Insertion plate, packaging structure comprising an insertion plate, method of manufacturing thereof, and electrical system

Abstract

This disclosure relates to an insert board, a package structure including the insert board, a method of manufacturing the same, and an electrical system. An insert board for a package structure is provided, comprising: an insulating body having one or more holes; one or more coupling members disposed on or within the insulating body; and one or more electronic components, including a first electronic component disposed in a first hole among the one or more holes and electrically coupled to a corresponding first coupling member among the one or more coupling members, the first electronic component being adapted to be electrically coupled to other components of the package structure outside the insert board via the first coupling member.

Description

Technical Field

[0001] This disclosure relates to high reliability / high performance power packaging technology, and more specifically, to an insert board integrating electronic components, a package structure including the insert board, a method of manufacturing the same, and an electrical system thereof. Background Technology

[0002] With the increasing demand for higher-performance power modules in various applications (such as electric vehicles (EVs), the structure of power modules has become more complex. This often requires integrating multiple dies and components into a single module. However, managing the production and quality of such complex power modules becomes a challenge. Summary of the Invention

[0003] According to one aspect of this disclosure, an insert plate for a packaging structure is provided, comprising: an insulating body having one or more holes; one or more coupling members disposed on or in the insulating body; and one or more electronic components, including a first electronic component disposed in a first hole among the one or more holes and electrically coupled to a corresponding first coupling member among the one or more coupling members, the first electronic component being adapted to be electrically coupled to other components of the packaging structure outside the insert plate via the first coupling member.

[0004] In some embodiments, the package structure includes a power die adapted to be mounted to a first mounting substrate and disposed between the insert plate and the first mounting substrate, and the first coupling member adapted to be electrically coupled to the electrodes of the die.

[0005] In some embodiments, the one or more electronic components further include a second electronic component disposed in a second hole of the one or more holes, electrically coupled to a corresponding second coupling member of the one or more coupling members, and adapted to be electrically coupled to a component junction of a first mounting substrate via a corresponding second coupling member, wherein the die is mounted to a die junction of the first mounting substrate.

[0006] In some embodiments, the insert plate further includes at least one of the following: a conductive spacer disposed in a third hole of the one or more holes, the spacer being adapted to be electrically coupled to an electrode of the die located on the side opposite to the first mounting substrate; or a post disposed in a fourth hole of the one or more holes, one end of the post being adapted to engage with the first mounting substrate.

[0007] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, and the first coupling member includes a first conductor portion disposed on or in the first surface of the insulating body, wherein the first conductor portion includes a first portion at a sidewall of the first hole, the first portion being electrically connected to an electrode of the first element.

[0008] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, and the first coupling member includes a first conductor portion disposed on or in the first surface of the insulating body, wherein the first conductor portion covers at least a portion of the first hole from one side of the first surface of the insulating body, and the first conductor portion is electrically connected to an electrode of the first element.

[0009] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the first coupling member includes a first conductor portion, the first conductor portion including a first portion filling the first hole, a second portion extending from the first portion along the sidewall of the first hole to the first surface of the insulating body, and a third portion extending from the second portion along the first surface of the insulating body, wherein the first portion or the second portion is electrically connected to the electrode of the first element.

[0010] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the first coupling member includes a first conductor portion, the first conductor portion including a first part and a second part disposed in the first hole and separated from the first part, the first part covering at least a portion of the first hole from one side of the first surface of the insulating body, wherein the first part is electrically connected to the electrode of the first element.

[0011] In some embodiments, the second hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the second coupling member fills the second hole and extends from the first surface of the insulating body to the second surface of the insulating body, the second coupling member has a recess extending inward from the first surface of the insulating body, the second element is at least partially disposed in the recess and electrically connected to the second coupling member.

[0012] In some embodiments, the second hole extends inward from a first surface of the insulating body and does not extend to a second surface of the insulating body opposite to the first surface. The second coupling member covers the surface of the second hole and has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

[0013] In some embodiments, the first element includes a gate resistor adapted to be electrically coupled to the gate electrode of the die of the package structure via the first coupling member; or the second element includes a temperature sensing element adapted to be electrically coupled to the mounting substrate of the package structure.

[0014] According to one aspect of this disclosure, a packaging structure is also provided, comprising: an insert plate according to any embodiment of this disclosure; a first mounting substrate including an insulating body and a conductive layer on one side of the insulating body; and a power die electrically coupled to a die junction portion of the conductive layer, the die being disposed between the insert plate and the first mounting substrate, wherein the first electronic component is electrically coupled to one of the following via the first coupling member: the conductive layer of the first mounting substrate; or the electrode of the power die.

[0015] In some embodiments, the packaging structure further includes a second mounting substrate disposed opposite to the first mounting substrate across the insert plate.

[0016] According to one aspect of this disclosure, a method of manufacturing a package structure is also provided, comprising: providing an insert plate. Providing the insert plate may include: providing an insulating body; forming one or more holes in the insulating body; forming one or more coupling members on or in the insulating body; and disposing one or more electronic components, wherein the one or more electronic components include a first electronic component disposed in a first hole among the one or more holes, electrically coupled to a corresponding first coupling member among the one or more coupling members, and adapted to be electrically coupled to other components of the package structure outside the insert plate via the first coupling member.

[0017] In some embodiments, the method further includes: providing a first mounting substrate, the first mounting substrate including a die junction and a power die electrically coupled to the die junction; and attaching the insert plate to the first mounting substrate, wherein attaching the insert plate to the first mounting substrate includes: electrically coupling the first coupling member to the electrodes of the die, such that the first electronic component is electrically coupled to the electrodes of the die through the first coupling member.

[0018] In some embodiments, the one or more electronic components further include a second electronic component disposed in a second hole of the one or more holes and electrically coupled to a corresponding second coupling member of the one or more coupling members. Joining the insert plate to the first mounting substrate further includes electrically coupling the second electronic component to a component joint of the first mounting substrate.

[0019] In some embodiments, providing an insert plate further includes: providing a conductive spacer in a third hole of the one or more holes; and providing a post in a fourth hole of the one or more holes. Joining the insert plate to a first mounting substrate further includes: electrically coupling one end of the spacer to an electrode of the die located on the side opposite to the first mounting substrate; and joining one end of the post to the first mounting substrate.

[0020] In some embodiments, the method further includes attaching a second mounting substrate to the side of the insert plate opposite to the first mounting substrate.

[0021] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, and the first coupling member includes a first conductor portion disposed on or in the first surface of the insulating body, wherein the first conductor portion includes a first portion at a sidewall of the first hole, the first portion being electrically connected to an electrode of the first element.

[0022] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, and the first coupling member includes a first conductor portion disposed on or in the first surface of the insulating body, wherein the first conductor portion covers at least a portion of the first hole from one side of the first surface of the insulating body.

[0023] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the first coupling member includes a first conductor portion, the first conductor portion including a first portion filling the first hole, a second portion extending from the first portion along the sidewall of the first hole to the first surface of the insulating body, and a third portion extending from the second portion along the first surface of the insulating body, wherein the first portion or the second portion is electrically connected to the electrode of the first element.

[0024] In some embodiments, the first hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the first coupling member includes a first conductor portion, the first conductor portion including a first part and a second part disposed in the first hole and separated from the first part, the first part covering at least a portion of the first hole from one side of the first surface of the insulating body, wherein the first part is electrically connected to the electrode of the first element.

[0025] In some embodiments, the second hole extends from a first surface of the insulating body through the insulating body to a second surface of the insulating body opposite to the first surface, the second coupling member fills the second hole and extends from the first surface of the insulating body to the second surface of the insulating body, the second coupling member has a recess extending inward from the first surface of the insulating body, the second element is at least partially disposed in the recess and electrically connected to the second coupling member.

[0026] In some embodiments, the second hole extends inward from a first surface of the insulating body and does not extend to a second surface of the insulating body opposite to the first surface. The second coupling member covers the surface of the second hole and has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

[0027] In some embodiments, the first element includes a gate resistor adapted to be electrically coupled to the gate electrode of the die via the first coupling member, or the second element includes a temperature sensing element.

[0028] According to one aspect of this disclosure, an electrical system is also provided, which includes the packaging structure described in any embodiment of this disclosure.

[0029] According to aspects and embodiments of this disclosure, novel insert boards integrating electronic components, package structures including insert boards, methods of manufacturing the same, and electrical systems are provided. Embodiments of this disclosure can improve the manufacturability and design flexibility of power modules, and enhance reliability. Furthermore, they can reduce process steps, improving production efficiency and yield.

[0030] Other features and advantages of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0031] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the specification, serve to explain the principles of this disclosure.

[0032] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0033] Figure 1 A schematic cross-sectional view of a dual-sided cooling (DSC) package structure is shown;

[0034] Figure 2A-2J Schematic cross-sectional views of an insert plate for a packaging structure according to embodiments of the present disclosure are shown respectively;

[0035] Figures 3A-3F A schematic cross-sectional view showing the steps of a method for manufacturing an insert plate according to some embodiments of the present disclosure is shown. Figure 3G and 3H A schematic cross-sectional view of some alternative steps in a method for manufacturing an insert plate according to an alternative embodiment is shown;

[0036] Figures 4A-4F A schematic cross-sectional view showing the steps of a method for manufacturing an insert plate according to some embodiments of the present disclosure is shown. Figure 4G and 4H A schematic cross-sectional view of some alternative steps in a method for manufacturing an insert plate according to an alternative embodiment is shown;

[0037] Figure 5A , 5B Figures 5 and 5C respectively show schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure;

[0038] Figure 6A , 6B Figures 6 and 6C respectively show schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure;

[0039] Figure 7 A schematic flowchart illustrating a method for manufacturing a packaging structure according to some embodiments of the present disclosure is shown;

[0040] Figure 8 A schematic flowchart illustrating a method for manufacturing a packaging structure according to other embodiments of the present disclosure is shown; and

[0041] Figure 9 A schematic diagram of an electrical system according to some embodiments of the present disclosure is shown.

[0042] Note that in the embodiments described below, the same reference numerals are sometimes used across different figures to denote the same parts or parts having the same function, and repeated descriptions are omitted. In this specification, similar reference numerals and letters are used to denote similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0043] For ease of understanding, the positions, dimensions, and extents of the structures shown in the accompanying drawings and other references may not represent actual positions, dimensions, and extents. Therefore, the disclosed invention is not limited to the positions, dimensions, and extents disclosed in the accompanying drawings and other references. Detailed Implementation

[0044] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present disclosure. Furthermore, techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification.

[0045] It should be understood that the following description of at least one exemplary embodiment is merely illustrative and not intended to limit the scope of this disclosure or its application or use. It should also be understood that any implementation described herein does not necessarily represent a preferred or advantageous implementation over others. This disclosure is not limited to any expressed or implied theory given in the foregoing description of the technical field, background, summary of the invention, or detailed description.

[0046] Additionally, certain terms may be used in the following description for reference only, and are therefore not intended to be limiting. For example, unless the context clearly indicates otherwise, the words “first,” “second,” and other such numerical terms relating to structures or elements do not imply order or sequence.

[0047] It should also be understood that when the term “including / contains” is used herein, it indicates the presence of the indicated feature, whole, step, operation, unit and / or component, but does not preclude the presence or addition of one or more other features, wholes, steps, operations, units and / or components and / or combinations thereof.

[0048] Figure 1 A schematic cross-sectional view of a dual-sided cooling (DSC) package structure is shown. Figure 1As shown, the DSC package structure 10 may include a first mounting substrate 100 and a second mounting substrate 200. The substrate 100 may include an insulating body 1011 and conductive layers 1013 and 1015 on opposite sides of the insulating body. The substrate 200 may include an insulating body 2011 and conductive layers 2013 and 2015 on opposite sides of the insulating body. Each of the insulating bodies 1011 and 2011 may be formed of, for example, ceramic or organic materials. The conductive layers 1013, 1015, 2013, and 2015 may each be formed of a metal such as copper or aluminum. As an example, the substrates 100 and 200 may each be, for example, a Direct Bond Copper (DBC) substrate, a Direct Plated Copper (DPC) substrate, an Active Metal Braze (AMB) substrate, a Direct Bonding Aluminum (DBA) substrate, or an Insulated Metal Substrate, etc.

[0049] The DSC package structure 10 may also include a die 103, for example, a power die in which a power device is formed. As an example, the die 103 is mounted to a first mounting substrate 100, for example, electrically coupled to a conductive layer 1013 of the substrate 100, such as... Figure 1 As shown. Power devices may include, for example, but not limited to, power MOS transistors, IGBTs, power diodes, etc.

[0050] The DSC package structure 10 may further include a spacer 105. One end of the spacer 105 is electrically coupled to the side of the die opposite to the first mounting substrate 100, for example, via an attachment material (e.g., solder paste or conductive sintering material) 125 to the die's electrodes. The other end of the spacer 105 is electrically coupled to the second mounting substrate 200, for example, via an attachment material (e.g., solder paste or conductive sintering material) 127 to the conductive layer 2013 of the second mounting substrate.

[0051] The DSC package structure 10 may further include a gate resistor 107. The gate resistor 107 is electrically coupled to the conductive layer 1013 of the first mounting substrate 100 and electrically coupled to an electrode (e.g., a gate or control electrode) of the die 103 via a wire 141. The DSC package structure 10 may also include other elements 107, such as temperature sensing elements, such as negative temperature coefficient (NTC) sensing elements (e.g., thermistors), to sense the die temperature. The temperature sensing element 107 may be electrically coupled to the conductive layer 1013 of the first mounting substrate 100. The DSC package structure 10 may also include a support or pillar 111. One end of the pillar 111 is electrically coupled to the first mounting substrate 100, and the other end is electrically coupled to the second mounting substrate 200. Figure 1 In the diagram, post 111 is shown attached to the conductive layer 1013 of the first mounting substrate 100 and the conductive layer 2013 of the second mounting substrate 200 via attachment materials (e.g., sintered materials) 131 and 133, respectively.

[0052] A typical manufacturing method for the DSC package structure 10 is as follows: First, a die, a gate resistor, and a post are attached to a first mounting substrate 100. Then, conductive spacers are attached to the die. Wire bonding is performed to connect the gate resistor and the die (its gate) with wires. Next, the post is attached to the first mounting substrate. Then, a second mounting substrate is attached to the structure formed as described above.

[0053] The applicant's research found that the complex DSC packaging structure design necessitates multiple pick-and-place processes, resulting in long manufacturing times and lengthy, complex procedures, leading to low production efficiency and high costs. Furthermore, the pick-and-place process inevitably introduces processing errors, which accumulate across multiple processes. It was also noted that multiple pick-and-place processes, along with other process steps (e.g., attaching the second mounting substrate), can cause errors in multiple dimensions, such as pitch or roll errors in addition to planar errors. This necessitates high manufacturing precision, further reducing production efficiency and yield.

[0054] The applicant also discovered that defects associated with the gate conductor 141 are one of the main factors causing failures in the package structure 10, thus significantly limiting yield improvement. Furthermore, due to design limitations, the temperature sensing element 109 is difficult to place close to the die 103, as it requires space and related wiring, and must be compromised with other design considerations. Therefore, the temperature it senses deviates from the actual temperature of the die. In some applications, a deviation of a few degrees or even one degree in certain critical temperature ranges can lead to different consequences.

[0055] At least in response to one or more of the above and other problems, through efforts, originality and innovation, the applicant has proposed solutions to various embodiments disclosed herein. According to embodiments of this disclosure, a novel insert board for a package structure is proposed. This insert board can be used in conjunction with one or more mounting substrates on which dies (e.g., power dies) are mounted to form a package structure (e.g., a power module), as will be described in detail later with reference to the accompanying drawings.

[0056] Figure 2A-2J Schematic cross-sectional views of an insert plate for a packaging structure according to embodiments of the present disclosure are shown. In the drawings, the same or similar reference numerals are used for the same elements. Where a particular element or component has already been described in a prior drawing, its repetition in subsequent drawings and descriptions will be omitted. It should also be understood that the content described with respect to different drawings or different embodiments can be applied similarly or adaptively to other drawings or embodiments, as is the ability of those skilled in the art.

[0057] Figure 2A An interposer substrate 20A for a packaging structure is shown. For example... Figure 2A As shown, the insertion plate 20A may include an insulating body 201, the insulating body 201 having one or more holes. Figure 2A Not marked in the text, see for example Figure 3B , 4B The insulating body 201 can be formed of an insulating material, such as ceramic or an organic insulating material such as epoxy resin, polyimide, etc. The organic insulating material may contain, for example, glass fiber. The insert plate 20A may also include one or more coupling members (e.g., coupling members 21, 23) disposed on and / or within the insulating body. The coupling members may be formed of a metal (e.g., but not limited to copper). The insert plate 20A may also include one or more electronic components, such as electronic components 207, 209. The one or more electronic components may include a first electronic component, such as component 207 or 209. Taking component 207 as an example of a first electronic component, component 207 may be disposed in a first hole (not shown in FIG. 2, for example) among the one or more holes. Figure 3B In 507), it is electrically coupled to a corresponding first coupling member 21 (e.g., its first conductor portion 215) in one or more coupling members, and is adapted to be electrically coupled to other components of the package structure outside the insert plate via the first coupling member, as will be referred to below. Figures 5A-5C As described in 6A-6C. As an example, element 207 may be, for example, but not limited to, a gate resistor adapted to be electrically coupled to the gate electrode of the die via a first coupling element (e.g., via a portion thereof).

[0058] According to embodiments of this disclosure, the first hole (see, for example, Figure 3B The first coupling member (507) extends from a first surface (e.g., lower surface 2011) of the insulating body 201 through the insulating body 201 to a second surface (e.g., upper surface 2013) opposite to the first surface of the insulating body 201. The first coupling member may be formed of a metal (e.g., copper, etc.). The first coupling member may include a first conductor portion 215 disposed on or within the first surface of the insulating body. In some embodiments, such as Figure 2A As shown, the first conductor portion 215 may include a first portion 2151 at the sidewall of the first hole. The first portion 2151 may be electrically connected to an electrode 2071 of the first element. The first conductor portion 215 may also include a second portion 2152 on or within the first surface of the insulating body 201. The second portion 2152 is configured to extend along or substantially parallel to the first surface of the insulating body 201. Figure 2A In the diagram, the second portion 2152 is shown disposed within the insulating body 201, and more specifically, within the first surface of the insulating body 201. The second portion 2152 can be used for electrical coupling with components outside the insert plate (e.g., a die or mounting substrate).

[0059] The first coupling component 21 may also include a second conductor portion 217. For example... Figure 2A As shown, the second conductor portion 217 may include a first portion 2171 at the sidewall of the first hole. The first portion 2171 may be electrically connected to another electrode 2073 of the first element. The second conductor portion 217 may also include a second portion 2172 on or within the second surface 2013 of the insulating body 201. The second portion 2172 is configured to extend along or substantially parallel to the second surface 2013 of the insulating body 201. Figure 2A In the diagram, the second portion 2172 is shown disposed within the insulating body 201, more specifically, on the second surface (upper surface) 2013 of the insulating body 201, and its upper surface is substantially flush with the second surface. The second portion 2172 can be used for electrical coupling with external components (e.g., dies, mounting substrates, or other circuit components). It should also be understood that the electrode configuration of the element (e.g., the first element 207) shown herein is merely exemplary, and it can have various electrode configurations as needed.

[0060] The one or more electronic components may further include additional electronic components (second electronic components), such as (but not limited to) component 209. The second electronic component may be disposed in a second hole within the one or more holes. Figure 2A Not marked in the text, but can be seen in, for example Figure 4BIn example 509), the second hole is a blind hole (also known as a recess), meaning it does not penetrate the insulating body 201. The second electronic component can be electrically coupled to a corresponding second coupling member (e.g., coupling member 23) of the one or more coupling members, and is adapted to be electrically coupled, for example, to a component outside the insertion plate via the corresponding second coupling member, such as to a component junction of the first mounting substrate, as will be referred to below. Figures 5A-5C As described in 6A-6C.

[0061] like Figure 2A (as well as Figure 4B As shown, the second hole extends inward from the first surface of the insulating body 201 and does not extend to the second surface of the insulating body opposite to the first surface. The second coupling member 23 covers the surface of the second hole (which may include its bottom surface and side surface), and the second coupling member 23 has a recess extending inward from the first surface 2011 of the insulating body 201 / 501 (see...). Figure 4D (539). Element 209 may be at least partially disposed in the recess 539, and the second coupling member 23 is electrically coupled to element 209, for example, electrically coupled to its electrodes. As an example, element 209 may be, for example, but not limited to, a temperature sensing element, such as an NTC thermistor. Figure 2A In this embodiment, element 209 is exemplarily shown as potentially including electrodes 2091 and 2093. Electrode 2091 is used for electrical coupling with conductive component 23, while electrode 2093 is used for electrical coupling with other components. In the context of this disclosure, the term "electrical coupling between A and B" can refer to A and B being in direct contact or being electrically coupled through a conductive material or component.

[0062] It should be understood that although elements 207 and 209, and their corresponding holes and coupling components, are shown and described differently from each other in some embodiments, those skilled in the art will readily understand that, where appropriate, the description of the configuration of elements 207 and 209, and their corresponding holes and coupling components, etc., can be used interchangeably. For example, in Figure 2A In this context, component 207 can also be used as component 209, and component 209 can be used as component 207.

[0063] The insertion plate 20A may also include a conductive spacer 205. The spacer 205 may be disposed in a third hole among the one or more holes. Figure 2A Not marked in the text, see example Figure 3B In embodiments, spacer 205 can be configured for electrical coupling with, for example, an electrode of a die. Spacer 205 can be formed of a conductive material, such as a metal (e.g., copper). Figure 2AIn the example shown, the spacer 205 is shown with its lower surface substantially flush with the lower surface of the second portion 2152 of the first conductor portion 215, that is, substantially flush with the lower surface of the insulating body 201.

[0064] The insertion plate 20A may also include a support or a post 211. The post 211 may be disposed in a fourth hole among the one or more holes. Figure 2A Not marked in the text, see example Figure 3B In 511), in some embodiments, the post is configured to engage with a first mounting substrate and a second mounting substrate at its two ends, respectively. Similar to spacer 205, the post may be formed of a conductive material, such as a metal (e.g., copper). The portion of the first conductor portion 215 or the second portion 2172 extending along the surface of the insulating body 201 may represent, for example, but not limited to, wiring for electrical connection.

[0065] Figure 2B An insert plate 20B for a packaging structure is shown. The insert plate 20B and... Figure 2A The main differences in the insert plate 20A shown are as follows. In the insert plate 20B, the second hole for the element 209 is a through hole through the insulating body 201, and the corresponding configuration of the second coupling member 23 is different. Figure 2A The second coupling component 23 in the example. In the insert plate 20B, the second portion 2152 of the first conductor portion 215 is configured to protrude from the first surface 2011 of the insulating body, or rather, on the first surface of the insulating body (relative to the first surface of the insulating body). Figure 2A In the shown orientation, the second portion 2152 is shown below the first surface (lower surface) of the insulating body. Furthermore, in the insert plate 20B, the second portion 2172 of the second conductor portion 217 is configured to protrude beyond the second surface 2013 of the insulating body, or rather, on the second surface of the insulating body (relative to the second surface of the insulating body). Figure 2A In the indicated orientation, the second part 2172 is shown above the second surface (upper surface) of the insulating body.

[0066] like Figure 2B (as well as Figure 3B As shown in the figure, the second hole 509 (see) Figure 3B The second coupling member 23 extends from the first surface 2011 of the insulating body 201, through the insulating body, to the second surface 2013 of the insulating body opposite to the first surface 2011. The second coupling member 23 fills the second hole and extends from the second surface 2013 of the insulating body toward the first surface 2011 of the insulating body. Figure 2B In the example shown, the second coupling member 23 extends from the second surface 2013 of the insulating body to the first surface 2011; however, this disclosure is not limited thereto. Figure 2BIn the example shown, the second coupling member 23 has a recess 539 extending inward from the first surface of the insulating body (see...). Figure 3D The second element 209 is at least partially disposed in the recess 539 and electrically coupled to the second coupling member 513. Note that in Figure 2B An exemplary configuration of the electrodes of element 209 is shown, but the electrodes of element 207 are omitted. Figure 2B As shown, element 209 has electrodes 2091 and 2093 respectively disposed at its upper and lower ends, wherein electrode 2091 is electrically coupled to coupling member 23.

[0067] In addition, Figure 2B In the example insert plate 20B shown, the spacer 205 is shown with its lower surface protruding from the lower surface of the insulating body 201 and substantially flush with the lower surface of the second portion 2152 of the first conductor portion 215.

[0068] The above is Figure 2A The description can be applied here in the same or adaptive way, so it will not be repeated here.

[0069] Figure 2C An insert plate 20C for a packaging structure is shown. The insert plate 20C and... Figure 2A The main differences between the shown insert plate 20A and the others are as follows. In insert plate 20C, [the following is incorporated]... Figure 2B The coupling component 23 and element 209 are shown. Additionally, in the insertion plate 20C, the first conductor portion 215 of the first coupling component 21 does not have the first portion 2151 at the sidewall of the corresponding hole, but instead effectively retains only... Figure 2A The second part 2152. Similarly, the second conductor part 217 does not have the first part 2171 at the sidewall of the corresponding hole, but is equivalent to only retaining Figure 2A Part 2172. Figure 2C In this example, the first conductor portion 215 (2152) and the second conductor portion 217 (2172) are electrically coupled to the element 207 at the sidewalls of the hole, for example, electrically connected to or in contact with the electrodes 2071 and 2073 of the element 207. In this example, the spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215, that is, substantially flush with the lower surface 2011 of the insulating body 201. The contents described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0070] Figure 2D An insert plate 20D for a packaging structure is shown. The insert plate 20D and... Figure 2CThe main differences between the shown insert plate 20C and the insert plate 20D are as follows. In the insert plate 20D, the first conductor portion 215 extends along the first surface of the insulating body 201, covering at least a portion of the opening end of the corresponding first hole, and thus electrically couples with one end (here, its lower end) of the element 207 to form an electrical connection with the electrode 2071 of the element 207. Similarly, the second conductor portion 217 extends along the second surface 2013 of the insulating body 201, covering at least a portion of the opening end of the corresponding first hole, and thus electrically couples with the other end (here, its upper end) of the element 207 to form an electrical connection with the electrode 2073 of the element 207. In this example, the spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215, that is, substantially flush with the lower surface of the insulating body 201. In addition, in the insert plate 20D, the arrangement of the second element 209 and the second coupling member 23 and the corresponding hole is similar to... Figure 2A The same applies to the preceding figures. The content described above can be applied similarly or adaptively here, and therefore will not be repeated.

[0071] Figure 2E An insert plate 20E for a packaging structure is shown. The insert plate 20E and... Figure 2D The main difference between the shown insert plate 20D and the insert plate 20E is as follows. In the insert plate 20E, the first conductor portion 215 is formed to protrude from the first surface 2011 of the insulating body 201, while the second conductor portion 217 is formed to protrude from the second surface 2013 of the insulating body 201. For example... Figure 2E As shown, the first conductor portion 215 extends along the surface 2011 of the insulating body 201, covering at least a portion of the opening end of the corresponding first hole, and thereby electrically connecting or contacting one end (here, its lower end) of the element 207 to form an electrode of the element 207. Figure 2E Electrical connection (not shown). Similarly, the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, and thus is electrically connected or in contact with the other end (here, its upper end) of the element 207 to form an electrical connection with the electrode (not shown in the image). Figure 2E Electrical connections (not shown). In this example, spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215. The contents described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0072] Figure 2F An insert plate 20F for a packaging structure is shown. The insert plate 20F and... Figure 2A The main difference in the shown insertion plate 20A lies in the different configurations of the first coupling component 21 and the corresponding holes. For example... Figure 2FAs shown, in the insertion plate 20F, the first coupling member 21 may include first to fifth conductor portions 2171-2715. The first conductor portion 2171 is disposed at the sidewall of the corresponding first hole. The second conductor portion 2172 may be disposed on or within the first surface of the insulating body 201. The second conductor portion 2172 is configured to extend along or substantially parallel to the first surface 2011 of the insulating body 201. Figure 2F In the diagram, a second conductor portion 2172 is shown disposed within the insulating body 201, more specifically, within the first surface 2011 of the insulating body 201, with its lower surface substantially flush with the first surface. The second conductor portion 2172 can be used for electrical coupling with external components (e.g., a die or mounting substrate). Optionally, a third conductor portion 2173 can be disposed at the opposite sidewall of the first aperture. A fourth conductor portion 2174 can also be disposed on or within the first surface of the insulating body 201. The fourth conductor portion 2172 is configured to extend along or substantially parallel to the first surface of the insulating body 201. Figure 2F In the diagram, an optional fourth conductor portion 2174 is shown disposed within the insulating body 201, more specifically, in the first surface (lower surface) 2011 of the insulating body 201, and its lower surface is substantially flush with the first surface. A fifth conductor portion 2175 is configured to be coupled to or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and to cover the opening of the first hole from the second surface of the insulating body. The fifth conductor portion 2175 may be disposed on and / or within the second surface 201 of the insulating body 201, and may be configured to extend along or substantially parallel to the second surface of the insulating body 201. Figure 2F In the diagram, the fifth conductor portion 2175 is shown as including a portion disposed within the insulating body 201 and a portion protruding from the insulating body 201; however, this disclosure is not limited thereto. Additionally, although the fifth conductor portion 2175 is shown as laterally protruding from a corresponding hole, this disclosure is not limited thereto. One or more of the first conductor portion 2171, the fifth conductor portion 2175, and the third conductor portion 2173 may be electrically connected to one electrode (not shown) of the first element 207. It should be understood that other electrodes of the first element 207 may be disposed in connection with... Figure 2F The cross-section is offset at the location described above. The content described in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0073] Figure 2G An insert plate 20G for a packaging structure is shown. The insert plate 20G and... Figure 2E The main difference between the shown insert plate 20E and the others lies in the configuration of the first coupling component 21 and the corresponding holes. For example... Figure 2GAs shown, the first coupling member 21 may include a first conductor portion 215 and a second conductor portion 217. In the insertion plate 20G, the first conductor portion 215 is formed to protrude from the first surface 2011 of the insulating body 201. The first conductor portion 215 extends along the surface 2011 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, and thereby electrically couples with one end (here, its lower end) of the element 207 to form an electrode of the element 207. Figure 2G Electrical connection (not shown). The second conductor portion 217 is formed to include a first portion 2172 protruding from the second surface 2013 of the insulating body 201, and a second portion 2173 embedded in a corresponding hole. The first portion 2172 of the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, while the second portion 2173 of the second conductor portion 217 is electrically coupled to the other end (here, its upper end) of the element 207 to form an connection with the electrode (of the element 207). Figure 2G Electrical connections (not shown). In this example, spacer 205 is also shown with its lower surface substantially flush with the lower surface of the first conductor portion 215. The contents described above in the preceding figures can be applied similarly or adaptively here, and therefore will not be repeated.

[0074] Figure 2H An insert plate 20H for a packaging structure is shown. The insert plate 20H and... Figure 2E The main difference between the shown insert plate 20E and the others lies in the configuration of the first coupling component 21 and the corresponding holes. For example... Figure 2H As shown, the first coupling component may include a first conductor portion 215 and a second conductor portion 217. In the insertion plate 20H, the first conductor portion 215 is formed in the first surface 2011 of the insulating body 201, with its lower surface substantially flush with the first surface 2011. The first conductor portion 215 extends along the surface 2011 of the insulating body 201, covering at least a portion of the opening end of the corresponding first hole, and thereby electrically coupling with one end (here, its lower end) of the element 207 to form an electrode of the element 207. Figure 2HElectrical connection (not shown). The second conductor portion 217 is formed to include a first portion 2171 that laterally protrudes from the sidewall of the corresponding hole, and a second portion 2172 embedded in the corresponding hole. The first portion 2171 of the second conductor portion 217 extends along the surface 2013 of the insulating body 201 to cover at least a portion of the opening end of the corresponding first hole, while the second portion 2172 of the second conductor portion 217 is electrically coupled to the other end (here, its upper end) of the element 207 to form an electrical connection with the electrode (not shown) of the element 207. Although the first portion 2171 of the second conductor portion 217 is shown to include a portion that laterally protrudes from the sidewall of the corresponding hole, this disclosure is not limited thereto. In other implementations, the first portion 2171 may not have a portion that laterally protrudes from the sidewall of the hole. The content described above in the preceding drawings can be applied similarly or adaptively here, and therefore will not be repeated.

[0075] Figure 2I An insert plate 20I for a packaging structure is shown. In the insert plate 20I, a first coupling member 21 and... Figure 2F The first coupling component 21 shown is similar to this in some respects. For example... Figure 2I As shown, the first coupling member 21 may include first to fifth conductor portions 2171-2715. The first conductor portion 2171 is disposed on the sidewall of a corresponding first hole. The second conductor portion 2172 may be disposed on or within the first surface of the insulating body 201. The second conductor portion 2172 is configured to extend along or substantially parallel to the first surface 2011 of the insulating body 201. Figure 2IIn the diagram, a second conductor portion 2172 is shown disposed within the insulating body 201, more specifically, on the first surface 2011 of the insulating body 201, with its lower surface substantially flush with the first surface 2011. The second conductor portion 2172 can be used for electrical coupling with external components (e.g., a die or mounting substrate). Optionally, a third conductor portion 2173 can be disposed at the opposite sidewall of the first hole. A fourth conductor portion 2174 is configured to fill the corresponding hole, coupled to or integrally formed with the first conductor portion 2171 and the third conductor portion 2173, and covering the opening of the first hole from the second surface of the insulating body. A fifth conductor portion 2175 is coupled to or integrally formed with the fourth conductor portion 2174, and can be disposed on or within the second surface of the insulating body 201, and can be configured to extend along or substantially parallel to the second surface 2013 of the insulating body 201. As shown in the figure, the fourth conductor portion 2174 and the fifth conductor portion 2175 can be configured such that their upper surfaces are substantially flush with the upper surface of the insulating body 201. As an example, the fourth conductor portion 2174 can represent wiring for electrical connection. One or more of the first conductor portion 2171, the fifth conductor portion 2175, and the third conductor portion 2173 can be electrically connected to one electrode (not shown) of the first element 207. It should be understood that other electrodes of the first element 207 can be positioned relative to... Figure 2I The location where the cross section is offset.

[0076] Furthermore, in the insertion plate 20I, such as Figure 2I As shown, the spacer 205 is configured such that its lower surface is substantially flush with the lower surface 2011 of the insulating body 201, and its upper surface is substantially flush with the upper surface 2013 of the insulating body 201.

[0077] In the insert plate 20I, the post 211 can be configured such that its upper surface is substantially flush with the upper surface 2013 of the insulating body 201. The lateral dimension of the portion of the post 211 protruding from the lower surface 2011 of the insulating body 201 can be smaller than the lateral dimension of the portion of the post 211 embedded in the insulating body 201. It should be understood that the content described above in the preceding drawings can be applied similarly or adaptively here, and therefore will not be repeated.

[0078] Figure 2J An insert plate 20J for a packaging structure is shown. The insert plate 20J and... Figure 2AThe main difference in the shown insert plate 20A is that the first conductor portion 215 of the first coupling member is coupled to the spacer 205 by being formed on the conductor portion 219, or it can be integrally formed. Specifically, the second portion 2152 of the first conductor portion 215 is electrically coupled to the spacer 205 along the lower surface 2011 of the insulating body 201. It should be understood that the wiring on the insert plate can be diverse. For example, additional wiring or other coupling members can be provided as needed to connect various elements, components, or conductors of the insert plate. The content described above in the preceding drawings can be applied similarly or adaptively here, and therefore will not be repeated.

[0079] Figures 3A-3F A schematic cross-sectional view illustrating the steps of a method for manufacturing an insert plate according to some embodiments of the present disclosure is shown. The content described above with reference to the accompanying drawings can be applied similarly or adaptively herein, and therefore will not be repeated.

[0080] like Figure 3A As shown, an insulating body 501 is provided. The insulating body 501 may be formed of ceramic or organic insulating material. The insulating body 501 may have a first surface 2011 and a second surface 2013.

[0081] like Figure 3B As shown, one or more holes 507, 509 are formed in the insulating body 501. Optionally, one or more holes 505, 511 may also be formed in the insulating body 501. It should be understood that, although in Figure 3B In the illustrated implementation, holes 507, 509 and holes 505, 511 are shown to be formed in the same step; however, this disclosure is not limited thereto. There are no limitations on the geometry or size of the holes, and the geometry or size of the holes can be configured according to the application. Furthermore, although in Figure 3B In the illustration, the cross-sections of the holes are shown to have substantially the same lateral dimensions; however, this disclosure is not limited thereto; for example, in some embodiments, the lateral dimensions of one portion of the hole may differ from those of another portion. It should also be understood that, although in Figure 3B In the illustrated embodiment, the hole is shown as a through-hole penetrating the insulating substrate 201; however, this disclosure is not limited thereto. For example, in other embodiments, the hole may be a non-through-hole (also called a blind via), i.e., one that does not penetrate the layer in which it is situated (e.g., the insulating body 501 / 201). Therefore, in the context herein, the term “hole” is intended to include both through-holes and blind vias (also referred to as recesses).

[0082] Next, one or more coupling components are formed on or within the insulating body. This will be discussed below. Figure 3C-3E Please provide an explanation.

[0083] In some implementations, such as Figure 3CAs shown, conductive material (e.g., metal, such as copper) fillers 527 and 529 can be formed in holes 507 and 509, respectively. For example, conductive fillers 527 and 529 can be formed by plating, sintering, and / or inlay processes. For example, a copper layer can be plated onto the surface of the insulating body 501 (including the hole) by a plating process (e.g., electroplating or electroless plating) to at least fill holes 507 and 509. Undesirable portions of the plated copper layer can then be removed to form conductive fillers 527 and 529. Alternatively, a thin liner layer (e.g., plating) can be formed on the surface of the hole in the insulating body 501, a suitably shaped metal component can be inserted into the hole, and then a strong bond between the metal component and the liner layer can be formed by a hot-melt or sintering process to form conductive fillers 527 and 529.

[0084] Optionally, in this step, fillers 525 for spacers and fillers 521 for posts can also be formed in holes 505 and 511 in a similar manner. In other implementations, conductive fillers 525 and 521 can be formed in different steps from conductive fillers 527 and 529.

[0085] After that, as Figure 3D As shown, a portion of the conductive fillers 527 and 529 is removed, for example, through processes such as etching or drilling. Figure 3D In the illustrated implementation, a through-hole 537 is formed in the conductive filler 527, thereby forming a conductive material layer on the sidewall of the hole 507, which can serve as, for example... Figure 2A and 2B A portion of the first and second conductor portions 215 and 217 shown, such as first portions 2151 and 2171. A blind via (or recess) 539 is formed in the conductive filler 529, thereby forming, for example... Figure 2C The second coupling member 23 is shown in the figure. In this case, the conductive filler 529 can be, for example, as... Figure 2B and 2C The second coupling component 23 is shown.

[0086] After that, as Figure 3E As shown, a conductive layer is formed on or within the surface of the insulating body 501. For example, conductive layers 2152 and 2172 are formed on the first surface 2011 and the second surface 2013 of the insulating body 501, respectively, through plating and etching processes. For example, in some implementations, the plating process may be... Figure 3D A coating is formed on the structure shown, and then unwanted portions of the coating can be selectively removed to obtain... Figure 3E The structure shown. It should also be understood that, although in Figure 3EThe diagram shows that portions 2152 and 2172 of the plating are retained, but in other embodiments, additional portions of the plating may also be retained if desired, such as portions formed on fillers 521, 525, or other portions formed on insulating body 501 (e.g., as connecting conductors or wiring, for example with...). Figure 2J (Similar to connecting conductor 219).

[0087] Then, one or more electronic components can be installed. For example... Figure 3F As shown, element 207 is disposed in hole 537, and element 209 is disposed in hole 539 (which is in hole 539). Elements 207 and 209 can be elements 207 and 209 as described above in conjunction with the preceding figures. Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0088] Figure 3G and 3H A schematic cross-sectional view is shown of some alternative steps in a method for manufacturing an insert plate according to an alternative embodiment, which replaces the steps described above. Figure 3E and 3F The steps. Note that in the preceding... Figure 3C The spacer 205 is configured to protrude from the lower surface of the insulating body 501, such that its lower surface is flush with the lower surface of the insulating body 501. Figure 3E The lower surface of the second portion 2152 of the first conductor portion 215 formed in the middle is substantially flush with the lower surface. In this alternative implementation, the lower surface of the spacer 205 is formed to be substantially flush with the lower surface of the insulating body 501. And in this alternative implementation, in Figure 3G In the steps shown, a second portion 2152 of the first conductor portion 215 is formed in the lower surface 2011 of the insulating body 201, and the lower surface of the second portion 2152 is substantially flush with the lower surface 2011 of the insulating body 201. Furthermore, as... Figure 3G As shown, a second portion 2172 of the second conductor portion 217 is formed in the upper surface 2013 of the insulating body 201, and the upper surface of the second portion 2172 is substantially flush with the upper surface 2013 of the insulating body 201. One or more electronic components can then be installed. For example... Figure 3H As shown, element 207 is disposed in hole 537, and element 209 is disposed in hole 539 (which is in hole 509). Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0089] Figures 4A-4F A schematic cross-sectional view is shown illustrating the steps of a method for manufacturing an insert plate according to other embodiments of the present disclosure. The above... Figures 3A-3H The described content can be applied in the same or adaptive way. Figures 4A-4F The described embodiments.

[0090] like Figure 4A As shown, an insulating body 501 is provided. The insulating body 501 may be formed of ceramic or organic insulating materials, etc. The insulating body 501 may have a first surface 2011 and a second surface 2013.

[0091] Next, one or more holes can be formed in the insulating body. For example... Figure 4B As shown, one or more holes 507, 509 are formed in the insulating body 501. Optionally, one or more holes 505, 511 may also be formed in the insulating body 501. Figure 4B In the illustrated embodiment, holes 505, 507, and 511 are shown as through-holes penetrating the insulating substrate 201, while hole 509 is shown as a blind hole (also referred to as a recess). Similarly, it should be understood that, although in Figure 4B In the illustrated implementation, holes 507, 509 and holes 505, 511 are shown to be formed in the same step; however, this disclosure is not limited thereto. There are no limitations on the geometry or size of the holes, which can be configured according to the application.

[0092] Next, one or more coupling components are formed on or within the insulating body. This will be discussed below. Figure 4C-4E Please provide an explanation.

[0093] In some implementations, such as Figure 4C As shown, conductive material (e.g., metal, such as copper) fillers 527 and 529 can be formed in holes 507 and 509, respectively. For example, conductive fillers 527 and 529 can be formed by plating, sintering, and / or inlay processes. For example, a copper layer can be plated onto the surface of the insulating body 501 (the surface containing the holes) by a plating process (e.g., electroplating or electroless plating) to at least fill holes 507 and 509. Undesirable portions of the plated copper layer can then be removed to form conductive fillers 527 and 529. Alternatively, a thin liner layer (e.g., a metal (e.g., copper) plating) can be formed on the surface of the holes in the insulating body 501, and appropriately shaped metal parts (e.g., formed of copper) can be inserted into the holes. A strong bond between the metal parts and the liner layer can then be formed by a hot-melt or sintering process to form conductive fillers 527 and 529.

[0094] Optionally, in this step, fillers 525 for spacers and fillers 521 for posts can also be formed in holes 505 and 511 in a similar manner. In other implementations, conductive fillers 525 and 521 can be formed in different steps from conductive fillers 527 and 529. Here, fillers 521, 525, and 527 are formed to have a thickness substantially the same as that of the insulating body 501, and their respective upper and lower surfaces are substantially flush with the upper and lower surfaces of the insulating body 501.

[0095] After that, as Figure 4D As shown, a portion of the conductive fillers 527 and 529 is removed, for example, through processes such as etching or drilling. Figure 4D In the implementation shown, a blind via 537 is formed in the conductive filler 527, thereby forming a conductive material layer on the sidewall of the via 507, which can correspond to Figure 2I Parts 2171 and 2173 are shown. A blind via (or recess) 539 is formed in the conductive filler 529, thereby forming, for example... Figure 2I The second coupling component 23 is shown. In this embodiment, a portion of the conductive filler 521 is also removed to form a blind via 531 therein.

[0096] After that, as Figure 4E As shown, a conductive layer is formed on or within the surface of the insulating body 501. For example, conductive layers 2175 and 2172 are formed on the first surface 2011 and the second surface 2013 of the insulating body 501, respectively, through electroplating and etching processes. Similarly, for example, plating processes may be used... Figure 3D A coating is formed on the structure shown, and then unwanted portions of the coating can be selectively removed to obtain... Figure 3E The structure is shown. It should also be understood that in other embodiments, additional portions of the coating may be retained if desired.

[0097] In this embodiment, a conductive component 541 is also formed filling the blind hole 531 of the conductive filler 521. For example... Figure 4E As shown, the conductive component 541 extends and protrudes from the lower surface 2011 of the insulating body 501. The conductive component 541 can be joined with the conductive filler 521 having a blind hole 531 to form a post 211.

[0098] Then, one or more electronic components can be installed. For example... Figure 4F As shown, element 207 is disposed in hole 537 (which is in hole 507), and element 209 is disposed in hole 539 (which is in hole 509). Elements 207 and 209 can be elements 207 and 209 as described above in conjunction with the preceding figures. Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0099] Figure 4G and 4H A schematic cross-sectional view is shown of some alternative steps in a method for manufacturing an insert plate according to an alternative embodiment, which replaces the steps described above. Figure 4E and 4F The steps. In this alternative implementation, the lower surface of the spacer 205 is formed to be substantially flush with the lower surface of the insulating body 501. And in this alternative implementation, in Figure 4GIn the steps shown, the second conductor portion 2172 of the coupling member 21 is formed in the lower surface 2011 of the insulating body 201, and the lower surface of the second portion 2172 is substantially flush with the lower surface 2011 of the insulating body 201. Furthermore, as... Figure 4G As shown, a fifth conductor portion 2175 is formed in the upper surface 2013 of the insulating body 201, and the upper surface of the fifth portion 2175 is substantially flush with the upper surface 2013 of the insulating body 201.

[0100] Then, one or more electronic components can be installed. For example... Figure 4H As shown, element 207 is disposed in hole 537 (which is in hole 507), and element 209 is disposed in hole 539 (which is in hole 509). Elements 207 and 209 can be electrically coupled to corresponding coupling components, respectively.

[0101] Figure 5A , 5B Figures 5C and 5C respectively show schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure. Depending on the embodiment, the packaging structure may be a power module or a portion thereof, or it may be an intermediate structure used to fabricate a power module.

[0102] like Figure 5A As shown, the package structure 50A may include a mounting substrate and an insertion plate. The insertion plate may be an insertion plate according to any embodiment. Figure 5A As an example, it is shown that... Figure 2A The insertion plate 20A and the first mounting substrate 100 are shown. Note that in... Figure 5A The electrodes of elements 207 and 209 are not shown. The first mounting substrate 100 may include an insulating body 1011 and conductive layers 1013 and 1015 on both sides thereof. In some embodiments, the conductive layer 1013 may have multiple portions, such as a die bonding portion 1013_1 for attaching a die, an element bonding portion 1013_2 for attaching other elements, etc. It should be understood that although the die bonding portion 1013_1 and the element bonding portion 1013_2 are shown as separate components herein, this disclosure is not limited thereto.

[0103] The mounting substrate 100 may mount a power die 103. The power die 103 is electrically coupled to a die bonding portion 1013_1 of the mounting substrate 100, for example, through a conductive bonding material 123. The die 103 is disposed between the insertion plate 20A and the first mounting substrate 100. Component 207 is electrically coupled to the power die 103 through a second conductor portion 215 of the first coupling member, for example, to an electrode (e.g., a gate) of the die 103. Component 209 is electrically coupled to a component bonding portion 1013_2 of the conductive layer 1013, for example, through crimping or through a conductive bonding material (e.g., solder or conductive sintered material) 133.

[0104] One end of the spacer 205 is electrically coupled or attached to the die 103, for example, electrically coupled to an electrode (e.g., source or drain) on one side of the upper surface of the die 103. In some embodiments, the spacer may be attached to the die by, for example, crimping; in other embodiments, the spacer may be electrically coupled to the die by solder paste or a sintered component.

[0105] One end of the post 211 may be engaged or coupled to the first mounting substrate 100. In some embodiments, the post 211 may be attached to the insulating body 1011 of the mounting substrate 100, such as... Figure 5A As shown. In other embodiments, post 211 may be attached to the conductive layer of mounting substrate 100, as will be described below. Figure 5B (As shown).

[0106] Figure 5B A schematic cross-sectional view of a packaging structure according to another embodiment of the present disclosure is shown. Figure 5B As shown, the package structure 50B may include a first mounting substrate 100 and an insertion plate. Figure 5B As an example, it is shown that... Figure 2B The insert plate 20B is shown. The package structure 50B may have a power die 103. The power die 103 is electrically coupled to a die bond 1013_1 of the conductive layer 1013 of the mounting substrate 100, for example, through a conductive bonding material 123. The die 103 is disposed between the insert plate 20A and the first mounting substrate 100. Element (first element) 207 is electrically coupled to the power die 103 through a second conductor portion 215 of the first coupling member, for example, through a conductive bonding material (e.g., solder or conductive sintered part) 107 and to the electrode (e.g., gate) of the die 103. Element 209 is electrically coupled to an element bond 1013_2 of the conductive layer 1013, for example, through a conductive bonding material (e.g., solder or conductive sintered part) 133. One end of spacer 205 is electrically coupled or attached to die 103, for example, via a conductive bonding material (e.g., solder or conductive sintered material) 125 to an electrode (e.g., source or drain) on the upper surface side of die 103. One end of post 211 may be bonded or electrically coupled to the conductive layer 1013 of first mounting substrate 100.

[0107] Figure 5C A schematic cross-sectional view of a packaging structure according to another embodiment of the present disclosure is shown. Figure 5C The package structure 50C shown is... Figure 5B The main difference in the package structure 50B shown is that its insert plate is as follows: Figure 2I The shown insertion plate 20I replaces Figure 5B Insert plate 20B in the middle.

[0108] Figure 6A , 6B Figures 6C and 6C respectively show schematic cross-sectional views of packaging structures according to some embodiments of the present disclosure.

[0109] like Figure 6A As shown, in Figure 5A A second mounting substrate 200 is attached to the structure 50A shown. Similar to the mounting substrate 100, the mounting substrate 200 may include an insulating body 2011 and a side surface of the insulating body 2011 (on...) Figure 6A The conductive layer 2013 is on the lower surface of the mounting substrate 200 (under the orientation of the substrate). The mounting substrate 200 may also include a conductive layer 2013 on the other side of the insulating body 2011 (in the orientation of the substrate). Figure 6A The conductive layer 2015 is located on the upper surface of the substrate. In some embodiments, the conductive layer 2013 may have multiple portions, such as portions for attaching spacers, portions for attaching posts (if needed), etc. In some embodiments, additional dies may also be attached to the second mounting substrate 200, as with the first mounting substrate 100; in this case, the conductive layer 2013 may also have portions for attaching dies. Figure 6A In the example shown, spacer 205 is attached to the conductive layer 2013 of mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). Post 211 is attached to the insulating body 2011 of mounting substrate 200, for example by an adhesive or sintered material (not shown).

[0110] In other implementations, an additional die (not shown) may be mounted to the second mounting substrate 200, which may be electrically coupled to other components in a manner similar to that of die 103.

[0111] like Figure 6B As shown, in Figure 5B A second mounting substrate 200 is attached to the structure 50B shown. The mounting substrate 200 may include an insulating body 2011 and a side of the insulating body 2011 (on Figure 6B The conductive layer 2013 is on the lower surface of the mounting substrate 200 (under the orientation of the substrate). The mounting substrate 200 may also include a conductive layer 2013 on the other side of the insulating body 2011 (in the orientation of the substrate). Figure 6B Under the orientation of [the desired orientation], a conductive layer 2015 is placed on its upper surface. Figure 6B In the example shown, spacer 205 is attached to a portion of the conductive layer 2013 of mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). Post 211 is attached to another portion of the conductive layer 2013 of insulating body 2011 of mounting substrate 200, for example by crimping or by a conductive attachment material (not shown).

[0112] like Figure 6C As shown, in Figure 5CA second mounting substrate 200 is attached to the structure 50C shown. The mounting substrate 200 may include an insulating body 2011 and a side of the insulating body 2011 (on Figure 6C The conductive layer 2013 is on the lower surface of the mounting substrate 200 (under the orientation of the substrate). The mounting substrate 200 may also include a conductive layer 2013 on the other side of the insulating body 2011 (in the orientation of the substrate). Figure 6C Under the orientation of [the desired orientation], a conductive layer 2015 is placed on its upper surface. Figure 6C In the example shown, spacer 205 is attached to a portion of the conductive layer 2013 of mounting substrate 200, for example by crimping or by a conductive attachment material (not shown). Post 211 is attached to another portion of the conductive layer 2013 of insulating body 2011 of mounting substrate 200, for example by crimping or by a conductive attachment material (not shown).

[0113] Those skilled in the art will understand that Figures 5A-5C as well as Figures 6A-6C The package structure shown can be attached and electrically coupled to a lead frame (not shown), and can be encapsulated with an encapsulating agent.

[0114] Figure 7 A schematic flowchart illustrating a method for manufacturing a package structure according to some embodiments of the present disclosure is shown. The method 700 for manufacturing a package structure according to embodiments of the present disclosure may include: providing or preparing an insert plate. As an example embodiment, such as... Figure 7 As shown, providing or preparing an insert plate may include the following steps. In step S701, an insulating body is provided, such as... Figure 3A and 4A The insulating body 501 is shown. In step S703, one or more holes are formed in the insulating body, for example, as shown. Figure 3B and 4B As shown. In step S705, one or more coupling components are formed on or within the insulating body, for example as... Figure 3C-3E and Figure 4C-4E As shown. In step S707, one or more electronic components are set. The one or more electronic components may include a first electronic component (e.g., component 207 or 209), such as... Figure 3F , 3H and Figure 4F , 4HAs shown. In step S707, and optionally, a second electronic component (e.g., component 209) may also be included. In some implementations, setting one or more electronic components may include: setting a first component (e.g., component 207) in a first hole in step S7071; and optionally, setting a second component (e.g., component 209) in a second hole in step S7073. The first electronic component is set in a first hole of one or more holes such that it is electrically coupled to a corresponding first coupling member of one or more coupling members. The first electronic component is adapted to be electrically coupled to other components of the package structure outside the insert plate, such as to a die or mounting substrate, via the first coupling member. The second electronic component (e.g., 209) may be configured to be electrically coupled to a corresponding second coupling member of one or more coupling members.

[0115] In step S709, optionally, a conductive spacer may be provided in the third hole, for example as... Figure 3C , 4C -4E, etc. In step S711, optionally, a column or support member can be provided in the fourth hole, for example, as shown in Figure 4E. Figure 3C , 4C As shown in -4E, etc.

[0116] Figure 8 A schematic flowchart illustrating a method for manufacturing a package structure according to other embodiments of the present disclosure is shown. The method 800 for manufacturing a package structure according to an embodiment of the present disclosure may include: in step S801, providing a first mounting substrate, such as the aforementioned mounting substrate 100. The first mounting substrate may include a die bonding portion and a power die electrically coupled to the die bonding portion. The first mounting substrate may also include a component bonding portion. In step S803, attaching an insert plate to the first mounting substrate.

[0117] In some implementations, bonding the insert plate to the first mounting substrate may include: in step S8031, electrically coupling the first coupling member to the electrodes of the die, thereby electrically coupling the first electronic component to the electrodes of the die through the first coupling member. Optionally, in step S8033, the second electronic component may be electrically coupled to the component junction of the first mounting substrate.

[0118] In some implementations, bonding the insert plate to the first mounting substrate may include: Optionally, in step S8035, electrically coupling one end of the spacer to an electrode of the die, for example, to an electrode of the die located on the side opposite to the first mounting substrate. Optionally, in step S8035, bonding one end of the post to the first mounting substrate, for example, to a conductive layer or insulating body of the mounting substrate.

[0119] Method 800 may also include, optionally, in step S805, attaching a second mounting substrate (e.g., mounting substrate 200) to the side of the insert plate opposite to the first mounting substrate.

[0120] In some embodiments, the first element may include a gate resistor or a temperature sensing element, and the second element may include a temperature sensing element.

[0121] Figure 9 A schematic diagram of an electrical system according to some embodiments of the present disclosure is shown. The insert board and package structure of the embodiments of the present disclosure can be applied to a variety of electrical systems. The package structure according to the present disclosure can be used in various applications of power devices, such as, but not limited to, inverters, converters, power supplies, power controllers, etc., and can also be applied to equipment or systems such as new energy vehicles, wind power systems, solar power generation systems, and energy storage systems. For example, as... Figure 9 As shown, an electric vehicle as an electrical system may include an inverter or power controller 901, which may include a packaging structure according to the present disclosure or a power module 903 having a packaging structure according to the present disclosure (e.g., encapsulated with an encapsulating agent). The packaging structure / power module 903 may be any embodiment of the present disclosure and any variation thereof.

[0122] Those skilled in the art will readily understand that this disclosure can employ a wide variety of power devices, such as, but not limited to, power MOSFETs, thyristors, and power diodes. Those skilled in the art should recognize that the boundaries between operations (or steps) described in the above embodiments are merely illustrative. Multiple operations may be combined into a single operation, a single operation may be distributed among additional operations, and operations may be performed with at least partial temporal overlap. Moreover, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be varied in various other embodiments. However, other modifications, variations, and substitutions are equally possible. Therefore, this specification and the accompanying drawings should be considered illustrative rather than restrictive.

[0123] While specific embodiments of this disclosure have been described in detail by way of example, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. The various embodiments or features disclosed herein can be combined in any way without departing from the spirit and scope of this disclosure. Those skilled in the art should also understand that various modifications can be made to the embodiments without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. An insert plate for a packaging structure, comprising: An insulating body having one or more holes; One or more coupling components are disposed on or within the insulating body; as well as One or more electronic components, including a first electronic component disposed in a first hole among the one or more holes, electrically coupled to a corresponding first coupling member among the one or more coupling members, the first electronic component being adapted to be electrically coupled to other components of a package structure outside the insert plate via the first coupling member.

2. The insertion plate as claimed in claim 1, wherein: The packaging structure includes a power die adapted to be mounted onto a first mounting substrate and disposed between the insertion plate and the first mounting substrate. The first coupling component is adapted to be electrically coupled to the electrodes of the die.

3. The insertion plate of claim 2, wherein the one or more electronic components further comprises a second electronic component disposed in a second hole of the one or more holes, electrically coupled to a corresponding second coupling member of the one or more coupling members, and adapted to be electrically coupled to a component junction of the first mounting substrate via the corresponding second coupling member. in, The die is mounted to the die joint of the first mounting substrate.

4. The insertion plate of claim 2, further comprising at least one of the following: A conductive spacer is disposed in a third of the one or more holes, the spacer being adapted to be electrically coupled to an electrode of the die located on its side opposite to the first mounting substrate; or A post is disposed in a fourth hole among the one or more holes, one end of the post being adapted to engage with the first mounting substrate.

5. The insertion plate as claimed in claim 1, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. in, The first conductor portion includes a first portion at the sidewall of the first hole, which is electrically connected to an electrode of the first element.

6. The insertion plate as claimed in claim 1, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. in, The first conductor portion covers at least a portion of the first hole from one side of the first surface of the insulating body, and the first conductor portion is electrically connected to one electrode of the first element.

7. The insertion plate as claimed in claim 1, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, the first conductor portion comprising a first portion filling the first hole, a second portion extending from the first portion along the sidewall of the first hole to a first surface of the insulating body, and a third portion extending from the second portion along the first surface of the insulating body. in, The first part or the second part is electrically connected to the electrodes of the first element.

8. The insertion plate as claimed in claim 1, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, which comprises a first part and a second part disposed in the first hole and separated from the first part. The first part covers at least a portion of the first hole from one side of a first surface of the insulating body. in, The first part is electrically connected to the electrodes of the first element.

9. The insertion plate as claimed in claim 3, wherein The second hole extends from the first surface of the insulating body, through the insulating body, to the second surface of the insulating body opposite to the first surface. The second coupling member fills the second hole and extends from the first surface of the insulating body to the second surface of the insulating body. The second coupling member has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

10. The insertion plate as claimed in claim 3, wherein The second hole extends inward from the first surface of the insulating body but does not extend to the second surface of the insulating body opposite to the first surface. The second coupling member covers the surface of the second hole and has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

11. The insertion plate as claimed in claim 3, wherein: The first element includes a gate resistor adapted to be electrically coupled to the gate electrode of the die in the package structure via the first coupling member; or The second element includes a temperature sensing element adapted to be electrically coupled to the mounting substrate of the package structure.

12. A packaging structure, comprising: Insertion plate as described in any one of claims 1-11; The first mounting substrate includes an insulating body and a conductive layer on one side of the insulating body; as well as A power die, electrically coupled to a die junction portion of the conductive layer, the die being disposed between the insertion plate and the first mounting substrate. The first electronic component is electrically coupled to one of the following via the first coupling member: The conductive layer of the first mounting substrate; or The electrodes of the power die.

13. The packaging structure of claim 12, further comprising: The second mounting substrate is disposed opposite to the first mounting substrate, separated by the insertion plate.

14. A method for manufacturing a packaging structure, comprising: An insertion board is provided, including: Provide insulation body; One or more holes are formed in the insulating body; One or more coupling components are formed on or within the insulating body; and Set one or more electronic components The one or more electronic components include a first electronic component disposed in a first hole of the one or more holes, electrically coupled to a corresponding first coupling component of the one or more coupling components, and adapted to be electrically coupled to other components of the packaging structure outside the insert plate through the first coupling component.

15. The method of claim 14, further comprising: A first mounting substrate is provided, the first mounting substrate including a die joint and a power die electrically coupled to the die joint; as well as The insertion plate is attached to the first mounting substrate. The process of attaching the insertion plate to the first mounting substrate includes: The first coupling component is electrically coupled to the electrode of the die, thereby enabling the first electronic component to be electrically coupled to the electrode of the die through the first coupling component.

16. The packaging structure of claim 15, wherein the one or more electronic components further comprises a second electronic component disposed in a second hole of the one or more holes, and electrically coupled to a corresponding second coupling component of the one or more coupling components. Joining the insert plate to the first mounting substrate further includes: The second electronic component is electrically coupled to the component junction of the first mounting substrate.

17. The packaging structure of claim 15, wherein... The insert plate also includes: A conductive spacer is provided in the third hole of the one or more holes; as well as A post is provided in the fourth hole of the one or more holes. Joining the insert plate to the first mounting substrate further includes: One end of the spacer is electrically coupled to an electrode on the side of the die opposite to the first mounting substrate. as well as One end of the post is joined to the first mounting substrate.

18. The method of claim 15, further comprising: The second mounting plate is attached to the side of the insertion plate opposite to the first mounting plate.

19. The method of claim 15, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. in, The first conductor portion includes a first portion at the sidewall of the first hole, which is electrically connected to an electrode of the first element.

20. The method of claim 15, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion disposed on or in the first surface of the insulating body. in, The first conductor portion covers at least a portion of the first hole from one side of the first surface of the insulating body.

21. The method of claim 15, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, the first conductor portion comprising a first portion filling the first hole, a second portion extending from the first portion along the sidewall of the first hole to a first surface of the insulating body, and a third portion extending from the second portion along the first surface of the insulating body. in, The first part or the second part is electrically connected to the electrodes of the first element.

22. The method of claim 15, wherein The first hole extends from a first surface of the insulating body, through the insulating body, to a second surface of the insulating body opposite to the first surface. The first coupling component includes a first conductor portion, which comprises a first part and a second part disposed in the first hole and separated from the first part. The first part covers at least a portion of the first hole from one side of a first surface of the insulating body. in, The first part is electrically connected to the electrodes of the first element.

23. The method of claim 16, wherein The second hole extends from the first surface of the insulating body, through the insulating body, to the second surface of the insulating body opposite to the first surface. The second coupling member fills the second hole and extends from the first surface of the insulating body to the second surface of the insulating body. The second coupling member has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

24. The method of claim 16, wherein The second hole extends inward from the first surface of the insulating body but does not extend to the second surface of the insulating body opposite to the first surface. The second coupling member covers the surface of the second hole and has a recess extending inward from the first surface of the insulating body. The second element is at least partially disposed in the recess and is electrically connected to the second coupling member.

25. The method of claim 16, wherein The first element includes a gate resistor adapted to be electrically coupled to the gate electrode of the die via the first coupling member, or The second element includes a temperature sensing element.

26. An electrical system comprising the encapsulation structure as described in any one of claims 12-13.

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