0204] S208, in response to the second instruction, the main chip can execute the first standby process.

[0205] In S205, the main chip does not execute the first standby process, keeping it in the first wake-up state. This prevents the main chip from entering the first standby state while the sub-chip is controlling the screen and displaying the first content.

[0206] In S208, after receiving the second instruction from the sub-chip, the sub-chip stops displaying the first content and begins to control the display screen to display content. Therefore, after receiving the second instruction from the sub-chip, the main chip can execute the first standby process and enter the first standby state to save power consumption of the electronic device 100.

[0207] Optionally, the main chip can cancel the first wake-up lock, allowing the main chip to execute the first standby process.

[0208] S209, The main chip executes the screen-on configuration process.

[0209] S210, the main chip controls the display screen to show the second content.

[0210] After receiving the second instruction from the sub-chip, the main chip can execute the screen-on configuration process. After completing the screen-on configuration process, the main chip can control the display screen to show the second content.

[0211] Optionally, S208 is not limited to being executed before S209; S208 can be executed before, after, or simultaneously with any step after S207.

[0212] from Figure 2I As can be seen from the embodiment, when the sub-chip controls the display screen to display the first content, the main chip is already in the first wake-up state. In S208, after receiving the second instruction sent by the sub-chip, the main chip does not need to execute the first wake-up process again, saving the time of waking up the main chip and the time of switching from the sub-chip to the main chip, thus speeding up the speed at which the main chip controls the display screen to display the second content.

[0213] It should be noted that, Figure 2I The methods shown are only for explaining this application, and this application is for... Figure 2I The execution steps before and after each method are not limited.

[0214] Figure 3 This paper illustrates a flowchart of a second method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0215] S301, reference Figure 2I S201-S205 in the embodiment.

[0216] S302, the main chip executes the screen-on configuration process.

[0217] Upon receiving the first instruction, the main chip can execute the screen-on configuration process. This process involves the electronic device pre-drawing the image to be displayed and configuring the hardware and software parameters for screen activation. After switching to the main chip, it can take over the display screen and control the screen to display the pre-drawn image.

[0218] The screen-on configuration process may include, but is not limited to, the following steps: drawing an image, sending the image to the display, powering on the liquid crystal display (LCD), and setting the display brightness.

[0219] Optionally, S302 is not limited to being executed after S205; S302 can also be executed before, after, or simultaneously with any step after S202.

[0220] Optionally, after executing the screen-on configuration process, the main chip can request a screen-on lock, preventing it from executing the screen-off configuration process. This is because if the main chip does not control the display within a certain time after executing the screen-on configuration process, it will execute the screen-off configuration process to cancel the hardware and software configuration parameters configured in the screen-on configuration process. To prevent the main chip from executing the screen-off configuration process, it can request a screen-on lock, thus preventing it from executing the screen-off configuration process and canceling the hardware and software configuration parameters configured in the screen-on configuration process.

[0221] This application does not limit itself to applying for a screen-on lock; other methods can also be used to prevent the main chip from executing the screen-off configuration process.

[0222] S303, First event detected, sub-chip stops displaying first content.

[0223] S304. The sub-chip sends a second instruction to the main chip, which instructs the main chip to control the content displayed on the screen.

[0224] For the descriptions of S303-S304, please refer to the descriptions in S206-S207, which will not be repeated here.

[0225] S305, in response to the second instruction, the main chip can execute the first standby process and the screen-off configuration process.

[0226] In S205, the main chip does not execute the first standby process, keeping it in the first wake-up state. This prevents the main chip from entering the first standby state while the sub-chip is controlling the screen and displaying the first content.

[0227] Upon receiving the second instruction from the sub-chip, the sub-chip stops displaying the first content and the main chip begins controlling the display screen to show content. Therefore, upon receiving the second instruction from the sub-chip, the main chip can execute a first standby process, entering a first standby state to save power consumption of the electronic device 100. Similarly, after receiving the second instruction from the sub-chip, if the main chip does not control the display screen to show content within a certain period, the main chip can execute a screen-off configuration process to save power consumption of the electronic device 100.

[0228] Optionally, the main chip can cancel the wake-up lock, allowing the main chip to execute the first standby process.

[0229] Optionally, the main chip can disable the screen-on lock, allowing the main chip to execute the screen-off configuration process.

[0230] S306, the main chip controls the display screen to show the second content.

[0231] After receiving the second instruction from the sub-chip, the main chip can control the display screen to show the second content.

[0232] Optionally, S305 is not limited to being executed before S305; S305 can also be executed after S305 or simultaneously with S305.

[0233] from Figure 3 As can be seen from the example, when the sub-chip controls the display screen to display the first content, the main chip is already in the first wake-up state, and the main chip has already drawn the image to be displayed and configured the software and hardware configuration parameters. In S306, after receiving the second instruction sent by the sub-chip, the main chip no longer needs to execute the first wake-up process and the screen-on configuration process, saving the time of waking up the main chip and executing the screen-on configuration process, as well as the time of switching from the sub-chip to the main chip, thus speeding up the speed at which the main chip controls the display screen to display the second content.

[0234] It should be noted that, Figure 3 The methods shown are only for explaining this application, and this application is for... Figure 3 The execution steps before and after each method are not limited.

[0235] Before the main chip receives the second instruction sent by the sub-chip. Figure 3 Examples and Figure 2I The common feature of the embodiments is that the main chip is in the first wake-up state. Figure 3 Examples and Figure 2I The difference in the embodiments is that after the main chip receives the second instruction sent by the sub-chip, Figure 2I The example requires executing a screen-on configuration process. Figure 3 The embodiment does not require executing the screen-on configuration process before the main chip receives the second instruction sent by the sub-chip. Figure 3 The main chip in this embodiment has completed the screen-on configuration process.

[0236] exist Figure 3 In the embodiments, Figure 3 Examples and Figure 2I Compared to the previous embodiment, after the main chip receives the second instruction sent by the sub-chip, the electronic device 100 can save time in executing the screen-on configuration process, and the main chip can control the display screen to display the second content more quickly.

[0237] In some embodiments, while the sub-chip controls the display screen to display first content, the main chip can perform a first service, such as a background upgrade service.

[0238] Figure 4 This application provides a schematic flowchart illustrating a method for a main chip to perform a first service while a sub-chip controls a display screen to display first content.

[0239] S401, Reference Figure 2I S201-S205 in the embodiment, or Figure 3 S301-S302 in the embodiment.

[0240] In S401, refer to Figure 2I The descriptions in S201-S205 of the embodiments, or Figure 3 As described in S301-S302 of the embodiment, the main chip is already in a first wake-up state while the sub-chip controls the display screen to display the first content.

[0241] S402, The main chip receives a wake-up command.

[0242] S403, in response to the wake-up command, the main chip executes the first service.

[0243] Upon receiving the wake-up command, the main chip is already in the first wake-up state in response to the command. The main chip does not need to execute the first wake-up process again and can directly process the first service.

[0244] In some embodiments, if the display screen is off while the sub-chip is controlling the display screen, the electronic device 100 allows the main chip to enter a first standby state to save power consumption of the electronic device 100.

[0245] Figures 5A-5B A set of schematic diagrams is shown, illustrating the process where the display screen turns off after the sub-chip controls the display screen to show the first content.

[0246] Figures 5A-5B An example is shown where electronic device 100 is a wearable device.

[0247] For example, such as Figure 5A As shown, the electronic device 100 displays a blood pressure measurement interface. Figure 5A The blood pressure measurement interface shown can be an interface displayed on a screen controlled by a sub-chip.

[0248] The third condition is met, such as Figure 5B As shown, electronic device 100 can turn off the screen, and the sub-chip can control the display screen to stop displaying content.

[0249] Optionally, the third condition may include, but is not limited to, any of the following: within the first time period, the electronic device 100 does not receive user operation, or the user presses the power button, etc.

[0250] Figure 5C A flowchart illustrating a method for the main chip to execute a first service after the display screen is turned off while the sub-chip is controlling the display screen.

[0251] S501. During the period when the sub-chip controls the display screen, the display screen turns off and stops displaying the first content.

[0252] Optionally, if the third condition is met during the sub-chip's control of the display screen, the display screen can be turned off and the first content can be stopped from being displayed.

[0253] Optionally, the third condition may include, but is not limited to, any of the following: within the first time period, the electronic device 100 does not receive user operation, or the user presses the power button. The third condition may also include other conditions, which are not limited in this application.

[0254] S502, the sub-chip sends a third instruction to the main chip.

[0255] S503, in response to the third instruction, the main chip can execute the first standby process, or it can execute the first standby process and the screen-off configuration process.

[0256] During the period when the sub-chip controls the display screen, if the display screen turns off and stops displaying the first content, the sub-chip can send a third instruction to the main chip. The third instruction is used to instruct the main chip to enter the first standby state in order to save the power consumption of the electronic device 100.

[0257] After receiving the third instruction from the sub-chip, the main chip can execute the first standby process after a second duration, the second duration being greater than or equal to 0.

[0258] Optionally, upon receiving the third instruction from the sub-chip, the main chip can immediately execute the screen-off configuration process. In other words, the main chip can execute the first standby process and the screen-off configuration process asynchronously.

[0259] S504, the main chip received a wake-up command.

[0260] S505, the main chip confirms whether the main chip is in the first standby state.

[0261] During the sub-chip's control of the display screen, the main chip receives a wake-up command, which instructs the main chip to perform a first service. For example, the first service could be a background upgrade service.

[0262] In some embodiments, if the main chip has already executed the first standby process, or has already executed the first standby process and the screen-off configuration process, and is in the first standby state when it receives the wake-up command, then in response to the wake-up command, the main chip confirms that it is in the first standby state.

[0263] In some embodiments, if the main chip has not yet executed the first standby process, or has not yet executed the first standby process and the screen-off configuration process, and the main chip is still in the first wake-up state when it receives the wake-up command, then in response to the wake-up command, the main chip confirms that it is not in the first standby state.

[0264] If it is confirmed that the main chip is in the first standby state, the main chip executes S506-S507.

[0265] If it is confirmed that the main chip is not in the first standby state, but in the first wake-up state, the main chip executes S507.

[0266] S506, the main chip executes the first wake-up process.

[0267] S507, the main chip processes the primary business.

[0268] If the main chip is confirmed to be in the first standby state, it can execute the first wake-up procedure, putting it into the first wake-up state. Once in the first wake-up state, the main chip can process the first service.

[0269] If it is confirmed that the main chip is not in the first standby state, but in the first wake-up state, the main chip does not need to execute the first wake-up process and can directly process the first service.

[0270] The second option

[0271] You can refer to this. Figures 2A-2H As described in the embodiments, after switching from the main chip to the sub-chip, the sub-chip can control the display screen to display content.

[0272] Figure 6 This paper illustrates a flowchart of a third method provided in this application for switching from a sub-chip to a main chip, with the main chip controlling the content displayed on the screen.

[0273] S601, the sub-chip controls the display screen to show the first content.

[0274] When the display screen is controlled by the sub-chip to display the first content, the main chip can be in a first standby state or a second wake-up state.

[0275] The first standby state can refer to the CPU being in a low-power operating state, or the CPU being powered off, the device being in a suspended operating state, or the process being in a frozen state.

[0276] The second wake-up state can refer to the CPU being in a non-low-power operating state, the device being in a restored operating state, or the process being in a thawed state.

[0277] The first standby state is the opposite of the second wake-up state. When the main chip is in the first standby state, it can execute a third wake-up process to enter the second wake-up state. When the main chip is in the second wake-up state, it can execute a third standby process to enter the first standby state.

[0278] The third wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and the unfreezing process. The third standby process includes: the freezing process, the device pausing operation, and the CPU entering a low-power state or the CPU being powered off.

[0279] exist Figure 6 In this embodiment, the main chip may further include a first wake-up state, which is different from the second wake-up state.

[0280] The first wake-up state and the second wake-up state are similar in that the CPU is in a non-low-power operating state and the device is in a recovery operating state.

[0281] The difference between the first wake-up state and the second wake-up state is that the process in the first wake-up state is in a frozen state, while the process in the second wake-up state is in a thawed state.

[0282] When the main chip is in the first standby state, it can execute the first wake-up process and enter the first wake-up state.

[0283] When the main chip is in the second wake-up state, it can execute the second standby process and enter the first wake-up state.

[0284] For an explanation of the first wake-up process, please refer to the description in S605.

[0285] For an explanation of the first wake-up state, please refer to the description in S604.

[0286] For an explanation of the second standby process, please refer to the description in S604.

[0287] S602, the sub-chip sends a first instruction to the main chip, the first instruction being used to instruct the main chip to set to the first wake-up state.

[0288] For other descriptions of S601-S602, please refer to the descriptions in S201-S202, which will not be repeated here.

[0289] S603, in response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state.

[0290] After receiving the first instruction from the sub-chip, the main chip needs to confirm whether it is in the second wake-up state.

[0291] When the main chip is in the second wake-up state, S604 needs to be executed to put the main chip in the first wake-up state. The first wake-up state is different from the second wake-up state.

[0292] When the main chip is not in the second wake-up state, i.e., in the first standby state, S605 needs to be executed to put the main chip into the first wake-up state.

[0293] S604, the main chip executes the second standby process, which includes: the freeze process.

[0294] After receiving the first instruction from the sub-chip, when the main chip is in the second wake-up state, the main chip needs to execute the second standby process to put the main chip into the first wake-up state.

[0295] The second standby process includes: the freezing process.

[0296] The first wake-up state includes: the CPU is in a non-low power operation state, the device is in a recovery operation state, and the process is in a frozen state.

[0297] Optionally, when the main chip is in the second wake-up state, after receiving the first instruction from the sub-chip, if the main chip has a service being executed, it must wait for the service to complete before executing the second standby process. If the main chip has no service being executed, it can immediately execute the second standby process.

[0298] S605, the main chip executes the first wake-up process, which includes: the CPU entering a non-low power operating state and the device resuming operation.

[0299] After receiving the first instruction from the sub-chip, if the main chip is not in the second wake-up state, i.e., in the first standby state, the main chip needs to execute the first wake-up process to put the main chip into the first wake-up state.

[0300] The first wake-up process includes: the CPU entering a non-low-power operating state and the device resuming operation.

[0301] S606, the main chip does not execute the first standby process. The first standby process includes: device pausing operation, CPU power-down, or CPU entering a low-power operation state.

[0302] In S604, after the main chip completes the second standby process and enters the first wake-up state, or in S605, after the main chip completes the first wake-up process and enters the first wake-up state, the main chip can be configured not to execute the first standby process. This allows the main chip to remain in the first wake-up state and prevents it from entering the first standby state.

[0303] The first standby process includes: device pausing operation, CPU powering down, or CPU entering a low-power operation state.

[0304] Optionally, the main chip can request a second wake-up lock, preventing it from executing the first standby process. However, this application does not limit the methods used to prevent the main chip from executing the first standby process; other methods can also be employed.

[0305] S607, First event detected, sub-chip stops displaying first content.

[0306] S608, the sub-chip sends a second instruction to the main chip, the second instruction being used to instruct the main chip to control the display screen to show the content.

[0307] For the description of S607-S608, please refer to the description in S206-S207, which will not be repeated here.

[0308] The S609 main chip can execute the first standby process.

[0309] In S609, after receiving the second instruction from the sub-chip, the sub-chip stops displaying the first content and the main chip begins to control the display screen to display content. Therefore, after receiving the second instruction from the sub-chip, the main chip can execute the first standby process and enter the first standby state to save power consumption of the electronic device 100.

[0310] Optionally, the main chip can cancel the second wake-up lock, allowing the main chip to execute the first standby process.

[0311] S610, the main chip executes the second wake-up process, which includes: the unfreezing process.

[0312] In S604-S606 or S605-S606, the main chip does not execute the first standby process, keeping it in the first wake-up state. This prevents the main chip from entering the first standby state while the sub-chip is controlling the screen and displaying the first content.

[0313] In S608, after receiving the second instruction from the sub-chip, the sub-chip stops displaying the first content and the main chip begins controlling the display screen to show content. Therefore, after receiving the second instruction from the sub-chip, the main chip can execute the second wake-up process, causing the main chip to enter the second wake-up state. After entering the second wake-up state, the main chip can process the first service.

[0314] S611, the main chip executes the screen-on configuration process.

[0315] S612, the main chip controls the display screen to show the second content.

[0316] After receiving the second instruction from the sub-chip, the main chip can execute the screen-on configuration process. After completing the screen-on configuration process, the main chip can control the display screen to show the second content.

[0317] Optionally, S610 is not limited to being executed before S611; S610 can also be executed after S611.

[0318] Optionally, S609 is not limited to being executed before S610; S609 can be executed before, after, or simultaneously with any step after S608.

[0319] from Figure 6 As can be seen from the example, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. In S610, after receiving the second instruction sent by the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time for the main chip to execute the steps of the CPU entering a non-low-power operating state and the device resuming operation, and saves the time of switching from the sub-chip to the main chip, thus speeding up the speed at which the main chip controls the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the processes are in a frozen state, and the CPU does not schedule processes, which also saves the power consumption of the electronic device 100.

[0320] It should be noted that, Figure 6 The methods shown are only for explaining this application, and this application is for... Figure 6 The execution steps before and after each method are not limited.

[0321] Before the main chip receives the second instruction sent by the sub-chip. Figure 6 Examples and Figure 2I The similarities between the embodiments are that the CPU is in a non-low-power operating state and the device is in a recovery operating state. Figure 6 Examples and Figure 2I The difference in the embodiments is that, Figure 6 The process in this embodiment is in a frozen state. Figure 2I The process in the example is in a thawed state.

[0322] After the main chip receives the second instruction sent by the sub-chip... Figure 6 Examples and Figure 2I The difference in the embodiments is that, Figure 6 The implementation requires a second wake-up process to unfreeze the process. Figure 2I The embodiment does not require the execution of a second wake-up process before the main chip receives the second instruction sent by the sub-chip. Figure 2I The process in the example is now in a thawed state.

[0323] exist Figure 6 In the embodiments, Figure 6Examples and Figure 2I In comparison, in the previous embodiment, the process is in a frozen state before the main chip receives the second instruction sent by the sub-chip, and the CPU will not schedule the process, which can save 100% of the power consumption of the electronic device.

[0324] exist Figure 2I In the embodiments, Figure 2I Examples and Figure 6 In comparison, after the main chip receives the second instruction sent by the sub-chip, the process is in a thawed state and there is no need to thaw the process again. The main chip can control the display screen to display the second content more quickly.

[0325] Figure 7 This paper illustrates a flowchart of a fourth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0326] S701, the sub-chip controls the display screen to show the first content.

[0327] When the display screen is controlled by the sub-chip to display the first content, the main chip can be in a first standby state or a second wake-up state.

[0328] For an introduction to the first standby state and the second wake-up state, please refer to the description in S601.

[0329] exist Figure 7 In this embodiment, the main chip may further include a first wake-up state, which is different from the second wake-up state.

[0330] The first wake-up state and the second wake-up state are similar in that the device is in a restored running state and the process is in a thawed state.

[0331] The difference between the first wake-up state and the second wake-up state is that in the first wake-up state, the CPU is either powered down or in a low-power operating state, while in the second wake-up state, the CPU is in a non-low-power operating state.

[0332] When the main chip is in the first standby state, it can execute the first wake-up process and enter the first wake-up state.

[0333] When the main chip is in the second standby state, it can execute the second standby process and enter the first wake-up state.

[0334] For an explanation of the first wake-up process, please refer to the description in S705.

[0335] For an explanation of the first wake-up state, please refer to the description in S704.

[0336] For an explanation of the second standby process, please refer to the description in S704.

[0337] S702, the sub-chip sends a first instruction to the main chip, the first instruction being used to instruct the main chip to set to the first wake-up state.

[0338] For other descriptions of S701-S702, please refer to the descriptions in S201-S202, which will not be repeated here.

[0339] S703, in response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state.

[0340] After receiving the first instruction from the sub-chip, the main chip needs to confirm whether it is in the second wake-up state.

[0341] When the main chip is in the second wake-up state, S704 needs to be executed to put the main chip into the first wake-up state. The first wake-up state is different from the second wake-up state.

[0342] When the main chip is not in the second wake-up state, i.e., in the first standby state, S705 needs to be executed to put the main chip into the first wake-up state.

[0343] S704, the main chip executes the second standby process, which includes: the CPU powering down or the CPU entering a low-power operating state.

[0344] After receiving the first instruction from the sub-chip, when the main chip is in the second wake-up state, the main chip needs to execute the second standby process to put the main chip into the first wake-up state.

[0345] The second standby process includes: the CPU powering off or the CPU entering a low-power operating state.

[0346] The first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operation state, the device is in a resumed operation state, and the process is in a thawed state.

[0347] Optionally, when the main chip is in the second wake-up state, after receiving the first instruction from the sub-chip, if the main chip has a service being executed, it must wait for the service to complete before executing the second standby process. If the main chip has no service being executed, it can immediately execute the second standby process.

[0348] S705, the main chip executes the first wake-up process, which includes: the CPU entering a non-low power operating state, the device resuming operation, the unfreezing process, the CPU being powered down again, or the CPU re-entering a low power operating state.

[0349] After receiving the first instruction from the sub-chip, if the main chip is not in the second wake-up state, i.e., in the first standby state, the main chip needs to execute the first wake-up process to put the main chip into the first wake-up state.

[0350] The first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, the unfreezing process, and the CPU being powered down again or the CPU re-entering a low-power operating state.

[0351] In the first wake-up process, the main chip executes the step of putting the CPU into a non-low-power operating state because the CPU's participation is required when the main chip executes the device recovery and unfreezing processes, meaning the CPU needs to be in a non-low-power operating state. After completing the device recovery and unfreezing processes, the main chip then executes the step of either powering down the CPU or putting the CPU back into a low-power operating state.

[0352] S706, the main chip does not execute the first standby process. The first standby process includes: freezing process and device suspension.

[0353] In S704, after the main chip completes the second standby process and enters the first wake-up state, or in S705, after the main chip completes the first wake-up process and enters the first wake-up state, the main chip can be configured not to execute the first standby process. This allows the main chip to remain in the first wake-up state and prevents it from entering the first standby state.

[0354] The first standby process includes: freezing process and device suspension.

[0355] Optionally, the main chip can request a third wake-up lock, preventing it from executing the first standby process. However, this application does not limit the methods used to prevent the main chip from executing the first standby process; other methods can also be employed.

[0356] S707, the first event was detected, and the sub-chip stopped displaying the first content.

[0357] S708, the sub-chip sends a second instruction to the main chip, which instructs the main chip to control the display screen to show the content.

[0358] The S709 main chip can execute the first standby process.

[0359] S710, in response to the second instruction, the main chip executes the second wake-up process, which includes: the CPU entering a non-low power operating state.

[0360] S711, the main chip executes the screen-on configuration process.

[0361] The S712 main chip controls the display screen to show the second content.

[0362] Similar to S607-S612, S707-S712 differ in that the second wake-up process in S710 differs from that in S610. The second wake-up process in S710 includes the CPU entering a non-low-power operating state. For details, please refer to the descriptions in S607-S612; these will not be repeated here.

[0363] from Figure 7 As can be seen from the example, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. In the S710, after receiving the second instruction sent by the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the device recovery and unfreezing process steps, saves the time of switching from the sub-chip to the main chip, and speeds up the speed at which the main chip controls the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operating state or the CPU is powered down, and the CPU does not schedule processes, which also saves the power consumption of the electronic device.

[0364] It should be noted that, Figure 7 The methods shown are only for explaining this application, and this application is for... Figure 7 The execution steps before and after each method are not limited.

[0365] Before the main chip receives the second instruction sent by the sub-chip. Figure 7 Examples and Figure 2I The similarities among the embodiments are that the device is in a restored operating state and the process is in a thawed state. Figure 7 Examples and Figure 2I The difference in the embodiments is that, Figure 7 In this embodiment, the CPU is either powered off or operating in a low-power state. Figure 2I The CPU in this embodiment is operating in a non-low-power state.

[0366] After the main chip receives the second instruction sent by the sub-chip... Figure 7 Examples and Figure 2I The difference in the embodiments is that, Figure 7 The implementation requires a second wake-up process to bring the CPU into a non-low-power operating state. Figure 2I The embodiment does not require the execution of a second wake-up process before the main chip receives the second instruction sent by the sub-chip. Figure 2I The CPU in this embodiment is already in a non-low-power operating state.

[0367] exist Figure 7 In the embodiments, Figure 7 Examples and Figure 2IIn comparison, before the main chip receives the second instruction sent by the sub-chip, the CPU is in a power-down state or a low-power operating state, and the CPU will not schedule processes, which can save 100% of the power consumption of electronic devices.

[0368] exist Figure 2I In the embodiments, Figure 2I Examples and Figure 7 In comparison, after the main chip receives the second instruction sent by the sub-chip, the CPU is in a non-low-power operating state. There is no need to execute the second wake-up process to make the CPU enter the non-low-power operating state. The main chip can control the display screen to display the second content more quickly.

[0369] Before the main chip receives the second instruction sent by the sub-chip. Figure 7 Examples and Figure 6 The common feature of the embodiments is that the device is in a recovery operation state. Figure 7 Examples and Figure 6 The difference in the embodiments is that, Figure 7 In this embodiment, the CPU is either powered off or in a low-power operating state, and the process is in an unfrozen state. Figure 6 In this embodiment, the CPU is in a non-low-power operating state, and the process is in a frozen state.

[0370] After the main chip receives the second instruction sent by the sub-chip... Figure 7 Examples and Figure 6 The difference in the embodiments is that, Figure 7 The implementation requires a second wake-up process to bring the CPU into a non-low-power operating state. Figure 6 The implementation also requires a second wake-up process, but Figure 6 The second wake-up process in the embodiment is used to unfreeze the process.

[0371] Figure 8 This paper illustrates a flowchart of a fifth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0372] S801, the sub-chip controls the display screen to show the first content.

[0373] When the display screen is controlled by the sub-chip to display the first content, the main chip can be in a first standby state or a second wake-up state.

[0374] For an introduction to the first standby state and the second wake-up state, please refer to the description in S601.

[0375] exist Figure 8 In this embodiment, the main chip may further include a first wake-up state, which is different from the second wake-up state.

[0376] The first wake-up state and the second wake-up state are similar in that the device is in a recovery operation state.

[0377] The difference between the first and second wake-up states is that in the first wake-up state, the CPU is either powered down or in a low-power operating state, and the process is in a frozen state. In the second wake-up state, the CPU is in a non-low-power operating state, and the process is in a thawed state.

[0378] When the main chip is in the first standby state, it can execute the first wake-up process and enter the first wake-up state.

[0379] When the main chip is in the second standby state, it can execute the second standby process and enter the first wake-up state.

[0380] For an explanation of the first wake-up process, please refer to the description in S805.

[0381] For an explanation of the first wake-up state, please refer to the description in S804.

[0382] For an explanation of the second standby process and the first wake-up state, please refer to the description in S804.

[0383] S802, the sub-chip sends a first instruction to the main chip, the first instruction being used to instruct the main chip to set to the first wake-up state.

[0384] For other descriptions of S701-S702, please refer to the descriptions in S201-S202, which will not be repeated here.

[0385] S803, in response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state.

[0386] After receiving the first instruction from the sub-chip, the main chip needs to confirm whether it is in the second wake-up state.

[0387] When the main chip is in the second wake-up state, S804 needs to be executed to put the main chip into the first wake-up state. The first wake-up state is different from the second wake-up state.

[0388] When the main chip is not in the second wake-up state, that is, in the first standby state, S805 needs to be executed to put the main chip into the first wake-up state.

[0389] S804, the main chip executes the second standby process, which includes: freezing process, CPU power-down or CPU entering low-power operation state.

[0390] After receiving the first instruction from the sub-chip, when the main chip is in the second wake-up state, the main chip needs to execute the second standby process to put the main chip into the first wake-up state.

[0391] The second standby process includes: freezing process, CPU power-down, or CPU entering a low-power operating state.

[0392] Optionally, the main chip needs the CPU to perform the freezing process step. Therefore, the main chip can first execute the freezing process step in the second standby process, and then execute the CPU power-down or CPU enter low-power operation state step in the second standby process.

[0393] The first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operation state, the device is in a resumed operation state, and the process is in a frozen state.

[0394] Optionally, when the main chip is in the second wake-up state, after receiving the first instruction from the sub-chip, if the main chip has a service being executed, it must wait for the service to complete before executing the second standby process. If the main chip has no service being executed, it can immediately execute the second standby process.

[0395] S805, the main chip executes the first wake-up process, which includes: the CPU entering a non-low power operating state, the device resuming operation, the CPU being powered down again, or the CPU re-entering a low power operating state.

[0396] After receiving the first instruction from the sub-chip, if the main chip is not in the second wake-up state, i.e., in the first standby state, the main chip needs to execute the first wake-up process to put the main chip into the first wake-up state.

[0397] The first wake-up process includes: the CPU entering a non-low-power operating state, peripheral devices resuming operation, the CPU being powered off again, or the CPU entering a low-power operating state again.

[0398] The main chip needs the CPU to participate in the peripheral device recovery process. Therefore, the main chip can first execute the step of the CPU entering a non-low-power operating state. After the peripheral device recovery process is completed, the main chip can then execute the step of the CPU powering down or the CPU entering a low-power operating state again.

[0399] S806, the main chip does not execute the first standby process, which includes: the device suspends operation.

[0400] In S804, after the main chip completes the second standby process and enters the first wake-up state, or in S805, after the main chip completes the first wake-up process and enters the first wake-up state, the main chip can be configured not to execute the first standby process. This allows the main chip to remain in the first wake-up state and prevents it from entering the first standby state.

[0401] The first standby process includes: the device suspends operation.

[0402] Optionally, the main chip can request a fourth wake-up lock, preventing it from executing the first standby process. However, this application does not limit the methods used to prevent the main chip from executing the first standby process; other methods can also be employed.

[0403] S807, the first event was detected, and the sub-chip stopped displaying the first content.

[0404] S808: The sub-chip sends a second instruction to the main chip, which instructs the main chip to control the display screen to show the content.

[0405] The S809 main chip can execute the first standby process.

[0406] S810, in response to the second instruction, the main chip executes the second wake-up process, which includes: the CPU entering a non-low power operating state and unfreezing the process.

[0407] S811, the main chip executes the screen-on configuration process.

[0408] S812, the main chip controls the display screen to show the second content.

[0409] Similar to S609-S612, the S807-S812 differ in that the second wake-up process in the S810 is different from that in the S610. The second wake-up process in the S810 includes: the CPU entering a non-low-power operating state and unfreezing the process.

[0410] Optionally, the unfreezing process requires the participation of the CPU. Therefore, the main chip can first execute the step of the CPU entering a non-low-power running state in the second wake-up process, and then execute the unfreezing process step.

[0411] For details, please refer to the descriptions in S607-S612, which will not be repeated here.

[0412] from Figure 8As can be seen from the example, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. In the S810, after receiving the second instruction sent by the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time for the main chip to execute the device recovery operation steps, saves the time for switching from the sub-chip to the main chip, and speeds up the speed at which the main chip controls the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operation state or the CPU is powered down, and the processes are also in a frozen state. The CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0413] It should be noted that, Figure 8 The methods shown are only for explaining this application, and this application is for... Figure 8 The execution steps before and after each method are not limited.

[0414] Before the main chip receives the second instruction sent by the sub-chip. Figure 8 Examples and Figure 2I The common feature of the embodiments is that the device is in a recovery operation state. Figure 8 Examples and Figure 2I The difference in the embodiments is that, Figure 8 In this embodiment, the CPU is either powered off or in a low-power operating state, and the process is in a frozen state. Figure 2I In this embodiment, the CPU is in a non-low-power operating state, and the process is in an unfrozen state.

[0415] After the main chip receives the second instruction sent by the sub-chip... Figure 8 Examples and Figure 2I The difference in the embodiments is that, Figure 8 The implementation requires a second wake-up process to bring the CPU into a non-low-power operating state and unfreeze the process. Figure 2I The embodiment does not require the execution of a second wake-up process before the main chip receives the second instruction sent by the sub-chip. Figure 2I In this embodiment, the CPU is already in a non-low-power operating state, and the process is already in an unfrozen state.

[0416] exist Figure 8 In the embodiments, Figure 8 Examples and Figure 2I In comparison, before the main chip receives the second instruction sent by the sub-chip, the CPU is in a power-down state or a low-power operation state, the process is in a frozen state, and the CPU will not schedule the process, which can save 100% of the power consumption of the electronic device.

[0417] exist Figure 2I In the embodiments, Figure 2I Examples and Figure 8In comparison, after the main chip receives the second instruction sent by the sub-chip, the CPU is in a non-low-power operating state and the process is in a thawed state. There is no need to execute the second wake-up process to make the CPU enter the non-low-power operating state and the thawed process. The main chip can control the display screen to display the second content more quickly.

[0418] Before the main chip receives the second instruction sent by the sub-chip. Figure 8 Examples and Figure 6 The similarities between the embodiments are that the device is in a recovery state and the process is in a frozen state. Figure 8 Examples and Figure 6 The difference in the embodiments is that, Figure 8 In this embodiment, the CPU is either powered off or operating in a low-power state. Figure 6 The CPU in this embodiment is operating in a non-low-power state.

[0419] After the main chip receives the second instruction sent by the sub-chip... Figure 8 Examples and Figure 6 The difference in the embodiments is that, Figure 8 The implementation requires a second wake-up process to cause the CPU to enter a non-low-power operating state and unfreeze the process. Figure 6 The implementation also requires a second wake-up process, but Figure 6 The second wake-up process in the embodiment is used to unfreeze the process.

[0420] Before the main chip receives the second instruction sent by the sub-chip. Figure 8 Examples and Figure 7 The common feature of the embodiments is that the CPU is in a power-down state or in a low-power operation state, and the device is in a recovery operation state. Figure 8 Examples and Figure 7 The difference in the embodiments is that, Figure 8 The process in this embodiment is in a frozen state. Figure 7 The process in the example is in a thawed state.

[0421] After the main chip receives the second instruction sent by the sub-chip... Figure 8 Examples and Figure 7 The difference in the embodiments is that, Figure 8 The implementation requires a second wake-up process to bring the CPU into a non-low-power operating state and unfreeze the process. Figure 7 The implementation also requires a second wake-up process, but Figure 7 The second wake-up process in the embodiment is used to put the CPU into a non-low-power operating state.

[0422] Figure 9This paper illustrates a flowchart of a sixth method provided in this application for switching from a sub-chip to a main chip, and having the main chip control the content displayed on the screen.

[0423] S901, Electronic device 100 execution Figure 6 S601-S606 in the embodiment, or Figure 7 S701-S706 in the embodiment, or Figure 8 S801-S806 in the embodiment.

[0424] S902, the main chip executes the screen-on configuration process.

[0425] Optionally, if the process is in a frozen state during the execution of S902, a process unfreezing step needs to be performed. S902 is then executed again after the process is in a unfrozen state. The process freezing step is then performed again after S902 has completed.

[0426] Figure 9 Examples and Figure 6 Implementation examples or Figure 7 Implementation examples or Figure 8 The difference in this embodiment is that after receiving the first instruction, the main chip can execute the screen-on configuration process without waiting to receive the second instruction.

[0427] Optionally, S902 is not limited to being executed after S606; S902 can also be executed before, after, or simultaneously with any step after S602.

[0428] Optionally, S902 is not limited to being executed after S706; S902 can also be executed before, after, or simultaneously with any step after S702.

[0429] Optionally, S902 is not limited to being executed after S806; S902 can also be executed before, after, or simultaneously with any step after S802.

[0430] S903, the first event was detected, and the sub-chip stopped displaying the first content.

[0431] S904, the sub-chip sends a second instruction to the main chip, which instructs the main chip to control the display screen to show the content.

[0432] For the description of S903-S904, please refer to the description in S206-S207, which will not be repeated here.

[0433] The S905 main chip can execute the first standby process and the screen-off configuration process.

[0434] For a description of S905, please refer to the description of S305; this application will not repeat it here.

[0435] S906, the main chip executes the second wake-up process.

[0436] S907, the main chip controls the display screen to show the second content.

[0437] S906 and S907 are similar to S610, S612, S710, S712, S810, and S812, except that S906 and S907 do not include the step of executing the screen-on configuration process. For details, please refer to the descriptions in S610, S612, S710, S712, S810, and S812, which will not be repeated here.

[0438] from Figure 9 As can be seen from the example, when the sub-chip controls the display screen to display the first content, the main chip is already in the first wake-up state, and the main chip has already drawn the image to be displayed and configured the hardware and software configuration parameters. In S906, after receiving the second instruction sent by the sub-chip, the main chip does not need to execute the screen-on configuration process again, saving the time of waking up the main chip and executing the screen-on configuration process, as well as the time of switching from the sub-chip to the main chip, thus speeding up the speed at which the main chip controls the display screen to display the second content.

[0439] In some embodiments, while the sub-chip controls the display screen to display first content, the main chip can perform a first service, such as a background upgrade service.

[0440] Figure 10 This application provides another method flowchart illustrating the main chip performing a first service while the sub-chip controls the display screen to display first content.

[0441] S1001, Electronic device 100 execution Figure 6 S601-S606 in the embodiment, or Figure 7 S701-S706 in the embodiment, or Figure 8 S801-S806 in the embodiment, or Figure 9 S901-S902 in the embodiment.

[0442] S1002, The main chip receives a wake-up command.

[0443] S1003, Execute the second wake-up process.

[0444] S1004, the main chip executes the first service.

[0445] Upon receiving a wake-up command, the main chip is already in the first wake-up state in response. The main chip then only needs to execute the second wake-up procedure to enter the second wake-up state. Once in the second wake-up state, the main chip can execute the first service.

[0446] In some embodiments, if the display screen is off while the sub-chip is controlling the display screen, the electronic device 100 allows the main chip to enter a first standby state to save power consumption of the electronic device 100.

[0447] For example, you can refer to Figures 5A-5B Description of the screen-off scenario in the embodiments.

[0448] Figure 11 A flowchart illustrating another method in which the main chip executes the first business function after the display screen is turned off while the sub-chip is controlling the display screen.

[0449] S1101. When the sub-chip controls the display screen, the display screen turns off and stops displaying the first content.

[0450] S1102, the sub-chip sends a third instruction to the main chip.

[0451] S1103, in response to the third instruction, the main chip can execute the first standby process, or it can execute the first standby process and the screen-off configuration process.

[0452] S1101-S1103 are similar to S501-S503, and can be referred to the descriptions in S501-S503. They will not be repeated here.

[0453] For an explanation of the first standby process, please refer to [link / reference]. Figure 6 or Figure 7 or Figure 8 The examples are described below.

[0454] S1104, The main chip receives a wake-up command.

[0455] S1105, The main chip confirms that the main chip is in the first standby state, the first wake-up state, or the second wake-up state.

[0456] During the sub-chip's control of the display screen, the main chip receives a wake-up command, which instructs the main chip to perform a first service. For example, the first service could be a background upgrade service.

[0457] In some embodiments, if the main chip has already executed the first standby process, or has already executed the first standby process and the screen-off configuration process, and is in the first standby state when it receives the wake-up command, then in response to the wake-up command, the main chip confirms that it is in the first standby state.

[0458] For an explanation of the first standby state, please refer to [link / reference]. Figure 6 or Figure 7 or Figure 8 The descriptions in the embodiments are not repeated here.

[0459] In some embodiments, if the main chip has not yet executed the first standby process, or has not yet executed the first standby process and the screen-off configuration process, and the main chip is still in the first wake-up state when it receives the wake-up command, then in response to the wake-up command, the main chip confirms that it is in the first wake-up state.

[0460] For an explanation of the first wake-up state, please refer to [link / reference]. Figure 6 or Figure 7 or Figure 8 The descriptions in the embodiments are not repeated here.

[0461] In some embodiments, if the main chip has services to process before receiving a wake-up command, it is already in the second wake-up state. After completing the service, the main chip has not yet executed the first standby process and remains in the second wake-up state. When the main chip receives a wake-up command, it can directly execute the first service.

[0462] If it is confirmed that the main chip is in the first standby state, the main chip executes S1106.

[0463] If it is confirmed that the main chip is in the first wake-up state, the main chip executes S1107.

[0464] If it is confirmed that the main chip is in the second wake-up state, the main chip executes S1108.

[0465] S1106. The main chip executes the third wake-up process and performs the first service. The third wake-up process includes: the CPU entering a non-low power operating state, the device resuming operation, and the unfreezing process.

[0466] If the main chip is confirmed to be in the first standby state, it can execute the third wake-up procedure. After completing the third wake-up procedure, the main chip enters the second wake-up state. Then, the main chip can execute the first service.

[0467] The third wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and the unfreezing process.

[0468] S1107, The main chip executes the second wake-up process and performs the first service.

[0469] If the main chip is confirmed to be in the first wake-up state, it can execute the second wake-up procedure. After completing the second wake-up procedure, the main chip is in the second wake-up state. Then, the main chip can execute the first service.

[0470] For an explanation of the first wake-up state and the second wake-up process, please refer to [link / reference]. Figure 6 or Figure 7 or Figure 8 The descriptions in the embodiments are not repeated here.

[0471] S1108, the main chip executes the first service.

[0472] If it is confirmed that the main chip is in the second wake-up state, the main chip can directly execute the first service.

[0473] Figure 12 This is a schematic diagram of a device control method provided in this application.

[0474] S1201. When the sub-chip controls the display screen to display the first content, the sub-chip sends a first instruction to the main chip. The first instruction is used to instruct the main chip to be set to a first wake-up state. When the sub-chip controls the display screen to display the first content, the main chip is in a first standby state or a second wake-up state.

[0475] S1202. In response to the first instruction, after the main chip is in the first wake-up state, the main chip does not execute the first standby process.

[0476] S1203, The main chip receives a second instruction sent by the sub-chip. The second instruction is used to instruct the main chip to control the display screen to display content.

[0477] S1204. In response to the second instruction, the main chip controls the display screen to display the second content, and executes the first standby process when the first standby event is detected.

[0478] The first wake-up state may be the same as or different from the second wake-up state.

[0479] Using this method, the main chip can enter the first wake-up state in advance. When the main chip needs to control the display screen and display content, it can skip the wake-up process corresponding to the first standby process, saving the time to wake up the main chip, reducing the latency of switching from the sub-chip to the main chip, and speeding up the speed at which the main chip controls the display screen to display the second content.

[0480] In one possible implementation, the second wake-up state is the same as the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: in response to the first instruction, the main chip confirms whether the main chip is in the first wake-up state; if the main chip is in the first wake-up state, the main chip is set not to execute the first standby process; if the main chip is in the first standby state, the main chip executes the first wake-up process, so that the main chip is in the first wake-up state, and after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

[0481] In one possible implementation, the first wake-up state or the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state; the first standby process includes: freezing the process, suspending the device, powering down the CPU or the CPU entering a low-power operating state; the first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and thawing the process.

[0482] In this way, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction sent by the sub-chip, the main chip does not need to execute the first wake-up process again, saving the time of waking up the main chip. For example, it saves the main chip from executing the steps of the CPU entering a non-low-power operating state, the device restoring operation, and the unfreezing process, thus speeding up the speed at which the main chip controls the display to show the second content.

[0483] For example, you can refer to Figure 2I Description in the embodiments.

[0484] In one possible implementation, the second wake-up state is different from the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: in response to the first instruction, the main chip confirms whether the main chip is in the second wake-up state; if the main chip is in the second wake-up state, the main chip executes the second standby process, causing the main chip to be in the first wake-up state; after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process; if the main chip is in the first standby state, the main chip executes the first wake-up process, causing the main chip to be in the first wake-up state; after the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

[0485] In one possible implementation, the first standby process includes: the device suspending operation, the CPU being powered off, or the CPU entering a low-power operating state; the second standby process includes: a freeze process; and the first wake-up process includes: the CPU entering a non-low-power operating state and the device resuming operation.

[0486] In one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a frozen state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0487] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a second wake-up process, which includes: unfreezing the processes frozen in the second standby process.

[0488] Thus, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the steps of the CPU entering a non-low-power operating state and the device resuming operation, thus speeding up the process of the main chip controlling the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the processes are in a frozen state, and the CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0489] For example, you can refer to Figure 6 Description in the embodiments.

[0490] In one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0491] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes:

[0492] The main chip executes a second wake-up process, which includes the CPU entering a non-low-power operating state.

[0493] Thus, when the sub-chip controls the display screen to show the first content, the main chip is already in the first wake-up state. After receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the device recovery and unfreezing process steps, speeding up the process of the main chip controlling the display screen to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operating state or the CPU is powered down, and the CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0494] For example, you can refer to Figure 7 Description in the embodiments.

[0495] In one possible implementation, the first standby process includes: the device suspends operation; the first wake-up process includes: the CPU enters a non-low-power operating state, the device resumes operation, the CPU is powered down again, or the CPU re-enters a low-power operating state; the second standby process includes: a freeze process, the CPU is powered down, or the CPU enters a low-power operating state.

[0496] In one possible implementation, the second wake-up state includes: the CPU is in a non-low-power operating state, the device is in a resumed operating state, and the process is in a thawed state; the first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operating state, the device is in a resumed operating state, and the process is in a frozen state; the first standby state includes: the CPU is in a power-down state or in a low-power operating state, the device is in a suspended operating state, and the process is in a frozen state.

[0497] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a second wake-up process, which includes: the CPU entering a non-low-power operating state and unfreezing the processes frozen in the second standby process.

[0498] Thus, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state. In the S810, after receiving the second instruction from the sub-chip, the main chip only needs to execute the second wake-up process. On the one hand, this saves the time the main chip spends executing the device recovery steps, speeding up the process of the main chip controlling the display to show the second content. On the other hand, during the period when the main chip is in the first wake-up state, the CPU is in a low-power operating state or the CPU is powered down, and the processes are also in a frozen state. The CPU does not schedule processes, which also saves 100% of the power consumption of the electronic device.

[0499] For example, you can refer to Figure 8 Description in the embodiments.

[0500] In one possible implementation, the main chip does not execute the first standby process, which specifically includes: the main chip requests a wake-up lock but does not execute the first standby process.

[0501] This is not limited to requesting a wake-up lock to prevent the main chip from executing the first standby process. Other methods can also be used to prevent the main chip from executing the first standby process, and this application does not limit this method.

[0502] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip releasing the wake-up lock.

[0503] In this way, while the main chip is controlling the display screen to show the second content, the main chip can execute the first standby process. If no user operation is received within a certain period of time, the main chip can execute the first standby process and remain in the first standby state to save power consumption of the electronic device.

[0504] In one possible implementation, before the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip executing a screen-on configuration process.

[0505] In this way, when the sub-chip controls the display to show the first content, the main chip is already in the first wake-up state, and has already drawn the image to be displayed and configured the hardware and software parameters. After receiving the second instruction from the sub-chip, the main chip does not need to execute the screen-on configuration process again, saving the time of waking up the main chip and executing the screen-on configuration process, and speeding up the speed at which the main chip controls the display to show the second content.

[0506] For example, you can refer to Figure 3 or Figure 9 Description in the embodiments.

[0507] In one possible implementation, after the main chip executes the screen-on configuration process, the method further includes: the main chip requests a screen-on lock and does not execute the screen-off configuration process.

[0508] This is not limited to requesting a wake-up lock to prevent the main chip from executing the screen-off configuration process. Other methods can also be used to prevent the main chip from executing the screen-off configuration process, and this application does not limit this to such methods.

[0509] In one possible implementation, after the main chip receives the second instruction sent by the sub-chip, the method further includes: the main chip releasing the screen lock.

[0510] In this way, while the main chip is controlling the display screen to show the second content, the main chip can execute the first standby process. If no user operation is received within a certain period of time, the main chip can execute the screen-off configuration process, and the display screen can be turned off to save power consumption of the electronic device.

[0511] In one possible implementation, the screen-on configuration process includes: drawing an image, sending the image to the display, powering on the LCD, and setting the display brightness.

[0512] For example, the main chip can be an application processor, and the sub-chip can be a microcontroller unit.

[0513] This application provides an electronic device, including a memory, a main chip, and a sub-chip; wherein the main chip, the sub-chip, and the memory are coupled, the memory is used to store a computer program, and when the main chip or the sub-chip executes the computer program, the electronic device performs... Figure 12 This illustrates a device control method.

[0514] This application provides a computer-readable storage medium, including instructions that, when executed on an electronic device, cause the electronic device to perform... Figure 12 This illustrates a device control method.

[0515] This application provides a chip system, which includes a main chip and a sub-chip, wherein the main chip or the sub-chip is used to invoke computer instructions to cause an electronic device to perform... Figure 12 This illustrates a device control method.

[0516] This application provides a computer program product containing instructions that, when executed on an electronic device, causes the electronic device to perform... Figure 12 This illustrates a device control method.

[0517] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0518] It is understood that the user interfaces described in the embodiments of this application are merely example interfaces and do not constitute a limitation on the solution of this application. In other embodiments, the user interface may adopt different interface layouts, may include more or fewer controls, and may add or remove other functional options, as long as they are based on the same inventive concept provided in this application, they are all within the protection scope of this application.

[0519] It should be noted that, without causing contradictions or conflicts, any feature in any embodiment of this application, or any part of any feature, can be combined, and the combined technical solution is also within the scope of the embodiments of this application.

[0520] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A device control method, characterized in that, The method is applied to an electronic device, the electronic device including a main chip and a sub-chip, and the method includes: When the sub-chip controls the display screen to display the first content, the sub-chip sends a first instruction to the main chip. The first instruction is used to instruct the main chip to be set to a first wake-up state. When the sub-chip controls the display screen to display the first content, the main chip is in a first standby state or a second wake-up state. In response to the first instruction, after the main chip is in the first wake-up state, the main chip does not execute the first standby process; The main chip receives a second instruction sent by the sub-chip, the second instruction being used to instruct the main chip to control the display screen to display content; In response to the second instruction, the main chip controls the display screen to display the second content, and executes the first standby process when a first standby event is detected.

2. The method according to claim 1, characterized in that, The second wake-up state is the same as the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: In response to the first instruction, the main chip confirms whether the main chip is in the first wake-up state; If the main chip is in the first wake-up state, the main chip is set not to execute the first standby process; If the main chip is in the first standby state, the main chip executes the first wake-up process to put the main chip in the first wake-up state. After the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

3. The method according to claim 2, characterized in that, The first wake-up state or the second wake-up state includes: the CPU is in a non-low power operation state, the device is in a resumed operation state, and the process is in a thawed state; The first standby state includes: the CPU being in a power-off state or a low-power operation state, the device being in a paused operation state, and the process being in a frozen state; The first standby process includes: freezing the process, pausing the device, powering down the CPU, or the CPU entering a low-power operating state; The first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, and unfreezing the process.

4. The method according to claim 1, characterized in that, The second wake-up state is different from the first wake-up state; in response to the first instruction, after the main chip is in the wake-up state, the main chip does not execute the first standby process, specifically including: In response to the first instruction, the main chip confirms whether the main chip is in a second wake-up state; If the main chip is in the second wake-up state, the main chip executes the second standby process, so that the main chip is in the first wake-up state. After the main chip is in the first wake-up state, the main chip is set not to execute the first standby process. If the main chip is in the first standby state, the main chip executes the first wake-up process to put the main chip in the first wake-up state. After the main chip is in the first wake-up state, the main chip is set not to execute the first standby process.

5. The method according to claim 4, characterized in that, The first standby process includes: the device pausing operation, the CPU being powered off, or the CPU entering a low-power operation state; The second standby process includes: a freezing process; The first wake-up process includes: the CPU entering a non-low-power operating state and the device resuming operation.

6. The method according to claim 5, characterized in that, The second wake-up state includes: the CPU is in a non-low power operation state, the device is in a resumed operation state, and the process is in a thawed state; The first wake-up state includes: the CPU is in a non-low power operation state, the device is in a resume operation state, and the process is in a frozen state; The first standby state includes: the CPU being in a power-off state or in a low-power operation state, the device being in a paused operation state, and the process being in a frozen state.

7. The method according to claim 4, characterized in that, The first standby process includes: freezing process and device suspension; The first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, the process being unfrozen, the CPU being powered down again, or the CPU re-entering a low-power operating state; The second standby process includes: powering off the CPU or putting the CPU into a low-power operating state.

8. The method according to claim 7, characterized in that, The second wake-up state includes: the CPU is in a non-low power operation state, the device is in a resumed operation state, and the process is in a thawed state; The first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operation state, the device is in a resumed operation state, and the process is in a thawed state; The first standby state includes: the CPU being in a power-off state or in a low-power operation state, the device being in a paused operation state, and the process being in a frozen state.

9. The method according to claim 4, characterized in that, The first standby process includes: the device suspending operation; The first wake-up process includes: the CPU entering a non-low-power operating state, the device resuming operation, the CPU being powered down again, or the CPU re-entering a low-power operating state; The second standby process includes: a freezing process, in which the CPU is powered off or the CPU is put into a low-power operating state.

10. The method according to claim 9, characterized in that, The second wake-up state includes: the CPU is in a non-low power operation state, the device is in a resumed operation state, and the process is in a thawed state; The first wake-up state includes: the CPU is in a power-down state or the CPU is in a low-power operation state, the device is in a resumed operation state, and the process is in a frozen state; The first standby state includes: the CPU being in a power-off state or in a low-power operation state, the device being in a paused operation state, and the process being in a frozen state.

11. The method according to claim 5 or 6, characterized in that, After the main chip receives the second instruction sent by the sub-chip, the method further includes: The main chip executes a second wake-up process, which includes: unfreezing the processes frozen in the second standby process.

12. The method according to claim 7 or 8, characterized in that, After the main chip receives the second instruction sent by the sub-chip, the method further includes: The main chip executes a second wake-up process, which includes the CPU entering a non-low-power operating state.

13. The method according to claim 9 or 10, characterized in that, After the main chip receives the second instruction sent by the sub-chip, the method further includes: The main chip executes a second wake-up process, which includes: the CPU entering a non-low-power operating state and unfreezing the processes frozen in the second standby process.

14. The method according to claim 2 or 3, characterized in that, The main chip does not execute the first standby process, specifically including: The main chip requests a wake-up lock and does not execute the first standby process.

15. The method according to claim 14, characterized in that, After the main chip receives the second instruction sent by the sub-chip, the method further includes: The main chip releases the wake-up lock.

16. The method according to any one of claims 1-15, characterized in that, Before the main chip receives the second instruction sent by the sub-chip, the method further includes: The main chip executes the screen-on configuration process.

17. The method according to claim 16, wherein after the main chip executes the screen-on configuration process, the method further comprises: The main chip requests a screen-on lock and does not execute the screen-off configuration process.

18. The method according to claim 16 or 17, wherein after the main chip receives the second instruction sent by the sub-chip, the method further comprises: The main chip releases the screen lock.

19. The method according to any one of claims 16-18, wherein the screen-on configuration process includes: Drawing an image, sending the image to the display, powering on the LCD, and setting the display brightness.

20. An electronic device, characterized in that, The electronic device includes a main chip, a sub-chip, and a memory; wherein the memory is coupled to the main chip and the sub-chip, and the memory is used to store a computer program. When the main chip or the sub-chip executes and calls the computer program, the electronic device performs the method of any one of claims 1-19.

21. A computer-readable storage medium, characterized in that, Includes instructions that, when executed on an electronic device, cause the electronic device to perform the method of any one of claims 1-19.

22. A computer program product, characterized in that, Includes instructions that, when executed on an electronic device, cause the electronic device to perform the method of any one of claims 1-19.

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