A core-shell structure sintering aid for low-temperature conductive silver paste of heterojunction solar cells and a preparation method and application thereof

By using a core-shell structured metallic glass/silver composite powder as a sintering aid in HJT low-temperature silver paste to promote metallurgical bonding between conductive filler particles, the problem of sintering conductive fillers at low temperatures was solved, and electrode preparation with low resistivity and low cost was achieved.

CN122393048APending Publication Date: 2026-07-14FOSHAN HAOYU XINNENG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FOSHAN HAOYU XINNENG TECH CO LTD
Filing Date
2026-05-25
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

The conductive filler in the existing HJT low-temperature silver paste is difficult to form an effective sintering neck when cured at 150~250℃, resulting in high volume resistivity and high cost.

Method used

A core-shell structured metallic glass/silver composite powder is used as a sintering aid. The core is a metallic glass amorphous alloy powder, and the outer shell is a continuous silver layer. By promoting the metallurgical bonding between conductive filler particles at low temperature, the silver content is reduced while maintaining conductivity.

Benefits of technology

Achieving metallurgical bonding between conductive filler particles at low temperatures significantly reduces bulk resistivity, reduces silver usage, broadens the curing temperature window, adapts to different process requirements, reduces costs, and improves electrode contact resistivity.

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Abstract

The application discloses a core-shell structure sintering aid for a low-temperature conductive silver paste of a heterojunction solar cell, and the core-shell structure sintering aid is a core-shell structure metal glass / silver composite powder, the inner core is a metal glass amorphous alloy powder, and the outer shell is a continuous silver layer. The core-shell structure sintering aid can efficiently promote the formation of metallurgical bonding between silver powder and / or silver-coated copper powder in a low-temperature solidification condition in a small amount of addition, meanwhile, the overall conductivity of the electrode is not reduced, and the core-shell structure sintering aid is easy to disperse, and can be used for preparing a low-silver-content high-conductivity HJT low-temperature silver paste.
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