Electronic device signal connection structure, system, and method

Abstract

The application discloses an electronic device signal connection structure, system and method. The structure mainly comprises: a first circuit board comprising a first signal connection position; a second circuit board comprising a second signal connection position; a structure support, the surface of which is electroplated with a conductive circuit, the conductive circuit comprising a first exposed connection end and a second exposed connection end; the first circuit board and the second circuit board are fixed to the structure support through a first screw and a second screw respectively; when the first screw is tightened, the first signal connection position is in conduction with the first connection end; when the second screw is tightened, the second signal connection position is in conduction with the second connection end; and then the first signal connection position is in conduction with the second signal connection position. The electronic device signal connection structure provided by the application realizes cross-circuit board signal connection through screw locking and support wiring, has a simple structure, stable performance, reduces production processes and improves production efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic circuits, specifically to a signal connection structure, system, and method for electronic devices. Background Technology

[0002] With the rapid development of technology, virtual reality (VR), augmented reality (AR), and mixed reality (MR) technologies are gradually entering people's lives. Head-mounted display devices, as a key carrier of VR, AR, and MR, have also received widespread attention. Head-mounted display devices have a large number of interfaces or user interfaces, requiring signal connections between these interfaces and circuit boards.

[0003] In existing technologies, ZIF (Zero Insertion Force) connectors and BTB (Board to Board) connectors are mainly used to implement signal interfaces on circuit boards, combined with signal cables, flexible printed circuits (FPCs), and flexible flat circuits (FFCs) for inter-board signal transmission. The disadvantages are that the connector mating process is complex, leading to high production and maintenance costs and hindering the improvement of production efficiency. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a signal connection structure, system and method for electronic devices, which addresses the defects and deficiencies of at least one of the aforementioned background technologies. The signal connection across circuit boards is achieved by screw fastening and bracket wiring, resulting in a simple structure, stable performance, reduced production steps and improved production efficiency.

[0005] Some embodiments of this application provide a signal connection structure for an electronic device, including:

[0006] A first circuit board, the first circuit board including a first signal connection location;

[0007] A second circuit board, the second circuit board including a second signal connection location;

[0008] A structural support frame, the surface of which is electroplated with conductive lines, the conductive lines including an exposed first connection end and a second connection end;

[0009] The first circuit board and the second circuit board are respectively fixed to the structural support by the first screw and the second screw;

[0010] When the first screw is tightened, the first signal connection position is connected to the first connection end. When the second screw is tightened, the second signal connection position is connected to the second connection end, and thus the first signal connection position is connected to the second signal connection position.

[0011] Preferably, when the first screw is tightened, the first signal connection position contacts and conducts with the first connection end; when the second screw is tightened, the second signal connection position contacts and conducts with the second connection end.

[0012] Preferably, conductive foam is provided at the contact position between the first signal connection position and the first connection end, and / or conductive foam is provided at the contact position between the second signal connection position and the second connection end.

[0013] Preferably, the surface of the first signal connection location is gold-plated, and / or the surface of the second signal connection location is gold-plated.

[0014] Preferably, the first screw is conductively connected to the first signal connection position and the first connection end, and / or the second screw is conductively connected to the second signal connection position and the second connection end.

[0015] Preferably, the surface of the conductive line is covered with an anti-oxidation coating.

[0016] Preferably, the signal is an external interactive signal of the electronic device, and the signal connection structure is used to transmit the external interactive signal of the electronic device to the internal circuit board.

[0017] Other embodiments of this application provide an electronic device signal connection system, including:

[0018] The signal connection structure is any one of the above-mentioned electronic device signal connection structures, and the number is at least two;

[0019] At least two of the signal connection structures are configured with the same circuit board as the first circuit board in the signal connection structure.

[0020] At least two of the signal connection structures use the same structural support as the structural support in the signal connection structure.

[0021] In some embodiments of this application, a head-mounted display device is provided, including any of the electronic device signal connection structures or electronic device signal connection systems described above.

[0022] This application also provides a signal connection method for an electronic device, the method comprising:

[0023] Determine the target signal to be transmitted, as well as the first and second circuit boards where the two ends of the target signal transmission are located;

[0024] The first connection position where the first circuit board is fixed to the device structure bracket by the first screw, and the second connection position where the second circuit board is fixed to the device structure bracket by the second screw are respectively determined;

[0025] Design the first circuit board and the second circuit board such that the two ends of the target signal are connected to the first connection position and the second connection position;

[0026] Conductive lines are electroplated on the structural support, and exposed first and second connection ends are provided on the conductive lines, such that when the screw is tightened, the first connection position is connected to the first connection end, and the second connection position is connected to the second connection end.

[0027] Compared with the prior art, the advantages and positive effects of the present invention are:

[0028] By replacing traditional connectors with screw press-fit, the connection performance is stable, and the connector snapping action is reduced during the production process, thereby saving labor costs and improving production efficiency. At the same time, the electroplated wires on the structural support replace traditional signal cables, FPCs, and FFCs, reducing the complexity of the structural space and lowering the production and maintenance costs of electronic equipment. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A cross-sectional view of an embodiment of the electronic device signal connection structure provided in this application;

[0032] Figure 2 A cross-sectional view of an embodiment of the electronic device signal connection structure provided in this application;

[0033] Figure 3 A cross-sectional view of an embodiment of the electronic device signal connection structure provided in this application;

[0034] Figure 4 A connection block diagram of an embodiment of the electronic device signal connection system provided in this application;

[0035] Figure 5 A schematic flowchart of an embodiment of the electronic device signal connection method provided in this application;

[0036] Explanation of icon numbers:

[0037] First circuit board 1, second circuit board 2, structural bracket 3, first screw 4, second screw 5, first signal connection position 11, second signal connection position 21, conductive line 31, first connection end 311, second connection end 312, gold plating layer 6, core control circuit board 7, signal interface circuit board 8. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0039] Head-mounted display devices have numerous interfaces or user interfaces, requiring signal connections between these interfaces and circuit boards. A key aspect of simplifying production assembly and improving efficiency is finding a more convenient way to connect these interfaces (such as power on / off buttons, volume up / down buttons, and LED control buttons) to the core control unit.

[0040] Therefore, this application proposes a signal connection structure for electronic devices, such as... Figure 1 As shown, the system includes: a first circuit board 1, which includes a first signal connection position 11; a second circuit board 2, which includes a second signal connection position 21; and a structural support 3, the surface of which is electroplated with conductive lines 31, which include an exposed first connection end 311 and a second connection end 312. The first circuit board 1 and the second circuit board 2 are respectively fixed to the structural support 3 by a first screw 4 and a second screw 5. When the first screw 4 is tightened, the first signal connection position 11 contacts and conducts with the first connection end 311. When the second screw 5 is tightened, the second signal connection position 21 contacts and conducts with the second connection end 312, thereby connecting the first signal connection position 11 with the second signal connection position 21.

[0041] In this embodiment, the first circuit board 1 can be the main control circuit board where the core control unit of the device is located, and the second circuit board 2 can be the interface circuit board for connecting external interactive components of the device. The connection positions of the two circuit boards inside the electronic device are often far apart. The two ends that the target signal needs to connect to are located on the main control circuit board and the interface circuit board, respectively, forming exposed solder pads, and located on the side close to the structural support 3. The structural support 3 is the internal frame support structure of the device, used to support equipment components such as circuit boards, lenses, and projection optical engines. Screw through holes are provided at the fixing points of the circuit boards and the structural support 3, and threaded holes are provided on the structural support accordingly. Screws pass through the screw through holes of the circuit boards and are locked in the threaded holes to achieve screw attachment between the circuit boards and the structural support 3. In this embodiment, the first circuit board 1 and the second circuit board 2 are locked to the structural support 3 by the first screw 4 and the second screw 5. After locking, the circuit boards and the structural support 3 are tightly attached, and the exposed copper at the signal connection position is pressed into contact with one end of the electroplated conductive line 31 on the structural support 3, realizing signal conduction. After the target signal is guided onto the structural support 3, it is transmitted through the conductive line 31 designed as needed, thereby realizing the transmission of the target signal between the main control circuit board and the interface circuit board.

[0042] It should be noted that the circuit board in this application can be a rigid circuit board, such as a PCB (Printed Circuit Board) or a ceramic circuit board, or a flexible circuit board, such as an FPC (Flexible Printed Circuit), or a rigid-flex PCB (R-FPC). Among these, PCBs have mature manufacturing processes, are easy to mass-produce, and have low costs, making them the most widely used. In this example, both the main control circuit board and the signal interface circuit board can be PCBs.

[0043] This embodiment replaces traditional connectors with screw pressing, ensuring stable connection performance and reducing the connector snapping action during manufacturing, thereby saving labor costs and improving production efficiency. At the same time, the electroplated wires on the structural bracket 3 replace traditional signal cables, FPCs, and FFCs, reducing the complexity of the structural space and lowering the production and maintenance costs of electronic equipment.

[0044] In an optional embodiment, conductive foam is provided at the contact position between the first signal connection position 11 and the first connection end 311, and / or conductive foam is provided at the contact position between the second signal connection position 21 and the second connection end 312.

[0045] The conductive foam is mainly composed of a foam substrate and a conductive coating. After being placed at the contact position, it achieves interference locking, improves the stability of signal contact conduction between the circuit board and the structural support 3, and ensures the effective operation of the electronic device signal connection structure proposed in this application under different working conditions.

[0046] In an alternative implementation, such as Figure 2As shown, the surface of the first signal connection position 11 is gold-plated, and / or the surface of the second signal connection position 21 is gold-plated.

[0047] Gold is an excellent conductive material with high conductivity. Plating gold on the contact pads of the circuit board can improve the contact conductivity between the circuit board and the structural support 3. Furthermore, gold has stronger oxidation resistance than copper, which can improve the long-term stability of the contact conductivity structure proposed in this application. The height of the gold plating layer 6 can be greater than or equal to the height of the solder resist on the circuit board, making the contact position more prominent and the contact with the structural support 3 tighter.

[0048] Furthermore, the surfaces of the first connection end 311 and the second connection end 312 of the conductive line 31 on the structural bracket 3 can be locally thickened, which can also make the contact at the signal connection position tighter. It should be noted that the surface of the connection position of the first circuit board 1 or the second circuit board 2 can be gold-plated and the connection end of the structural bracket 3 can be thickened at the same time, or only one of them can be used, both of which can improve the contact conduction effect of the target signal.

[0049] In an alternative implementation, such as Figure 3 As shown, the first screw 4 is electrically connected to the first signal connection position 11 and the first connection end 311, and / or the second screw 5 is electrically connected to the second signal connection position 21 and the second connection end 312.

[0050] In this embodiment, the circuit board and the structural support 3 are not connected by locking contact, but by the conductive properties of the screws themselves. On one side of the circuit board, the first signal connection position 11 and the second signal connection position 21 are respectively located on the side of the first circuit board 1 and the second circuit board 2 away from the structural support 3. After the first screw 4 and the second screw 5 are tightened, they respectively contact and connect with the first signal connection position 11 and the second signal connection position 21. On the other side of the structural support 3, the conductive line 31 can extend to the vicinity or inside of the threaded hole, and contact and connect with the screw when the screw is tightened.

[0051] This embodiment utilizes the conductivity of the screw itself to transmit signals between the circuit board and the structure, eliminating the need to tighten the circuit board and the structural support 3 to a tight fit. This allows for a more flexible spatial layout design of the circuit board and the structural support, making it suitable for different application scenarios than the aforementioned solutions.

[0052] In an optional embodiment, the surface of the conductive lines 31 on the structural support 3 is covered with an anti-oxidation coating. The anti-oxidation coating isolates the conductive lines 31 from air, thereby ensuring the reliability of the plating on the traces of the structural support 3 and preventing oxidation of the lines. The anti-oxidation coating can be an organic coating, such as an acrylic resin coating or an epoxy resin coating, or a metal plating, such as a tin plating or a nickel plating.

[0053] In an optional embodiment, the transmitted signal is an external interaction signal of the electronic device, and the signal connection structure is used to transmit the external interaction signal of the electronic device to the internal circuit board. The external interaction signal of the electronic device originates from user interaction with the electronic device's interface or operating screen, including power on / off buttons, volume up / down buttons, LED on / off buttons, and swipe touch gestures. Such signals need to be transmitted from the interface circuit board at the interface or operating screen connection point to the main control circuit board, resulting in a relatively long transmission distance within the device. By deploying the electronic device signal connection structure provided in the aforementioned embodiment, the signal is cleverly transmitted using the structural support 3, reducing the number of internal wirings, simplifying the device assembly steps, and improving manufacturing efficiency.

[0054] Some embodiments of this application also provide an electronic device signal connection system, such as Figure 4 As shown, it includes: a signal connection structure, wherein the signal connection structure is any of the above-mentioned electronic device signal connection structures, and the number is at least two; at least two of the signal connection structures use the same circuit board as the first circuit board 1 of the signal connection structure; at least two of the signal connection structures use the same structural bracket 3 as the structural bracket of the signal connection structure.

[0055] In practical applications, it is often necessary to transmit interaction signals from multiple external devices to the core control circuit board 7. In this case, a "one-to-many" signal connection system can be formed, referring to the signal connection structure described in the above embodiment. Multiple signal connection positions for multiple target signals are set on the main control signal circuit board. After the main control circuit board is fixed to the structural bracket 3 with one or more screws, the multiple signal connection positions are connected to the multiple conductive lines on the structural bracket 3. These multiple conductive lines do not interfere with each other and are independently connected to an interface circuit board 8, including a power button, volume up / down buttons, and an LED control board, ensuring that each target signal is transmitted independently without interference. The multiple interface circuit boards 8 are respectively fixed to the structural bracket with screws.

[0056] Viewed independently, the core control circuit board and each interface circuit board form a signal connection structure provided in the aforementioned embodiment; as a whole, the multiple sets of the signal connection structures use the same core control circuit board as the first circuit board 1 and the same structural bracket 3 as the structural bracket in the signal connection structure; the signal connection system provided in this embodiment is a multiple reuse of the aforementioned signal connection structure.

[0057] The master-slave circuit board signal connection system described in this embodiment improves the connection between multiple input signals from electronic device interfaces or operating interfaces and internal processing units, thereby enhancing the human-computer interaction experience.

[0058] Some embodiments of this application also provide a head-mounted display device, including the electronic device signal connection structure or electronic device signal connection system described in any of the above embodiments. Based on recent advances in portable computing, a head-mounted display device (HMD) can be a glasses device that provides users with augmented reality (AR), virtual reality (VR), and / or mixed reality (MR).

[0059] Some embodiments of this application also provide a signal connection method for an electronic device, such as... Figure 5 As shown, Figure 5 This is a flowchart illustrating the signal connection method for the electronic device.

[0060] In this embodiment, the method includes steps S10-S40:

[0061] Step S10: Determine the target signal to be transmitted and the first and second circuit boards where the two ends of the target signal transmission are located.

[0062] The first circuit board can be the core control circuit board of the device, and the second circuit board can be the device's interactive signal interface circuit board.

[0063] Step S20: Determine the first connection position where the first circuit board and the device structure bracket are fixed by the first screw, and the second connection position where the second circuit board and the device structure bracket are fixed by the second screw.

[0064] It should be noted that the structural support can be an existing part of the equipment or a new addition for signal transmission; the first circuit board and the second circuit board can be fixedly connected to the same structural support, or they can be a combination of multiple interconnected structural supports that can be regarded as a whole.

[0065] Step S30: Design the first circuit board and the second circuit board so that the two ends of the target signal are connected to the first connection position and the second connection position.

[0066] The connection of the two ends of the target signal to the first connection position and the second connection position means that by modifying the circuit board graphic design, the two ends of the target signal to be connected are extended to the first screw and the second screw or their vicinity, respectively, forming exposed pads, which facilitates connection with the conductive lines on the structural support.

[0067] Step S40: Electroplating conductive lines on the structural support, and setting exposed first and second connecting ends on the conductive lines, so that when the screw is tightened, the first connecting position is connected to the first connecting end, and the second connecting position is connected to the second connecting end.

[0068] In the aforementioned embodiment, the connection between the connection point on the circuit board and the connection end on the structural bracket can be either direct contact connection when the circuit board and the structural bracket are tightly attached, or indirect connection through the conductive properties of the screw itself, or a combination of both.

[0069] The electronic device signal connection method provided in this application aims to optimize circuit design based on the bracket position, achieve stable signal transmission between circuit boards without adding new circuit structures, reduce the complexity of structural space, and reduce the production and maintenance costs of electronic devices.

[0070] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A signal connection structure for an electronic device, characterized in that, include: A first circuit board, the first circuit board including a first signal connection location; A second circuit board, the second circuit board including a second signal connection location; A structural support frame, the surface of which is electroplated with conductive lines, the conductive lines including an exposed first connection end and a second connection end; The first circuit board and the second circuit board are respectively fixed to the structural support by the first screw and the second screw; When the first screw is tightened, the first signal connection position is connected to the first connection end. When the second screw is tightened, the second signal connection position is connected to the second connection end, and thus the first signal connection position is connected to the second signal connection position.

2. The electronic device signal connection structure according to claim 1, characterized in that, When the first screw is tightened, the first signal connection position contacts and conducts with the first connection end; when the second screw is tightened, the second signal connection position contacts and conducts with the second connection end.

3. The electronic device signal connection structure according to claim 2, characterized in that, Conductive foam is provided at the contact position between the first signal connection position and the first connection end, and / or conductive foam is provided at the contact position between the second signal connection position and the second connection end.

4. The electronic device signal connection structure according to claim 2, characterized in that, The surface of the first signal connection location is gold-plated, and / or the surface of the second signal connection location is gold-plated.

5. The electronic device signal connection structure according to claim 1, characterized in that, The first screw is conductively connected to the first signal connection position and the first connection end, and / or the second screw is conductively connected to the second signal connection position and the second connection end.

6. The electronic device signal connection structure according to any one of claims 1 to 5, characterized in that, The surface of the conductive circuit is covered with an anti-oxidation coating.

7. The electronic device signal connection structure according to any one of claims 1 to 5, characterized in that, The signal is an external interaction signal of the electronic device, and the signal connection structure is used to transmit the external interaction signal of the electronic device to the internal circuit board.

8. A signal connection system for an electronic device, characterized in that, include: A signal connection structure, wherein the signal connection structure is any one of the electronic device signal connection structures according to claims 1 to 7, and the number is at least two; At least two of the signal connection structures are configured with the same circuit board as the first circuit board in the signal connection structure. At least two of the signal connection structures use the same structural support as the structural support in the signal connection structure.

9. A head-mounted display device, characterized in that, Includes the electronic device signal connection structure according to any one of claims 1 to 7, or the electronic device signal connection system according to claim 8.

10. A signal connection method for an electronic device, characterized in that, The method includes: Determine the target signal to be transmitted, as well as the first and second circuit boards where the two ends of the target signal transmission are located; The first connection position where the first circuit board is fixed to the device structure bracket by the first screw, and the second connection position where the second circuit board is fixed to the device structure bracket by the second screw are respectively determined; Design the first circuit board and the second circuit board such that the two ends of the target signal are connected to the first connection position and the second connection position; Conductive lines are electroplated on the structural support, and exposed first and second connection ends are provided on the conductive lines, such that when the screw is tightened, the first connection position is connected to the first connection end, and the second connection position is connected to the second connection end.

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