PCB board, impedance adjusting system, method, controller, control system, electronic device, storage medium and vehicle

Abstract

The application discloses a PCB (Printed Circuit Board), which comprises at least two rigid areas for mounting electronic components, the at least two rigid areas comprising a first rigid area and a second rigid area; at least one flexible area, the at least one flexible area comprising a first flexible area, the first flexible area being used for connecting the first rigid area and the second rigid area; the rigid area and the flexible area are integrally formed, on the basis of ensuring signal transmission quality, the occupied space of the PCB is reduced, and the cost and arrangement difficulty of the PCB are reduced.

Description

Technical Field

[0001] This invention relates to the field of printed circuit boards, and more particularly to a PCB board, an impedance adjustment system, a method, a controller, a control system, electronic equipment, a storage medium, and a vehicle. Background Technology

[0002] With the development of automotive intelligence, the functions integrated on domain controllers are becoming more and more numerous, resulting in larger and larger PCB board areas for domain controllers, which occupy more space in the vehicle. At the same time, the number of inter-domain collaborations and data transmissions required is also increasing, leading to a sharp increase in the number of wiring harnesses, which increases wiring harness costs and wiring complexity. Summary of the Invention

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a PCB board, an impedance adjustment system, a method, a controller, a control system, electronic equipment, a storage medium, and a vehicle.

[0004] The first aspect of the present invention provides a PCB board including at least two rigid regions for mounting electronic components, the at least two rigid regions including a first rigid region and a second rigid region; at least one flexible region, the at least one flexible region including a first flexible region, the first flexible region being used to connect the first rigid region and the second rigid region; the rigid region and the flexible region are integrally formed.

[0005] According to a first aspect embodiment of the PCB board, the first rigid region and the second rigid region are connected by a first flexible region. The PCB board can be bent through the first flexible region, reducing its space occupation and improving the flexibility of its layout. When the first and second rigid regions of the PCB board are arranged in different areas, they can be connected through the first flexible region, eliminating the need for connecting wire harnesses and reducing the cost and layout difficulty of the PCB board. Simultaneously, the rigid and flexible regions of the PCB board are integrally formed, and the entire PCB board is made of the same material, ensuring the signal transmission quality. In other words, the PCB board of this embodiment, while ensuring signal transmission quality, reduces its space occupation, lowers its cost, and reduces its layout difficulty.

[0006] In some embodiments, the thickness of the flexible region is less than the thickness of the rigid region.

[0007] In some embodiments, the first flexible region may cause the projections of the first rigid region and the second rigid region in the thickness direction of the PCB board to coincide.

[0008] In some embodiments, the flexible region is formed by a depth control process.

[0009] In some embodiments, the wiring between the rigid region and the flexible region is continuous without transition.

[0010] A second aspect of the present invention provides an impedance adjustment system applied to the PCB board described in the above embodiments, comprising: a capacitor connected in parallel to the traces of the PCB board, wherein the capacitance value of the capacitor is adaptively adjustable to achieve the adjustment of the trace impedance of the PCB board.

[0011] In some embodiments, the impedance adjustment system further includes a processor connected to both the capacitor and the PCB board, for adjusting the capacitance value of the capacitor according to the signal characteristics of the PCB board.

[0012] In some embodiments, the signal characteristics include the signal amplitude characteristics and frequency characteristics.

[0013] A third aspect of the present invention provides an impedance adjustment method applied to the impedance adjustment system described in the above embodiments, comprising: acquiring the signal characteristics of the input signal of the PCB board; and adjusting the capacitance value of the capacitor according to the signal characteristics to adjust the impedance of the PCB board traces.

[0014] In some embodiments, adjusting the capacitance value based on the signal characteristics specifically includes: calculating the target impedance of the PCB trace based on the signal characteristics; and adjusting the capacitance value based on the target impedance.

[0015] In some embodiments, adjusting the capacitance value according to the target impedance specifically includes: determining a bias voltage adjustment amount based on the target impedance; and adjusting the capacitance value based on the bias voltage adjustment amount.

[0016] In some embodiments, the method further includes: acquiring the signal characteristics of the output signal of the PCB board; and adjusting the capacitance value of the capacitor based on the difference between the signal characteristics of the output signal and the signal characteristics of the input signal.

[0017] In some embodiments, adjusting the capacitance value based on the difference between the signal characteristics of the output signal and the signal characteristics of the input signal specifically includes: adjusting the capacitance value when the difference between the signal characteristics of the output signal and the signal characteristics of the input signal is greater than or equal to a set threshold.

[0018] In some embodiments, the impedance adjustment method further includes performing an impedance optimization calculation of the PCB traces at regular intervals.

[0019] A fourth aspect of the present invention provides a controller, comprising a housing and a PCB board as described in the above embodiments, or comprising a housing and an impedance adjustment system as described in the above embodiments, wherein the PCB board is disposed within the housing.

[0020] A fifth aspect of the present invention provides a control system, including a first controller, a second controller and the PCB board described in the above embodiments, or including a first controller, a second controller and the impedance adjustment system described in the above embodiments, wherein the first controller and the second controller are connected through a first flexible area, the first rigid area is disposed within the first controller, and the second rigid area is disposed within the second controller.

[0021] A sixth aspect of the present invention provides an electronic device including a processor connected to a memory storing a computer program; the processor is configured to read and execute the computer program stored in the memory, so that the methods described in the above embodiments are executed.

[0022] A seventh aspect of the present invention provides a storage medium storing computer-executable instructions, the computer-executable instructions being used to cause a computer to perform the methods described in the above embodiments.

[0023] An eighth aspect of the present invention provides a vehicle that includes the controller described in the above embodiments, or the control system described in the above embodiments, or the electronic equipment described in the above embodiments.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0026] Figure 1 This is a schematic diagram of the structure of a PCB board according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the PCB board layout according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the PCB board layout according to another embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of an impedance adjustment system according to an embodiment of the present invention;

[0030] Figure 5This is a flowchart of an impedance adjustment method according to an embodiment of the present invention;

[0031] Figure 6 This is a flowchart of an impedance adjustment method according to another embodiment of the present invention.

[0032] Figure label:

[0033] 10: PCB board; 11: Rigid area; 12: Flexible area; 111: First rigid area; 112: Second rigid area; 121: First flexible area; 20: Capacitor; 30: Processor; 100: Impedance adjustment system. Detailed Implementation

[0034] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] The first aspect of the present invention provides a PCB board 10, including at least two rigid regions 11 for mounting electronic components, the at least two rigid regions 11 including a first rigid region 111 and a second rigid region 112; at least one flexible region 12, the at least one flexible region 12 including a first flexible region 121, the first flexible region 121 being used to connect the first rigid region 111 and the second rigid region 112; the rigid region 11 and the flexible region 12 are integrally formed.

[0038] According to a first aspect embodiment of the PCB board 10, such as Figure 1-3 As shown, the first rigid region 111 and the second rigid region 112 are connected by the first flexible region 121. The PCB board 10 can be bent through the first flexible region 121, reducing the space occupied by the PCB board 10 and improving the flexibility of its layout. When the first rigid region 111 and the second rigid region 112 of the PCB board 10 are arranged in different areas, they can be connected through the first flexible region 121, eliminating the need for connecting wires and reducing the cost and layout difficulty of the PCB board 10. Simultaneously, the rigid region 111 and the flexible region 12 of the PCB board 10 are integrally formed, and the entire PCB board 10 is made of the same material, ensuring the signal transmission quality of the PCB board 10. In other words, the PCB board 10 of this embodiment, while ensuring signal transmission quality, reduces the space occupied by the PCB board 10, lowering its cost and reducing its layout difficulty.

[0039] Furthermore, the PCB board 10 may also include three rigid regions 11 and two flexible regions 12. The rigid regions 11 and flexible regions 12 are spaced apart, and the flexible regions 12 are connected between the two rigid regions 11. The PCB board 10 can be folded through the two flexible regions 12, reducing the space occupied by the PCB board 10 and improving the flexibility of the PCB board 10 layout. When the three rigid regions 11 of the PCB board 10 are arranged in different areas, they can be connected through the flexible regions 12, eliminating the need for connecting wire harnesses and reducing the cost and layout difficulty of the PCB board 10. At the same time, the rigid regions 11 and flexible regions 12 of the PCB board 10 are integrally formed structures, and the entire PCB board 10 is made of the same material. That is, while ensuring signal transmission quality, the PCB board 10 reduces the space occupied by the PCB board 10, reducing the cost and layout difficulty of the PCB board 10. Similarly, the PCB board 10 may also include four or more rigid regions 11 and multiple flexible regions 12 corresponding to the rigid regions 11, which will not be elaborated here.

[0040] In some embodiments, the thickness of the flexible region 12 is less than the thickness of the rigid region 11.

[0041] like Figure 1As shown, the thickness T of the flexible area 12 of the PCB board 10 is less than the thickness of the rigid area 11 of the PCB board 10, which enables the PCB board 10 to bend flexibly. It can be flexibly bent and arranged according to product usage requirements, adapting to various irregular shapes of product internal structures and effectively saving space. Compared with the PCB board 10 design with a fully rigid area 11 in related technologies, this solution can be bent into different shapes according to product requirements, improving the flexibility of product design, enabling a more compact layout of the PCB board 10 and electronic components, and improving the space utilization rate of the product.

[0042] In some embodiments, the first flexible region 121 may cause the projections of the first rigid region 111 and the second rigid region 112 in the thickness direction of the PCB board 10 to coincide.

[0043] like Figure 2 As shown, according to product usage requirements, when the first rigid area 111 and the second rigid area 112 of the PCB board 10 are arranged in the same area, the PCB board 10 can be bent through the first flexible area 121 between the first rigid area 111 and the second rigid area, so that the projections of the first rigid area 111 and the second rigid area 112 in the thickness direction of the PCB board 10 coincide, thereby reducing the space occupied by the PCB board 10, improving the flexibility of the PCB board 10 arrangement, adapting to the internal structure of various irregularly shaped products, and effectively saving space.

[0044] In some embodiments, the flexible region 12 is formed by a depth control process.

[0045] like Figure 1 As shown, the flexible area 12 of the PCB board 10 can be made using a depth-controlled process, allowing for localized depth-controlled cutouts on the PCB board 10. This enables the originally rigid PCB board to achieve a flexible bending effect in the thinned sections, creating both a rigid, non-bendable area and a flexible, bendable area within the PCB board 10. Furthermore, since the rigid area 11 and the flexible area 12 are integrally formed, there is no need to bind or connect them, reducing the impact of the transition area between the rigid area 11 and the flexible area 12 on the signal transmission quality of the PCB board 10 and simplifying the manufacturing process. In other words, the depth-controlled process for the flexible area 12 of the PCB board 10 reduces the space occupied by the PCB board 10 while ensuring signal transmission quality, thus lowering the cost and layout complexity of the PCB board 10.

[0046] In some embodiments, the wiring between the rigid region 11 and the flexible region 12 is continuous without transition.

[0047] like Figure 1-3As shown, the traces between the first rigid region 111, the first flexible region 121 and the second rigid region 112 of the PCB board 10 are continuous without transition, which further improves the signal transmission quality of the PCB board 10 and ensures the stability of the signal transmission of the PCB board 10.

[0048] In addition, the PCB board 10 may also include three rigid regions 11 and two flexible regions 12. The rigid regions 11 and flexible regions 12 are spaced apart, and the flexible regions 12 are connected between the two rigid regions 11. The traces between the rigid regions 11 and the flexible regions 12 are continuous without transitions, which can further improve the signal transmission quality of the PCB board 10 and ensure the stability of the signal transmission of the PCB board 10. Similarly, the PCB board 10 may also include four or more rigid regions 11 and multiple flexible regions 12 corresponding to the rigid regions 11, which will not be described in detail here.

[0049] In some optional embodiments, the ground lines on both sides of the signal lines of the PCB board 10 are shielded to achieve the shielding effect of the PCB.

[0050] A second aspect of the present invention provides an impedance adjustment system 100, applied to a PCB board 10 in any of the above embodiments, comprising: a capacitor 20 connected in parallel to the traces of the PCB board 10, wherein the capacitance value of the capacitor 20 is adaptively adjustable to achieve the adjustment of the trace impedance of the PCB board 10.

[0051] According to a second aspect of the present invention, the impedance adjustment system 100 includes a capacitor 20 connected in parallel to the traces of a PCB board 10. The capacitance value of the capacitor 20 is adaptively adjustable. That is, by adjusting the capacitance value of the variable capacitor 20, the trace impedance of the PCB board 10 connected in parallel with the capacitor 20 is changed. By adjusting the trace impedance of the PCB board 10, the reflection and distortion of the signal during transmission are reduced, making the signal voltage and current distribution on the transmission line of the PCB board 10 more uniform and stable, enhancing the anti-interference capability of the PCB board 10 when transmitting signals, and significantly improving the stability of signal transmission and the quality of the output signal of the PCB board 10.

[0052] In some embodiments, the impedance adjustment system 100 further includes a processor 30, which is connected to both the capacitor 20 and the PCB board 10, and is used to adjust the capacitance value of the capacitor 20 according to the signal characteristics of the PCB board 10.

[0053] like Figure 4 As shown, the processor 30 is connected to the capacitor 20, which is connected in parallel to the traces of the PCB board 10. The processor 30 can adjust the capacitance of the capacitor 20 according to the signal characteristics, thereby changing the trace impedance of the PCB board 10 connected in parallel with the capacitor 20, optimizing the signal quality, and enhancing the anti-interference capability of the rigid area 11 and the flexible area 12 of the PCB board 10.

[0054] In some embodiments, signal characteristics include amplitude characteristics and frequency characteristics of the signal.

[0055] Specifically, the processor 30 can adjust the capacitance value of the capacitor 20 according to the amplitude and frequency characteristics of the signal. This adjustment can be based on the signal characteristics of the input signal to the PCB board 10, or on the signal characteristics of both the input and output signals of the PCB board 10. This changes the trace impedance of the PCB board 10 connected in parallel with the capacitor 20, making the signal voltage and current distribution on the transmission line of the PCB board 10 more uniform and stable, enhancing the anti-interference capability of the PCB board 10 when transmitting signals, and significantly improving the stability of signal transmission and the quality of the output signal of the PCB board 10.

[0056] In some optional embodiments, the processor 30 adjusts the capacitance of the capacitor 20 according to the amplitude and frequency characteristics of the signal using an AI model algorithm, and dynamically adjusts the trace impedance of the PCB board 10 in real time, so that the signal quality transmitted by the traces of the PCB board 10 is always kept in the best state, enhancing the anti-interference capability of the trace signals of the PCB board 10, and making the PCB board 10 less susceptible to interference when transmitting signals.

[0057] In some alternative embodiments, such as Figure 4 As shown, the processor 30 in the impedance adjustment system 100 has signal feature detection, AI model algorithm, and bias voltage adjustment functions. The processor 30 analyzes the frequency and amplitude characteristics of the input and output signals of the PCB board 10 and generates signal feature values. The AI ​​model reads the signal features of the input and output signals, processes them using the AI ​​model algorithm, and generates a bias voltage adjustment strategy. The processor 30 adjusts the bias voltage of the variable capacitor 20 according to the bias voltage adjustment strategy. The variable capacitor 20 can change its capacitance value by applying a bias voltage, thereby changing the impedance of the PCB board 10 traces connected in parallel with the capacitor 20. The input signal is the signal output from the signal generation terminal, and the output signal is the signal received by the receiving terminal after transmission through the PCB board 10 traces.

[0058] A third aspect of the present invention provides an impedance adjustment method, applied to the impedance adjustment system 100 of any of the above embodiments, such as... Figure 5 As shown, the impedance adjustment method includes steps S1-S2, and the specific steps are as follows:

[0059] Step S1: Obtain the signal characteristics of the input signal of the PCB board 10.

[0060] Step S2: Adjust the capacitance value of capacitor 20 according to the signal characteristics to adjust the trace impedance of PCB board 10.

[0061] According to the impedance adjustment method of the third aspect of the present invention, the signal characteristics of the input signal of the PCB board 10 are obtained by the signal characteristic detection function. Based on the signal characteristics, the capacitance value of the capacitor 20 connected in parallel with the trace of the PCB board 10 is adjusted, thereby changing the trace impedance of the PCB board 10 connected in parallel with the capacitor 20. By adjusting the trace impedance of the PCB board 10, the reflection and distortion of the signal during transmission are reduced, making the signal voltage and current distribution on the transmission line of the PCB board 10 more uniform and stable, enhancing the anti-interference ability of the PCB board 10 when transmitting signals, and significantly improving the stability of signal transmission and the quality of output signal of the PCB board 10.

[0062] In some optional embodiments, the amplitude and frequency characteristics of the input signal of the PCB board 10 are obtained, and the capacitance of the capacitor 20 is adjusted according to the amplitude and frequency characteristics to adjust the trace impedance of the PCB board 10.

[0063] In some embodiments, the impedance adjustment method specifically includes: calculating the target impedance of the traces on the PCB board 10 based on signal characteristics; and adjusting the capacitance value of the capacitor 20 based on the target impedance.

[0064] Specifically, the signal characteristics of the input signal on the PCB board 10 are obtained through signal feature detection. Based on these characteristics, the target impedance of the traces on the PCB board 10 is calculated. The capacitance of the matching capacitor 20 is then adjusted to match the target impedance of the traces on the PCB board 10, making the final impedance of the traces on the PCB board 10 infinitely close to the target impedance. This enhances the anti-interference capability of the PCB board 10 during signal transmission, improves the stability of signal transmission, and enhances the quality of the output signal.

[0065] In some optional embodiments, an AI model algorithm is used to calculate the target impedance of the traces on the PCB board 10 based on the signal characteristics of the input signal. The capacitance value of the capacitor 20 is adjusted according to the target impedance to optimize the signal quality in real time, so that the signal quality transmitted by the PCB board 10 is always kept in the best state. This enhances the anti-interference capability of the PCB board 10 when transmitting signals, and improves the stability of product signal transmission and the quality of received signals.

[0066] In some embodiments, the impedance adjustment method specifically includes: determining the bias voltage adjustment amount based on the target impedance; and adjusting the capacitance value of capacitor 20 based on the bias voltage adjustment amount.

[0067] Specifically, the signal characteristics of the input signal of the PCB board 10 are obtained through the signal characteristic detection function. Based on the signal characteristics, the target impedance of the traces of the PCB board 10 is calculated. Based on the target impedance of the traces of the PCB board 10, the bias voltage adjustment amount is obtained, and the bias voltage applied to the variable capacitor 20 is controlled and adjusted, thereby changing the capacitance value of the variable capacitor 20. By changing the capacitance value of the bias capacitor 20, the trace impedance of the PCB board 10 connected in parallel with the bias capacitor 20 is changed, thereby achieving the purpose of adjusting the trace impedance of the PCB board 10.

[0068] In some embodiments, the impedance adjustment method further includes: acquiring the signal characteristics of the output signal of the PCB board 10; and adjusting the capacitance value of the capacitor 20 according to the difference between the signal characteristics of the output signal and the signal characteristics of the input signal.

[0069] Specifically, the signal characteristics of the input signal to PCB board 10 are obtained through signal feature detection. Based on these characteristics, the target impedance of the traces on PCB board 10 is calculated. The bias voltage adjustment amount is then determined based on the target impedance, and the bias voltage applied to variable capacitor 20 is adjusted accordingly, thereby changing the capacitance value of variable capacitor 20. Furthermore, the signal characteristics of the output signal to PCB board 10 are obtained through signal feature detection. Based on the difference between the output signal characteristics and the input signal characteristics, the capacitance value of capacitor 20 is further optimized, ensuring that the quality of the received output signal remains optimal and enhancing the signal anti-interference capability of PCB board 10.

[0070] In some embodiments, the impedance adjustment method specifically includes: adjusting the capacitance value of capacitor 20 when the difference between the signal characteristics of the output signal and the signal characteristics of the input signal is greater than or equal to a set threshold.

[0071] Specifically, the signal characteristics of the input signal on the PCB board 10 are obtained through the signal characteristic detection function. After changing the capacitance value of the variable capacitor 20 according to the signal characteristics, the capacitor 20 is further optimized when the difference between the signal characteristics of the output signal and the signal characteristics of the input signal is greater than or equal to a set threshold, thereby improving the system's operating efficiency while ensuring the quality of the output signal.

[0072] In some optional embodiments, the signal characteristics include the amplitude characteristics and frequency characteristics of the signal. When the difference between the signal characteristics of the output signal and the amplitude signal characteristics of the input signal is greater than or equal to a set threshold, the capacitor 20 is optimized and adjusted; or when the difference between the signal characteristics of the output signal and the frequency signal characteristics of the input signal is greater than or equal to a set threshold, the capacitor 20 is optimized and adjusted, thereby improving the system's operational efficiency while ensuring the quality of the output signal.

[0073] In some embodiments, the impedance adjustment method further includes performing a trace impedance optimization calculation on the PCB board 10 at regular intervals, that is, ensuring the output signal quality of the PCB board 10 while taking into account the system's operational efficiency.

[0074] In some alternative embodiments, such as Figure 6 As shown, the processor 30 in the impedance adjustment system 100 first analyzes the signal frequency and amplitude characteristics of the input signal. Then, it transmits the analyzed signal characteristics to the AI ​​model. After processing by the AI ​​model, a bias voltage adjustment strategy for the variable capacitor 20 is generated. This strategy controls and adjusts the bias voltage applied to the variable capacitor 20, thereby changing the capacitance value of the variable capacitor 20. By changing the capacitance value of the bias capacitor 20, the trace impedance of the PCB board 10 connected in parallel with the bias capacitor 20 is changed, achieving the purpose of PCB board 10 trace impedance adjustment. By adjusting the PCB board 10 trace impedance, signal reflection and distortion during transmission are reduced, making the signal voltage and current distribution on the transmission line of the PCB board 10 more uniform and stable. This reduces the impact of noise and interference on the signal quality of the PCB board 10, achieving the goal of optimizing the output signal quality. Furthermore, the optimized output signal is synchronously fed back to the processor 30 in the impedance adjustment system 100. The processor 30 uses an AI algorithm to synchronously detect the signal frequency and amplitude characteristics of the output signal. If the detected deviation between the output signal characteristics and the input signal characteristics is greater than or equal to a set threshold, the processor 30 adjusts the bias voltage regulation strategy of the variable capacitor 20 in real time through the autonomous learning and decision-making characteristics of the AI ​​model algorithm until the signal characteristic deviation between the output signal and the input signal is within the set threshold range, thereby achieving real-time optimization of the output signal quality, keeping the output signal quality at its best, and improving the anti-interference capability of the signal when it is transmitted on the PCB board 10.

[0075] A fourth aspect of the present invention provides a controller, including a housing and a PCB board 10 of any of the above embodiments, or including a housing and an impedance adjustment system 100 of any of the above embodiments, wherein the PCB board 10 is disposed within the housing.

[0076] The controller according to a fourth aspect embodiment of the present invention, such as Figure 2As shown, the PCB board 10 is housed within a controller housing. The first rigid region 111 and the second rigid region 112 of the PCB board 10 are connected by a first flexible region 121. The PCB board 10 can be bent via the first flexible region 121, reducing its space footprint within the controller and improving its layout flexibility. The rigid region 111 and the flexible region 122 of the PCB board 10 are integrally formed, ensuring signal transmission quality while reducing the space occupied by the PCB board 10 within the controller and enhancing layout flexibility. Furthermore, the impedance adjustment system 100 further enhances the anti-interference capability of the PCB board 10 during signal transmission, improving the stability of the controller signal transmission and the quality of the output signal.

[0077] Specifically, the PCB board 10 can be folded at different angles according to the controller's usage and shape design requirements, making the design of the PCB board 10 match the controller's usage and installation needs. The shape of the PCB board 10 does not need to be considered during controller design, making the entire controller design more flexible.

[0078] In some alternative embodiments, the controller can be a domain controller on the vehicle. The PCB board 10 is arranged within the same domain controller, and its overall volume can be reduced by bending and overlapping. This simultaneously reduces the space required for mounting the domain controller and the vehicle space occupied when the domain controller is installed. Bending the PCB board allows it to adapt to domain controllers of different shapes and spatial layouts, making the domain controller design more compatible with installation and usage requirements. The rigid area 11 and flexible area 12 of the PCB board 10 are integrally formed, and combined with the impedance adjustment system 100, the domain controller ensures signal transmission quality while saving costs and offering greater flexibility in vehicle installation.

[0079] The fifth aspect of the present invention provides a control system, including a first controller, a second controller and a PCB board 10 of any of the above embodiments, or including a first controller, a second controller and an impedance adjustment system 100 of any of the above embodiments. The first controller and the second controller are connected through a first flexible area 121, a first rigid area 111 is disposed in the first controller, and a second rigid area 112 is disposed in the second controller.

[0080] The control system according to the fifth aspect embodiment of the present invention, such as Figure 3As shown, in the control system, the first rigid area 111 is located within the first controller, and the second rigid area 112 is located within the second controller. The first controller and the second controller are connected through the first flexible area 121, which eliminates a large number of cross-controller wiring harnesses, reducing the wiring cost and complexity of the control system. The rigid area 11 and the flexible area 12 of the PCB board 10 are integrally formed, which reduces the space occupied by the PCB board 10 in the controller while ensuring the signal transmission quality of the control system, thus improving the flexibility of the control system layout. In addition, the impedance adjustment system 100 can also change the trace impedance of the PCB board 10 connected in parallel with the capacitor 20 by adjusting the capacitance value of the variable capacitor 20. By adjusting the trace impedance of the PCB board 10, the reflection and distortion of the signal during transmission are reduced, making the signal voltage and current distribution on the transmission line of the PCB board 10 more uniform and stable, further enhancing the anti-interference capability of the PCB board 10 when transmitting signals, and improving the stability of the control system signal transmission and the quality of the output signal.

[0081] In some optional embodiments, both the first controller and the second controller can be domain controllers on the vehicle. A first rigid region 111 is disposed within the first domain controller, and a second rigid region 112 is disposed within the second domain controller. The first and second domain controllers are connected via a first flexible region 121, eliminating the need for numerous wiring harnesses connecting different domain controllers and reducing the wiring cost and complexity of the control system. The rigid region 11 and flexible region 12 of the PCB board 10 are integrally formed, and combined with the impedance adjustment system 100, the domain control system ensures signal transmission quality while saving costs and offering greater flexibility in vehicle installation.

[0082] In some alternative embodiments, the control system may include three or more controllers, with the rigid area 11 of the PCB board 10 disposed within each controller. The controllers can be connected to each other through the flexible area 12 of the PCB board 10, so that the domain control system can save costs and make the installation on the vehicle more flexible while ensuring signal transmission quality.

[0083] A sixth aspect of the present invention provides an electronic device including a processor 30 connected to a memory, the memory storing a computer program; the processor 30 is used to read the computer program stored in the memory and execute it, so that the impedance adjustment method of any of the above embodiments is executed.

[0084] A seventh aspect of the present invention provides a storage medium storing computer-executable instructions for causing a computer to perform the impedance adjustment method of any of the above embodiments.

[0085] An eighth aspect of the present invention provides a vehicle that includes the controller of the above embodiments, or the control system of the above embodiments, or the electronic equipment of the above embodiments.

[0086] Other configurations and operations of the vehicle according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0087] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0088] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A PCB board (10), characterized in that, include: At least two rigid regions (11) are provided for mounting electronic components, wherein the at least two rigid regions (11) include a first rigid region (111) and a second rigid region (112); At least one flexible region (12), the at least one flexible region (12) including a first flexible region (121), the first flexible region (121) being used to connect the first rigid region (111) and the second rigid region (112); The rigid region (11) and the flexible region (12) are integrally formed.

2. The PCB board (10) according to claim 1, characterized in that: The thickness of the flexible region (12) is less than the thickness of the rigid region (11).

3. The PCB board (10) according to claim 1, characterized in that: The first flexible region (121) allows the projections of the first rigid region (111) and the second rigid region (112) in the thickness direction of the PCB board (10) to coincide.

4. The PCB board (10) according to claim 1, characterized in that: The flexible region (12) is formed by a depth control process.

5. The PCB board (10) according to claim 1, characterized in that: The wiring between the rigid region (11) and the flexible region (12) is continuous without any transition.

6. An impedance adjustment system (100), applied to the PCB board (10) according to any one of claims 1-5, characterized in that, include: A capacitor (20) is connected in parallel to the traces of the PCB board (10). The capacitance value of the capacitor (20) can be adaptively adjusted to adjust the impedance of the traces of the PCB board (10).

7. The impedance adjustment system (100) according to claim 6, characterized in that, Also includes: The processor (30) is connected to both the capacitor (20) and the PCB board (10) and is used to adjust the capacitance value of the capacitor (20) according to the signal characteristics of the PCB board (10).

8. The impedance adjustment system (100) according to claim 7, characterized in that: The signal characteristics include the amplitude characteristics and frequency characteristics of the signal.

9. An impedance adjustment method, applied to the impedance adjustment system (100) according to any one of claims 6-8, characterized in that, include: Obtain the signal characteristics of the input signal of the PCB board (10); Based on the signal characteristics, the capacitance value of the capacitor (20) is adjusted to adjust the trace impedance of the PCB board (10).

10. The impedance adjustment method according to claim 9, characterized in that, Adjusting the capacitance value of the capacitor (20) according to the signal characteristics specifically includes: Based on the signal characteristics, calculate the target impedance of the traces on the PCB board (10); Adjust the capacitance value of the capacitor (20) according to the target impedance.

11. The impedance adjustment method according to claim 10, characterized in that, The step of adjusting the capacitance value of the capacitor (20) according to the target impedance specifically includes: Based on the target impedance, the bias voltage adjustment amount is determined; The capacitance value of the capacitor (20) is adjusted according to the bias voltage adjustment amount.

12. The impedance adjustment method according to claim 9, characterized in that, The method further includes: Obtain the signal characteristics of the output signal of the PCB board (10); The capacitance value of the capacitor (20) is adjusted according to the difference between the signal characteristics of the output signal and the signal characteristics of the input signal.

13. The impedance adjustment method according to claim 12, characterized in that, The step of adjusting the capacitance value of the capacitor (20) based on the difference between the signal characteristics of the output signal and the signal characteristics of the input signal specifically includes: When the difference between the signal characteristics of the output signal and the signal characteristics of the input signal is greater than or equal to a set threshold, the capacitance value of the capacitor (20) is adjusted.

14. The impedance adjustment method according to claim 9, characterized in that, Also includes: The impedance optimization calculation of the PCB board (10) traces is performed once every certain period of time.

15. A controller, characterized in that, The device includes a housing and a PCB board (10) as described in any one of claims 1-5, or includes a housing and an impedance adjustment system (100) as described in any one of claims 6-8, wherein the PCB board (10) is disposed within the housing.

16. A control system, characterized in that, include: The system comprises a first controller, a second controller, and a PCB board (10) as described in any one of claims 1-5, or includes a first controller, a second controller, and an impedance adjustment system (100) as described in any one of claims 6-8. The first controller and the second controller are connected through the first flexible area (121). The first rigid region (111) is disposed within the first controller, and the second rigid region (112) is disposed within the second controller.

17. An electronic device, characterized in that, Includes a processor (30) connected to a memory on which a computer program is stored; the processor (30) is configured to read the computer program stored in the memory and execute it such that the method described in any one of claims 9-14 is performed.

18. A storage medium, characterized in that, The device stores computer-executable instructions for causing a computer to perform the method as described in any one of claims 9-14.

19. A vehicle, characterized in that, It includes the controller as described in claim 15, or the control system as described in claim 16, or the electronic device as described in claim 17.

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