A high-efficiency heat-dissipation type anti-sulfuration resistor
By combining dual protection and heat dissipation structure, the problems of sulfidation corrosion and heat dissipation of anti-sulfidation resistors are solved, realizing all-round sealing and efficient heat dissipation of resistors, and improving the stability and life of resistors.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNUS TECH CORP
- Filing Date
- 2026-05-19
- Publication Date
- 2026-07-14
AI Technical Summary
Existing anti-sulfurization resistors face challenges in complex applications due to sulfidation corrosion and high-temperature heat dissipation, lacking comprehensive protection, which leads to reduced resistor stability and lifespan.
It adopts a dual protection structure, including an anti-sulfurization protective inner sleeve and a sealed outer sleeve, combined with a heat dissipation mechanism and heat dissipation mesh plate. It achieves synergy between heat dissipation and anti-sulfurization through thermally conductive buffer silicone, forming an all-round sealing barrier and constructing a dual heat dissipation path.
This achieves all-around sealing and efficient heat dissipation of the resistor, reduces resistance drift and heat accumulation, and extends the lifespan of the resistor.
Smart Images
Figure CN122393091A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of electronic component technology, and in particular relates to a high-efficiency heat dissipation type anti-sulfurization resistor. Background Technology
[0002] In complex application scenarios such as industrial control, automotive electronics, coastal areas, and chemical industrial parks, resistors, as the core basic components of electronic circuits, undertake key functions such as current limiting, voltage division, and load matching. Their working stability directly determines the operational reliability and service life of the entire electronic device. However, in practical applications, resistors have long faced two severe challenges: one is the problem of sulfide corrosion, and the other is the problem of high-temperature heat dissipation. The combination of the two forms a vicious cycle, which seriously affects the stability, service life, and circuit operation safety of resistors.
[0003] A search revealed Chinese Patent Publication No. CN111341509A, which discloses an anti-sulfurization chip resistor and its manufacturing method. The anti-sulfurization chip resistor includes a substrate, two front electrodes, two back electrodes, a resistive layer, a first protective layer, a second protective layer, two auxiliary electrode layers, two vacuum-deposited layers, and two electroplated layers. The resistive layer is disposed on the top surface of the substrate, and the first protective layer is above the resistive layer; the second protective layer is above the first protective layer; the two auxiliary electrode layers are respectively disposed on the two front electrodes and connected to the second protective layer on the same side; each vacuum-deposited layer is located on a side surface of the substrate; the two electroplated layers are respectively disposed on two side surfaces of the substrate and on the front and back surfaces near the side surfaces. This structure is robust and has strong sealing properties, effectively preventing the formation of interface gaps under thermal shock; it effectively resists sulfidation corrosion under harsh conditions such as high temperature, high humidity, and oil boiling, and has stronger weather resistance.
[0004] Regarding the aforementioned technologies, the inventors have discovered the following shortcomings: Existing anti-sulfurization solutions mostly protect single areas, failing to form a comprehensive protection system. They lack effective sealing and protection designs for weak points such as electrode leads and the connection between the resistive element and the substrate. These areas become the main channels for sulfide gas penetration, allowing sulfide gas to seep through gaps to the surface of the resistive element, causing aging and resistance drift. Furthermore, existing anti-sulfurization protective layers are mostly made of a single material, only capable of "blocking" sulfide gas and unable to effectively treat the trace amounts of permeated sulfide gas. Over time, sulfides accumulate inside the protective layer, gradually losing its protective performance. Additionally, existing heat dissipation bases mostly use ordinary copper, which has limited thermal conductivity and lacks a dedicated heat dissipation enhancement structure, resulting in low heat dissipation efficiency and severe heat accumulation. This not only shortens the resistor's lifespan but also exacerbates resistance drift, affecting the circuit's operational stability.
[0005] Therefore, the present invention provides a high-efficiency heat dissipation type anti-sulfurization resistor to solve the above problems. Summary of the Invention
[0006] The purpose of this invention is to provide a high-efficiency heat dissipation type anti-sulfurization resistor in order to solve the above-mentioned problems.
[0007] To achieve the above objectives, the present invention adopts the following technical solution: a high-efficiency heat dissipation type anti-sulfurization resistor, including a heat dissipation mechanism, a resistor element mechanism is provided on the upper surface of the heat dissipation mechanism, and a protective mechanism is provided on the outer surface of the resistor element mechanism.
[0008] The heat dissipation mechanism includes a heat dissipation plate, the upper surface of which is provided with a placement groove. Thermal grease is evenly applied to the inner wall of the placement groove, and an insulating thermally conductive substrate is placed and installed in the placement groove, with the insulating thermally conductive substrate in uniform contact with the thermal grease.
[0009] As a further description of the above technical solution:
[0010] Support legs are symmetrically fixedly installed on the lower surface of the heat sink, and several heat dissipation fins are uniformly fixedly installed on the lower surface of the heat sink, with the heat dissipation fins located between the support legs.
[0011] As a further description of the above technical solution:
[0012] The edges of the insulating thermally conductive substrate are flush with the upper surface edge of the heat sink, and micro thermally conductive bumps are uniformly fixedly installed at equal intervals on the upper surface of the insulating thermally conductive substrate.
[0013] As a further description of the above technical solution:
[0014] The resistive element mechanism includes a resistive body, the lower surface of which is in seamless contact with micro thermally conductive bumps on the upper surface of an insulating thermally conductive substrate, and the upper surface of the resistive body is provided with a spiral conductive texture.
[0015] As a further description of the above technical solution:
[0016] Both ends of the resistor are provided with electrode connection areas, which extend to the edges of both ends of the insulating and thermally conductive liner. Electrode lead-out pins are fixedly installed in the electrode connection areas.
[0017] As a further description of the above technical solution:
[0018] The protective mechanism includes thermally conductive buffer silicone, the lower surface of which is in close contact with the upper surface of the resistor, and the lower surface of which is provided with a spiral groove, the inner wall of which is in close contact with the surface of the spiral conductive texture.
[0019] As a further description of the above technical solution:
[0020] An anti-sulfurization protective inner sleeve is fixedly installed on the upper surface of the thermally conductive buffer silicone, and the lower surface of the anti-sulfurization protective inner sleeve is seamlessly attached to the upper surface of the thermally conductive buffer silicone.
[0021] As a further description of the above technical solution:
[0022] The four edges of the anti-sulfurization protective inner sleeve extend to the upper surface edge of the insulating and thermally conductive substrate and are in close contact with the upper surface of the insulating and thermally conductive substrate.
[0023] As a further description of the above technical solution:
[0024] An anti-sulfurization sealing jacket is fixedly installed on the outer surface of the anti-sulfurization protective inner sleeve. The anti-sulfurization sealing jacket completely covers the outer surface and surrounding sides of the resistor. The lower surface of the anti-sulfurization sealing jacket is tightly fitted to the upper surface of the heat sink.
[0025] As a further description of the above technical solution:
[0026] The upper surface and all four sides of the anti-sulfurization sealing jacket are fixedly equipped with heat dissipation mesh plates. The edges of the heat dissipation mesh plates are flush with the edges of the anti-sulfurization sealing jacket. The lower surface of the heat dissipation mesh plates is not in contact with the upper surface of the heat dissipation plate. Through holes are provided on both sides of the anti-sulfurization sealing jacket. Elastic sealing rings are fixedly installed on the inner walls of the through holes. The inner walls of the elastic sealing rings are in contact with the outer surface of the electrode lead-out pins.
[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:
[0028] 1. In this invention, a dual protection system of anti-sulfurization inner sleeve and anti-sulfurization sealing outer sleeve is adopted, combined with dual heat dissipation of heat dissipation mechanism and heat dissipation mesh plate. At the same time, heat dissipation and anti-sulfurization are synergistically achieved through thermally conductive buffer silicone. This realizes the compatibility of heat dissipation and anti-sulfurization of the resistor without the need for additional heat dissipation or anti-sulfurization accessories, which improves the overall practicality of the resistor. In addition, the overall structure of the resistor is compact, reducing the size of the resistor and making it suitable for various application scenarios such as industrial control and automotive electronics, reflecting the ease of installation of the resistor.
[0029] 2. In this invention, a dual protection system of anti-sulfurization protective inner sleeve and anti-sulfurization sealing outer sleeve is adopted, combined with an elastic sealing ring and other reinforced sealing structures to form an all-round, dead-angle-free sealing barrier. This system can not only block the penetration of sulfidation gas, but also adsorb and transform sulfidation gas through nano zinc oxide, fundamentally solving the problem of sulfidation corrosion of resistive elements and electrodes, and significantly reducing the risk of failure such as resistance drift and poor contact.
[0030] 3. In this invention, a dual heat dissipation path of "bottom conduction heat dissipation + side / top auxiliary heat dissipation" is constructed. The oxygen-free copper heat sink (with heat dissipation fins), the insulating thermally conductive substrate (with micro thermally conductive bumps), and the heat dissipation mesh structure work together. Combined with thermally conductive silicone grease and thermally conductive buffer silicone to reduce thermal resistance, the heat generated by the resistor element is quickly dissipated, effectively avoiding high temperature accumulation and greatly improving the heat dissipation efficiency of the resistor.
[0031] 4. In this invention, dual anti-sulfurization protection reduces corrosion and aging, efficient heat dissipation reduces the thermal aging rate of components, thermally conductive buffer silicone relieves thermal expansion and contraction stress, and prevents the protective layer from cracking and falling off. All materials are selected for high temperature resistance and aging resistance, which synergistically improves the long-term stability of the resistor, greatly extends its service life, and reduces equipment maintenance costs. Attached Figure Description
[0032] Figure 1 This is a three-dimensional structural diagram of a high-efficiency heat dissipation type anti-sulfurization resistor.
[0033] Figure 2 This is a schematic cross-sectional view of a high-efficiency heat dissipation type anti-sulfurization resistor.
[0034] Figure 3 This is an exploded structural diagram of a high-efficiency heat dissipation type anti-sulfurization resistor.
[0035] Figure 4 This is an exploded view of the heat dissipation mechanism in a high-efficiency heat dissipation type anti-sulfurization resistor.
[0036] Figure 5 This is a schematic diagram of the disassembled protective mechanism in a high-efficiency heat dissipation type anti-sulfurization resistor.
[0037] Figure 6 This is an exploded structural diagram of the anti-sulfurization sealing jacket and heat dissipation mesh plate in a high-efficiency heat dissipation type anti-sulfurization resistor.
[0038] Figure 7 This is a three-dimensional structural diagram of a thermally conductive buffer cover in a high-efficiency heat dissipation type anti-sulfurization resistor.
[0039] Figure 8 This is a schematic cross-sectional view of the anti-sulfurization sealing jacket in a high-efficiency heat dissipation type anti-sulfurization resistor.
[0040] Legend:
[0041] 1. Heat dissipation mechanism; 101. Heat sink plate; 102. Support leg; 103. Heat dissipation fins; 104. Thermal grease; 105. Insulating thermally conductive substrate; 106. Miniature thermally conductive bumps; 2. Protective mechanism; 201. Anti-sulfurization sealing jacket; 202. Anti-sulfurization protective inner sleeve; 203. Thermally conductive buffer silicone; 204. Spiral groove; 205. Elastic sealing ring; 3. Resistor element mechanism; 301. Resistor body; 302. Spiral conductive texture; 4. Electrode lead pin; 5. Heat dissipation mesh plate. Detailed Implementation
[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0043] In specific implementation, such as Figures 1-8 As shown, the present invention provides a technical solution: a high-efficiency heat dissipation type anti-sulfurization resistor, including a heat dissipation mechanism 1, a resistor element mechanism 3 is provided on the upper surface of the heat dissipation mechanism 1, and a protective mechanism 2 is provided on the outer surface of the resistor element mechanism 3; wherein, the heat dissipation mechanism 1 includes a heat dissipation plate 101, a placement groove is provided on the upper surface of the heat dissipation plate 101, thermally conductive grease 104 is uniformly applied on the inner wall of the placement groove, and an insulating thermally conductive substrate 105 is placed and installed in the placement groove, and the insulating thermally conductive substrate 105 is in uniform contact with the thermally conductive grease 104.
[0044] Support legs 102 are symmetrically fixedly installed on the lower surface of the heat sink 101, and several heat sink fins 103 are uniformly fixedly installed on the lower surface of the heat sink 101, with the heat sink fins 103 located between the support legs 102.
[0045] The edges of the insulating thermally conductive substrate 105 are flush with the upper surface edge of the heat sink 101, and micro thermally conductive bumps 106 are uniformly fixed on the upper surface of the insulating thermally conductive substrate 105 at equal intervals.
[0046] Specifically, by setting up the heat dissipation mechanism 1, since the lower surface of the resistor 301 is in contact with the micro thermally conductive bumps 106 on the insulating thermally conductive substrate 105, the heat will be conducted through the insulating thermally conductive substrate 105 to the thermally conductive grease 104, and then transferred to the heat sink 101. The heat sink 101 is integrally molded from oxygen-free copper material and has excellent thermal conductivity, which quickly absorbs the heat generated by the resistor 301. The heat is dissipated to the air through the heat dissipation fins 103 on the lower surface of the heat sink 101. At the same time, the thermally conductive buffer silicone 203 on the upper surface of the resistor 301 will conduct the heat to the anti-sulfurization protective inner sleeve 202, and then transfer the heat to the anti-sulfurization sealing outer sleeve 201. At this time, the heat in the anti-sulfurization sealing outer sleeve 201 is dissipated to the air through the heat dissipation mesh plate 5.
[0047] The resistor element mechanism 3 includes a resistor body 301. The lower surface of the resistor body 301 is in seamless contact with the micro thermally conductive bumps 106 on the upper surface of the insulating thermally conductive substrate 105. The upper surface of the resistor body 301 is provided with a spiral conductive texture 302.
[0048] Electrode connection areas are provided at both ends of the resistor 301, and the electrode connection areas extend to the edges of both ends of the insulating and thermally conductive liner. Electrode lead-out pins 4 are fixedly installed in the electrode connection areas.
[0049] Specifically, by setting the resistor element mechanism 3, the electrode lead-out pin 4 realizes the electrical connection between the resistor body 301 and the external circuit. When the spiral conductive texture 302 conducts electricity on the resistor body 301, the resistor body 301 itself will generate heat. The electrode lead-out pin 4 is made of tin-plated copper material, which has excellent conductivity and oxidation resistance.
[0050] The protective mechanism 2 includes a thermally conductive buffer silicone 203. The lower surface of the thermally conductive buffer silicone 203 is in close contact with the upper surface of the resistor 301. A spiral groove 204 is provided on the lower surface of the thermally conductive buffer silicone 203. The inner wall of the spiral groove 204 is in close contact with the surface of the spiral conductive texture 302.
[0051] An anti-sulfurization protective inner sleeve 202 is fixedly installed on the upper surface of the thermally conductive buffer silicone 203, and the lower surface of the anti-sulfurization protective inner sleeve 202 is seamlessly attached to the upper surface of the thermally conductive buffer silicone 203.
[0052] The edges of the anti-sulfurization protective inner sleeve 202 extend to the edge of the upper surface of the insulating and thermally conductive substrate 105 and are in close contact with the upper surface of the insulating and thermally conductive substrate 105.
[0053] An anti-sulfurization protective inner sleeve 202 is fixedly installed on its outer surface. The anti-sulfurization sealing outer sleeve 201 completely wraps around the outer surface and sides of the resistor 301. The lower surface of the anti-sulfurization sealing outer sleeve 201 is tightly attached to the upper surface of the heat sink 101.
[0054] The upper surface and all four sides of the anti-sulfurization sealing jacket 201 are fixedly equipped with heat dissipation mesh plates 5. The edges of the heat dissipation mesh plates 5 are flush with the edges of the anti-sulfurization sealing jacket 201. The lower surface of the heat dissipation mesh plates 5 is not in contact with the upper surface of the heat dissipation plate 101. Through holes are provided on both sides of the anti-sulfurization sealing jacket 201. Elastic sealing rings 205 are fixedly installed on the inner walls of the through holes. The inner walls of the elastic sealing rings 205 are in contact with the outer surface of the electrode lead-out pins 4.
[0055] Specifically, by setting up the protective mechanism 2, when protecting the resistor 301, the anti-sulfurization protective inner sleeve 202 covers the connection area between the resistor 301 and the electrode. The anti-sulfurization protective inner sleeve 202 is made of a composite material of polyimide resin and nano zinc oxide, which plays a sealing role and a sulfur adsorption role in the connection area between the resistor 301 and the electrode, and initially blocks the penetration of sulfur gas. The nano zinc oxide reacts chemically with the sulfur gas, adsorbing and converting the sulfur gas into a stable compound. Since the anti-sulfurization sealing outer sleeve 201 wraps the entire resistor body, and the anti-sulfurization sealing outer sleeve 201 is made of fluororubber, it has excellent sulfur resistance, high temperature resistance and aging resistance, and can form a strong external sealing barrier. Therefore, it forms a secondary sealing shield for the resistor body, further blocking the sulfur gas. The elastic sealing ring 205 seals the electrode lead 4 and the anti-sulfurization sealing outer sleeve 201 to prevent sulfur gas from penetrating from weak points.
[0056] Working principle: When the spiral conductive texture 302 conducts electricity on the resistor 301, the resistor 301 itself will generate heat. Since the lower surface of the resistor 301 is in contact with the micro thermally conductive bumps 106 on the insulating thermally conductive substrate 105, the heat will be conducted through the insulating thermally conductive substrate 105 to the thermally conductive grease 104, and then transferred to the heat sink 101. The heat is then dissipated into the air by the heat sink fins 103 on the lower surface of the heat sink 101.
[0057] Meanwhile, the thermally conductive buffer silicone 203 on the upper surface of the resistor 301 will conduct heat to the anti-sulfurization protective inner sleeve 202, and then transfer the heat to the anti-sulfurization sealing outer sleeve 201. At this time, the heat inside the anti-sulfurization sealing outer sleeve 201 is dissipated into the air through the heat dissipation mesh plate 5.
[0058] When protecting the resistor 301, the anti-sulfurization protective inner sleeve 202 covers the area where the resistor 301 connects to the electrode, thereby sealing and adsorbing the sulfidation in the area where the resistor 301 connects to the electrode, and initially blocking the penetration of sulfidation gas. Since the anti-sulfurization sealing outer sleeve 201 wraps around the entire resistor body, it forms a secondary sealing shield for the resistor body, further blocking the sulfidation gas. The elastic sealing ring 205 seals the electrode lead-out pin 4 and the anti-sulfurization sealing outer sleeve 201 to prevent sulfidation gas from penetrating from weak points.
[0059] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A high-efficiency heat dissipation type anti-sulfurization resistor, characterized in that: include: Heat dissipation mechanism (1), the upper surface of the heat dissipation mechanism (1) is provided with a resistor element mechanism (3), and the outer surface of the resistor element mechanism (3) is provided with a protective mechanism (2). The heat dissipation mechanism (1) includes a heat dissipation plate (101), and a placement groove is provided on the upper surface of the heat dissipation plate (101). Thermal grease (104) is uniformly applied to the inner wall of the placement groove. An insulating thermally conductive substrate (105) is placed and installed in the placement groove, and the insulating thermally conductive substrate (105) is in uniform contact with the thermal grease (104).
2. The high-efficiency heat dissipation type anti-sulfurization resistor according to claim 1, characterized in that, Support legs (102) are symmetrically fixedly installed on the lower surface of the heat sink (101), and a number of heat dissipation fins (103) are uniformly fixedly installed on the lower surface of the heat sink (101), with the heat dissipation fins (103) located between the support legs (102).
3. The high-efficiency heat dissipation type anti-sulfurization resistor according to claim 1, characterized in that, The edges of the insulating thermally conductive substrate (105) are flush with the edges of the upper surface of the heat sink (101), and micro thermally conductive bumps (106) are uniformly fixed on the upper surface of the insulating thermally conductive substrate (105) at equal intervals.
4. The high-efficiency heat dissipation type anti-sulfurization resistor according to claim 1, characterized in that, The resistive element mechanism (3) includes a resistive body (301), the lower surface of which is in seamless contact with the micro thermally conductive bumps (106) on the upper surface of the insulating thermally conductive substrate (105), and the upper surface of the resistive body (301) is provided with a spiral conductive texture (302).
5. A high-efficiency heat dissipation type anti-sulfurization resistor according to claim 4, characterized in that, Both ends of the resistor (301) are provided with electrode connection areas, which extend to the edges of both ends of the insulating thermally conductive liner. Electrode lead-out pins (4) are fixedly installed in the electrode connection areas.
6. The high-efficiency heat dissipation type anti-sulfurization resistor according to claim 1, characterized in that, The protective mechanism (2) includes thermally conductive buffer silicone (203), the lower surface of which is in close contact with the upper surface of the resistor (301), and the lower surface of which is provided with a spiral groove (204), the inner wall of which is in close contact with the surface of the spiral conductive texture (302).
7. A high-efficiency heat dissipation type anti-sulfurization resistor according to claim 6, characterized in that, An anti-sulfurization protective inner sleeve (202) is fixedly installed on the upper surface of the thermally conductive buffer silicone (203), and the lower surface of the anti-sulfurization protective inner sleeve (202) is seamlessly attached to the upper surface of the thermally conductive buffer silicone (203).
8. A high-efficiency heat dissipation type anti-sulfurization resistor according to claim 7, characterized in that, The periphery of the anti-sulfurization protective inner sleeve (202) extends to the edge of the upper surface of the insulating thermally conductive substrate (105) and is in close contact with the upper surface of the insulating thermally conductive substrate (105).
9. A high-efficiency heat dissipation type anti-sulfurization resistor according to claim 7, characterized in that, The anti-sulfurization protective inner sleeve (202) is fixedly installed with an anti-sulfurization sealing outer sleeve (201). The anti-sulfurization sealing outer sleeve (201) completely wraps the outer surface and surrounding sides of the resistor (301). The lower surface of the anti-sulfurization sealing outer sleeve (201) is tightly attached to the upper surface of the heat sink (101).
10. A high-efficiency heat dissipation type anti-sulfurization resistor according to claim 9, characterized in that, The upper surface and the four sides of the anti-sulfurization sealing jacket (201) are fixedly equipped with heat dissipation mesh plates (5). The edges of the heat dissipation mesh plates (5) are flush with the edges of the anti-sulfurization sealing jacket (201). The lower surface of the heat dissipation mesh plates (5) is not in contact with the upper surface of the heat dissipation plate (101). The two side walls of the anti-sulfurization sealing jacket (201) are provided with through holes. The inner wall of the through holes is fixedly equipped with elastic sealing rings (205). The inner wall of the elastic sealing rings (205) is fitted with the outer surface of the electrode lead-out pins (4).