Flexible circuit board roll press pre-press device and method with local reinforcement structure

Abstract

The present application relates to the technical field of flexible circuit board roll pressing pre-pressing, and discloses a flexible circuit board roll pressing pre-pressing device and method with a local reinforcing structure, which comprises: a working base arranged on a rack, the working base being used for bearing and fixing a flexible circuit board to be processed; a conveying and positioning mechanism used for conveying and positioning the flexible circuit board to a preset processing station; a mechanical hand used for positioning and adhering a reinforcing plate to a preset reinforcing area of the flexible circuit board; a roll pressing pre-pressing mechanism used for applying roll pressing pressure and roll pressing temperature to the flexible circuit board with the reinforcing plate positioned and adhered; a collecting module used for collecting process state parameters in real time; and an adjusting module used for automatically adjusting output parameters of the roll pressing pre-pressing mechanism according to a comparison result of the process state parameters and a preset target parameter range. The present application realizes self-adaptive adjustment of the processing process.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit board rolling preloading technology, and more specifically, to a flexible circuit board rolling preloading device and method with a locally reinforced structure. Background Technology

[0002] In the manufacturing process of flexible printed circuit boards (FPCBs), in order to meet the structural strength, insulation performance, or heat dissipation requirements of specific areas, it is usually necessary to attach a reinforcing plate to the pre-defined reinforcing area of ​​the FPCB.

[0003] Currently, for flexible circuit boards with such locally reinforced structures, the bonding process between the reinforcing plate and the flexible circuit board, especially the roll forming pre-compression stage, is crucial to the quality of the final product. Traditional roll forming pre-compression devices mostly use fixed roll forming pressure and temperature parameters for processing. However, due to the differences in material properties, thickness, and required bonding strength between flexible circuit boards and their reinforcing plates of different specifications, fixed processing parameters are difficult to adapt to diverse processing needs. This often leads to problems during processing such as excess adhesive, wrinkles between the reinforcing plate and the flexible circuit board, the thickness of the pre-set reinforcing area after bonding not meeting design requirements, and bubbles or misalignment in the bonded appearance, seriously affecting the product yield and processing accuracy. In addition, to cope with different processing needs or solve the above quality problems, operators need to repeatedly manually adjust the parameters of the roll forming pre-compression mechanism. This not only increases labor costs and reduces overall processing efficiency, but also makes it difficult to ensure the accuracy and consistency of parameter adjustments, and fails to achieve intelligent and automated control of the processing process.

[0004] Therefore, it is necessary to provide a flexible circuit board rolling preloading device and method with a local reinforcement structure to solve the problem of poor adaptation of fixed parameters for flexible circuit board reinforcing plate rolling preloading, which leads to poor quality of flexible circuit boards and low efficiency of flexible circuit board rolling preloading device. Summary of the Invention

[0005] In view of this, the present invention proposes a rolling preloading device and method for flexible circuit boards with a local reinforcement structure, aiming to solve the problem of poor adaptation of fixed parameters for rolling preloading of flexible circuit board reinforcement plates, which leads to poor quality of flexible circuit boards and low efficiency of the rolling preloading device for flexible circuit boards.

[0006] On one hand, the present invention proposes a flexible circuit board roll forming preloading device with a locally reinforced structure, comprising: A frame and a work platform, wherein the work platform is mounted on the frame and is used to support and fix the flexible circuit board to be processed; A conveying and positioning mechanism is mounted on the frame, and the conveying and positioning mechanism is used to convey and position the flexible circuit board at a preset processing station; A robotic arm is positioned above the processing station and is used to position and attach the reinforcing plate to the preset reinforcement area of ​​the flexible circuit board. A rolling pre-compression mechanism is located above the processing station. The rolling pre-compression mechanism is used to apply rolling pressure and rolling temperature to the flexible circuit board that has been positioned and attached to the reinforcing plate. The acquisition module is used to acquire process status parameters in real time. The process status parameters include the pressure and temperature values ​​of the flexible circuit board during the roll forming and pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the roll forming and pre-pressing reinforcement plate. The adjustment module is electrically connected to both the acquisition module and the rolling preloading mechanism. The adjustment module is used to automatically adjust the output parameters of the rolling preloading mechanism based on the comparison results between the process state parameters and the preset target parameter range.

[0007] Furthermore, the adjustment module includes: The pressure judgment unit is used to compare the pressure value with a preset target pressure range, and determine whether to adjust the output pressure of the rolling pre-compression mechanism based on the comparison result; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, the output pressure is adjusted according to the thickness value. The temperature judgment unit is used to compare the temperature value with a preset target temperature range, and determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result; if it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, the heating temperature is adjusted according to the bonding appearance image.

[0008] Furthermore, the pressure judgment unit is used to compare the pressure value with a preset target pressure range, and to determine whether to adjust the output pressure of the rolling preload mechanism based on the comparison result, including: The pressure values ​​at multiple points during the roll forming and pre-compression process of the flexible circuit board are obtained, and the average pressure value of the multiple pressure values ​​is calculated. If the average pressure is within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism will not be adjusted. If the average pressure is not within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism should be adjusted.

[0009] Furthermore, if it is determined that the output pressure of the rolling preloading mechanism needs to be adjusted, then adjusting the output pressure according to the thickness value includes: After obtaining the thickness values ​​of several points in the preset reinforcement area of ​​the roll-formed pre-stressed reinforcing plate, calculate the average thickness value of the thickness values ​​at several points; If the average thickness is not within the preset thickness range, the output pressure is adjusted according to the thickness deviation between the average thickness and the preset thickness range. If the average thickness is within the preset thickness range, then it is determined again that the output pressure will not be adjusted.

[0010] Furthermore, when adjusting the output pressure based on the thickness deviation between the average thickness and a preset thickness range, the following steps are included: Calculate the thickness deviation between the average thickness and the center value of the preset thickness range; The pressure adjustment amount is calculated based on the preset pressure-thickness correction coefficient, and the pressure adjustment amount is equal to the thickness deviation value multiplied by the pressure-thickness correction coefficient; The output pressure of the rolling preload mechanism can be increased or decreased according to the pressure adjustment amount; When the average thickness is greater than the upper limit of the preset thickness range, the thickness deviation is positive, the pressure adjustment is positive, and the adjustment module controls the rolling pre-compression mechanism to increase the output pressure. When the average thickness is less than the lower limit of the preset thickness range, the thickness deviation value is negative, the pressure adjustment amount is negative, and the adjustment module controls the rolling pre-compression mechanism to reduce the output pressure.

[0011] Furthermore, the temperature judgment unit is used to compare the temperature value with a preset target temperature range, and to determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result, including: Obtain temperature values ​​at multiple points during the rolling and pre-compression process of flexible circuit boards, and calculate the average temperature value at multiple points. If the average temperature is within the preset target temperature range, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. If the average temperature is not within the preset target temperature range, it is determined that the heating temperature of the rolling pre-compression mechanism should be adjusted.

[0012] Furthermore, adjusting the heating temperature based on the fit appearance image includes: Image recognition is performed on the fitted appearance image; If the average temperature is greater than the maximum value of the preset target temperature range, then the percentage of the overflow area at the edge of the reinforcing plate is extracted. If the average temperature is less than the minimum value of the preset target temperature range, then the percentage of the wrinkled area at the edge of the reinforcing plate is extracted. Adjust the heating temperature according to the preset threshold for the percentage of overflow area and the threshold for the percentage of wrinkled area.

[0013] Furthermore, when adjusting the heating temperature according to the preset threshold values ​​for the percentage of overflow area and the percentage value of wrinkled area, the following steps are included: If the percentage of overflow area is greater than the preset threshold for overflow area, calculate the deviation value of the overflow area percentage from the preset threshold for overflow area, and adjust the heating temperature according to the deviation value of the overflow area percentage. If the percentage of overflow area is less than or equal to the preset threshold for the percentage of overflow area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is inversely proportional to the deviation value of the overflow area.

[0014] Furthermore, when adjusting the heating temperature according to the preset threshold values ​​for the percentage of overflow area and the percentage value of wrinkled area, the method further includes: If the proportion of the wrinkled area is greater than a preset threshold for the proportion of the wrinkled area, calculate the deviation value of the wrinkled area proportion from the preset threshold for the proportion of the wrinkled area; adjust the heating temperature according to the wrinkled area proportion deviation value. If the proportion of the wrinkled area is less than or equal to the preset threshold for the proportion of the wrinkled area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is directly proportional to the deviation value of the fold ratio.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: by setting a data acquisition module to collect various process state parameters in real time during the rolling pre-pressing process, the adjustment module can automatically adjust the output pressure and heating temperature of the rolling pre-pressing mechanism according to the comparison results of the actual processing parameters and the preset parameters. This can adapt to the processing needs of locally reinforced flexible circuit boards of different specifications and different bonding requirements, avoid problems such as glue overflow, wrinkles, and unqualified bonding thickness caused by fixed processing parameters, effectively improve the yield and processing accuracy of locally reinforced flexible circuit board rolling pre-pressing processing, realize the adaptive adjustment of the processing process, eliminate the need for repeated manual parameter adjustments, and improve the overall processing efficiency.

[0016] On the other hand, this application also provides a method for rolling preloading of flexible circuit boards with local reinforcement structures, including: Real-time acquisition of process status parameters, including pressure and temperature values ​​of the flexible circuit board during the roll forming and pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the roll forming and pre-pressing reinforcement plate. Based on the comparison results between the process state parameters and the preset target parameter range, the output parameters of the rolling preloading mechanism are automatically adjusted; The pressure value is compared with the preset target pressure range, and the comparison result determines whether the output pressure of the rolling pre-compression mechanism needs to be adjusted; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, the output pressure is adjusted according to the thickness value. The temperature value is compared with the preset target temperature range, and the heating temperature of the rolling pre-pressing mechanism is adjusted according to the comparison result. If it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, the heating temperature is adjusted according to the bonding appearance image.

[0017] It is understood that the flexible circuit board rolling preloading device and method with local reinforcement structure provided in this application have the same beneficial effects, and will not be described in detail here. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 A functional block diagram of a flexible circuit board rolling preloading device with a locally reinforced structure provided in an embodiment of the present invention; Figure 2 A flowchart of a rolling preloading method for flexible circuit boards with localized reinforcement structures provided in an embodiment of the present invention. Detailed Implementation

[0019] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey its scope to those skilled in the art. It should be noted that, unless otherwise specified, embodiments and features described herein can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0020] In some embodiments of this application, see Figure 1 As shown, this embodiment provides a flexible circuit board roll forming preloading device with a locally reinforced structure, comprising: A frame and a work platform, wherein the work platform is mounted on the frame and is used to support and fix the flexible circuit board to be processed; A conveying and positioning mechanism is mounted on the frame, and the conveying and positioning mechanism is used to convey and position the flexible circuit board at a preset processing station; A robotic arm is positioned above the processing station and is used to position and attach the reinforcing plate to the preset reinforcement area of ​​the flexible circuit board. A rolling pre-compression mechanism is located above the processing station. The rolling pre-compression mechanism is used to apply rolling pressure and rolling temperature to the flexible circuit board that has been positioned and attached to the reinforcing plate. The acquisition module is used to acquire process status parameters in real time. The process status parameters include the pressure and temperature values ​​of the flexible circuit board during the roll forming and pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the roll forming and pre-pressing reinforcement plate. The adjustment module is electrically connected to both the acquisition module and the rolling preloading mechanism. The adjustment module is used to automatically adjust the output parameters of the rolling preloading mechanism based on the comparison results between the process state parameters and the preset target parameter range.

[0021] Understandably, by setting up a data acquisition module to collect various process status parameters in real time during the rolling pre-pressing process, the adjustment module can automatically adjust the output pressure and heating temperature of the rolling pre-pressing mechanism based on the comparison results between the actual processing parameters and the preset parameters. This can adapt to the processing needs of locally reinforced flexible circuit boards of different specifications and with different bonding requirements, avoiding problems such as glue overflow, wrinkles, and unqualified bonding thickness caused by fixed processing parameters. It effectively improves the yield and processing accuracy of locally reinforced flexible circuit board rolling pre-pressing processing, realizes adaptive adjustment of the processing process, eliminates the need for repeated manual parameter adjustments, and also improves the overall processing efficiency.

[0022] Specifically, the conveying and positioning mechanism includes two sets of conveying rollers arranged along the conveying direction. The flexible circuit board is placed between the two sets of conveying rollers, which can drive the flexible circuit board to move along the conveying direction. A positioning block and a positioning suction cup are provided at the processing station. The positioning block is used to axially limit the flexible circuit board, and the positioning suction cup is set at the position corresponding to the processing station on the work base to adsorb and fix the flexible circuit board, preventing displacement during the rolling process. The rolling pre-pressing mechanism includes a rolling drive cylinder, a heating roller, and a pressure sensor. The cylinder body of the rolling drive cylinder is fixed to the frame, and the piston rod of the rolling drive cylinder is connected to the roller seat of the heating roller. The pressure sensor is set at the connection position between the piston rod and the roller seat to detect the actual pressure applied to the flexible circuit board by the heating roller during the rolling process. An electric heating wire and a temperature sensor are embedded inside the heating roller. The temperature sensor is used to detect the actual working temperature of the heating roller, and the electric heating wire is used to heat the heating roller to preheat and soften the adhesive during the rolling process, improving the bonding effect. The acquisition module includes a pressure acquisition unit and a temperature acquisition unit located at the heating roller, as well as a thickness detection unit and an image acquisition unit located downstream of the processing station. The thickness detection unit uses a laser thickness sensor to detect the thickness of the preset reinforcement area after rolling, and the image acquisition unit uses an industrial camera to capture images of the bonding appearance.

[0023] In some specific embodiments of this application, the adjustment module includes: The pressure judgment unit is used to compare the pressure value with a preset target pressure range, and determine whether to adjust the output pressure of the rolling pre-compression mechanism based on the comparison result; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, the output pressure is adjusted according to the thickness value. The temperature judgment unit is used to compare the temperature value with a preset target temperature range, and determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result; if it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, the heating temperature is adjusted according to the bonding appearance image.

[0024] Understandably, by using pressure and temperature judgment units to specifically adjust the output pressure and heating temperature, the real-time collected process parameters and actual processing feedback can be combined to achieve precise adjustment of pressure and temperature, avoiding control deviations caused by adjusting a single parameter, and ensuring that the bonding quality after rolling pre-pressing meets the requirements.

[0025] Specifically, when setting the preset target pressure range and target temperature range, the upper and lower limit thresholds of pressure and temperature should first be determined based on the recommended parameters in the equipment's technical specifications, process requirements, or instruction manual.

[0026] Furthermore, for the target pressure range, it is necessary to consider the system's operating characteristics, such as the pressure fluctuation range during normal operation, the safe pressure limit, and the impact of load changes on pressure, to ensure that the set value meets the requirements for efficient equipment operation while avoiding the risk of failure due to excessively high or low pressure. Similarly, for the target temperature range, the optimal operating temperature range of the equipment, changes in ambient temperature, heat dissipation conditions, and the temperature sensitivity of materials or media must be considered. An upper limit should be reasonably set to prevent overheating and damage to components, while a lower limit should be set to ensure stable process reactions or equipment performance.

[0027] In actual operation, the pressure and temperature parameter setting interfaces can be accessed sequentially through the equipment's control panel or related management software. The preset minimum and maximum values ​​can be accurately entered. After completion, a trial run monitoring should be conducted to observe whether the pressure and temperature can be stably controlled within the set range. If any abnormalities are found, the parameters should be adjusted in a timely manner until they meet the expected requirements.

[0028] In some specific embodiments of this application, when the pressure judgment unit compares the pressure value with a preset target pressure range and determines whether to adjust the output pressure of the rolling preload mechanism based on the comparison result, it includes: The pressure values ​​at multiple points during the roll forming and pre-compression process of the flexible circuit board are obtained, and the average pressure value of the multiple pressure values ​​is calculated. If the average pressure is within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism will not be adjusted. If the average pressure is not within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism should be adjusted.

[0029] Understandably, by calculating the average pressure value at multiple points, the random errors that exist in single-point pressure detection can be avoided, making the pressure detection results more consistent with the actual pressure situation during the rolling preloading process, improving the accuracy of pressure adjustment judgment, avoiding unnecessary adjustments caused by single detection errors, and ensuring the stability of output pressure.

[0030] In some specific embodiments of this application, when it is determined that the output pressure of the rolling preloading mechanism needs to be adjusted, adjusting the output pressure according to the thickness value includes: After obtaining the thickness values ​​of several points in the preset reinforcement area of ​​the roll-formed pre-stressed reinforcing plate, calculate the average thickness value of the thickness values ​​at several points; If the average thickness is not within the preset thickness range, the output pressure is adjusted according to the thickness deviation between the average thickness and the preset thickness range. If the average thickness is within the preset thickness range, then it is determined again that the output pressure will not be adjusted.

[0031] Understandably, by calculating the average thickness of multiple points in the reinforced area after rolling, the actual bonding thickness between the reinforcing plate and the flexible circuit board after pre-pressing can be directly reflected. By adjusting the output pressure in combination with the thickness deviation, the adjustment result can directly match the preset bonding thickness requirements, avoiding problems such as excessive bonding thickness or overpressure caused by unreasonable pressure, and further ensuring processing accuracy and bonding stability.

[0032] Specifically, the preset thickness range is calculated from the thickness of the reinforcing plate itself, the base thickness of the corresponding area of ​​the flexible circuit board, and the reserved thickness of the adhesive layer required by the process. The maximum value of the preset thickness range is the sum of the standard thickness of the reinforcing plate, the base thickness of the corresponding area of ​​the flexible circuit board, and the maximum allowable thickness of the adhesive layer. The minimum value of the preset thickness range is the sum of the standard thickness of the reinforcing plate, the base thickness of the corresponding area of ​​the flexible circuit board, and the minimum allowable thickness of the adhesive layer. It can be pre-adjusted according to the local reinforcement specifications of different flexible circuit boards to meet differentiated processing requirements.

[0033] In one specific embodiment of this application, the output pressure is directly proportional to the thickness deviation value. Specifically, when the average thickness is greater than the maximum value of the preset thickness range, the thickness deviation value is the difference between the average thickness and the maximum value of the preset thickness range. In this case, the output pressure needs to be increased to squeeze out excess adhesive through greater rolling pressure, thereby reducing the overall thickness after bonding and bringing it back to the preset thickness range. When the average thickness is less than the minimum value of the preset thickness range, the thickness deviation value is the difference between the minimum value of the preset thickness range and the average thickness. In this case, the output pressure needs to be reduced to avoid excessive adhesive extrusion due to excessive rolling pressure, ensuring that the bonding thickness meets the processing requirements.

[0034] In some specific embodiments of this application, adjusting the output pressure based on the thickness deviation between the average thickness and a preset thickness range includes: Calculate the thickness deviation between the average thickness and the center value of the preset thickness range; The pressure adjustment amount is calculated based on the preset pressure-thickness correction coefficient, and the pressure adjustment amount is equal to the thickness deviation value multiplied by the pressure-thickness correction coefficient; The output pressure of the rolling preload mechanism can be increased or decreased according to the pressure adjustment amount; When the average thickness is greater than the upper limit of the preset thickness range, the thickness deviation is positive, the pressure adjustment is positive, and the adjustment module controls the rolling pre-compression mechanism to increase the output pressure. When the average thickness is less than the lower limit of the preset thickness range, the thickness deviation value is negative, the pressure adjustment amount is negative, and the adjustment module controls the rolling pre-compression mechanism to reduce the output pressure.

[0035] Understandably, by calculating the pressure adjustment amount by combining the thickness deviation value with the preset correction coefficient, the output pressure can be precisely and quantitatively adjusted, avoiding deviations caused by manual experience adjustment. This makes the adjustment of the output pressure more suitable for the actual bonding thickness requirements, further improving the accuracy of processing parameter adjustment and the stability of bonding thickness.

[0036] Specifically, the pressure-thickness correction coefficient is jointly calibrated by the rigidity of the rolling pre-compression mechanism, the elastic modulus of the heating roller, and the nominal viscosity of the adhesive. For different models of rolling pre-compression devices and processed adhesives, the corresponding correction coefficients can be obtained in advance through calibration experiments and stored in the adjustment module to ensure the accuracy of the pressure adjustment calculation. In one specific embodiment, for an adhesive with a nominal viscosity of X Pa·s, a rolling pre-compression mechanism with a rigidity level of Y and a heating roller with an elastic modulus of Z MPa are used. The pressure-thickness correction coefficient K is obtained through multiple calibration experiments. When the average thickness detected exceeds the preset thickness upper limit M μm, the deviation value is +Δh μm. The calculated pressure adjustment amount is +K·Δh. The adjustment module directly controls the rolling pre-compression mechanism to increase the output pressure by the pressure value corresponding to K·Δh, which can quickly adjust the bonding thickness back to the preset range.

[0037] In some specific embodiments of this application, when the temperature judgment unit compares the temperature value with a preset target temperature range and determines whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result, it includes: Obtain temperature values ​​at multiple points during the rolling and pre-compression process of flexible circuit boards, and calculate the average temperature value at multiple points. If the average temperature is within the preset target temperature range, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. If the average temperature is not within the preset target temperature range, it is determined that the heating temperature of the rolling pre-compression mechanism should be adjusted.

[0038] Understandably, by calculating the average of temperature values ​​at multiple points, errors caused by local heat dissipation interference in single-point temperature detection can be effectively avoided, making the temperature detection results more consistent with the actual working temperature of the heating roller, improving the accuracy of temperature adjustment judgment, avoiding unnecessary temperature adjustments, and ensuring the stability of heating temperature during the rolling process.

[0039] In some specific embodiments of this application, adjusting the heating temperature based on the fit appearance image includes: Image recognition is performed on the fitted appearance image; If the average temperature is greater than the maximum value of the preset target temperature range, then the percentage of the overflow area at the edge of the reinforcing plate is extracted. If the average temperature is less than the minimum value of the preset target temperature range, then the percentage of the wrinkled area at the edge of the reinforcing plate is extracted. Adjust the heating temperature according to the preset threshold for the percentage of overflow area and the threshold for the percentage of wrinkled area.

[0040] Understandably, excessively high temperatures can cause the adhesive viscosity to drop too much, leading to adhesive overflow during rolling. Conversely, excessively low temperatures can cause the adhesive viscosity to be too high, resulting in bonding wrinkles after rolling. By extracting and analyzing the proportion of adhesive overflow area and the proportion of wrinkled area, the actual quality feedback of the bonding appearance can be transformed into a basis for temperature adjustment. This allows temperature adjustment to better meet the actual processing quality requirements and effectively reduce the occurrence of appearance defects such as adhesive overflow and wrinkles.

[0041] In specific adjustments, if the percentage of the extracted excess adhesive area exceeds the preset threshold for the percentage of the excess adhesive area, the rolling pre-pressing mechanism is controlled to lower the heating temperature, increase the viscosity of the adhesive, and reduce the amount of excess adhesive during the rolling process; if the percentage of the extracted wrinkled area exceeds the preset threshold for the percentage of the wrinkled area, the rolling pre-pressing mechanism is controlled to increase the heating temperature, lower the viscosity of the adhesive, improve the smoothness of the rolling bonding, and eliminate bonding wrinkles.

[0042] Furthermore, the setting of the threshold for the percentage of adhesive overflow area and the threshold for the percentage of wrinkled areas requires comprehensive consideration of factors such as product type, usage scenario, quality standards, and production process. For precision electronic components or consumer products with high appearance requirements, the threshold for the percentage of adhesive overflow area is usually set between 0.5% and 2% to ensure a clean product appearance and avoid affecting subsequent assembly or function. For structural components or industrial products with relatively low appearance requirements, this threshold can be appropriately relaxed to 3%-5%. The setting of the threshold for the percentage of wrinkled areas needs to be combined with material characteristics and product function. If it is a flexible material and good extensibility or fit needs to be guaranteed, the threshold is generally controlled between 1% and 3%. For rigid materials or non-appearance surfaces, the threshold can be adjusted to 4%-6% according to actual usage needs. At the same time, the setting of the thresholds for the percentage of adhesive overflow area and the percentage of wrinkled areas should also refer to industry general standards, specific requirements, and feasibility in the production process. Through preliminary test verification and data analysis, a reasonable threshold range that can meet quality requirements and ensure production efficiency should be determined, and continuous optimization and adjustment should be made based on feedback in actual production.

[0043] In some specific embodiments of this application, adjusting the heating temperature according to preset threshold values ​​for the percentage of overflow area and the percentage of wrinkled area includes: If the percentage of overflow area is greater than the preset threshold for overflow area, calculate the deviation value of the overflow area percentage from the preset threshold for overflow area, and adjust the heating temperature according to the deviation value of the overflow area percentage. If the percentage of overflow area is less than or equal to the preset threshold for the percentage of overflow area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is inversely proportional to the deviation value of the overflow area.

[0044] Understandably, the larger the deviation in the percentage of overflow area, the more severe the overflow problem is due to the current heating temperature being too high. Therefore, a greater temperature reduction is needed. Adjusting the temperature to match the actual severity of the overflow avoids excessive or insufficient temperature adjustments, allowing for more precise control of the overflow problem. The more the percentage of overflow area exceeds the threshold, the greater the temperature reduction. This not only quickly improves the overflow problem but also prevents subsequent wrinkling defects caused by excessive temperature reduction, ensuring the accuracy of temperature regulation.

[0045] In some specific embodiments of this application, when adjusting the heating temperature according to the preset threshold values ​​for the percentage of overflow area and the percentage value of wrinkled area, the method further includes: If the proportion of the wrinkled area is greater than a preset threshold for the proportion of the wrinkled area, calculate the deviation value of the wrinkled area proportion from the preset threshold for the proportion of the wrinkled area; adjust the heating temperature according to the wrinkled area proportion deviation value. If the proportion of the wrinkled area is less than or equal to the preset threshold for the proportion of the wrinkled area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is directly proportional to the deviation value of the fold ratio.

[0046] Understandably, the greater the deviation in the proportion of wrinkles, the more obvious the wrinkle problem is due to the current heating temperature being too low. The required temperature increase will also be greater. Matching the corresponding temperature increase according to the actual severity of the wrinkles can avoid the wrinkles not being eliminated due to insufficient temperature adjustment, or the glue overflow problem caused by excessive temperature increase. This further ensures the accuracy of temperature regulation and balances the prevention and control of both glue overflow and wrinkles.

[0047] On the other hand, see Figure 2 As shown, this application also provides a method for rolling and preloading flexible circuit boards with local reinforcement structures, applied to the aforementioned rolling and preloading device for flexible circuit boards with local reinforcement structures, comprising the following steps: S100. Real-time acquisition of process status parameters, including the pressure and temperature values ​​of the flexible circuit board during the rolling pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the rolling pre-pressing reinforcement plate. S200. Based on the comparison result between the process state parameters and the preset target parameter range, automatically adjust the output parameters of the rolling preloading mechanism; S300. Compare the pressure value with the preset target pressure range, and determine whether to adjust the output pressure of the rolling pre-compression mechanism based on the comparison result; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, then adjust the output pressure according to the thickness value. S400. Compare the temperature value with the preset target temperature range, and determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result; if it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, then adjust the heating temperature according to the bonding appearance image.

[0048] Understandably, by collecting multi-dimensional process status parameters in real time during the rolling pre-pressing process, and combining preset parameter ranges with actual processing quality feedback, the output pressure and heating temperature are automatically adjusted. Without frequent manual intervention of parameters, it can adapt to the processing needs of flexible circuit boards with different local reinforcement structures, solving the problem of unstable bonding quality caused by the lag and insufficient precision of manual parameter adjustment. It effectively improves the consistency and yield of rolling pre-pressing processing, and ensures the bonding strength and appearance quality of the local reinforcement area.

[0049] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program goods. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program goods embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0050] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program goods according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0051] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0052] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A flexible circuit board roll forming preloading device with a locally reinforced structure, characterized in that, include: A frame and a work platform, wherein the work platform is mounted on the frame and is used to support and fix the flexible circuit board to be processed; A conveying and positioning mechanism is mounted on the frame, and the conveying and positioning mechanism is used to convey and position the flexible circuit board at a preset processing station; A robotic arm is positioned above the processing station and is used to position and attach the reinforcing plate to the preset reinforcement area of ​​the flexible circuit board. A rolling pre-compression mechanism is located above the processing station. The rolling pre-compression mechanism is used to apply rolling pressure and rolling temperature to the flexible circuit board that has been positioned and attached to the reinforcing plate. The acquisition module is used to acquire process status parameters in real time. The process status parameters include the pressure and temperature values ​​of the flexible circuit board during the roll forming and pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the roll forming and pre-pressing reinforcement plate. The adjustment module is electrically connected to both the acquisition module and the rolling preloading mechanism. The adjustment module is used to automatically adjust the output parameters of the rolling preloading mechanism based on the comparison results between the process state parameters and the preset target parameter range.

2. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 1, characterized in that, The adjustment module includes: The pressure judgment unit is used to compare the pressure value with a preset target pressure range, and determine whether to adjust the output pressure of the rolling pre-compression mechanism based on the comparison result; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, the output pressure is adjusted according to the thickness value. The temperature judgment unit is used to compare the temperature value with a preset target temperature range, and determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result; if it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, the heating temperature is adjusted according to the bonding appearance image.

3. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 2, characterized in that, The pressure judgment unit is used to compare the pressure value with a preset target pressure range, and to determine whether to adjust the output pressure of the rolling preload mechanism based on the comparison result, including: The pressure values ​​at multiple points during the roll forming and pre-compression process of the flexible circuit board are obtained, and the average pressure value of the multiple pressure values ​​is calculated. If the average pressure is within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism will not be adjusted. If the average pressure is not within the preset target pressure range, it is determined that the output pressure of the rolling preload mechanism should be adjusted.

4. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 2, characterized in that, If it is determined that the output pressure of the rolling preloading mechanism needs to be adjusted, then adjusting the output pressure according to the thickness value includes: After obtaining the thickness values ​​of several points in the preset reinforcement area of ​​the roll-formed pre-stressed reinforcing plate, calculate the average thickness value of the thickness values ​​at several points; If the average thickness is not within the preset thickness range, the output pressure is adjusted according to the thickness deviation between the average thickness and the preset thickness range. If the average thickness is within the preset thickness range, then it is determined again that the output pressure will not be adjusted.

5. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 4, characterized in that, When adjusting the output pressure based on the thickness deviation between the average thickness and a preset thickness range, the following steps are included: Calculate the thickness deviation between the average thickness and the center value of the preset thickness range; The pressure adjustment amount is calculated based on the preset pressure-thickness correction coefficient, and the pressure adjustment amount is equal to the thickness deviation value multiplied by the pressure-thickness correction coefficient; The output pressure of the rolling preload mechanism can be increased or decreased according to the pressure adjustment amount; When the average thickness is greater than the upper limit of the preset thickness range, the thickness deviation is positive, the pressure adjustment is positive, and the adjustment module controls the rolling pre-compression mechanism to increase the output pressure. When the average thickness is less than the lower limit of the preset thickness range, the thickness deviation value is negative, the pressure adjustment amount is negative, and the adjustment module controls the rolling pre-compression mechanism to reduce the output pressure.

6. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 2, characterized in that, The temperature judgment unit is used to compare the temperature value with a preset target temperature range, and to determine whether to adjust the heating temperature of the rolling pre-pressing mechanism based on the comparison result, including: Obtain temperature values ​​at multiple points during the rolling and pre-compression process of flexible circuit boards, and calculate the average temperature value at multiple points. If the average temperature is within the preset target temperature range, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. If the average temperature is not within the preset target temperature range, it is determined that the heating temperature of the rolling pre-compression mechanism should be adjusted.

7. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 2, characterized in that, When adjusting the heating temperature according to the fit appearance image, the following steps are included: Image recognition is performed on the fitted appearance image; If the average temperature is greater than the maximum value of the preset target temperature range, then the percentage of the overflow area at the edge of the reinforcing plate is extracted. If the average temperature is less than the minimum value of the preset target temperature range, then the percentage of the wrinkled area at the edge of the reinforcing plate is extracted. Adjust the heating temperature according to the preset threshold for the percentage of overflow area and the threshold for the percentage of wrinkled area.

8. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 7, characterized in that, When adjusting the heating temperature according to the preset threshold values ​​for the percentage of overflow area and the percentage value of wrinkled area, the following steps are included: If the percentage of overflow area is greater than the preset threshold for overflow area, calculate the deviation value of the overflow area percentage from the preset threshold for overflow area, and adjust the heating temperature according to the deviation value of the overflow area percentage. If the percentage of overflow area is less than or equal to the preset threshold for the percentage of overflow area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is inversely proportional to the deviation value of the overflow area.

9. The flexible circuit board rolling preloading device with a locally reinforced structure according to claim 8, characterized in that, When adjusting the heating temperature according to the preset threshold values ​​for the percentage of overflow area and the percentage value of wrinkled area, the method further includes: If the proportion of the wrinkled area is greater than a preset threshold for the proportion of the wrinkled area, calculate the deviation value of the wrinkled area proportion from the preset threshold for the proportion of the wrinkled area; adjust the heating temperature according to the wrinkled area proportion deviation value. If the proportion of the wrinkled area is less than or equal to the preset threshold for the proportion of the wrinkled area, it is determined that the heating temperature of the rolling pre-pressing mechanism will not be adjusted. The adjusted heating temperature is directly proportional to the deviation value of the fold ratio.

10. A method for rolling preloading of flexible circuit boards with locally reinforced structures, applied to the rolling preloading apparatus for flexible circuit boards with locally reinforced structures as described in any one of claims 1-9, characterized in that, include: Real-time acquisition of process status parameters, including pressure and temperature values ​​of the flexible circuit board during the roll forming and pre-pressing process, as well as the thickness value and bonding appearance image of the preset reinforcement area after the roll forming and pre-pressing reinforcement plate. Based on the comparison results between the process state parameters and the preset target parameter range, the output parameters of the rolling preloading mechanism are automatically adjusted; The pressure value is compared with the preset target pressure range, and the comparison result determines whether the output pressure of the rolling pre-compression mechanism needs to be adjusted; if it is determined that the output pressure of the rolling pre-compression mechanism needs to be adjusted, the output pressure is adjusted according to the thickness value. The temperature value is compared with the preset target temperature range, and the heating temperature of the rolling pre-pressing mechanism is adjusted according to the comparison result. If it is determined that the heating temperature of the rolling pre-pressing mechanism should be adjusted, the heating temperature is adjusted according to the bonding appearance image.

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