Relay connector and fpc substrate for relay connector

Abstract

The present application provides a relay connector that improves the deterioration, delay, and the like of signals between a first substrate and a second substrate, and an FPC substrate for the relay connector. The relay connector includes a housing having a first housing portion and a second housing portion, a first insertion space in which the first substrate is inserted being provided in the first housing portion, and a second insertion space in which the second substrate is inserted being provided in the second housing portion; a plurality of terminals provided across both the first housing portion and the second housing portion; and a mounting fitting provided to the housing. The mounting fitting has a fixing portion that is capable of being fixed to a substrate surface of a third substrate when the fixing portion is inserted through a through-hole provided in the third substrate at least in part of the second housing portion.

Description

Technical Field

[0001] The present invention relates to a relay connector, and more particularly, to a relay connector capable of connecting a first substrate to a second substrate, and an FPC substrate for the relay connector. Background Technology

[0002] An optical transceiver is a device used to exchange electrical signals and optical signals, and is electrically connected to an application-specific integrated circuit (ASIC) mounted on the printed wiring board via a socket connector mounted on the printed wiring board.

[0003] Existing socket connectors are typically mounted on printed circuit boards (PCBs) with the insertion / removal direction of the optical transceiver parallel to the surface of the PCB (see, for example, Patent Document 1). However, in this mounting method, depending on the location of the optical transceiver, the distance from the socket to the integrated circuit increases; in other words, the pattern length of the PCB increases. Therefore, as the signal speed increases, problems such as signal degradation and delay occur.

[0004] In the invention described in Patent Document 2, the aforementioned problem is addressed by making the insertion / removal direction of the optical transceiver perpendicular to the surface of the printed wiring board. The socket assembly 30 of Patent Document 2 is an assembly that electrically connects a pluggable module 20, such as an optical transceiver, to an integrated circuit 13, such as an application-specific integrated circuit (ASIC), and is mounted substantially perpendicularly on the front surface 101 of a printed wiring board (substrate) 100 housed within a housing 11 of a communication system 10. The socket assembly 30 has a connector 200 and a cage 400 that houses the connector 200. When the module 20 is inserted into the connector 200, the module 20 is electrically connected to the front surface 101 of the printed wiring board 100 in a state substantially perpendicular to the surface of the printed wiring board, and transmits signals on the printed wiring board 100 via a pattern applied to the printed wiring board 100. It is evident that, according to the structure of Patent Document 2, compared to the connector in Patent Document 1 where the insertion and removal direction of the optical transceiver is arranged parallel to the surface of the printed wiring board, the pattern length of the printed wiring board can be shortened. Therefore, it is possible to mitigate signal degradation and delay to some extent. However, in the invention involved in Patent Document 2, since all communication is carried out through the pattern on the printed wiring board, the aforementioned problems have not been completely solved.

[0005] Patent Document 1: Japanese Patent No. 7082068

[0006] Patent Document 2: US Patent Publication No. 2004 / 0097374 Summary of the Invention

[0007] The purpose of this invention is to provide a relay connector that solves the problems in the prior art described above, and an FPC substrate for the relay connector.

[0008] To address the aforementioned issues, a relay connector according to one aspect of the present invention has the following features: the relay connector comprises: a housing having a first housing portion and a second housing portion, wherein a first insertion space for inserting a first substrate is provided in the first housing portion, and a second insertion space for inserting a second substrate is provided in the second housing portion; a plurality of terminals provided across both the first housing portion and the second housing portion; and a mounting accessory provided in the housing, wherein the mounting accessory has a fixing portion that can be fixed to the substrate surface of the third substrate when at least a portion of the second housing portion is inserted through a through hole provided in the third substrate.

[0009] According to this method of relay connector, since the relay connector can be installed with at least a portion of the second housing portion inserted through a through hole provided in the third substrate, the first substrate and the second substrate can be directly connected through terminals provided inside the relay connector without passing through patterns on the printed wiring board.

[0010] Since the first substrate and the second substrate can be directly connected via terminals without passing through patterns on a printed wiring board, a relay connector that improves problems such as signal degradation and delay between the first substrate and the second substrate, as well as an FPC substrate for the relay connector, is provided. Attached Figure Description

[0011] Figure 1 This is a perspective view showing a relay connector according to one embodiment of the present invention together with a substrate and surrounding components that can be used with the relay connector, and is a view showing the state of the substrate before it is connected.

[0012] Figure 2 This is a perspective view showing a relay connector according to one embodiment of the present invention together with a substrate and surrounding components that can be used with the relay connector, and is a diagram showing the state after the substrate is connected.

[0013] Figure 3 This indicates that it is set. Figure 1 , Figure 2 The diagram shows a schematic perspective view of the system in use according to one embodiment of the present invention, illustrating the relay connector.

[0014] Figure 4 This is a perspective view of an FPC substrate unit that can be used in one embodiment of the present invention for a relay connector.

[0015] Figure 5This is a three-dimensional view showing the state of the FPC substrate inside the relay connector when the FPC substrate is connected to the relay connector.

[0016] Figure 6 This is a perspective view showing the state of the FPC substrate inside the relay connector when the card edge plate is further connected to the relay connector.

[0017] Figure 7 yes Figure 5 and Figure 6 The diagram shows an enlarged view of the multiple terminals and mounting accessories located on the relay connector.

[0018] Figure 8 It is a 3D view of the signal terminals and grounding terminals.

[0019] Figure 9 It is a three-dimensional view of the signal terminals and the power terminals.

[0020] Figure 10 This is a magnified view of a portion of the substrate surface of the system substrate.

[0021] Figure 11 It is a 3D diagram of the installation accessories.

[0022] Figure 12 This is a front 3D view of a horizontally positioned repeater connector.

[0023] Figure 13 This is a 3D view of the rear of a vertically positioned repeater connector.

[0024] Figure 14 These are the front view, top view, and rear view of the repeater connector.

[0025] Figure 15 It is used with Figure 13 The same method is used to represent a perspective view of the state after the relay connector is installed on the system board.

[0026] Figure 16 yes Figure 15 Top view.

[0027] Figure 17 yes Figure 16 The diagram is a sectional view along line AA, showing a cross-section of the signal terminals included in the first terminal group A.

[0028] Figure 18 yes Figure 16 The BB line cross-sectional view is a diagram showing the cross-section at the signal terminals included in the second terminal group B.

[0029] Figure 19 yes Figure 16The diagram is a cross-sectional view along the CC line, showing a section at the grounding terminal included in the first terminal group A.

[0030] Figure 20 yes Figure 16 The DD-line sectional view is a diagram showing the cross-section at the grounding terminal included in the second terminal group B.

[0031] Figure 21 yes Figure 16 The diagram is a sectional view along the EE line, showing a cross-section of the power supply terminals included in the first terminal group A.

[0032] Figure 22 yes Figure 16 The diagram is a sectional view along line FF, showing a cross-section of the power supply terminals included in the second terminal group B.

[0033] Explanation of reference numerals in the attached figures

[0034] 1…Relay connector; 2…System; 5…Connector; 10…Housing; 11…First housing section; 12…Second housing section; 20…Signal terminal; 23…First signal contact; 24…Second signal contact; 30…Ground terminal; 33…First ground contact; 34…Second ground contact; 40…Substrate connection terminal; 44…Electrical contact (signal contact); 45…Substrate connection section; 50…Mounting accessory; 55…Fixing part; 60…Substrate connection terminal (power terminal); 64…Electrical contact (power contact); 65…Substrate connection section; 70…System substrate (third substrate); 71…Through hole; 73…Ventilation port; 75…Internal space; 80…FPC substrate (second substrate); 90…Module (optical transceiver); 92…Edge plate (first substrate); 110…First insertion space; 117…Through hole; 120…Second insertion space; 125…Through hole; 129…Space. Detailed Implementation

[0035] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. For ease of explanation, only preferred embodiments are shown, but this is not intended to limit the present invention.

[0036] Figure 1 , Figure 2These are perspective views showing a relay connector according to one embodiment of the present invention, along with a substrate and surrounding components that can be used with the relay connector. According to this relay connector 1, for example, a retaining plate 92 (“first substrate”) and an FPC substrate 80 (“second substrate”) inserted into a first housing portion 11 and a second housing portion 12 of the relay connector 1 can be connected to each other. Furthermore, these retaining plates 92 and FPC substrates 80 are merely examples of substrates that can be connected via the relay connector 1, and this embodiment is not limited to the use of these substrates. Figure 1 This indicates the state of these substrates before they were connected. Figure 2 This indicates their state after they are connected.

[0037] The edge-type plate 92 can be a known plate, used Figure 1 , Figure 2 The product shown is acceptable. For example, it could be a component of a module such as optical transceiver 90. Furthermore, optical transceiver 90 is an example of a module that can be used with card edge plate 92. Card edge plate 92 can also be installed in other modules besides optical transceiver 90, or card edge plate 92 can be used alone without using a module.

[0038] Figure 1 , Figure 2 The shown clamping plate 92 is positioned at the front end of the main body 91 of the optical transceiver 90, clamped by the internal substrates 93A and 93B in the vertical direction "Z" ("third direction") orthogonal to both the front-rear direction "X" ("first direction") and the width direction "Y" ("second direction"), and has a predetermined length along the width direction "Y" orthogonal to the front-rear direction "X". A cable support portion 95 is provided at the rear end side, capable of supporting the optical cable 3 along the front-rear direction "X".

[0039] Figure 3 This indicates that it is set. Figure 1 , Figure 2 The diagram shows a schematic perspective view of the system configuration of the repeater connectors. System 2 includes a housing (70, 74), multiple frames 76 mounted on the housing, and multiple repeater connectors 1 (in...). Figure 3 Only the second housing portion 12 is shown in the image.

[0040] Regarding the outer casing, Figure 3For simplicity, only a portion of the components constituting the housing are shown, namely the system substrate 70 forming the sidewall and the base plate 74 forming the bottom wall. System substrates 70A and 70B are arranged adjacent to each other in the width direction "Y," forming one sidewall of the housing. Furthermore, the interior 700 of the housing actually houses various components, but for the sake of simplicity, only the FPC substrate 80 and a portion of the components associated with this embodiment, namely the connector 5 and the heat sink 15, are shown here. Additionally, in the following description and drawings, the letters "A" or "B" are used as reference numerals only for ease of distinction.

[0041] The frame 76 is provided in a state where it is erected vertically outward from one substrate surface 701 of the system substrate 70. The mounting orientation of the frame 76 relative to the system substrate 70 is not particularly limited. For example, the frame 76A provided on the system substrate 70A is mounted in a horizontal orientation "Y", and the frame 76B provided on the system substrate 70B is mounted in a vertical orientation "Z". Figure 1 , Figure 2 The optical transceiver 90, which is provided with a retaining plate 92, is inserted into each frame 76 from one substrate surface 701 toward another substrate surface 702 (X1). That is, the system substrate 70, like the invention described in Patent Document 2, is provided perpendicularly to the insertion / removal direction of the optical transceiver 90 along the surface (YZ surface) formed by the width direction "Y" and the vertical direction "Z". When the optical transceiver 90 is inserted into the frame 76, the retaining plate 92 provided on the front end side of the optical transceiver 90 is inserted into the first housing portion 11 of the repeater connector 1.

[0042] Each relay connector 1 is mounted in the housing such that a portion of the second housing portion 12 is inserted from one substrate surface 701 toward another substrate surface 702 (X1) into a through hole 71 provided on the system substrate 70. Figure 3 Only the second housing portion 12 (which is inserted through) is shown in the diagram. The through-hole 71 is configured to pass through the substrate surfaces 701 and 702, which have surfaces orthogonal to the insertion direction "X1" of the second housing portion 12; in other words, surfaces formed by the width direction "Y" and the vertical direction "Z" (YZ plane). A vent 73 communicating with the interior 700 of the housing is also provided on the system substrate 70 to cool the interior 700 of the housing. The vents 73 are arranged between the through-holes 71, thereby effectively dissipating heat emitted from the FPC substrate 80 to the outside of the housing.

[0043] The FPC substrate 80 is inserted into the second housing portion 12 of each relay connector 1 from one end of another substrate surface 702 toward one substrate surface 701 (X2). At this time, the FPC substrate 80 is housed inside the housing 700. Although the FPC substrate 80 used in this embodiment has a slightly special shape, its basic structure is the same as that of a conventional FPC substrate. Therefore, the FPC substrate 80 can be easily manufactured by processing commercially available products. In addition to the straight portions 831, 841, 851 that are inserted into one end of the second housing portion 12, the FPC substrate 80 also includes extended portions 832-833, 842-845, 852-854 that extend toward the base plate 74 in the width direction "Y" and / or the downward direction "Z2". The other end of the FPC substrate, namely the end of the extension portions 832-833, is connected to the connector 5 provided on the base plate 74. In addition, the ends of the extension portions 842-845 and 852-854 are connected to the heat sink 15 provided on the base plate 74. In order to improve the cooling effect, the extension portions 832-833, 842-845, and 852-854 are made to have the shortest distance between each other in the direction towards the connector 5, and to form the largest possible gap 86-88.

[0044] Figures 4 to 6 This is a perspective view showing the detailed structure at one end of an FPC substrate. Figure 4 This is a 3D view of an FPC substrate unit at one end. Figure 5 This is a perspective view showing the state of the FPC board inside the repeater connector when the FPC board is connected to the repeater connector. More specifically, it is a perspective view showing the connection state of the FPC board with the multiple terminals and mounting accessories provided in the repeater connector. Figure 6 This is a perspective view showing the state of the FPC substrate inside the relay connector when the card edge plate is further connected to the relay connector. More specifically, it is a perspective view showing the connection state of the FPC substrate, the card edge plate, and the multiple terminals and mounting accessories provided in the relay connector.

[0045] like Figure 4 As shown, the FPC substrate 80 has a first pad portion 810 and a second pad portion 820 arranged adjacent to each other in the width direction "Y" at one end in the front-rear direction "X". On each of the front and back surfaces of these first pad portions 810 and second pad portions 820, a plurality of first pads 811 and second pads 821 are arranged along the width direction "Y" corresponding to the plurality of terminals 20 and 30 provided on the repeater connector 1. In addition, on the outer surfaces of the first pad portions 810 and second pad portions 820 in the width direction "Y", concave locking portions 812 and 822 are respectively provided for locking the FPC substrate 80 to the repeater connector 1.

[0046] like Figure 5 As shown, when the FPC substrate 80 is connected to the repeater connector 1, multiple terminals 20 and 30 provided on the repeater connector 1 are elastically connected to the first pad 811 and the second pad 821, respectively, and the locking portion 54 of the mounting accessory 50 provided on the repeater connector 1 is elastically locked to the locking portions 812 and 822 respectively provided on the first pad portion 810 and the second pad portion 820. Similarly, when the retaining edge plate 92 is connected to the repeater connector 1, as... Figure 6 As shown, multiple terminals 20 and 30 provided on the relay connector 1 are elastically connected to multiple pads 911 provided on the edge plate 92. In addition to these terminals 20 and 30, terminals 40 and 60 are also elastically connected to the aforementioned multiple pads 911.

[0047] Figure 7 express Figure 5 and Figure 6 The diagram shows an enlarged view of the multiple terminals 20, 30, 40, 60 and the mounting accessory 50. These terminals 20, 30, 40, 60 can be classified into two groups in the vertical direction "Z". A first terminal group A is formed on the upper side, including a portion of each of terminals 20, 30, 40, 60, and a second terminal group B is formed on the lower side, including the remaining portions of each of terminals 20, 30, 40, 60, and 20. The first terminal group A and the second terminal group B are arranged separately in the vertical direction "Z". In addition, a portion of terminals 20A, 30A, 40A, 60A included in the first terminal group A and another portion of terminals 20B, 30B, 40B, 60B included in the second terminal group B have the same arrangement in the width direction "Y" and are staggered and interleaved in the width direction "Y". Since the terminals 20A, 30A, 40A, and 60A included in the first terminal group A and the terminals 20B, 30B, 40B, and 60B included in the second terminal group B have the same arrangement in the width direction "Y", only the first terminal group A will be described in detail below, and the description of the second terminal group will be omitted or simplified.

[0048] The first terminal group A includes a signal terminal 20A, a ground terminal 30A, and substrate connection terminals 40A and 60A. The substrate connection terminals 40A and 60A further include a signal terminal 40A and a power terminal 60A. These signal terminals 20A, ground terminals 30A, signal terminals 40A, and power terminals 60A are all arranged along the front-to-back direction "X" and are equally spaced and adjacent to each other in the width direction "Y". Similarly, the second terminal group B, including signal terminals 20B, ground terminals 30B, signal terminals 40B, and power terminals 60B, is also arranged along the front-to-back direction "X" in the repeater connector 1 and is equally spaced and adjacent to each other in the width direction "Y".

[0049] The first terminal group A and the second terminal group B form gaps in the front of the front-rear direction "X" and in the vertical direction "Z" to clamp the first pad portion 810 and the second pad portion 820 of the FPC substrate 80. Similarly, a gap is formed in the rear of the front-rear direction "X" and in the vertical direction "Z" to clamp the pad portion of the retaining plate 92. When connecting the FPC substrate 80 and the retaining plate 92 to the relay connector 1, the FPC substrate 80 is inserted into the gap formed in the front of ...

[0050] The signal terminals 20A and ground terminals 30A included in the first terminal group A are arranged as a group "S" consisting of "ground terminal, signal terminal, signal terminal, ground terminal". In each group "S", two signal terminals 20A are sandwiched between two ground terminals 30A on both sides. By adopting this arrangement, the so-called crosstalk problem can be mitigated. In the first terminal group A, a total of eight groups "S1" to "S8" are arranged along the width direction "Y". More specifically, between a total of four groups "S1" to "S4" and a total of four groups "S5" to "S8", other groups "T" (described later) are arranged in the center along the width direction "Y" in a sandwiched state. Furthermore, the ground terminals forming the ends of each group "S" are allowed to be repeated between adjacent groups. For example, in groups "S1" to "S3", signal terminal 20A and ground terminal 30A are arranged in the order of "ground terminal 30A, signal terminal 20A, signal terminal 20A, ground terminal 30A, signal terminal 20A, signal terminal 20A, ground terminal 30A, signal terminal 20A, signal terminal 20A, ...". The fourth ground terminal 30A becomes a component of both the first group "S1" and the second group "S2". In addition, the seventh ground terminal 30A becomes a component of both the second group "S2" and the third group "S3".

[0051] The other groups "T" located in the center of the width direction "Y" are formed by arranging the signal terminals 40 and power terminals 60 included in the first terminal group A in the order of "signal terminal, power terminal, power terminal, signal terminal". Group "T" is different from the groups "S1" to "S8" mentioned above, and therefore does not have the same terminals as group "S".

[0052] exist Figure 8In the diagram, the signal terminal 20 and the ground terminal 30 are represented in a three-dimensional view, using the aforementioned group "S" as the unit. In other words, they are arranged in the order of "ground terminal, signal terminal, signal terminal, ground terminal". The signal terminal 20 and the ground terminal 30 have the same size and shape, and are formed into plate shapes by cutting and bending metal plates.

[0053] Signal terminal 20 is used for high-speed transmission. Signal terminal 20 has a base 21 in the center, a first signal contact 23 at one end, and a second signal contact 24 at the other end. Figure 7 In the current state, the first signal contact 23 contacts the designated pads of the card edge plate 92, and the second signal contact 24 contacts the designated pads of the FPC substrate 80, connecting them. At approximately the center of the base 21, a press-in protrusion 210, protruding in the width direction "Y", is provided for use when fixing to the repeater connector 1. Furthermore, on the side closer to the second signal contact 24 than the press-in protrusion 210, a step portion 25 is provided in the vertical direction "Z" for adjusting the height of the first signal contact 23 and the second signal contact 24.

[0054] Grounding terminal 30 is used for grounding connection. Similar to signal terminal 20, grounding terminal 30 also has a base 31 in the center, a first grounding contact 33 at one end, and a second grounding contact 34 at the other end. Figure 7 In the current state, the first grounding contact 33 contacts the designated pad of the card edge plate 92, and the second grounding contact 34 contacts the designated pad of the FPC substrate 80, connecting them to the ground line. Similar to the signal terminal 20, a press-in protrusion 310 is provided in approximately the center of the base 31, and a stepped portion 35 is provided on the side near the second grounding contact 34.

[0055] exist Figure 9 In the diagram, using the aforementioned group "T" as the unit, in other words, a perspective view showing the signal terminals 40 and power terminals 60 arranged in the order of "signal terminals, power terminals, power terminals, signal terminals," is provided. Figure 10 The substrate surface 701 of the system substrate 70 (“third substrate”) is shown in reference. Figure 3 A magnified view of a portion of the image.

[0056] On the substrate surface 701 of the system substrate 70, a plurality of pads 75 to 79 are provided to surround the via 71. For pads 75 and 76, a total of four pads 75, 76, 76, and 75 are arranged sequentially along the width direction "Y" in the outer regions of the via 71 in the vertical "Z" direction and at the center of the width direction "Y". Signal terminals 40 and power terminals 60 are soldered to these pads 75 and 76, respectively. Additionally, two pads 77 are provided in each outer region of the via 71 in the width direction "Y", for a total of four. Mounting accessories 50 are soldered to these pads 77. Furthermore, in the outer regions of the via 71 in the vertical "Z" direction, strip-shaped common pads 78 and 79 are provided, spaced apart from pads 75 and 76 in the width direction "Y", extending along the edge of the via 71 in the width direction "Y". Ground terminals 30 are soldered to these common pads 78 and 79.

[0057] Similar to signal terminal 20 and ground terminal 30, signal terminal 40 and power terminal 60 have the same size and shape, and are formed into plate shapes by cutting and bending metal plates. Signal terminal 40 and power terminal 60 extend along the front-back direction "X" as a whole, but unlike signal terminal 20 and ground terminal 30, one end of them is bent at a right angle to the housing 10, which is perpendicular to the housing 10.

[0058] The signal terminal 40 is used for low-speed transmission. The signal terminal 40 has a base 41 at its center, a signal contact 44 serving as an electrical contact at one end, and a substrate connection portion 45 at its other end. This substrate connection portion 45 is bent at a right angle in the vertical direction "Z" and has a connection surface 45a along the surface formed by the width direction "Y" and the vertical direction "Z" (YZ plane). When in... Figure 7 In the current state, the electrical contact 44 contacts the designated pad of the card edge plate 92, and the substrate connection portion 45 is soldered to the pad 75 of the system substrate 70, connecting the card edge plate 92 to the system substrate 70. On the substrate connection portion 45 side of the base portion 41, a press-in protrusion 410 is provided in a state that protrudes in the width direction "Y" for use when fixed to the repeater connector 1.

[0059] The power terminal 60 is used to supply power to the optical transceiver 90 via the system substrate 70. Similar to the signal terminal 40, the power terminal 60 also has a base 61 at the center, a power contact 64 serving as an electrical contact at one end, and a substrate connection portion 65 at the other end. This substrate connection portion 65 is formed by bending at a right angle in the vertical direction "Z" along a plane (YZ plane) formed by the width direction "Y" and the vertical direction "Z". When in... Figure 7In the current state, the electrical contact 64 contacts the designated pads of the card edge plate 92, and the substrate connection portion 65 is soldered to the pads 76 of the system substrate 70, connecting the card edge plate 92 to the system substrate 70. On the substrate connection portion 65 side of the base 61, a press-in protrusion 610 is provided in a state that protrudes in the width direction "Y" for use when fixed to the repeater connector 1.

[0060] Figure 11 This is a perspective view of mounting accessory 50. Like terminal 20, mounting accessory 50 is formed into a plate shape by cutting and bending a metal plate, and extends in the same direction as terminal 20 in the front-back direction "X".

[0061] The mounting accessory 50 has a generally rectangular base 51 at its center. A press-in protrusion 510, used for fixing to the repeater connector 1, is provided approximately at the center of the base 51, protruding in the vertical direction "Z". A fixing part 55 is provided at one end of the base 51 in the front-rear direction "X". This fixing part 55 is formed by bending at a right angle in the width direction "Y" relative to the housing 10, thus forming a fixing surface 55a along the plane (YZ plane) formed by the width direction "Y" and the vertical direction "Z". An elastic arm 53, capable of elastic deformation in the width direction "Y", extends further from one end along the front-rear direction "X", and a locking part 54, bent to protrude in the width direction "Y", is provided at its front end. Figure 7 In the state of being fixed, the fixing part 55 is soldered to the pad 77 of the system substrate 70, and the locking part 54 locks the concave locking parts 812 and 822 provided on the first pad part 810 and the second pad part 820 of the FPC substrate 80.

[0062] Figures 12 to 14 These are individual component diagrams of the relay connector. Figure 12 A front 3D view showing a horizontally positioned repeater connector. Figure 13 This is a rear 3D view showing a vertically positioned repeater connector. Figure 14 (a) represents the front view of the relay connector. Figure 14 (b) represents its top view. Figure 14 (c) represents its rear view. Figure 15 This indicates the state after the relay connector is installed on the system board. Figure 13 The same 3D diagram. Furthermore, although in Figure 15 It is not explicitly shown, but in addition to the card edge plate 92, the FPC substrate 80 is also connected to the relay connector 1.

[0063] The repeater connector 1 has a resin housing 10 and a... Figure 7The diagram shows a plurality of terminals 20 and mounting accessories 50 arranged on the housing 10. The housing 10 includes a first housing portion 11 and a second housing portion 12 arranged adjacent to each other along the front-rear direction "X". Both the first housing portion 11 and the second housing portion 12 are generally rectangular in shape, and the second housing portion 12 has a smaller cross-section than the first housing portion 11 in the plane formed by the width direction "Y" and the vertical direction "Z" (YZ plane). The through-hole 71 of the system substrate 70 allows the second housing portion 12 with the smaller cross-section to be inserted.

[0064] A first insertion space 110 for inserting a retaining plate 92 is provided in the first housing portion 11, and a second insertion space 120 for inserting an FPC substrate 80 is provided in the second housing portion 12. The retaining plate 92 is inserted into the first insertion space 110 from the first housing portion 11 toward the second housing portion 12 "X1". On the other hand, the FPC substrate 80 is inserted into the second insertion space 12 from the second housing portion 12 toward the first housing portion 11 "X2". A gap 82 is formed at the insertion opening of the second insertion space 120 with respect to the FPC substrate 80. Figure 5 When the FPC substrate 80 is inserted into the second insertion space 120, the partition 121 corresponding to the partition is housed in the gap 82, thereby enabling the FPC substrate 80 to be positioned at a predetermined position in the second insertion space 120.

[0065] The first housing portion 11 and the second housing portion 12 each have a plurality of terminal slots 113 (see reference). Figure 13 , Figure 15 Terminals 20 and the like are disposed on the housing 10. The terminals 20 and the like are arranged at predetermined positions with equal intervals between each other in a state of being adjacent to each other in the front-rear direction "X" and in the width direction "Y" using terminal slots 113, etc. At this time, the signal terminals 20 and the ground terminals 30 are disposed entirely inside the housing 10. On the other hand, the signal terminals 40 and the power terminals 60 are disposed inside the housing 10 only on the side of the signal contacts 44 and the power contacts 64, especially inside the first housing part 11. The substrate connecting parts 45, 65 and their peripheral parts are housed outside the housing 10 in a state of being exposed to the outside of the housing 10 in the front-rear direction "X", more specifically, at the boundary between the first housing part 11 and the second housing part 12, especially in the space 129 on the side of the second housing part 12.

[0066] The second housing portion 12 has a plurality of through holes 125 arranged along the vertical direction "Z" through the housing 10. These through holes 125 connect the base 31 of each ground terminal 30 disposed inside the housing 10 to the outside of the housing 10. By pouring solder into these through holes 125, each ground terminal 30 can be soldered to a common pad 78 on the system substrate 70. More specifically, the common pad 78 electrically connects all five through holes 125 (and ground terminals 30) on one side of the group "T" of "signal terminal, power terminal, power terminal, signal terminal" disposed in the center of the width direction "Y". Similarly, the common pad 79 electrically connects all through holes 125 (and ground terminals 30) on the other side of the group "T", thereby strengthening the grounding connection function on each side.

[0067] To facilitate connection with respect to the common pads 78 and 79, all through holes 125 are provided along the width direction "Y" at positions substantially the same as the connection surfaces 45a and 65a of the substrate connection portions 45 and 65 in the front-to-back direction "X". Furthermore, to facilitate connection with respect to the system substrate 70, the fixing portion 55 of the mounting accessory 50, particularly the fixing surface 55a on the second housing portion 12 side (see reference...) Figure 12 The through-hole 125, the connecting surfaces 45a and 65a of the substrate connecting portions 45 and 65 are also positioned substantially at the same location in the front-to-back direction "X" as the connecting surfaces 45a and 65a of the through-hole 125 and the substrate connecting portions 45 and 65. As a result, the through-hole 125, the connecting surfaces 45a and 65a of the substrate connecting portions 45 and 65, and the fixing surface 55a of the fixing portion 55 can all be easily soldered to the designated pads on the system substrate 70. Furthermore, "substantially" here means that it can be slightly offset within a range that does not hinder soldering.

[0068] Mounting accessories 50 are respectively fixed to the two sides of the first housing portion 11 in the width direction "Y". Each side of the first housing portion 11 is provided with a press-in groove 112 into which the base 51 of the mounting accessory 50 can be pressed. The mounting accessory 50 can be fixed by sliding along the press-in groove 112 in the front-back direction "X". When the mounting accessory 50 slides, the elastic arm portion 53 of the mounting accessory 50 is guided through the hole provided between the first housing portion 11 and the second housing portion 12 towards "X1" into the groove 123 provided on the inner wall of the second insertion space 120 of the second housing portion 12 (see reference). Figure 12 , 13 The locking portion 54 provided at the front end is positioned so that it can be locked to the locking portion 812 of the FPC substrate 80 inserted into the second housing portion 12 in the "X2" direction.

[0069] Figure 16 express Figure 15 A top view, in addition, Figures 17 to 22express Figure 16 Sectional views at various locations from A to F.

[0070] Figure 17 and Figure 18 They are respectively equivalent to Figure 16 The cross-sections at lines AA and BB. More specifically, Figure 17 This indicates the cross-section at signal terminal 20A, which is included in the first terminal group A. Figure 18 This indicates the cross-section at signal terminal 20B, which is included in the second terminal group B.

[0071] in addition, Figure 19 and Figure 20 They are respectively equivalent to Figure 16 The cross-sections at the CC and DD lines. More specifically, Figure 19 This indicates the cross-section at grounding terminal 30A, which is included in the first terminal group A. Figure 20 This indicates the cross-section at the grounding terminal 30B included in the second terminal group B.

[0072] in addition, Figure 21 and Figure 22 They are respectively equivalent to Figure 16 The cross-sections at the EE and FF lines. More specifically, Figure 21 This indicates the cross-section of the substrate connection terminals included in the first terminal group A, particularly the power supply terminal 60A. Figure 22 This indicates the cross-section of the substrate connection terminals included in the second terminal group B, particularly the power supply terminal 60B. Furthermore, signal terminals 40A and 40B can also be considered to be the same as power supply terminals 60A and 60B.

[0073] like Figures 19 to 22 As shown, when a portion of the second housing portion 12 is inserted into the through hole 71 along the insertion direction "X1", the system substrate 70 is in a state where the substrate surface 701 with pads 75 to 79 located near the front side in the insertion direction "X1" is opposite to the connection surfaces 45a and 65a of the substrate connection terminals 40 and 60, and the fixing surface 55a of the mounting accessory 50 located at substantially the same position as the connection surfaces 45a and 65a in the front-rear direction "X".

[0074] like Figure 17 , Figure 18 As shown, at the cross-sectional position of the signal terminal 20, the relay connector 1 is fixed to the common pads 78 and 79 of the system substrate 70 by means of solder 122a and 122b that enter the gap between the through hole 71 and the outer side of the second housing part 12 in the vertical direction "X".

[0075] The signal terminal 20 is disposed across both the first housing portion 11 and the second housing portion 12 through through holes 117 and 127 respectively, which communicate the first insertion space 110 and the second insertion space 120. The first signal contact 23 of the signal terminal 20 can be positioned in the first insertion space 110, and the second signal contact 24 can be positioned in the second insertion space 120. One end of the retaining plate 92 is elastically clamped in the vertical direction between the first signal contact 23A of the signal terminal 20A and the first signal contact 23B of the signal terminal 20B. Similarly, one end of the FPC substrate 80 is elastically clamped in the vertical direction between the second signal contact 24A of the signal terminal 20A and the second signal contact 24B of the signal terminal 20B.

[0076] like Figure 19 and Figure 20 As shown, at the cross-sectional position of the grounding terminal 30, the relay connector 1 is fixed to the common pads 78 and 79 of the system substrate 70 using solder 122a and 122b that enter the gap between the through hole 71 and the outer surface of the second housing portion 12 in the vertical "X" direction. In addition, the base 31 of each grounding terminal 30 provided on the second housing portion 12 is soldered to the common pad 79 of the system substrate 70 using solder flowing in through the through hole 125, thereby strengthening the grounding connection.

[0077] Like the signal terminal 20, the grounding terminal 30 is disposed across both the first housing portion 11 and the second housing portion 12 via through holes 117 and 127 respectively provided in the first housing portion 11 and the second housing portion 12, which connect the first insertion space 110 and the second insertion space 120. The first grounding contact 33 of the grounding terminal 30 can be positioned in the first insertion space 110, and the second grounding contact 34 can be positioned in the second insertion space 120. One end of the retaining plate 92 is elastically clamped in the vertical direction between the first grounding contact 33A of the grounding terminal 30A and the first grounding contact 33B of the grounding terminal 30B. Similarly, one end of the FPC substrate 80 is elastically clamped in the vertical direction between the second grounding contact 34A of the grounding terminal 30A and the second grounding contact 34B of the grounding terminal 30B.

[0078] like Figure 21 and Figure 22 As shown, when a portion of the second housing portion 12 is inserted into the through hole 71 along the insertion direction "X1", the system substrate 70 becomes a substrate surface 701 located near the front side in the insertion direction "X1" with pads 75 to 79, connection surfaces 45a and 65a of the substrate connection terminals 40 and 60, and a position disposed at substantially the same as the connection surfaces 45a and 65a in the front-rear direction "X" (see reference). Figures 12 to 15The mounting fitting 50 is positioned opposite the fixing surface 55a of the mounting accessory 50 (etc.). Furthermore, at the cross-sectional position of the substrate connection terminals shown in these figures, the power terminal 60 (and the signal terminal 40) is provided across both the first housing portion 11 and the second housing portion 12 via the through hole 117 provided in the first housing portion 11 and the space 129 formed in the second housing portion 12. At this time, the electrical contacts 64 (and the signal contacts 44) positioned in the first insertion space 110, more specifically, the power contacts 64A (and the signal contacts 44A), and the power contacts 64B (and the signal contacts 44B), form insertion openings that can elastically clamp one end of the retaining plate 92 in the vertical direction. Additionally, the substrate connection portion 65 (and the substrate connection portion 45) are respectively positioned in the second housing portion 12. On the other hand, the substrate connecting portions 65A (and 45A) and 65B (and 45B) located on the second housing portion 12 are soldered to the pads 76 and 75 on the substrate surface 701 of the system substrate 70 at connecting surfaces 65a and 45a. Additionally, although not explicitly shown in the drawings, the fixing surface 55a of the fixing portion 55 of the mounting accessory 50 is simultaneously fixed to the pad 77 on the substrate surface 701 of the system substrate 70 at the fixing surface 55a.

[0079] Further aspects, features, and effects of the present invention include the preferred mode for carrying out the invention, which will be readily understood from the following detailed description by illustrating several specific embodiments and examples. Furthermore, the invention can also be configured by other and different embodiments, and many details can be changed in various explicit ways without departing from the spirit and scope of the invention. Therefore, the drawings and descriptions are merely illustrative and not intended to limit the scope.

Claims

1. A relay connector, characterized in that, have: The housing has a first housing portion and a second housing portion, wherein the first housing portion is provided with a first insertion space for inserting a first substrate, and the second housing portion is provided with a second insertion space for inserting a second substrate; Multiple terminals are disposed across both the first housing portion and the second housing portion; as well as Mounting accessories are provided on the housing. The mounting accessory has a fixing part, which can be fixed to the substrate surface of the third substrate when at least a portion of the second housing part is inserted through a through hole provided in the third substrate.

2. The relay connector according to claim 1, characterized in that, The fixing part has a fixing surface, which can be fixed to the substrate surface of the third substrate located near the front side in the insertion direction when at least a portion of the second housing part is inserted into the through hole in the direction from the first housing part toward the second housing part.

3. The relay connector according to claim 1, characterized in that, The mounting fittings are provided on each side of the housing in an intersecting direction that intersects the direction along the insertion direction.

4. The relay connector according to claim 1, characterized in that, The mounting accessories are disposed on the first housing portion.

5. The relay connector according to claim 1, characterized in that, The fixing surface of the fixing part, which can be fixed to the substrate surface, is formed by bending along a surface that intersects the insertion direction.

6. The relay connector according to claim 1, characterized in that, The mounting accessory has a locking portion capable of locking onto the second base plate inserted into the second housing portion.

7. The relay connector according to claim 6, characterized in that, The installation accessories include: The base is mounted on the first housing portion; The locking portion is formed in an elastic arm portion extending from the base toward the insertion direction; and The fixing part has a fixing surface formed by bending one end of the base.

8. The relay connector according to claim 1, characterized in that, The first substrate is inserted into the first insertion space from the first housing portion toward the second housing portion. The second substrate is inserted into the second insertion space from the second housing portion toward the first housing portion.

9. The relay connector according to claim 1, characterized in that, A substrate connection portion capable of connecting to the third substrate is provided on the second housing portion side of a portion of the plurality of terminals.

10. The relay connector according to claim 9, characterized in that, The substrate connecting portion has a connecting surface, and when at least a portion of the second housing portion is inserted into the through hole in the direction from the first housing portion toward the second housing portion, the connecting surface can be connected to the substrate surface of the third substrate.

11. The relay connector according to claim 10, characterized in that, The connecting surface is arranged along the surface that intersects the insertion direction.

12. The relay connector according to claim 10, characterized in that, The connecting surface is disposed on the second housing portion side of the boundary between the first housing portion and the second housing portion in a direction along the insertion direction.

13. The relay connector according to claim 10, characterized in that, The connecting surface is formed by bending each of the portion of terminals along a surface that intersects the insertion direction.

14. The relay connector according to claim 10, characterized in that, The connecting surface is positioned at the same location as the fixing surface of the fixing part in the direction along the insertion direction.

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