Microphone system

Abstract

The application discloses a microphone system, comprising at least one pickup panel, a first host and a transmission cable connected between the pickup panel and the first host, the pickup panel and the first host are physically separated; wherein the at least one pickup panel is used for picking up at least one group of audio signals, and converting the audio signals into modulated signals and then sending the modulated signals to the first host through the transmission cable; the first host is used for processing the received modulated signals to obtain output signals; and the transmission cable is used for realizing the transmission of the modulated signals between the pickup panel and the first host. Through the above technical scheme, the pickup panel can be independently arranged at a pickup position required to be arranged, and the first host can be arranged at another position, for example, the first host can be hidden, so that the layout of adapting to a complex environment is realized.

Description

Technical Field

[0001] This application relates to the field of audio technology, specifically to a microphone system. Background Technology

[0002] In modern remote collaboration and communication, conference rooms have become a core setting for high-quality audio interaction. Conference room audio systems need to be able to stably pick up the speech of each participant in complex indoor acoustic environments, effectively eliminate echoes and suppress noise, and ensure pure and natural sound to provide an immersive communication experience for local and remote participants.

[0003] In related technologies, integrated microphones typically integrate the pickup unit and signal processing circuitry into the same housing. While this highly integrated structure is compact, it reduces sound quality in practical applications for the following reasons: First, limited by the confined internal space and complex electromagnetic environment, the computing power and algorithm performance of the audio processing chip (such as deep noise reduction, adaptive echo cancellation, and high-precision beamforming) cannot be fully utilized, resulting in limited processing effects. Second, the close proximity of the pickup unit, processing circuitry, and power module makes it easy to introduce circuit noise, power supply ripple interference, and mechanical vibration coupling, damaging the original purity of the audio signal. Furthermore, the fixed integrated design makes it difficult to flexibly optimize the position, angle, and directivity of the pickup unit according to the actual acoustic structure of the conference room (such as room size, reverberation time, and background noise source location), which may lead to blind spots, insufficient far-field sensitivity, or over-collection of environmental reverberation, ultimately hindering the improvement of overall sound quality. Summary of the Invention

[0004] A microphone system is provided to address the sound quality issues of microphone systems in the related art.

[0005] According to a first aspect of this application, a microphone system is provided, comprising at least one pickup panel, a first host, and a transmission cable connecting the pickup panel and the first host, wherein the pickup panel and the first host are physically separated; wherein... At least one of the pickup panels is used to pick up audio signals and convert the audio signals into modulated signals before sending them to the first host via the transmission cable; The transmission cable is used to transmit the modulation signal from the pickup panel to the first host. The first host is used to receive and process the modulation signal to obtain an output signal.

[0006] Optionally, the pickup panel includes: A microphone array for picking up the audio signal; An analog-to-digital converter module is used to convert the audio signal into a first digital signal; and A modulation and demodulation module is used to convert the first digital signal into a modulated signal and then send it to the first host through the transmission cable; The analog-to-digital conversion module is connected between the modulation / demodulation module and the microphone array.

[0007] Optionally, the modulated signal includes a first differential signal; The modulation and demodulation module includes: A first serializer is used to convert the first digital signal into a first differential signal and then send it to the first host via the transmission cable.

[0008] Optionally, the first host includes: A first deserializer is used to convert the first differential signal into a second digital signal; A first processor is configured to perform processing operations on the second digital signal to obtain a third digital signal; The processing operation includes at least one of the following: Noise reduction, automatic mixing, echo cancellation, and enhancement.

[0009] Optionally, the first host further includes a second processor and at least one output port; The second processor is used to receive the third digital signal and distribute it to the corresponding output port.

[0010] Optionally, the output port includes: The first port is used to convert the third digital signal into an analog signal and then output it; The second port is used to package the third digital signal into a network protocol packet and then output it.

[0011] Optionally, the second processor is further configured to manage the operating status of the microphone system and to perform parameter configuration of the microphone system.

[0012] Optionally, the second processor is further configured to send the configuration parameters of the pickup panel to the first processor; The first host also includes: The second serializer is connected to the first processor. The second serializer is used to convert the configuration parameters of the pickup panel into a second differential signal and then send it to the pickup panel through the transmission cable. The pickup panel also includes: The second deserializer is used to receive the second differential signal and convert it into a fourth digital signal.

[0013] Optionally, the configuration parameters include a clock synchronization signal; the first host is further configured to: The clock synchronization signal is simultaneously sent to multiple of the pickup panels.

[0014] Optionally, the pickup panel has a thickness of 3mm to 10mm and is configured to be mounted on a ceiling or desktop.

[0015] Optionally, the pickup panel further includes: The first power supply port is used to receive power from external devices and to enable data interaction with external devices.

[0016] Optionally, the transmission cable is also used to realize signal transmission and power exchange between the pickup panel and the first host.

[0017] Optionally, the first host further includes: The second power supply port is used to receive power from external devices and to enable data interaction with external devices.

[0018] Optionally, the pickup panel further includes a first module interface, the first host further includes a second module interface, and the transmission cable is connected between the first module interface and the second module interface.

[0019] Optionally, the pickup panel further includes: A preamplifier circuit is used to amplify the audio signal picked up by the microphone array; The preamplifier circuit is connected between the microphone array and the analog-to-digital converter module.

[0020] This application provides a microphone system that can be flexibly arranged and effectively improve the audio acquisition quality and transmission stability.

[0021] More specifically, some embodiments of this application may produce the following specific beneficial effects: On the one hand, by physically separating the pickup panel from the first host through the above technical solution, the pickup panel can be independently deployed at the required pickup position according to the usage scenario, while the host is placed in another position, for example, the host can be hidden, thus achieving a layout that adapts to complex environments; on the other hand, by physically separating the pickup panel, the picked-up audio signal is converted into a modulation signal and then transmitted to the first host through a transmission cable. The first host then processes the modulation signal to obtain the output signal, effectively avoiding the distortion and attenuation problems caused by interference in long-distance analog transmission of audio signals, thereby improving the stability and fidelity of audio transmission; furthermore, the pickup panel is far away from potential interference sources such as the processing circuit and power module of the first host, physically isolating the influence of circuit noise on the front-end analog signal, ensuring the high fidelity and high signal-to-noise ratio of the original audio signal. On the other hand, physically separating the pickup panels from the main unit allows for flexible adjustment of the number of pickup panels according to usage needs, thereby expanding the pickup range of the microphone system, meeting the pickup requirements of multiple scenarios and areas, and improving the scalability and deployment flexibility of the microphone system. Furthermore, it enables flexible optimization of the position, angle, and directivity of the pickup units based on the actual acoustic structure of the conference room (such as room size, reverberation time, and background noise source location), reducing pickup blind spots, improving far-field sensitivity, and avoiding ambient reverberation, effectively improving the overall sound quality of the microphone system. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structural architecture of the microphone system provided in an exemplary embodiment of this application; Figure 2 This is a schematic diagram of a microphone system provided in an exemplary embodiment of this application, in which multiple pickup panels are connected to a first host and a second host to form a star topology. Figure 3 This is a schematic diagram of the uplink between the pickup panel and the first host in an exemplary embodiment of this application; Figure 4 This is a schematic diagram of the position structure of the pickup panel relative to the ceiling provided in an exemplary embodiment of this application; Figure 5This is a schematic diagram of the position structure of the pickup panel and the first host provided in an exemplary embodiment of this application, in which the transmission of signals and power are connected by two transmission cables and relative to the ceiling. Figure 6 This is a schematic diagram of the position structure of the pickup panel and the first host provided in the exemplary embodiment of this application, in which the transmission of signals and power are connected by a transmission cable and relative to the ceiling.

[0024] Explanation of reference numerals in the attached figures: 10. Microphone system; 100. Pickup panel; 101. Mounting housing; 102. Support plate; 110. Microphone array; 120. Analog-to-digital converter module; 130. Modulation and demodulation module; 131. First serializer; 140. Second deserializer; 150. First power supply port; 160. First module interface; 170. Second module interface; 180. Preamplifier circuit; 190. First power supply module; 200. First host; 210. First deserializer; 220. First processor; 230. Second processor; 240, Output port; 241, First port; 242, Second port; 250, Second serializer; 260. Second power supply port; 270. Second power supply module; 300. Transmission cables; 400, Second Host; 20. Suspended ceiling. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0028] The use of "applies to" or "configured to" in this application implies open and inclusive language, which does not exclude the applicability to or configuration to devices performing additional tasks or steps. Additionally, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0029] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0030] Based on the technical issues mentioned in the background, conference rooms have become a core scenario for high-quality audio interaction in modern remote collaboration and communication. Conference room audio systems need to be able to stably capture the speech of each participant in complex indoor acoustic environments, effectively eliminate echoes and suppress noise, ensuring pure and natural sound, and providing an immersive communication experience for both local and remote participants.

[0031] In the field of conference audio equipment, traditional all-in-one microphone designs have long been considered the natural choice for meeting the sound pickup needs of conference rooms due to their compact structure and ease of deployment. The industry generally agrees that the challenges in improving sound quality primarily stem from the performance of the microphone unit itself, the precision of the algorithm processing, or achieving better circuit layout and shielding within limited space. Therefore, common technological improvement paths focus on selecting more sensitive microphone chips, integrating more powerful processors, or optimizing audio algorithms within a given all-in-one housing, attempting to achieve breakthroughs in sound quality under the constraints of high integration.

[0032] However, through in-depth analysis and practice, the inventors of this patent recognized a fundamental, yet long-overlooked, premise in the aforementioned common technical approaches: that "sound pickup" and "processing" must share the same physical space. It is this seemingly self-evident design constraint, rather than a specific component or algorithm, that constitutes the core root of the sound quality bottleneck. The inventors observed that within the integrated structure, the electromagnetic radiation generated by the high-performance audio processing chip, the ripple noise of the power supply circuit, and the extremely sensitive analog pickup unit create an irreconcilable physical contradiction. This contradiction cannot be completely resolved by improving a single component, as it stems from the inherent flaw at the system architecture level where "strong interference sources" and "weak signal sources" are forced to coexist closely.

[0033] The discovery process of this problem was further clarified and deepened in specific application scenarios. Taking ceiling-mounted installation as an example, traditional integrated ceiling microphones are often bulky in order to accommodate the processing circuitry, imposing strict requirements on installation space and ceiling height. The industry usually regards this as an unavoidable trade-off and focuses its research and development on how to make the circuit board smaller and the shielding better. However, the inventors broke out of this mindset and realized that "large size" and "limited sound quality" are not two independent problems, but two external manifestations of the same architectural problem: the root cause of the large size is to accommodate the processing circuitry, and the root cause of the limited sound quality is that these circuits cause near-field interference to the pickup unit. Therefore, the real technical challenge is not how to "integrate better", but how to "separate reasonably".

[0034] In view of this, a microphone system 10 is provided that can be flexibly arranged and effectively improve the audio acquisition quality and transmission stability, aiming to solve the space and sound quality limitations caused by integrated microphone systems. This application overcomes the problem of unbalanced space and sound quality caused by integrated microphone systems by physically separating the sound pickup function from the first host in the physical structure.

[0035] According to the first aspect of this application, reference to Figure 1A microphone system 10 is provided. In this embodiment, the microphone system 10 includes at least one pickup panel 100, a first host 200, and a transmission cable 300 connecting the pickup panel 100 and the first host 200. The pickup panel 100 and the first host 200 are physically separated. The at least one pickup panel 100 is used to pick up at least one set of audio signals and convert the audio signals into modulation signals, which are then transmitted to the first host 200 via the transmission cable 300. The first host 200 is used to process the received modulation signals to obtain an output signal. The transmission cable 300 is used to realize the transmission of modulation signals between the pickup panel 100 and the first host 200.

[0036] It should be noted that the pickup panel 100 in this embodiment is used to pick up at least one set of audio signals and convert the audio signals into modulation signals before sending them to the first host 200 via the transmission cable 300. Therefore, the pickup panel 100 in this example is only used to acquire audio signals and convert them into modulation signals. That is, the pickup panel 100 does not perform mixing, noise reduction, or sound source localization processing on the audio data. The transmitted audio data is the raw audio data that has not been mixed, noise reduced, or sound source localized by the pickup panel 100, and no further complex audio processing tasks are performed. In this way, it is not necessary to set up an additional processor or processing circuit for processing audio signals on the pickup panel 100. Instead, the first host 200 is used to centrally process complex audio signals, thereby simplifying the structure of the pickup panel 100, reducing its size, and improving installation flexibility. This results in a more compact structural design that can meet the installation requirements of a small ceiling space 20.

[0037] Through the above technical solution, on the one hand, by physically separating the pickup panel 100 from the first host 200, the pickup panel 100 can be independently deployed at the required pickup location according to the usage scenario, while the host can be placed in another location (such as inside a cabinet, where it can be hidden), thus flexibly adapting to complex environments. On the other hand, through this physically separated arrangement, the pickup panel 100 converts the picked-up audio signal into a modulated signal and transmits it to the first host 200 via the transmission cable 300. The first host 200 then processes the modulated signal to obtain the output signal, effectively avoiding distortion and attenuation problems caused by interference during long-distance analog transmission of audio signals, thereby improving the stability and fidelity of audio transmission. Furthermore, the pickup panel 100 is located away from the first host 200. The processing circuit and power module of the microphone system 10 physically isolate the circuit noise from the front-end audio signal, ensuring the high fidelity and high signal-to-noise ratio of the original audio signal. On the other hand, by physically separating the pickup panel 100 from the first host 200, the number of pickup panels 100 can be flexibly set according to usage needs, thereby expanding the pickup range of the microphone system 10, meeting the pickup needs of multiple scenarios and multiple areas, and improving the scalability and deployment flexibility of the microphone system 10. Furthermore, the position, angle and directivity of the pickup unit can be flexibly optimized according to the actual acoustic structure of the conference room (such as room size, reverberation time, and background noise source location), reducing pickup blind spots, improving far-field sensitivity, and avoiding reverberation in the acquisition environment, effectively improving the overall sound quality of the microphone system.

[0038] Understandably, in this example, the reference Figure 2 The number of pickup panels 100 can be multiple, and these multiple pickup panels 100 can be distributed in different locations, such as different locations on the ceiling 20, and each can be connected to the first host 200 through its own transmission cable 300. In this way, on the one hand, the complexity of wiring can be reduced; on the other hand, a single first host 200 can integrate and process the audio signals of multiple pickup panels 100 to cover a wider pickup area and enhance the uniformity of sound field perception. When the speaker moves from the coverage area of ​​one pickup panel 100 to the coverage area of ​​another pickup panel 100, the first host 200 can perform seamless and high-precision sound source localization across the entire macro array range based on the time difference of arrival (TDOA) of the audio signals received by all pickup panels 100. This enables the microphone system 10 to continuously track moving sound sources and avoid pickup blind spots.

[0039] In an optional embodiment, the microphone system 10 in this example can be implemented as a ceiling-mounted microphone 20 to pick up audio signals. That is, the pickup panel 100 is attached to the side of the ceiling 20 facing the ambient space, while the first host 200 is located on the side of the ceiling 20 away from the ambient space. In this case, only a small hole needs to be made in the ceiling 20 for the transmission cable 300 to pass through, and the microphone system 10 can be installed by passing the transmission cable 300 through the small hole. In this way, damage to the structure of the ceiling 20 can be greatly reduced, while improving the overall aesthetics.

[0040] In an optional embodiment, the microphone system 10 in this example also adopts the form of a ceiling microphone. Multiple pickup panels 100 can be distributed in different areas within the ceiling 20. The first host 200 can be placed in other easily concealed locations such as a cabinet or a low-voltage box. By having the distributed pickup panels 100 work together with the concealed first host 200, the microphone system 10 can be installed without damaging the structure of the ceiling 20, thus eliminating the dependence on the installation space inside the ceiling 20 and making the deployment of the microphone system 10 more flexible.

[0041] In some embodiments, please refer to Figure 1 The pickup panel 100 includes a microphone array 110, an analog-to-digital converter module 120, and a modulation / demodulation module 130. In this embodiment, the microphone array 110 is used to pick up audio signals, the analog-to-digital converter module 120 is used to convert the audio signals into a first digital signal, and the modulation / demodulation module 130 is used to convert the first digital signal into a modulated signal and then transmit it to the first host 200 via a transmission cable 300. The analog-to-digital converter module 120 is connected between the modulation / demodulation module 130 and the microphone array 110.

[0042] By adopting the above technical solution, the pickup panel 100 is divided into a microphone array 110, an analog-to-digital converter module 120, and a modulation and demodulation module 130, realizing a modular layout of the pickup panel 100. At this end of the pickup panel 100, the microphone array 110 realizes the acquisition of audio signals, the analog-to-digital converter module 120 realizes analog-to-digital conversion, and the modulation and demodulation module 130 realizes modulation and demodulation processing, which efficiently converts analog audio signals into digital signals and performs preliminary demodulation, which is convenient for stable long-distance transmission and avoids the noise and loss that may be introduced by long-distance transmission of analog signals inside the panel, and can provide a relatively pure digital signal source for the first host 200.

[0043] As a more specific technical solution, taking the microphone panel 100 in this embodiment of the application as an example, which includes a mounting housing 101 and a support plate 102, the mounting housing 101 has an installation space, and the support plate 102 is located in the installation space. The microphone array 110, the analog-to-digital conversion module 120, and the modulation and demodulation module 130 are all set on the support plate 102, realizing the modularization of the overall structure of the microphone panel 100, and enabling the microphone panel 100 to be distributed according to needs.

[0044] In some embodiments, the modulated signal includes a first differential signal. Please continue to refer to... Figure 1 The modulation and demodulation module 130 in this embodiment includes a first serializer 131. The first serializer 131 in this embodiment converts a first digital signal into a first differential signal and then transmits it to a first host 200 via a transmission cable 300. The first serializer 131 in this embodiment can convert multiple parallel first digital signals into a high-speed serial differential stream. On the one hand, the first differential signal has strong anti-interference capability and can maintain signal transmission stability in complex electromagnetic environments, effectively reducing the impact of common-mode noise during transmission. On the other hand, by using the first serializer 131 to achieve differential encoding and high-speed serial output of digital signals, transmission efficiency can be improved and cable resource occupation can be reduced, making it suitable for reliable transmission of long-distance, high-fidelity audio data.

[0045] For example, the first serializer 131 can be a Low-Voltage Differential Signaling Serializer (LVDS serializer), and correspondingly, the aforementioned first differential signal is a first Low-Voltage Differential Signaling (LVDS) signal. LVDS signals have low voltage swing and differential transmission characteristics, which can significantly reduce electromagnetic radiation and improve signal integrity.

[0046] In some embodiments, please refer to Figure 1The first host 200 includes a first deserializer 210 and a first processor 220. In this embodiment, the first deserializer 210 converts a first differential signal into a second digital signal, and the first processor 220 performs processing operations on the second digital signal to obtain a third digital signal. This technical solution, by setting up a first deserializer 210 and a first processor 220 at the first host 200, allows the first deserializer 210 to restore the received first differential signal to a parallel second digital signal, recovering the audio signal initially acquired by the pickup panel 100, providing a reliable data signal source for the subsequent first processor 220, and ensuring the integrity of the audio signal. The first processor 220 processes the second digital signal to obtain the third digital signal.

[0047] In some embodiments, the processing operations include at least one of the following: noise reduction, automatic mixing, echo cancellation, and enhancement. By configuring the first processor 220 to perform noise reduction, automatic mixing, echo cancellation, and enhancement operations on the third digital signal, the clarity and intelligibility of the audio signal are effectively improved, meeting the auditory needs of different application scenarios. Simultaneously, the first processor 220 and the first deserializer 210 work together, reducing the computational power of the first processor 220.

[0048] It is understandable that the processing operations performed by the first processor 220 on the third digital signal in this embodiment are dynamically configured according to the actual application scenario requirements. For example, in a video conferencing system, the focus is on echo cancellation and automatic gain control, while in a public address system, the focus is on audio enhancement and noise suppression. By using modular algorithm calls, both the targeted processing effect and the flexibility and adaptability of the system are ensured.

[0049] In an optional embodiment, the first deserializer 210 can be a Low-Voltage Differential Signaling Deserializer (LVDS), used to convert high-speed serial differential signals back into parallel digital signals. The first processor 220 can be a Digital Signal Processor (DSP), capable of performing in-depth processing of digital signals according to digital signal processing algorithms. Digital signal processing algorithms include, but are not limited to, complex digital filtering, adaptive beamforming, acoustic echo cancellation, noise suppression, and speech enhancement algorithms, achieving high-precision processing of audio signals.

[0050] By employing an LVDS deserializer in conjunction with a DSP, on the one hand, the LVDS deserializer ensures the stability and integrity of data transmission, effectively reducing electromagnetic interference and signal attenuation during long-distance transmission of high-speed signals; on the other hand, a DSP specifically designed for novel data processing enables real-time and efficient processing of audio signals.

[0051] In some embodiments, please refer to Figure 1 The first host 200 also includes a second processor 230 and at least one output port 240; wherein the second processor 230 is used to receive a third digital signal and distribute it to the corresponding output port 240. Using this technical solution, the third digital signal obtained after processing by the first processor 220 (i.e., the third digital signal processed by the corresponding digital signal processing algorithm) is sent to the second processor 230, which receives and distributes it to the corresponding output port 240 to drive an external audio device for playback, or to encode the processed audio signal into a format suitable for the output device. In this example, refer to... Figure 1 and Figure 3 The microphone array 110, through the first serializer 131, the first deserializer 210, the first processor 220, and the second processor 230, forms a complete audio signal acquisition, transmission, and processing path, which is an uplink audio data path. The first host 200 can also be connected to a second host 400 to store the data. The connection between the first host 200 and the second host 400 will be described below and will not be repeated here.

[0052] For example, the second processor 230 can be a central processing unit, responsible for scheduling and output control of audio data. In this embodiment, through the collaboration and division of labor between the first processor 220 and the second processor 230, the processing and distribution of the third digital signal are realized, effectively improving the overall computing efficiency and response speed of the system.

[0053] In some embodiments, please refer to Figure 1 The output port 240 includes a first port 241 and a second port 242. In this embodiment, the first port 241 is used to convert the third digital signal into an analog signal and then output it, while the second port 242 is used to package the third digital signal into a network protocol packet and then output it. With this technical solution, on the one hand, the second processor 230 connects to an external audio device through the first port 241 to transmit the processed audio signal to an external speaker or headphones, achieving high-quality audio output; on the other hand, the second processor 230 can also connect to a network device through the second port 242. Thus, the second port 242 can package the third digital signal into a network protocol packet and output it to the network device, supporting remote transmission and distribution of audio signals.

[0054] For example, the processed third digital signal can be converted into an analog signal for local playback. Simultaneously, the processed third digital signal can be packaged into network protocol packets and output to a network setting for storage, such as for recording, or for remote playback, meeting the needs of scenarios like remote conferencing and online teaching. In this example, the first port 241 can be a line output port 240 (i.e., line out output port 240), which can output a standard line-level analog audio signal without power amplification. The processed digital signal is then converted back into an analog signal using the line out port 240 for local playback. The second port 242 can be a Dante output port 240. In this example, the Dante output port 240 follows the Dante protocol, packaging the third digital signal into network protocol packets for low-latency transmission to the Dante network via Ethernet.

[0055] In some embodiments, the second processor 230 is further configured to manage the operating state of the microphone system 10 and perform parameter configuration of the microphone system 10. In this embodiment, the second processor 230 manages the operating state of the microphone system 10 and performs parameter configuration of the microphone system 10. Through the settings of the second processor 230, the configuration parameters of the microphone system 10 can be uniformly managed and dynamically adjusted to ensure that audio acquisition is always in an optimal state.

[0056] For example, the configuration parameters include gain adjustment, directivity settings, and sampling rate configuration. On the one hand, combined with real-time environmental awareness and user needs, the second processor 230 can manage and switch the microphone's operating state. For example, it can automatically enable noise reduction mode when increased ambient noise is detected, or switch between omnidirectional and directional pickup modes according to the meeting scenario. On the other hand, the second processor 230 can adjust the input gain to avoid clipping distortion, and achieve sound source localization and voice enhancement when the multi-microphone array 110 works in collaboration, further improving the clarity and stability of far-field pickup and meeting the high-quality audio acquisition requirements in complex application scenarios.

[0057] In some embodiments, the second processor 230 is further configured to send configuration parameters of the pickup panel 100 to the first processor 220. Please refer to [link / reference needed]. Figure 1 The first host 200 further includes a second serializer 250. The second serializer 250 is connected to the first processor 220 and is used to convert the configuration parameters of the pickup panel 100 into a second differential signal and then transmit it to the pickup panel 100 via the transmission cable 300. The pickup panel 100 also includes a second deserializer 140. The second deserializer 140 is used to receive the second differential signal and convert it into a fourth digital signal.

[0058] Specifically, the second processor 230 generates or receives configuration parameters for the pickup panel 100 and sends these configuration parameters to the first processor 220. The first host 200 also includes a second serializer 250, which in this example is connected to the first processor 220. The first processor 220 transmits the configuration parameters to the second serializer 250, which converts the configuration parameters into a second differential signal. In this example, the transmission cable 300 can transmit not only the first digital signal to the first deserializer 210 but also the second differential signal to the second deserializer 140, thus enabling bidirectional transmission.

[0059] The second deserializer 140 receives the second differential signal from the second serializer 250 via the transmission cable 300, and restores the second differential signal to a fourth digital signal (i.e., configuration parameter instructions), which is then sent to the analog-to-digital conversion module 120 on the pickup panel 100 to execute the configuration parameter instructions. In this example, the second serializer 250 can be a differential signal serializer, used to convert the digital signal corresponding to the configuration parameters into a differential signal for long-distance anti-interference transmission. The second deserializer 140 can be a differential signal deserializer, used to restore the received second differential signal to a fourth digital signal, and send the fourth digital signal to the pickup panel 100. The fourth digital signal is then converted back into an analog signal by the data conversion module of the pickup panel and sent to each microphone unit to complete the real-time update and synchronization of the configuration parameters.

[0060] The technical solution provided in this application establishes a downlink configuration link from the second processor 230 of the first host to the pickup panel 100, enabling unified parameter configuration of all distributed pickup panels 100 on the first host 200 (or remotely connected to the first host 200 via a network) without requiring physical contact or local operation of each panel. This facilitates adjustment of the configuration parameters of the pickup panel 100 in specific installation scenarios (e.g., within the ceiling 20, at height, or remotely). In this example, the configuration parameters of the pickup panel 100 include signal acquisition parameters, acoustic processing algorithm parameters, operating mode control parameters, diagnostic calibration parameters, and clock synchronization signals. Thus, multiple discretely distributed panels can be constructed into a unified, intelligent macroscopic pickup array, achieving a wide-area, uniform, and intelligent pickup effect that cannot be achieved by a single device.

[0061] In some embodiments, based on the clock synchronization signal included in the aforementioned configuration parameters, the first host 200 is further configured to simultaneously send the clock synchronization signal to multiple pickup panels 100. This technical solution enables clock synchronization between multiple pickup panels 100 using a single first host 200, ensuring high synchronization accuracy of audio signals acquired from different spatial locations on the time axis and avoiding time differences between signals. For example, the second processor 230 integrates an advanced sound source localization algorithm, including a Generalized Cross Correlation-Phase Transform (GCC-PHAT) algorithm, to calculate the speaker's three-dimensional position in real time. When the speaker moves to the middle area of ​​two pickup panels 100, two or more panels receive signals simultaneously. The host processor can fuse this information to provide more accurate localization data, rather than simply switching. Based on the real-time sound source localization results, the second processor 230 then employs an adaptive beamforming algorithm, such as Minimum Variance Distortionless Response (MVDR), to dynamically adjust the weighting and delay of the signals from each pickup panel 100, forming a highly directional and highly tracking virtual "microphone." This ensures that the speaker's voice can be clearly and focusedly picked up no matter where they go, effectively suppressing environmental noise and reverberation from directions other than the speaking direction, and significantly improving the listening experience for remote participants.

[0062] In some embodiments, the pickup panel 100 has a thickness of 3mm to 10mm and is configured to be installed on the ceiling 20 or a desktop. The pickup panel 100 in this embodiment has a thickness of 3mm to 10mm and is installed on the ceiling 20 or a desktop. On the one hand, the thickness of the pickup panel 100 occupies little space, achieving the effect of concealed installation and flexible deployment; on the other hand, the pickup panel 100 is extremely lightweight and can be installed using "surface-attachment" methods (magnetic, adhesive, etc.), replacing traditional "embedded" installation.

[0063] In some embodiments, please refer to Figure 1 The microphone panel 100 also includes a first power supply port 150. In this embodiment, the first power supply port 150 is used to receive power from an external device and to enable data interaction with the external device.

[0064] For example, the external device can be a network switch capable of providing DC power. A transmission cable can be used to connect the first power supply port 150 and the connection ports included in the external device to achieve power and data exchange. In this example, the first power supply port 150 can be a Power over Ethernet (PoE) port. This technical solution ensures a stable and reliable power supply to the microphone panel 100, while simultaneously enabling data and power exchange via the transmission cable.

[0065] In some embodiments, please refer to Figure 1 and Figure 2 The transmission cable 300 is also used to realize the interaction of control signals and power between the pickup panel 100 and the first host 200. This technical solution enables bidirectional transmission of control signals and power, supporting remote power supply and equipment status monitoring. Through the transmission cable 300, the first host 200 can send configuration commands to the pickup panel 100 and obtain and manage the operating status of the pickup panel 100 in real time, realizing dynamic monitoring and intelligent adjustment of the equipment's operation.

[0066] In some embodiments, please refer to Figure 1 The first host 200 further includes a second power supply port 260 for receiving power from an external device and enabling data interaction with the external device. For example, the external device can also be a network switch capable of providing DC power, and the second power supply port 260 and the connection ports included in the external device can be connected by a transmission cable to achieve power and data interaction. In this example, the second power supply port 260 can be a Power over Ethernet (PoE) port.

[0067] It should be noted that in this embodiment of the application, the external devices connected to the pickup panel 100 and the first host 200 respectively can be the same external device, such as the same network switch, or they can be different external devices, thereby realizing distributed deployment.

[0068] In another example, the microphone panel 100 can also be connected to an external device via the first host 200 to achieve centralized power supply and data interaction, which simplifies the structural components of the microphone system 10 and reduces the number of transmission cables used. In this example, the microphone panel 100 does not need to be connected to an additional external device; the first host 200 provides power and data interaction centrally.

[0069] In some embodiments, please refer to Figure 1The microphone panel 100 also includes a first module interface 160, and the first host 200 also includes a second module interface 170. The transmission cable 300 is connected between the first module interface 160 and the second module interface 170. This technical solution achieves the connection of the transmission cable 300 between the microphone panel 100 and the first host 200.

[0070] In this example, the microphone panel 100 and the first host 200 communicate via the first module interface 160 and the second module for power supply and data exchange. The first module interface 160 and the second module interface 170 work together to achieve a physical connection, ensuring stable transmission of power supply and data signals.

[0071] In an optional embodiment, the first module interface 160 can be reused as the first power supply port 150 of the aforementioned microphone panel 100. This allows the first host 200 to supply power from external devices to the microphone panel 100, supporting integrated power supply and data interaction, further enhancing system integration and wiring flexibility. In this example, multiple microphone panels 100 are connected to the second module interface 170 of the first host 200 via their respective transmission cables 300. The first host 200 is connected to the second host 400 via the second power supply port 260. In this structure, one end of the first host 200 connects to multiple microphone panels 100, and the other end connects to the second host 400, forming a star topology. Compared to the traditional method of individually wiring each microphone to the second host 400, this greatly simplifies system wiring, reduces wiring complexity and cost, and enables centralized management and intelligent control of devices, facilitating centralized management and fault isolation. In this example, the second host 400 can be a conference host. The second host 400 is used to interface with the conference system platform to process, forward, and store audio data. It can also send control commands to the first host 200 to manage the working status of the microphone panel 100 and set configuration parameters. For example, refer to... Figure 6 The microphone panel 100 and the first host 200 shown are connected by a transmission cable 300 to transmit signals and exchange electrical energy.

[0072] Specifically, in this example, the first module interface 160 and the second module interface 170 can be configured as 8-pin 8-contact modular jacks (Registered Jack 45, or RJ45 interface for short), and the transmission cable 300 can also be Category 5 unshielded twisted pair cable (Cat5 cable for short). The combination of RJ45 interface and Cat5 cable transmits LVDS signals and DC power, which not only has good electromagnetic compatibility but also maintains signal integrity during long-distance transmission. This standardized physical layer scheme facilitates maintenance and replacement, and supports hot-swapping, improving system availability. Through a unified interface specification, the pickup panel 100 in different locations can be plugged and played, which not only reduces material and wiring costs but also greatly simplifies the installation process, achieving a plug-and-play connection experience while ensuring transmission quality.

[0073] In this example, the second power supply port 260 is configured as a Power over Ethernet Interface (POE port). The transmission cable 300 between the first host 200 and the second host 400 can be an Ethernet cable, which can receive DC power from the second host 400 and realize bidirectional data interaction.

[0074] In some embodiments, please refer to Figure 1 The pickup panel 100 also includes a preamplifier circuit 180. In this embodiment, the preamplifier circuit 180 amplifies the audio signal picked up by the microphone array 110; wherein, the preamplifier circuit 180 is connected between the microphone array 110 and the analog-to-digital converter module 120. This technical solution effectively improves the signal-to-noise ratio of the audio signal, ensuring that weak audio signals are not drowned out by noise during transmission. After the preamplifier circuit 180 performs preliminary gain processing on the original audio signal, the analog-to-digital converter module 120 converts it into a first digital signal, which is then processed by the first processor 220 using algorithms such as noise reduction, adaptive beamforming, and echo cancellation. This is suitable for audio signal pickup scenarios in long-distance pickup or low sound pressure level environments.

[0075] In some embodiments, the microphone panel 100 further includes a first power module 190, and the first host 200 further includes a second power module 270. The second power module 270 supplies power to the first power module 190 through the second power supply port 260, the second module interface 170, and the first module interface 160. Alternatively, external devices can also directly supply power to the first power module 190 through the second module structure and the first module interface 160.

[0076] The microphone system 10 in this application embodiment is described below with an example in which the first power supply port 150 of the pickup panel 100 is multiplexed as a first power supply port 150. Figure 1 In this context, D1+ / D1-, D2+ / D2-, and D3+ / D3- are differential signals; tdm-mclk and tdm-bclk are clock signals; and I... 2 C-SDA and I 2 C-SCL refers to the configuration parameter control signal pair, tdm-fsync is the frame synchronization signal, and tdm-dout 1 to tdm-dout 8 are digital signals. In this example, the microphone array 110 of the pickup panel 100 picks up the audio signal, performs preliminary gain through the preamplifier circuit 180, and then sends it to the analog-to-digital converter module 120 for sampling. The module outputs a first digital signal to the first serializer 131 and outputs a first differential signal. The first differential signal is transmitted to the second module interface 170 via the first module interface 160 and the transmission cable 300. The second module interface 170 transmits the first differential signal to the first deserializer 210. The first deserializer 210 outputs multiple second digital signals and sends them to the first processor 220. The first processor 220 performs processing operations on the second digital signals to obtain a third digital signal. The third digital signal is sent to the second processor 230, and the second processor 230 distributes the third digital signal to the corresponding output ports 240, such as the first port 241 and the second port 242. This constitutes the signal uplink. In the downlink, the second processor 230 receives configuration parameters from external input via the first port 241 or the second port 242 and sends them to the first processor 220. The first processor 220 outputs configuration parameter control signals to the second serializer 250. The second serializer 250 converts the configuration parameter control signals into second differential signals and transmits them to the second deserializer 140 via the second module interface 170, the transmission cable 300, and the first module interface 160. The second deserializer 140 restores the second differential signals to configuration parameter control signals and transmits them to the analog-to-digital converter module 120, completing the parameter configuration. The second power module 270 supplies power to the remote pickup panel 100 via the second power supply port 260 of the first host 200, through the PoE port, and via the same transmission cable 300.

[0077] The following description uses an example to illustrate the installation of the microphone system 10 to the ceiling 20 in an embodiment of this application. In this example, reference is made to... Figure 4 and Figure 5The first host 200 is located inside the ceiling 20, and the microphone panel 100 is attached to the outer side of the ceiling 20. The microphone panel 100 communicates with the first host 200 via a transmission cable 300 for power exchange and with the first host 200 via another transmission cable 300 for signal transmission. The two cables independently complete power supply and data exchange to avoid power supply noise interfering with the audio signal.

[0078] Below, for reference Figure 2 The microphone system 10 in this application embodiment will be described using a specific application example. In this example, the microphone system is deployed in a large conference room. The first host 200 is installed in a cabinet on the side of the conference room, and the second host 400 (e.g., a conference host or central control system) is located in the same cabinet or control room. Taking the placement of eight pickup panels 100 throughout the conference room as an example, the eight pickup panels 100 are evenly distributed in a grid pattern and attached to the outer side of the conference room ceiling 20, forming a macroscopic pickup array covering the entire conference area. Each pickup panel has a built-in microphone array 110, which independently collects the audio signal of its coverage area and transmits the audio signal to the first host for processing. Each pickup panel 100 is connected to the first host 200 via an independent Cat5e transmission cable 300 (e.g., between 10 meters and 50 meters in length). The transmission cable 300 is used both to transmit high-speed differential audio data and to provide DC power to the pickup panel 100 via PoE (Power over Ethernet), realizing single-cable power supply and communication. In this scenario, each microphone panel 100 only performs audio data acquisition, amplification, analog-to-digital conversion, and modulation. The microphone panel 100 does not perform mixing, noise reduction, or sound source localization processing on the audio data; that is, the transmitted audio data is audio data that has not undergone mixing or noise reduction processing by the microphone panel 100. The second processor 230 of the first host 200 acts as the central processing unit, synchronously receiving audio signals from all microphone panels and performing core collaborative acoustic processing. This processing includes joint sound source localization calculation based on signals from all microphone panels, and a multi-target tracking and identity fusion algorithm combining voiceprint features and motion trajectories. This allows for accurate identification and merging of a unique speaker target from the associated signals captured simultaneously by multiple panels, outputting continuous and precise location coordinates. These coordinates, along with the corresponding optimized audio stream, are reported to the second host 400 to drive the camera for smooth and stable automatic tracking and switching.

[0079] In this scenario, when a speaker moves within the overlapping coverage area of ​​multiple microphone panels 100, their sound may be simultaneously captured by two or more microphone panels 100. All audio is transmitted to the first host 200 for unified processing to locate the speaker's actual position. Specifically, the first host 200 processes the sound throughout the conference room, locates the sound source, and reports it to the second host 400. The second host then controls the cameras in the conference room to switch between viewpoints. Compared to traditional distributed microphone systems, where each panel independently reports a sound source location, leading to the same speaker being misidentified as multiple independent sound sources, this system causes frequent switching of video tracking cameras or image flickering, severely impacting the meeting experience.

[0080] This embodiment not only ensures extreme flexibility and signal fidelity in front-end deployment through physical separation and raw signal uploading, but also fundamentally eliminates sound source localization conflicts and "ghosting" phenomena when multiple panels work together through centralized back-end collaborative processing. It achieves precise and stable control across the entire link from audio acquisition and intelligent processing to video linkage, significantly improving the overall performance and user experience of the conference system in complex acoustic environments.

[0081] Below, for reference Figure 2 The microphone system 10 in this application embodiment will be described using a specific application example. In this example, the system is deployed in a large lecture hall. The first host 200 is installed in a cabinet on the back wall of the classroom, and the second host 400 (such as a recording host) is located in the control room. In this embodiment, 12 ultra-thin pickup panels 100 are evenly attached to the outer side of the classroom ceiling 20 in a matrix of three rows and four columns, forming a macroscopic pickup array covering the entire teaching area.

[0082] Please continue to refer to this. Figure 2 and Figure 6 Each pickup panel 100 is connected to the first host 200 via an independent Cat6 transmission cable 300. The cable simultaneously transmits high-speed differential audio data and is powered via PoE. In this scenario, each pickup panel 100 only performs audio signal acquisition, amplification, and analog-to-digital conversion. The transmitted audio data is a raw, multi-channel digital signal without any local processing. The second processor 230 of the first host 200 acts as the central processing unit, synchronously receiving the audio data streams from all panels and performing global virtual adaptive beamforming processing: based on the phase and amplitude information of the signals from all pickup panels, an adaptive beamforming algorithm is used to dynamically construct one or more electronically adjustable virtual beams in the digital domain.

[0083] When the instructor moves around the podium area or interacts with students, the second processor 230 analyzes the changes in the sound source's location in real time. By adjusting the weighting coefficients and delay parameters of the audio signals on each pickup panel, the main lobe direction of the virtual beam automatically tracks the instructor's movement, achieving an intelligent "sound follows the person" pickup effect. Simultaneously, the system can create directional suppression zones at the beam's side lobes, effectively attenuating interference from fixed noise sources such as projector fans and air conditioner vents. The processed optimized audio stream and beam pointing information are reported in real time to the second host 400, which drives the panoramic camera to track and capture images, providing a clean teacher's voice signal for the recording system.

[0084] This embodiment overcomes the limitation of fixed physical microphone directionality by using multi-panel collaborative virtual beamforming technology, achieving continuous and clear pickup of large-scale moving sound sources, while maintaining robustness in complex noise environments, significantly improving audio acquisition quality and system adaptability in large-scale teaching scenarios.

[0085] In summary, the microphone system 10 in this embodiment has the following beneficial effects: First, multiple microphone panels 100 achieve microsecond-level synchronous sampling through a first processor 220. When a speaker moves from the coverage area of ​​one microphone panel 100 to the coverage area of ​​another microphone panel 100, the host processor can perform seamless, high-precision sound source localization across the entire macro array based on the time delay difference (TDOA) of the audio signals received by all microphone panels 100. Second, the precise sound source location information output by the second processor 230 is sent to the intelligent tracking camera in real time. Based on the high-precision coordinates provided by the host processor, the camera achieves smooth, seamless automatic switching and tracking, always keeping the speaker in the center of the frame, completely solving the problem of image flickering or target loss caused by inaccurate positioning; Third, as the central processing unit, the second processor 230 can integrate data from all the microphone panels 100. When the same person is in the overlapping area covered by multiple microphone panels 100, the second processor 230 will perform sound source identification and merging to ensure that the sound source is identified and located only once. For example, by analyzing voiceprint features or tracking movement trajectories, the second processor 230 can determine that it is still the same sound source, avoiding misidentifying the same person as multiple independent sound sources, thereby eliminating the "image deduplication" problem and providing the camera with a unique and accurate positioning command. Fourth, the macro array can simultaneously locate multiple independent sound sources. The second processor 230 can distinguish and identify different speakers, and output the location information of multiple speakers separately, automatically adjust the mixing ratio, or display name tags for different speakers, improving meeting efficiency and experience; Fifth, the second processor 230 utilizes the audio signals from all the pickup panels 100 to construct a virtual adaptive beam that covers the entire conference area. When the sound source (speaker) moves, the second processor 230 can adjust the beam direction in real time to always be aimed at the current speaker, achieving "sound follows the person." Sixth, macroscopic arrays can simultaneously form multiple "zeros" to suppress noise in a specific direction, or form multiple "beams" to simultaneously pick up the voices of multiple independent speakers and process them separately.

[0086] In the above embodiments, the descriptions of each embodiment have different focuses. Parts not described in detail in a particular embodiment can be found in the relevant descriptions of other embodiments. Furthermore, those skilled in the art will recognize that, based on the spirit of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A microphone system (10), characterized in that, It includes at least one microphone panel (100), a first host (200), and a transmission cable (300) connecting the microphone panel (100) and the first host (200), wherein the microphone panel (100) and the first host (200) are physically separated; wherein, At least one of the pickup panels (100) is used to pick up audio signals and convert the audio signals into modulation signals and send them to the first host (200) through the transmission cable (300). The transmission cable (300) is used to transmit the modulation signal from the pickup panel (100) to the first host (200). The first host (200) is used to receive and process the modulation signal to obtain an output signal.

2. The microphone system (10) according to claim 1, characterized in that, The pickup panel (100) includes: A microphone array (110) is used to pick up the audio signal; Analog-to-digital converter module (120) is used to convert the audio signal into a first digital signal; and The modulation and demodulation module (130) is used to convert the first digital signal into a modulated signal and then send it to the first host (200) through the transmission cable (300). The analog-to-digital conversion module (120) is connected between the modulation and demodulation module (130) and the microphone array (110).

3. The microphone system (10) according to claim 2, characterized in that, The modulation signal includes a first differential signal; The modulation and demodulation module (130) includes: The first serializer (131) is used to convert the first digital signal into a first differential signal and then send it to the first host (200) through the transmission cable (300).

4. The microphone system (10) according to claim 3, characterized in that, The first host (200) includes: The first deserializer (210) is used to convert the first differential signal into a second digital signal; A first processor (220) is used to perform processing operations on the second digital signal to obtain a third digital signal; The processing operation includes at least one of the following: Noise reduction, automatic mixing, echo cancellation, and enhancement.

5. The microphone system (10) according to claim 4, characterized in that, The first host (200) also includes a second processor (230) and at least one output port (240). The second processor (230) is used to receive the third digital signal and distribute it to the corresponding output port (240).

6. The microphone system (10) according to claim 5, characterized in that, The output port (240) includes: The first port (241) is used to convert the third digital signal into an analog signal and then output it. The second port (242) is used to package the third digital signal into a network protocol packet and then output it.

7. The microphone system (10) according to claim 5, characterized in that, The second processor (230) is also used to manage the operating state of the microphone system (10) and to perform parameter configuration of the microphone system (10).

8. The microphone system (10) according to claim 7, characterized in that, The second processor (230) is also used to send the configuration parameters of the pickup panel (100) to the first processor (220). The first host (200) also includes: The second serializer (250) is connected to the first processor (220). The second serializer (250) is used to convert the configuration parameters of the pickup panel (100) into a second differential signal and then send it to the pickup panel (100) through the transmission cable (300). The pickup panel (100) also includes: The second deserializer (140) is used to receive the second differential signal and convert it into a fourth digital signal.

9. The microphone system (10) according to claim 8, characterized in that, The configuration parameters include a clock synchronization signal; the first host (200) is also used for: The clock synchronization signal is simultaneously sent to multiple of the pickup panels (100).

10. The microphone system (10) according to claim 1, characterized in that, The pickup panel (100) is 3mm to 10mm thick and is configured to be mounted on a ceiling (20) or a desktop.

11. The microphone system (10) according to any one of claims 1 to 9, characterized in that, The pickup panel (100) also includes: The first power supply port (150) is used to receive power from external devices and to enable data interaction with external devices.

12. The microphone system (10) according to any one of claims 1 to 9, characterized in that, The transmission cable (300) is also used to realize the transmission of control signals and the interaction of electrical energy between the pickup panel (100) and the first host (200).

13. The microphone system (10) according to any one of claims 1 to 9, characterized in that, The first host (200) also includes: The second power supply port (260) is used to receive power from external devices and to enable data interaction with external devices.

14. The microphone system (10) according to any one of claims 1 to 9, characterized in that, The pickup panel (100) also includes a first module interface (160), the first host (200) also includes a second module interface (170), and the transmission cable (300) is connected between the first module interface (160) and the second module interface (170).

15. The microphone system (10) according to any one of claims 2 to 9, characterized in that, The pickup panel (100) also includes: A preamplifier circuit (180) is used to amplify the audio signal picked up by the microphone array (110); The preamplifier circuit (180) is connected between the microphone array (110) and the analog-to-digital converter module (120).

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