PCB board conveying control method and system based on adaptive adjustment

By using an adaptive PCB board transfer control method and system, clamping parameters are adjusted in real time, solving the problems of production interruption and board stability in existing technologies. This enables flexible production and intelligent transfer, improving the automation level of the PCB manufacturing process.

CN122395819APending Publication Date: 2026-07-14ACCUTECH SHENZHEN CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ACCUTECH SHENZHEN CO LTD
Filing Date
2026-04-13
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

Existing PCB board conveying devices require manual adjustment when changing product models, leading to production interruptions, high labor costs, and an inability to coordinate clamping force and height in real time. Thick boards are prone to sag or warp during high-speed conveying, and the devices lack intelligent and flexible production capabilities.

Method used

By acquiring the board shape parameters of the PCB board, the initial clamping parameters are calculated using a preset anti-slip-anti-warping mapping model. Combined with force sensors and vision sensors, the clamping width, force, and height are adjusted in real time to achieve dynamic compensation and build an adaptive adjustment transmission control system.

Benefits of technology

It enables rapid adaptive settings for PCB boards of different specifications, improves the stability of thick boards during high-speed vertical transport, avoids board damage, reduces production costs, and enhances flexible production capabilities and intelligence.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of automatic equipment manufacturing, in particular to a PCB conveying control method and system based on adaptive adjustment. The method comprises the following steps: obtaining the board type parameters of a PCB to be conveyed; obtaining initial clamping width setting values, initial clamping force setting values and initial clamping height setting values through a preset anti-slip and anti-warp mapping model based on the board thickness and the theoretical weight; controlling a vertical conveying mechanism to be positioned according to the initial clamping width setting values and the initial clamping height setting values, and clamping the PCB to be conveyed according to the initial clamping force setting values; in the conveying process, real-time acquisition of actual clamping force distribution data, and edge position and attitude angle data of the PCB to be conveyed; real-time cooperative closed-loop adjustment of the clamping width, the clamping force and the clamping height according to the actual clamping force distribution data and the edge position and attitude angle data of the PCB to be conveyed, and dynamic compensation of state deviations generated in the conveying process.
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Description

Technical Field

[0001] This application relates to the field of automated equipment manufacturing technology, and more specifically, to a PCB board conveying device and system based on adaptive adjustment. Background Technology

[0002] In the manufacturing and assembly lines of printed circuit boards (PCBs), vertical conveyor equipment is used to efficiently transfer boards between different workstations or floors. Existing technologies generally use conveyor wheels or pneumatic clamps with fixed spacing. This design can only be adapted to a single specification of PCB. When the product model is changed, the machine must be stopped and the mechanical structure must be manually adjusted, resulting in production interruption, long changeover time, high labor costs, and poor accuracy of manual adjustment. It is also very easy to cause scratches, microcracks or warping deformation of the board due to uneven force when clamping high-value, thick PCBs.

[0003] Currently, some adjustable-width PCB conveying devices have appeared on the market. However, in existing technologies, the adjustment is mostly unidirectional, only adjusting the width, without considering the coordination of clamping force and height. Thick boards are prone to falling or warping due to their own weight and inertia. They lack real-time feedback and dynamic adjustment capabilities, cannot cope with vibration and slippage during high-speed conveying, have low intelligence, and cannot be integrated with the production line information system to achieve flexible production.

[0004] Therefore, there is an urgent need to develop an intelligent conveying solution that can automatically adapt to different plate types and ensure the absolute stability of thick plates during high-speed vertical conveying. Summary of the Invention

[0005] In view of this, in order to solve the above-mentioned problems in the prior art, this application provides a PCB board conveying control method and system based on adaptive adjustment.

[0006] The embodiments of this application are implemented as follows: In a first aspect, this application provides a PCB board conveying control method based on adaptive adjustment, comprising: Obtain the board type parameters of the PCB board to be transmitted, wherein the board type parameters include at least the board thickness, width and theoretical weight; Based on the thickness and theoretical weight of the plate, the initial clamping width setting, initial clamping force setting, and initial clamping height setting are obtained through a preset anti-slip-anti-warping mapping model. The vertical conveying mechanism is positioned according to the initial clamping width setting value and the initial clamping height setting value, and clamps the PCB board to be conveyed according to the initial clamping force setting value. During the transfer process, the actual clamping force distribution data fed back by the force sensor and the edge position and attitude angle data of the PCB board to be transferred fed back by the vision sensor are acquired in real time. Based on the actual clamping force distribution data and the edge position and attitude angle data of the PCB board to be transferred, the clamping width, clamping force and clamping height are adjusted in real time in a closed loop to dynamically compensate for the state deviation generated during the transfer process.

[0007] In one possible implementation, the specific construction of the preset anti-slip-anti-warping mapping model includes: For standard PCB samples of different thicknesses, transfer tests were conducted under various combinations of clamping width, clamping height and clamping force to obtain critical data points that lead to slippage or warping. Based on the critical data points of slippage or warping, surface fitting is performed to form an anti-slippage-anti-warping mapping model with plate thickness and weight as input and safety clamping parameter range as output.

[0008] In one possible implementation, the step of performing real-time coordinated closed-loop adjustment of the clamping width, clamping force, and clamping height based on the actual clamping force distribution data further includes: Calculate the actual clamping force difference between the two clamping arms; If the force difference value continues to exceed the first set threshold, it is determined that the PCB has a risk of unilateral warping. At this time, the clamping height is controlled to be adaptively adjusted: the clamping force on the side with greater force is reduced, and the clamping height on both sides is adjusted simultaneously to apply a reverse corrective torque.

[0009] In one possible implementation, the step of real-time coordinated closed-loop adjustment of the clamping width, clamping force, and clamping height based on the edge position and attitude angle data of the PCB board to be transferred further includes: Identify the lateral offset of the edge of the PCB board to be transferred relative to the reference position of the clamping arm; If the lateral offset exceeds the second set threshold, slippage is determined to have occurred, and a first adjustment command is generated: while increasing the clamping force, the clamping width is reduced proportionally, wherein the increase in clamping force and the decrease in clamping width are calculated by the PID controller based on the offset.

[0010] In one possible implementation, obtaining the board type parameters of the PCB board to be transmitted further includes: In response to the issued production order, directly parse and obtain the PCB board specification data to be transmitted as defined therein; When the PCB board to be transported enters the transport area, the contour scanning and thickness inversion are performed by the vision recognition system to identify the board shape parameters in real time.

[0011] In one possible implementation, the real-time collaborative closed-loop adjustment further includes: Monitor the real-time acceleration of vertical conveyor equipment; Based on the real-time acceleration and the theoretical weight of the PCB board to be transported, the additional clamping force required to prevent the PCB board to be transported from falling is dynamically calculated. The additional clamping force is used as a feedforward and added to the current clamping force setting.

[0012] In one possible implementation, the dynamic calculation refers to the additional clamping force required to prevent the PCB board to be transported from falling, and its dynamic calculation formula is expressed as: ; in, To add clamping force, The safety factor is related to the coefficient of friction. This is the theoretical weight of the PCB board to be transferred. For real-time acceleration, This is the acceleration due to gravity.

[0013] Secondly, this application provides a PCB board conveying control system based on adaptive adjustment, including a mechanical execution module, a sensing feedback module, and a control decision module: The mechanical execution module includes a dual-sided synchronous telescopic clamping mechanism and a servo drive module that drives it to adjust its width and height. The sensing feedback module includes an array of force sensors for monitoring clamping force and a multi-view vision sensor for monitoring the position and orientation of the PCB board to be transferred. The control decision module pre-stores the anti-slip-anti-warping mapping model and the collaborative control algorithm, which are used to process sensor data and generate adjustment commands for the mechanical execution module.

[0014] In one possible implementation, each clamping end of the dual-sided synchronous telescopic clamping mechanism is equipped with an independent micro servo drive unit, which is used to independently fine-tune the position and output force of a single clamping point with millimeter-level precision under the command of the control decision module.

[0015] In one possible implementation, the clamping end of the dual-sided synchronous telescopic clamping mechanism is integrated with an independently driveable friction wheel for providing transmission power.

[0016] The technical solution provided in this application can achieve at least the following beneficial effects: This application provides a PCB board conveying control method and system based on adaptive adjustment. By acquiring the board shape parameters of the PCB to be conveyed and obtaining the initial clamping width, clamping force, and clamping height based on a preset anti-slip-anti-warping mapping model, rapid adaptive setting for PCBs of different specifications is achieved. Then, a dual-sided synchronous telescopic clamping mechanism precisely executes initial positioning and clamping. During conveying, real-time acquisition of clamping force distribution data from force sensors and board edge position and attitude angle data from vision sensors is used to perform real-time collaborative closed-loop adjustment of the clamping width, clamping force, and clamping height, dynamically compensating for slippage, warping, and other state deviations. This significantly improves the stability of thick boards during high-speed vertical conveying and avoids board damage. For vertical conveying scenarios, real-time acceleration monitoring is further implemented. The system calculates additional clamping force based on a dynamic formula and adds it to the clamping force setpoint via a feedforward method, effectively preventing board drop caused by acceleration and deceleration and ensuring reliable conveying. Simultaneously, the system's built-in anti-slip-anti-warping mapping model, constructed based on extensive experimental data and combined with precise calibration methods for the first and second set thresholds and the safety factor k, provides quantitative basis and adaptability for control decisions, improving adaptability to different board types and operating conditions. Finally, by integrating the mechanical execution module, sensor feedback module, and control decision module, a complete intelligent conveying solution is formed, achieving flexible changeover, high-speed and stable conveying, and precise force-position coordinated control on the production line. This effectively reduces manual intervention and production costs, and improves the automation and intelligence level of the PCB manufacturing process. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic flowchart illustrating an exemplary embodiment of the PCB board transfer control method based on adaptive adjustment. Figure 2 This is a flowchart illustrating an exemplary embodiment of the anti-slip-anti-warping mapping model construction method of this application; Figure 3 This is a schematic diagram illustrating a real-time collaborative closed-loop adjustment based on the actual clamping force distribution data, as shown in an exemplary embodiment of this application. Figure 4 This is a flowchart illustrating a method for obtaining a first set threshold according to an exemplary embodiment of this application; Figure 5This is a schematic diagram of the anti-fall feedforward control process shown in an exemplary embodiment of this application; Figure 6 This is a schematic diagram of an adaptive adjustment-based PCB board conveying control system, as illustrated in an exemplary embodiment of this application.

[0019] Figure label: 1. Mechanical actuation module; 2. Sensor feedback module; 3. Control decision module. Detailed Implementation

[0020] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the exemplary embodiments described are only some embodiments of this application, and not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0021] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0022] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0023] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0024] Next, the technical solutions of this application and how they solve the aforementioned technical problems will be described in detail through embodiments and in conjunction with the accompanying drawings. The embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application.

[0025] In one exemplary embodiment, such as Figure 1 As shown, a PCB board conveying control method based on adaptive adjustment is provided. In this embodiment, the method may include the following steps: Step 100: Obtain the board type parameters of the PCB board to be transferred, wherein the board type parameters include at least the board thickness, width and theoretical weight; Step 200: Based on the thickness and theoretical weight of the plate, the initial clamping width setting, initial clamping force setting, and initial clamping height setting are obtained through a preset anti-slip-anti-warping mapping model. Step 300: Control the vertical conveying mechanism to position itself according to the initial clamping width setting value and the initial clamping height setting value, and clamp the PCB board to be conveyed according to the initial clamping force setting value; Step 400: During the transfer process, the actual clamping force distribution data fed back by the force sensor and the edge position and attitude angle data of the PCB board to be transferred fed back by the vision sensor are acquired in real time. Step 500: Based on the actual clamping force distribution data and the edge position and attitude angle data of the PCB board to be transferred, the clamping width, clamping force and clamping height are adjusted in real time in a closed loop to dynamically compensate for the state deviation generated during the transfer process.

[0026] In one embodiment, such as Figure 1 As shown, the specific implementation of this adaptive adjustment-based PCB board conveying control method is as follows: Step 1: Obtain the board type parameters of the PCB board to be transmitted.

[0027] This step can be achieved in two ways, depending on the actual situation.

[0028] Method 1: Obtain from the Manufacturing Execution System. When the Manufacturing Execution System issues a production order, the order contains the part number information of the PCB board to be transmitted. Based on the part number information, the corresponding process parameter file is requested from the Manufacturing Execution System. The Manufacturing Execution System returns the board type parameters, including: length L, width W, thickness T, material type, and theoretical weight M.

[0029] Method 2: Obtain data through a visual recognition system. When manufacturing execution system data is missing or used for trial production, a visual recognition system set up at the feeding station is used. After the PCB enters the recognition area, the visual recognition system is triggered to take a picture, and then the length and width are calculated using existing image processing algorithms.

[0030] Thickness measurement can be performed using a contact method. The double-sided synchronous telescopic clamping mechanism in the vertical conveying device moves towards each other at a low speed. When the force sensor embedded in the clamping end detects a sudden change in pressure from 0 to 0.05N, the movement stops immediately, and the absolute positions of the clamping arms on both sides are recorded. The difference between these positions is the actual thickness, and the theoretical weight is calculated in conjunction with the material density.

[0031] Step 2: Dual-sided synchronous telescopic clamping mechanism.

[0032] The internally stored "anti-slip-anti-warping mapping model" is invoked. This model is a combination of a multi-dimensional lookup table and an interpolation algorithm. The model takes thickness T, weight M, and length L as inputs and outputs a set of co-optimized initial settings: initial clamping width W_set, initial clamping force F_set, and initial clamping height H_set.

[0033] The specific solution process is as follows: Using thickness T, weight M, and length L as indices, find the nearest neighbor node in the lookup table.

[0034] If no perfectly matching node is found, three-dimensional linear interpolation is performed to obtain a preliminary range of safety parameters.

[0035] Further optimization within the interval: Define a comprehensive robustness index: R=α×(F_max-F)+β×(H-H_min)-γ×F; Where α, β, and γ are weighting coefficients, F_max is the minimum force required to prevent slippage, and H_min is the minimum height to prevent warping. R is maximized through iterative calculation.

[0036] Step 3: Control the positioning and clamping of the clamping mechanism.

[0037] Send commands to the servo driver.

[0038] Width adjustment: Drive the width adjustment servo motor, which drives the two clamping arms to move synchronously to the W_set position through the ball screw pair. Since the two screws are rigidly connected by the synchronous shaft, the movement of both sides is absolutely synchronous.

[0039] Height adjustment: Drive the height adjustment servo motor to move the entire clamping arm along the Z-axis to the H_set position.

[0040] Clamping force application: The controller switches the servo motor to torque control mode and sends the corresponding torque command. The force sensor at the clamping end provides real-time feedback on the actual clamping force, forming a closed loop to ensure accurate and stable clamping force.

[0041] Start the transfer: After the clamping is stable, start the micro motor on the clamping end to drive the friction wheel to rotate at a preset speed and start transferring the PCB.

[0042] Step 4: Acquire sensor data in real time.

[0043] During transmission, the following data are collected in real time: The actual clamping force at the clamping point is measured by an array of force sensors embedded in the clamping surface and is denoted as F1, F2, F3, etc.

[0044] The edge position and attitude angle of the PCB board to be transmitted are acquired by a multi-view vision sensor. Camera A, facing the edge of the board, measures the lateral slip ΔX in real time. Camera B, tilted and looking down, forms a binocular vision with camera A to calculate the roll angle Φ of the board surface. The vision processing uses a sub-pixel algorithm.

[0045] Step 5: Real-time collaborative closed-loop adjustment.

[0046] The basic logic of generating adjustment commands based on real-time data is as follows: input the force difference, slippage, acceleration, etc. into their respective PID or feedforward controllers, output clamping force compensation, width compensation, and height compensation, and then superimpose them to obtain the final command, which is then sent to the servo driver to realize the dynamic adjustment of clamping width, clamping force, and clamping height.

[0047] In one embodiment, such as Figure 2 As shown, the specific construction process of the anti-slip-anti-warping mapping model is as follows: Step 210: Prepare a series of standard PCB samples covering common thickness ranges: 1.0mm, 1.6mm, 2.0mm, 2.4mm, and 3.2mm. Prepare multiple samples of different lengths and widths for each thickness to cover different weights. The material of the samples should be consistent with that of the actual production.

[0048] Step 220: Install the template on the equipment, fix the clamping height and clamping width, gradually increase the clamping force, and run at the target conveying speed. Use a high-speed camera to monitor whether there is relative displacement between the template and the friction wheel. When slippage is detected for the first time, record the critical clamping force F_slip at this time. Change the clamping height and width, repeat the test, and obtain the critical force under different combinations.

[0049] Step 230: Fix the clamping force, gradually change the clamping height, and at the same time use a laser displacement sensor to measure the deflection in the middle of the sample. When the deflection exceeds the allowable value, record the critical clamping height H_warp at this time, change the clamping force, and repeat the test.

[0050] Step 240: Summarize all critical point data, including thickness T, weight M, length L, critical point clamping force F_slip, and critical point clamping height H_warp. Use a multivariate nonlinear regression or surface fitting algorithm to establish two core functions: F_min=f1(T,M,v); H_max=f2(T,L,F); Where F_min is the minimum clamping force to ensure no slippage, v is the transmission speed, and H_max is the maximum clamping height to ensure no warping.

[0051] The fitting results are discretized into a multidimensional lookup table and accompanied by a linear interpolation algorithm, which is then stored in the controller's non-volatile memory to form an "anti-slip-anti-warping mapping model". This anti-slip-anti-warping mapping model can quickly output a range of safety parameters based on the input thickness T, weight M, and length L.

[0052] In one embodiment, such as Figure 3 and Figure 4 As shown, warping adjustment is performed based on the actual clamping force distribution. The core of this process is to calculate the difference in clamping forces on both sides. When the difference exceeds a first set threshold, a coordinated adjustment of height and force is made. The specific process is as follows: Step 310: In each control cycle, calculate the difference ΔF between the average clamping forces on the left and right sides. If ΔF exceeds the first set threshold and continues for multiple cycles, it is determined that there is a risk of unilateral warping, and coordinated adjustment is required.

[0053] The formula for calculating the difference between the average clamping forces on the left and right sides is: ΔF = |(F1+F3) / 2-(F2+F4) / 2|.

[0054] Step 320: Based on the magnitude and direction of ΔF, calculate the required corrective torque. The formula for calculating this corrective torque is as follows: M_corr = ΔF × (Wc / 2); Where Wc is the current clamping width.

[0055] Step 330: Calculate the height adjustment amount based on the corrective torque. The formula for calculating the height adjustment amount is as follows: ΔH = M_corr / (F_avg × K); Where F_avg is the average clamping force, and K is the lever coefficient related to the clamping arm structure.

[0056] Step 340: Lower the height of the clamping arm on the side with greater force by ΔH, and raise the height of the arm on the side with less force by ΔH. At the same time, decrease and increase the clamping force on the corresponding sides respectively, so that the force difference approaches zero.

[0057] The first set threshold is the critical value of force difference for judging the risk of warping, and its acquisition process is as follows: Step 311: Select samples of different thicknesses and conduct a warping experiment on the equipment. Gradually increase the additional force on one side to simulate an increase in force difference. At the same time, use a vision system to measure the warping angle of the board surface and record the force difference value corresponding to the warping angle reaching an observable state. Repeat the experiment 10 times for each thickness and take the average to obtain the critical force difference value corresponding to each thickness. Use this critical force difference value as the threshold for each thickness.

[0058] Step 312: Create a thickness-threshold table and store the results in the controller. Step 313: During actual operation, the controller looks up the first set threshold in a table based on the current PCB thickness.

[0059] In one embodiment, adjustment is made based on the amount of slippage indicated by visual feedback. The core of this process is calculating the lateral offset. When the offset exceeds a second preset threshold, a linkage adjustment between force and width is performed. The specific implementation process is as follows: In each control cycle, the lateral offset ΔX from the visual feedback is read. If ΔX exceeds a second set threshold, the anti-slip PID controller is triggered. This anti-slip PID controller takes ΔX as input and outputs two correlated quantities: Clamping force increment ΔF_slip=Kp1×ΔX+Ki1×∫ΔXdt+Kd1×d(ΔX) / dt; Clamping width reduction ΔWc_slip=-(Kp2×ΔX+Kd2×d(ΔX) / dt); The negative sign indicates narrowing. The PID parameters were tuned experimentally to ensure fast response and no overshoot. The preset linkage ratio is: for every 1N increase in clamping force, the width is narrowed by 0.05mm. The new instruction is: F_cmd = F_set + ΔF_slip; Wc_cmd = Wc_set + ΔWc_slip; After execution, the clamping force increases to increase friction, while the width narrows to enhance mechanical constraint, together suppressing slippage.

[0060] The second set threshold is the maximum allowable lateral slip, which is determined based on the positioning accuracy of the subsequent process. For example, SMT placement requires a positioning error of ±0.1mm, so the slip threshold should be less than 0.1mm, and 0.08mm is chosen to leave a margin.

[0061] In one embodiment, such as Figure 5 As shown, a fall prevention feedforward control is also set up in the vertical transmission scenario, and its specific implementation process is as follows: Step 410: The controller reads the instantaneous acceleration 'a' of the current motion through the servo driver, with a sampling period of 1ms.

[0062] Step 420: According to physical principles, to prevent the PCB board to be transferred from falling due to inertia, additional clamping force is needed to provide sufficient static friction. The formula for calculating the additional clamping force is: ; in, To add clamping force, The safety factor is related to the coefficient of friction. This is the theoretical weight of the PCB board to be transferred. For real-time acceleration, This is the acceleration due to gravity.

[0063] Step 430: [The text appears to be incomplete and contains several grammatical errors. A more accurate translation would require As a feedforward, it is superimposed on the current clamping force setting to generate a new clamping force command. This superposition begins to increase in a ramp 50ms before the acceleration changes, so that the clamping force transitions smoothly and avoids impact.

[0064] Step 440: Based on the direction and magnitude of acceleration, temporarily adjust the clamping height setting to move the clamping point toward the center of gravity. When accelerating upward, increase the clamping height by 10-20mm to reduce the overturning moment; when accelerating downward, decrease the clamping height.

[0065] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially as indicated, these steps are not necessarily executed in the indicated order. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0066] Corresponding to the aforementioned embodiments of the PCB board conveying control method based on adaptive adjustment, this application also provides embodiments of the PCB board conveying control system based on adaptive adjustment.

[0067] In one exemplary embodiment, such as Figure 2 As shown, the adaptive adjustment-based PCB board conveying control system includes a mechanical actuation module 1, a sensor feedback module 2, and a control decision module 3. The mechanical execution module 1 includes a dual-sided synchronous telescopic clamping mechanism and a servo drive module that drives it to adjust its width and height. The sensing feedback module 2 includes an array of force sensors for monitoring clamping force and a multi-view vision sensor for monitoring the position and orientation of the PCB board to be transferred. The control decision module 3 pre-stores the anti-slip-anti-warping mapping model and the collaborative control algorithm, which are used to process sensor data and generate adjustment commands for the mechanical execution module.

[0068] In one embodiment, the mechanical actuation module 1 includes a dual-sided synchronous telescopic clamping mechanism and a servo drive module.

[0069] The dual-sided synchronous telescopic clamping mechanism consists of left and right symmetrical clamping arms. Each clamping arm is mounted on the frame via a linear guide rail and can move along the width and height directions. The end of the clamping arm is equipped with an active friction wheel, which is independently driven by a micro servo motor to provide transmission power.

[0070] The servo drive module can achieve the following functions: Width adjustment: Two servo motors drive ball screws through a coupling. The screw nut is connected to the clamping arm. The two screws are rigidly connected by a synchronous shaft to ensure synchronization.

[0071] Height adjustment: A servo motor drives a lead screw, which moves the entire clamping arm assembly along the Z-axis.

[0072] In one embodiment, the sensing feedback module 2 includes an array of force sensors and a multi-view vision sensor.

[0073] The array-type force sensor includes a torque sensor embedded in each clamping end, which can measure three-dimensional force and torque in real time; the multi-view vision sensor consists of two industrial cameras, with camera A facing the side of the PCB board to be conveyed and equipped with a telecentric lens to measure lateral slippage; camera B is installed at an angle to form a binocular vision with camera A to measure the board's attitude angle.

[0074] In one embodiment, the control decision module 3 employs a combination of an industrial PC and a multi-axis motion control card. The PC runs control software and is responsible for manufacturing execution system communication, vision processing, model solving, human-machine interface, etc.; the motion control card is responsible for real-time closed-loop control, communicates with servo drives and sensors, and has pre-stored an anti-slip-anti-warping mapping model and an adaptive adjustment-based PCB board conveying control method within the control decision module.

[0075] In one embodiment, a miniature linear servo motor is integrated inside the clamping end of each clamping arm. This motor can independently control the normal displacement and output force of the clamping point relative to the clamping arm base. When height difference adjustment is required, the control decision module sends a command to the miniature servo drive unit of the corresponding clamping end to independently extend or retract a small distance, while adjusting the output force to achieve precise local posture correction.

[0076] In one embodiment, each clamping end is also equipped with a friction wheel directly driven by a micro servo motor. The surface of the friction wheel is covered with a polyurethane rubber layer to increase the coefficient of friction without damaging the PCB board to be conveyed. The speed of the friction wheel can be independently controlled by the control decision module to achieve differential speed-assisted correction. The friction wheel motor has a built-in encoder to achieve closed-loop speed control and ensure synchronous conveying. In the clamping state, the friction wheel presses against the PCB board to be conveyed and drives its movement through friction, thereby replacing the traditional conveyor belt or roller, simplifying the structure and improving control accuracy.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A PCB board conveying control method based on adaptive adjustment, characterized in that, include: Obtain the board type parameters of the PCB board to be transmitted, wherein the board type parameters include at least the board thickness, width and theoretical weight; Based on the thickness and theoretical weight of the plate, the initial clamping width setting, initial clamping force setting, and initial clamping height setting are obtained through a preset anti-slip-anti-warping mapping model. The vertical conveying mechanism is positioned according to the initial clamping width setting value and the initial clamping height setting value, and clamps the PCB board to be conveyed according to the initial clamping force setting value. During the transfer process, the actual clamping force distribution data fed back by the force sensor and the edge position and attitude angle data of the PCB board to be transferred fed back by the vision sensor are acquired in real time. Based on the actual clamping force distribution data and the edge position and attitude angle data of the PCB board to be transferred, the clamping width, clamping force and clamping height are adjusted in real time in a closed loop to dynamically compensate for the state deviation generated during the transfer process.

2. The PCB board conveying control method based on adaptive adjustment as described in claim 1, characterized in that, The specific construction of the preset anti-slip-anti-warping mapping model includes: For standard PCB samples of different thicknesses, transfer tests were conducted under various combinations of clamping width, clamping height and clamping force to obtain critical data points that lead to slippage or warping. Based on the critical data points of slippage or warping, surface fitting is performed to form an anti-slippage-anti-warping mapping model with plate thickness and weight as input and safety clamping parameter range as output.

3. The PCB board conveying control method based on adaptive adjustment as described in claim 1, characterized in that, The step of performing real-time coordinated closed-loop adjustment of the clamping width, clamping force, and clamping height based on the actual clamping force distribution data further includes: Calculate the actual clamping force difference between the two clamping arms; If the force difference value continues to exceed the first set threshold, it is determined that the PCB has a risk of unilateral warping. At this time, the clamping height is controlled to be adaptively adjusted: the clamping force on the side with greater force is reduced, and the clamping height on both sides is adjusted simultaneously to apply a reverse corrective torque.

4. The PCB board conveying control method based on adaptive adjustment as described in claim 1, characterized in that, The step of performing real-time coordinated closed-loop adjustment of the clamping width, clamping force, and clamping height based on the edge position and attitude angle data of the PCB board to be transferred further includes: Identify the lateral offset of the edge of the PCB board to be transferred relative to the reference position of the clamping arm; If the lateral offset exceeds the second set threshold, slippage is determined to have occurred, and a first adjustment command is generated: while increasing the clamping force, the clamping width is reduced proportionally, wherein the increase in clamping force and the decrease in clamping width are calculated by the PID controller based on the offset.

5. The PCB board conveying control method based on adaptive adjustment as described in claim 1, characterized in that, The step of obtaining the board type parameters of the PCB board to be transmitted further includes: In response to the issued production order, directly parse and obtain the PCB board specification data to be transmitted as defined therein; When the PCB board to be transported enters the transport area, the contour scanning and thickness inversion are performed by the vision recognition system to identify the board shape parameters in real time.

6. The PCB board conveying control method based on adaptive adjustment as described in claim 1, characterized in that, The real-time collaborative closed-loop regulation also includes: Monitor the real-time acceleration of vertical conveyor equipment; Based on the real-time acceleration and the theoretical weight of the PCB board to be transported, the additional clamping force required to prevent the PCB board to be transported from falling is dynamically calculated. The additional clamping force is used as a feedforward and added to the current clamping force setting.

7. The PCB board conveying control method based on adaptive adjustment as described in claim 6, characterized in that, The dynamic calculation refers to the additional clamping force required to prevent the PCB board to be transported from falling, and its dynamic calculation formula is expressed as follows: ; in, To add clamping force, The safety factor is related to the coefficient of friction. This is the theoretical weight of the PCB board to be transferred. For real-time acceleration, This is the acceleration due to gravity.

8. A PCB board conveying control system based on adaptive adjustment, configured in a vertical conveying mechanism, characterized in that, It includes a mechanical actuation module, a sensor feedback module, and a control decision module: The mechanical execution module includes a dual-sided synchronous telescopic clamping mechanism and a servo drive module that drives it to adjust its width and height. The sensing feedback module includes an array of force sensors for monitoring clamping force and a multi-view vision sensor for monitoring the position and orientation of the PCB board to be transferred. The control decision module pre-stores the anti-slip-anti-warping mapping model and the collaborative control algorithm, which are used to process sensor data and generate adjustment commands for the mechanical execution module.

9. The PCB board conveying control system based on adaptive adjustment as described in claim 8, characterized in that, Each clamping end of the dual-sided synchronous telescopic clamping mechanism is equipped with an independent micro servo drive unit, which is used to independently fine-tune the position and output force of a single clamping point with millimeter-level precision under the command of the control decision module.

10. The PCB board conveying control system based on adaptive adjustment as described in claim 8, characterized in that, The clamping end of the dual-sided synchronous telescopic clamping mechanism is integrated with an independently driveable friction wheel to provide transmission power.