Heat dissipation assembly and manufacturing method thereof

Abstract

This application discloses a heat dissipation element and its manufacturing method. The manufacturing method includes the following steps: a plurality of inductor coils are disposed on the surface of an inner circuit board; an outer copper-clad substrate is disposed on the surface of the inner circuit board with the inductor coils to obtain an intermediate body; a first through hole is formed in the intermediate body, the first through hole penetrating the intermediate body along a first direction, the first direction being the thickness direction of the inner circuit board; a first conductive plating layer is formed on the surface of the intermediate body with the first through hole, the first conductive plating layer also covering the inner wall of the first through hole to form a mounting hole; at least the first conductive plating layer on the surface of the intermediate body is wired to obtain an outer circuit board, and a magnetic element is disposed at the end of the mounting hole, the plurality of inductor coils being disposed around the magnetic element; and a heat dissipation element is disposed on the outer circuit board, the heat dissipation element having a rotating shaft, the rotating shaft being rotatably disposed in the mounting hole and connected to the magnetic element, thereby obtaining a heat dissipation assembly.

Description

Technical Field

[0001] This application relates to the field of circuit boards, and more particularly to a heat dissipation component and its manufacturing method. Background Technology

[0002] Circuit boards typically house electronic components that generate significant heat during operation, impacting system performance. While heat dissipation is primarily achieved by mounting heat sinks above the components, these sinks increase the overall thickness of the encapsulated circuit board. Furthermore, traditional heat sinks require an external power supply. Therefore, achieving effective heat dissipation without increasing the overall circuit board thickness or requiring a separate external power supply remains a pressing issue for researchers in this field. Summary of the Invention

[0003] In view of this, this application provides a heat dissipation component and a method for manufacturing the same, in order to solve the above-mentioned technical problems.

[0004] The first aspect of this application provides a method for manufacturing a heat dissipation component, comprising the following steps: disposing of a plurality of inductor coils on the surface of an inner circuit board; disposing of an outer copper-clad substrate on the surface of the inner circuit board with the inductor coils to obtain an intermediate body; forming a first through-hole in the intermediate body, the first through-hole penetrating the intermediate body along a first direction, the first direction being the thickness direction of the inner circuit board; forming a first conductive plating layer on the surface of the intermediate body with the first through-hole, the first conductive plating layer also covering the inner wall of the first through-hole to form a mounting hole; fabricating circuitry on at least the first conductive plating layer on the surface of the intermediate body to obtain an outer circuit board, and disposing of a magnetic element at the end of the mounting hole, the plurality of inductor coils surrounding the magnetic element; and disposing of a heat dissipation element on the outer circuit board, the heat dissipation element having a rotating shaft rotatably disposed within the mounting hole and connected to the magnetic element, thereby obtaining a heat dissipation component.

[0005] Based on the first aspect, in some possible implementations, the inner circuit board includes a first circuit layer, and the provision of multiple inductors includes: providing a solder layer on the surface of the first circuit layer, the first circuit layer including multiple first pads, the solder layer being disposed on the first pads; and mounting inductors on the solder layer so that the inductors are electrically connected to the first circuit layer.

[0006] Based on the first aspect, in some possible embodiments, after forming the first conductive plating layer, the manufacturing method further includes: enlarging the opening of the mounting hole located on the surface of the intermediate body to form a shaft hole, the diameter of the shaft hole being larger than the diameter of the mounting hole; installing a bearing in the shaft hole, with the rotating shaft passing through the bearing.

[0007] Based on the first aspect, in some possible implementations, when opening the first through hole, the manufacturing method further includes: opening a second through hole in the intermediate body, the second through hole penetrating the intermediate body along a first direction, and the first conductive plating layer also covering the inner wall of the second through hole to form a heat dissipation hole, the heat dissipation hole forming a first opening and a second opening on two opposite surfaces of the intermediate body respectively, the diameter of the first opening being larger than the diameter of the second opening.

[0008] Based on the first aspect, in some possible embodiments, after fabricating the circuit to form an outer circuit substrate, the fabrication method further includes: mounting a first heating element and a second heating element on the outer circuit substrate, wherein the heat output of the first heating element is greater than that of the second heating element, wherein the first heating element and the first opening are located on the same side of the intermediate body, and the second heating element and the second opening are located on the other side of the intermediate body.

[0009] Based on the first aspect, in some possible implementations, after setting the heat dissipation element, the manufacturing method further includes: installing a first protective cover and a second protective cover on the outer circuit board, the first protective cover and the second protective cover respectively covering the first heating element and the second heating element, the first protective cover having an airflow outlet, the second protective cover having an airflow inlet, and the airflow inlet, heat dissipation hole and airflow outlet being interconnected to form a heat dissipation channel.

[0010] A second aspect of this application provides a heat dissipation assembly, comprising: a multilayer circuit board and a heat dissipation element rotatably disposed on the surface of the multilayer circuit board. The multilayer circuit board contains a plurality of inductor coils and mounting holes that penetrate the multilayer circuit board along a first direction, the first direction being the thickness direction of the multilayer circuit board. The inner wall of the mounting hole is provided with a first conductive plating layer, and a magnetic element is provided at the end of the mounting hole. The plurality of inductor coils are arranged around the magnetic element. The heat dissipation element has a rotating shaft that is rotatably disposed within the mounting hole and connected to the magnetic element.

[0011] Based on the second aspect, in some possible implementations, the multilayer circuit board includes a first circuit layer, the first circuit layer includes a plurality of first solder pads, a solder layer is provided on the first solder pads, an inductor coil is provided on the solder layer, and the inductor coil is electrically connected to the first circuit layer.

[0012] Based on the second aspect, in some possible implementations, the mounting hole is provided with a shaft hole at the opening on the surface of the multilayer circuit board. The diameter of the shaft hole is larger than the diameter of the mounting hole, and a bearing is installed in the shaft hole, with the rotating shaft passing through the bearing.

[0013] Based on the second aspect, in some possible implementations, a heat dissipation hole is also provided in the multilayer circuit board. The heat dissipation hole penetrates the multilayer circuit board along the first direction. The inner wall of the heat dissipation hole is provided with a first conductive plating layer. The heat dissipation hole forms a first opening and a second opening on two opposite surfaces of the multilayer circuit board, respectively. The diameter of the first opening is larger than the diameter of the second opening.

[0014] Based on the second aspect, in some possible implementations, a first heating element and a second heating element are respectively provided on two opposite surfaces of the multilayer circuit board, wherein the heat output of the first heating element is greater than the heat output of the second heating element, wherein the first heating element and the first opening are located on the same surface of the multilayer circuit board, and the second heating element and the second opening are located on the other surface of the multilayer circuit board.

[0015] Based on the second aspect, in some possible implementations, a first protective cover and a second protective cover are also provided on the multilayer circuit board. The first protective cover and the second protective cover are respectively covered on the first heating element and the second heating element. The first protective cover is provided with an airflow outlet, and the second protective cover is provided with an airflow inlet. The airflow inlet, heat dissipation hole and airflow outlet are interconnected to form a heat dissipation channel.

[0016] This application obtains an intermediate body by setting an outer copper-clad substrate on the surface of the inner circuit board with an inductor coil, so that the inductor coil is located in the intermediate body, which helps to reduce the overall size of the heat dissipation component. A mounting hole is opened in the intermediate body for mounting a heat dissipation element. The heat dissipation element has a rotating shaft, which is rotatably disposed in the mounting hole and connected to a magnetic component. The inductor coil, together with the magnetic component, is used to provide power to the heat dissipation element, so that the heat dissipation element can achieve a better heat dissipation effect without an external power supply. Attached Figure Description

[0017] Figure 1 This is a cross-sectional schematic diagram of the inner circuit board according to an embodiment of this application.

[0018] Figure 2 In order to be in Figure 1 The diagram shows a cross-section of the inner circuit board after a solder layer has been applied.

[0019] Figure 3 In order to be in Figure 2 The diagram shows a cross-section of the inner circuit board after an inductor coil has been installed.

[0020] Figure 4 In order to be in Figure 3 The diagram shows a cross-sectional view of the inner circuit board after the first copper-clad substrate is installed.

[0021] Figure 5 In order to be in Figure 4 The diagram shows a cross-section of the inner circuit board after a second copper-clad substrate has been installed.

[0022] Figure 6 In order to be in Figure 5 The diagram shows a cross-section of the inner circuit board after the first and second through holes are provided.

[0023] Figure 7 In order to be in Figure 6 The diagram shows a cross-section of the inner circuit board after the first conductive plating layer has been applied.

[0024] Figure 8 In order to be in Figure 7 The diagram shows a cross-section of the inner circuit board after the shaft hole is installed.

[0025] Figure 9 In order to be in Figure 8 The diagram shows a cross-sectional view of the inner circuit board after circuit fabrication.

[0026] Figure 10 In order to be in Figure 9 The diagram shows a cross-sectional view of the inner circuit board after the first heating element and the second heating element are installed.

[0027] Figure 11 In order to be in Figure 10 The diagram shows a cross-sectional view of the inner circuit board after the magnetic components are installed.

[0028] Figure 12 In order to be in Figure 11 The diagram shows a cross-sectional view of the inner circuit board after heat dissipation elements have been installed.

[0029] Figure 13 This is a cross-sectional schematic diagram of a heat dissipation assembly according to one embodiment.

[0030] Figure 14A for Figure 13 Enlarged view of section VIII.

[0031] Figure 14B for Figure 13 Top view at point VIII.

[0032] Explanation of key component symbols:

[0033] Inner circuit board 100; First direction X; First circuit layer 101; Outer circuit layer 102; First inner circuit layer 110; Second inner circuit layer 111; First dielectric layer 11; Second dielectric layer 10; First solder pad 12; First conductive via 20; Second conductive via 21; Solder layer 13; Inductor coil 14; First intermediate 210; First copper-clad substrate 30; Third dielectric layer 31; First metal layer 32; Second intermediate 220; Second copper-clad substrate 40; Fourth dielectric layer 41; Second metal layer 42; First through hole 51; Mounting hole 511; Opening 5111; Shaft Hole 5112; second through hole 52; heat dissipation hole 521; first opening 5211; second opening 5212; first conductive plating layer 60; outer circuit board 200; first heating element 71; second heating element 72; first solder layer 131; electronic component 80; second solder layer 132; magnetic component 90; bearing 91; rotating shaft 92; heat dissipation element 93; insulating layer 300; heat dissipation assembly 400; first protective cover 401; airflow outlet 4011; second protective cover 402; airflow inlet 4021; the following specific embodiments will further illustrate this application in conjunction with the above drawings. Detailed Implementation

[0034] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0036] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0037] One embodiment of this application provides a method for manufacturing a heat dissipation component 400, comprising the following steps:

[0038] Step S1, please refer to Figure 1 An inner circuit board 100 is provided, comprising a first circuit layer 101, a second dielectric layer 10, at least one first inner circuit layer 110, and a first dielectric layer 11 stacked sequentially along a first direction X, wherein the first direction X is the thickness direction of the inner circuit board 100. A plurality of first solder pads 12 are provided on the side of the first circuit layer 101 opposite to the second dielectric layer 10. The first circuit layer 101 and the first inner circuit layer 110 are electrically connected to each other through at least one set of first conductive vias 20.

[0039] In this embodiment, there are two first inner layer circuit layers 110, which are respectively disposed on two opposite surfaces of the first dielectric layer 11. The two first inner layer circuit layers 110 are electrically connected to each other through a second conductive via 21. In some embodiments, the number of first inner layer circuit layers 110 is not limited to two.

[0040] In some embodiments, the first dielectric layer 11 and the second dielectric layer 10 are made of insulating resin. For example, the material of the first dielectric layer 11 can be selected from epoxy resin, BT resin, polyphenylene ether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). The materials of the first dielectric layer 11 and the second dielectric layer 10 can be the same or different.

[0041] For step S2, please refer to [link / reference]. Figure 2 A solder layer 13 is provided on the side of the first pad 12 that is away from the first circuit layer 101.

[0042] In this embodiment, the number of solder layers 13 corresponds one-to-one with the number of first solder pads 12, and the material used for the solder layers 13 is solder paste. In other embodiments, the solder layers 13 may be made of other metal materials that facilitate subsequent soldering, such as copper paste.

[0043] Step S3, please refer to Figure 3 An inductor coil 14 is installed on the solder layer 13, and the inductor coil 14 is electrically connected to the first circuit layer 101.

[0044] In this embodiment, the inductor coil 14 is mounted on the solder layer 13 by welding.

[0045] For step S4, please refer to [link / reference]. Figure 4 An outer first copper-clad substrate 30 is formed on the surface of the inner circuit board 100 with inductor coil 14 by adding layers, thus obtaining a first intermediate body 210.

[0046] In some embodiments, the first copper-clad substrate 30 includes a first metal layer 32 and a third dielectric layer 31 stacked sequentially along a first direction, with the third dielectric layer 31 disposed on the side of the first circuit layer 101 facing away from the second dielectric layer 10. In this case, the inductor coil 14 is embedded in the third dielectric layer 31, which helps to reduce the overall size of the heat dissipation assembly 400.

[0047] In this embodiment, the material of the third dielectric layer 31 is the same as that of the first dielectric layer 11, and the material of the first metal layer 32 is copper. In other embodiments, the third dielectric layer 31 may also be made of other insulating materials, and the first metal layer 32 may also be made of other metal materials, as long as it meets the actual requirements of this application.

[0048] For step S5, please refer to [link / reference]. Figure 4 and Figure 5 After fabricating the circuit of the first metal layer 32 to form the second inner circuit layer 111, the second copper-clad substrate 40 is further deposited on the surface of the second inner circuit layer 111 by adding layers to obtain the second intermediate 220.

[0049] In some embodiments, the second copper-clad substrate 40 includes a second metal layer 42 and a fourth dielectric layer 41 stacked sequentially along a first direction, and a third dielectric layer 31 is disposed on the side of the second inner layer circuit layer 111 opposite to the third dielectric layer 31.

[0050] In this embodiment, the fourth dielectric layer 41 is made of the same material as the first dielectric layer 11, and the second metal layer 42 is made of copper. In some embodiments, the fourth dielectric layer 41 may also be made of other insulating materials, and the second metal layer 42 may also be made of other metal materials, as long as the actual requirements of this application are met.

[0051] Step S6, please refer to Figure 6 A first through hole 51 is formed in the second intermediate body 220, and the first through hole 51 penetrates the second intermediate body 220 along the first direction X.

[0052] In some embodiments, a second through hole 52 may be provided within the second intermediate body 220, and the second through hole 52 penetrates the second intermediate body 220 along the first direction 52. In this embodiment, there are two second through holes 52, and the two second through holes 52 are respectively provided on both sides of the first through hole 51. In other embodiments, the number and position of the second through holes 52 can be changed according to actual needs.

[0053] In this embodiment, both the first through hole 51 and the second through hole 52 are made by mechanical drilling.

[0054] For step S7, please refer to [link / reference]. Figure 6 and Figure 7 A first conductive plating layer 60 is formed on the surface of the second intermediate body 220, which has a first through hole 51. The first conductive plating layer 60 also covers the inner wall of the first through hole 51 to form a mounting hole 511. The mounting hole 511 in this application is used to mount the heat dissipation element 93.

[0055] In this embodiment, the first conductive plating layer 60 covers the side of the second metal layer 42 that faces away from the fourth dielectric layer 41, and the material selected for the first conductive plating layer 60 is metallic copper. In some embodiments, the first conductive plating layer 60 may also be made of other metal materials.

[0056] In some embodiments, the first conductive plating layer 60 further covers the inner wall of the second through hole 52 to form a heat dissipation hole 521. The heat dissipation hole 521 forms a first opening 5211 and a second opening 5212 on two opposite surfaces of the second intermediate body 220, respectively. The diameter of the first opening 5211 is larger than the diameter of the second opening 5212. The heat dissipation hole 521 provided in the second intermediate body 220 facilitates airflow on both sides of the second intermediate body 220, further improving the heat dissipation effect.

[0057] Step S8, please refer to Figure 7 and Figure 8 The mounting hole 511 is enlarged in the third opening 5111 on the surface of the second intermediate body 220 to form a shaft hole 5112. The diameter of the shaft hole 5112 is larger than the diameter of the mounting hole 511. The shaft hole 5112 of this application is used to mount the heat dissipation element 93, and the diameter of the shaft hole 5112 can be adjusted according to the actual installation requirements.

[0058] For step S9, please refer to [link / reference]. Figure 8 and Figure 9 The second metal layer 42 and the first conductive plating layer 60 located on the surface of the second intermediate body 220 are used to fabricate circuits to obtain an outer circuit substrate 200. The outer circuit substrate 200 includes an outer circuit layer 102, a fourth dielectric layer 41, a second inner circuit layer 111 and a third dielectric layer 31 stacked sequentially along the first direction X.

[0059] Step S10, please refer to Figure 9 and Figure 10 A first heating element 71 and a second heating element 72 are respectively mounted on the outer circuit board 200. The heat output of the first heating element 71 is greater than that of the second heating element 72. The first heating element 71 and the first opening 5211 are located on the same side of the second intermediate body 220, while the second heating element 72 and the second opening 5212 are located on the other side of the second intermediate body 220. In this application, since the heat output of the first heating element 71 is greater than that of the second heating element 72, the gas flow velocity around the first heating element 71 will be greater than that around the second heating element 72. According to Bernoulli's principle, at this time, the aperture of the first opening 5211 located on the same side of the first heating element 71 is larger than the aperture of the second opening 5212.

[0060] In this embodiment, the first heating element 71 and the second heating element 72 are disposed on the side of the outer circuit layer 102 away from the fourth dielectric layer 41 via a first solder layer 131. The first solder layer 131 can be made of tin or other metallic materials. The first heating element 71 and the second heating element 72 can be active or passive elements. This application does not limit the number or type of the first heating element 71 and the second heating element 72; adjustments can be made according to actual needs.

[0061] In some embodiments, the outer circuit layer 102, on the side facing away from the fourth dielectric layer 41, is further provided with multiple electronic components 80. The electronic components 80 are connected to the outer circuit layer 102 via a second solder layer 132, wherein the second solder layer 132 can be made of tin or other metallic materials. The electronic components 80 can be active or passive components. This application does not limit the number or type of electronic components 80; adjustments can be made according to actual needs.

[0062] Step S11, please refer to Figure 11 A magnetic element 90 is provided at the end of the mounting hole 511, and multiple inductor coils 14 are arranged around the magnetic element 90. The inductor coils 14, together with the magnetic element 90, are used to provide power to the heat dissipation element 93, so that the heat dissipation element 93 can achieve a good heat dissipation effect without an external power supply.

[0063] In some embodiments, the magnetic element 90 may be a permanent magnet.

[0064] Step S12, please refer to Figure 12 A heat dissipation element 93 is provided on the outer circuit layer 102 of the outer circuit board 200. The heat dissipation element 93 has a rotating shaft 92, which is rotatably disposed in a mounting hole 511 and connected to a magnetic component 90. A bearing 91 is installed in a shaft hole 5112, and the rotating shaft 92 passes through the bearing 91. In this embodiment, the heat dissipation element 93 is specifically a fan. In other embodiments, the heat dissipation element 93 can also be other structures with heat dissipation functions.

[0065] During operation, the first circuit layer 101 supplies power to the inductor coil 14, causing the inductor coil 14 to generate a magnetic field. This magnetic field interacts with the magnetic component 90, causing the magnetic component 90 to drive the heat dissipation element 93 to rotate, thereby dissipating heat. In this embodiment, a Hall sensor can be further provided to sense the aforementioned magnetic field and its changes. This application utilizes electromagnetic induction technology to connect the inductor coil 14 with the magnetic component 90, and the inductor coil 14 is electrically connected to the first circuit layer 101, providing power to the heat dissipation element 93 without the need for an external power supply.

[0066] Step S13, please refer to Figure 12 and Figure 13A first protective cover 401 and a second protective cover 402 are installed on the outer circuit layer 102 of the outer circuit board 200. The first protective cover 401 and the second protective cover 402 respectively cover the first heating element 71 and the second heating element 72.

[0067] The first protective cover 401 has an airflow outlet 4011, and the second protective cover 402 has an airflow inlet 4021. The airflow inlet 4021, the heat dissipation hole 521, and the airflow outlet 4011 are interconnected to form a heat dissipation channel, thereby creating the heat dissipation assembly 400. The installation of the first protective cover 401 and the second protective cover 402 serves two purposes: firstly, to protect the outer circuit board 200 and extend its service life; and secondly, to prevent accidental injury when a person touches the heat dissipation element 93, thus providing heat insulation and protection. In this embodiment, the airflow outlet 4011 is larger than the airflow inlet 4021, which facilitates better heat dissipation.

[0068] Please see Figure 12 , Figure 13 , Figure 14A and Figure 14B The heat dissipation assembly 400 of one embodiment of this application includes a multilayer circuit board 410 and a heat dissipation element 93 rotatably disposed on the surface of the multilayer circuit board 410.

[0069] The multilayer circuit board 410 has multiple inductor coils 14 inside and mounting holes 511 inside. The mounting holes 511 penetrate the multilayer circuit board 410 along a first direction X, where the first direction X is the thickness direction of the multilayer circuit board 410. The inner wall of the mounting hole 511 is provided with a first conductive plating layer 60. The end of the mounting hole 511 is provided with a magnetic element 90, and multiple inductor coils 14 are arranged around the magnetic element 90.

[0070] The heat dissipation element 93 has a rotating shaft 92, which is rotatably disposed within the mounting hole 511 and connected to the magnetic component 90. In this embodiment, the heat dissipation element 93 is specifically a fan. In some embodiments, the heat dissipation element 93 may also be other structures with heat dissipation functions. In this embodiment, there are two heat dissipation elements 93, which are respectively disposed on two opposite surfaces of the multilayer circuit board 410. Compared with the traditional single-sided heat dissipation mode, this application can achieve double-sided heat dissipation, which greatly increases the heat dissipation effect.

[0071] In some embodiments, the multilayer circuit board 410 includes an outer circuit layer 102, a second inner circuit layer 111, a first circuit layer 101, a first inner circuit layer 110, and an insulating layer 300, which are sequentially stacked along a first direction X. The outer circuit layer 102 is disposed on opposite sides outside the insulating layer 300, and the second inner circuit layer 111, the first circuit layer 101, and the first inner circuit layer 110 are disposed within the insulating layer 300. The number of each of the second inner circuit layer 111, the first circuit layer 101, and the first inner circuit layer 110 is two. In other embodiments, the number of the second inner circuit layer 111, the first circuit layer 101, and the first inner circuit layer 110 can be adjusted according to actual conditions. The outer circuit layer 102, the second inner circuit layer 111, the first circuit layer 101, and the first inner circuit layer 110 are electrically connected to each other through at least one set of first conductive vias 20, and the two first inner circuit layers 110 are electrically connected to each other through second conductive vias 21.

[0072] In some embodiments, the insulating layer 300 is made of insulating resin. For example, the insulating layer 300 may be made of one of the following resins: epoxy resin, BT resin, polyphenylene ether (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

[0073] In some embodiments, the first circuit layer 101 includes a plurality of first solder pads 12, on which a solder layer 13 is provided, and an inductor coil 14 is disposed on the solder layer 13 and electrically connected to the first circuit layer 101. In this embodiment, the inductor coil 14 is mounted on the solder layer 13 by soldering, in which case the inductor coil 14 is embedded in the insulating layer 300.

[0074] In some embodiments, the mounting hole 511 is provided with a shaft hole 5112 at the opening on the surface of the multilayer circuit board 410. The diameter of the shaft hole 5112 is larger than the diameter of the mounting hole 511. A bearing 91 is installed in the shaft hole 5112, and a rotating shaft 92 passes through the bearing 91.

[0075] In some embodiments, a heat dissipation hole 521 is further formed within the multilayer circuit board 410. The heat dissipation hole 521 penetrates the multilayer circuit board 410 along a first direction X. A first conductive plating layer 60 is provided on the inner wall of the heat dissipation hole 521. A first opening 5211 and a second opening 5212 are formed on two opposite surfaces of the multilayer circuit board 410, respectively. The diameter of the first opening 5211 is larger than the diameter of the second opening 5212. The heat dissipation hole 521 provided in this application facilitates air circulation on both sides of the multilayer circuit board 410, further improving the heat dissipation effect.

[0076] In some embodiments, a first heating element 71 and a second heating element 72 are respectively provided on two opposite surfaces of the multilayer circuit board 410. The first solder layer 131 can be made of tin or other metallic materials. The first heating element 71 and the second heating element 72 can be active or passive elements. The heat generated by the first heating element 71 is greater than that generated by the second heating element 72. The first heating element 71 and the first opening 5211 are located on the same surface of the multilayer circuit board 410, while the second heating element 72 and the second opening 5212 are located on the other surface of the multilayer circuit board 410.

[0077] In some embodiments, a plurality of electronic components 80 are further provided on two opposite surfaces of the multilayer circuit board 410. The electronic components 80 are connected to the outer circuit layer 102 through a second solder layer 132, wherein the second solder layer 132 may be made of tin or other metal materials. The electronic components 80 can be active components or passive components. This application does not limit the number and type of electronic components 80, that is, it can be adjusted according to actual needs.

[0078] In some embodiments, a first protective cover 401 and a second protective cover 402 are provided on the multilayer circuit board 410. The first protective cover 401 and the second protective cover 402 respectively cover the first heating element 71 and the second heating element 72. The first protective cover 401 is provided with an air outlet 4011, and the second protective cover 402 is provided with an air inlet 4021. The air inlet 4021, the heat dissipation hole 521 and the air outlet 4011 are interconnected to form a heat dissipation channel.

[0079] The method for manufacturing the heat dissipation assembly 400 of this application involves providing heat dissipation elements 93 on both sides of the outer circuit board 200. The heat dissipation elements 93 are mounted on one side of the first heating element 71 and the second heating element 72, and their mounting height is approximately flush with that of the first heating element 71 and the second heating element 72. This facilitates efficient heat dissipation from areas with high heat density (such as the side of the first heating element 71 and the second heating element 72 near the outer circuit layer 102 and the first solder layer 131). Compared to the conventional method of mounting the heat dissipation elements 93 above the first heating element 71 and the second heating element 72, this application, by placing the heat dissipation elements 93 on one side of the first heating element 71 and the second heating element 72, helps to reduce the overall size of the heat dissipation assembly 400.

[0080] The heat dissipation assembly 400 of this application has heat dissipation elements 93 on both sides of the multilayer circuit board 410, which helps to improve the overall heat dissipation efficiency of the heat dissipation elements 93. In addition, the multilayer circuit board 410 is provided with multiple heat dissipation holes 521, which can realize air circulation on both sides of the multilayer circuit board 410 and further improve the heat dissipation effect. At the same time, the heat dissipation elements 93 are installed on one side of the first heating element 71 and the second heating element 72, which helps to reduce the overall volume of the heat dissipation assembly 400.

[0081] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A method for manufacturing a heat dissipation component, characterized in that, Includes the following steps: Multiple inductor coils are disposed on the surface of the inner circuit board; An outer copper-clad substrate is disposed on the surface of the inner circuit board having the inductor coil to obtain an intermediate body; A first through hole is formed in the intermediate body, and the first through hole penetrates the intermediate body along a first direction, which is the thickness direction of the inner circuit board. A first conductive plating layer is formed on the surface of the intermediate body having the first through hole, and the first conductive plating layer also covers the inner wall of the first through hole to form a mounting hole. At least the first conductive plating layer located on the surface of the intermediate body is wired to obtain an outer circuit board, and a magnetic element is provided at the end of the mounting hole, with the plurality of inductor coils arranged around the magnetic element; and A heat dissipation element is provided on the outer circuit board. The heat dissipation element has a rotating shaft, which is rotatably disposed in the mounting hole and connected to the magnetic component, thereby obtaining the heat dissipation assembly.

2. The method for manufacturing the heat dissipation component as described in claim 1, characterized in that, The inner circuit board includes a first circuit layer, and the plurality of inductor coils are provided as follows: A solder layer is provided on the surface of the first circuit layer, the first circuit layer including a plurality of first solder pads, and the solder layer is disposed on the first solder pads; The inductor coil is mounted on the solder layer, and the inductor coil is electrically connected to the first circuit layer.

3. The method for manufacturing the heat dissipation component as described in claim 1, characterized in that, After forming the first conductive coating, the manufacturing method further includes: The opening of the mounting hole on the surface of the intermediate body is enlarged to form a shaft hole, the diameter of which is larger than the diameter of the mounting hole; A bearing is installed in the shaft hole, and the rotating shaft passes through the bearing.

4. The method for manufacturing the heat dissipation component as described in claim 1, characterized in that, When creating the first through hole, the manufacturing method further includes: A second through hole is formed in the intermediate body, the second through hole penetrates the intermediate body along the first direction, and the first conductive plating layer also covers the inner wall of the second through hole to form a heat dissipation hole. The heat dissipation hole forms a first opening and a second opening on two opposite surfaces of the intermediate body, respectively, and the diameter of the first opening is larger than the diameter of the second opening. After fabricating the circuit to form the outer circuit substrate, the fabrication method further includes: A first heating element and a second heating element are respectively installed on the outer circuit board. The heat output of the first heating element is greater than that of the second heating element. The first heating element and the first opening are located on the same side of the intermediate body, and the second heating element and the second opening are located on the other side of the intermediate body.

5. The method for manufacturing the heat dissipation component as described in claim 4, characterized in that, After setting the heat dissipation element, the manufacturing method further includes: A first protective cover and a second protective cover are installed on the outer circuit board. The first protective cover and the second protective cover cover the first heating element and the second heating element, respectively. The first protective cover is provided with an airflow outlet, and the second protective cover is provided with an airflow inlet. The airflow inlet, the heat dissipation hole and the airflow outlet are interconnected to form a heat dissipation channel.

6. A heat dissipation component, characterized in that, include: A multilayer circuit board, wherein a plurality of inductors are disposed within the multilayer circuit board, and mounting holes are provided within the multilayer circuit board, the mounting holes penetrating the multilayer circuit board along a first direction, the first direction being the thickness direction of the multilayer circuit board, a first conductive plating layer is provided on the inner wall of the mounting holes, and a magnetic element is provided at the end of the mounting holes, the plurality of inductors being arranged around the magnetic element; and A heat dissipation element is rotatably disposed on the surface of the multilayer circuit board. The heat dissipation element has a rotating shaft, which is rotatably disposed in the mounting hole and connected to the magnetic component.

7. The heat dissipation assembly as described in claim 6, characterized in that, The multilayer circuit board includes a first circuit layer, the first circuit layer includes a plurality of first solder pads, a solder layer is provided on the first solder pads, the inductor is disposed on the solder layer, and the inductor is electrically connected to the first circuit layer.

8. The heat dissipation assembly as described in claim 6, characterized in that, The mounting hole is located at the opening on the surface of the multilayer circuit board and has a shaft hole. The diameter of the shaft hole is larger than the diameter of the mounting hole. A bearing is installed in the shaft hole and the rotating shaft passes through the bearing.

9. The heat dissipation assembly as described in claim 6, characterized in that, The multilayer circuit board is also provided with heat dissipation holes, which penetrate the multilayer circuit board along the first direction. The inner wall of the heat dissipation hole is provided with the first conductive plating layer. The heat dissipation hole forms a first opening and a second opening on two opposite surfaces of the multilayer circuit board, respectively. The diameter of the first opening is larger than the diameter of the second opening. The multilayer circuit board has a first heating element and a second heating element on two opposite surfaces, respectively. The heat output of the first heating element is greater than that of the second heating element. The first heating element and the first opening are located on the same surface of the multilayer circuit board, and the second heating element and the second opening are located on the other surface of the multilayer circuit board.

10. The heat dissipation assembly as described in claim 9, characterized in that, It also includes a first protective cover and a second protective cover disposed on the multilayer circuit board. The first protective cover and the second protective cover respectively cover the first heating element and the second heating element. The first protective cover is provided with an airflow outlet, and the second protective cover is provided with an airflow inlet. The airflow inlet, the heat dissipation hole and the airflow outlet are interconnected to form a heat dissipation channel.

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