A processing device for computer keyboard circuit board
By combining the annular pressure foot ring and the dust removal mechanism, the problems of insufficient rigidity and chip blockage of micro drill bits during high-speed, small-diameter drilling are solved, achieving stability and precision in the drilling process and reducing the risk of drill bit damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Filing Date
- 2026-05-18
- Publication Date
- 2026-07-14
AI Technical Summary
During high-speed, small-diameter drilling, micro-drill bits lack rigidity and have narrow chip removal channels that are prone to clogging, leading to problems such as drill bit jamming, chipping, and breakage.
It adopts a circular pressure foot ring structure with elastic pressure lip, integrating the central cavity and dust removal mechanism. It can suck up debris in real time and clean the embedded debris in the drill bit with the help of centrifugal force, limiting the radial swing of the drill bit and realizing synchronous dust suction and drill bit protection during the drilling process.
It effectively suppresses drill bit swerve, reduces chip removal channel blockage, improves drilling stability, reduces the risk of drill bit damage, and ensures hole position accuracy and machining quality.
Smart Images
Figure CN122395826A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board processing technology, and more specifically, to a processing device for a computer keyboard circuit board. Background Technology
[0002] Keyboards are widely used in many fields such as electronic digital products and office equipment. The core conductive and control carrier of a keyboard is the printed circuit board (PCB), which is mostly made of double-sided copper-clad laminate or multi-layer composite substrate. The industrial manufacturing process of keyboard PCBs is complex, mainly including key processing steps such as board cutting, board surface polishing and cleaning, inner layer circuit etching, lamination, solder resist coating, surface metallization treatment, positioning drilling, component soldering and mounting, and electrical performance testing. The processing quality of each step directly affects the stability and lifespan of the finished keyboard. Among them, the drilling process is the core key process for the conductive connection between layers of multi-layer PCBs and the structural assembly and positioning.
[0003] The drilling of keyboard circuit boards is generally completed using high-speed CNC drilling equipment. During operation, a high-speed spindle drives a micro drill bit to rotate at high speed. The drill bit is fed vertically downward by a precision feed mechanism. The cutting edge of the drill bit and the spiral groove structure are used to cut and remove the copper foil, fiberglass substrate and resin layer of the circuit board, thereby processing through-holes with uniform specifications to meet the requirements of circuit conduction and assembly.
[0004] In high-speed, small-diameter drilling operations, the micro-drills used have a delicate structure and weak overall rigidity. The chip removal channels inside the drill rod are narrow, and impurities such as copper powder, fiberglass debris, and resin dust are continuously generated during the drilling process. These debris are fine and easily adhere, accumulating and clogging the chip removal channels inside the drill rod. Once the chip removal channels are blocked, the cutting debris remains, creating a hard obstruction and compression on the high-speed rotating drill, leading to a sharp increase in the drill's rotational resistance, which in turn increases the likelihood of drill chipping and breakage. Therefore, there is an urgent need for a processing equipment for computer keyboard circuit boards to solve the above problems. Summary of the Invention
[0005] This invention provides a processing device for computer keyboard circuit boards. By incorporating an annular pressure foot ring with an elastic pressure lip and integrating a central cavity and dust removal mechanism within it, the area surrounding the drill hole is sealed to prevent dust dispersion. Simultaneously, it provides a supportive fit to the circuit board. During drilling operations and drill bit lifting, debris can be extracted in real time, and centrifugal force can be used to clean embedded debris from the drill bit, thereby solving the problems mentioned in the background art, namely: When drilling small holes at high speeds, micro drill bits have weak rigidity and narrow chip removal channels. Adhesive chips can easily clog the channels, causing the drill bit to jam and experience abnormal stress, increasing the likelihood of chipping and breakage.
[0006] To achieve the above objectives, the processing equipment for the computer keyboard circuit board includes a machine body, which includes a longitudinal frame and a transverse frame. A processing platform for supporting the circuit board is mounted on the longitudinal frame. A drilling component is slidably mounted on the transverse frame. The drilling component includes a horizontal slider that moves horizontally along the transverse frame. A vertical slider is slidably mounted inside the horizontal slider and moves vertically relative to the horizontal slider. Two external support frames are mounted on the surface of the vertical slider. The two external support frames are arranged vertically and vertically relative to the vertical slider. A drill bit mechanism is installed in the two external support frames. The lower end of the drill bit mechanism passes through the lower external support frame and extends downward. The bottom of the lower outer support frame is snapped with a clamping assembly, which is used to press against the surface of the circuit board during drilling. The clamping assembly is equipped with a dust removal mechanism inside, which is used to suck up the chips generated during drilling. When the vertical slider drives the drill bit mechanism to feed downward, the clamping assembly contacts the circuit board and applies pressure before the drill bit mechanism, and the lower opening of the clamping assembly forms a radial limiting fit with the drill bit mechanism to limit the radial sway of the drill bit mechanism during the drilling process. When the drill bit mechanism completes drilling and is lifted upwards, the dust removal mechanism remains open to suck up residual chips on the drill bit mechanism, and the bottom shape features of the clamping assembly are also used to determine the accuracy of the hole positions on the circuit board.
[0007] In the above technical solution, the modular integrated layout effectively suppresses the radial runout of the micro drill bit during high-speed operation, promptly guides and cleans the drilling chips to reduce the risk of chip channel blockage and tool breakage, and improves the processing stability of small hole drilling on keyboard circuit boards.
[0008] Based on this, the drill bit mechanism includes a telescopic component and a drill bit body. The telescopic component is used to drive the drill bit body to reciprocate in the vertical direction, and the upper end of the drill bit body is rotatably connected to the telescopic component.
[0009] The clamping assembly includes a mounting groove at the bottom of the lower outer support frame, a snap-fit ring is snapped into the inside of the mounting groove, and a pressure foot ring is fixedly installed on the end of the snap-fit ring away from the mounting groove.
[0010] Preferably, the pressure foot ring is cylindrical with a central cavity inside. In the non-drilling state, the drill bit body is housed inside the central cavity. A bottom hole is provided at the bottom of the central cavity. When drilling is performed, the drill bit body can pass through the bottom hole and extend downward to contact the circuit board for drilling. The inner wall of the central cavity and the inner wall of the bottom hole have a rounded transition shape. The inner diameter of the bottom hole is larger than the diameter of the drill bit body.
[0011] Furthermore, the bottom surface of the pressure foot ring is fitted with a pressure lip, which is made of elastic material and is used to form a sealed contact and buffer impact when pressing against the circuit board.
[0012] In another technical solution, the dust removal mechanism includes a flow cavity formed inside the inner wall of the pressure foot ring. The flow cavity has several dust removal holes on the side near the central cavity. The upper end of the flow cavity is connected to a suction pipe, which is used to connect an external suction pump to generate negative pressure suction force in the central cavity.
[0013] The dust removal holes in the middle cavity are divided into an upper adsorption zone and a lower adsorption zone. During the drilling process, the generated chips are sucked out through the lower adsorption zone. After drilling is completed, the drill bit body is lifted and enters the middle cavity under the drive of the telescopic component. At this time, the upper adsorption zone, combined with the rotational motion of the drill bit body itself, sucks out the chips remaining on the surface and inside of the drill bit body. In the dust removal holes of the upper adsorption zone, a guide strip is installed at the lower end of the inner wall near the flow cavity, and the guide strip is inclined toward the upper end of the flow cavity.
[0014] This technical solution achieves timely chip removal during drilling by setting a flow chamber connected to the suction pipe inside the pressure foot ring and arranging dust removal holes in sections. At the same time, the upper adsorption zone, combined with the centrifugal force of the drill bit rotation, cleans the residual chips on the surface and inside of the drill bit, improving the dust removal and chip removal effect, thereby reducing the situation of chip retention and accumulation causing blockage of the chip removal channel.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. In the processing equipment for this computer keyboard circuit board, by adopting a circular pressure foot ring structure, the area around the drilled hole can be covered, and the bottom pressure lip can be attached to the surface of the circuit board, preventing drilling dust from drifting to other areas of the circuit board. At the same time, the pressure foot ring can provide a bonded support to the circuit board.
[0016] 2. In the processing equipment for the computer keyboard circuit board, by setting a central cavity inside the pressure foot ring and integrating a dust removal mechanism, copper powder and glass fiber debris generated during the drilling process can be sucked up in real time. After drilling is completed, the drill bit body is lifted and decelerated, and the residual chips embedded in the drill bit body are thrown out by centrifugal force. The dust removal mechanism is linked to simultaneously suck up dust, reducing the accumulation of chips that block the chip discharge channel of the drill bit body.
[0017] 3. In the processing equipment for this computer keyboard circuit board, the pressure foot ring forms a partition space. Even if the drill bit breaks during the drilling process, the broken part is constrained inside the cavity, preventing the broken tool from swinging at high speed and scratching the surrounding structure of the circuit board. In addition, the bottom hole of the pressure foot ring adopts an adaptation design that is slightly larger than the outer diameter of the drill bit, which can form a radial limit on the drill bit. At the same time, the integrity of the drilling can be visually detected by observing the fit between the bottom hole and the formed hole. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the drilling component in this invention; Figure 3 This is a schematic diagram of the installation structure of the clamping assembly in this invention; Figure 4 This is a schematic diagram of the pressure foot ring in this invention; Figure 5 This is the drilling process of the drilling component on the circuit board in this invention; Figure 6 This is the second drilling process of the drilling component on the circuit board in this invention; Figure 7 This is the third step in the drilling process of the circuit board using the drilling component in this invention; Figure 8 This is a diagram of the dust removal structure of the drill bit body during the drilling process of the circuit board in this invention; Figure 9 This is a diagram of the dust removal structure for the drill bit body in this invention; Figure 10 This is a cross-sectional view of the dust removal holes in the upper adsorption zone of the present invention.
[0019] The meanings of the labels in the diagram are as follows: 1. Equipment body; 11. Processing platform; 12. Longitudinal frame; 13. Transverse frame; 14. Drilling components; 141. Horizontal slider; 142. External support frame; 143. Drill bit mechanism; 144. Vertical slider; 101. Telescopic component; 102. Drill bit body; 2. Clamping assembly; 21. Mounting slot; 22. Snap-fit ring; 23. Presser foot ring; 24. Bottom hole; 25. Middle cavity; 26. Pressing lip; 3. Dust removal mechanism; 31. Flow chamber; 32. Dust removal hole; 33. Suction pipe; 34. Guide strip; 301. Lower adsorption zone; 302. Upper adsorption zone. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] In high-speed, small-diameter drilling operations, micro drill bits have a delicate structure and insufficient rigidity. Furthermore, the chip removal channels inside the drill rod are narrow. The copper powder, fiberglass debris, and resin dust generated during drilling are fine and easily accumulate and clog the chip removal channels of the drill rod. The retained chips will compress and impede the high-speed rotating drill bit, resulting in increased rotational resistance, drill bit jamming, and thus increasing the probability of drill bit chipping and breakage. In view of this, see Figures 1-3 As shown, the present invention provides a processing device for a computer keyboard circuit board, including a device body 1. The device body 1 includes a longitudinal frame 12 and a transverse frame 13. A processing platform 11 for supporting the circuit board is mounted on the longitudinal frame 12, which can realize the stable placement and positioning of the circuit board. A drilling component 14 is slidably arranged on the transverse frame 13. The drilling component 14 includes a horizontal slider 141, which moves horizontally along the transverse frame 13. A vertical slider 144 is slidably arranged inside the horizontal slider 141. The vertical slider 144 is positioned relative to the horizontal slider 141. 41 Vertical movement and sliding cooperation in the horizontal and vertical directions enable flexible feed adjustment of the drilling component 14 in two-dimensional space. The surface of the vertical slider 144 is equipped with two external support frames 142. The two external support frames 142 are arranged vertically and horizontally relative to the vertical slider 144. The drill bit mechanism 143 is installed in the two external support frames 142. The vertically and horizontally spaced external support frames 142 can form a stable clamping and support for the drill bit mechanism 143. The lower end of the drill bit mechanism 143 passes through the lower external support frame 142 and extends downward to realize effective drilling operations on the circuit board. The lower outer support frame 142 is fitted with a clamping component 2 at the bottom. The clamping component 2 can press against the surface of the circuit board during drilling and pre-press the circuit board before drilling. The clamping component 2 is equipped with a dust removal mechanism 3 inside. The dust removal mechanism 3 is used to suck up the chips generated during drilling and remove impurities such as copper powder and glass fiber debris generated during drilling in a timely manner. When the vertical slider 144 drives the drill mechanism 143 to feed downward, the clamping assembly 2 contacts the circuit board and applies pressure before the drill mechanism 143, and the lower opening of the clamping assembly 2 forms a radial limiting fit with the drill mechanism 143 to limit the radial sway of the drill mechanism 143 during the drilling process. When the drill mechanism 143 completes drilling and is lifted upward, the dust removal mechanism 3 remains open to suck up the chips remaining on the drill mechanism 143.
[0022] Further integration Figure 3 As shown, the drill bit mechanism 143 includes a drill bit body 102. The top of the drill bit body 102 is assembled inside the telescopic member 101. The telescopic member 101 serves as a linear drive component. The upper part of the drill bit body 102 is assembled with the telescopic member 101 by a rotational connection (using existing technology, which will not be described in detail here), so that the drill bit body 102 can generate independent rotational motion degrees of freedom relative to the telescopic member 101. During operation, the telescopic component 101 receives the equipment control command and outputs a vertical driving force, which drives the drill bit body 102 to move downward synchronously, so that the drill bit body 102 extends through the lower opening of the clamping assembly 2 and contacts the circuit board surface. The drill bit body 102 maintains a rotating state to complete the micro-hole cutting process. After the single hole processing is completed, the telescopic component 101 outputs a reverse driving force, which drives the drill bit body 102 to rise upward at a uniform speed. The drill bit body 102 continues to maintain a rotating state and is stored inside the middle cavity 25 of the clamping assembly 2, forming a corresponding positional relationship with the negative pressure suction area of the dust removal mechanism 3, and cooperates to complete the collection of surface and internal attached chips.
[0023] Combination Figure 4 As shown, the clamping assembly 2 is assembled at the bottom of the lower outer support frame 142. It is positioned and installed by the mounting groove 21 opened at the bottom of the lower outer support frame 142. The snap ring 22 is snapped into the mounting groove 21. The pressure foot ring 23 is fixedly installed at the end of the snap ring 22 away from the mounting groove 21, so that the clamping assembly 2 is aligned with the lower end of the drill bit mechanism 143. The pressure foot ring 23 is cylindrical and has a through-hole 25 inside. In the non-drilling state, the drill bit body 102 can be accommodated inside the through-hole 25. The bottom of the through-hole 25 has a bottom hole 24 connected to the through-hole 25. Furthermore, such as Figure 5 As shown, the clamping assembly 2 is driven by the vertical movement of the vertical slider 144 (the driving method adopts the lead screw structure in the prior art, which will not be described in detail here). The sliding degree of the vertical slider 144 is adjusted and determined according to the length of the pressure foot ring 23, so that the clamping assembly 2 can form a suitable contact force with the surface of the circuit board. When the vertical slider 144 drives the clamping assembly 2 to move downward, the bottom of the pressure foot ring 23 can form a contact with the surface of the circuit board, and cooperate with the processing platform 11 to clamp and support the periphery of the drilling area of the circuit board. At the same time, it can surround the drilling area, so that the subsequent dust removal operation can be concentrated in the designated area.
[0024] During operation, the vertical slider 144 receives equipment control commands, causing the outer support frame 142 and the clamping assembly 2 to move downwards synchronously, in conjunction with... Figure 5 , Figure 6 and Figure 7As shown, the bottom of the pressure foot ring 23 contacts the surface of the circuit board and applies a preset pressure to complete the clamping and support of the circuit board. At this time, the bottom hole 24 of the clamping assembly 2 is precisely aligned with the hole to be drilled, and the drill bit body 102 is inside the cavity 25. During the drilling process, the clamping assembly 2 remains in contact with the circuit board, and the bottom hole 24 forms a radial fit with the drill bit body 102 to limit the movement trajectory of the drill bit body 102.
[0025] See Figure 6 As shown, the inner diameter of the bottom hole 24 is larger than the diameter of the drill bit body 102, which allows the drill bit body 102 to form a radial clearance when passing through the bottom hole 24. This provides room for the high-speed rotation of the drill bit body 102 and also provides radial restraint for the drill bit body 102, ensuring that the drilling trajectory of the drill bit body 102 remains accurate. The clearance between the inner diameter of the bottom hole 24 and the drill bit body 102 can be set to 0.1~0.2mm. On the one hand, this clearance size can accommodate the slight radial runout of the drill bit body 102 during high-speed rotation, providing sufficient room for movement. On the other hand, this clearance setting prevents the drill bit body 102 from wobbling significantly due to an excessively large clearance. At the same time, this clearance size can also accommodate the flow of chips, facilitating the dust removal mechanism 3 to suck up the chips, thus meeting the processing requirements of small-diameter drilling of keyboard circuit boards.
[0026] Because the circuit board surface has uneven solder mask layers, uneven trace heights, and slight warping, and because the pressure foot ring 23 is a rigid structure, direct contact with the circuit board can easily cause damage to the board surface. Therefore, returning to... Figure 4 It can be seen that the bottom surface of the pressure foot ring 23 is equipped with a pressure lip 26. The pressure lip 26 is made of elastic material (such as silicone or rubber) and is used to form a sealed contact and buffer the impact when pressing the circuit board. The elastic material pressure lip 26 can conform to the concave and convex shape of the circuit board surface to form a tight sealed contact, so that the drilling area is in a relatively closed space, reducing the spillage of chips. At the same time, the elastic material can buffer the impact force when the clamping assembly 2 is pressed down, avoiding damage to the circuit and solder mask layer on the circuit board surface caused by rigid contact.
[0027] Based on the structural design of the clamping assembly 2, the dust removal mechanism 3 is integrated inside the pressure foot ring 23, see reference. Figure 8 and Figure 9As shown, the flow chamber 31 is located inside the inner wall of the pressure foot ring 23 and is arranged in a ring around the central cavity 25. Several dust removal holes 32 are provided on the side of the flow chamber 31 near the central cavity 25. The dust removal holes 32 penetrate the inner wall of the pressure foot ring 23, so that the flow chamber 31 is connected to the central cavity 25. Furthermore, the several dust removal holes 32 are divided into an upper adsorption area 302 and a lower adsorption area 301 on the inner wall of the central cavity 25. The lower adsorption area 301 is located near the bottom hole 24, and the upper adsorption area 302 is located above the lower adsorption area 301, corresponding to the upper area of the central cavity 25. The suction pipe 33 is sealed and connected to the upper end of the flow chamber 31 and can extend to the outside of the pressure foot ring 23 for connecting an external suction pump to provide negative pressure power for the dust removal mechanism 3.
[0028] Furthermore, the dust removal mechanism 3 generates negative pressure suction force in the central cavity 25 through an external suction pump, realizing the suction and collection of drilling chips. Its upper adsorption zone 302 and lower adsorption zone 301 respectively undertake different suction functions, forming a regional synergistic dust removal effect: the lower adsorption zone 301 is set close to the bottom hole 24, corresponding to the drilling position of the drill bit body 102, and can directly target the chips generated during drilling, instantly sucking copper powder, glass fiber debris, resin dust, etc. to the flow. The moving cavity 31 is then discharged through the suction pipe 33 to achieve real-time dust removal during the drilling process; the upper adsorption zone 302 is located in the upper part of the middle cavity 25, corresponding to the position after the drill bit body 102 is lifted. After the drill bit body 102 is lifted into the middle cavity 25, it can cooperate with the rotational movement of the drill bit body 102 to suck up the residual chips on the surface and inside of the drill bit body 102, thereby cleaning the residual chips of the drill bit body 102 and reducing the accumulation of chips in the chip discharge channel of the drill bit body 102.
[0029] During operation, the suction pipe 33 is connected to an external suction pump and kept in the open state. The suction pump generates negative pressure in the flow chamber 31 through the suction pipe 33, thereby forming a stable negative pressure suction force in the middle chamber 25. During drilling, the drill bit body 102 drills the circuit board through the bottom hole 24. The generated chips enter the flow chamber 31 through the dust removal hole 32 of the lower adsorption zone 301 under the action of negative pressure, and are then discharged through the suction pipe 33. When drilling is completed, the drill bit body 102 is lifted upward and enters the middle chamber 25 under the drive of the telescopic component 101. At this time, the drill bit body 102 is in a rotating state. The chips remaining on its surface and inside are separated from the drill bit body 102 under the action of rotation. Under the action of negative pressure suction force, they enter the flow chamber 31 through the dust removal hole 32 of the upper adsorption zone 302, and are then discharged through the suction pipe 33.
[0030] The inner wall of the middle cavity 25 and the inner wall of the bottom hole 24 are in the form of a rounded transition. When the chips generated by drilling flow to the dust removal hole 32 under negative pressure, the rounded transition structure can reduce the accumulation of chips at the connection between the middle cavity 25 and the bottom hole 24, so that the chips can flow smoothly to the dust removal hole 32 and reduce the retention of chips in the middle cavity 25.
[0031] Combination Figure 10 As shown, in the dust removal hole 32 of the upper adsorption zone 302, an inclined guide plate 34 is installed at the lower end of the inner wall near the flow cavity 31. The guide plate 34 can prevent the chips sucked up by the upper adsorption zone 302 from falling down to the lower adsorption zone 301, thus preventing the chips that have been sucked up to the upper adsorption zone 302 from falling back to the periphery of the bottom hole 24 and affecting subsequent drilling operations. At the same time, since the guide plate 34 is relatively short, it will not block the suction channel of the dust removal hole 32, nor will it significantly hinder the negative pressure airflow in the middle cavity 25. Therefore, it will not affect the overall suction effect of the dust removal mechanism 3.
[0032] Before drilling, the vertical slider 144 drives the clamping assembly 2 to move downward until the elastic pressure lip 26 at the bottom of the pressure foot ring 23 forms a contact with the surface of the circuit board and applies a preset pressure to achieve pressing and clamping of the drilling area of the circuit board, keeping the circuit board in a stable state; at the same time, the pressure foot ring 23 is cylindrical and surrounds the drill bit body 102 to form a protective enclosure around the drilling area, separating the drill bit body 102 from the non-drilling area of the circuit board, defining an independent area for subsequent drilling and dust removal operations, providing a stable reference for the drilling of the drill bit body 102, and also creating conditions for the concentrated suction of the dust removal mechanism 3, so that the chips generated later can be confined within the enclosure area for centralized processing; During drilling, the clamping assembly 2 remains in contact with the circuit board, and its bottom hole 24 forms a radial fit with the drill bit body 102, which limits the radial deflection of the drill bit body 102. At the same time, the dust removal mechanism 3 is always in the open state, and the external suction pump generates negative pressure in the middle cavity 25 through the suction pipe 33. The dust removal hole 32 of the lower adsorption area 301 is aligned with the drilling position, and the copper powder, glass fiber debris, resin dust and other chips generated during the drilling process are immediately sucked into the flow cavity 31 and discharged, realizing synchronous dust removal during the drilling process, reducing the retention of chips in the bottom hole 24 and the middle cavity 25. At the same time, the surrounding structure of the clamping assembly 2 can prevent chips from drifting to other areas of the circuit board, realizing the synergistic effect of drilling limit protection and synchronous dust removal.
[0033] After drilling is completed, the telescopic component 101 drives the drill bit body 102 to rise upwards. The drill bit body 102 disengages from the circuit board and enters the central cavity 25 of the clamping assembly 2. At this time, the drill bit body 102 continues to rotate due to inertia. During its rotation, centrifugal force is generated, which can throw out the residual chips attached to the surface of the drill bit body 102 and the internal chip removal channel. At the same time, the dust removal mechanism 3 remains open. Under the action of negative pressure, the dust removal holes 32 of the upper adsorption zone 302 suck up the thrown residual chips, so that the chips enter the flow cavity 31 through the dust removal holes 32 and are discharged, realizing the dust removal within the gap of the drill bit body 102 itself. The dust can be discharged because, on the one hand, the centrifugal force of the rotation of the drill bit body 102 can make the residual chips detach from the drill bit body 102, and on the other hand, because the drilling operation has just been completed, the residual chips have just accumulated on the surface of the drill bit body 102 and in the chip removal channel, and have not yet formed obvious adhesion with the drill bit body 102 and the inner wall of the channel, making it easy to be sucked away by negative pressure.
[0034] After drilling is completed, the accuracy of the drilling position can be determined by the structural features of the clamping assembly 2. Specifically, this can be done by visually observing the inner wall morphology of the bottom hole 24 of the pressure foot ring 23. If the inner wall of the bottom hole 24 is worn, scratched, or deformed, it indicates that the drill bit body 102 has deviated during drilling, and the corresponding hole position on the circuit board is skewed. At the same time, a miniature camera can be installed inside the central cavity 25 of the clamping assembly 2 to observe the inner wall of the bottom hole 24 and the drilling formation in real time, further improving the accuracy of hole position detection. When the inner wall of the bottom hole 24 is damaged, affecting the subsequent limiting and dust removal effects, since the clamping assembly 2 is engaged with the mounting groove 21 of the outer support frame 142 through the snap-fit ring 22, the snap-fit ring 22 can be directly disassembled and replaced together with the pressure foot ring 23 without disassembling the entire drilling component 14, which facilitates equipment maintenance and replacement.
[0035] If the drill bit body 102 breaks during the drilling operation, the pressure foot ring 23 of the clamping assembly 2 has a cylindrical structure, and its internal cavity 25 forms a closed accommodating space. This can physically block the broken drill bit body 102 fragments, confining them inside the cavity 25. The fragments cannot spread outward or swing at high speed, thus preventing them from contacting the non-drilling areas of the circuit board. This will prevent damage to the circuits, solder mask, and other structures on the circuit board, reducing the scrap rate of the circuit board and minimizing processing losses.
[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A processing device for a computer keyboard circuit board, comprising a device body (1), the device body (1) comprising a longitudinal frame (12) and a transverse frame (13), wherein a processing platform (11) for supporting the circuit board is mounted on the longitudinal frame (12), and a drilling component (14) is slidably disposed on the transverse frame (13), characterized in that: The drilling component (14) includes a horizontal slider (141) that moves horizontally along the transverse frame (13). A vertical slider (144) is slidably provided inside the horizontal slider (141). The vertical slider (144) moves vertically relative to the horizontal slider (141). Two external supports (142) are mounted on the surface of the vertical slider (144). The two external supports (142) are arranged vertically and vertically relative to the vertical slider (144). A drill bit mechanism (143) is installed in the two external supports (142). The lower end of the drill bit mechanism (143) passes through the lower external support (142) and extends downward. The lower end of the outer support frame (142) is fitted with a clamping assembly (2), which is used to press against the surface of the circuit board during drilling. The clamping assembly (2) is equipped with a dust removal mechanism (3) inside, which is used to suck up the chips generated during drilling. When the vertical slider (144) drives the drill mechanism (143) to feed downward, the clamping assembly (2) contacts the circuit board and applies pressure before the drill mechanism (143), and the lower opening of the clamping assembly (2) forms a radial limiting fit with the drill mechanism (143) to limit the radial deflection of the drill mechanism (143) during the drilling process. When the drill bit mechanism (143) completes drilling and is lifted upward, the dust removal mechanism (3) remains open to suck up the residual chips on the drill bit mechanism (143), and the bottom shape features of the clamping assembly (2) are also used to determine the accuracy of the hole positions on the circuit board.
2. The processing equipment for a computer keyboard circuit board according to claim 1, characterized in that: The drill bit mechanism (143) includes a telescopic member (101) and a drill bit body (102). The telescopic member (101) is used to drive the drill bit body (102) to reciprocate in the vertical direction. The upper end of the drill bit body (102) is rotatably connected to the telescopic member (101).
3. The processing equipment for a computer keyboard circuit board according to claim 2, characterized in that: The clamping assembly (2) includes a mounting groove (21) at the bottom of the lower outer support frame (142), a snap-fit ring (22) is snap-fitted inside the mounting groove (21), and a pressure foot ring (23) is fixedly installed on the side end of the snap-fit ring (22) away from the mounting groove (21).
4. The processing equipment for a computer keyboard circuit board according to claim 3, characterized in that: The pressure foot ring (23) is cylindrical and has a central cavity (25) inside. In the non-drilling state, the drill bit body (102) is housed inside the central cavity (25). The bottom of the central cavity (25) has a bottom hole (24). When drilling is performed, the drill bit body (102) can pass through the bottom hole (24) and extend downward to contact the circuit board for drilling.
5. The processing equipment for a computer keyboard circuit board according to claim 4, characterized in that: The inner wall of the central cavity (25) and the inner wall of the bottom hole (24) are in a circular arc transition shape.
6. The processing equipment for a computer keyboard circuit board according to claim 4, characterized in that: The inner diameter of the bottom hole (24) is greater than the diameter of the drill bit body (102).
7. The processing equipment for a computer keyboard circuit board according to claim 3, characterized in that: The bottom surface of the pressure foot ring (23) is fitted with a pressure lip (26), which is made of elastic material and is used to form a sealed contact and buffer the impact when pressing against the circuit board.
8. The processing equipment for a computer keyboard circuit board according to claim 3, characterized in that: The dust removal mechanism (3) includes a flow cavity (31) opened inside the inner wall of the pressure foot ring (23). The flow cavity (31) has several dust removal holes (32) on the side near the middle cavity (25). The upper end of the flow cavity (31) is connected to a suction pipe (33). The suction pipe (33) is used to connect an external suction pump to generate negative pressure suction force in the middle cavity (25).
9. The processing equipment for a computer keyboard circuit board according to claim 8, characterized in that: The dust removal hole (32) in the middle cavity (25) is divided into an upper adsorption zone (302) and a lower adsorption zone (301). During the drilling process, the generated chips are sucked out through the lower adsorption zone (301). After the drilling is completed, the drill bit body (102) is lifted and enters the middle cavity (25) under the drive of the telescopic component (101). At this time, the upper adsorption zone (302) combines with the rotational motion of the drill bit body (102) to suck up the chips remaining on the surface and inside of the drill bit body (102).
10. The processing equipment for a computer keyboard circuit board according to claim 9, characterized in that: In the dust removal hole (32) of the upper adsorption zone (302), a guide plate (34) is installed on the lower end of the inner wall near the flow cavity (31), and the guide plate (34) is inclined toward the upper end of the flow cavity (31).