Solid state disk and electronic device

Abstract

The present disclosure provides a solid state disk and an electronic device, the solid state disk comprises a first plate, a second plate and a master control assembly, the second plate is configured with a golden finger; the second plate is arranged at the plugging area of the first plate, the total thickness of the first plate and the second plate meets a first thickness threshold, so that when the solid state disk is inserted into a target slot, the golden finger on the second plate is electrically connected with the contact terminal in the target slot; the master control assembly is arranged at the non-plugging area of the first plate, the total thickness of the master control assembly and the first plate meets a second thickness threshold, so that the overall thickness of the solid state disk meets a preset specification. The solid state disk is suitable for more size specifications of the master control assembly.

Description

Technical Field

[0001] This disclosure relates to the field of hard disk technology, and more particularly to a solid-state hard disk and an electronic device. Background Technology

[0002] Solid-state drives (SSDs) have been widely used in enterprise servers, data centers, and other scenarios due to their high performance and low latency. However, due to the constraints of the overall system structure and interface specifications, the overall physical size of SSDs is strictly limited, which in turn imposes strong constraints on the size and installation space of their internal controller chips. Summary of the Invention

[0003] This disclosure provides a solid-state drive and an electronic device to at least solve the above-mentioned technical problems existing in the prior art.

[0004] According to a first aspect of this disclosure, a solid-state drive (SSD) is provided, the SSD including a first board, a second board, and a controller assembly, wherein the second board is configured with gold fingers; The second board is disposed in the insertion area of ​​the first board, and the total thickness of the first board and the second board meets the first thickness threshold so that when the solid-state drive is inserted into the target slot, the gold fingers on the second board are electrically connected to the contact terminals in the target slot. The main control component is located in the non-plug area of ​​the first board, and the total thickness of the main control component and the first board meets the second thickness threshold so that the overall thickness of the solid-state drive meets the preset specifications.

[0005] In one embodiment, the first plate is configured with a first connection point, and the second plate is configured with a second connection point, wherein the first connection point and the second connection point correspond one-to-one and are electrically connected.

[0006] In one embodiment, the first connection point and the second connection point include a ground point, a system management bus point, a clock signal point, a reset signal point, a status indication signal point, a control signal point, and a high-speed data transmission point.

[0007] In one embodiment, the second board is soldered to the insertion area of ​​the first board via a solder bump soldering.

[0008] In one embodiment, the second board is a rigid circuit board, and the surface of the board facing away from the first board is covered with an insulating protective layer, with the contacts of the gold fingers exposed outside the insulating protective layer.

[0009] In one embodiment, the solid-state drive further includes a thermally conductive component that covers the main control component and forms thermally conductive contact with the non-plug area of ​​the first board.

[0010] In one embodiment, a receiving groove is provided in the non-plug area of ​​the first plate, and the main control component is disposed in the receiving groove.

[0011] In one embodiment, the thickness of the non-plug area of ​​the first plate is less than the thickness of the plug area of ​​the first plate.

[0012] In one embodiment, the main control component includes a main control chip, a memory chip, and a power management chip, all of which are soldered to the non-plug area of ​​the first board.

[0013] According to a second aspect of this disclosure, an electronic device is provided, which includes the solid-state drive described in the foregoing embodiments.

[0014] The solid-state drive disclosed herein, through the stacked design of the first and second boards, not only meets the standard insertion thickness requirements of the target slot, ensuring smooth insertion of the solid-state drive and achieving a stable electrical connection, but also allows for adaptive design of the first board thickness based on the actual package thickness of the controller chip. This enables the controller component to be assembled in the non-insertion area of ​​the first board without requiring package thinning, while still meeting the preset specifications of the overall solid-state drive thickness. This effectively overcomes the size limitations of controller chip selection in existing technologies and avoids problems such as increased costs, reduced reliability, and decreased production yield caused by chip thinning.

[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0016] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0017] Figure 1 A schematic diagram of the structure of a solid-state drive in related technologies is shown; Figure 2 A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 1 ; Figure 3A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 2 ; Figure 4 A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 3 ; Figure 5 A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 4 ; Figure 6 A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 5 ; Figure 7 A schematic diagram of the structure of a solid-state drive according to an embodiment of the present disclosure is shown. Figure 6 . Detailed Implementation

[0018] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0019] In related technologies, solid-state drives (SSDs) typically have top and bottom mounting spaces on their printed circuit boards (PCBs). Since the bottom mounting space is relatively ample, the main control components are generally placed on the bottom surface of the PCB. However, to meet the requirements of gold finger insertion specifications and structural strength, the thickness of the PCB must maintain a fixed standard value. This severely restricts the height of the bottom mounting space, thereby limiting the external dimensions of the main control components.

[0020] Taking an enterprise-grade solid-state drive conforming to the E3.S 1T physical specification standard as an example, such as Figure 1 As shown, the overall thickness of the PCB is limited to 7.5mm. The PCB board thickness is fixed at 1.57mm, and the remaining space is divided into a top component area (height less than 2.86mm) and a bottom component area (height less than 3.07mm). Due to the relatively ample space at the bottom, the industry typically places the main control chip in the bottom area of ​​the PCB.

[0021] However, in actual structural design, installation space must be reserved for the heat dissipation structure: after deducting the 0.8mm thickness of the heat sink and the 0.4mm thickness of the thermal grease, the effective installation height available for the main control chip is only 1.87mm. This stringent limitation means that many high-performance main control chips with package thicknesses exceeding 1.87mm cannot be directly used.

[0022] If the main control chip is thinned during packaging to meet height requirements, it will not only significantly increase packaging costs but also increase the risk of chip breakage. Furthermore, it can easily lead to signal quality degradation at the packaging level, reducing product reliability and production yield. Therefore, how to meet height constraints without thinning the main control chip, overcoming limitations in main control chip selection, and simultaneously ensuring product performance and reliability has become a pressing technical problem to be solved in this field.

[0023] A first aspect of this disclosure is to provide a solid-state drive, such as... Figure 2 and Figure 3 As shown, the solid-state drive includes a first board, a second board, and a main control assembly. The second board is equipped with gold fingers. The second board is located in the insertion area of ​​the first board. The total thickness of the first board and the second board meets a first thickness threshold so that when the solid-state drive is inserted into a target slot, the gold fingers on the second board are electrically connected to the contact terminals in the target slot. The main control assembly is located in the non-insertion area of ​​the first board. The total thickness of the main control assembly and the first board meets a second thickness threshold so that the overall thickness of the solid-state drive meets a preset specification.

[0024] The first board is the main printed circuit board of the solid-state drive (SSD), with its insertion area for mating with external slots. The non-insertion area is the functional area for housing components such as the main controller. The second board is a sub-circuit board with gold fingers, which is attached to the insertion area of ​​the first board. The main controller, the core processing unit of the SSD, is located in the non-insertion area of ​​the first board.

[0025] The main control chip in the main control component can have various package thickness specifications. Therefore, the thickness of the first board can be adaptively designed based on the actual external dimensions of the main control component, so that after the main control component is assembled in the non-plug area of ​​the first board, the total thickness of the first board and the main control component meets the second thickness threshold. The second thickness threshold is determined based on the preset overall specifications of the solid-state drive (SSD) to ensure that the overall thickness of the SSD conforms to the preset specifications, which are the physical size standards that the SSD must meet.

[0026] The target slot is a standard interface slot compatible with solid-state drives (SSDs). The thickness of the SSD's connector must match the structural parameters of the target slot: excessive thickness will prevent proper insertion, while insufficient thickness can lead to poor contact and abnormal signal transmission. Therefore, after determining the thickness of the first board based on the overall thickness requirements, the thickness of the second board can be adaptively set so that the total thickness of the two boards, when assembled in the connector area of ​​the first board, meets a first thickness threshold. This first thickness threshold is the standard connector thickness required by the target slot, ensuring that the SSD can be smoothly inserted into the target slot and that the gold fingers on the second board can achieve a stable and reliable electrical connection with the contact terminals inside the target slot.

[0027] Continuing with the example of an enterprise-grade solid-state drive conforming to the E3.S 1TB physical specification standard: If the thickness of the main control chip in the main control component is 2mm, to meet the specification constraint of a total solid-state drive thickness of 7.5mm, the thickness of the non-plug area of ​​the first board is adaptively determined after deducting the reserved dimensions for structures such as the heatsink and thermal grease. Simultaneously, to meet the 1.57mm standard plug-in thickness required by the target slot, the thickness of the second board is determined based on the thickness of the plug-in area of ​​the first board, so that the total thickness of the first and second boards combined reaches 1.57mm.

[0028] In this way, the solid-state drive can be smoothly inserted into the target slot and a reliable electrical connection can be achieved, while also meeting the specifications for the thickness of the SSD. At the same time, it is compatible with the controller chip with a thickness of 2mm, without the need for chip packaging to reduce its thickness.

[0029] This embodiment, through the superposition design of the first and second boards, not only meets the standard insertion thickness requirements of the target slot, ensuring smooth insertion of the solid-state drive and achieving a stable electrical connection, but also allows for adaptive design of the first board thickness based on the actual package thickness of the main control chip. This enables the main control component to be assembled in the non-insertion area of ​​the first board without requiring package thinning, while still meeting the preset specifications of the overall solid-state drive thickness. This effectively overcomes the size limitations of main control chip selection in existing technologies and avoids problems such as increased costs, reduced reliability, and decreased production yield caused by chip thinning.

[0030] In another embodiment of this disclosure, the first plate is configured with a first connection point, and the second plate is configured with a second connection point, wherein the first connection point and the second connection point correspond one-to-one and are electrically connected.

[0031] Specifically, the first plate has a first connection point in the area where it mates with the second plate. For example... Figure 4 The box shown. The second panel has a second connection point at a position corresponding to the first connection point, for example... Figure 5The back view is shown. Figure 5 The front view shown depicts the gold fingers on the second board. The first and second connection points are arranged in a one-to-one correspondence and interlocked to form a stable and reliable electrical connection after assembly, ensuring normal power transmission and data exchange between the second and first boards. The assembled board appears as follows... Figure 6 As shown.

[0032] In another embodiment of this disclosure, the first connection point and the second connection point include a ground point, a system management bus point, a clock signal point, a reset signal point, a status indication signal point, a control signal point, and a high-speed data transmission point.

[0033] The system features several key components: Grounding points for electrical grounding and noise suppression of the entire storage system, ensuring circuit stability; System management bus points for device status monitoring, parameter configuration, and management information exchange, meeting platform control requirements; Clock signal points for providing a synchronous clock reference for the SSDs, ensuring coordinated and orderly operation of all modules; Reset signal points for power-on and faulty reset control, improving device reliability; Status indicator signal points for feedback on device operating status and presence detection, facilitating system identification and fault diagnosis; Control signal points for transmitting read / write control and timing control commands, enabling scheduling and management of the storage workflow; and High-speed data transmission points specifically for high-speed data exchange, ensuring high-performance bandwidth for the SSDs.

[0034] Through the above-mentioned multi-type and multi-functional point layout, a complete and robust signal transmission link can be formed between the first board and the second board, ensuring that the solid-state drive can operate stably and reliably in terms of interface compatibility, control management and data transmission.

[0035] by Figure 5 Taking the layout of the connection points shown as an example, as Figure 7 As shown, the connection points specifically include: ground point (GND), system management bus related points (SMCLK, SMDAT, SMRST#), clock signal point (CLK), status indicator signal point (LED), control signal point (PERST1, PERN0, PEP0), reference clock signal point (REFCLKn1, REFCLKPn1), and multiple sets of high-speed differential data transmission points (PERN1 / PERP1, PERN2 / PERP2, PERN3 / PERP3). Through the one-to-one correspondence of these functional points, a complete power, management, control, and high-speed data transmission link can be formed between the first and second boards, ensuring the stable and reliable operation of the solid-state drive.

[0036] In another embodiment of this disclosure, the second board is soldered to the insertion area of ​​the first board via a solder bump soldering.

[0037] Specifically, pre-formed solder bumps are used as the soldering and conductive medium. During assembly, a reflow soldering process melts the solder bumps, reliably bonding the second board to the first board. This achieves a stable mechanical connection between the two circuit boards while ensuring good electrical conductivity between the first and second connection points. This connection method eliminates the need for intermediate transition components such as sockets and connectors, enabling direct interconnection between PCBs. This not only simplifies the structure and reduces the overall space occupied but also improves signal transmission quality and connection reliability. Furthermore, it allows for precise control of the total thickness of the stacked boards, ensuring they meet the thickness standards required by the target slot and further guaranteeing the compatibility of the solid-state drive.

[0038] In another embodiment of this disclosure, the second board is a rigid circuit board, and the surface of the board facing away from the first board is covered with an insulating protective layer, and the contacts of the gold fingers are exposed outside the insulating protective layer.

[0039] The second board is made of a rigid circuit board, providing sufficient structural strength and support rigidity for the gold fingers. This ensures that the solid-state drive (SSD) is not easily deformed or damaged when inserted into the slot, improving the overall structural reliability. Simultaneously, an insulating protective layer covers the surface of the second board facing away from the first board. This layer effectively isolates external electrical interference and the risk of physical short circuits, providing insulation protection for the circuitry and components on the second board. The contact area of ​​the gold fingers is exposed outside the insulating protective layer, allowing direct contact with the contact terminals in the target slot. This ensures a stable and reliable electrical connection, balancing structural strength, insulation safety, and signal transmission reliability during SSD insertion.

[0040] In another embodiment of this disclosure, the solid-state drive further includes a thermally conductive component that covers the main control component and forms a thermally conductive contact with the non-plug area of ​​the first board.

[0041] The thermal conductive component efficiently dissipates the large amount of heat generated by the main control component during high-speed operation. Through its own thermal conductivity, it quickly transfers heat to the first board and external heat dissipation structure, preventing the main control component from experiencing issues such as frequency throttling, stuttering, or even failure due to overheating, thus ensuring the continuous and stable operation of the SSD. Simultaneously, the thermal conductive component is tightly fitted to the main control component and the first board, improving heat dissipation efficiency without increasing the overall thickness of the SSD. This ensures that the SSD consistently meets the stringent size limitations imposed by specifications such as E3.S 1T, further enhancing the reliability and lifespan of the device under high-load conditions.

[0042] In another embodiment of this disclosure, a receiving groove is provided in the non-plug area of ​​the first plate, and the main control component is disposed in the receiving groove.

[0043] The first board has a receiving slot in its non-plug area, where the main control component is installed and housed. This design effectively reduces the space occupied by the main control component in the thickness direction of the solid-state drive (SSD) after assembly. Without altering the overall structural strength of the first board, it further increases the effective mounting height of the main control component, enabling compatibility with thicker main control chips and avoiding the need for chip thinning during packaging. Simultaneously, placing the main control component within the receiving slot improves the stability of the device installation and the overall structural integrity, resulting in a more uniform overall thickness of the SSD. This better meets the stringent thickness limitations of specifications such as E3.S 1T, further optimizing the product's structural layout and space utilization.

[0044] In another embodiment of this disclosure, the thickness of the non-plug area of ​​the first plate is less than the thickness of the plug area of ​​the first plate.

[0045] This embodiment employs a differentiated structural design where the thickness of the non-plug area is less than that of the plug area. This design effectively increases the available installation space for the main control components in the non-plug area, while ensuring that the plug area meets the slot thickness requirements and has sufficient structural strength. This allows for compatibility with thicker main control chips, avoiding the need for chip thinning through packaging. At the same time, it ensures that the overall size of the solid-state drive meets the strict thickness constraints of the preset standard. This improves the flexibility in selecting the main control chip and guarantees the structural reliability and interface compatibility of the product.

[0046] In another embodiment of this disclosure, the main control component includes a main control chip, a memory chip, and a power management chip, all of which are soldered to the non-plug area of ​​the first board.

[0047] By placing the main control chip, storage chip, and power management chip in the non-plug area, the installation space in this area can be fully utilized, avoiding interference with the gold fingers and second board structure in the plug area. It can also shorten the signal transmission path between the chips, improve the stability of data interaction and power supply, and facilitate unified heat dissipation management of the heat dissipation components, optimize the overall electrical performance and heat dissipation effect of the solid-state drive, and ensure reliable operation of the storage system under high load conditions.

[0048] A second aspect of this disclosure provides an electronic device including the SSD described in the above embodiments. Specifically, it can be used in various electronic devices with high requirements for storage performance, space size, and operational reliability, such as enterprise-level servers, data center storage nodes, high-end workstations, industrial control equipment, cloud computing devices, and edge computing devices. These electronic devices typically require large-capacity, high-performance storage units as the core for data storage and interaction. Simultaneously, due to limitations in their chassis structure and installation space, the size specifications of the SSD are strictly constrained. The SSD provided in this disclosure, through differentiated layout and thickness adaptation design of the first and second boards, can meet the device's storage performance requirements, be compatible with various high-performance main control chips, and adapt to the device's installation space requirements, allowing for direct assembly without additional adjustments to the device structure. Furthermore, the SSD's high reliability, stable signal transmission, and excellent heat dissipation performance can match the long-term, high-load operation scenarios of these electronic devices, effectively ensuring the overall operational stability and data security of the electronic device, further improving the comprehensive performance of the electronic device.

[0049] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this disclosure can be achieved, and this is not limited herein.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0051] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A solid-state drive, characterized in that, The solid-state drive includes a first board, a second board, and a main control component, wherein the second board is equipped with gold fingers; The second board is disposed in the insertion area of ​​the first board, and the total thickness of the first board and the second board meets the first thickness threshold so that when the solid-state drive is inserted into the target slot, the gold fingers on the second board are electrically connected to the contact terminals in the target slot. The main control component is located in the non-plug area of ​​the first board, and the total thickness of the main control component and the first board meets the second thickness threshold so that the overall thickness of the solid-state drive meets the preset specifications.

2. The solid-state drive according to claim 1, characterized in that, The first board is configured with a first connection point, and the second board is configured with a second connection point, wherein the first connection point and the second connection point correspond one-to-one and are electrically connected.

3. The solid-state drive according to claim 2, characterized in that, The first connection point and the second connection point include a ground point, a system management bus point, a clock signal point, a reset signal point, a status indication signal point, a control signal point, and a high-speed data transmission point.

4. The solid-state drive according to claim 1, characterized in that, The second board is soldered to the insertion area of ​​the first board using a solder bump soldering method.

5. The solid-state drive according to claim 1, characterized in that, The second board is a rigid circuit board, and the surface of the board facing away from the first board is covered with an insulating protective layer, and the contacts of the gold fingers are exposed outside the insulating protective layer.

6. The solid-state drive according to claim 1, characterized in that, The solid-state drive also includes a thermal conductive component, which covers the main control component and forms thermally conductive contact with the non-plug area of ​​the first board.

7. The solid-state drive according to claim 1, characterized in that, The non-plug area of ​​the first plate has a receiving groove, and the main control component is disposed in the receiving groove.

8. The solid-state drive according to claim 1, characterized in that, The thickness of the non-plug area of ​​the first plate is less than the thickness of the plug area of ​​the first plate.

9. The solid-state drive according to claim 1, characterized in that, The main control component includes a main control chip, a storage chip, and a power management chip, all of which are soldered to the non-plug area of ​​the first board.

10. An electronic device, characterized in that, The electronic device includes the solid-state drive as described in claims 1-9.

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