A packaging jig and a packaging method for packaging a diaphragm material

Abstract

This invention discloses a packaging fixture and packaging method for encapsulating diaphragm materials. The packaging fixture includes two cover plates connected by hinges. Each cover plate has a central adsorption area with several central adsorption holes, and a peripheral adsorption area with several peripheral adsorption holes around the central adsorption area. The two cover plates are equipped with cooperating positioning pins and cover plate positioning holes. This packaging fixture and method for encapsulating diaphragm materials, through the two interlocking cover plates with central and peripheral adsorption areas of different ranges, as well as positioning pins and cover plate positioning holes, allows multiple diaphragms to be adsorbed and positioned on the two cover plates. During multiple opening and closing processes, the diaphragms are continuously stacked, enabling a single fixture to encapsulate diaphragms of different sizes. This simplifies the process steps and improves positioning accuracy and packaging consistency.

Description

Technical Field

[0001] This invention relates to the technical field of packaging equipment, and in particular to a packaging fixture and packaging method for packaging film materials. Background Technology

[0002] A proton exchange membrane fuel cell (PEMFC) is a highly efficient energy conversion device that uses hydrogen (H2) as fuel and oxygen (O2) as oxidant. It directly converts the chemical energy stored in the fuel and oxidant into electrical energy through an electrochemical reaction. When a PEMFC is operating, H2 diffuses through the gas diffusion layer to the anode catalyst layer, where it loses electrons and generates hydrogen ions (H+). At the cathode, O2 diffuses through the gas diffusion layer to the cathode catalyst layer, where it reacts with H+ and electrons to form H2O under the catalytic action of the catalyst.

[0003] The membrane electrode assembly (MEA) is the site where the catalyst reaction occurs and is the core component of a PEMFC. The MEA consists of a proton exchange membrane, a catalyst layer, and a gas diffusion layer. In MEA structures, a "five-in-one" design refers to encapsulating the CCM (proton exchange membrane coated with the catalyst layer) into a sandwich-like structure using two side-mounted membranes; a "seven-in-one" design involves encapsulating two gas diffusion layers (usually carbon paper) on both sides of the five-in-one structure (proton exchange membrane and catalyst layer).

[0004] In existing technologies, five-in-one and seven-in-one membrane electrodes are achieved using two sets of fixtures, and manual assembly requires repeatedly lifting and flipping the fixtures. When encapsulating a seven-in-one membrane electrode, the fixture uses milled grooves (milled according to the shape of carbon paper) to position the carbon paper (i.e., the gas diffusion layer). Adhesive is applied to the carbon paper or the five-in-one membrane electrode to bond the two sides of the carbon paper to the five-in-one membrane electrode, and then they are pressed and bonded to complete the seven-in-one process.

[0005] In this encapsulation process, the sheet-like carbon paper is prone to warping, resulting in inaccurate positioning during pressing and poor encapsulation consistency. The carbon paper itself acts as a gas diffusion layer; directly adsorbing and positioning the carbon paper through negative pressure leads to poor encapsulation results and the risk of inaccurate carbon paper positioning, or requires an excessively large amount of negative pressure gas, resulting in energy waste. Operationally, after dispensing and pressing, it needs to be transferred to a hot press for heating to cure the adhesive, a cumbersome process. Furthermore, the encapsulation pressing requires repeatedly lifting and flipping the fixture, increasing the workload and reducing encapsulation efficiency. The use of different fixtures for five-in-one and seven-in-one encapsulation increases the risk of inaccurate positioning, affecting the encapsulation effect. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the defects of inaccurate positioning, poor packaging consistency and cumbersome packaging process in the prior art when packaging membrane electrodes and other membranes, and to provide a packaging fixture and packaging method for packaging membrane materials.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution:

[0008] An encapsulation fixture for encapsulating diaphragm materials includes a first cover plate and a second cover plate for encapsulating a diaphragm assembly, the first cover plate and the second cover plate being connected by a hinge, and the diaphragm assembly including a first diaphragm, a second diaphragm and a third diaphragm;

[0009] The first cover plate has a first central adsorption area in the central region, and the first central adsorption area has a plurality of first central adsorption holes. The first cover plate has a first peripheral adsorption area around the first central adsorption area, and the first peripheral adsorption area has a plurality of first peripheral adsorption holes.

[0010] The second cover plate has a second central adsorption area in the central region, and the second central adsorption area has a plurality of second central adsorption holes. The second cover plate has a second peripheral adsorption area around the second central adsorption area, and the second peripheral adsorption area has a plurality of second peripheral adsorption holes.

[0011] The first central adsorption hole, the second central adsorption hole, the first peripheral adsorption hole, and the second peripheral adsorption hole are all connected to an external negative pressure source.

[0012] During assembly, the second diaphragm is adsorbed onto the first cover plate, and the first diaphragm or the third diaphragm is adsorbed onto the second cover plate; it also includes a first component adsorbed onto the first cover plate, the first component being composed of the first diaphragm and the second diaphragm;

[0013] The first cover plate and the second cover plate are provided with matching positioning pins and cover plate positioning holes.

[0014] In this solution, the two cover plates of the packaging fixture for packaging the membrane are connected by hinges, eliminating the need for the membrane to move back and forth between the separate fixtures during the packaging process. This reduces manual handling, simplifies the alignment process between the two cover plates, and improves packaging efficiency. Positioning pins and positioning holes are provided on the two cover plates to ensure accurate positioning of the adsorption holes on the two cover plates and the membrane as it is alternately adsorbed between the two cover plates (the positioning pins can be used to position the packaged material), thus improving packaging consistency. By setting central and peripheral adsorption areas with different adsorption ranges on the two cover plates, membrane materials of different sizes can be adsorbed, adapting to the packaging needs of membranes of different sizes. Specifically, by designing the distribution of several central and peripheral adsorption holes, ensuring that they adsorb at least the contours of the membranes placed in the central and peripheral adsorption areas respectively, warping of the membrane material contour edges can be effectively avoided, improving packaging consistency. Thus, multiple membranes are adsorbed and positioned on the two cover plates, and continuously stacked during multiple opening and closing processes, allowing the packaging of membranes of different sizes to be completed on a single fixture. This simplifies the process operation steps and improves positioning accuracy and packaging consistency.

[0015] Preferably, the positioning pin or the cover plate positioning hole is located in the area surrounded by the peripheral adsorption area and the central adsorption area, and at least two positioning pins or the cover plate positioning holes are located on the same side of the cover plate and are positioned corresponding to the two ends of the cover plate.

[0016] In this design, the positioning pins and cover plate positioning holes are located within the area surrounded by the peripheral and central adsorption zones. This does not affect the adsorbed membranes and maintains their integrity. Furthermore, it allows as many membranes as possible to be positioned using the positioning pins, thereby improving positioning accuracy.

[0017] Preferably, the first central adsorption region is a recessed surface that is lower than the surrounding area of ​​the first central adsorption region; and / or, the second central adsorption region is a recessed surface that is lower than the surrounding area of ​​the second central adsorption region.

[0018] In this solution, the above configuration forms a recessed structure between the first central adsorption region and / or the second central adsorption region. During encapsulation, the recessed structure is used to place the membrane, resulting in more accurate and reliable positioning.

[0019] Preferably, it also includes a heating module, which is disposed between the first central adsorption area and the first peripheral adsorption area of ​​the first cover plate, or between the second central adsorption area and the second peripheral adsorption area of ​​the second cover plate.

[0020] In this solution, the heating module described above can heat and bond the two membranes located in the central adsorption area and the peripheral adsorption area at their overlapping position to fix the two encapsulated membranes.

[0021] Preferably, the heating module is further provided with heat insulation material on the inner or outer side to prevent heat from spreading.

[0022] In this solution, the heat insulation material described above can prevent heat from spreading to the inside or outside, thus affecting the packaging quality.

[0023] Preferably, the first central adsorption pore and the first peripheral adsorption pore have different pore sizes; or the second central adsorption pore and the second peripheral adsorption pore have different pore sizes.

[0024] In this design, the central adsorption pore and the peripheral adsorption pore use different pore sizes, which can accommodate the adsorption of membranes of different materials and thicknesses. Furthermore, the magnitude of the negative pressure adsorption force can be adjusted by using different pore sizes to avoid the adsorption force being too large or too small.

[0025] An encapsulation method, the encapsulation method utilizing the encapsulation fixture described above for encapsulating a diaphragm assembly;

[0026] Includes the following steps:

[0027] S1: Configure the packaging fixture so that the adsorption range of the first cover plate and the second cover plate can cover the membrane assembly to be packaged;

[0028] S2: Place the first diaphragm on the second cover plate, place the second diaphragm on the first cover plate, and turn on the negative pressure;

[0029] S3: Rotate the hinge to close the first cover plate and the second cover plate, cover and fix the first diaphragm and the second diaphragm to form the first component;

[0030] S4: Close the negative pressure in the second cover plate, maintain the negative pressure in the first cover plate, and open the first cover plate and the second cover plate; place the third diaphragm on the second cover plate and turn on the negative pressure;

[0031] S5: Rotate the hinge to close the first cover plate and the second cover plate to cover and fix the first component and the third diaphragm to form the second component.

[0032] In this solution, the encapsulation method, through the aforementioned encapsulation fixture and steps, alternately opens or closes negative pressure adsorption on two cover plates of a single encapsulation fixture. This allows new films to be encapsulated or semi-finished products (i.e., film components that are not yet fully encapsulated) to be alternately adsorbed, and after the cover plates are closed, the film is laminated and fixed. This eliminates the need for the films to move back and forth across dispersed fixtures during the encapsulation process; instead, films of different sizes can be encapsulated on a single fixture, simplifying the process and improving encapsulation efficiency, positioning accuracy, and consistency. Furthermore, this encapsulation method, utilizing the aforementioned encapsulation fixture, is not limited to the size combination of the films; that is, it is not limited to a combination where the middle film is small and the side films are large, nor is it limited to a combination where the side films are small and the middle film is large.

[0033] Preferably, in steps S3 and S5, a heating module is further activated, wherein the heating module heats and cures the adhesive material between the first diaphragm and the second diaphragm, or the adhesive material between the first component and the third diaphragm.

[0034] In this solution, through the above steps, the heating module achieves bonding and fixing between the diaphragms by heating the overlapping material between the diaphragms to fuse or heating the adhesive.

[0035] Preferably, it also includes encapsulating a fourth diaphragm on the outer surface of the second component;

[0036] Includes the following steps:

[0037] The fourth membrane is laminated onto a base membrane that matches the first peripheral adsorption region or the second peripheral adsorption region to form a third component;

[0038] The second component is adsorbed onto the first cover plate, and the third component is placed on the second cover plate so that the third component is adsorbed by the second peripheral adsorption holes;

[0039] Rotate the hinge to close the first cover plate and the second cover plate, thereby covering and securing the second component and the third component.

[0040] Preferably, the first diaphragm, the second diaphragm, the third diaphragm, and / or the third component have diaphragm positioning holes for engaging with the positioning pin, so that when the first diaphragm, the second diaphragm, the third diaphragm, and / or the third component are adsorbed onto the cover plate, the diaphragm positioning holes engage with the positioning pin.

[0041] The positive and progressive effects of this invention are as follows: the packaging fixture and packaging method for encapsulating membrane materials, through two intersecting cover plates, with central adsorption areas and peripheral adsorption areas of different ranges on the cover plates, as well as positioning pins and cover plate positioning holes, allow multiple membranes to be adsorbed and positioned on the two cover plates, and continuously stacked during multiple opening and closing processes, so that membranes of different sizes can be packaged on a single fixture, simplifying the process operation steps and improving positioning accuracy and packaging consistency. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the packaging fixture of Embodiment 1 of the present invention.

[0043] Figure 2 This is a schematic diagram of another embodiment of the packaging fixture of Embodiment 1 of the present invention.

[0044] Figure 3 This is a schematic diagram of the internal structure of the packaging fixture in Embodiment 1 of the present invention.

[0045] Figure 4 This is a schematic diagram of the exploded structure of the membrane electrode in Embodiment 2 of the present invention.

[0046] Figure 5 This is a schematic diagram of the structure of carbon paper on side A and substrate film on side A in Embodiment 2 of the present invention.

[0047] Figure 6 This is a schematic diagram of the structure of the membrane electrode after the seven-in-one encapsulation in Embodiment 2 of the present invention.

[0048] Explanation of reference numerals in the attached figures:

[0049] Packaging fixture 100

[0050] First cover plate 110

[0051] First peripheral adsorption zone 113

[0052] First peripheral adsorption pore 114

[0053] First peripheral negative pressure chamber 115

[0054] First peripheral ventilation duct 116

[0055] Second cover plate 120

[0056] Second central adsorption region 121

[0057] Second central adsorption pore 122

[0058] Second peripheral adsorption zone 123

[0059] Second peripheral adsorption pores 124

[0060] Second central negative pressure chamber 125

[0061] Second peripheral negative pressure chamber 126

[0062] Second central ventilation duct 127

[0063] Second peripheral ventilation duct 128

[0064] Positioning pin 130

[0065] Cover plate positioning hole 140

[0066] Heating module 150

[0067] 160 heat insulation ring

[0068] Sealing groove 170

[0069] Membrane electrode 200

[0070] 210 proton exchange membrane with catalytic layer coated

[0071] A-side frame film 220

[0072] B-side frame film 230

[0073] A-side carbon paper 240

[0074] B-side carbon paper 250

[0075] A-side basement membrane 260

[0076] Diaphragm positioning hole 270 Detailed Implementation

[0077] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0078] Example 1

[0079] This embodiment provides a packaging fixture 100 for encapsulating membrane materials. The membrane materials specifically comprise the various membrane-like components that make up the membrane electrode 200. These membrane-like components include a proton exchange membrane, a catalyst layer, and a gas diffusion layer. The encapsulation process involves two stages: first, a five-in-one encapsulation, and then a seven-in-one encapsulation. Five-in-one encapsulation refers to encapsulating the proton exchange membrane 210 (CCM) coated with the catalyst layer into a sandwich-like structure using two side-mounted frame films. Seven-in-one encapsulation refers to encapsulating the two gas diffusion layers (generally carbon paper) on both sides of the five-in-one encapsulation assembly. The encapsulated seven-in-one membrane electrode 200 is used in a proton exchange membrane fuel cell and is a core component of the proton exchange membrane fuel cell. The assembly formed by coating the proton exchange membrane with catalyst layers on both sides is also called a three-in-one assembly, meaning the CCM is a three-in-one composite membrane.

[0080] like Figures 1-3 As shown, the encapsulation fixture 100 includes a first cover plate 110 and a second cover plate 120 for encapsulating a diaphragm assembly. The first cover plate 110 and the second cover plate 120 are connected by hinges. The first cover plate 110 is also referred to as the upper cover plate, and the second cover plate 120 is also referred to as the lower base plate. The upper cover plate and the lower base plate are connected by two hinges.

[0081] The diaphragm assembly includes a first diaphragm, a second diaphragm, and a third diaphragm, with the first diaphragm located between the second and third diaphragms. In this embodiment, as... Figure 4-6 As shown, the first membrane in the middle is a proton exchange membrane 210 (CCM) with catalytic layers coated on both sides. The second and third membranes are the A-side frame membrane 220 and the B-side frame membrane 230 respectively, which are coated on the two opposite surfaces of the proton exchange membrane.

[0082] In the structure of the second cover plate 120 (i.e., the lower base plate), a second central adsorption area 121 is provided in the central region, and a second peripheral adsorption area 123 is provided around the second central adsorption area 121. The size of the second central adsorption area 121 and the second peripheral adsorption area 123 can be designed according to the size of the membrane in which these two areas are placed. The second central adsorption area 121 and the second peripheral adsorption area 123 are respectively provided with two independent hollow cavities in the interlayer of the second cover plate 120, namely a second central negative pressure cavity 125 and a second peripheral negative pressure cavity 126. The two negative pressure cavities are respectively connected to an external negative pressure source through a second central air passage 127 and a second peripheral air passage 128; for example Figure 3 As shown, a sealing groove 170 is machined between the second central negative pressure chamber 125 and the second peripheral negative pressure chamber 126. A sealing ring is filled in the sealing groove 170 to separate the two negative pressure chambers. The second central adsorption region 121 has a plurality of second central adsorption holes 122 on the surface of the central negative pressure chamber. The second central adsorption holes 122 are used to adsorb CCM (proton exchange membrane 210 coated with a catalyst layer). In order to better adsorb the membrane and prevent the membrane's outline edge from warping, the distribution position of the second central adsorption holes 122 is designed so that its distribution position can at least adsorb the outline of the proton exchange membrane placed in the second central adsorption region 121. The second peripheral adsorption region 123 has a plurality of second peripheral adsorption holes 124 on the surface of the second peripheral negative pressure chamber 126. The second peripheral adsorption holes 124 are used to adsorb the border membrane. Similarly, in order to better adsorb the membrane and prevent the membrane's outline edge from warping, the distribution position of the second peripheral adsorption holes 124 is designed so that its distribution position can at least adsorb the outline of the border membrane placed in the second peripheral adsorption region 123.

[0083] In the structure of the first cover plate 110 (i.e., the upper cover plate), there is no first central adsorption area in the central region, but there is a first peripheral adsorption area 113 corresponding to the second peripheral adsorption area 123 on the second cover plate 120. A first peripheral negative pressure cavity 115 is provided in the interlayer of the first cover plate 110, and the first peripheral negative pressure cavity 115 is connected to an external negative pressure source through a first peripheral vent 116. The first peripheral adsorption area 113 has a plurality of first peripheral adsorption holes 114 on the surface of the first peripheral negative pressure cavity 115. The first peripheral adsorption holes 114 are used to adsorb the frame film. Similarly, in order to better adsorb the film and prevent the outline edge of the film from warping, the distribution position of the first peripheral adsorption holes 114 is designed so that the distribution position can at least adsorb the outline of the frame film placed in the first peripheral adsorption area 113.

[0084] The first cover plate 110 and the second cover plate 120 are provided with matching positioning pins 130 and cover plate positioning holes 140. There are a total of four pairs of positioning pins 130 and cover plate positioning holes 140, which are distributed at the four corners of the corresponding positions of the first cover plate 110 and the second cover plate 120.

[0085] The packaging fixture 100 uses hinged connections between two cover plates for packaging films, eliminating the need for the film to move back and forth within the fixture during packaging. This reduces manual handling, simplifies the alignment process between the two cover plates, and improves packaging efficiency. Positioning pins 130 and positioning holes 140 are provided on the two cover plates to ensure accurate positioning during the adsorption holes and as the film is alternately adsorbed between the two cover plates (positioning pins 130 can be used to position the packaged material), improving packaging consistency. By setting central and peripheral adsorption areas with different adsorption ranges on the two cover plates, during assembly, the second film is adsorbed onto the first cover plate 110, and the first or third film is adsorbed onto the second cover plate 120. The fixture also includes a first component adsorbed onto the first cover plate 110, which is composed of the first and second films. This component can adsorb film materials of different sizes, adapting to the packaging needs of films of different sizes. By designing the distribution of several central adsorption holes and several peripheral adsorption holes, the contours of the membrane placed in the central and peripheral adsorption areas are effectively adsorbed, thus preventing edge warping of the membrane material and improving encapsulation consistency. Multiple membranes are adsorbed and positioned on two cover plates, and continuously stacked during multiple opening and closing processes. This allows for the encapsulation of membranes of different sizes on a single fixture, simplifying the process steps and improving positioning accuracy and encapsulation consistency.

[0086] It should be noted that the number, size, and distribution of the central and peripheral adsorption holes in the first cover plate 110 and the second cover plate 120 can be adjusted according to the needs of the adsorption effect. Their distribution can not only adsorb the contour edges of the membrane, but also provide more central and peripheral adsorption holes in areas corresponding to the interior of the membrane to enhance the adsorption force and surface stability of the membrane during adsorption. Different sized membranes can also be adsorbed within the same central adsorption area, or different sized membranes can be adsorbed within the same peripheral adsorption area. In other embodiments, to facilitate adsorption operation and improve the adsorption effect, a first central adsorption area and a corresponding first central negative pressure chamber and first central adsorption holes can also be provided on the first cover plate 110.

[0087] Positioning pins 130 or cover plate positioning holes 140 are located in the area surrounded by the peripheral adsorption area and the central adsorption area. At least two positioning pins 130 or cover plate positioning holes 140 are located on the same side of the cover plate, corresponding to the positions of both ends of the cover plate. In this embodiment, the positioning pins 130 and cover plate positioning holes 140 are located in the first peripheral adsorption area 113 and the second peripheral adsorption area 123, and at the edge of the cover plate. This does not affect the membrane in the central adsorption area, and the membrane does not need to be perforated to avoid the positioning pins 130, thus maintaining the integrity of the membrane; and allowing as many membranes as possible to be positioned using the positioning pins 130. In other embodiments, depending on different encapsulation applications and different membrane materials, the positions of the positioning pins 130 and cover plate positioning holes 140 are not limited to the peripheral adsorption area, but can also be in the central adsorption area. However, in this case, the membrane located in the central adsorption area needs to be perforated to avoid the positioning pins 130.

[0088] The second central adsorption region 121 is a recessed surface lower than the surrounding area. This recessed structure is typically very shallow, matching the thickness of the membrane. During encapsulation, the recessed structure is used to place the membrane, resulting in more accurate and reliable positioning. In other embodiments, when a first central adsorption region exists, the first central adsorption region can also be processed into a recessed surface lower than the surrounding area.

[0089] In this embodiment, the first cover plate 110 is provided with a positioning pin 130 and a cover plate positioning hole 140, which are located at different positions on the first cover plate 110. The second cover plate 120 is provided with a cover plate positioning hole 140 at a position corresponding to the positioning pin 130 of the first cover plate 110, and the second cover plate 120 is provided with a positioning pin 130 at a position corresponding to the cover plate positioning hole 140 of the first cover plate 110. In other words, the first cover plate 110 has both positioning pins 130 and cover plate positioning holes 140; similarly, the second cover plate 120 also has both positioning pins 130 and cover plate positioning holes 140. When the diaphragm is attached to the first cover plate 110, the positioning pins 130 on the first cover plate 110 can be used to position the diaphragm, and when the diaphragm is attached to the second cover plate 120, the positioning pins 130 on the second cover plate 120 can also be used to position the diaphragm. In this way, during the encapsulation process, the diaphragm can be accurately positioned regardless of which cover plate it is on, and is not limited to only the first cover plate 110 or the second cover plate 120 for positioning the diaphragm. As a result, the diaphragms can be continuously stacked, improving the overall positioning accuracy.

[0090] In other embodiments, if all the positioning pins 130 are located on the same cover plate, and all the cover plate positioning holes 140 are located on another cover plate, it is not as good as the arrangement described in this embodiment, which allows for accurate positioning of the diaphragm regardless of which cover plate it is on. Preferably, at least two positioning pins 130 are respectively located at both ends of the mating surface of the first cover plate 110 and outside the first central adsorption area 121; at least two positioning pins 130 are respectively located at both ends of the mating surface of the second cover plate 120 and outside the second central adsorption area.

[0091] Furthermore, in this embodiment, the positioning pins 130 at the four corners are divided into two pairs. One pair of positioning pins 130 (i.e., two positioning pins 130) is located at a diagonal position on the first cover plate 110, outside the central adsorption area; while the other pair of positioning pins 130 is located at another diagonal position on the second cover plate 120, also outside the central adsorption area. Of course, in other embodiments, each pair of positioning pins 130 is not necessarily arranged diagonally; it can also be located at both ends of the covering surface of each cover plate, outside the central adsorption area. In this way, when the diaphragm is positioned using the positioning pins 130, both of the two opposite positions on the outer side of the diaphragm can be positioned, rather than just on one side, thereby improving positioning accuracy.

[0092] Among them, such as Figure 2As shown, the first cover plate 110 (i.e., the lower base plate) has a milled groove machined between the first central adsorption area and the first peripheral adsorption area 113 for placing the heating module 150. Alternatively, the second cover plate 120 (i.e., the upper cover plate) may have a milled groove machined between the second central adsorption area 121 and the second peripheral adsorption area 123 for placing the heating module 150. The heating module 150 is disposed between the first cover plate 110 and the first peripheral adsorption area 113, or between the second cover plate 120 and the second central adsorption area 121 and the second peripheral adsorption area 123. The heating module 150 is used to heat and cure the adhesive material between the two encapsulated films. The heating module 150 can heat the overlapping portion of the material of the two encapsulated films or the adhesive coated between the two films to fix the two films.

[0093] Furthermore, the heating module 150 is also provided with heat insulation material on its outer side, specifically a heat insulation ring 160, to prevent heat dissipation and avoid affecting the packaging quality. The heat insulation material can also be provided on the inner side of the heating module 150.

[0094] In this embodiment, the pore sizes of the first central adsorption pore and the first peripheral adsorption pore 114 are approximately the same, and the pore sizes of the second central adsorption pore 122 and the second peripheral adsorption pore 124 are also approximately the same. However, preferably, in other embodiments, depending on the material, thickness, and size of the adsorption membrane, the central adsorption pore and the peripheral adsorption pore can adopt different pore sizes to adapt to adsorb membranes of different materials and thicknesses, better avoiding membrane edge warping; and the magnitude of the negative pressure adsorption force can be adjusted by using different pore sizes to avoid the adsorption force being too large or too small. For example, since the membrane area covering the peripheral adsorption region is larger, the pore size of the peripheral adsorption pore can be larger than that of the central adsorption pore. The peripheral adsorption pore can adopt a higher negative pressure adsorption force, while the central adsorption pore can adopt a lower negative pressure adsorption force.

[0095] Example 2

[0096] This embodiment provides a packaging method that uses a packaging fixture 100 as described in Embodiment 1 to package a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second and a third diaphragm packaged on opposite surfaces of the first diaphragm.

[0097] The encapsulation method includes the following steps:

[0098] S1. Configure the packaging fixture 100 so that the adsorption range of the first cover plate 110 and the second cover plate 120 can cover and adsorb the first membrane, the second membrane and the third membrane.

[0099] S2. Place the first diaphragm on the second cover plate 120, place the second diaphragm on the first cover plate 110, and turn on the negative pressure;

[0100] S3. Rotate the hinge to close the first cover plate 110 and the second cover plate 120, so as to cover and fix the first diaphragm and the second diaphragm to form the first component;

[0101] S4. Close the negative pressure of the second cover plate 120, maintain the negative pressure in the first cover plate 110, open the first cover plate 110 and the second cover plate 120, place the third diaphragm on the second cover plate 120, and turn on the negative pressure.

[0102] S5. Rotate the hinge to close the first cover plate 110 and the second cover plate 120 to cover and fix the first component and the third diaphragm to form the second component.

[0103] The first diaphragm, the second diaphragm, and the third diaphragm have diaphragm positioning holes 270 for cooperating with the positioning pin 130, so that when the first diaphragm, the second diaphragm, and the third diaphragm are adsorbed onto the cover plate, the diaphragm positioning holes 270 and the positioning pin 130 cooperate with each other.

[0104] Specifically, such as Figures 4-6 As shown, the membrane assembly in this embodiment is a membrane electrode 200. The encapsulation of the membrane electrode 200 can be divided into two stages: first, a five-in-one encapsulation, and then a seven-in-one encapsulation. Both the five-in-one and seven-in-one encapsulations can be performed using the encapsulation method described above.

[0105] When performing the five-in-one encapsulation, the first membrane in the middle is a proton exchange membrane 210 (CCM) with catalytic layers coated on both sides. The second and third membranes are the A-side frame membrane 220 and the B-side frame membrane 230 respectively, which are coated on the two opposite surfaces of the proton exchange membrane. After encapsulation, the second component is a five-in-one membrane electrode 200. The CCM is a smaller membrane that uses a central adsorption area for adsorption, while the A-side frame membrane 220 and B-side frame membrane 230 are larger membranes that use peripheral adsorption areas for adsorption. Before encapsulation, membrane positioning holes 270 that mate with the positioning pins 130 are cut into the A-side frame membrane 220 and B-side frame membrane 230. During encapsulation, when the A-side frame membrane 220 and B-side frame membrane 230 are placed on the first cover plate 110 and the second cover plate 120 respectively, they can be positioned and fitted onto the positioning pins 130 through the membrane positioning holes 270. In this way, the A-side frame membrane 220 and B-side frame membrane 230 are positioned, and the semi-finished product "first component" generated in the intermediate process is positioned.

[0106] In the seven-in-one encapsulation process, the second component (i.e., the five-in-one membrane electrode 200) is used as the new first membrane. Carbon paper 240 on side A and carbon paper 250 on side B (the carbon paper serves as a gas diffusion layer) are laminated onto the two opposing surfaces of the five-in-one membrane electrode 200. In other words, carbon paper 240 on side A and carbon paper 250 on side B serve as the new second and third membranes, respectively. After encapsulation, a seven-in-one membrane electrode 200 is obtained. The seven-in-one membrane electrode 200 can be used in proton exchange membrane fuel cells and is a core component of proton exchange membrane fuel cells.

[0107] It should be noted that when applying the above encapsulation method, any film can be adsorbed either by the first central adsorption hole and / or the second central adsorption hole 122, or by the first peripheral adsorption hole 114 and / or the second peripheral adsorption hole 124, but the combination order of the sizes of the encapsulated films is not limited. For example, the film combination for a five-in-one package is a combination where the central CCM film is small, and the A-side border films 220 and B-side border films 230 on both sides are large; the film combination for a seven-in-one package is a combination where the central five-in-one package film is small, and the A-side carbon paper 240 and B-side carbon paper 250 on both sides are large. In other embodiments, the combination of film sizes can be arbitrary and is not limited to the film size combinations of the five-in-one and seven-in-one packages in this embodiment. The cover plate, through the central adsorption hole and / or peripheral adsorption hole, can not only adsorb films of different sizes, but also adsorb films better, so that the contour edges of the films will not warp, thereby greatly improving the consistency of the encapsulation.

[0108] The first central adsorption hole and the first peripheral adsorption hole 114 of the first cover plate 110 can be connected to the same external negative pressure source. By switching or opening / closing the pipes, the first central adsorption hole and the first peripheral adsorption hole 114 can have the same or different adsorption forces. Alternatively, the first central adsorption hole and the first peripheral adsorption hole 114 can be connected to different external negative pressure sources to generate the same or different adsorption forces according to adsorption requirements. The connection method between the second central adsorption hole 122 and the second peripheral adsorption hole 124 of the second cover plate 120 and the external negative pressure source can also adopt a negative pressure source connection method similar to that of the first cover plate 110.

[0109] This encapsulation method, through the aforementioned encapsulation fixture 100 and steps, alternately opens or closes negative pressure adsorption on the two cover plates of the encapsulation fixture 100. This allows new films to be encapsulated or semi-finished products (i.e., film components that are not yet fully encapsulated) to be alternately adsorbed, and after the cover plates are closed, the film is laminated and fixed. This eliminates the need for the films to move back and forth between dispersed fixtures during the encapsulation process; instead, films of different sizes can be encapsulated on a single fixture, simplifying the process and improving encapsulation efficiency, positioning accuracy, and encapsulation consistency. Furthermore, this encapsulation method, utilizing the aforementioned encapsulation fixture 100, is not limited to the size combination of the films; that is, it is not limited to a combination where the middle film is small and the films on both sides are large, nor is it limited to a combination where the films on both sides are small and the middle film is large.

[0110] In this embodiment, a heating module 150 is provided on the first cover plate 110 or the second cover plate 120. Therefore, in the above encapsulation method, step S3, "overlapping and fixing the first and second films," specifically includes: after the first and second films are overlapped, the heating module 150 heats and cures the adhesive material between the first and second films. The heating module 150 heats and fuses the overlapping portion of the materials of the first and second films, or the heating module 150 heats the adhesive applied to the first or second film to bond and fix the first and second films after cooling.

[0111] Step S5, "overlapping and fixing the first component and the third diaphragm," specifically includes: after the first component and the third diaphragm are overlapped, the heating module 150 heats and cures the adhesive material between the first component and the third diaphragm. The heating module 150 heats and fuses the overlapping material of the first component and the third diaphragm, or the heating module 150 heats the adhesive applied to the first component or the third diaphragm, so that the first component and the third diaphragm are bonded and fixed after cooling.

[0112] Through the above steps, the heating module 150 achieves bonding and fixing between the diaphragms by heating the overlapping materials between the diaphragms to fuse them together or by heating the adhesive.

[0113] The encapsulation method further includes: the negative pressure adsorption force of the first central adsorption hole is different from that of the first peripheral adsorption hole 114; and / or, the negative pressure adsorption force of the second central adsorption hole 122 is different from that of the second peripheral adsorption hole 124.

[0114] In this method, the central adsorption hole and the peripheral adsorption hole use different negative pressure adsorption forces, which can adapt to the differences in adsorption force requirements of membranes located in different areas, and avoid the adsorption force being too high or too low, thus affecting the accuracy of encapsulation positioning.

[0115] If the membrane assembly further includes a fourth membrane encapsulated on the outer surface of the second assembly, then the encapsulation method further includes the following steps:

[0116] The fourth membrane is laminated onto a base membrane that matches the first peripheral adsorption region 113 or the second peripheral adsorption region 123 to form a third component;

[0117] The second component is adsorbed onto the first cover plate 110, and the third component is placed on the second cover plate 120 so that the third component is adsorbed by the second peripheral adsorption hole 124.

[0118] Rotate the hinge to close the first cover plate 110 and the second cover plate 120, thereby covering and fixing the second and third components to form the fifth component.

[0119] The third component has a diaphragm positioning hole 270 for engaging with the positioning pin 130, so that when the third component is adsorbed onto the cover plate, the diaphragm positioning hole 270 and the positioning pin 130 engage with each other.

[0120] Specifically, in this embodiment, the positioning pin 130 and the positioning hole 140 on the cover plate are located near the outer edge of the peripheral adsorption area. When performing the seven-in-one encapsulation of the membrane electrode 200, since the outer dimensions of the carbon paper 240 on side A and the carbon paper 250 on side B are both smaller than the coverage area of ​​the positioning pin 130 and the positioning hole 140 on the cover plate (at this time, the carbon paper 240 on side A or the carbon paper 250 on side B serves as the fourth membrane), in order to better position the carbon paper 240 on side A and the carbon paper 250 on side B, the carbon paper 240 on side A can be pre-coated with the base film 260 on side A, and the carbon paper 250 on side B can be pre-coated with the base film on side B (not shown in the figure). Membrane positioning holes 270 that cooperate with the positioning pin 130 are cut out on both the base film 260 on side A and the base film on side B.

[0121] Both the A-side carbon paper 240 and the B-side carbon paper 250 can be encapsulated using the above method and steps. When the A-side carbon paper 240 is encapsulated using the above method, the A-side carbon paper 240 serves as the fourth film, and the component obtained by laminating the A-side carbon paper 240 with the A-side base film 260 is the third component. The fifth component is the encapsulation component of the five-in-one encapsulation component (i.e., the second component) and the A-side carbon paper 240 component (i.e., the third component composed of the A-side carbon paper 240 and the A-side base film 260). When the B-side carbon paper 250 is encapsulated using the above method, the fifth component formed on the A-side is used as a new fourth film, and the above steps are repeated. The B-side carbon paper 250 is used as the fourth film, and the B-side carbon paper 250 is laminated with the B-side base film to obtain the B-side fifth component, i.e., the seven-in-one encapsulation film electrode 200.

[0122] The base film has a slight adhesiveness, which is used to connect to the fourth membrane and ensure that the fourth membrane will not fall off, while also making it easy to remove after encapsulation.

[0123] In other embodiments, even if the carbon paper 240 on side A and / or carbon paper 250 on side B are smaller than the coverage area of ​​the positioning pin 130 and the cover plate positioning hole 140, they can be positioned by the adsorption force of the central adsorption area or other means. However, unlike the method described above, a base film is added on the basis of carbon paper 240 on side A and / or carbon paper 250, and a film positioning hole 270 is opened on the base film that matches the surrounding adsorption area to realize the positioning of the small-sized fourth film, thereby completing the encapsulation of the fourth film and the second component. The base film can be removed during use without affecting the use of the film.

[0124] It should also be noted that in other embodiments, depending on the packaged product, further packaging may be performed on one side of the second component, rather than always on both sides.

[0125] The following is a specific example of a packaging method for encapsulating five-in-one and seven-in-one film electrodes 200, including the following steps:

[0126] Encapsulated 5-in-1 film electrode 200:

[0127] S10.1. A catalytic layer is sprayed onto both sides of the proton exchange membrane to obtain the CCM;

[0128] S10.2 Cut the A-side frame film 220 and the B-side frame film 230, and cut out the film positioning holes 270;

[0129] S10.3 Place the CCM in the center area of ​​the second cover plate 120 (i.e., the lower base plate) and activate the negative pressure adsorption in the second center area of ​​the lower base plate;

[0130] S10.4 Place the A-side frame film 220 on the first cover plate 110 (i.e., the upper cover plate) and activate the first peripheral negative pressure adsorption.

[0131] S10.5. Close the upper cover plate and the lower bottom plate to shut off the second central negative pressure adsorption of the lower bottom plate;

[0132] S10.6 Open the top cover, place the B-side frame film 230 in the bottom plate, align the film positioning hole 270 of the B-side frame film 230 with the positioning pin 130, and turn on the negative pressure adsorption of the second peripheral adsorption area 123 of the bottom plate.

[0133] S10.7. Close the upper cover plate and the lower bottom plate, turn off the negative pressure between the upper cover plate and the lower bottom plate, turn on the heating module 150, and bond and solidify the frame film to obtain the encapsulated five-in-one film electrode 200.

[0134] S10.8 Turn off the heating module 150, turn on the negative pressure adsorption five-in-one membrane electrode 200 of the upper cover, and open the upper cover.

[0135] Encapsulated 7-in-1 film electrode 200:

[0136] S10.9 Cut carbon paper on both sides A and B and laminate it with the base film. The outer contour of the base film is the same as that of the frame film. The base film is cut with film positioning holes 270 that are consistent with the frame film.

[0137] S10.10 Apply adhesive to the edge of the carbon paper (i.e., the overlap between the carbon paper and the five-in-one film electrode 200);

[0138] S10.11 Place the carbon paper 240 on side A together with the base film in the bottom plate, insert the film positioning hole 270 of the base film into the corresponding positioning pin 130 of the bottom plate, and turn on the negative pressure adsorption of the bottom plate.

[0139] S10.12 Place the five-in-one membrane electrode 200 on the upper cover plate, and fit the positioning hole of the five-in-one membrane electrode 200 into the positioning pin 130 of the upper cover plate to activate the negative pressure adsorption.

[0140] S10.13. Close the upper cover plate and the lower bottom plate to shut off the negative pressure adsorption of the upper cover plate;

[0141] S10.14. Open the top cover plate, place the B-side carbon paper 250 together with the base film in the top cover plate, align the film positioning hole 270 of the base film with the positioning pin 130, and turn on the negative pressure of the top cover plate.

[0142] S10.15. Close the upper cover plate and the lower base plate, turn off the negative pressure between the upper cover plate and the lower base plate, and turn on the heating module 150 to allow the adhesive on the carbon paper to cure.

[0143] S10.16 After curing, turn off the heating module 150, open the top cover, and take out the seven-in-one membrane electrode 200.

[0144] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A packaging fixture for encapsulating diaphragm materials, characterized in that, The device includes a first cover plate and a second cover plate for encapsulating a diaphragm assembly, the first cover plate and the second cover plate being connected by a hinge, and the diaphragm assembly including a first diaphragm, a second diaphragm and a third diaphragm; The first cover plate has a first central adsorption area in the central region, and the first central adsorption area has a plurality of first central adsorption holes. The first cover plate has a first peripheral adsorption area around the first central adsorption area, and the first peripheral adsorption area has a plurality of first peripheral adsorption holes. The second cover plate has a second central adsorption area in the central region, and the second central adsorption area has a plurality of second central adsorption holes. The second cover plate has a second peripheral adsorption area around the second central adsorption area, and the second peripheral adsorption area has a plurality of second peripheral adsorption holes. The first central adsorption hole, the second central adsorption hole, the first peripheral adsorption hole, and the second peripheral adsorption hole are all connected to an external negative pressure source. During assembly, the second diaphragm is adsorbed onto the first cover plate, and the first diaphragm or the third diaphragm is adsorbed onto the second cover plate; it also includes a first component adsorbed onto the first cover plate, the first component being composed of the first diaphragm and the second diaphragm; The first cover plate and the second cover plate are provided with matching positioning pins and cover plate positioning holes.

2. The packaging fixture for encapsulating diaphragm materials as described in claim 1, characterized in that, The positioning pins or the cover plate positioning holes are located in the area surrounded by the peripheral adsorption area and the central adsorption area. At least two positioning pins or cover plate positioning holes are located on the same side of the cover plate and are positioned corresponding to the two ends of the cover plate.

3. The packaging fixture for encapsulating diaphragm materials as described in claim 2, characterized in that, The first central adsorption region is a recessed surface that is lower than the surrounding area of ​​the first central adsorption region; and / or, the second central adsorption region is a recessed surface that is lower than the surrounding area of ​​the second central adsorption region.

4. The packaging fixture for encapsulating diaphragm materials as described in claim 1, characterized in that, It also includes a heating module, which is disposed between the first central adsorption area and the first peripheral adsorption area of ​​the first cover plate, or between the second central adsorption area and the second peripheral adsorption area of ​​the second cover plate.

5. The packaging fixture for encapsulating diaphragm materials as described in claim 4, characterized in that, The heating module is also provided with heat insulation material on its inner or outer side to prevent heat from spreading.

6. The packaging fixture for encapsulating diaphragm materials as described in claim 1, characterized in that, The first central adsorption pore and the first peripheral adsorption pore have different pore sizes; or the second central adsorption pore and the second peripheral adsorption pore have different pore sizes.

7. A packaging method, characterized in that, The encapsulation method utilizes an encapsulation fixture for encapsulating diaphragm materials as described in any one of claims 1-6 for encapsulating diaphragm assemblies; Includes the following steps: S1: Configure the packaging fixture so that the adsorption range of the first cover plate and the second cover plate can cover the membrane assembly to be packaged; S2: Place the first diaphragm on the second cover plate, place the second diaphragm on the first cover plate, and turn on the negative pressure; S3: Rotate the hinge to close the first cover plate and the second cover plate, cover and fix the first diaphragm and the second diaphragm to form the first component; S4: Close the negative pressure in the second cover plate, maintain the negative pressure in the first cover plate, and open the first cover plate and the second cover plate; place the third diaphragm on the second cover plate and turn on the negative pressure; S5: Rotate the hinge to close the first cover plate and the second cover plate, so as to cover and fix the first component and the third diaphragm to form the second component.

8. The packaging method as described in claim 7, characterized in that, In steps S3 and S5, the heating module is activated, and the heating module heats and cures the adhesive material between the first diaphragm and the second diaphragm, or the adhesive material between the first component and the third diaphragm.

9. The packaging method as described in claim 7, characterized in that, It also includes encapsulating a fourth diaphragm on the outer surface of the second component; Includes the following steps: The fourth membrane is laminated onto a base membrane that matches the first peripheral adsorption region or the second peripheral adsorption region to form a third component; The second component is adsorbed onto the first cover plate, and the third component is placed on the second cover plate so that the third component is adsorbed by the second peripheral adsorption holes; Rotate the hinge to close the first cover plate and the second cover plate, thereby covering and securing the second component and the third component.

10. The packaging method as described in claim 9, characterized in that, The first diaphragm, the second diaphragm, the third diaphragm, and / or the third component have diaphragm positioning holes for cooperating with the positioning pin, so that when the first diaphragm, the second diaphragm, the third diaphragm, and / or the third component are adsorbed onto the cover plate, the diaphragm positioning holes cooperate with the positioning pin.

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