Printed circuit board, method of manufacturing the same, and processing system for printed circuit board

Abstract

This application relates to the field of printed circuit board (PCB) manufacturing technology, and discloses a PCB and its manufacturing method, as well as a PCB processing system. The PCB manufacturing method includes: providing a processing board, the processing board including a first conductive layer, a second conductive layer, and an insulating layer, the first conductive layer having a first opening; disposing of a conductive material within the first opening, with a portion of the conductive material doped into the insulating layer; using a laser to ablate the insulating layer exposed by the first opening to obtain connecting openings formed in the insulating layer, and forming a conductive network on the inner wall of the connecting openings, the conductive network including a conductive carbon mesh and at least a portion of the conductive material; and electroplating the processing board through the conductive network to obtain an electroplated layer covering the conductive network. The PCB and its manufacturing method and the PCB processing system provided in this application are intended to solve the environmental pollution problems associated with traditional black hole processes and chemical copper plating processes.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a printed circuit board and its manufacturing method, and a printed circuit board processing system. Background Technology

[0002] In the field of printed circuit board (PCB) manufacturing, the hole metallization process is a key step in realizing interlayer electrical interconnection, which to some extent affects the quality of the finished PCB.

[0003] The current mainstream industry practice is to use a wet process system that combines black hole treatment with electroless copper plating for hole metallization. This technology activates the hole walls with chemical agents under acidic or alkaline conditions, followed by the deposition of an electroless copper layer as a substrate for subsequent electroplating. Although this process is highly mature, its technical principles dictate that it must rely on corrosive solutions (such as reducing agents like copper sulfate and formaldehyde) and strong acid / alkali media. The production process generates pollutants such as wastewater containing heavy metals and volatile organic compounds, posing environmental pollution problems. Summary of the Invention

[0004] This application provides a printed circuit board and its manufacturing method, as well as a printed circuit board processing system, to solve the environmental pollution problems associated with traditional black hole technology and chemical copper plating technology.

[0005] In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board, comprising: A processing board is provided, the processing board including a first conductive layer and a second conductive layer stacked together, and an insulating layer located between the first conductive layer and the second conductive layer, wherein the first conductive layer is provided with a first opening hole, the first opening hole exposing a portion of the insulating layer; A conductive material is disposed within the first window opening, and a portion of the conductive material is incorporated into the insulating layer. The insulating layer exposed by the first window is ablated using a laser to obtain a connection window formed in the insulating layer, and a conductive network is formed on the inner wall of the connection window. The conductive network includes a conductive carbon mesh formed by the insulating layer and at least a portion of the conductive material. Both the first conductive layer and the second conductive layer are connected to the conductive network. The processing plate is electroplated through the conductive network to obtain an electroplated layer covering the conductive network.

[0006] In some embodiments, conductive material is disposed within the first window opening by plasma sputtering or high-energy ion beam.

[0007] In some embodiments, the conductive material is deposited within the first window opening by plasma sputtering, wherein the vacuum level of the vacuum chamber is ≤5×10⁻⁶. -4 Pa, working gas is Ar and / or N2, working gas pressure is 0.3pa-2pa, sputtering power is 60W-150W.

[0008] In some embodiments, the conductive material is disposed within the first window opening using a high-energy ion beam, wherein the vacuum level of the vacuum chamber is ≤1×10⁻⁶. -3 Pa, working air pressure is 0.1pa-0.5pa, injected energy is 400eV-700eV, and pulse frequency is 100Hz-300Hz.

[0009] In some embodiments, the method of manufacturing the printed circuit board further includes, prior to providing the processing board: A substrate is provided, the processing board including a first conductive layer and a second conductive layer stacked thereon, and an insulating layer located between the first conductive layer and the second conductive layer; The first window is machined into the first conductive layer by mechanical milling or laser ablation to obtain the processing plate.

[0010] In some embodiments, the conductive material is one or more of gold, copper, iron, silver, nickel, nitrogen, phosphorus, and carbon; and / or, the laser is a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near-infrared laser.

[0011] In some embodiments, when the insulating layer exposed by the first window is ablated using a laser, a carbon-containing gas is introduced into the first window.

[0012] In some embodiments, the carbon-containing gas is CH4 or C2H2.

[0013] In some embodiments, when the insulating layer exposed by the first window is ablated using a laser, an anti-oxidation gas is introduced into the first window.

[0014] In some embodiments, the anti-oxidation gas is an inert gas and / or a reducing gas.

[0015] Secondly, embodiments of this application provide a printed circuit board processing system for performing the printed circuit board manufacturing method as described in the first aspect.

[0016] Thirdly, embodiments of this application provide a printed circuit board, which is manufactured by the printed circuit board manufacturing method described in the first aspect.

[0017] The printed circuit board manufacturing method provided in this application has the following advantages: Firstly, conductive material is placed inside the first window, with some of the conductive material incorporated into the insulating layer. Then, a laser is used to ablate the insulating layer exposed by the first window to obtain a connecting window formed in the insulating layer. This creates a conductive network on the inner wall of the connecting window. The conductive network includes a conductive carbon mesh formed from the insulating layer and at least some conductive material. Both the first and second conductive layers are connected to the conductive network. Therefore, the board can be electroplated using the conductive network to obtain an electroplated layer covering the conductive network. The printed circuit board manufacturing method provided in this application eliminates the use of chemical agents, avoids the generation of corrosive solutions and harmful gases, achieves green and environmentally friendly production, and solves the environmental pollution problems associated with traditional black hole processes and chemical copper plating processes.

[0018] The advantages of the printed circuit board processing system and the printed circuit board provided in this application compared with the prior art can be found in the description of the advantages of the printed circuit board manufacturing method provided in this application compared with the prior art, which will not be repeated here. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of a method for manufacturing a printed circuit board in one embodiment of this application. Figure 2 This is a schematic diagram of the substrate structure in one embodiment of this application; Figure 3 yes Figure 2 A schematic diagram of the structure of the processing plate formed from the substrate shown; Figure 4 Is Figure 3 A schematic diagram showing the conductive material disposed within the first window opening of the first conductive layer of the processing plate. Figure 5 It uses laser ablation Figure 4 A schematic diagram showing the insulation layer exposed by the first opening; Figure 6 pass Figure 5 The diagram shows a conductive network used for electroplating the processing board.

[0021] The markings in the diagram mean: 100. Processing board; 101. Substrate; 10. First conductive layer; 11. First window opening; 20. Second conductive layer; 21. Second window opening; 30. Insulation layer; 31. Connection window opening; 40. Conductive materials; 50. Conductive network; 60. Electroplating layer. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0023] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0026] In the field of printed circuit board (PCB) manufacturing, the hole metallization process is a key step in realizing interlayer electrical interconnection, which to some extent affects the quality of the finished PCB.

[0027] The current mainstream industry practice is to use a wet process system (a processing technology using liquid chemicals) that combines black hole treatment (a process of chemically treating the hole walls to form a conductive layer) with electroless copper plating (a process of depositing a copper layer on the hole walls through a chemical reduction reaction) for hole metallization. This technology activates the hole walls with chemical agents under acidic or alkaline conditions, and then deposits an electroless copper layer as a substrate for electroplating. Although this process is highly mature, its technical principles dictate that it must rely on corrosive solutions (such as reducing agents like copper sulfate and formaldehyde) and strong acid / alkali media. The production process generates pollutants such as wastewater containing heavy metals and volatile organic compounds, posing environmental pollution problems.

[0028] In view of this, this application provides a printed circuit board and its manufacturing method, as well as a printed circuit board processing system. By first placing conductive material within a first window opening, and partially incorporating the conductive material into an insulating layer, and then using a laser to ablate the insulating layer exposed by the first window opening, a connecting window opening formed in the insulating layer is obtained. This creates a conductive network on the inner wall of the connecting window opening. The conductive network includes a conductive carbon mesh formed from the insulating layer and at least a portion of the conductive material. Both the first and second conductive layers are connected to the conductive network. Therefore, the processed board can be electroplated using the conductive network to obtain an electroplated layer covering the conductive network. The printed circuit board manufacturing method provided in this application eliminates the use of chemical agents, avoids the generation of corrosive solutions and harmful gases, achieves green and environmentally friendly production, and solves the environmental pollution problems associated with traditional black hole processes and chemical copper plating processes.

[0029] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0030] Please refer to Figures 1 to 3 In a first aspect, embodiments of this application provide a method for manufacturing a printed circuit board, comprising: S100: A processing board 100 is provided. The processing board 100 includes a first conductive layer 10 and a second conductive layer 20 stacked together, and an insulating layer 30 located between the first conductive layer 10 and the second conductive layer 20. The first conductive layer 10 is provided with a first opening 11, and the first opening 11 exposes a portion of the insulating layer 30.

[0031] The first conductive layer 10 can be made of copper, gold, silver, tin, nickel, etc. The second conductive layer 20 can also be made of copper, gold, silver, tin, nickel, etc. The insulating layer 30, as a non-conductive material that isolates different conductive layers, can include flexible substrates, flexible stretchable substrates, or rigid substrates, such as PET (Polyethylene terephthalate), PVC (Polyvinyl chloride), PP (Polypropylene), PI (Polyimide), TPI (Thermoplastic polyimide), PTFE (Polytetrafluoroethylene), etc.

[0032] It is understood that one or more first window openings 11 may be provided. A substrate 101 having a first conductive layer 10, a second conductive layer 20 and an insulating layer 30 can be provided, and the first window openings 11 can be processed on the first conductive layer 10 by mechanical milling or laser ablation to obtain a processing board 100, thereby making it relatively convenient to process the processing board 100.

[0033] S200: Please refer to this as well. Figure 4 Conductive material 40 is disposed in the first window 11, and part of the conductive material 40 is incorporated into the insulating layer 30.

[0034] Conductive material 40 can be deposited within the first window 11 via plasma sputtering or high-energy ion beam deposition. Upon high-speed collision with the insulating layer 30, the conductive material 40 will become doped into its surface and interior, physically modifying the insulating layer 30. This modification of the insulating layer 30's structure cannot be achieved through coating, chemical vapor deposition, evaporation, or spraying processes. The conductive material 40 can be one or more of gold, copper, iron, silver, nickel, nitrogen, phosphorus, and carbon. The material of the conductive material 40 can be selected from different metals or non-metals depending on the conductivity requirements.

[0035] It should be noted that the material selection of conductive material 40 can be determined according to the target conductivity requirements, among which copper is preferred due to its compatibility with subsequent electroplating processes.

[0036] Understandably, since the insulating layer 30 is an organic material with lower hardness and density than the conductive layer, the conductive material 40 will be doped into it, creating a microstructure. Because the first conductive layer 10 and the second conductive layer 20 have high density and hardness, the conductive material 40 will essentially only form a conductive thin film for both layers.

[0037] S300: Please refer to this as well. Figure 5A laser is used to ablate the insulating layer 30 exposed by the first opening 11 to obtain a connection opening 31 formed in the insulating layer 30, and to form a conductive network 50 on the inner wall of the connection opening 31. The conductive network 50 includes a conductive carbon mesh formed by the insulating layer 30 and at least a portion of the conductive material 40. The first conductive layer 10 and the second conductive layer 20 are both connected to the conductive network 50.

[0038] The laser can be a laser of various wavelengths, such as a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near-infrared laser. Under the laser's action, the conductive material 40 doped within the insulating layer 30 undergoes a violent photothermal effect with the insulating layer 30. The H (hydrogen), O (oxygen), and N (nitrogen) elements of the organic matter in the insulating layer 30 are released in vapor form, leaving the carbon elements of the insulating layer 30 and the conductive material 40. The remaining carbon elements form a conductive carbon mesh, and the remaining conductive material 40 combines with the conductive carbon mesh to form a porous conductive network 50, thus completing the laser-activated porous conductive network 50. The conductive material 40 in the insulating layer 30 can serve as a catalyst layer for laser activation, thereby ensuring that the conductive network 50 has good conductivity and meets the requirements of subsequent electroplating.

[0039] Understandably, in order for the insulating layer 30 to form a conductive carbon mesh, the energy density of the laser emitted by the laser needs to reach a specific threshold.

[0040] It should be noted that the laser scanning path of the laser can be planned according to the three-dimensional shape of the hole wall of the connecting window 31 to ensure that each area inside the connecting window 31 receives uniform energy input.

[0041] It should also be noted that if the conductive material 40 is not placed in the first window 11 beforehand, so that some of the conductive material 40 is incorporated into the insulating layer 30, and the insulating layer 30 exposed by the first window 11 is directly ablated by a laser, it will be difficult to form a continuous conductive network as the conductive network 50 due to the low carbon conversion rate, which will fail to meet the stringent requirements of the substrate conductivity for subsequent electroplating processes. The printed circuit board manufacturing method provided in this application improves the generation efficiency of the porous conductive network 50 to a threshold level that meets the requirements of electroplating by first placing the conductive material 40 in the first window 11, so that some of the conductive material 40 is incorporated into the insulating layer 30, and then using a laser to ablate the insulating layer 30 exposed by the first window 11.

[0042] It is understandable that the first window 11 and the connecting window 31 can form a micro-blind hole, with a conductive network 50 provided on the bottom and side walls of the micro-blind hole. Alternatively, the laser can simultaneously ablate the second conductive layer 20 to obtain a second window 21 formed on the second conductive layer 20, with the first window 11, connecting window 31, and second window 21 forming a through hole. When multiple first window 11s and multiple connecting window 31s are provided, some of the first window 11s and some of the connecting window 31s correspond one-to-one to form blind holes, with conductive networks 50 provided on the side walls of the connecting window 31s and the bottom walls of the blind holes. Some of the first window 11s, some of the connecting window 31s, and multiple second window 21s correspond one-to-one to form through holes, with conductive networks 50 provided on the side walls of the connecting window 31s.

[0043] S400: Please refer to this as well. Figure 6 Electroplating is performed on the processing plate 100 through the conductive network 50 to obtain an electroplated layer 60 covering the conductive network 50.

[0044] Since both the first conductive layer 10 and the second conductive layer 20 are connected to the conductive network 50, they are electrically connected through the conductive network 50. The electroplated layer 60 can fill the first window 11, connect the window 31 and the second window 21, and partially cover the first conductive layer 10 and / or the second conductive layer 20. The first conductive layer 10 and the second conductive layer 20 are electrically connected through the conductive network 50 and the electroplated layer 60. The conductive network 50 and the electroplated layer 60 successfully bridge the conductive lines between the first conductive layer 10 and the second conductive layer 20, realizing interlayer electrical interconnection. Especially in high-density interconnection structures, it can reliably complete the metallization of micro-blind vias and through-holes, thereby constructing a complete, low-impedance three-dimensional conductive network 50, providing a solid foundation for subsequent pattern electroplating and final circuit functionality.

[0045] As can be seen from the above, the printed circuit board manufacturing method provided in this application embodiment first sets a conductive material 40 in the first window 11, and part of the conductive material 40 is doped into the insulating layer 30. Then, a laser is used to ablate the insulating layer 30 exposed by the first window 11 to obtain a connection window 31 formed in the insulating layer 30, and a conductive network 50 is formed on the inner wall of the connection window 31. The conductive network 50 includes a conductive carbon mesh formed by the insulating layer 30 and at least part of the conductive material 40. The first conductive layer 10 and the second conductive layer 20 are both connected to the conductive network 50. Therefore, the processing board 100 can be electroplated through the conductive network 50 to obtain an electroplated layer 60 covering the conductive network 50. The printed circuit board manufacturing method provided in this application embodiment eliminates the use of chemical agents, avoids the generation of corrosive solutions and harmful gases, realizes green and environmentally friendly production, and solves the environmental pollution problems of traditional black hole process and chemical copper plating process.

[0046] The printed circuit board manufacturing method provided in this application addresses the dependence of chemical copper plating on strong acid / alkali media. By using laser activation of the porous conductive network 50 in synergy with physical modification, the porous conductive network 50 is directly constructed within the connection openings 31 of the insulating layer 30. This eliminates the need for corrosive chemical agents and avoids the use of liquid chemical reagents or aqueous solutions in material processing or manufacturing technology. It also avoids the generation of corrosive solutions and harmful gases, achieving a dry process for hole metallization. This green manufacturing process completes the pretreatment for hole metallization, enabling green and environmentally friendly production. At the same time, it completely replaces the traditional black hole and chemical copper deposition processes, reducing the number of manufacturing steps for printed circuit boards, significantly improving production efficiency, and solving the technical problems of environmental pollution and complex processes associated with traditional black hole and chemical copper plating processes.

[0047] Please refer to Figure 4 In some embodiments, conductive material 40 is disposed within the first window 11 by plasma sputtering or high-energy ion beam.

[0048] By adopting the above scheme, some conductive material 40 can be doped into the insulating layer 30, while the surface of the insulating layer 30 is made to have nanoscale roughness and microstructure (such as microcrystals, microcracks, and porous networks). This structure significantly enhances the light absorption rate of the insulating layer 30 doped with conductive material 40 by 15%-50% through the synergistic mechanism of extending the optical path, optimizing light absorption, and constructing "light traps". This can effectively improve the drilling quality and efficiency of laser on the insulating layer 30 and the second conductive layer 20.

[0049] When modifying the insulating layer 30 by placing conductive material 40 inside the first window 11 through plasma sputtering, high-purity copper plates or similar materials can be used as the target material. The vacuum degree of the plasma sputtering equipment is ≤5×10⁻⁶. -4 The working gas is Ar and / or N2, with a working pressure of 0.3 Pa to 2 Pa. Lower pressures (e.g., 0.3 Pa to 1 Pa) are beneficial for increasing the density of the conductive material 40 film, while slightly higher pressures (1 Pa to 2 Pa) can enhance plasma density and improve the uniformity of coverage on the inner wall of the connecting window 31. The plasma sputtering power is 60 W to 150 W, adjusted according to the aperture and depth of the first window 11 and the thickness of the deposited conductive material 40. The distance between the target and the processing board 100 (50 mm to 80 mm) and the sputtering time will also be adjusted according to specific circumstances.

[0050] When using a high-energy plasma beam (a high-energy ion stream used for material modification and doping) to place conductive material 40 within the first window 11 to modify the insulating layer 30, the generated high-ionization copper (Cu) plasma, under sample bias, can achieve more directional deposition, significantly improving the coverage of the bottom and sidewalls of the connecting window 31. The vacuum level of the high-energy plasma beam equipment is ≤1×10⁻⁶. -3 The working pressure is 0.1 Pa to 0.5 Pa, and the injection energy is 400 eV to 700 eV. Low-energy activated copper ions cannot overcome the surface barrier to enter the lattice of the insulating layer 30 and will only adsorb on its surface. High-energy activated copper ions will subsequently embed into the conductive carbon network (LIG, Laser-Induced Graphene) formed by the insulating layer 30, and can be better combined to form a conductive network 50. The pulse frequency of the high-energy plasma beam is 100 Hz to 300 Hz to control the interval of copper ion injection. Its sputtering time can be adjusted according to different actual conditions.

[0051] Optionally, the conductive material 40 is made of one or more of the following: gold (Au), copper (Cu), iron (Fe), silver (Ag), nickel (Ni), nitrogen (N), phosphorus (P), and carbon (C).

[0052] This configuration allows the conductive material 40 to be incorporated into the surface and interior of the insulating layer 30 after high-speed collision with it, thereby altering the microstructure of the insulating layer 30 and improving its light absorption rate for laser light.

[0053] It should be noted that the conductive material 40 not only improves the utilization rate of laser energy, but also, when the conductive material 40 is made of metal, can act as a metal catalyst, reducing the activation energy of the porous conductive network 50.

[0054] Please refer to Figure 5 In some embodiments, the laser is a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near-infrared laser.

[0055] By adopting the above scheme, a connection opening 31 formed in the insulating layer 30 can be obtained, and a conductive network 50 can be formed on the inner wall of the connection opening 31.

[0056] It is understandable that lasers of all wavelengths can activate porous conductive networks, but the conversion efficiency varies.

[0057] It should be noted that the process of ablating the insulating layer 30 exposed by the first window 11 using a laser can be considered as the laser activation stage. This stage primarily utilizes lasers of various wavelengths as the main energy source. When using a carbon dioxide (CO2) laser, its wavelength range can be 10.6 μm. Because its laser effect is mainly photothermal rather than laser ablation, the laser energy density needs to reach the threshold for activating the porous conductive network 50. Controlled pyrolysis is achieved by precisely controlling the laser spot diameter, scanning speed, and power parameters. Precise control of the laser energy density ensures the quality of the porous conductive network 50 formation, providing a reliable foundation for subsequent electroplating processes.

[0058] For laser parameter optimization, a model can be established to correlate energy density with the conversion rate of the porous conductive network 50. Insufficient energy density will lead to incomplete carbonization, while excessive energy density will cause excessive ablation of the insulating layer 30. The optimal energy density window for a specific insulating layer 30 is determined experimentally; this parameter is a function of the insulating layer 30 thickness, thermal conductivity, and laser absorptivity. A multi-pass overlapping scanning strategy can be adopted, with the first pass primarily activating the surface of the insulating layer 30 and the subsequent passes achieving the directional growth of the porous conductive network 50.

[0059] Among these methods, the synergistic effect of plasma doping concentration and laser process parameters is adjusted to control the 50 lattice defect density and sp50 of the porous conductive network. 2 The proportion of hybrid carbon (conductive graphitic carbon). Doping of high-concentration conductive metallic materials 40 with conductive carbon mesh can form a nanoscale metal particle-porous conductive network 50 composite network, significantly improving interlayer conductivity.

[0060] For example, when the spot size of the CO2 laser emitted by a carbon dioxide laser is set to 50μm-100μm, the laser power to 10-15W, and the laser scanning speed to 300mm / s-500mm / s, its frequency is 20kHz-25kHz. If an ultraviolet laser is used as the main energy source, when the spot size of the ultraviolet laser is set to 10μm-50μm, the laser power to 2W-4W, and the laser scanning speed to 100mm / s-400mm / s, the frequency is 100kHz-200kHz. Furthermore, lasers of different wavelengths, such as blue light emitted by a blue laser (wavelength 455nm), green light emitted by a green laser (wavelength 532nm), and near-infrared light emitted by a near-infrared laser (wavelength 1064nm), can activate different insulating layers 30 to obtain connection openings 31 formed in the insulating layer 30, and to form a conductive network 50 on the inner wall of the connection openings 31.

[0061] Optionally, when using a laser to ablate the insulating layer 30 exposed by the first window 11, a carbon-containing gas is introduced into the first window 11.

[0062] This setup allows carbon-containing gas to decompose into active carbon atoms under the high temperature of the laser, providing an active carbon source to replenish the forming conductive network 50, promoting the growth of the porous conductive network 50, increasing the yield of the conductive network 50, and making the conductive network 50 more continuous, denser, and more conductive.

[0063] It is understandable that carbon-containing components in a carbon-containing gas environment undergo pyrolysis under laser pyrolysis, and the resulting active carbon atoms insert into the lattice of the porous conductive network 50, improving the connectivity of its three-dimensional conductive network 50.

[0064] As a possible implementation method, the carbon-containing gas is CH4 or C2H2.

[0065] This setup allows carbon-containing gases to decompose into active carbon atoms under the high temperature of a laser.

[0066] Optionally, when using a laser to ablate the insulating layer 30 exposed by the first window 11, an anti-oxidation gas is introduced into the first window 11.

[0067] This design prevents the carbon elements in the insulating layer 30 from being oxidized and burned into carbon dioxide when they encounter oxygen at high temperatures, thus preventing the formation of the conductive network 50.

[0068] As a possible approach, the anti-oxidation gas can be an inert gas and / or a reducing gas.

[0069] This design better prevents the carbon elements in the insulation layer 30 from being oxidized at high temperatures.

[0070] It should be noted that the composite gas environment design, which combines inert gas protection with reducing reactive gas regulation, effectively suppresses oxidation side reactions during laser processing, solving the process control challenge of simultaneously achieving uniformity and stability of the conductive network 50. The carbon-containing gas, inert gas protection, and reducing reactive gas can also be used as cooling gases to adjust the heat conduction rate and control the reaction temperature field when the laser ablates the insulating layer 30 exposed by the first window 11. The different types and ratios of carbon-containing gas, inert gas, and reducing reactive gas can be adjusted according to specific process conditions.

[0071] For example, the inert gas can be Ar, N2, etc. The reducing gas can be H2, NH3, etc.

[0072] The printed circuit board manufacturing method provided in this application involves using high-energy-density laser irradiation to induce a carbonization reaction on the surface of the insulating layer 30, generating a conductive carbon mesh. Simultaneously, plasma doping or gas-assisted techniques are combined to enhance the conversion rate and conductivity of the porous conductive network 50, ultimately forming a conductive network 50 that can be directly electroplated. This method completely abandons traditional wet chemical processes, achieving a dry process for hole metallization. Furthermore, it integrates and innovates technologies, organically combining independent technologies such as laser processing and plasma treatment, and systematically combining laser-activated carbon mesh technology with material modification technology, achieving synergistic effects in the field of printed circuit boards.

[0073] Compared with traditional processes, this application innovatively integrates plasma doping technology with laser-activated carbon mesh. The plasma pretreatment not only improves the utilization rate of laser energy, but also reduces the activation energy of the porous conductive network 50 by introducing a metal catalyst. Meanwhile, the precise matching of laser parameters and gas environment ensures the controllability of the quality of the porous conductive network 50. The synergistic effect of the two technologies improves the conversion efficiency of the insulating layer 30 to the conductive network 50 to the industrial-grade requirements that allow for direct electroplating.

[0074] Secondly, embodiments of this application provide a printed circuit board processing system for performing the printed circuit board manufacturing method as described in the first aspect.

[0075] The printed circuit board processing system provided in this application embodiment first places a conductive material 40 inside the first window 11, with some of the conductive material 40 incorporated into the insulating layer 30. Then, a laser is used to ablate the insulating layer 30 exposed by the first window 11 to obtain a connection window 31 formed in the insulating layer 30. This results in a conductive network 50 forming on the inner wall of the connection window 31. The conductive network 50 includes a conductive carbon mesh formed by the insulating layer 30 and at least some of the conductive material 40. Both the first conductive layer 10 and the second conductive layer 20 are connected to the conductive network 50. Therefore, the processing board 100 can be electroplated through the conductive network 50 to obtain an electroplated layer 60 covering the conductive network 50. The printed circuit board manufacturing method provided in this application embodiment eliminates the use of chemical agents, avoids the generation of corrosive solutions and harmful gases, achieves green and environmentally friendly production, and solves the environmental pollution problems of traditional black hole processes and chemical copper plating processes.

[0076] Thirdly, embodiments of this application provide a printed circuit board, which is manufactured by the printed circuit board manufacturing method of the first aspect.

[0077] The printed circuit board provided in this application embodiment first places a conductive material 40 inside the first window 11 during manufacturing. Part of the conductive material 40 is incorporated into the insulating layer 30. Then, a laser is used to ablate the insulating layer 30 exposed by the first window 11, resulting in a connection window 31 formed in the insulating layer 30. This forms a conductive network 50 on the inner wall of the connection window 31. The conductive network 50 includes a conductive carbon mesh formed from the insulating layer 30 and at least part of the conductive material 40. Both the first conductive layer 10 and the second conductive layer 20 are connected to the conductive network 50. Therefore, the processing board 100 can be electroplated using the conductive network 50 to obtain an electroplated layer 60 covering the conductive network 50. The printed circuit board manufacturing method provided in this application embodiment eliminates the use of chemical agents, avoids the generation of corrosive solutions and harmful gases, achieves green and environmentally friendly production, and solves the environmental pollution problems associated with traditional black hole processes and chemical copper plating processes.

[0078] It should be noted that the printed circuit board provided in this application embodiment serves as a support for electronic components and a carrier for electrical connections, and can be a rigid board or a flexible board.

[0079] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that, include: A processing board is provided, the processing board including a first conductive layer and a second conductive layer stacked together, and an insulating layer located between the first conductive layer and the second conductive layer, wherein the first conductive layer is provided with a first opening hole, the first opening hole exposing a portion of the insulating layer; A conductive material is disposed within the first window opening, and a portion of the conductive material is incorporated into the insulating layer. The insulating layer exposed by the first window is ablated using a laser to obtain a connection window formed in the insulating layer, and a conductive network is formed on the inner wall of the connection window. The conductive network includes a conductive carbon mesh formed by the insulating layer and at least a portion of the conductive material. Both the first conductive layer and the second conductive layer are connected to the conductive network. The processing plate is electroplated through the conductive network to obtain an electroplated layer covering the conductive network.

2. The method for manufacturing a printed circuit board according to claim 1, characterized in that, Conductive material is deposited in the first window opening by plasma sputtering or high-energy ion beam.

3. The method for manufacturing a printed circuit board according to claim 2, characterized in that, The conductive material is deposited within the first window opening by plasma sputtering, wherein the vacuum level of the vacuum chamber is ≤5×10⁻⁶. -4 Pa, working gas is Ar and / or N2, working gas pressure is 0.3pa-2pa, sputtering power is 60W-150W.

4. The method for manufacturing a printed circuit board according to claim 2, characterized in that, The conductive material is deposited within the first window opening using a high-energy ion beam, wherein the vacuum level of the vacuum chamber is ≤1×10⁻⁶. -3 Pa, working air pressure is 0.1pa-0.5pa, injected energy is 400eV-700eV, and pulse frequency is 100Hz-300Hz.

5. The method for manufacturing a printed circuit board according to claim 1, characterized in that, Before providing the processing board, the method for manufacturing the printed circuit board further includes: A substrate is provided, the processing board including a first conductive layer and a second conductive layer stacked thereon, and an insulating layer located between the first conductive layer and the second conductive layer; The first window is machined into the first conductive layer by mechanical milling or laser ablation to obtain the processing plate.

6. The method for manufacturing a printed circuit board according to claim 1, characterized in that, The conductive material is one or more of gold, copper, iron, silver, nickel, nitrogen, phosphorus, and carbon; and / or the laser is a carbon dioxide laser, an ultraviolet laser, a blue laser, a green laser, or a near-infrared laser.

7. The method for manufacturing a printed circuit board according to any one of claims 1 to 6, characterized in that, When the insulating layer exposed by the first window is ablated using a laser, a carbon-containing gas is introduced into the first window.

8. The method for manufacturing a printed circuit board according to claim 7, characterized in that, The carbon-containing gas is CH4 or C2H2.

9. The method for manufacturing a printed circuit board according to any one of claims 1 to 6, characterized in that, When the insulating layer exposed by the first window is ablated using a laser, an anti-oxidation gas is introduced into the first window.

10. The method for manufacturing a printed circuit board according to claim 9, characterized in that, The anti-oxidation gas is an inert gas and / or a reducing gas.

11. A processing system for printed circuit boards, characterized in that, The printed circuit board processing system is used to perform the printed circuit board manufacturing method as described in any one of claims 1 to 10.

12. A printed circuit board, characterized in that, The printed circuit board is manufactured by the method for manufacturing a printed circuit board as described in any one of claims 1 to 10.

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