A micro-electromechanical sensor, a micro-electromechanical module and an electronic device
By optimizing the arrangement and structural design of the diaphragm and electrode plates in the MEMS acoustic sensor and increasing the capacitance change, the problem of insufficient sensitivity of the MEMS acoustic sensor in artificial intelligence voice interaction is solved, and higher signal detection resolution and sound processing accuracy are achieved.
CN122395532APending Publication Date: 2026-07-14HUAWEI TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-01-14
- Publication Date
- 2026-07-14
AI Technical Summary
Technical Problem
How to optimize the performance of MEMS acoustic sensors to meet the needs of artificial intelligence voice interaction, and improve their sensitivity and signal detection resolution.
Method used
Design a microelectromechanical sensor that employs a special arrangement of diaphragm and electrode plates to increase the number and area variation of electrode plates. Improve sensitivity by increasing capacitance change during vibration. Combine this with structural optimization of support beam and dielectric layer to reduce damping and parasitic capacitance.
Benefits of technology
It enhances the sensitivity and signal detection resolution of MEMS acoustic sensors, improves the accuracy of sound processing, and reduces interference from parasitic capacitance.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122395532A_ABST
Abstract
The application discloses a micro-electro-mechanical sensor, a micro-electro-mechanical module and an electronic device, and relates to the field of micro-electro-mechanical devices. The application aims to optimize the performance of the micro-electro-mechanical sensor. The specific scheme comprises the following steps: the micro-electro-mechanical sensor comprises a substrate, a diaphragm, a first electrode and a second electrode. The diaphragm covers an opening of the substrate. The first electrode comprises a plurality of first electrode pieces arranged along the radial direction of the diaphragm. The second electrode comprises a plurality of second electrode pieces arranged along the radial direction of the diaphragm. The micro-electro-mechanical sensor adopts a compression mold damping mode, reduces noise, and improves the signal-to-noise ratio. A high bias voltage is allowed to be applied to improve the output sensitivity. The effective vibration area of the diaphragm is increased, the sensitivity is improved, the diaphragm is allowed to have a large deflection displacement, the acoustic overload point is increased, and therefore the reliability is improved.
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