Module edge interface assembly positioning
By using a mechanical interference design with reference pillars and positioning ridges between the housing and the PCB, the problem of inaccurate positioning of signal contacts in high data rate applications is solved, improving electrical and mechanical performance and meeting industry standards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- MOLEX INC
- Filing Date
- 2026-01-14
- Publication Date
- 2026-07-14
Smart Images
Figure CN122393653A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the positioning of module edge interface components, specifically, to cable components. Background Technology
[0002] The volume of data processed by computers, computing systems, and computing environments continues to increase. For example, a data center can include hundreds of computing and networking systems interconnected using fiber optic cables, copper cables, and various connectors, cable assemblies, and terminals. These interconnections have high and ever-increasing data throughput. As an example, many data centers contain combinations of 10 Gigabit Ethernet (10GbE), 25GbE, 50GbE, and 100GbE network interfaces and interconnects. 200GbE, 400GbE, and 800GbE interconnect technologies are also under development and deployment. Other interconnect solutions rely on 56 Gbps, 112Gb / s, and 224Gb / s interconnect technologies, and interconnect technologies are being developed to support even higher data rates. A range of cable assemblies are available for data interconnection. Depending on the requirements of the data communication environment using connectors, multiple designs exist for each cable assembly. Summary of the Invention
[0003] The following summarizes certain aspects of the concepts and embodiments described herein. These aspects are representative and not exhaustively listed. In alternative embodiments, certain features and elements may be added, omitted, and interchanged with each other. Furthermore, those skilled in the art can make variations, extensions, and modifications to the exemplary embodiments without departing from the concepts to cover equivalent and related structures.
[0004] This paper describes new components and assembly techniques for positioning signal contacts on card edges or PCB-type tip interfaces with improved accuracy. This concept can be applied to SFP modules, and an example SFP module incorporating the technique for precise signal contact positioning is described herein. However, it should be understood that this concept can be extended to a wide range of cable assemblies, termination assemblies, and other components used for data communication.
[0005] An example cable assembly includes a housing having a datum pillar. The datum pillar includes a locating ridge extending from its outer surface. The cable assembly also includes a printed circuit board (PCB) positioned within the housing. The PCB includes an interlocking recess. When the PCB is positioned within the housing, the datum pillar occupies an open space within the interlocking recess of the PCB. The locating ridge of the datum pillar exerts mechanical interference toward the peripheral edge of the interlocking recess of the PCB. In one aspect, the PCB includes rows of contacts, the rows of contacts including signal contacts and ground contacts, the signal contacts in the rows including a front contact edge, and the locating ridge of the datum pillar defining the positioning of the front contact edge of the signal contact relative to a reference surface of the datum pillar.
[0006] In one example, the locating ridge includes an angled center edge and a vertical center edge. The vertical center edge extends upward from the housing's mounting surface, and the angled center edge extends at an angle from the vertical center edge to the surface of the reference post. In another example, the locating ridge includes an angled center edge and a vertical center surface. In some examples, the reference post may also include a centering buffer extending from the outer surface of the reference post.
[0007] In other aspects, the housing also includes an upper housing shell and a lower housing shell, and the lower housing shell includes a bottom wall and side walls extending perpendicular to the bottom wall. A reference post may be positioned along one of a plurality of side walls of the lower housing shell. In one example, the reference post is a first reference post positioned along a first side wall of the housing, and a positioning ridge extends from the outer surface of the first reference post. The housing may also include a second reference post positioned along a second side wall of the housing, and a second positioning ridge extends from the outer surface of the second reference post.
[0008] In other aspects, the housing also includes an upper housing shell and a lower housing shell, and the lower housing shell includes a bottom wall and side walls extending perpendicular to the bottom wall. A reference post may be positioned along one of a plurality of side walls of the lower housing shell. In one example, the reference post is a first reference post positioned along a first side wall of the housing, and a positioning ridge is a first positioning ridge extending from the outer surface of the first reference post. The housing may also include a second reference post, and a buffer may extend from the outer surface of the second reference post.
[0009] In other aspects, the interlocking notch of the PCB may be a first interlocking notch positioned along a first peripheral edge of the PCB. The PCB may include a second interlocking notch positioned along a second peripheral edge of the PCB. The first positioning ridge and the second positioning ridge may be used to position the PCB relative to the housing based on the mechanical interference between the first positioning ridge and the first interlocking notch and the mechanical interference between the second positioning ridge and the second interlocking notch.
[0010] In other aspects, the interlocking notch of the PCB may be a first interlocking notch positioned along the outer edge of the PCB. The PCB may include a second interlocking notch positioned along the outer edge of the PCB. The first and second positioning ridges may be used to position the PCB relative to the housing based on the mechanical interference between the first positioning ridge and the first interlocking notch, and the mechanical interference between the second positioning ridge and the buffer.
[0011] Another example cable assembly includes: a housing having a reference surface and a positioning ridge; and a PCB positioned within the housing. The positioning ridge can position the PCB relative to the reference surface of the housing based on contact between the positioning ridge and the peripheral edge of the PCB. In one example, the PCB includes signal contacts, and the positioning ridge can position the front contact edge of the signal contacts relative to the reference surface. In one case, the positioning ridge may include an angled center edge and a vertical center edge. The vertical center edge may extend upward from the mounting surface of the housing, and the angled center edge may extend from the vertical center edge at an angle. In another example, the positioning ridge includes an angled center edge and a vertical center surface.
[0012] Another example cable assembly includes: a housing having a positioning ridge and a centering buffer; and a PCB positioned within the housing. The positioning ridge and centering buffer can be used to position the PCB relative to the housing based on the peripheral edge of the PCB and the contact between the positioning ridge and the centering buffer. The PCB includes signal contacts, and the positioning ridge can position the front contact edge of the signal contacts relative to a reference surface of the housing. Attached Figure Description
[0013] Many aspects of this disclosure can be better understood by referring to the following accompanying drawings. The components in the drawings are not necessarily drawn to scale, but rather the emphasis is on clearly illustrating the principles of this disclosure. Furthermore, in the drawings, similar reference numerals denote corresponding parts in several views.
[0014] Figure 1A A perspective view of one end of a cable assembly according to various aspects of this disclosure is shown.
[0015] Figure 1B Several aspects of this disclosure are shown. Figure 1A The diagram shows a perspective view of the cable assembly, with the housing unfolded.
[0016] Figure 2A Several aspects of this disclosure are shown. Figure 1A The diagram shows a perspective view of the front end of the cable assembly module, with the upper housing omnipresent.
[0017] Figure 2B Several aspects of this disclosure are shown. Figure 1AThe image shows a top view of the front end of the cable assembly, with the upper housing omnipresent.
[0018] Figure 3 Several aspects of this disclosure are shown. Figure 1A The top view of the front end of the PCB in the cable assembly shown.
[0019] Figure 4A and Figure 4B Several aspects of this disclosure are shown. Figure 1A A detailed view of one side of the lower housing of the cable assembly shown.
[0020] Figure 4C and Figure 4D Several aspects of this disclosure are shown. Figure 1A A detailed view of the other side of the lower housing of the cable assembly shown.
[0021] Figure 5 A detailed view of another example of a positioning ridge of a housing according to several aspects of this disclosure is shown.
[0022] Figure 6 Several aspects of this disclosure are shown. Figure 2B A cross-sectional view of the cable assembly indicated by AA.
[0023] Figure 7 Several aspects of this disclosure are shown. Figure 1A Another example of the cable assembly shown is the lower housing. Detailed Implementation
[0024] The amount of data processed by computers, computing systems, and computing environments continues to increase. For example, a data center can include hundreds of computing and networking systems interconnected using fiber optic cables, copper cables, and various connectors, cable assemblies, and terminals between them.
[0025] Small Form-factor Pluggable (SFP) module format is a compact, hot-pluggable network interface module format used for data interconnection, and SFP modules are commonly used for interconnection in data centers. An SFP interface on a computing or networking system is a modular slot for media-specific transceivers, such as fiber optic or copper cable assemblies. Cable assemblies may include SFP pluggable transceiver modules at one or both ends of copper, fiber optic, or other types of interconnect cables. SFP pluggable transceiver modules can be inserted into SFP interfaces for data interconnection.
[0026] A range of SFP pluggable transceiver modules are currently available, including Small Form Factor Pluggable Dual Density (SFP-DD), Compact Small Form Factor Pluggable (cSFP), SFP+, Quad Small Form Factor Pluggable (QSFP), Quad Small Form Factor Pluggable Dual Density (QSFP-DD), and Eight-Channel Small Form Factor Pluggable (OSFP). SFP pluggable transceiver modules typically include one or more printed circuit boards (PCBs), with one or more semiconductor circuit devices or chips and other circuitry mounted to the PCB. Active cable (AEC) assemblies may include one or more SFP pluggable transceiver modules at the free ends of cables or cable bundles. AEC assemblies may include PCBs and semiconductor chips for signal retiming, noise reduction, signal integrity improvement, and other functions. Other types of cable assemblies, including passive cable assemblies, may also include PCBs located within the housing of the pluggable module.
[0027] Within the context of the above overview, this paper describes novel methods, components, and assembly techniques for positioning signal contacts on card edges or PCB-type tip interfaces with improved accuracy. This concept can be applied to SFP modules, and this paper describes an example SFP module incorporating techniques for precise signal contact positioning. However, it should be understood that this concept can be extended to a wide range of cable assemblies, termination assemblies, and other components used for data communication.
[0028] The example cable assembly includes a housing having a reference post positioned along a side wall of the housing. The reference post includes a positioning ridge extending from its outer surface. A PCB in the cable assembly includes an interlocking recess. The reference post of the housing may occupy an open space within the interlocking recess of the PCB, and the positioning ridge of the reference post may set or determine the positioning of the PCB relative to the housing. The positioning ridge may set the positioning of the PCB based on mechanical interference between the positioning ridge and the peripheral edge of the interlocking recess of the PCB. The positioning ridge may also set the positioning of the front contact edge of a signal contact on the front edge of the PCB.
[0029] Switch to the attached image. Figure 1A A perspective view of one end of the cable assembly 100 is shown. Figure 1B A perspective view of cable assembly 100 is shown, with the housing of cable assembly 100 unfolded. Cable assembly 100 is representative, not drawn to any particular size or scale, and is shown to provide an example of a module incorporating features for precisely positioning signal contacts on a PCB. Cable assembly 100 is not intended to be limited to any particular style or type of cable or cable assembly. As described herein, the concept of precisely positioning signal contacts on a PCB is not limited to use with SFP modules. This concept can rely on a wide range of cable assemblies, termination assemblies, and other components for data communication.
[0030] Cable assembly 100 includes a pluggable transceiver module 102 (also referred to as "module 102") at one end of a cable bundle 104. Cable assembly 100 is an example of an AEC or related type of cable assembly. Module 102, described in further detail below, is also representative, and the concepts described herein can be applied to a range of pluggable modules, including SFP, OSFP, SFP-DD, cSFP, SFP+, QSFP, QSFP-DD, and other types of pluggable modules.
[0031] exist Figure 1A and Figure 1B Referring to the preceding text, module 102 includes a housing or module enclosure that surrounds multiple components, such as PCB 130, one or more semiconductor chips and other circuitry mounted on PCB 130, and other components. Module 102 in Figure 1A and Figure 1B The example shown is for illustration purposes. In other cases, additional housings of the related module may enclose two or more PCBs and other components, and the concepts described herein can be extended to other types of modules and related components. Figure 1A and Figure 1B In this design, the housing includes an upper housing shell 112 and a lower housing shell 114. The upper housing shell 112 and the lower housing shell 114 may be embodied in or formed of a metal or metal alloy, but may also rely on other types of materials. In one example, the upper housing shell 112 and the lower housing shell 114 may be embodied in die-cast zinc, zinc alloy, or other metals or metal alloys, and in some cases may be electroplated. The housing of module 102 may be formed using any suitable additive or subtractive manufacturing technique, including cutting, stamping, bending, molding, injection molding, printing, and other techniques.
[0032] Cable bundle 104 includes multiple cables having signal conductors, ground conductors, and / or drain conductors. In one example, cable bundle 104 includes multiple biaxial or twin-strand cables 105 (also referred to as “cables 105”). In some cases, cable bundle 104 may be embodied by cables other than twin-strand cables, including twisted-pair cables, shielded twisted-pair cables, single-conductor cables, shielded single-conductor cables, single-conductor coaxial cables, and other types of cables. Each of cables 105 may include a pair of signal conductors surrounded by dielectric insulators or insulating materials, a shield, one or more drain or ground conductors, and a sheath. The signal conductors of cable 105 may be electrically coupled and terminated to signal and drain contact pads on PCB 130. The ground or drain conductors of cable 105 may also be electrically coupled and terminated to ground contact pads or surface areas of PCB 130.
[0033] PCB 130 may be embodied as a printed circuit board comprising a laminated stack of metal layers and dielectric insulating material or a similar substrate. One or more semiconductor chips and other circuit components may be electrically coupled to and mounted on PCB 130. Circuit components may be electrically interconnected with each other via metal traces on PCB 130. PCB 130 includes a PCB-type tip or card edge interface located at the front edge 132 of PCB 130. Data signals carried on cable 105 may be routed (transmitted) on the metal traces of PCB 130, between semiconductor chips and other circuit components on PCB 130 for signal processing, and to and from the card edge interface at the front edge 132 of PCB 130 via a row of contacts 134. The row of contacts 134 extends toward the front edge 132 on the top surface of PCB 130. The row of contacts 134 may include high-speed signal contacts, low-speed signal contacts, power contacts, drain or ground contacts, and combinations of other contacts. PCB 130 may also include another row of contacts, similar to contact row 134, extending on the bottom surface of PCB 130.
[0034] Module 102 includes a front port end and a cable opening end. A longitudinal axis "L" extends from the front port end of module 102 to the cable opening end. The longitudinal axis "L" also extends from the front port end of module 102 to the cable opening end along the upper housing 112, the lower housing 114, and the PCB 130. A cable bundle 104 extends from the cable opening end of module 102. The front edge 132 of the PCB 130 extends from the front port end of module 102. As described above, the pluggable module 102 is an example of an SFP module, and module 102 can be inserted into a port (not shown) for data communication with another computing or networking device. The front port end of module 102 can be inserted into this port. An electrical connection can be established between a mating connector within this port and a row of contacts 134 at the front edge 132 of the PCB 130.
[0035] Designing and assembling module 102 with relatively high precision and tight tolerances may be important, especially if module 102 is used in high data rate applications. Newer industry standard specifications for high data rate SFP modules can define tolerances for the position of the contacts in contact row 134 based on electrical, mechanical, or related performance requirements for such data rates. As an example, the position of the contacts in contact row 134 relative to the mating connector within the port when module 102 is inserted into a port can be defined by industry standards and is important for high data rate communication. As an example standard specification, the position of the signal contacts in contact row 134 can be specified between the leading edge of the contact and one or more reference surfaces of the housing, as described in further detail below.
[0036] The lower housing 114 includes a bottom wall 115 and side walls 116 and 118. The side walls 116 and 118 extend in a direction perpendicular to the bottom wall 115 (and in separate planes). Figure 1B As shown, a reference post 140 is positioned at one end of sidewall 116 facing the front port of module 102. A reference post 150 is also positioned at one end of sidewall 118 facing the front port of module 102. In other embodiments, the size, shape, and position of reference posts 140 and 150 may vary compared to the illustrated embodiment. In addition to reference posts 140 and 150, the lower housing 114 may also include other reference posts at other locations. The positions of the contacts in the contact row 134 of PCB 130 may be specified between the leading edge of the contact and the reference surface 141 of reference post 140 and the reference surface 151 of reference post 150, as described in further detail below. Reference posts 140 and 150, the positioning ridges on reference posts 140 and 150, the centering buffers on reference posts 140 and 150, and other features of module 102 are designed to precisely ensure the position of the contact row 134 of PCB 130, as described in further detail below. Positioning ridges, centering buffers, and other features can be formed on a combination of reference posts 140 and 150 and other reference posts of the lower housing 114. A series of different examples are described below.
[0037] Figure 2A It shows Figure 1A The diagram shows a perspective view of the front end of module 102 of the cable assembly 100, with the upper housing 112 omitted. Figure 2B A top view of the front end of module 102 is shown, omitting the upper housing 112. Therefore, Figure 2A and Figure 2B A PCB 130 and a lower housing 114 are shown. The lower housing 114 includes a bottom wall 115 and side walls 116 and 118. A reference post 140 is positioned at one end of side wall 116 facing the front port end of module 102. As an example, reference post 140 may be integrally formed with side wall 116 as part of side wall 116, although reference post 140 may also be a separate component of module 102. A reference post 150 is also positioned at one end of side wall 118 facing the front port end of module 102. As an example, reference post 150 may be integrally formed with side wall 118 as part of side wall 118, although reference post 150 may also be a separate component of module 102. In other embodiments, the size, shape, number, and position of reference posts 140 and 150 are different from those of other reference posts 102. Figure 2A The embodiments shown may vary.
[0038] PCB 130 is positioned and secured within the lower housing housing 114 of the enclosure. Figure 2A In the example shown, one or more semiconductor chips and other circuit components are mounted on and electrically coupled to PCB 130. PCB 130 includes a PCB-type tip or card edge interface located at the front edge 132 of PCB 130. Data signals can be routed through PCB 130 and travel to and from the card edge interface at the front edge 132 of PCB 130 via a row of contacts 134. The row of contacts 134 extends toward the front edge 132 on the top surface 133A of PCB 130. The row of contacts 134 may include high-speed signal contacts, low-speed signal contacts, power contacts, drain or ground contacts, and combinations of other contacts. The row of contacts 134 is depicted as a representative example. The concepts described herein can be applied to accurately set or control the position of the row of contacts 134; however, for other types and styles of pluggable modules, cable assemblies, terminal assemblies, and related components for data communication, the concepts can be relied upon to accurately position other rows of contacts, including larger and smaller rows.
[0039] Contacts 135-138 on PCB 130 are... Figure 2A and Figure 2B The following is a separate reference as an example contact of contact row 134. Contacts 135 and 138 are examples of ground or drain contacts in contact row 134. Contacts 136 and 137 are examples of signal contacts in contact row 134. Differential signals can be electrically communicated through signal contacts 136 and 137. Compared to signal contacts 136 and 137, ground contacts 135 and 138 can be relatively longer in the direction of the longitudinal axis "L", such that ground contacts 135 and 138 can electrically contact the terminal pin in the mating connector before signal contacts 136 and 137. PCB 130 may also include another contact row similar to contact row 134, which is located on the bottom surface 133B of PCB 130 (see...). Figure 6 Extending upwards.
[0040] PCB 130 includes one or more interlocking notches formed along each side or side edge. See below for reference. Figures 4A-4DThe interlocking notch of PCB 130 is described in more detail. Reference posts 140 and 150 of the lower housing 114 may occupy open space within the interlocking notch of PCB 130 (e.g., mating within the open space). The size and position of the interlocking notch may substantially conform to the geometry of reference posts 140 and 150. Mechanical interference between reference posts 140 and 150 and PCB 130 can accurately set or determine the position of contact row 134 relative to the housing of module 102. More specifically, mechanical interference between the edge of the interlocking notch of PCB 130 and the locating ridges of reference posts 140 and 150 can set the position of contacts in contact row 134 relative to reference surface 141 of reference post 140 and reference surface 151 of reference post 150. In other embodiments, such as those referenced below… Figure 7 In the described implementation, the additional reference post of the lower housing can occupy the open space within other interlocking recesses of PCB 130 or similar PCB.
[0041] The position of one or more signal contacts (such as one or both of signal contacts 136 and 137) can be set relative to reference surfaces 141 and 151 based on mechanical interference. The leading edge of one or both of signal contacts 136 and 137 can be precisely set... Figure 2B The distance “D1” shown is a measurement based on mechanical interference between the reference surfaces 141 of reference post 140 and 151 of reference post 150 and the leading edges of signal contacts 136 and 137 to meet industry standard specifications or other standards. In other cases, a specified distance similar to D1 can be measured between the reference surfaces 141 and 151 and the trailing edges of contacts 136 and 137. As a different example, the position of one or more ground or drain contacts (such as ground contacts 135 and 138) relative to reference surfaces 141 and 151 can be set. In this case, the leading edge of one or both of the ground contacts 135 and 138 can be precisely set as distance “D2”, which is a measurement between the reference surfaces 141 and 151 and the leading edges of ground contacts 135 and 138. Alternatively, a specified distance similar to D2 can be measured between the reference surfaces 141 and 151 and the trailing edges of ground contacts 135 and 138. Other dimensional specifications between the surface of the housing of module 102 and the leading or trailing edge of the contacts in the contact row 134 can also be designed based on the concepts described herein.
[0042] PCB 130 can be manufactured with relatively tight tolerances. The housing of module 102 (including lower housing 114) can also be manufactured with relatively tight tolerances. However, PCB 130 should be accurately positioned within lower housing 114 to keep the value of "D" within a certain range. Therefore, the locating ridges 160 and 170 of the reference posts 140 and 150 can help ensure the accurate position of PCB 130 within lower housing 114. When PCB 130 is placed and assembled into lower housing 114, the locating ridges 160 and 170 can press against the edges of the interlocking recesses of PCB 130, thereby accurately setting the position of PCB 130 relative to lower housing 114. Furthermore, the leading edges of contacts 136 and 137 in the contact row 134 can be accurately set to a distance "D" from the reference surfaces 141 and 151 of reference posts 140 and 150. (Refer to below) Figure 4A and Figure 4B The positioning ridges 160 and 170 and the interlocking notch of PCB 130 are described in more detail.
[0043] Figure 3 A top view of the front end of PCB 130 is shown. Figure 3 As best shown, PCB 130 includes an interlocking recess 120 formed along its peripheral side edge 133C. PCB 130 may also include an interlocking recess 122 formed along its peripheral side edge 133D. The dimensions, shape, and location of the interlocking recesses 120 and 122 are as follows: Figure 3 The examples provided are representative. PCBs based on the concepts described herein may include other types, styles, shapes, and sizes of interlocking notches for positioning purposes, consistent with the concepts described herein.
[0044] An open space or area is provided within each interlocking recess 120 and 122. This is provided when the PCB 130 is positioned and assembled into the lower housing housing 114 (see...). Figure 2AThe reference pillars 140 and 150 of the lower housing 114 occupy spaces within the interlocking recesses 120 and 122, respectively. The interlocking recess 120 is defined by a side edge 133C of the PCB 130. The positioning edge 121 of the interlocking recess 120 is part of the peripheral side edge 133C of the PCB 130. Similarly, the interlocking recess 122 is defined by a side edge 133D of the PCB 130. The positioning edge 123 of the interlocking recess 122 is part of the peripheral side edge 133D of the PCB 130. The positioning ridges 160 and 170 of the reference pillar 140 and 150 can be pressed against the positioning edges 121 and 123 of the interlocking recesses 120 and 122 of the PCB 130, respectively, to accurately position the PCB 130 relative to the lower housing 114. Positioning ridges 160 and 170 also prevent translation of PCB 130 when module 102 is inserted into or removed from external connector.
[0045] Figure 4A It shows Figure 2B The top view of detail diagram AA shown, and Figure 4B It shows Figure 2B The 3D view of detail diagram AA shown. Figure 4A and Figure 4B PCB 130 is omitted from the view so that positioning ridge 160 can be shown. Figure 4A and Figure 4B The positioning ridge 160 is depicted as an example, and in other embodiments and as described below, the size, shape, and style of the positioning ridge 160 may vary. The positioning ridge 160 may be formed as an angled material ridge extending outward from the surface of the reference post 140. The positioning ridge 160 extends outward from the rear surface 143 of the reference post 140. The rear surface 143 of the reference post 140 intersects with the reference surface 141 of the reference post 140 (see reference surface 141). Figure 2A It extends in a parallel plane.
[0046] Reference post 140 includes mounting surfaces 144 and 146. When PCB 130 is assembled in module 102, the bottom surface of PCB 130 can rest on mounting surfaces 144 and 146 of reference post 140, as well as other surfaces provided by lower housing housing 114. Positioning ridge 160 extends upward from mounting surface 144 to a height “H”. Positioning ridge 160 includes a vertical (or substantially vertical) center edge 161 extending upward from mounting surface 144 and an angled center edge 162 extending at an angle from vertical center edge 161 to rear surface 143 of reference post 140. The width of positioning ridge 160 can increase from its outermost front edge (where positioning ridge 160 may be narrower) to rear surface 143 of reference post 140 (where positioning ridge 160 may be wider).
[0047] exist Figure 4A and Figure 4B The positioning ridge 160 is shown as an example. In other embodiments, the size, shape, and style of the positioning ridge 160 may vary. As an example, the height "H" of the positioning ridge 160 may vary compared to that shown. The height "H" of the positioning ridge 160 may be selected to determine the degree of mechanical interference between the PCB 130 and the positioning ridge 160. The height "H" of the positioning ridge 160 may be selected to control whether the positioning ridge 160 interferes (e.g., contacts) with all layers of the PCB 130 along the positioning edge 121 of the interlocking notch 120 from the bottom surface to the top surface of the PCB 130, as referenced below. Figure 5 The shape of the positioning ridge 160 can also vary compared to that shown. The positioning ridge 160 can be formed with a more rounded or even flat outer surface, instead of the relatively narrow outer edges of the vertical center edge 161 and the angled center edge 162. (Refer to below) Figure 5 An example positioning ridge with a flat outer surface is described. The position of positioning ridge 160 may also vary compared to that shown. Positioning ridge 160 may be positioned at other locations on the rear surface 143 of reference post 140.
[0048] The reference column 140 also includes a centering buffer 180, such as Figure 4B As shown in the diagram, the centering buffer 180 can be formed as a rounded, semi-circular material ridge extending outward from the side surface of the reference post 140. The centering buffer 180 may include a rounded ridge 181 extending upward from the mounting surface 146 and an angled edge 182 extending at an angle from the rounded ridge 181 to the side surface of the reference post 140. The centering buffer 180 can help to center the PCB 130 within the housing of the module 102, as described in further detail below.
[0049] Figure 4C It shows Figure 2B The top view of detail diagram BB shown, and Figure 4D It shows Figure 2B The detailed image shown is a 3D view of BB. Figure 4C and Figure 4D PCB 130 is omitted from the view so that positioning ridge 170 can be shown. Figure 4C and Figure 4D The positioning ridge 170 is depicted as an example, and in other embodiments and as described below, the size, shape, and style of the positioning ridge 170 may vary. The positioning ridge 170 may be formed as an angled material ridge extending outward from the surface of the reference post 150. The positioning ridge 170 extends outward from the rear surface 153 of the reference post 150. The rear surface 153 of the reference post 150 intersects with the reference surface 151 of the reference post 150 (see reference surface 151). Figure 2AIt extends in a parallel plane.
[0050] The reference pillar 150 includes mounting surfaces 154 and 156. When the PCB 130 is assembled in module 102, the bottom surface of the PCB 130 can rest on the mounting surfaces 154 and 156 of the reference pillar 150, as well as other surfaces provided by the lower housing housing 114. A positioning ridge 170 extends upward from the mounting surface 154 to a height “H”. The positioning ridge 170 includes a vertical (or substantially vertical) center edge 171 extending upward from the mounting surface 154 and an angled center edge 172 extending at an angle from the vertical center edge 171 to the rear surface 153 of the reference pillar 150. The width of the positioning ridge 170 can increase from the outer edges of the vertical center edge 171 and the angled center edge 172 (where the positioning ridge 170 may be narrower) to the rear surface 153 of the reference pillar 150 (where the positioning ridge 170 may be wider).
[0051] exist Figure 4C and Figure 4D The positioning ridge 170 is shown as an example. In other embodiments, the size, shape, and style of the positioning ridge 170 can vary. As an example, the height "H" of the positioning ridge 170 can vary compared to that shown. The height "H" of the positioning ridge 170 can be selected to determine the degree of mechanical interference between the PCB 130 and the positioning ridge 170. The height "H" of the positioning ridge 170 can be selected to control whether the positioning ridge 170 interferes (e.g., contacts) with all layers of the PCB 130 along the positioning edge 123 of the interlocking notch 122 from the bottom surface to the top surface of the PCB 130. The shape of the positioning ridge 170 can also vary compared to that shown. The positioning ridge 170 can be formed with a more rounded or even flat outer surface, rather than a relatively narrow outer edge with a vertical center edge 171 and an angled center edge 172. Refer below. Figure 5 An example positioning ridge with a flat outer surface is described. The position of positioning ridge 170 may also vary compared to that shown. Positioning ridge 170 may be positioned at other locations on the rear surface 153 of reference post 150.
[0052] As described above, the locating ridges 160 and 170 of the reference posts 140 and 150 help ensure the accurate positioning of the PCB 130 within the lower housing 114. When the PCB 130 is positioned on the mounting surfaces 144, 146, 154, and 156 of the lower housing 114, the locating ridges 160 and 170 can press against the locating edges 121 and 123 of the interlocking recesses 120 and 122, respectively. This mechanical interference accurately sets the position of the PCB 130 relative to the lower housing 114. Furthermore, the leading edges of the contacts 136 and 137 in the contact row 134 can be accurately set to a distance “D” from the reference surface 141 of the reference post 140 and the reference surface 151 of the reference post 150, such as... Figure 2A and Figure 2B As shown.
[0053] The reference column 150 also includes a centering buffer 190, such as Figure 4D As shown in the diagram. The centering buffer 190 can be formed as a rounded semi-circular material ridge extending outward from the side surface of the reference post 150. The centering buffer 190 may include a rounded ridge 191 extending upward from the mounting surface 156 and an angled edge 192 extending at an angle from the rounded ridge 191 to the side surface of the reference post 150. Centering buffer 180 (see...) Figure 4B ) and 190 can help to center the PCB 130 within the housing of module 102.
[0054] Figure 5 A detailed view of another example of a positioning ridge 200 is shown. Figure 5 The positioning ridge 200 is depicted as an example, and in other embodiments, the size, shape, and style of the positioning ridge 200 may vary. The positioning ridge 200 may be relied upon as an alternative to one or both of the positioning ridges 160 and 170 in the housing of module 102. Figure 5 In the example shown, positioning ridge 200 is an alternative to positioning ridge 170 and is part of reference post 150. Positioning ridge 200 is formed as an angled material ridge extending outward from the surface of reference post 150. Positioning ridge 200 extends outward from the rear surface 153 of reference post 150.
[0055] The positioning ridge 200 extends upward from the mounting surface 154 to a height "H". The height "H" of the positioning ridge 200 can be greater than... Figure 4DThe locating ridge 170 shown may be higher or larger, although the height “H” of the locating ridge 200 may vary. The locating ridge 200 includes a vertical (or substantially vertical) center surface 201 extending upward from the mounting surface 154 and an angled center edge 202 extending at an angle from the vertical center surface 201 to the rear surface 153 of the reference post 150. The locating ridge 200 may be narrower at the vertical center surface 201 and wider at the rear surface 153 of the reference post 150.
[0056] In some cases, the vertical center surface 201 of the positioning ridge 200 can be superior to Figure 4D The positioning ridge 170 shown has a narrower, sharper corner at its vertical center edge 171. Additionally, the height "H" of the positioning ridge 200 can be selected to control whether the positioning ridge 200 contacts all layers of the PCB 130. The shape of the positioning ridge 200 can also vary compared to what is shown. For example, the vertical center surface 201 can be formed with a rounded surface instead of a flat surface. The positioning ridge 200 can also be positioned at other locations on the rear surface 153 of the reference pillar 150.
[0057] Figure 6 It shows Figure 2B The cross-sectional view is indicated by AA. (See figure.) Figure 6 As shown, the bottom surface 133B of PCB 130 rests on the mounting surface 144 of reference post 140 and other surfaces provided by the lower housing 114. The positioning ridge 160 includes a vertical center edge 161 extending vertically (e.g., substantially perpendicular to the mounting surface) upward from the mounting surface 144. The positioning ridge 160 also includes an angled center edge 162 extending at an angle from one end of the vertical center edge 161 to the rear surface 143 of reference post 140. The positioning ridge 160 contacts and presses against the interlocking recess 120 of PCB 130 (see [link to relevant documentation]). Figure 3 On the positioning edge 121, to accurately set the position of PCB 130 relative to the lower housing 114.
[0058] The dimensions of the positioning ridge 160 can be varied. For example, the height "H" of the positioning ridge 160 can vary compared to what is shown. The height "H" of the positioning ridge 160 can be selected to determine the degree of contact between the PCB 130 and the positioning ridge 160. The height "H" of the positioning ridge 160 can also be selected to control whether the positioning ridge 160 interferes with (e.g., contacts) all layers of the PCB 130. Figure 5In the example shown, the height "H" of the positioning ridge 160 is chosen such that the positioning ridge 160 contacts the bottom surface 133B of the PCB 130 and some internal layers of the PCB 130, but the positioning ridge 160 does not contact or intersect with the top surface 133A of the PCB 130. In some cases, avoiding contact with both the top surface 133A and the bottom surface 133B of the PCB 130 may be helpful in preventing delamination of the PCB 130.
[0059] Figure 7 It shows the use of Figure 1A Another example of the cable assembly 100 shown is a lower housing 114A. The lower housing 114A includes a bottom wall 115A and side walls 116A and 118A. A reference post 140A is positioned along side wall 116A toward the front end of the lower housing 114A, and another reference post 142A is positioned further rearward along side wall 116A. A reference post 150A is also positioned along side wall 118A toward the front end of the lower housing 114A, and another reference post 152A is positioned further rearward along side wall 118A. In some cases, the lower housing 114A may include other reference posts at other locations besides reference posts 140A, 142A, 150A, and 152A. The PCB may be designed with interlocking recesses corresponding to the positions, shapes, dimensions, etc., of the reference posts 140A, 142A, 150A, and 152A, consistent with the concepts described herein.
[0060] Reference post 150A includes a centering buffer 180A, and reference post 152A includes a positioning ridge 160A. The centering buffer 180A is similar to... Figure 4A and Figure 4B The centering buffer 180 of the lower housing 114 is shown. The positioning ridge 160A is also similar. Figure 4A and Figure 4B The positioning ridge 160 is shown. However, compared to the lower housing 114, the centering buffer 180A and the positioning ridge 160A can extend downwards to the bottom wall 115A of the lower housing 114A because the lower housing 114A does not include the mounting surfaces 144 and 146 of the lower housing 114. Additionally, the reference post 150A includes the centering buffer 180A on one side but does not include any positioning ridge on either side. The reference post 152A includes the positioning ridge 160A on one side but does not include any centering buffer on either side. Although in Figure 7 It is not visible in the middle, but reference post 140A includes a centering buffer, and reference post 142A includes a positioning ridge.
[0061] Compared to the lower housing 114, the lower housing 114A presents a different arrangement of reference posts, centering buffers, and positioning ridges. Other variations fall within the scope of the embodiment, including additional numbers of reference posts at other locations, and may depend on additional numbers (i.e., two (2), three (3), or more), positions, and arrangements of centering buffers and positioning ridges on each reference post. In general, the mechanical interference between the centering buffers and positioning ridges of the housing and the peripheral edge surfaces of the PCB can help to accurately set the positioning and location of the PCB within the housing.
[0062] Terms such as “top,” “bottom,” “side,” “front,” “back,” “right,” and “left” are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to identify certain features relative to each other, as the orientation of the structures described herein can vary. The terms “including,” “contains,” “has,” etc., are synonymous, used in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc. Furthermore, the term “or” is used in its inclusive sense rather than its exclusive sense, such that, for example, when used to connect a list of elements, the term “or” indicates one, some, or all of the elements in the list.
[0063] Unless otherwise stated, combinatorial language (such as "at least one of X, Y, and Z" or "at least one of X, Y, or Z") is generally used to refer to one of them, any combination of two, or all three (or more, if referring to a larger group), such as X and only X, Y and only Y, and Z and only Z, combinations of X and Y, X and Z, and Y and Z, and all of X, Y, and Z. Such combinatorial language is generally not intended (and unless specified not to) refer to or require the inclusion of at least one of X, at least one of Y, and at least one of Z.
[0064] Unless otherwise defined herein as relating to a specific range, percentage, or related measure of deviation, the terms “about” and “substantially” take into account at least some manufacturing tolerances between the theoretical design and the manufactured product or component, such as the geometric dimensional and tolerance standards described in ASME® Y14.5 and relevant International Organization for Standardization (ISO®) standards. As will be understood by one of ordinary skill in the art, such manufacturing tolerances may still be considered even when used in conjunction with theoretical terms such as geometric “perpendicular,” “orthogonal,” “vertices,” “collinear,” “coplanar,” and other terms, even without explicit reference to “about,” “substantially,” or related terms.
[0065] The embodiments described above are merely examples of implementations providing a clear understanding of the principles of this disclosure. Many variations and modifications can be made to the above embodiments without substantially departing from the spirit and principles of this disclosure. Furthermore, components and features described with respect to one embodiment may be included in another embodiment. All such modifications and variations are intended to be included within the scope of this disclosure.
Claims
1. A cable assembly, comprising: A housing, the housing including a reference post, the reference post including a positioning ridge extending from the outer surface of the reference post; as well as A printed circuit board, positioned within the housing, includes an interlocking recess, wherein: The reference post occupies the open space within the interlocking recess of the printed circuit board; and The positioning ridge of the reference post exerts mechanical interference on the outer edge of the interlocking recess of the printed circuit board.
2. The cable assembly according to claim 1, wherein: The printed circuit board includes rows of contacts; The contact row includes signal contacts and ground contacts; The contacts in the contact row include the front contact edge; and The positioning ridge of the reference post defines the positioning of the front contact edge of the contact relative to the reference surface of the reference post.
3. The cable assembly according to claim 1, wherein, The positioning ridge includes an angled central edge and a vertical central edge.
4. The cable assembly according to claim 3, wherein, The vertical center edge extends upward from the mounting surface of the housing, and the angled center edge extends at an angle from the vertical center edge to the surface of the reference post.
5. The cable assembly according to claim 1, wherein, The positioning ridge includes an angled central edge and a vertical central surface.
6. The cable assembly according to claim 1, wherein: The housing also includes an upper housing shell and a lower housing shell; The lower housing includes a bottom wall and a plurality of side walls extending perpendicularly to the bottom wall; and The reference post is positioned along one of the plurality of sidewalls of the lower housing.
7. The cable assembly according to claim 1, wherein: The reference column includes a first reference column; The positioning ridge includes a first positioning ridge extending from the outer surface of the first reference post; The housing also includes a second reference post; and The housing also includes a buffer extending from the outer surface of the second reference post.
8. The cable assembly according to claim 7, wherein: The interlocking notch includes a first interlocking notch positioned along the peripheral side edge of the printed circuit board; The printed circuit board includes a second interlocking notch positioned along the peripheral side edge of the printed circuit board; and The first positioning ridge and the buffer are used to set the position of the printed circuit board relative to the housing based on the mechanical interference between the first positioning ridge and the first interlocking notch and the mechanical interference between the second positioning ridge and the buffer.
9. The cable assembly according to claim 1, wherein, The reference post also includes a centering buffer extending from another outer surface of the reference post.
10. A cable assembly, comprising: A housing, the housing including a reference surface and a positioning ridge; as well as A printed circuit board is positioned in the housing, wherein the positioning ridge sets the positioning of the printed circuit board relative to the reference surface of the housing based on the contact between the positioning ridge and the peripheral edge of the printed circuit board.
11. The cable assembly of claim 10, wherein: The printed circuit board includes signal contacts; and The positioning ridge defines the positioning of the front contact edge of the signal contact relative to the reference surface.
12. The cable assembly of claim 10, wherein, The positioning ridge includes an angled central edge and a vertical central edge.
13. The cable assembly according to claim 12, wherein, The vertical center edge extends upward from the mounting surface of the housing, and the angled center edge extends from the vertical center edge at a certain angle.
14. The cable assembly of claim 10, wherein, The positioning ridge includes an angled central edge and a vertical central surface.
15. The cable assembly of claim 10, wherein, The housing also includes: A first reference post is positioned along a first sidewall of the housing, and the positioning ridge extends from the outer surface of the first reference post; A second reference post is positioned along the second sidewall of the housing; and The second positioning ridge extends from the outer surface of the second reference post.
16. The cable assembly of claim 15, wherein, The printed circuit board also includes: A first interlocking notch is positioned along the first peripheral edge of the printed circuit board; and The second interlocking notch is positioned along the second peripheral edge of the printed circuit board, wherein the first positioning ridge and the second positioning ridge are respectively used to set the positioning of the printed circuit board relative to the housing based on the mechanical interference between the first positioning ridge and the first interlocking notch and the mechanical interference between the second positioning ridge and the second interlocking notch.
17. The cable assembly of claim 16, wherein: The first reference post further includes a first centering buffer extending from another outer surface of the first reference post; and The second reference post also includes a second centering buffer extending from another outer surface of the second reference post.
18. A cable assembly comprising: A housing, the housing including a positioning ridge and a centering buffer; as well as A printed circuit board is positioned within the housing, wherein the positioning ridge and the centering buffer determine the positioning of the printed circuit board relative to the housing based on the contact between the peripheral edge of the printed circuit board and the positioning ridge and the centering buffer.
19. The cable assembly of claim 18, wherein: The printed circuit board includes signal contacts; and The positioning ridge positions the front contact edge of the signal contact relative to the reference surface of the housing.
20. The cable assembly of claim 18, wherein, The positioning ridge includes angled edges.