Solid state disk water cooling heat dissipation device

Abstract

The application belongs to the technical field of solid state disk heat dissipation, and particularly relates to a solid state disk water-cooling heat dissipation device, which comprises a metal bottom plate, a water-cooling assembly, an air-cooling assembly and a quick-release assembly. The bottom of the metal bottom plate is provided with a lower clamping groove. The water-cooling assembly comprises a water-cooling pipe and a heat dissipation fin. The water-cooling pipe comprises a water-cooling pipe body, a contact heat dissipation pipe body and a titanium ceramic composite coating. The contact heat dissipation pipe body is horizontally arranged at the bottom and is installed in the lower clamping groove. The titanium ceramic composite coating is fixed to the inner sides of the water-cooling pipe body and the contact heat dissipation pipe body, respectively. The solid state disk water-cooling heat dissipation device provided by the application can prevent calcium and magnesium ion adsorption by the compact structure of the titanium ceramic composite coating, realize physical non-stick effect, inhibit scale formation, effectively reduce scale generation, form water-cooling and air-cooling circulation heat dissipation through the water-cooling assembly and the air-cooling assembly, effectively reduce the temperature of the solid state disk, and ensure stable operation of the solid state disk.

Description

Technical Field

[0001] This invention belongs to the field of solid-state drive heat dissipation technology, and particularly relates to a solid-state drive water cooling device. Background Technology

[0002] As solid-state drives (SSDs) evolve towards higher capacities and faster read / write speeds, their heat generation during operation has increased dramatically. This is especially true for M.2 interface NVMe SSDs, whose sustained operating temperatures can reach 80-100℃, far exceeding the safe operating temperature threshold (typically ≤70℃), severely impacting read / write performance stability and lifespan. To address this issue, water-cooling systems are widely used in high-end SSD cooling applications due to their high heat dissipation efficiency and small footprint.

[0003] However, existing solid-state drive water cooling devices have the following key technical defects:

[0004] Scale buildup on water-cooling pipes leads to heat dissipation failure: Traditional water-cooling pipes are mostly made of pure copper or stainless steel. During long-term operation, calcium and magnesium ions in the circulating water will precipitate due to changes in solubility, forming dense, layered scale (mainly composed of calcium carbonate crystals). Because solid-state drive water-cooling pipes are usually designed with small diameters (≤8mm) to fit the device size, the scaling problem is more prominent. Severe scale buildup can clog the pipes, significantly reducing heat dissipation performance. At the same time, a corrosive environment can easily form under the scale, accelerating pipe wall damage and shortening the device's lifespan. Summary of the Invention

[0005] The purpose of this invention is to provide a water-cooling heat dissipation device for solid-state drives, which aims to solve the technical problem of scale buildup inside the water-cooling pipes of traditional solid-state drive water-cooling heat dissipation devices in the prior art, which leads to a decrease in heat dissipation performance.

[0006] To achieve the above objectives, the solid-state drive water cooling device provided in this embodiment of the invention includes a metal base plate, a water cooling component, an air cooling component, and a quick-release component. The metal base plate is used to contact the solid-state drive and conduct the heat emitted by the solid-state drive to the water cooling component. The water cooling component is fixed to the metal base plate and absorbs the heat on the metal base plate. The air cooling component is fixed to the water cooling component and dissipates the heat absorbed by the water cooling component. The water cooling component and the air cooling component form a water cooling and air cooling cycle for heat dissipation.

[0007] The bottom of the metal base plate is provided with a lower slot, and the water-cooling component is installed in the lower slot.

[0008] The water-cooling assembly includes water-cooling pipes and heat dissipation fins. The water-cooling pipes are fixed to the metal base plate and the heat dissipation fins, respectively. The heat dissipation fins are fixed to the metal base plate, and multiple heat dissipation fins are provided. The multiple heat dissipation fins are connected in sequence to form an upper slot. The water-cooling pipes are installed in the lower slot and the upper slot, respectively. The water-cooling pipe includes a water-cooling pipe body, a contact heat dissipation pipe body, and a titanium-ceramic composite coating. The water-cooling pipe body is installed in the upper slot and connected to the contact heat dissipation pipe body. The bottom of the contact heat dissipation pipe body is horizontally arranged and installed in the lower slot. The titanium-ceramic composite coating is fixed to the inner side of the water-cooling pipe body and the contact heat dissipation pipe body, respectively.

[0009] As an optional embodiment of the present invention, a mounting plate is fixed to the end of the metal base plate, and the quick-release assembly is disposed on the mounting plate.

[0010] As an optional embodiment of the present invention, the quick-release assembly includes quick-release bolts and washers, wherein the quick-release bolts are sequentially threaded to the washers and the mounting plate; and four quick-release assemblies are provided for both the mounting plate and the quick-release assembly.

[0011] As an optional embodiment of the present invention, the water-cooling pipe has a U-shaped body and one end is fixedly connected to the contact heat dissipation pipe body.

[0012] As an optional embodiment of the present invention, the heat dissipation fin includes a fin body, a guide groove, and a limiting hole. The fin body is fixed to the metal base plate. The guide groove is inclinedly disposed on the fin body and communicates with the limiting hole. Multiple limiting holes are arranged to overlap and form the upper slot. The heat dissipation fin is U-shaped.

[0013] As an optional embodiment of the present invention, the thickness of the titanium-ceramic composite coating is 15-30 μm.

[0014] As an optional embodiment of the present invention, the air-cooling assembly includes an air-cooling frame, an upper bolt, and a cooling fan. The air-cooling frame is detachably mounted on the heat dissipation fins via the upper bolt, and the upper bolt is sequentially threaded to the air-cooling frame and the heat dissipation fins. The cooling fan is fixed to the top side of the air-cooling frame and is mounted on one side of the heat dissipation fins.

[0015] The solid-state drive water cooling device provided in this embodiment of the invention has at least one of the following technical effects:

[0016] The solid-state drive water cooling device provided in this application uses a titanium ceramic composite coating inside the water cooler. The dense structure of the titanium ceramic composite coating can prevent the adsorption of calcium and magnesium ions, achieving a physical non-stick effect and inhibiting the formation of scale. This can effectively reduce the generation of scale. Through the water cooling component and the air cooling component, a water cooling and air cooling cycle is formed to effectively reduce the temperature of the solid-state drive and ensure the stable operation of the solid-state drive. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of a solid-state drive water-cooling heat dissipation device provided in an embodiment of the present invention.

[0019] Figure 2 This is a perspective view of a solid-state drive water-cooling heat dissipation device provided in an embodiment of the present invention.

[0020] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle.

[0021] Figure 4 This is a side view of a solid-state drive water cooling device provided in an embodiment of the present invention.

[0022] Figure 5 for Figure 4 Sectional view at the middle BB.

[0023] Figure 6 This is a perspective view of the heat dissipation fins of a solid-state drive water cooling device provided in an embodiment of the present invention.

[0024] The following are the labeling elements in the figure:

[0025] 1. Metal base plate; 2. Water-cooled assembly; 3. Air-cooled assembly; 4. Quick-release assembly; 5. Mounting plate;

[0026] 11. Lower card slot;

[0027] 21. Water cooling pipes; 22. Heat dissipation fins;

[0028] 211. Water-cooled tube body; 212. Contact heat dissipation tube body; 213. Titanium-ceramic composite coating;

[0029] 221. Upper slot; 222. Fin body; 223. Guide groove; 224. Limiting hole;

[0030] 31. Air-cooled bracket; 32. Mounting bolts; 33. Cooling fan;

[0031] 41. Quick-release bolts; 42. Washers. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0033] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0036] In one embodiment of the present invention, such as Figures 1-6As shown, a solid-state drive (SSD) water cooling device is provided, including a metal base plate 1, a water cooling component 2, an air cooling component 3, and a quick-release component 4. The metal base plate 1 is used to contact the SSD and conduct the heat emitted by the SSD to the water cooling component 2. The water cooling component 2 is fixed to the metal base plate 1 and absorbs the heat on the metal base plate 1. The air cooling component 3 is fixed to the water cooling component 2 and dissipates the heat absorbed by the water cooling component 2. The water cooling component 2 and the air cooling component 3 form a water cooling and air cooling cycle for heat dissipation.

[0037] The bottom of the metal base plate 1 is provided with a lower slot 11, and the water-cooling component 2 is installed in the lower slot 11.

[0038] The water-cooling assembly 2 includes water-cooling pipes 21 and heat dissipation fins 22. The water-cooling pipes 21 are fixed to the metal base plate 1 and the heat dissipation fins 22 are fixed to the metal base plate 1. Multiple heat dissipation fins 22 are provided and connected in sequence to form an upper slot 221. The water-cooling pipes 21 are installed in the lower slot 11 and the upper slot 221 respectively. The water-cooling pipes 21 include a water-cooling pipe body 211, a contact heat dissipation pipe body 212, and a titanium ceramic composite coating 213. The water-cooling pipe body 211 is installed in the upper slot 221 and connected to the contact heat dissipation pipe body 212. The bottom of the contact heat dissipation pipe body 212 is horizontally arranged and installed in the lower slot 11. The titanium ceramic composite coating 213 is fixed to the inner side of the water-cooling pipe body 211 and the contact heat dissipation pipe body 212 respectively.

[0039] In another embodiment of the present invention, a mounting plate 5 is fixed to the end of the metal base plate 1, and a quick-release assembly 4 is disposed on the mounting plate 5.

[0040] In another embodiment of the present invention, the quick-release assembly 4 includes a quick-release bolt 41 and a washer 42. The quick-release bolt 41 is threadedly connected to the washer 42 and the mounting plate 5 in sequence. The mounting plate 5 and the quick-release assembly 4 are each provided with four bolts.

[0041] In another embodiment of the present invention, the water-cooling pipe 21 and the water-cooling pipe body 211 are arranged in a U-shape, and one end is fixedly connected to the heat dissipation pipe body 212.

[0042] In another embodiment of the present invention, the heat dissipation fin 22 includes a fin body 222, a guide groove 223, and a limiting hole 224. The fin body 222 is fixed to the metal base plate 1. The guide groove 223 is inclinedly disposed on the fin body 222 and communicates with the limiting hole 224. Multiple limiting holes 224 are arranged to overlap and form an upper slot 221. The heat dissipation fin 22 is U-shaped.

[0043] In another embodiment of the present invention, the thickness of the titanium-ceramic composite coating 213 is 15-30 μm.

[0044] In another embodiment of the present invention, the air-cooled assembly 3 includes an air-cooled frame 31, an upper bolt 32, and a cooling fan 33. The air-cooled frame 31 is detachably mounted on the heat dissipation fins 22 by the upper bolt 32, and the upper bolt 32 is threadedly connected to the air-cooled frame 31 and the heat dissipation fins 22 in sequence. The cooling fan 33 is fixed to the top side of the air-cooled frame 31 and is mounted on one side of the heat dissipation fins 22.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A water-cooling heat dissipation device for solid-state drives, characterized in that, It includes a metal base plate, a water-cooling assembly, an air-cooling assembly, and a quick-release assembly. The metal base plate is used to contact the solid-state drive and conduct the heat emitted by the solid-state drive to the water-cooling assembly. The water-cooling assembly is fixed to the metal base plate and absorbs the heat on the metal base plate. The air-cooling assembly is fixed to the water-cooling assembly and dissipates the heat absorbed by the water-cooling assembly. The water-cooling assembly and the air-cooling assembly form a water-cooling and air-cooling circulation for heat dissipation. The bottom of the metal base plate is provided with a lower slot, and the water-cooling component is installed in the lower slot. The water-cooling assembly includes water-cooling pipes and heat dissipation fins. The water-cooling pipes are fixed to the metal base plate and the heat dissipation fins, respectively. The heat dissipation fins are fixed to the metal base plate, and multiple heat dissipation fins are provided. The multiple heat dissipation fins are connected in sequence to form an upper slot. The water-cooling pipes are installed in the lower slot and the upper slot, respectively. The water-cooling pipe includes a water-cooling pipe body, a contact heat dissipation pipe body, and a titanium-ceramic composite coating. The water-cooling pipe body is installed in the upper slot and connected to the contact heat dissipation pipe body. The bottom of the contact heat dissipation pipe body is horizontally arranged and installed in the lower slot. The titanium-ceramic composite coating is fixed to the inner side of the water-cooling pipe body and the contact heat dissipation pipe body, respectively.

2. The solid-state drive water cooling device according to claim 1, characterized in that, A mounting plate is fixed to the end of the metal base plate, and the quick-release assembly is disposed on the mounting plate.

3. The solid-state drive water cooling device according to claim 2, characterized in that, The quick-release assembly includes quick-release bolts and washers. The quick-release bolts are sequentially threaded to the washers and the mounting plate. There are four quick-release bolts on both the mounting plate and the quick-release assembly.

4. The solid-state drive water cooling device according to claim 1, characterized in that, The water-cooling pipe has a U-shaped body and one end is fixedly connected to the heat dissipation pipe body.

5. The solid-state drive water cooling device according to claim 1, characterized in that, The heat dissipation fins include a fin body, a guide groove, and a limiting hole. The fin body is fixed to the metal base plate. The guide groove is inclinedly arranged on the fin body and communicates with the limiting hole. Multiple limiting holes are arranged to overlap and form the upper slot. The heat dissipation fins are U-shaped.

6. The solid-state drive water cooling device according to claim 1, characterized in that, The thickness of the titanium-ceramic composite coating is 15-30 μm.

7. A solid-state drive water-cooling heat dissipation device according to claim 1, characterized in that, The air-cooling assembly includes an air-cooling frame, upper bolts, and a cooling fan. The air-cooling frame is detachably mounted to the heat dissipation fins via the upper bolts, and the upper bolts are sequentially threaded to the air-cooling frame and the heat dissipation fins. The cooling fan is fixed to the top side of the air-cooling frame and is located on one side of the heat dissipation fins.

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