Circuit board dust management system and circuit board dust management method

By combining a dust collection device, a processing module, and an input module, the generation and recording of dust on circuit boards are monitored and recorded in real time, solving the problem of dust theft in circuit board processing plants and achieving efficient early warning and management.

CN122390730APending Publication Date: 2026-07-14JIANDING (HUBEI) ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIANDING (HUBEI) ELECTRONICS CO LTD
Filing Date
2026-04-14
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

In circuit board manufacturing plants, there is a problem of factory personnel stealing high-value dust materials, and existing technologies cannot monitor and provide early warnings in real time.

Method used

By employing a dust collection device, processing module, and input module, and through steps such as calculating the collection rate, normalized value, and standard deviation, dust generation and recording are monitored in real time, and alarm information is issued to prevent theft.

Benefits of technology

It enables real-time monitoring of circuit board dust, timely detection of abnormalities, prevention of theft of high-value materials, and improves the timeliness and accuracy of management.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A circuit board dust management system and a circuit board dust management method are disclosed. The circuit board dust management system includes a dust recovery device, a weighing device and a processing module. The weighing device is used to measure the actual dust amount of the dust recovered by the dust recovery device. The processing module can perform a first calculation step and a first judgment step to calculate the collection rate of the dust and determine whether it is lower than the preset collection rate. The processing module can perform a second calculation step and a second judgment step to calculate a normalized value and determine whether it is more than 15% of the positive and negative range of the historical normalized average value. The normalized value is the sum of multiple artificial records of the dust amount divided by the total length. The processing module can determine whether to issue an alarm information according to the judgment results of the first judgment step and the second judgment step.
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Description

Technical Field

[0001] This invention relates to a dust management system and a dust management method, particularly a circuit board dust management system and a circuit board dust management method. Background Technology

[0002] In circuit board manufacturing plants, the dust remaining after circuit board processing contains high-value materials such as nickel, gold, and copper. In practice, there is a problem of factory personnel stealing this dust containing valuable materials. Generally, managers in circuit board manufacturing plants only discover the large-scale theft of this dust during annual statistics. Summary of the Invention

[0003] This invention discloses a circuit board dust management system and a circuit board dust management method, which are mainly used to improve the situation in existing circuit board manufacturing plants where factory personnel steal dust containing high-value materials.

[0004] One embodiment of the present invention discloses a circuit board dust management system, comprising: a dust collection device for user operation to collect dust generated by a circuit board being processed during a processing procedure performed by a circuit board processing equipment; a processing module for obtaining a weighing device to measure the actual amount of dust collected by the dust collection device; and an input module electrically connected to the processing module, the input module being used to provide user input of user data and manual recording of dust amount; wherein, after obtaining a theoretical dust generation amount and an actual dust amount corresponding to the processing procedure, the processing module performs the following steps: a first calculation step: calculating a collection rate; the collection rate is the actual dust amount divided by the theoretical dust generation amount; a first judgment step: judging whether the collection rate is lower than a preset collection rate; if it is judged to be lower than the preset collection rate, issuing a corresponding alarm message; the preset collection rate is not less than 65%; wherein, the processing module performs M processing procedures on N circuit board processing equipment, and the processing module obtains N M-pen theoretical dust generation and N After M manually record the dust quantity, the processing module will perform the following steps: Second calculation step: Calculate a normalized value; the normalized value is N. The sum of the dust amounts recorded manually by M people, divided by the previous total length; the total length is the Nth length executed by the circuit board processing equipment. The M processing steps represent the total length of each circuit board cut. A second judgment step involves determining whether the normalized value exceeds ±15% of a historical normalized average. If it does, a corresponding alarm message is issued. Here, N is a positive integer greater than 1, and M is a positive integer greater than 0.

[0005] Optionally, after obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: a standard deviation judgment step: determine whether the actual dust quantity exceeds a preset range; the upper limit of the default range is the historical average actual dust quantity plus 3 times the standard deviation, and the lower limit of the preset range is the historical average actual dust quantity minus 3 times the standard deviation. If the actual dust quantity is determined to exceed the upper limit, a corresponding alarm message will be issued; if the actual dust quantity is determined to be lower than the lower limit, a corresponding alarm message will be issued.

[0006] Optionally, the circuit board processing equipment removes one corner of the circuit board, the corner including the FR4 circuit board, copper layer, and nickel-gold layer; the processing module calculates the theoretical dust generation amount based on the following formula: M=b t Cu L ρ Cu + b t NiAu L ρ NiAu + (0.5 b hb(t Cu + t NiAu )) L ρ FR4 Where M is the theoretical dust generation, b is the width of the corner, and t is the theoretical dust generation. Cu Where L is the height of the copper layer, L is the thickness of the corner, and ρ is the thickness of the copper layer. Cu t is the density of the copper layer. NiAu ρ is the height of the nickel-gold layer. NiAu ρ is the density of the nickel-gold layer, h is the total height of the corner, and ρFR4 is the density of FR4.

[0007] One embodiment of this invention discloses a circuit board dust management method, which is executed by a processing module connected to a circuit board processing equipment. After the processing module controls the circuit board processing equipment to execute a processing program, the processing module will execute the circuit board dust management method. The circuit board dust management method includes the following steps: a data acquisition step: acquiring an actual dust quantity, a manually recorded dust quantity, and a theoretical dust quantity; the actual dust quantity is the value obtained by measuring the dust recovered by a dust recovery device through a weighing device; the manually recorded dust quantity is input by the user through an input module; a first calculation step: calculating a collection rate; the collection rate is the actual dust quantity divided by the theoretical dust generation quantity; a first judgment step: judging whether the collection rate is lower than a preset collection rate; if it is judged to be lower than the preset collection rate, a corresponding alarm message is issued; wherein, the processing module executes a processing program M times on N circuit board processing equipment, and the processing module acquires N M-pen theoretical dust generation and N After M manually record the dust quantity, the processing module will perform the following steps: Second calculation step: Calculate a normalized value; the normalized value is N. The sum of the dust amounts recorded manually by M people, divided by the previous total length; the total length is the Nth length executed by the circuit board processing equipment. The total length of each circuit board cut in M ​​processing steps; a second judgment step: determine whether the normalized value exceeds ±15% of a historical normalized average value; if it exceeds, issue a corresponding alarm message; where N is a positive integer greater than 1 and M is a positive integer greater than 0.

[0008] Optionally, after obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: a standard deviation judgment step: determine whether the actual dust quantity exceeds an upper limit value or is lower than a lower limit value; the upper limit value is the historical average actual dust quantity plus 3 times the standard deviation, and the lower limit value is the historical average actual dust quantity minus 3 times the standard deviation. If the actual dust quantity is determined to exceed the upper limit value, a corresponding alarm message will be issued; if the actual dust quantity is determined to be lower than the lower limit value, a corresponding alarm message will be issued.

[0009] Optionally, the circuit board processing equipment removes one corner of the circuit board, the corner including the FR4 circuit board, copper layer, and nickel-gold layer; the processing module calculates the theoretical dust generation amount based on the following formula: M=b t Cu L ρ Cu + b t NiAu L ρ NiAu + (0.5 b hb(t Cu + t NiAu )) L ρ FR4 Where M is the theoretical dust generation, b is the width of the corner, and t is the theoretical dust generation. Cu Where L is the height of the copper layer, L is the thickness of the corner, and ρ is the thickness of the copper layer. Cu t is the density of the copper layer. NiAu ρ is the height of the nickel-gold layer. NiAu ρ is the density of the nickel-gold layer, h is the total height of the corner, and ρ is the density of the nickel-gold layer. FR4 The density of FR4.

[0010] In summary, the circuit board dust management system and circuit board dust management method of the present invention, through the design of the dust recovery device, processing module, input module, first calculation step, first judgment step, second calculation step and second judgment step, can enable relevant personnel to issue alarm information in real time when dust theft may occur in the factory, so as to notify relevant personnel.

[0011] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the functional blocks of the circuit board dust management system of the present invention.

[0013] Figure 2 This is a schematic diagram of the circuit board dust management system of the present invention.

[0014] Figure 3 This is a partial process diagram of the first embodiment of the circuit board dust management method of the present invention.

[0015] Figure 4 This is a partial process diagram of the first embodiment of the circuit board dust management method of the present invention.

[0016] Figure 5 This is a schematic diagram of the circuit board of the circuit board dust management system of the present invention.

[0017] Figure 6 This is a schematic diagram of the corner of the circuit board of the circuit board dust management system of the present invention.

[0018] Figure 7 This is a partial process diagram of the second embodiment of the circuit board dust management method of the present invention.

[0019] Figure 8 This is a partial process diagram of the second embodiment of the circuit board dust management method of the present invention. Detailed Implementation

[0020] In the following description, if a specific drawing is indicated or shown in a particular drawing, it is only to emphasize that most of the relevant content mentioned in the following description appears in that particular drawing, but does not limit the following description to refer only to that particular drawing.

[0021] Please refer to the following: Figures 1 to 6 , Figure 1 This is a schematic diagram of the functional blocks of the circuit board dust management system of the present invention. Figure 2This is a schematic diagram of the circuit board dust management system of the present invention. Figure 3 and Figure 4 These are schematic diagrams of different partial processes in the first embodiment of the circuit board dust management method of the present invention. Figure 5 This is a schematic diagram of the circuit board of the circuit board dust management system of the present invention. Figure 6 This is a schematic diagram of the corner of the circuit board of the circuit board dust management system of the present invention.

[0022] The circuit board dust management system 100 of the present invention includes: a processing module 1, a dust collection device 2, a weighing device 3, and an input module 4. The processing module 1 is, for example, an industrial computer, a server, etc., and is not limited thereto. The processing module 1 is connected to the dust collection device 2, the input module 4, and a circuit board processing equipment B. The circuit board processing equipment B can execute a processing program to cut a circuit board C. The processing module 1 can obtain information such as the number of processing programs executed by the circuit board processing equipment B, the time, and the work schedule. The circuit board processing equipment B includes, for example, a platform B1 and a processing tool B2. The platform B1 is used to hold the circuit board C, and the processing tool B2 is used to process the circuit board C. For example, the circuit board processing equipment B can be used to cut or drill holes in the circuit board C.

[0023] Dust collection device 2 is used to collect dust generated after the circuit board processing equipment B performs its processing procedure. Dust collection device 2 includes, for example, a suction pipe 21 and a collection device 22. The suction pipe 21 is provided for a user to hold and use to collect dust scattered on the circuit board processing equipment B. The collection device 22 includes, for example, a vacuum motor and a collection tank 221. The vacuum motor enables the end of the suction pipe 21 to have suction capability. The dust collected from the end of the suction pipe 21 will pass through the pipe and enter the collection tank 221.

[0024] The weighing device 3 is used to measure the weight of the dust recovered by the dust recovery device 2 and generate an actual dust quantity 31. The processing module 1 is connected to the weighing device 3, and the processing module 1 can obtain the actual dust quantity 31. In practical applications, after the user uses the dust recovery device 2 to collect the dust generated by the circuit board processing equipment B during the processing program, the dust in the recovery tank 221 can be transferred to the weighing device 3 for measurement, so that the processing module 1 can obtain the actual dust quantity 31.

[0025] In one variant embodiment, the weighing device 3 may also be integrated into the dust collection device 2, which can transmit the actual amount of dust 31 to the processing module 1 in real time based on the weight of the dust in the collection tank 221.

[0026] In one variant embodiment, the weighing device 3 includes a display for showing the actual dust quantity 31. The user can input the actual dust quantity 31 displayed on the display into the processing module 1 via an input device (e.g., keyboard, mouse, touchscreen, etc.) connected to the processing module 1.

[0027] In one embodiment, the dust recovery device 2 may also include another suction pipe, which is located near the processing tools (e.g., cutting blades, drill bits, etc.) of the circuit board processing equipment B. The suction pipe can perform dust extraction simultaneously during the processing of the circuit board C by the circuit board processing equipment B. That is, the dust recovery device 2 has two suction pipes: one is located near the processing tools to automatically extract dust generated during processing, and the other is provided for the user to hold and extract dust scattered on the processing platform.

[0028] Processing module 1 controls circuit board processing equipment B to execute a processing program, and after the circuit board processing equipment B completes the processing program, the weighing device 3 obtains the actual dust quantity 31. In practical applications, processing module 1 can directly obtain the actual dust quantity 31 from the weighing device 3 after a default time (e.g., 15 minutes, 20 minutes, etc.) after the circuit board processing equipment B completes the processing program. After obtaining the actual dust quantity 31, processing module 1 can first determine whether the difference between the actual dust quantity 31 and the historical average actual dust quantity 31 corresponding to the same processing program on the same weighing device 3 exceeds a preset difference range. If it is determined that the difference exceeds the default difference range, processing module 1 can, for example, issue a corresponding alarm message 14.

[0029] For example, suppose a standardized operating procedure in a factory requires personnel to clean the circuit board processing equipment B of dust within 5 minutes after the equipment completes its processing. In this example, if the personnel fail to clean the equipment within the specified time, the actual dust level 31 automatically obtained by the processing module 1 will likely be close to zero. Therefore, the processing module 1 can issue an alarm message 14 in real time to notify the personnel that the circuit board processing equipment B has not been cleaned.

[0030] Input module 4 is electrically connected to processing module 1. Input module 4 provides user input of user data 41 and manual recording of dust quantity 42. Input module 4 may include, for example, a touch screen, keyboard, mouse, etc., without limitation. In practical applications, before cleaning the circuit board processing equipment B using suction pipe 21, relevant personnel must, for example, input user data 41 through input module 4. After completing the dust suction operation, they must input the manual recording of dust quantity 42 through input module 4. The manually recorded dust quantity 42 referred to here is the actual dust quantity 31 measured by the weighing device 3 as observed by the user.

[0031] like Figure 3 As shown, after obtaining the theoretical dust generation amount 11 and the actual dust amount 31 corresponding to the processing program, the processing module 1 can execute the circuit board dust management method of the present invention. The circuit board dust management method includes the following steps: First calculation step S10: Calculate the collection rate 12; the collection rate 12 is the actual dust amount 31 divided by the theoretical dust generation amount 11; First judgment step S11: Determine whether the acquisition rate 12 is lower than a preset acquisition rate 13; If the sampling rate is determined to be lower than the preset sampling rate of 13, then an alarm step S12 is executed: a corresponding alarm message 14 is issued; the preset sampling rate of 13 is not less than 65%. If the sampling rate is determined to be not lower than the preset sampling rate of 13, then an end step SX is executed: the entire process is terminated.

[0032] Through the design of the first calculation step S10 and the first judgment step S11, an alarm message 14 can be issued when the collection rate 12 is lower than 65%, thereby notifying relevant personnel to check the dust collection device 2 to confirm whether the dust collection device 2 has malfunctioned.

[0033] like Figure 4 As shown, processing module 1 executes M processing programs on N circuit board processing equipment B, and processing module 1 obtains N... M-pen theoretical dust generation 11 and N After manually recording the dust quantity 42 in M-pen, the processing module 1 can execute the circuit board dust management method of the present invention, which includes the following steps: Second calculation step S20: Calculate a normalized value 15; the normalized value 15 is N. The sum of the dust amount recorded manually by M entries (42) divided by the previous total length; the total length is the result of N execution by circuit board processing equipment B. M processing steps, the sum of the lengths cut by each circuit board C; Second judgment step S21: Determine whether the normalized value 15 exceeds the range of ±15% of a historical normalized average value 16; if it exceeds, then execute an alarm step S22: issue the corresponding alarm message 14. If it does not exceed, then execute the end step SX: end the entire process.

[0034] Where N is a positive integer greater than 1, and M is a positive integer greater than 0. The historical normalized average of 16 can be set as the total average of all normalized values ​​of 15 within time intervals such as 1 month, 3 months, half a year, or one year, depending on actual needs, and there are no restrictions on this.

[0035] The first calculation step S10, the first judgment step S11, the second calculation step S20, and the second judgment step S21 described above are steps of the circuit board dust management method of the present invention. In practical applications, the processing module 1 may first execute the first calculation step S10 and the first judgment step S11, and then execute the second calculation step S20 and the second judgment step S21. Alternatively, the processing module 1 may first execute the second calculation step S20 and the second judgment step S21, and then execute the first calculation step S10 and the first judgment step S11.

[0036] like Figure 5 As shown, for example, a single circuit board processing machine B performs the same processing procedure on 100 circuit boards C in the same batch. This processing procedure involves cutting the corner C1 of each circuit board C by 3 centimeters to remove the corner C1. After the circuit board processing machine B completes 100 processing procedures, the processing module 1 will obtain 100 theoretical dust generation amounts 11 and 100 manually recorded dust amounts 42. In the second calculation step S20, the total length in the normalized value 15 is 300 (3 centimeters). 100).

[0037] Through the design of the second calculation step S20 and the second judgment step S21, it can be confirmed whether the normalized value 15 of the current processing program deviates from the historical normalized average value 16. If there is a deviation, it may indicate that the relevant equipment or data is abnormal.

[0038] like Figure 5 and Figure 6 As shown, in one embodiment, the circuit board processing equipment B removes one corner C1 of the circuit board C. Corner C1 comprises an FR4 circuit board C11 and a composite metal layer C12, which includes a copper layer and a nickel-gold layer. The processing module 1 calculates the theoretical dust generation amount I1 based on the following formula: M=b t Cu L ρ Cu + b t NiAu L ρ NiAu + (0.5 b hb(t Cu + t NiAu )) L ρ FR4 .

[0039] Where M is the theoretical dust generation amount, b is the width of corner C1, and t Cu Where L is the height of the copper layer, C1 is the thickness of the corner, and ρ is the height of the copper layer. Cu t is the density of the copper layer. NiAu ρ is the height of the nickel-gold layer. NiAu ρ is the density of the nickel-gold layer, h is the total height of corner C1, and ρ is the density of the nickel-gold layer. FR4 The density is FR4. In this embodiment, the area of ​​the composite metal layer C12 where the corner C1 is to be cut off is considered as a rectangle for calculation. The amount of dust generated can be calculated relatively accurately using the above formula. The width b is, for example, between 41 and 42 millimeters (mm). The length of the hypotenuse of the corner C1 is, for example, between 67.6 and 133.35 millimeters (mm).

[0040] Please see Figure 7 This is a partial process diagram of the second embodiment of the circuit board dust management method of the present invention. In one embodiment, after the processing module 1 obtains the actual dust quantity 31 and the manually recorded dust quantity 42, the processing module 1 can execute the circuit board dust management method of the present invention, which includes the following steps: Third calculation step S30: Calculate the book accuracy rate 17; the book accuracy rate 17 is the manually recorded dust amount 42 divided by the actual dust amount 31. Third judgment step S31: Determine whether the book accuracy rate 17 is lower than a preset book accuracy rate 18; the book accuracy rate 17 is not less than 90%; If the accuracy rate is determined to be lower than the preset book accuracy rate 18, then an alarm step S32 is executed: a corresponding alarm message 14 is issued. The alarm message 14 includes at least the user data 41 corresponding to the manually recorded dust quantity 42. If the accuracy rate is determined to be not lower than the preset book accuracy rate 18, then an end step SX is executed: the entire process is terminated.

[0041] In practice, after the third judgment step S31, if the processing module 1 issues an alarm message 14, the relevant personnel can directly obtain the user information 41 from the alarm message 14. In this way, they can check whether all the machines operated by the personnel have an accounting accuracy rate 17 of less than 90%, thereby confirming whether the personnel have a problem with inaccurate records.

[0042] Please see Figure 8 This is a partial process diagram of the second embodiment of the circuit board dust management method of the present invention. In one embodiment, after the processing module 1 obtains the actual dust quantity 31 and the manually recorded dust quantity 42, the processing module 1 can execute the circuit board dust management method of the present invention, which includes: Standard deviation judgment step S40: Determine whether the actual dust amount 31 exceeds a preset range; the upper limit of the default range is the historical average actual dust amount 31 plus 3 times the standard deviation, and the lower limit of the preset range is the historical average actual dust amount 31 minus 3 times the standard deviation.

[0043] If the actual dust amount is determined to be 31, which exceeds the preset range, then an alarm step S41 is executed: the corresponding alarm message 14 is issued. If the actual dust amount of 31 is determined to be within the preset range, then execute the termination step SX: end the overall process.

[0044] In practical applications, the historical average actual dust amount 31 can be, for example, the average of the actual dust amount 31 over the past 1 month, 3 months, 6 months, or 1 year, and can be designed according to actual needs.

[0045] As described above, in one embodiment, after the circuit board processing equipment B completes one processing program, the processing module 1 can execute all the above-mentioned process steps, namely: the first calculation step S10, the first judgment step S11, the second calculation step S20, the second judgment step S21, the third calculation step S30, the third judgment step S31, and the standard deviation judgment step S40. With this design, the actual dust amount 31 and the manually recorded dust amount 42 can be verified from four directions: the collection rate 12, the normalized value 15, the book accuracy 17, and the standard deviation. This allows the user to receive alarm information 14 in real time when the equipment or records are abnormal.

[0046] It should be noted that the circuit board dust management method of the present invention is not limited to being executed in the circuit board dust management system of the present invention. The circuit board dust management method of the present invention can also be executed by the processing module 1 connected to other circuit board processing equipment B.

[0047] In summary, the circuit board dust management system and the circuit board dust management method of the present invention, through the design of the first calculation step, the first judgment step, the second calculation step, and the second judgment step, enable relevant personnel to effectively monitor the dust generated during the processing of the circuit board C, especially the dust containing precious metals, so that relevant personnel can detect the theft of dust in real time.

[0048] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention.

Claims

1. A circuit board dust management system, characterized in that, The circuit board dust management system includes: A dust collection device for providing user operation to collect dust generated by a circuit board processing machine during a processing procedure; A processing module is used to obtain a weighing device to measure the actual amount of dust recovered by the dust recovery device; An input module electrically connected to the processing module, the input module being used to provide user input of user data and a manual record of dust quantity; After obtaining the theoretical dust generation amount and the actual dust amount corresponding to the processing program, the processing module will perform the following steps: First calculation step: Calculate a collection rate; the collection rate is the actual dust amount divided by the theoretical dust generation amount; First judgment step: Determine whether the acquisition rate is lower than a preset acquisition rate; If the sampling rate is determined to be lower than the preset sampling rate, a corresponding alarm message will be issued; the preset sampling rate is not less than 65%. The processing module executes the processing procedure M times on N circuit board processing devices, and the processing module obtains N... M's theoretical dust generation and N After the amount of dust is manually recorded by the M-pen, the processing module will perform the following steps: Second calculation step: Calculate a normalized value; the normalized value is N. The sum of the manually recorded dust amounts in M ​​strokes divided by the previous total length; the total length is the length of the circuit board processing equipment performing N... The sum of the lengths cut into each of the circuit boards in the Mth processing steps; The second judgment step is to determine whether the normalized value exceeds ±15% of a historical normalized average value; if it is determined to exceed, a corresponding alarm message is issued. Where N is a positive integer greater than 1, and M is a positive integer greater than 0.

2. The circuit board dust management system according to claim 1, characterized in that, After obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: The third calculation step: Calculate the book accuracy rate; the book accuracy rate is the manually recorded dust amount divided by the actual dust amount; The third judgment step: Determine whether the book accuracy rate is lower than a preset book accuracy rate; the book accuracy rate is not less than 90%. If the accuracy rate is determined to be lower than the preset accounting accuracy rate, a corresponding alarm message will be issued; the alarm message shall at least include the user data corresponding to the manually recorded dust amount.

3. The circuit board dust management system according to claim 2, characterized in that, After obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: The standard deviation determination step is as follows: Determine whether the actual dust amount exceeds a preset range; the upper limit of the preset range is the historical average actual dust amount plus 3 times the standard deviation, and the lower limit of the preset range is the historical average actual dust amount minus 3 times the standard deviation. If the actual dust level is determined to exceed the upper limit, a corresponding alarm message will be issued. If the actual dust level is determined to be lower than the lower limit, a corresponding alarm message will be issued.

4. The circuit board dust management system according to claim 3, characterized in that, The circuit board processing equipment removes one corner of the circuit board, the corner comprising an FR4 circuit board, a copper layer, and a nickel-gold layer; the processing module calculates the theoretical dust generation amount based on the following formula: M=b t Cu L ρ Cu + b t NiAu L ρ NiAu + (0.5 b h-b(t Cu + t NiAu )) L ρ FR4 ; Where M is the theoretical dust generation, b is the width of the corner, and t Cu Where L is the height of the copper layer, L is the thickness of the corner, and ρ is the thickness of the copper layer. Cu t is the density of the copper layer. NiAu ρ is the height of the nickel-gold layer. NiAu ρ is the density of the nickel-gold layer, h is the total height of the corner, and ρ is the density of the nickel-gold layer. FR4 The density of FR4.

5. A method for managing circuit board dust, characterized in that, The circuit board dust management method is executed by a processing module connected to a circuit board processing equipment. After the processing module controls the circuit board processing equipment to execute a processing program, the processing module will execute the circuit board dust management method, which includes the following steps: The data acquisition steps are as follows: Obtain an actual dust quantity, a manually recorded dust quantity, and a theoretical dust quantity; the actual dust quantity is the value obtained by measuring the dust recovered by a dust recovery device through a weighing device; the manually recorded dust quantity is input by the user through an input module. First calculation step: Calculate a collection rate; the collection rate is the actual dust amount divided by the theoretical dust generation amount; First judgment step: Determine whether the acquisition rate is lower than a preset acquisition rate; If the collection rate is determined to be lower than the preset collection rate, a corresponding alarm message will be issued; The processing module executes the processing procedure M times on N circuit board processing devices, and the processing module obtains N... M's theoretical dust generation and N After the amount of dust is manually recorded by the M-pen, the processing module will perform the following steps: Second calculation step: Calculate a normalized value; the normalized value is N. The sum of the manually recorded dust amounts in M ​​strokes divided by the previous total length; the total length is the length of the circuit board processing equipment performing N... The sum of the lengths cut into each of the circuit boards by the processing procedure M times; The second judgment step is to determine whether the normalized value exceeds ±15% of a historical normalized average value; if it is determined to exceed, a corresponding alarm message is issued. Where N is a positive integer greater than 1, and M is a positive integer greater than 0.

6. The circuit board dust management method according to claim 5, characterized in that, After obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: The third calculation step: Calculate the book accuracy rate; the book accuracy rate is the manually recorded dust amount divided by the actual dust amount; The third judgment step: Determine whether the book accuracy rate is lower than a preset book accuracy rate; the book accuracy rate is not less than 90%. If the accuracy rate is determined to be lower than the preset accounting accuracy rate, a corresponding alarm message will be issued; the alarm message shall at least include the user data corresponding to the manually recorded dust amount.

7. The circuit board dust management method according to claim 6, characterized in that, After obtaining the actual dust quantity and the manually recorded dust quantity, the processing module will perform the following steps: The standard deviation determination step is as follows: Determine whether the actual dust amount exceeds an upper limit or falls below a lower limit; the upper limit is the historical average actual dust amount plus three times the standard deviation, and the lower limit is the historical average actual dust amount minus three times the standard deviation. If the actual dust level is determined to exceed the upper limit, a corresponding alarm message will be issued. If the actual dust level is determined to be lower than the lower limit, a corresponding alarm message will be issued.

8. The circuit board dust management method according to claim 7, characterized in that, The circuit board processing equipment removes one corner of the circuit board, the corner comprising an FR4 circuit board, a copper layer, and a nickel-gold layer; the processing module calculates the theoretical dust generation amount based on the following formula: M=b t Cu L ρ Cu + b t NiAu L ρ NiAu + (0.5 b h-b(t Cu + t NiAu )) L ρ FR4 ; Where M is the theoretical dust generation, b is the width of the corner, and t Cu Where L is the height of the copper layer, L is the thickness of the corner, and ρ is the thickness of the copper layer. Cu t is the density of the copper layer. NiAu ρ is the height of the nickel-gold layer. NiAu ρ is the density of the nickel-gold layer, h is the total height of the corner, and ρ is the density of the nickel-gold layer. FR4 The density of FR4.