High power broadband multilayer tile transceiver assembly and method of assembly

Abstract

The application provides a high-power broadband multilayer tile type transceiving assembly and an assembling method thereof. The assembly is composed of a structure-independent transceiving subassembly and an amplitude and phase control subassembly. The two are electrically interconnected and detachably fixedly connected through elastic connecting bodies between the subassemblies. The transceiving subassembly comprises a transceiving front-end micro module with a cavity, a first elastic connecting body and a power management micro module as a cover plate. The amplitude and phase control subassembly comprises an attenuation and phase shift micro module with a cavity, a second elastic connecting body and a filter combining micro module as a cover plate. The application realizes high-power heat dissipation by closely attaching high heat consumption devices to a heat sink through modular decoupling, avoids complex stacking and multiple welding of a single cavity, and enables independent air-tight packaging and electrical adjustment and measurement of each subassembly, thereby significantly improving the processing yield, structural reliability and convenience of later maintenance and replacement of the product.

Description

Technical Field

[0001] This invention relates to the field of phased array antenna technology, and more specifically, to a high-power broadband multi-layer tile transceiver assembly and its assembly method. Background Technology

[0002] As the core of modern radar and communication systems, active phased array antennas initially adopted a "brick-like" structure for their transceiver components. This structure, where circuits are arranged vertically and orthogonal to the antenna array, offers advantages such as simple circuitry, good heat dissipation, and mature technology. However, its vertical dimension optimization is extremely limited, making it difficult to meet the urgent demands of modern equipment for low profile, lightweight design, and miniaturization. To overcome these shortcomings, the "tile-like" structure emerged. Tile-like components integrate functional modules such as RF circuits and control circuits layered onto a planar substrate, vertically interconnected and parallel to the antenna array, thus forming a low-profile structure. However, the horizontal dimensions of tile-like components are limited by the spacing between antenna elements. Especially in broadband, high-power applications, the variety of components and their large footprint force the components to adopt a multi-layer stacked structure within a single component. This complex inter-layer stacking not only reduces reliability but also poses significant challenges to high-power heat dissipation and mass production.

[0003] Existing solutions attempt to alleviate these contradictions, but significant drawbacks remain. For example, Chinese invention patent CN111835376A discloses a highly integrated multi-channel tile-type transceiver assembly that integrates three planar substrates and two transition modules within a single hermetically sealed enclosure. This method of centrally packaging high-power chips and other control chips within the same hermetically sealed cavity is not only structurally complex and inconvenient to disassemble and assemble, but also makes fault location extremely difficult during production and testing, severely restricting product manufacturability and subsequent maintainability.

[0004] Another solution, such as the high-power tile-type transceiver component disclosed in Chinese invention patent CN116545466B, involves mounting power amplifiers and other chips by creating cavities inside and on the surface of two types of circuit substrates, and then soldering the power amplifiers onto an embedded metal body to handle heat dissipation. However, creating large-area cavities on ceramic-based circuit substrates severely compromises the physical strength of the substrates, leading to decreased reliability. If organic substrates are used instead, the low dielectric constant of the substrates results in excessively wide high-frequency traces, which cannot meet the high-density wiring requirements of miniaturized designs. Furthermore, this solution relies on soldering between the two types of circuit substrates to achieve signal interconnection, involving a stringent high-temperature process. The temperature gradient in the process is difficult to achieve, resulting in poor actual manufacturability.

[0005] In summary, how to overcome the contradictions between high-density integration in a single cavity and heat dissipation, maintainability, and processing technology in existing tile-type components, and provide a transceiver component that meets the requirements of high power and low profile while possessing excellent manufacturability, ease of commissioning and testing, and structural reliability, has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] The present invention aims to solve at least one of the aforementioned technical problems existing in the prior art.

[0007] To this end, the first aspect of the present invention provides a high-power broadband multilayer tile transceiver component.

[0008] The second aspect of the present invention provides a method for assembling a high-power broadband multilayer tile transceiver assembly.

[0009] The present invention provides a high-power broadband multilayer tile transceiver assembly, comprising a transceiver sub-assembly and an amplitude and phase control sub-assembly that are structurally independent of each other. The transceiver sub-assembly and the amplitude and phase control sub-assembly are detachably fixedly connected, and the two are electrically connected through an elastic connector between the sub-assemblies. The transceiver sub-assembly includes a transceiver front-end micro-module, a power management micro-module, and a first elastic connector disposed between the two. The transceiver front-end micro-module includes a first cavity and a transceiver front-end circuit disposed within the first cavity. The power management micro-module is disposed on the first cavity and closed with the first cavity. The amplitude and phase control sub-assembly includes an attenuation phase shifting micro-module, a filter combining micro-module, and a second elastic connector disposed between the two. The attenuation phase shifting micro-module includes a second cavity and an amplitude and phase multifunctional circuit disposed on the second cavity. The filter combining micro-module is covered on the second cavity and closed with the second cavity.

[0010] The high-power broadband multilayer tile transceiver assembly according to the above-described technical solution of the present invention may also have the following additional technical features: In the above technical solution, the transceiver front-end micro-module further includes several sets of first micro-connectors installed at the bottom of the first cavity. The first micro-connectors serve as the receiving input port and transmitting output port of the component, and the bottom surface of the first cavity is a heat dissipation surface configured to be in close contact with an external heat sink.

[0011] In the above technical solution, the power management micro-module includes a first cover plate and a first multilayer substrate fixed inside the first cover plate. The leakage control circuit and the self-test and combining circuit are mounted on the first multilayer substrate. The first elastic connector presses against the transceiver front-end circuit and the first multilayer substrate to achieve vertical electrical interconnection between the two.

[0012] In the above technical solution, the first cover plate is sealed to the edge of the first cavity by seam welding to form a first hermetically sealed device that internally accommodates the transceiver front-end circuit and the first multilayer substrate.

[0013] In the above technical solution, the main support structure of the attenuation phase-shifting micromodule is the second cavity, and the amplitude-phase multifunctional circuit is mounted on the upper surface of the second multilayer substrate fixed at the bottom of the second cavity.

[0014] In the above technical solution, the filter combining micro-module includes a second cover plate, a third multilayer substrate fixed inside the second cover plate, and a number of second micro-connectors passing through the second cover plate. The filter capacitor and the combining circuit are mounted on the third multilayer substrate. The second micro-connector serves as a receive output port, a transmit input port, and a transmit / receive self-test port.

[0015] In the above technical solution, the second elastic connector is pressed between the second multilayer substrate and the third multilayer substrate to achieve vertical electrical interconnection between the two; the second cover plate is sealed to the edge of the second cavity by seam welding to form a second hermetically sealed device that internally accommodates the phase-multifunctional circuit and the third multilayer substrate.

[0016] In the above technical solution, the first cavity is made of aluminum or diamond aluminum material; the first elastic connector, the second elastic connector and the elastic connector between sub-assemblies all include a metal support and a snap button embedded in the metal support.

[0017] In the above technical solution, the multilayer substrates used inside the multilayer tile transceiver are all multilayer LTCC substrates, multilayer HTCC substrates or multilayer organic substrates with regular planar shapes.

[0018] This invention provides an assembly method for a high-power broadband multilayer tile transceiver assembly, applicable to the assembly of a high-power broadband multilayer tile transceiver assembly as described in any of the above technical solutions. The assembly method includes: The transceiver sub-assembly and the amplitude and phase control sub-assembly are assembled independently, and the two sub-assemblies are independently hermetically sealed and electrically tested. After both the transceiver sub-component and the amplitude and phase control sub-component have passed the adjustment and testing, the elastic connectors between the sub-components are placed between the two sub-components, and the transceiver sub-component and the amplitude and phase control sub-component are structurally fastened by detachable fasteners to form an integrated component with internal signal communication.

[0019] In summary, due to the adoption of the above-mentioned technical features, the beneficial effects of the present invention are: This invention achieves complete modular decoupling in terms of manufacturability and subsequent maintenance of tile-type transceiver components. By splitting the component into independent transceiver sub-components and amplitude / phase control sub-components, these sub-components can be independently assembled, debugged, and arbitrarily paired, enabling low-cost and rapid disassembly and replacement. This architecture overcomes the inherent defects of existing technologies that integrate three planar substrates and two adapter modules within a single hermetically sealed package, leading to difficulties in fault location during debugging and poor manufacturability. Furthermore, each transceiver and amplitude / phase control sub-component contains at most two micro-modules and one flexible connector, resulting in a simple structure that is easy to assemble and disassemble, further ensuring excellent manufacturability.

[0020] The solution breaks through the heat dissipation bottleneck of high-power tile-type components in terms of thermal management architecture. The innovative design places high heat-dissipating devices such as transceiver front-end circuits in the first cavity, so that the bottom of the cavity is a heat dissipation surface that is directly attached to the heat sink. This provides a reliable heat conduction path for high-power operation under high-density integration from a physical structure perspective, thereby achieving the same heat dissipation capacity and power output capacity as "brick-type" transceiver components.

[0021] In terms of process reliability, this invention eliminates the risks associated with irregular structures and multiple high-temperature welding. The multilayer substrate in this invention has a regular shape, avoiding blind cavities and other irregular structures, thus ensuring high substrate strength and reliability. This effectively avoids the problem of reduced substrate strength caused by creating cavities in the ceramic-based circuit substrate in existing technologies. Furthermore, the component eliminates the difficulties in achieving high-temperature processes and temperature gradients involved in connecting two circuit substrates via welding, instead utilizing elastic connectors to achieve vertical electrical interconnection between layers, improving the long-term operational stability and assembly yield of the component.

[0022] This invention offers inherent advantages in electromagnetic compatibility and architectural scalability through isolation and expansion. By packaging the transceiver sub-components and amplitude / phase control sub-components as independent sub-components, signal crosstalk is effectively avoided physically, significantly improving the electromagnetic compatibility of the components. Furthermore, thanks to this modular stacking concept based on flexible interconnection, the number of sub-components and the number of flexible connections between sub-components can be expanded according to the complexity of the components, reserving ample design redundancy for future system upgrades of the phased array antenna.

[0023] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram showing the positional relationship of a high-power broadband multilayer tile transceiver component according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the assembly of a high-power broadband multilayer tile transceiver module according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the stacked high-power broadband multilayer tile transceiver assembly according to an embodiment of the present invention.

[0025] in, Figures 1 to 3 The correspondence between the reference numerals and component names in the attached drawings is as follows: 1. First cavity; 2. Second cavity; 3. Hair button; 4. Transceiver front-end circuit; 5. First multilayer substrate; 6. Second multilayer substrate; 7. Third multilayer substrate; 8. First elastic connector; 9. Second elastic connector; 10. Elastic connector between sub-assemblies; 11. Second micro connector; 12. First micro connector; 13. Second cover plate; 14. First cover plate; 15. Amplitude and phase control sub-assembly; 16. Transceiver sub-assembly. Detailed Implementation

[0026] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0028] The following reference Figures 1 to 3 This invention describes a high-power broadband multilayer tile transceiver assembly and its assembly method provided according to some embodiments of the present invention.

[0029] Some embodiments of this application provide a high-power broadband multi-layer tile transceiver assembly.

[0030] like Figures 1 to 3As shown, the first embodiment of this invention proposes a high-power broadband multilayer tile-type transceiver module. From the perspective of the overall system architecture, this module breaks through the conventional design approach of concentrating all microwave substrates and RF circuits in a single enclosed cavity, instead adopting a decoupled and modular design concept. The module mainly comprises two structurally independent core parts: the transceiver sub-module 16 and the amplitude and phase control sub-module 15. This physical architecture, which divides the entire transceiver module into two relatively independent sub-modules, provides the basic physical conditions for subsequent independent production, independent commissioning, and rapid disassembly and replacement in case of failure. The transceiver sub-module 16 and the amplitude and phase control sub-module 15 are physically detachably fixedly connected, while in terms of electrical transmission, they are reliably electrically connected to each other via elastic connectors 10 between the sub-modules to achieve RF signals, control signals, and power supply, thus forming a fully functional integrated module in the final assembled state.

[0031] Within this overall architecture, the transceiver sub-assembly 16 is constructed as a stack of multiple micro-modules. The transceiver sub-assembly 16 includes a transceiver front-end micro-module, a power management micro-module, and a first elastic connector 8 positioned between them. The transceiver front-end micro-module carries most of the high-heat-dissipation devices, and its main structure includes a first cavity 1 and a transceiver front-end circuit 4 disposed within the first cavity 1. To achieve self-sealing of the micro-module, the power management micro-module is designed as a dual-function structure, not only carrying the corresponding control circuitry but also directly covering and closing the first cavity 1, thus forming a physical seal on the top of the transceiver sub-assembly 16.

[0032] In some embodiments, the transceiver front-end micromodule further includes several sets of first micro-connectors 12 mounted on the bottom of the first cavity 1. The first micro-connectors 12 are typically configured as the receive input port and transmit output port of the entire high-power broadband multilayer tile transceiver assembly, used for high-frequency signal interaction with external devices such as antenna radiating units. To cope with the enormous heat generated by the transceiver front-end circuit 4 under high-power operating conditions, the bottom surface of the first cavity 1 is specially configured as a heat dissipation surface closely attached to the external heat sink. This design places the transceiver front-end circuit 4, where heat generation is most concentrated, directly on the physical layer closest to the bottom heat sink, allowing heat to be conducted to the external cooling system via the shortest physical path, effectively preventing heat accumulation between the multilayer substrates inside the assembly.

[0033] In one specific embodiment, the aforementioned power management micromodule is further refined to include a first cover plate 14 and a first multilayer substrate 5 fixed inside the first cover plate 14. Components such as leakage control circuitry and self-test combining circuitry are mounted on the first multilayer substrate 5. To achieve vertical signal interconnection without using conventional rigid welding processes, a first elastic connector 8 is correspondingly arranged and pressed between the transceiver front-end circuit 4 and the first multilayer substrate 5. The first elastic connector 8 undergoes moderate elastic deformation under pressure to compensate for assembly tolerances in the Z-axis direction of the multilayer structure and deformation caused by thermal expansion and contraction, thereby achieving vertical electrical interconnection between the transceiver front-end circuit 4 and the first multilayer substrate 5. Furthermore, to protect the internal RF circuitry of the transceiver sub-assembly 16 from harsh external environments, the first cover plate 14 is sealed to the edge of the first cavity 1 using laser seam welding or parallel seam welding. The seam welding process can form a continuous and dense metal fusion line in the edge region, thereby forming a first hermetically sealed enclosure that internally accommodates the transceiver front-end circuit 4 and the first multilayer substrate 5. This hermetically sealed device can be independently leak tested to ensure that the airtightness meets the expected requirements.

[0034] Echoing the design logic of the transceiver sub-assembly 16, the amplitude and phase control sub-assembly 15 also adopts a stacked self-enclosed architecture based on micro-modules with integrated cavities and cover plates. The amplitude and phase control sub-assembly 15 includes an attenuation phase-shifting micro-module, a filter combining micro-module, and a second elastic connector 9 located between the two. The main support structure of the attenuation phase-shifting micro-module is the second cavity 2, and the amplitude and phase multifunctional circuit is mounted on the upper surface of the second multilayer substrate 6 fixed to the bottom of the second cavity 2. The filter combining micro-module serves to cover the second cavity 2, covering and closing it.

[0035] In some embodiments, the specific structure of the filter combining micromodule includes a second cover plate 13, a third multilayer substrate 7 fixed inside the second cover plate 13, and a plurality of second micro-connectors 11 passing through the second cover plate 13. Filtering capacitors and combining circuits, and other components are mounted on the third multilayer substrate 7 according to the circuit topology. The second micro-connectors 11 passing through the second cover plate 13 serve as the receive output port, transmit input port, and transmit / receive self-test port of the entire assembly, and are used to connect to the beamforming network of the phased array antenna or the external feed network.

[0036] In one specific embodiment, the interlayer interconnection and packaging method inside the amplitude and phase control sub-assembly 15 is similar to that of the transceiver sub-assembly 16. The second elastic connector 9 is pressed between the second multilayer substrate 6 and the third multilayer substrate 7, using its own elastic compression to ensure reliable contact at each electrical contact point, thereby achieving vertical electrical interconnection between the two. At the same time, the second cover plate 13 is sealed to the edge of the second cavity 2 by seam welding, thereby forming a second hermetically sealed package that internally accommodates the amplitude and phase multifunctional circuit and the third multilayer substrate 7.

[0037] In some embodiments, specific optimizations have been made to the selection of the support structure and thermally conductive materials. The first cavity 1 is made of aluminum or diamond aluminum. Metal matrix composites such as diamond aluminum not only possess low-density characteristics similar to traditional aluminum alloys, but also have extremely high thermal conductivity and adjustable coefficient of thermal expansion, which can better match the thermal expansion characteristics of the microwave substrate and the chip, reducing thermal stress. To ensure the reliability of vertical interconnection, the first elastic connector 8, the second elastic connector 9, and the elastic connector 10 between sub-components all include a metal support and a snap button 3 embedded in the metal support. The snap button 3 is typically made of coiled fine beryllium copper wire or gold-plated molybdenum wire, which has excellent conductivity, high-frequency transmission characteristics, and elastic recovery ability, and can maintain stable contact resistance and low insertion loss under long-term vibration and thermal cycling environments. In addition, to ensure the processing yield and physical strength of the substrate, the first multilayer substrate 5, the second multilayer substrate 6, and the third multilayer substrate 7 used inside the component are all multilayer LTCC substrates, multilayer HTCC substrates, or multilayer organic substrates with regular planar shapes. The regular planar shape avoids the need to process complex blind cavities or irregular steps inside the substrate, effectively maintaining the overall bending strength of the multilayer substrate and reducing the risk of microcracks during subsequent assembly under pressure.

[0038] In one specific embodiment, the technical solution of the present invention also covers the assembly method of the above-mentioned high-power broadband multilayer tile transceiver module. This method fully utilizes the aforementioned modular decoupling architecture and specifically includes the following assembly and commissioning steps: The transceiver sub-module 16 and the amplitude-phase control sub-module 15 are assembled independently. During their respective assembly processes, the internal circuitry of the cavity and the multilayer substrate are mounted and interconnected, and the two sub-modules are independently hermetically sealed using a seam welding process. After packaging, the transceiver sub-module 16 and the amplitude-phase control sub-module 15 are independently electrically commissioned using a dedicated test fixture. For example, the gain, output power, and noise figure of the transceiver sub-module 16 can be tested separately, and the phase shift accuracy, attenuation accuracy, and out-of-band rejection of the amplitude-phase control sub-module 15 can be tested separately. After both the transceiver sub-module 16 and the amplitude-phase control sub-module 15 have passed commissioning, the final component-level assembly stage begins. The inter-sub-module elastic connector 10 is placed between the two sub-modules, such that the snap fastener 3 inside the elastic connector aligns with the electrical contact pads reserved on the surfaces of the two sub-modules. Subsequently, the transceiver sub-assembly 16 and the amplitude and phase control sub-assembly 15 are structurally secured using detachable fasteners such as screws. Under the action of the fastening force, the elastic connecting parts 10 between the sub-assemblies are moderately compressed, thereby forming an integrated assembly with internal signal communication. If a functional module is found to be damaged during subsequent use, maintenance personnel only need to loosen the fasteners to disassemble and replace the faulty sub-assembly individually, without discarding the entire assembly, effectively reducing maintenance costs and improving equipment availability.

[0039] From the perspective of the electrical signal transmission flow, in the receiving mode, the radio frequency signal first enters the transceiver front-end circuit 4 through the first micro-connector 12. After low-noise amplification and other processing, the signal is transmitted vertically upwards via the first elastic connector 8 to the relevant circuits on the first multilayer substrate 5. It then passes through the inter-sub-component elastic connector 10 to enter the second multilayer substrate 6 of the amplitude and phase control sub-component 15. On the second multilayer substrate 6, the signal undergoes precise phase and amplitude adjustment via the amplitude and phase multifunction circuit, and then is transmitted to the third multilayer substrate 7 via the second elastic connector 9. After filtering and combining, it is finally output to the external network from the second micro-connector 11. In the transmitting mode, the signal flow is the opposite of the receiving process. The high-power transmit signal is amplified by the power amplifier in the transceiver front-end circuit 4, which is close to the bottom heat sink, and output through the first micro-connector 12. The large amount of heat generated during amplification is directly conducted to the external heat dissipation structure through the bottom of the first cavity 1. This clear three-dimensional spatial layout and signal flow planning provides a reliable engineering implementation path for the design of high-power tile-type components.

[0040] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this invention shall be included within the scope of protection of this invention.

Claims

1. A high-power broadband multi-layer tile transceiver component, characterized in that, It includes a transceiver sub-component and an amplitude and phase control sub-component, which are structurally independent of each other. The transceiver sub-component and the amplitude and phase control sub-component are detachably fixedly connected, and the two are electrically connected through an elastic connector between the sub-components. The transceiver sub-assembly includes a transceiver front-end micro-module, a power management micro-module, and a first elastic connector disposed between the two. The transceiver front-end micro-module includes a first cavity and a transceiver front-end circuit disposed within the first cavity. The power management micro-module is disposed on the first cavity and closed with the first cavity. The amplitude and phase control sub-assembly includes an attenuation phase shifting micro-module, a filter combining micro-module, and a second elastic connector disposed between the two. The attenuation phase shifting micro-module includes a second cavity and an amplitude and phase multifunctional circuit disposed on the second cavity. The filter combining micro-module is covered on the second cavity and closed with the second cavity.

2. The high-power broadband multi-layer tile transceiver assembly according to claim 1, characterized in that, The transceiver front-end micro-module also includes several sets of first micro-connectors installed at the bottom of the first cavity. The first micro-connectors serve as the receiving input port and transmitting output port of the component. The bottom surface of the first cavity is a heat dissipation surface configured to be in close contact with an external heat sink.

3. The high-power broadband multi-layer tile transceiver assembly according to claim 2, characterized in that, The power management micro-module includes a first cover plate and a first multilayer substrate fixed inside the first cover plate. A leakage control circuit and a self-test and combining circuit are mounted on the first multilayer substrate. The first elastic connector presses against the transceiver front-end circuit and the first multilayer substrate to achieve vertical electrical interconnection between the two.

4. The high-power broadband multi-layer tile transceiver assembly according to claim 3, characterized in that, The first cover plate is sealed to the edge of the first cavity by seam welding to form a first hermetically sealed device that internally accommodates the transceiver front-end circuit and the first multilayer substrate.

5. The high-power broadband multi-layer tile transceiver assembly according to claim 1, characterized in that, The main support structure of the attenuation phase-shifting micromodule is the second cavity, and the amplitude-phase multifunctional circuit is mounted on the upper surface of the second multilayer substrate fixed at the bottom of the second cavity.

6. The high-power broadband multi-layer tile transceiver assembly according to claim 5, characterized in that, The filtering and combining micro-module includes a second cover plate, a third multilayer substrate fixed inside the second cover plate, and several sets of second micro-connectors passing through the second cover plate. The filtering capacitor and the combining circuit are mounted on the third multilayer substrate. The second micro-connectors serve as a receive output port, a transmit input port, and a transmit / receive self-test port.

7. The high-power broadband multi-layer tile transceiver assembly according to claim 6, characterized in that, The second elastic connector is pressed between the second multilayer substrate and the third multilayer substrate to achieve vertical electrical interconnection between the two; the second cover plate is sealed to the edge of the second cavity by seam welding to form a second hermetically sealed device that internally accommodates the phase-multifunctional circuit and the third multilayer substrate.

8. The high-power broadband multi-layer tile transceiver assembly according to claim 1, characterized in that, The first cavity is made of aluminum or diamond aluminum; the first elastic connector, the second elastic connector and the elastic connector between sub-assemblies all include a metal support and a snap button embedded in the metal support.

9. The high-power broadband multi-layer tile transceiver assembly according to claim 3, 5, or 6, characterized in that, The multilayer tile-type transceiver uses multilayer substrates with regular planar shapes, such as multilayer LTCC substrates, multilayer HTCC substrates, or multilayer organic substrates.

10. A method for assembling a high-power broadband multilayer tile transceiver assembly, characterized in that, The assembly method for high-power broadband multilayer tile transceiver components as described in any one of claims 1 to 9 includes: The transceiver sub-assembly and the amplitude and phase control sub-assembly are assembled independently, and the two sub-assemblies are independently hermetically sealed and electrically tested. After both the transceiver sub-component and the amplitude and phase control sub-component have passed the adjustment and testing, the elastic connectors between the sub-components are placed between the two sub-components, and the transceiver sub-component and the amplitude and phase control sub-component are structurally fastened by detachable fasteners to form an integrated component with internal signal communication.

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