Induction heating type cooktop

Abstract

The present disclosure relates to an induction heating type cooktop. The induction heating type cooktop includes a housing, a cover plate connected to an upper end of the housing and provided with an upper plate portion on which an object to be heated is disposed, a thin layer coated on the upper plate portion, a thermal insulator disposed below the thin layer, a work coil disposed inside the housing, a work coil cooling fan configured to blow air toward the work coil, and a bracket provided with a cooling passage in which air blown by the work coil cooling fan passes through the work coil and is discharged.

Description

[0001] This application is a divisional application of LG Electronics Co., Ltd.'s patent application filed on April 20, 2020, with application number 202080097222.3 and invention title "Induction Heating Type Cooktop". Technical Field

[0002] This disclosure relates to an induction heating type cooktop. Background Technology

[0003] Various types of cooking appliances are used to heat food in homes or restaurants. In the past, gas stoves, which use gas as fuel, were widely used. However, in recent years, devices that use electricity to heat objects (such as cooking containers like pots) instead of gas have also become widely popular.

[0004] Methods of heating objects using electricity are mainly divided into resistance heating and induction heating. Resistance heating is a method of heating an object (e.g., a cooking container) by transferring heat generated when an electric current flows through a metal resistance wire or a non-metallic heating element such as silicon carbide through radiation or conduction. Induction heating is a method that uses the magnetic field generated around a coil when a predetermined radio frequency power is applied to the coil to induce eddy currents in the object to be heated, which is made of metallic components, thereby heating the object itself.

[0005] In recent years, induction heating has been mainly used in stoves.

[0006] However, in the case of stovetops using induction heating, there is a limitation that they can only heat magnetic objects. That is, when non-magnetic objects (such as heat-resistant glass, ceramics, etc.) are placed on the stovetop, stovetops using induction heating cannot heat the objects to be heated.

[0007] Therefore, as an example of a method for overcoming the limitations of induction-heated cooktops, a method has been devised in which a heating plate capable of being heated by induction is added between the cooktop and a non-magnetic object. Japanese Patent Registration No. 5630495 (October 17, 2014) discloses a method for performing induction heating by adding a heating plate.

[0008] However, in this method, the heating plate is not heated above the predetermined temperature, thus reducing heating efficiency. Furthermore, the time required to heat the components contained in the object to be heated is significantly increased compared to before. Because the heating plate is not heated above the predetermined temperature, no separate cooling structure is provided for cooling the heat in the heating plate.

[0009] As another example, Japanese Patent Registration No. 0644191 (November 10, 2006) discloses a method in which an electrical conductor is installed to heat an object to be heated, which is made of a material with low permeability.

[0010] However, in this method, because the thickness of the electrical conductor is greater than its skin depth, the magnetic field generated by the coil does not reach the object to be heated. Therefore, the magnetic object is not directly induced heated, significantly reducing heating efficiency.

[0011] Therefore, there is an increasing need to develop new technologies that can overcome the limitations of induction heating cooktops.

[0012] Furthermore, the heating method implemented in the induction heating type stove according to the related technology is implemented such that the heating plate and the electrical conductor are not heated above a predetermined temperature, or the container is directly induction heated. Therefore, due to this characteristic, it is not necessary to heat the object to be heated to any temperature (e.g., 300°C or higher).

[0013] Meanwhile, to address the aforementioned issues, when the heating plate or electrical conductor is heated to a predetermined temperature to generate high-temperature heat, this heat may be transferred to other components in the stove, such as the working coil and the upper plate on which the object to be heated is placed, and the components receiving the high-temperature heat may malfunction or be damaged. Therefore, a method is needed that can cool the high-temperature heat more quickly.

[0014] In particular, the likelihood of damage increases when the operating coil is exposed to critical temperatures (e.g., approximately 200°C) or higher. Therefore, a method is needed to cool the heat around the operating coil more quickly. Summary of the Invention

[0015] Technical issues

[0016] As described above, conventional devices capable of heating both magnets and non-magnets have poor heating efficiency.

[0017] The purpose of this disclosure is to provide an induction heating stove that can solve the above-mentioned problems of conventional devices.

[0018] More specifically, the purpose of this disclosure is to provide an induction heating cooktop that can heat objects regardless of their type and with high heating efficiency.

[0019] Furthermore, the purpose of this disclosure is to provide an induction heating type cooktop, which is designed such that when the object to be heated is a magnetic object, most of the eddy current is applied to the object to be heated, so that the working coil directly heats the object to be heated, and when the object to be heated is a non-magnetic object, the working coil indirectly heats the object to be heated, thereby cooling the high temperature heat generated at this time more quickly.

[0020] In particular, the purpose of this disclosure is to provide an induction heating cooktop that minimizes the temperature rise of internal components, especially the working coil, due to high-temperature heat.

[0021] Technical solution

[0022] An induction heating cooktop according to this disclosure may include a thin layer having a skin depth greater than its thickness. Magnetic objects are heated by eddy currents induced by a magnetic field generated by a working coil, while non-magnetic objects are heated by the thin layer (where eddy currents are induced by the magnetic field generated by the working coil). Therefore, both magnetic and non-magnetic objects can be heated while minimizing the loss of heating efficiency.

[0023] Furthermore, the induction heating type cooktop according to this disclosure includes: a working coil cooling fan configured to blow air toward the working coil; and a bracket defining a cooling channel configured to guide the air blown from the working coil cooling fan through the working coil, thereby forcing heat around the working coil to the outside.

[0024] Beneficial effects

[0025] The induction heating stove disclosed herein has the following advantages: it can minimize the loss of heating efficiency by directly heating a magnetic object to be heated and indirectly heating a non-magnetic object to be heated through a thin layer.

[0026] Furthermore, in the induction heating type stove according to this disclosure, a cooling channel is formed to force the heat around the working coil to convect, thereby minimizing the output loss of the working coil due to high temperature heat and minimizing damage to internal components such as the working coil.

[0027] In addition to the effects described above, the detailed effects of this disclosure will be described together with an explanation of the specific details used to perform this disclosure. Attached Figure Description

[0028] Figure 1 This is a perspective view of an induction heating type stove according to an embodiment of the present disclosure.

[0029] Figure 2 It is shown Figure 1 A view of the bottom surface of the cover plate shown.

[0030] Figure 3 It is shown Figure 1 The diagram shows a cross-sectional view of the cover plate, the working coil housed in the housing, the ferrite, and the object to be heated.

[0031] Figure 4 and Figure 5 It is a view used to describe the impedance change between the thin layer and the object to be heated, depending on the type of object being heated.

[0032] Figure 6 This is an exploded view of an induction heating type stove according to an embodiment of the present disclosure.

[0033] Figure 7 This is a view showing the cover plate separated from the induction heating type cooktop according to an embodiment of the present disclosure.

[0034] Figure 8 It is shown Figure 7 A view showing the state of separation of the insulating material.

[0035] Figure 9 It is shown Figure 8 A view showing the state of the working coil module separated in the image.

[0036] Figure 10 This is a view showing the air guide in an induction heating type cooktop according to an embodiment of the present disclosure in a state where the air guide is separated from the housing.

[0037] Figure 11 This is a view showing the airflow blown by the inverter cooling fan in an induction heating type stove according to an embodiment of the present disclosure.

[0038] Figure 12 This is a view showing an example of an inverter installed in an induction heating type cooktop according to an embodiment of the present disclosure.

[0039] Figure 13 This is a view showing a bracket installed in an induction heating type cooktop according to an embodiment of the present disclosure.

[0040] Figure 14 It is shown Figure 13 The view shown depicts the bracket being mounted to the working coil module.

[0041] Figure 15 This shows the insulation being installed on... Figure 14 The view shows the state of the bracket.

[0042] Figure 16 This is a view showing a working coil support provided in an induction heating type stove according to an embodiment of the present disclosure.

[0043] Figure 17 and Figure 18 It is a cross-sectional view of the cooling channel defined in the support.

[0044] Figure 19 This is a view showing an example of a thin-film temperature sensor installed on an induction heating type cooktop according to the present disclosure, according to a first embodiment.

[0045] Figure 20 It is shown Figure 19 The image shows an example view of the wires of a thin-film temperature sensor being set up.

[0046] Figure 21 and Figure 22 It is shown Figure 19 Another example view showing the wires of a thin-film temperature sensor in a set-up state.

[0047] Figure 23 This is a view showing an example of a thin-film temperature sensor installed in an induction heating type stove according to the second embodiment of the present disclosure.

[0048] Figure 24 This is a view showing an example of a thin-film temperature sensor installed in an induction heating type stove according to the third embodiment of the present disclosure.

[0049] Figure 25 yes Figure 23 and Figure 24 The image shows a longitudinal cross-sectional view of a thin-film temperature sensor. Detailed Implementation

[0050] In the following description, exemplary embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0051] In the following text, an induction heating type cooktop according to an embodiment of the present disclosure will be described.

[0052] Figure 1 This is a perspective view of an induction heating type stove according to an embodiment of the present disclosure. Figure 2 It is shown Figure 1 A view of the bottom surface of the cover plate shown, and Figure 3 It is shown Figure 1 The diagram shows a cross-sectional view of the cover plate, the working coil housed in the housing, the ferrite, and the object to be heated.

[0053] According to one embodiment of the present disclosure, an induction heating type stove 1 may include a housing 2, a cover plate 3, a working coil WC, and a thin layer TL.

[0054] The housing 2 can be connected to the cover plate 3.

[0055] The working coil WC can be installed in the housing 2. Besides the working coil WC, other components (e.g., a rectifier for supplying AC power and rectifying it into DC power, an inverter for converting the DC power rectified by the rectifier into resonant current through switching operations and supplying the resonant current to the working coil, a control module for controlling the operation of various devices in the induction heating stove, a relay or semiconductor switch for turning the working coil on or off, etc.) can also be installed in the housing 2. This will be described below.

[0056] The cover plate 3 can be disposed on the upper part of the housing 2. The cover plate 3 can cover the upper part of the housing 2.

[0057] The cover plate 3 may include an upper plate portion 4 on which the object to be heated HO is placed and a connecting portion 5 connected to the housing 2.

[0058] The cover plate 3 may be provided with a thin layer TL. The thin layer TL may be formed on the upper plate portion 4 of the cover plate 3. The upper plate portion 4 may be provided with an upper surface 4a for placing the object to be heated HO and a lower surface 4b as the opposite surface of the upper surface 4a, and the thin layer TL may be formed on one of the upper surface 4a and the lower surface 4b. For example, as Figure 2 As shown, a thin layer TL can be formed on the lower surface 4b of the upper plate portion 4. In the following text, it is assumed that the thin layer TL is formed on the lower surface 4b of the upper plate portion 4.

[0059] For example, the upper plate 4 can be made of glass material (e.g., ceramic glass).

[0060] In addition, the upper plate 4 may be provided with an input interface (not shown), which receives input from the user and transmits the input to the input interface control module. Figure 6 (60). The input interface (not shown) can be located in a position other than the upper plate 4.

[0061] For reference, the input interface (not shown) is a module for inputting the user's desired heating intensity, driving time, etc., of the induction heating cooktop 1, and can be implemented differently as a physical button or a touch panel. Furthermore, the input interface (not shown) may include, for example, a power button, a lock button, power level control buttons (+, -), a timer control button (+, -), a charging mode button, etc. The input interface (not shown) can transmit user-provided input to the input interface control module 60, and the input interface control module 60 can transmit this input to the control module (i.e., the inverter control module). Furthermore, the control module can control the operation of various devices (e.g., the operating coil) based on the input provided from the input interface control module 60 (i.e., the user input). A detailed description thereof will be omitted.

[0062] Meanwhile, whether the working coil WC is driven and the heating intensity (i.e., firepower) can be visually displayed on the upper plate 4 in the burner shape. The burner shape can be displayed by indicators 41, 42 and 43, which include multiple light-emitting elements (e.g., LEDs) disposed in the housing 2.

[0063] The working coil WC can be installed inside the housing 2 to heat the object to be heated HO.

[0064] Specifically, the working coil WC can be driven by a control module (not shown). When the object to be heated HO is placed on the upper plate 4, the working coil WC can be driven by the control module.

[0065] Furthermore, the working coil WC can directly heat objects with magnetic properties (i.e., magnetic objects), and can indirectly heat objects without magnetic properties (i.e., non-magnetic objects) through the thin layer TL described below.

[0066] The working coil WC can heat the object to be heated HO by induction heating, and can be set to overlap with the thin layer TL in the longitudinal direction (i.e., vertical or up-down direction).

[0067] A thin layer of TL can be applied to the upper plate 4 to heat the non-magnetic object in the object to be heated HO.

[0068] At least one burner can be installed in the induction heating type cooktop 1, and a thin layer of TL can be coated on the area corresponding to the burner on the upper plate 4. When multiple burners are installed in the induction heating type cooktop 1, the thin layer of TL can be coated only on a portion of the multiple burners. (Refer to...) Figure 1 and Figure 2 The example shown may have three burners F1, F2, and F3 in the induction heating cooktop 1, and the thin film TL may be applied only to the first burner F1 of the three burners F1, F2, and F3. However, this is merely an example, and the thin film TL may be applied to all three burners F1, F2, and F3, or it may be applied only to two of the three burners F1, F2, and F3.

[0069] The thin layer TL can be coated on the upper surface 4a or the lower surface 4b of the upper plate 4, and can be configured to overlap with the working coil WC in the longitudinal direction (i.e., vertical or up-down direction). Therefore, the object to be heated HO can be heated regardless of its arrangement and type.

[0070] In the following text, the thin layer TL is described as being coated on the lower surface 4b of the upper plate portion 4, but this is merely an assumption for ease of description. That is, the thin layer TL may be coated on the upper surface 4a of the upper plate portion 4.

[0071] Furthermore, the thin-layer TL can have at least one of magnetic or non-magnetic properties (i.e., magnetic, non-magnetic, or both).

[0072] The thin layer TL can be made of, for example, a conductive material (e.g., aluminum). As shown, the thin layer TL can be coated on the lower surface 4b of the upper plate portion 4 in a repeating pattern of multiple rings with different diameters, but this disclosure is not limited thereto.

[0073] In other words, the thin layer TL can be made of a material different from the conductive material, or it can be coated on the upper plate portion 4 in a different shape. For ease of description, in the embodiments of this disclosure, an example will be described where the thin layer TL is made of a conductive material and coated on the upper plate portion 4 in a shape of multiple repeating rings with different diameters.

[0074] For reference only. Figure 2 A thin layer TL is shown, but this disclosure is not limited thereto. That is, multiple thin layers can be coated, but for ease of description, an example of coating a single thin layer TL will be described in the embodiments of this disclosure.

[0075] Thin-layer TL will be described in more detail below.

[0076] Next, refer to Figure 3 The housing 2 may be equipped with an insulation body 10, a working coil WC, ferrite 211, etc.

[0077] The heat insulation element 10 can be disposed between the upper plate portion 4 and the working coil WC. That is, the heat insulation element 10 can be disposed between the lower surface 4b of the upper plate portion 4 and the working coil WC.

[0078] The heat insulation body 10 can be located below the cover plate 3, i.e. the upper plate 4, and the working coil WC can be located below the heat insulation body 10.

[0079] The heat insulation 10 can block the heat generated when the thin layer TL or the object to be heated HO is heated by the driving of the working coil WC from being transferred to the working coil WC.

[0080] In detail, when the thin layer TL or the object to be heated HO is heated by electromagnetic induction through the working coil WC, the heat of the thin layer TL or the object to be heated HO is transferred to the upper plate 4, and the heat of the upper plate 4 is transferred back to the working coil WC, which may cause the working coil WC to be damaged.

[0081] Since the heat insulation 10 blocks the heat transferred to the working coil WC, it can prevent the working coil WC from being damaged by heat and prevent the heating performance of the working coil WC from deteriorating.

[0082] Meanwhile, the stent ( Figure 6 The bracket 100 can be installed between the heat insulation body 10 and the working coil WC. That is, the induction heating type stove 1 may also include a bracket 100 installed between the heat insulation body 10 and the working coil WC.

[0083] The bracket 100 can be inserted between the heat insulator 10 and the working coil WC, so that the working coil WC does not directly contact the heat insulator 10. Therefore, the bracket 100 can prevent the heat generated when the thin layer TL or the object to be heated HO is heated by the driving of the working coil WC from being transferred to the working coil WC through the heat insulator 10.

[0084] In other words, because the support 100 can share part of the role of the insulation 10, the thickness of the insulation 10 can be minimized. This minimizes the distance between the object to be heated HO and the working coil WC.

[0085] Furthermore, the support 100 can be implemented by multiple components. The support 100 implemented by the multiple components can be configured to be spaced apart from each other between the working coil WC and the heat insulation body 10.

[0086] In addition, the bracket 100 can guide the cooling fan of the working coil, which will be described below. Figure 6 The air blown by the working coil cooling fan 90 is directed to pass through the working coil WC. In other words, the support 100 can guide the air blown by the working coil cooling fan 90 to pass through the working coil WC, thereby improving the cooling efficiency of the working coil WC.

[0087] The induction heating cooktop 1 may also include a ferrite core 211. The ferrite core 211 can be installed below the working coil WC. When the working coil WC is driven, the ferrite core 211 can block the downward-generated magnetic field.

[0088] The working coil WC, ferrite 211, etc. can be installed into the working coil support described below. Figure 6 On 210). That is to say, the working coil support 210 can support the working coil WC, ferrite 211, etc.

[0089] The working coil support 210 can be mounted on the substrate ( Figure 6The substrate 200 is supported on the lower surface of the housing 2 and can support the working coil WC, ferrite 211, etc. Since the substrate 200 supports the working coil WC, ferrite 211, etc., the heat insulation 10 can be in close contact with the upper plate 4. Therefore, the distance between the working coil WC and the object to be heated HO can be kept constant.

[0090] Next, we will refer to Figure 4 and Figure 5 The properties and structure of thin-layer TL are described in more detail.

[0091] Figure 4 and Figure 5 It is a view used to describe the impedance change between the thin layer and the object to be heated, depending on the type of object being heated.

[0092] Thin-layer TLs can be made from materials with low relative permeability.

[0093] In detail, due to the low relative permeability of thin-layer TL, the skin depth of thin-layer TL can be relatively deep. Skin depth refers to the depth to which current penetrates from the surface of a material, and relative permeability can be inversely proportional to skin depth. Therefore, the lower the relative permeability of thin-layer TL, the deeper the skin depth of thin-layer TL becomes.

[0094] Furthermore, the skin depth of the thin layer TL can be greater than the thickness of the thin layer TL. That is, because the thin layer TL has a small thickness (e.g., 0.1 μm to 1000 μm) and the skin depth of the thin layer TL is greater than the thickness of the thin layer TL, the magnetic field generated by the working coil WC passes through the thin layer TL and is transmitted to the object to be heated HO, thereby inducing eddy currents in the object to be heated HO.

[0095] In other words, when the skin depth of the thin layer TL is less than the thickness of the thin layer TL, the magnetic field generated by the working coil WC may have difficulty reaching the object to be heated HO.

[0096] However, when the skin depth of the thin layer TL is greater than the thickness of the thin layer TL, the magnetic field generated by the working coil WC can reach the object to be heated HO. That is, in the embodiments of this disclosure, since the skin depth of the thin layer TL is greater than the thickness of the thin layer TL, the magnetic field generated by the working coil WC passes through the thin layer TL, is mostly transmitted to the object to be heated HO, and is exhausted. In this way, the object to be heated HO can be heated primarily.

[0097] Meanwhile, since the thin layer TL has a small thickness as described above, the thin layer TL can have a resistance value, which can be used to heat the thin layer TL by means of the working coil WC.

[0098] In detail, the thickness of the thin layer TL can be inversely proportional to the resistivity (i.e., surface resistivity) of the thin layer TL. That is, as the thickness of the thin layer TL coated on the upper plate portion 4 decreases, the resistivity (i.e., surface resistivity) of the thin layer TL increases. Therefore, the thin layer TL can be coated thinly on the upper plate portion 4, so that the characteristics of the thin layer TL change with the heatable load.

[0099] For reference, the thin layer TL can have a thickness of, for example, from 0.1 μm to 1000 μm, but this disclosure is not limited thereto.

[0100] A thin layer TL with these properties exists to heat non-magnetic objects. Depending on whether the object HO to be heated, which is provided on the upper surface 4a of the upper plate portion 4, is magnetic or non-magnetic, the impedance characteristics between the thin layer TL and the object HO to be heated can be changed.

[0101] First, we will describe the case where the object to be heated, HO, is a magnetic object.

[0102] When the magnetic object to be heated HO is placed on the upper surface 4a of the upper plate 4 and the working coil WC is driven, the resistor component R1 and inductor component L1 of the magnetic object to be heated HO can form an equivalent circuit with the resistor component R2 and inductor component L2 of the thin layer TL, such as Figure 4 As shown.

[0103] In this case, the impedance of the magnetic object to be heated HO in the equivalent circuit (i.e., the impedance composed of R1 and L1) can be less than the impedance of the thin layer TL (i.e., the impedance composed of R2 and L2).

[0104] Therefore, when the equivalent circuit described above is formed, the magnitude of the eddy current I1 applied to the magnetic object to be heated HO can be greater than the magnitude of the eddy current I2 applied to the thin layer TL. Thus, most of the eddy current generated by the working coil WC can be applied to the object to be heated HO, and the object to be heated HO can be heated.

[0105] In other words, when the object to be heated HO is a magnetic object, the above equivalent circuit is formed, and most of the eddy current is applied to the object to be heated HO. Therefore, the working coil WC can directly heat the object to be heated HO.

[0106] Since a portion of the eddy current is also applied to the thin layer TL, the thin layer TL is slightly heated. Therefore, the object to be heated HO can be heated slightly indirectly through the thin layer TL. However, the degree to which the object to be heated HO is indirectly heated by the thin layer TL is not significant compared to the degree to which the object to be heated HO is directly heated by the working coil WC.

[0107] Next, we will describe the case where the object to be heated is a non-magnetic object.

[0108] When a non-magnetic object to be heated HO is placed on the upper surface 4a of the upper plate 4 and the working coil WC is driven, there may be no impedance in the non-magnetic object to be heated HO, but there may be impedance in the thin layer TL. That is, the resistor component R and the inductor component L may exist only in the thin layer TL.

[0109] Therefore, when a non-magnetic object to be heated HO is placed on the upper surface 4a of the upper plate 4, and the working coil WC is driven, the resistor component R and the inductor component L of the thin layer TL can be formed as follows: Figure 5 The equivalent circuit shown.

[0110] Therefore, the eddy current I can be applied only to the thin layer TL, while the eddy current can be applied to the non-magnetic object HO to be heated. More specifically, the eddy current I generated by the working coil WC can be applied only to the thin layer TL, and the thin layer TL can be heated.

[0111] In other words, when the object to be heated HO is non-magnetic, as described above, eddy current I is applied to the thin layer TL and the thin layer TL is heated. Therefore, the non-magnetic object to be heated HO can be indirectly heated through the thin layer TL heated by the working coil WC.

[0112] In summary, regardless of whether the object to be heated HO is magnetic or non-magnetic, it can be heated directly or indirectly by a heat source (called the working coil WC). That is, when the object to be heated HO is magnetic, the working coil WC can directly heat it, while when the object to be heated HO is non-magnetic, the thin layer TL heated by the working coil WC can indirectly heat it.

[0113] As described above, since the induction heating type stove 1 according to the embodiments of this disclosure can heat both magnetic and non-magnetic objects, it can heat objects regardless of their arrangement or type. Therefore, users do not need to know whether the object to be heated is magnetic or non-magnetic to place it in any heating area on the upper plate 4, thereby improving user convenience.

[0114] Furthermore, since the induction heating type cooktop 1 according to the embodiments of this disclosure can directly or indirectly heat the object to be heated using the same heat source, it is not necessary to provide a separate heating plate or radiant heater. Therefore, heating efficiency can be improved and material costs can be reduced.

[0115] Simultaneously, the heat generated in the thin layer TL can be transferred to the upper plate 4, and also below the thin layer TL. The heat transferred from the thin layer TL or the object to be heated to the upper plate 4 can also be transferred below the upper plate 4. In other words, the heat generated in the thin layer TL or the object to be heated HO can not only heat the object HO, but also the components disposed below the thin layer TL and the upper plate 4. Specifically, the heat generated in the thin layer TL can heat the working coil WC. In this case, the working coil WC may be damaged, or its heating performance may deteriorate.

[0116] Specifically, the insulation layer of the working coil WC can have a heat resistance temperature of about 200°C or lower. In this case, when the working coil WC is exposed to heat of 200°C or higher, the insulation layer is damaged, and problems such as fire due to synthesis may occur. To manufacture a non-magnetic object HO to be heated by a thin layer TL, the thin layer TL can be heated to about 600°C or higher. In this case, the heat resistance temperature of the working coil WC (e.g., about 200°C) is significantly lower than the heating temperature of the thin layer TL (e.g., about 600°C). Therefore, the heat generated in the thin layer TL may cause damage to the working coil WC.

[0117] Furthermore, the heat generated in the thin TL layer may damage other heat-sensitive components, such as the inverter 70.

[0118] Therefore, in the induction heating type cooktop 1 according to the embodiments of this disclosure, there is a need for a method to minimize the problem of heat generated by the thin layer TL damaging components such as the working coil WC and the inverter 70.

[0119] Therefore, the induction heating type cooktop 1 may also include a working coil cooling fan 90. The heat generated in the thin layer TL can be cooled by the air introduced through the working coil cooling fan 90, thereby minimizing damage to the internal components of the induction heating type cooktop 1.

[0120] Figure 6 This is an exploded view of an induction heating type cooktop according to an embodiment of the present disclosure. Figure 7 This is a view showing the cover plate separated from the induction heating type cooktop according to an embodiment of the present disclosure. Figure 8 It is shown Figure 7 A view of the state of the insulation separation in the middle, and Figure 9 It is shown Figure 8 A view showing the state of the working coil module separated in the image.

[0121] According to one embodiment of the present disclosure, the induction heating type cooktop 1 may include a housing 2, a cover plate 3, a power module 50, an input interface control module 60, an inverter 70, working coils WC1, WC2 and WC3, and all or at least a portion of a thin layer TL.

[0122] The power supply module 50, input interface control module 60, inverter 70, and working coils WC1, WC2, and WC3 can be housed in the housing 2. Furthermore, various modules and devices required to drive the induction heating cooktop 1, such as the control module (not shown) and inverter cooling fan 81, can also be housed in the housing 2.

[0123] At least one slit 2a may be formed on the side surface of the housing 2, through which heat inside the housing 2 is discharged to the outside. That is, heat generated when driving various modules and devices disposed in the housing 2 can be discharged to the outside of the housing 2 through the slit 2a.

[0124] The cover plate 3 can cover the housing 2. As described above, the arc-shaped plate 3 can be coated with a thin layer of TL.

[0125] The power module 50 may include a power supply that supplies AC power and a rectifier that rectifies the supplied AC power into DC power.

[0126] The input interface control module 60 can transmit an input to the control module (not shown), so that the induction heating stove 1 can be operated according to the input through the input interface (not shown).

[0127] Inverter 70 can convert DC power rectified by the rectifier into resonant current through switching operations and supply the resonant current to the operating coil WC. Inverter 70 may include an inverter printed circuit board (PCB) that integrates switching elements including insulated gate bipolar transistors (IGBTs), bridge diodes (BDs), etc.

[0128] The control module (not shown) can control the operation of various modules and devices in the induction heating cooktop 1. The control module (not shown) can control the inverter 70. In some cases, the control module (not shown) may include the inverter 70.

[0129] The switching element provided in the inverter 70 can be driven so that current flows through the working coil WC, and the working coil WC can generate a magnetic field according to the flow of current.

[0130] The number of working coils (WC) determines the number of burners formed in the induction heating stove 1. For example, as... Figure 6As shown, when the induction heating type stove 1 includes three working coils WC1, WC2 and WC3, it can form three burners F1, F2 and F3.

[0131] A burner can refer to the area where heat is supplied by a working coil WC. The object to be heated HO can be placed on the burner. The burner can be an area vertically spaced from at least a portion of the working coil WC. Figure 6 An example of three burners formed by three working coils WC1, WC2, and WC3 is shown, but the number of working coils WC is merely an example. That is, this disclosure may include an induction heating type cooktop 1 having one or more working coils WC. In the following, for ease of description, it is assumed that the induction heating type cooktop 1 includes three working coils WC1, WC2, and WC3, forming three burners.

[0132] As described above, the thin layer TL can be formed on the upper surface 4a or the lower surface 4b of the upper plate portion 4. The thin layer TL can be formed at a position corresponding to the burner. For example, when three burners F1, F2, and F3 are formed in the induction heating type stove 1, the thin layer TL can be formed in each of the three burners, or it can be formed in only some of the three burners. In the following description, for ease of description, it is assumed that the thin layer TL is coated only on one of the three burners F1, F2, and F3. In particular, it is assumed that the thin layer TL is coated only on the first burner F1, and the thin layer TL is not coated on the second burner F2 and the third burner F3. That is, it is assumed that the thin layer TL is coated only in the area of ​​the upper plate portion 4 corresponding to the first working coil WC1, and the thin layer TL is formed in the areas corresponding to the second working coil WC2 and the third working coil WC3, but this is merely an example and the present disclosure is not limited thereto.

[0133] The induction heating type cooktop 1 may also include heat insulation elements 10 and 20.

[0134] Insulators 10 and 20 can be disposed between the working coil WC and the burner. Insulators 10 and 20 can be disposed below the upper plate 4.

[0135] Furthermore, according to the embodiment, the insulation 20 can be omitted below the burner where the thin layer TL is not coated. That is, the induction heating type cooktop 1 may only include the insulation 10 disposed below the thin layer TL.

[0136] Insulators 10 and 20 can be disposed between the upper plate 4 and the working coil WC. Insulator 20 can be disposed directly on the working coils WC2 and WC3. In this case, insulator 20 can prevent heat transfer from at least one of the upper plate 4 or the thin layer TL to the working coils WC2 and WC3.

[0137] Furthermore, the heat insulator 10 can be mounted on the bracket 100, which is mounted on the working coil WC1. In this case, each of the heat insulator 10 and the bracket 100 can block heat transfer from at least one of the upper plate portion 4 or the thin layer TL to the working coil WC1, thereby improving the heat insulation effect. At this time, the bracket 100 can be a fixing member for fixing the heat insulator 10. That is, the bracket 100 can be used as a heat insulator mounting part.

[0138] like Figure 6 As shown, the heat insulation body 10 may be provided with a first sensing hole 11 and a second sensing hole 12. The first sensing hole 11 may be a hole in which a temperature sensor 400 for sensing the temperature of the upper plate portion 4 is provided, and the second sensing hole 12 may be a hole in which a temperature sensor 300 for sensing the temperature of the thin layer TL is provided.

[0139] The first sensing hole 11 can overlap with the area of ​​the upper plate portion 4 where the thin layer TL is not formed in the vertical direction, and the second sensing hole 12 can overlap with the thin layer TL in the vertical direction.

[0140] When the induction heating type stove 1 also includes a support 100, the support 100 may be provided with a first sensor hole h1 that overlaps with the first sensing hole 11 in the vertical direction and a second sensor hole h2 that overlaps with the second sensing hole 12 in the vertical direction.

[0141] The support 100 can be positioned between the heat insulator 10 and the working coil WC1. The support 100 can also be positioned above the working coil WC1 that heats the thin layer TL.

[0142] The support 100 can be inserted between the heat insulator 10 and the working coil WC1, preventing the working coil WC1 and the heat insulator 10 from directly contacting each other. Therefore, the support 100 can prevent the heat generated when the thin layer TL or the object to be heated HO is heated by the working coil WC1 from being transferred through the heat insulator 10 to the working coil WC1. In other words, because the support 100 can share some of the load of the heat insulator 10, the thickness of the heat insulator 10 can be minimized. This minimizes the distance between the object to be heated HO and the working coil WC1.

[0143] In addition, at least a portion of the cooling channel for cooling the working coil WC1 may be formed in the bracket 100.

[0144] The cooling channel can be an air channel through which air blown by the working coil cooling fan 90 passes through the working coil WC1. The bracket 100 can guide the air introduced into the housing 1 by the working coil cooling fan 90 through the working coil WC1, thereby improving the cooling efficiency of the working coil WC1. (Refer to...) Figures 16 to 18 The cooling channels formed in the support 100 are described in detail.

[0145] The bracket 100 can be supported by at least one of the working coil support 210 or the substrate 200. That is, the bracket 100 can be mounted to the working coil module.

[0146] The working coil module can refer to working coils WC1, WC2, and WC3, as well as components configured to support working coils WC1, WC2, and WC3. For example, the working coil module may include: working coils WC1, WC2, and WC3; working coil supports 210, 32, and 33 around which working coils WC1, WC2, and WC3 are wound; and substrates 200 and 30 configured to support working coil supports 210, 32, and 33.

[0147] The working coils WC1, WC2, and WC3 can be wound around the working coil supports 210, 32, and 33. The first working coil WC1 can be wound around the first working coil support 210, the second working coil WC2 can be wound around the second working coil support 32, and the third working coil WC3 can be wound around the third working coil support 33.

[0148] The working coil supports 210, 32, and 33 can be components around which the working coil WC1 is wound. The working coil supports 210, 32, and 33 can support the working coils WC1, WC2, and WC3. Ferrite can be disposed on the working coil supports 210, 32, and 33. The working coil supports 210, 32, and 33 can be mounted to substrates 200 and 30.

[0149] Substrates 200 and 30 may be components configured to support the working coil support 210 and the working coils WC1, WC2, and WC3. Indicators 41, 42, and 43 may be further disposed on substrates 200 and 30.

[0150] Connecting portions 101 and 201 can be formed in the bracket 100 and the working coil support 210, respectively. Since connecting members such as bolts (not shown) pass through connecting portions 101 and 201 and are fixed to the substrate 200, the bracket 100 and the working coil support 210 can be mounted to the substrate 200.

[0151] The substrate 200 may be supported by at least one support member 200a. The support member 200a may be a column configured to support the substrate 200. The support member 200a is disposed between the substrate 200 and the base plate 6 to separate the substrate 200 from the base plate 6. The space for mounting the working coil cooling fan 90 may be defined between the substrate 200 and the base plate 6 by the support member 200a.

[0152] The working coil cooling fan 90 can be installed below the substrate 200. The working coil cooling fan 90 can be positioned between the substrate 200 and the base plate 6.

[0153] The base plate 6 can form the bottom surface of the shell 2. An opening can be formed on the base plate 6. Figure 18 In addition to the opening 6c, an air intake port can also be formed on the base plate 6. Figure 11 6a) and air exhaust port ( Figure 10 and Figure 11 (6b).

[0154] The opening 6c can be positioned below the working coil cooling fan 90 in the base plate 6. The working coil cooling fan 90 can draw air to the outside of the housing 2 through the opening 6c and blow the drawn air into the cooling channel defined in the bracket 100. Specifically, the air blown by the working coil cooling fan 90 can pass through a pre-hole defined in the substrate 200. Figure 17 202), can be introduced into the air space of the working coil support 210 ( Figure 17 In section 212), the air can be blown into a cooling channel defined in the support 100. Therefore, the working coil WC1 can be cooled by the air blown by the working coil cooling fan 90. That is, damage to the working coil WC1 due to the high heat generated in the thin layer TL can be minimized.

[0155] Therefore, the working coil cooling fan 90, the base plate 200, the working coil support 210 and the bracket 100 can be arranged in this order along the height direction.

[0156] Meanwhile, since the inverter 70 is more susceptible to heat than other components, it can be configured not to overlap with the thin layer TL in the vertical direction. Therefore, the inverter 70 can be configured not to overlap with the working coil module on which the first working coil WC1 is mounted in the vertical direction.

[0157] Meanwhile, due to the volume occupied by the working coil module with the first working coil WC1 installed, the space for arranging the inverter within the housing 2 may become narrow. In particular, since inverter cooling fans and the like must be placed around the inverter to cool the heat generated by the inverter itself, the space for safely installing the inverter, inverter cooling fans, etc., must be provided within the housing 2 while minimizing the increase in the volume of the housing 2. Therefore, the inverter is not separately provided for each of the first to third working coils WC1, WC2, and WC3, but can be configured as an integrated inverter 70. Thus, when one inverter 70 performs a switching operation, causing current to be applied to the first to third working coils WC1, WC2, and WC3, a large amount of heat may be generated, especially within the inverter 70. In other words, when inverters corresponding to the first to third working coils WC1, WC2, and WC3 are separately provided, this integrated inverter is likely to overheat due to frequent switching operations. Therefore, when the induction heating type cooktop 1 includes an integrated inverter, a structure may be needed to cool the heat generated in the inverter more quickly.

[0158] Figure 10 This is a view showing the air guide in an induction heating type cooktop according to an embodiment of the present disclosure in a state where it is separated from the housing. Figure 11 This is a view showing the airflow blown by the inverter cooling fan in an induction heating type cooktop according to an embodiment of the present disclosure, and Figure 12 This is a view showing an example of an inverter installed in an induction heating type cooktop according to an embodiment of the present disclosure.

[0159] According to embodiments of the present disclosure, the induction heating type cooktop 1 may further include at least one of an inverter cooling fan 81, an air guide 83, or a radiator 85.

[0160] Inverter cooling fan 81 is a fan used to cool inverter 70 and can blow air toward inverter 70.

[0161] The inverter cooling fan 81 can draw air to the outside of the housing 2 and blow air through at least a portion of the inverter 70.

[0162] The housing 2 may be provided with an air intake port 6a. The air intake port 6a may be a hole through which air from outside the housing 2 is drawn into the housing 2. For example, the air intake port 6a may be defined on the bottom surface of the housing 2, i.e., on the base plate 6. The air intake port 6a may be defined at a position that overlaps with the inverter cooling fan 81 in the vertical direction.

[0163] Air drawn by the inverter cooling fan 81 through the air intake port 6a can be directed to the air guide 83. The inlet of the air guide 83 can be connected to the air intake port 6a.

[0164] Air guide 83 can guide air passing through inverter 70 to the outside of housing 2. The outlet of air guide 83 can communicate with air exhaust port 6b defined in housing 2.

[0165] The air exhaust port 6b can be defined on the side 7 of the housing 2 or on the bottom plate 6 of the housing 2. The induction heating cooktop 1 is typically installed in close contact with a wall. Therefore, when the air exhaust port 6b is defined on the side 7 of the housing 2, at least a portion of the air passing through the air exhaust port 6b can impact the wall and flow back into the housing 2. However, as... Figure 10 As shown, when the air exhaust port 6b is confined within the bottom surface of the base plate 6, i.e., the housing 2, the air exhausted through the air exhaust port 6b diffuses in all directions from the bottom of the housing 2. Therefore, the possibility of air flowing back into the housing 2 through the air exhaust port 6b can be minimized. The air exhausted through the air exhaust port 6b may be air whose temperature has slightly increased by the inverter 70 as it passes through the air guide 83. By minimizing the possibility of this slightly heated air flowing back into the housing 2, the possibility of an increase in the internal temperature of the housing 2 can be minimized.

[0166] An air guide 83 may be disposed on the inverter 70. The air guide 83 can form a channel for air to pass through the inverter 70. In this way, when the induction heating type cooktop 1 includes the air guide 83, the air passing through the inverter 70 is concentrated by the air guide 83 and flows faster, thereby improving the cooling efficiency of the inverter 70.

[0167] According to one embodiment, the air guide 83 can be configured such that an air passage is defined in a region where bridge diodes 73a and 74a and IGBTs 73b and 74b are disposed in the inverter 70. In this case, the air blown by the inverter cooling fan 81 can concentrate on cooling the heat generated by at least one of the bridge diodes 73a and 74a and IGBTs 73b and 74b as it passes through the air guide 83. Thus, when the air guide 83 is installed such that at least one of the bridge diodes 73a and 74a or IGBTs 73b and 74b is disposed therein, the heat generated from the bridge diodes 73a and 74a or IGBTs 73b and 74b, which are the main heating elements of the inverter 70, is dissipated to the outside of the housing 2 more quickly. Therefore, the overheating and damage of the bridge diodes 73a and 74a and IGBTs 73b and 74b can be minimized.

[0168] In other words, the air guide 83 can centrally cool the inverter 70, particularly the heat generated in at least one of the bridge diodes 73a and 74a or IGBTs 73b and 74b.

[0169] In addition, the induction heating cooktop 1 may also include a radiator 85. The radiator 85 may be mounted on the inverter 70.

[0170] Heat sink 85 can be mounted adjacent to bridge diodes 73a and 74a and IGBTs 73b and 74b in inverter 70. Heat sink 85 can be mounted to contact bridge diodes 73a and 74a and IGBTs 73b and 74b.

[0171] The radiator 85 can be installed inside the air guide 83. In particular, the radiator 85 can be installed on the air passage defined by the air guide 83.

[0172] Heat sink 85, bridge diodes 73a and 74a, and IGBTs 73b and 74b may be disposed in an air channel defined by air guide 83.

[0173] The heat sink 85 can absorb the heat generated by at least one of the bridge diodes 73a and 74a or the IGBTs 73b and 74b. In this way, the heat generated in the bridge diodes 73a and 74a and the IGBTs 73b and 74b can be cooled more quickly.

[0174] Thus, when the induction heating type cooktop 1 also includes a radiator 85 disposed inside the air guide 83, the heat generated in at least one of the bridge diodes 73a and 74a or IGBTs 73b and 74b can be cooled more quickly compared to the case where the radiator 85 is not included.

[0175] In inverter 70, bridge diodes 73a and 74a or IGBTs 73b and 74b may be disposed on an air channel defined by air guide 83. Specifically, bridge diodes 73a and 74a or IGBTs 73b and 74b may be disposed at a location in contact with heat sink 85. In this case, the cooling rate of heat generated in at least one of the bridge diodes 73a and 74a or IGBTs 73b and 74b can be faster.

[0176] In addition, such as Figure 10 and Figure 12 As shown, bridge diodes 73a and 74a can be positioned closer to the inlet of air guide 83 than IGBTs 73b and 74b.

[0177] In detail, the induction heating type cooktop 1 may include a first bridge diode 73a and a first IGBT 73b corresponding to the first working coil WC1, and a second bridge diode 74a and a second IGBT 74b corresponding to the second working coil WC2 and the third working coil WC3. By driving the first bridge diode 73a and the first IGBT 73b, current can be supplied to the first working coil WC1, and by driving the second bridge diode 74a and the second IGBT 74b, current can be supplied to the second working coil WC2 or the third working coil WC3.

[0178] In this configuration, the first bridge diode 73a can be positioned closer to the inlet of the air guide 83 than the first IGBT 73b, and the second bridge diode 74a can be positioned closer to the inlet of the air guide 83 than the second IGBT 74b. Therefore, it is advantageous to rapidly cool the heat generated in the bridge diodes 73a and 74a, which generate more heat than the IGBTs 73b and 74b.

[0179] When the outputs of the second working coil WC2 and the third working coil WC3 are less than the output of the first working coil WC1, the first bridge diode 73a and the first IGBT 73b can be positioned closer to the air inlet of the air guide 83 than the second bridge diode 74a and the second IGBT 74b. Therefore, due to the output size, there is an advantage that the heat generated in the first bridge diode 73a and the first IGBT 73b corresponding to the first working coil WC1 is cooled more quickly compared to the second bridge diode 74a and the second IGBT 74b corresponding to the second working coil WC2 and the third working coil WC3.

[0180] As described above, although the induction heating type cooktop 1 according to the embodiments of this disclosure also includes a thin layer TL and a working coil cooling fan 90 for cooling the heat generated by the thin layer TL, components such as the working coil WC and the inverter 70 can be stably cooled without substantially increasing the volume of the housing 2.

[0181] Meanwhile, in the induction heating type stove 1 according to the embodiments of the present disclosure, the cooling channel through which the air blown by the working coil cooling fan 90 passes can be defined to allow the working coil WC1 to be cooled more quickly.

[0182] According to an embodiment of the present disclosure, the induction heating type stove 1 may further include a component provided with a cooling channel in which air blown by the working coil cooling fan 90 passes through the working coil WC1 and is discharged.

[0183] Figure 13 This is a view showing a bracket installed in an induction heating type cooktop according to an embodiment of the present disclosure. Figure 14 It is shown Figure 13 The view shown depicts the bracket being mounted to the working coil module, and... Figure 15 This shows the insulation being installed on... Figure 14 The view shows the state of the bracket.

[0184] The bracket 100 can be installed onto the induction heating module. The bracket 100 can form a cooling channel and can be used as an insulation mounting part or a temperature sensor mounting part, through which air blown by the working coil cooling fan 90 passes.

[0185] The support 100 may include an internal component 111, an intermediate component 113, and an external component 115. An inner bridge 112 may be formed between the internal component 111 and the intermediate component 113. An outer bridge 114 may be formed between the intermediate component 113 and the external component 115.

[0186] A first sensor hole h1 may be defined in the inner member 111. The first sensor hole h1 may be a hole through which a sensor configured to sense the temperature of the upper plate portion 4 passes. At least one second sensor hole h2 may be defined in the intermediate member 113. The second sensor hole h2 may be a mounting space for a sensor configured to sense the temperature of the thin layer TL. In this case, the bracket 100 may be used as a temperature sensor mounting portion.

[0187] The outer member 115 may form the outer periphery of the support 100. The connecting portion 101 may be formed on the outside of the outer member 115. The support portion 103 may be formed below the outer member 115. The guide portion 105 may be formed above the outer member 115.

[0188] The connecting part 101 can be mounted to the substrate 200. The connecting part 101 can be mounted to the substrate 200 by means of connecting members (not shown), such as bolts and nuts.

[0189] The support portion 103 can support the substrate 200. The lower end of the support portion 103 can contact the substrate 200 and support the bracket 100.

[0190] The guide portion 105 can guide the installation position of the heat insulation body 10. The guide portion 105 can protrude upward along the outer member 115, and the heat insulation body 10 can be disposed inside the guide portion 105.

[0191] The guide portion 105 can fix the heat insulation body 10. The guide portion 105 can minimize the horizontal spacing of the heat insulation body 10. Thus, the guide portion 105 is formed in the bracket 100 so as to serve as a heat insulation body mounting portion.

[0192] The guide portion 105 can be a component with a circular shape. Alternatively, such as Figure 13As shown, since multiple guide members are spaced apart along a virtual circle, the guide portion 105 can be formed in a circular shape. In this case, the cooling channel outlet G2 can be defined between the guide members forming the guide portion 105. That is, the cooling channel outlet G2 can be defined in the guide portion 105, and the cooling channel outlet G2 can be a gap through which air passing through the cooling channel defined in the bracket 100 is discharged. Figure 15 As shown, the cooling channel outlet G2 can be defined between the insulation 10 and the support 100. That is, the cooling channel outlet G2 can be defined between the lower surface of the insulation 10 and the support 100.

[0193] Cooling aisle inlet ( Figure 17 G1 can be defined between the substrate 200 and the working coil support 210. This will be referred to... Figure 17 Detailed description.

[0194] The inner bridge 112 can connect the inner component 111 to the intermediate component 113. For example... Figure 13 As shown, at least one first through-hole 108 may be defined in the inner bridge 112. When the first through-hole 108 is defined in the inner bridge 112, at least a portion of the heat generated in the thin layer TL, etc., can flow to the first through-hole 108. In this case, heat transfer can be dispersed to the components forming the support itself (such as the inner bridge 112). Therefore, the problem of the support 100 deforming due to overheating can be minimized.

[0195] According to one embodiment, the first through hole 108 may not be limited to the inner bridge 112.

[0196] The inner bridge 112 may be provided with multiple bridge members that connect the inner member 111 to the intermediate member 113, thereby confining multiple first through holes 108 within the inner bridge 112. Thus, when the multiple bridge members connect the inner member 111 to the intermediate member 113, the rigidity of the support 100 increases. Therefore, depending on the material, thickness, etc., the inner bridge 112 may be provided with more than a predetermined number of bridge members.

[0197] The outer bridge 114 can connect the intermediate member 113 to the outer member 115. At least one connection hole 107 can be defined in the outer bridge 114.

[0198] The connection hole 107 is part of the cooling channel defined in the bracket 100 and may be a hole connected to the cooling channel outlet G2. The connection hole 107 and the cooling channel outlet G2 may communicate with each other. Air introduced into the cooling channel defined in the bracket 100 may pass sequentially through the connection hole 107 and the cooling channel outlet G2.

[0199] Multiple connection holes 107 can be defined in the outer bridge 114. The number of connection holes 107 can be the same as the number of cooling channel outlets G2. Figure 13 As shown, the second through hole 109 can be defined between the connecting hole 107 and another adjacent connecting hole 107.

[0200] The second through-hole 109 can minimize deformation problems caused by overheating of the support 100 by dispersing heat transfer to the components forming the support (such as the outer bridge 114).

[0201] According to one embodiment, the second through hole 109 may not be limited between the connecting hole 107 and another adjacent connecting hole 107.

[0202] Figure 16 This is a view showing a working coil support member disposed in an induction heating type stove according to an embodiment of the present disclosure, and Figure 17 and Figure 18 It is a cross-sectional view of the cooling channel defined in the support.

[0203] The working coil support 210 may include an internal support 203, an external support 205, and intermediate supports 207 and 209.

[0204] The inner support 203 can support the working coil WC wound inside the working coil support 210. The outer support 205 can form the outer periphery of the working coil support 210 and can support the working coil WC wound along the outer periphery of the working coil support 210.

[0205] Intermediate supports 207 and 209 can connect the inner support 203 to the outer support 205 and can support the working coil WC wound between the inner support 203 and the outer support 205. Ferrite 211 can be disposed on at least one of the intermediate supports 207 and 209 (e.g., 209).

[0206] Ferrite 211 prevents the magnetic field generated in the working coil WC from flowing to the lower side. Ferrite 211 can be formed from a material with very high permeability.

[0207] like Figure 16 As shown in the example, intermediate support 207 without ferrite 211 and intermediate support 209 with ferrite 211 can be formed alternately along a circle. An air space 212 can be defined between intermediate supports 207 and 209.

[0208] The air space 212 can be the space in which air is introduced by the working coil cooling fan 90.

[0209] In detail, such as Figure 17 As shown, the cooling channel inlet G1 can be defined between the internal support 203 and the substrate 200. Air drawn in from the outside by the working coil cooling fan 90 can be introduced into the air space 212 through the base hole 202 and the cooling channel inlet G1.

[0210] Air introduced into the air space 212 can pass through the working coils WC and move to the first gap 213a between the support 100 and the working coils WC.

[0211] Gap 213a and 213b can be defined between the support 100 and the working coil WC. Gap 213a and 213b can be divided into a first gap 213a defined at a position overlapping with the air space 212 in the vertical direction and a second gap 213b defined at a position overlapping with the ferrite 211 in the vertical direction.

[0212] Air introduced into the first gap 213a through air space 212 can move horizontally. Therefore, air introduced into the first gap 213a can move to the second gap 213b. Conversely, air in the second gap 213b can move back to the first gap 213a. That is, air introduced into gaps 213a and 213b can move freely horizontally. Subsequently, at least a portion of the air introduced into the second gap 213b can be discharged to the outside of the support 100 through cooling channel outlet G2.

[0213] In other words, in order to cool the working coil WC, air blown from the outside by the working coil cooling fan 90 can flow along the cooling channel inlet G1, the air space 212, the first gap 213a, the second gap 213b, and the cooling channel outlet G2. The cooling channel defined in the bracket 100 may include the cooling channel outlet G2, and the gaps 213a and 213b between the bracket 100 and the working coil WC.

[0214] As described above, the air blown by the working coil cooling fan 90 can pass through the working coil WC and be discharged to cool the working coil WC. That is, in the induction heating type stove 1 according to the embodiment of the present disclosure, a heat insulation member 10 is installed and a cooling channel passing through the working coil WC is also formed, thereby minimizing the overheating of the working coil WC caused by the heat generated by heating the thin layer TL.

[0215] Meanwhile, since the thin layer TL coated on the upper plate portion 4 has a structure that is directly heated by the working coil WC, the thin layer TL may be heated to a very high temperature approaching approximately 600°C. As described above, when the thin layer TL overheats, there is a risk of damaging the upper plate portion 4 on which the thin layer TL is applied. Therefore, in order to minimize the risk of damage to the upper plate portion 4, it is necessary to monitor the temperature of the thin layer TL and maintain the temperature of the thin layer TL below a set temperature.

[0216] Therefore, the induction heating type cooktop 1 may further include a thin-film temperature sensor 300 configured to sense the temperature of the thin film TL. The induction heating type cooktop 1 may include at least one thin-film temperature sensor 300. In addition, the induction heating type cooktop 1 may include an upper plate temperature sensor 400 configured to sense the temperature of the upper plate portion 4. The temperature sensors described below include the thin-film temperature sensor 300 and the upper plate temperature sensor 400.

[0217] In order to minimize the problem of damage to the upper plate 4 due to the rapid temperature rise of the thin layer TL, the temperature sensors 300 and 400 must be equipped with sensors that have a fast response speed and are capable of measuring temperatures close to about 600°C.

[0218] According to one embodiment, temperature sensors 300 and 400 may be temperature sensors configured to measure temperature using a thermocouple.

[0219] Temperature sensors 300 and 400 may include multiple thermocouples. The multiple thermocouples may include a first end connected to or in contact with the portion measuring the temperature, and a second end for transmitting the measured information to the control module.

[0220] Temperature sensors 300 and 400 may include some of various types of thermocouples. According to one embodiment, the thermocouples used in temperature sensors 300 and 400 may be type K thermocouples. Temperature sensors 300 and 400 can measure the electromotive force (EMF) generated by measuring temperature (e.g., the seeback voltage caused by the temperature difference between dissimilar metals). The EMF and temperature measured by the thermocouples may have a corresponding relationship, and data relating to the correlation between EMF and temperature can be pre-stored.

[0221] The induction heating cooktop 1 can calculate the temperature based on the electromotive force measured by a thermocouple. Conventional temperature sensors, such as thermistors, are slow to respond and have a limitation on the maximum measurable temperature of about 300°C or lower. Therefore, when the induction heating cooktop 1 is equipped with thermocouple thermometers as temperature sensors 300 and 400, the response speed is improved compared to conventional temperature sensors (e.g., thermistors), and relatively higher temperatures (about 600°C) can be measured. For example, the induction heating cooktop 1 can determine whether the temperature rises within a range of at least 600°C using temperature sensors 300 and 400. That is, the induction heating cooktop 1 can at least measure the manufacturer's guaranteed temperature (e.g., about 550°C) of the upper plate portion 4 using temperature sensors 300 and 400.

[0222] Temperature sensors 300 and 400 may be configured to measure the temperature of at least one of the thin film TL or the upper plate portion 4 using a plurality of thermocouples, which are configured to measure the temperature of a portion of the temperature distribution above a predetermined temperature distributed in the temperature distribution of the induction-heated thin film TL (formed). A first end of each of the plurality of thermocouples may be disposed on at least one of the thin film TL or the upper plate portion 4 to measure the heating temperature caused by the induction-heated thin film TL.

[0223] First, since the first end must be installed to connect to or contact the thin film TL, the thin film temperature sensor 300 can be mounted such that the first end is directly below the thin film TL. That is, the thin film temperature sensor 300 can be mounted such that the first end is positioned between the thin film TL and the working coil WC. Specifically, since the thin film temperature sensor 300 must measure the temperature of the region with the highest temperature in the thin film TL, the first end can be positioned in the region where the working coil WC is densely arranged in the space between the thin film TL and the working coil WC.

[0224] Meanwhile, since the gap (e.g., about 7 mm) between the upper plate portion 4 coated with a thin layer of TL and the working coil WC is very narrow, the mounting space for the thin-layer temperature sensor 300 may be limited. Therefore, it may be necessary to mount the thin-layer temperature sensor 300 in a structure that fits into the narrow space between the upper plate portion 4 and the working coil WC.

[0225] According to the first embodiment, the thin-film temperature sensor 300 can be mounted to be fixed to the bracket 100. That is, the thin-film temperature sensor 300 can be mounted such that the first end connected to or in contact with the thin film TL is fixed to the bracket 100.

[0226] Figure 19This is a view showing an example of a thin-film temperature sensor installed on an induction heating type cooktop according to the present disclosure, according to the first embodiment. Figure 20 It is shown Figure 19 A view showing an example of the wiring configuration of a thin-film temperature sensor, and... Figure 21 and Figure 22 It is shown Figure 19 Another example view showing the wires of a thin-film temperature sensor in a set-up state.

[0227] The second sensor hole h2 through which the thin-film temperature sensor 300 passes can be defined in the bracket 100, and the thin-film temperature sensor 300 can be mounted to pass through the second sensor hole h2. That is, the first end 312 of the thin-film temperature sensor 300 can pass through the second sensor hole h2 and be connected to or in contact with the thin film TL.

[0228] At least one second sensor hole h2 may be defined in, for example, the intermediate member 113 of the bracket 100. However, this is merely an example, and the second sensor hole h2 may be defined at any location on the bracket 100, such as the inner member 111, the inner bridge 112, the outer bridge 114, or the outer member 115.

[0229] Reference Figure 19 For example, a plurality of second sensor holes h2 may be defined in the bracket 100, and the plurality of second sensor holes h2 may be spaced apart at equal intervals.

[0230] A thin-film temperature sensor 300 can be installed in each of the second sensor holes h2. A sealing member 300a can also be installed, which is configured to fill (pack) the space remaining when the thin-film temperature sensor 300 is installed. The sealing member 300a can be made of a material such as silicone or rubber and can shield the second sensor hole h2.

[0231] The sealing member 300a can block heat transfer along the vertical direction of the support 100 through the second sensor hole h2. For example, the sealing member 300a can block heat generated from the thin layer TL, etc., from being transferred to the working coil WC through the second sensor hole h2.

[0232] Meanwhile, the thin-film temperature sensor 300 may be provided with heads 310 and 330 for accommodating the first end 312, and connectors 320 and 340 for accommodating at least a portion of a wire 322 for transmitting the sensed value of the first end 312 to a control module (not shown).

[0233] Heads 310 and 330 may be configured to connect to or contact the thin layer TL. Heads 310 and 330 may pass through a second sensing hole 12 defined in the insulation 10, and the upper surfaces of heads 310 and 330 may connect to or contact the thin layer TL.

[0234] Connectors 320 and 340 can be configured such that wire 322 passes over or across the working coils WC and is connected to a control module (not shown).

[0235] According to one embodiment, such as Figure 20 As shown, the thin-film temperature sensor 300 can be configured such that a wire 322 passes between the working coil WC wound around the working coil support 210. In this case, the wire 322 can pass between the working coil WC and the air space 212, and can pass through a wire hole 223 defined in the substrate 200.

[0236] Connector 320 can be formed from head 310 to wire hole 223, such as Figure 20 As shown. However, this is just an example, and the connector 320 may be formed only from the head 310 to the working coil WC or from the head 310 to the upper end of the working coil WC.

[0237] According to another embodiment, such as Figure 21 and Figure 22 As shown, the thin-film temperature sensor 300 can be configured such that the wire 322 passes over the working coil WC wound around the working coil support 210.

[0238] A wire channel 342, configured to guide the wire 322 horizontally, can be defined within the connector 340. That is, the wire 322, connected to the first end 312 housed in the head 330, can be bent at the connector 340, pass through the wire channel 342, and subsequently cross the working coil WC. As described above, when the wire channel 342 is defined within the connector 340, the operator can easily identify the assembly orientation of the connector 340 by defining the position of the wire channel 342.

[0239] According to an embodiment, the wire channels 333 and 334 through which the wire 322 passes can be defined in at least one of the sealing member 300a or the bracket 100.

[0240] Therefore, according to the first embodiment, since the thin-film temperature sensor 300 is fixed to the bracket 100 between the temperature measurement point and the working coil WC, the installation space of the thin-film temperature sensor 300 can be minimized, and the temperature of the thin-film TL can be measured stably.

[0241] According to the second embodiment, the thin-film temperature sensor 300 can be mounted to be fixed to the working coil support 210. That is, the thin-film temperature sensor 300 can be mounted such that the first end connected to or in contact with the thin film TL is fixed and supported by the working coil support 210.

[0242] According to the third embodiment, the thin-film temperature sensor 300 can be mounted to be fixed to the substrate 200. That is, the thin-film temperature sensor 300 can be mounted such that the first end connected to or in contact with the thin film TL is fixed and supported by the substrate 200.

[0243] Figure 23 This is a view showing an example of a thin-film temperature sensor installed in an induction heating type stove according to the present disclosure, according to a second embodiment. Figure 24 This is a view showing an example of a thin-film temperature sensor installed in an induction heating type cooktop according to the third embodiment of the present disclosure, and Figure 25 yes Figure 23 and Figure 24 The image shows a longitudinal cross-sectional view of a thin-film temperature sensor.

[0244] Thin-film temperature sensor 300 can be like Figure 23 As shown, it is mounted to be fixed to the working coil support 210, or it can be as follows: Figure 24 The thin-film temperature sensor 300 is shown to be mounted and fixed to the substrate 200. That is, according to the second and third embodiments, the point where the thin-film temperature sensor 300 is fixed can be spaced apart from the head 340 and 360 that accommodate the first end 312 as the temperature measurement point.

[0245] First, refer to Figure 23 In the thin-film temperature sensor 300, a head 340 housing the first end 312 can be located on the working coil WC, and a connector 350 connected to the lower end of the head 340 can be mounted to be fixed to intermediate supports 207 and 209. Specifically, the connector 250 can be fixed to the intermediate support 207 in which the ferrite 211 is not disposed. The connector 350 can be formed horizontally from the lower end of the head 340 to the intermediate support 207 in which the working coil WC is not wound. The connector 350 can be bent once or multiple times to secure it to the intermediate support 207.

[0246] Reference Figure 24 In the thin-film temperature sensor 300, a head 360 housing the first end 312 can be located on the working coil WC, and a connector 370 connected to the lower end of the head 360 can be mounted to secure it to the substrate 200. The connector 370 can be formed horizontally from the lower end of the head 360 to the substrate 200. The connector 370 can be bent once or multiple times to secure it to the substrate 200.

[0247] like Figure 23 or Figure 24 As shown, when the thin-film temperature sensor 300 is mounted to be fixed to the working coil support 210 or the substrate 200, the following advantages exist: the thin-film temperature sensor 300 can be fixed even without adding a separate component such as the bracket 100. That is, the thin-film temperature sensor 300 is mounted using the blank area of ​​the working coil support 210 or the blank area of ​​the substrate 200.

[0248] Next, the upper plate temperature sensor 400 can be installed so that the first end is connected to or in contact with the upper plate 4.

[0249] According to one embodiment, the upper plate temperature sensor 400 can be fixed to the working coil support 210. Specifically, the upper plate temperature sensor 400 can be installed such that the first end is located at the center of the working coil support 210, and the first end can pass through the first sensor hole h1 of the bracket 100 and the first sensing hole 11 of the heat insulation body 10 and be connected to or in contact with the upper plate 4.

[0250] The above description merely illustrates the technical concept of this disclosure, and those skilled in the art can make various modifications and changes to it without departing from the basic characteristics of this disclosure.

[0251] Therefore, the embodiments of this disclosure are not intended to limit the technical spirit of this disclosure, but are intended to illustrate the technical ideas of this disclosure, and the technical spirit of this disclosure is not limited by these embodiments.

[0252] The scope of protection of this disclosure shall be interpreted by the appended claims, and all technical ideas within the scope of equivalents shall be interpreted as falling within the scope of this disclosure.

Claims

1. An induction heating type cooktop, comprising: case; A cover plate, connected to the upper end of the housing, the cover plate having an upper surface configured to support the object to be heated thereon; The working coil is disposed inside the housing and wound in a ring; A bracket is positioned above the working coil; A thin layer is disposed at the cover plate and is configured to be heated by the working coil via induction. A cooling fan is configured to blow air toward the working coil; as well as A working coil support is configured to support the working coil. The working coil support defines an air space below the working coil to allow air blown by the cooling fan to pass through the working coil and flow along its outer surface. The working coil support includes multiple protrusions that project upwards toward the bracket, thereby defining multiple grooves. Each of these grooves is configured to accommodate annular portions of the working coil. The cooling channel includes a gap defined between the upper ends of the bracket and the plurality of protrusions, and overlaps with the thin layer in the vertical direction. The thin layer is configured to be heated by induction from the working coil, and to allow the magnetic field generated by the working coil to pass through the thin layer. The stove also includes a ferrite core installed below the working coil.

2. The induction heating stove according to claim 1, wherein, The working coil support includes a first support, which includes the plurality of protrusions, and the working coil is wound circumferentially along the plurality of protrusions.

3. The induction heating stove according to claim 1, wherein, The working coil support further includes a second support, which is radially spaced from the first support, and The air space is defined between the first support member and the second support member.

4. The induction heating stove according to claim 3, wherein, The ferrite is disposed on at least one of the first support and the second support.

5. The induction heating stove according to claim 1, wherein, The skin depth of the thin layer is greater than the thickness of the thin layer.

6. The induction heating cooktop according to claim 1, further comprising a first temperature sensor configured to measure the temperature of the thin layer, and in, At least a portion of the first temperature sensor is located in the air space.

7. The induction heating cooktop according to claim 6 further includes a second temperature sensor configured to measure the temperature of the cover plate, and in, The second temperature sensor is fixed to the working coil support.

8. The induction heating stove according to claim 7, wherein, The second temperature sensor is mounted at the center of the working coil support.

9. The induction heating cooktop according to claim 4, further comprising a first temperature sensor configured to measure the temperature of the thin layer. in, The ferrite is disposed on the second support member, and At least a portion of the first temperature sensor overlaps with the first support member in the vertical direction.

10. The induction heating cooktop according to claim 4, further comprising a first temperature sensor configured to measure the temperature of the thin layer. in, The ferrite is disposed on the second support member, and In this configuration, at least a portion of the first temperature sensor overlaps with the second support member in the vertical direction. The working coil support defines an air space between itself and the working coil, and the air space is disposed below the thin layer so as to overlap with the thin layer in the vertical direction.

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