PCB manufacturing method and PCB
By attaching adhesive tape to the windowed area of the PCB board and creating through slots on the core board, the problem of depression or cracking in the windowed area during the lamination process is solved, resin powder contamination is avoided, and the reliability of the finished PCB board is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN SHENGYI ELECTRONICS
- Filing Date
- 2026-06-08
- Publication Date
- 2026-07-14
AI Technical Summary
In the lamination process of PCB boards, the windowed areas are prone to denting or cracking, and are easily contaminated by resin powder, which can damage the circuit pattern.
Apply adhesive tape to the windowed area of the sub-board and make through grooves on the core board to divide the core board into the part to be removed and the part to be retained. After lamination, mill the joint to make the part to be removed of the core board fall off, tear off the adhesive tape, and expose the windowed area.
It prevents the windowed area from sinking or cracking during the lamination process and prevents resin powder contamination, thus improving the reliability of the finished PCB board.
Smart Images
Figure CN122395832A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board manufacturing technology, and in particular to a PCB manufacturing method and a PCB board. Background Technology
[0002] In applications such as automotive pressure sensors, PCBs often employ a semi-perforated structure design, creating cavities in specific areas of the board to meet pressure conduction requirements. To achieve this structure, traditional processes require pre-milling windows into the core board and prepreg before lamination. After lamination, the windowed areas naturally form cavities, exposing the circuit patterns. However, because the core board and prepreg are milled before lamination, the upper sub-board loses its bottom physical support during lamination, making it prone to denting or even cracking under high temperature and pressure. Simultaneously, during lamination, the prepreg softens and releases resin upon heating. The exposed copper surface of the circuitry in the windowed areas comes into direct contact with this resin powder. After high temperature and pressure, the resin powder is difficult to remove from the copper surface of the sub-board, ultimately contaminating the circuit patterns in that area. Summary of the Invention
[0003] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes a method for manufacturing a PCB board that can prevent the windowed areas of the PCB board from sinking or cracking during the lamination process, and avoid the windowed areas from being contaminated by resin powder.
[0004] This application also proposes a PCB board.
[0005] A PCB board manufacturing method according to a first aspect of this application includes the following steps: Apply adhesive tape to the windowed area of the sub-board; The first semi-cured sheet is windowed, and the windowing area corresponds to the windowing area of the sub-board; A first through slot is opened on the optical core plate, corresponding to the window area. The first through slot divides the optical core plate into a part to be removed and a part to be retained around the part to be removed, and the part to be removed and the part to be retained have a connection point. The sub-board, the first prepreg, and the core board are stacked in sequence and then laminated to obtain the mother board; The connection between the part to be removed and the part to be retained is milled off, causing the part to be removed from the core board to fall off. The tape is then removed to expose the windowed area.
[0006] The PCB manufacturing method according to the embodiments of this application has at least the following beneficial effects: Before lamination, a window is made in the first prepreg, and a first through-groove is formed around the window area on the core board, so that the core board forms a removable portion that remains connected to the retained portion. During lamination, the removable portion provides temporary physical support for the window area of the sub-board, preventing the sub-board from denting or cracking during the lamination process. Simultaneously, the tape attached to the window area of the sub-board can prevent resin powder that may fall from the window of the first prepreg from contaminating the window area of the sub-board, thus avoiding contamination of the window area of the sub-board.
[0007] In some embodiments, before forming the first through slot corresponding to the window area on the optical core board, the method further includes the step of: The top surface of the optical core board has a first copper layer. The first copper layer is etched so that the first copper layer on the optical core board corresponding to the position of the adhesive tape is retained, and the first copper layer at other positions is removed. The sum of the thickness of the first copper layer and the thickness of the adhesive tape is equal to the thickness of the first prepreg.
[0008] In some embodiments, the step of milling off the connection between the portion to be removed and the retained portion, causing the portion to be removed from the optical core plate, includes the following steps: The motherboard has a design outline corresponding to the area outside the window opening. The area outside the design outline is the waste area of the motherboard. The connection between the part to be removed and the part to be retained is set in the waste area. A groove is milled in the waste area of the motherboard to disconnect the connection between the part to be removed and the part to be retained, so that the part to be removed from the core board falls off.
[0009] In some embodiments, after milling the connection between the portion to be removed and the retained portion, causing the portion to be removed from the optical core plate to detach, and tearing off the adhesive tape to expose the windowed area, the method further includes the following steps: Cut the motherboard along the design outline, remove the waste area of the motherboard, and obtain the PCB board.
[0010] In some embodiments, applying tape to the windowed area of the sub-board includes the step of: Apply tape to the bottom of the sub-board, use laser cutting to cut the tape, remove the unwanted parts of the tape, and keep the tape in the window area.
[0011] In some embodiments, the distance between the outer periphery of the tape and the outline of the window area is set to be greater than or equal to 1 mm.
[0012] In some embodiments, the width of the first through groove is set to 0.5~0.8mm.
[0013] In some embodiments, before applying tape to the windowed area of the sub-board, the step further includes: Provides a second copper layer, a second prepreg, an inner core board, a third prepreg, and a third copper layer; Circuit patterns are fabricated on both sides of the inner core board; The second copper layer, the second prepreg, the inner core board, the third prepreg, and the third copper layer are sequentially stacked and laminated to obtain the sub-board.
[0014] In some embodiments, after milling the connection between the portion to be removed and the retained portion, causing the portion to be removed from the optical core plate to detach, and tearing off the adhesive tape to expose the windowed area, the method further includes the following steps: Gold plating was applied to the exposed copper surface in the windowed area.
[0015] The PCB board according to the second aspect of this application is manufactured using the PCB board manufacturing method described above.
[0016] The PCB board according to the embodiments of this application has at least the following beneficial effects: the PCB board prepared by the PCB board manufacturing method described above is less prone to dents or cracks on the board surface, and resin powder is less likely to appear in the window area, resulting in high reliability of the finished product.
[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0018] The accompanying drawings are used to provide a further understanding of the technical solutions disclosed in this application and form part of the specification. They are used together with the embodiments disclosed in this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions disclosed in this application.
[0019] Figure 1 This is a schematic diagram illustrating the steps of a PCB board manufacturing method provided in an embodiment of this application; Figure 2 This is a schematic cross-sectional view of step S501 in an embodiment of this application; Figure 3 This is an exemplary cross-sectional view of step S201 in an embodiment of this application; Figure 4 This is an exemplary cross-sectional view after step S104 of the embodiment of this application is completed; Figure 5 This is an exemplary bottom view after step S103 of the embodiment of this application is completed; Figure 6 This is an exemplary bottom view of step S105 in an embodiment of this application; Figure 7 This is an exemplary bottom view of step S401 in an embodiment of this application; Figure 8 This is an exemplary cross-sectional view of step S401 in an embodiment of this application; Figure 9 This is a cross-sectional view of a PCB board manufactured by a PCB board manufacturing method in an embodiment of this application.
[0020] Reference numerals: 100, Sub-board; 110, Solder mask layer; 120, Second copper layer; 130, Second prepreg; 140, First circuit layer; 150, Inner core board; 160, Second circuit layer; 170, Third prepreg; 180, Third copper layer; 200, Adhesive tape; 300, First prepreg; 400, First copper layer; 500, Optical core board; 500a, First through slot; 500b, Second through slot; 510, Part to be removed; 520, Retained part; 600, Mother board; 700, PCB board. Detailed Implementation
[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0022] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0023] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0024] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.
[0025] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0026] The following presents various embodiments of the PCB board manufacturing method of this application.
[0027] like Figure 1 As shown, Figure 1 This is a flowchart of a PCB board manufacturing method provided in one embodiment of this application. The PCB board manufacturing method includes, but is not limited to, steps S101, S102, S103, S104 and S105.
[0028] Step S101: Apply tape 200 to the windowed area of sub-board 100.
[0029] like Figure 2 As shown, the tape 200 in step S101 is PI tape. It can be understood that the sub-board 100 is made by laminating several core boards, copper foil and prepreg in sequence, wherein the core board is a substrate with double-sided copper cladding, single-sided copper cladding or no copper foil, and circuit patterns can be made on the copper foil.
[0030] Step S102: Open a window in the first semi-cured sheet 300, with the opening range corresponding to the opening area of the sub-board 100.
[0031] Specifically, the first prepreg 300 is used to bond the sub-board 100 and the core board 500. In the lamination process, the first prepreg 300 is softened by heat under high temperature and pressure, and after curing, it bonds the sub-board 100 and the core board 500 together. In some embodiments, the first prepreg 300 is made of low-flow PP material. The low-flow PP material has low resin flow, which can reduce the amount of resin overflow in the lamination process, ensuring that there is no excess resin residue at the opening position of the first prepreg 300, and keeping the opening edge neat.
[0032] In step S103, a first through groove 500a corresponding to the window area is opened on the optical core plate 500. The first through groove 500a divides the optical core plate 500 into a part to be removed 510 and a retaining part 520 surrounding the part to be removed 510, and the part to be removed 510 and the retaining part 520 retain a connection point.
[0033] like Figure 5 As shown, Figure 5This is an exemplary bottom view after step S103 of the embodiment of this application is completed. The first through slot 500a divides the optical core plate 500 into a part to be removed 510 and a retaining part 520 surrounding the part to be removed 510. In the subsequent lamination process, the part to be removed 510 can provide support for the sub-plate 100 to prevent the windowed area from denting or cracking during the lamination process.
[0034] Step S104: The sub-board 100, the first semi-cured sheet 300 and the optical core board 500 are stacked in sequence and then laminated to obtain the mother board.
[0035] Specifically, after steps S101 to S104, the structure obtained by sequentially stacking the sub-board 100, the first prepreg 300, and the optical core board 500 is as follows: Figure 4 As shown, during the lamination process, the part to be removed 510 provides temporary physical support for the windowed area of the sub-board 100, preventing the windowed area from denting or cracking during the lamination process. Simultaneously, the tape 200 attached to the windowed area of the sub-board 100 can prevent resin powder that may fall from the window of the first semi-cured sheet 300 from contaminating the windowed area of the sub-board 100, thus improving product yield.
[0036] Step S105, as follows Figure 6 As shown, Figure 6 This is an exemplary bottom view of step S105 in an embodiment of this application. The connection between the part to be removed 510 and the part to be retained 520 is milled off, so that the part to be removed 510 of the optical core plate 500 is detached, the tape 200 is torn off, and the window area is exposed.
[0037] In some embodiments, before step S103, before opening the first through slot 500a corresponding to the window area on the optical core plate 500, the method further includes the following step: S201, the top surface of the optical core board 500 has a first copper layer 400. The first copper layer 400 is etched so that the first copper layer 400 on the optical core board 500 corresponding to the position of the tape 200 is retained, and the first copper layer 400 at other positions is removed. The sum of the thickness of the first copper layer 400 and the thickness of the tape 200 is equal to the thickness of the first prepreg 300.
[0038] Specifically, the optical core board 500 is a substrate with double-sided copper clad or single-sided copper clad. In this embodiment, for example... Figure 3 As shown, Figure 3This is an exemplary structural diagram of step S201 in an embodiment of this application. The top surface of the optical core board 500 is copper-clad, meaning the top surface of the optical core board 500 has a first copper layer 400. Since the first prepreg 300 creates a window corresponding to the windowed area of the sub-board 100, after the sub-board 100, the first prepreg 300, and the optical core board 500 are sequentially stacked, gaps may exist between the tape 200 and the portion 510 of the optical core board 500 to be removed. By etching the first copper layer 400, the first copper layer 400 on the optical core board 500 corresponding to the position of the tape 200 is retained, while the first copper layer 400 at other positions is removed. Figure 4 As shown, Figure 4 This is an exemplary structural diagram after step S104 is completed in the embodiment of this application. After step S104, the top surface of the optical core board 500 is covered with a first copper layer 400. After the sub-board 100, the first prepreg 300 and the optical core board 500 are stacked in sequence, the first copper layer 400 fills the gap between the tape 200 and the optical core board 500. The first copper layer 400 provides support for the sub-board 100 and prevents the sub-board 100 from denting or cracking during the lamination process.
[0039] In some embodiments, step S105, milling the connection between the portion to be removed 510 and the retained portion 520 to detach the portion to be removed 510 from the optical core plate 500, includes the following steps: S301, the mother plate 600 has a design outline corresponding to the area outside the window opening area, and the area outside the design outline is the waste area of the mother plate 600. The connection between the part to be removed 510 and the part to be retained 520 is correspondingly set in the waste area. A groove is milled in the waste area of the mother plate 600 to disconnect the connection between the part to be removed 510 and the part to be retained 520, so that the part to be removed 510 of the core plate 500 falls off.
[0040] like Figure 6 and Figure 7 As shown, the dashed line represents the design outline, which is the outer boundary of the finished PCB board. Within the design outline is the PCB board 700 that needs to be retained, and outside the design outline is the scrap area of the motherboard 600, which will be removed during the final PCB board manufacturing stage. Grooves are milled in the scrap area of the motherboard 600 to form... Figure 6 and Figure 7 The second through groove 500b is shown. The second through groove 500b disconnects the connection between the part to be removed 510 and the part to be retained 520, causing the part to be removed 510 of the core plate 500 to detach. Since the second through groove 500b is located in the waste area, the windowed area will not be damaged when the connection is disconnected by milling.
[0041] In some embodiments, after milling the connection between the portion to be removed 510 and the retained portion 520, causing the portion to be removed 510 of the optical core plate 500 to detach, and after tearing off the adhesive tape 200 to expose the windowed area, the method further includes the following steps: S401, cut the motherboard 600 along the design outline, remove the waste area of the motherboard 600, and obtain the PCB board 700.
[0042] Specifically, such as Figure 7 and Figure 8 As shown, Figure 7 This is an exemplary bottom view of step S401 in an embodiment of this application. Figure 8 This is an exemplary cross-sectional view of step S401 in an embodiment of this application. By cutting the mother board 600 along the design contour, the waste area is separated and removed from the mother board 600, thereby obtaining a single PCB board that meets the finished product size requirements, and the position of the second through slot 500b opened in step S301 is completely removed, ensuring that the window area is not damaged when the milling groove disconnects the connection.
[0043] In some embodiments, step S101, applying tape 200 to the window area of the sub-board 100, includes the following steps: S501, attach tape 200 to the bottom surface of sub-board 100, laser cut tape 200, remove unwanted tape portions, and retain tape 200 within the window area.
[0044] like Figure 2 As shown, Figure 2 This is a schematic structural diagram of step S501 in an embodiment of this application. Specifically, adhesive tape 200 is applied to the entire surface of the sub-board 100. A CO2 laser is used to ablate the adhesive tape 200 along a preset trajectory. After cutting the required contour on the adhesive tape 200, the unwanted portions of the adhesive tape are removed. The adhesive tape 200 within the windowed area is retained. The adhesive tape 200 plays an isolating role in the lamination process, protecting the copper surface in the windowed area and preventing it from being contaminated by resin powder.
[0045] In some embodiments, the distance between the outer periphery of the tape 200 and the outline of the window area is set to be greater than or equal to 1 mm.
[0046] The tape 200 is retained within the window area, and the outer periphery of the tape 200 is spaced 1mm from the outline of the window area. This prevents the tape 200 from being pressed between the sub-board 100 and the first semi-cured sheet 300 during lamination, and facilitates the removal of the tape 200 after lamination.
[0047] In some embodiments, the first copper layer 400 is sized to match the tape 200. Specifically, the outer periphery of the first copper layer 400 is spaced from the outline of the window area by a distance greater than or equal to 1 mm.
[0048] In some embodiments, the width of the first through groove 500a is set to 0.5~0.8mm.
[0049] Specifically, the width of the first through groove 500a can be set to 0.5mm, 0.6mm, 0.7mm or 0.8mm. The above width settings are conducive to the removal of the part 510 to be removed from the optical core plate 500.
[0050] In some embodiments, before applying tape 200 to the windowed area of subboard 100, the step further includes: S601 provides a second copper layer 120, a second prepreg 130, an inner core board 150, a third prepreg 170, and a third copper layer 180; S602, circuit patterns are made on both sides of the inner core board 150; S603, the second copper layer 120, the second prepreg 130, the inner core board 150, the third prepreg 170 and the third copper layer 180 are sequentially stacked and then laminated to obtain the sub-board 100.
[0051] The sub-board 100 obtained in steps S601 to S603 is as follows: Figure 2 As shown, specifically, in step S601, the second copper layer 120 and the third copper layer 180 are copper foils, the second prepreg 130 and the third prepreg 170 are PP materials, and the inner core board 150 is a substrate with copper cladding on both sides.
[0052] In step S602, the inner core board 150 is browned and dried. Circuit patterns are then fabricated on both sides of the inner core board 150 by DI exposure to form the first circuit layer 140 and the second circuit layer 160. Finally, holes are punched in the inner core board 150.
[0053] Browning involves chemically treating the copper foil surface of the inner core board 150 to create a micro-rough structure, increasing the contact area between the copper foil and the second and third prepregs 130 and 170, thus improving adhesion between them. After browning, the inner core board 150 needs to be cleaned to remove residual browning solution, and then dried to evaporate all moisture from its surface. Furthermore, DI (Direct Imaging) is a process that uses laser or ultraviolet light to directly expose circuit patterns onto a substrate coated with a photosensitive material.
[0054] In step S603, the second copper layer 120 and the third copper layer 180 are copper foils. The second copper layer 120 and the third copper layer 180 are browned and dried. The second copper layer 120, the second prepreg 130, the inner core board 150, the third prepreg 170, and the third copper layer 180 are sequentially stacked and laminated to obtain the sub-board 100. Subsequently, the sub-board 100 undergoes drilling, hole filling, circuit pattern fabrication, and the formation of a solder resist layer 110 on its top surface.
[0055] In some embodiments, before laminating the sub-board 100, the first prepreg 300, and the optical core board 500 in sequence, step S104 further includes the following step: S701, browning sub-board 100 and light core board 500; S702, dried and browned sub-board 100 and core board 500.
[0056] Browning involves chemically treating the copper foil surfaces of the sub-board 100 and the core board 500 to create a micro-roughened structure, increasing the contact area between the copper foil and the first prepreg 300, thus improving the adhesion of the first prepreg 300. After browning, the sub-board 100 and the core board 500 need to be cleaned to remove residual browning solution, and then dried to evaporate all moisture from their surfaces.
[0057] In some embodiments, after milling the connection between the portion to be removed 510 and the retained portion 520, causing the portion to be removed 510 of the optical core plate 500 to detach, and after tearing off the adhesive tape 200 to expose the windowed area, the method further includes the following steps: S801, gold plating on the exposed copper surface in the windowed area.
[0058] Specifically, immersion gold plating is a PCB surface treatment process that involves sequentially depositing a nickel layer and a gold layer on the copper surface of the PCB through a chemical reaction. The nickel layer acts as a barrier layer, while the gold layer protects the nickel layer and provides solderability. In this embodiment, the tape 200 attached to the window area of the sub-board 100 can prevent resin powder that may fall from the window of the first prepreg 300 from contaminating the window area of the sub-board 100. No gold residue will appear on the window area during immersion gold plating, thus improving product yield.
[0059] The PCB board of the second aspect embodiment of this application is prepared by the PCB board manufacturing method described above.
[0060] like Figure 9 As shown, Figure 9 This is a cross-sectional view of a PCB board manufactured using the PCB board manufacturing method described above. Figure 9 It can be seen that the PCB board did not have any dents or cracks, indicating high reliability of the finished product.
[0061] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order shown in the operation diagrams. For example, depending on the functions / operations involved, two consecutively shown blocks may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order. Furthermore, the embodiments presented and described in the flowcharts of this application are provided by way of example to provide a more comprehensive understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and sub-operations described as part of a larger operation are executed independently.
[0062] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.
Claims
1. A method for manufacturing a PCB board, characterized in that, Including the following steps: Apply adhesive tape to the windowed area of the sub-board; The first semi-cured sheet is windowed, and the windowing area corresponds to the windowing area of the sub-board; A first through slot is opened on the optical core plate, corresponding to the window area. The first through slot divides the optical core plate into a part to be removed and a part to be retained around the part to be removed, and the part to be removed and the part to be retained have a connection point. The sub-board, the first prepreg, and the core board are stacked in sequence and then laminated to obtain the mother board; The connection between the part to be removed and the part to be retained is milled off, causing the part to be removed from the core board to fall off. The tape is then removed to expose the windowed area.
2. The PCB board manufacturing method according to claim 1, characterized in that, Before opening the first through slot corresponding to the window area on the optical core board, the method further includes the following steps: The top surface of the optical core board has a first copper layer. The first copper layer is etched so that the first copper layer on the optical core board corresponding to the position of the adhesive tape is retained, and the first copper layer at other positions is removed. The sum of the thickness of the first copper layer and the thickness of the adhesive tape is equal to the thickness of the first prepreg.
3. The PCB board manufacturing method according to claim 1, characterized in that, The step of milling off the connection between the part to be removed and the part to be retained, so that the part to be removed from the optical core board falls off, includes the following steps: The motherboard has a design outline corresponding to the area outside the window opening. The area outside the design outline is the waste area of the motherboard. The connection between the part to be removed and the part to be retained is set in the waste area. A groove is milled in the waste area of the motherboard to disconnect the connection between the part to be removed and the part to be retained, so that the part to be removed from the core board falls off.
4. The PCB board manufacturing method according to claim 3, characterized in that, After milling off the connection between the part to be removed and the part to be retained, causing the part to be removed from the optical core board to fall off, and tearing off the tape to expose the windowed area, the process further includes the following steps: Cut the motherboard along the design outline, remove the waste area of the motherboard, and obtain the PCB board.
5. The PCB board manufacturing method according to claim 1, characterized in that, The step of applying tape to the windowed area of the sub-board includes: Apply tape to the bottom of the sub-board, use laser cutting to cut the tape, remove the unwanted parts of the tape, and keep the tape in the window area.
6. The PCB board manufacturing method according to claim 1, characterized in that, Set the distance between the outer perimeter of the tape and the outline of the window area to be greater than or equal to 1 mm.
7. The PCB board manufacturing method according to claim 1, characterized in that, Set the width of the first through groove to 0.5~0.8mm.
8. The PCB board manufacturing method according to claim 1, characterized in that, Before applying tape to the windowed area of the sub-board, the procedure also includes the following steps: Provides a second copper layer, a second prepreg, an inner core board, a third prepreg, and a third copper layer; Circuit patterns are fabricated on both sides of the inner core board; The second copper layer, the second prepreg, the inner core board, the third prepreg, and the third copper layer are sequentially stacked and laminated to obtain the sub-board.
9. The PCB board manufacturing method according to claim 1, characterized in that, After milling off the connection between the part to be removed and the part to be retained, causing the part to be removed from the optical core board to fall off, and tearing off the tape to expose the windowed area, the process further includes the following steps: Gold plating was applied to the exposed copper surface in the windowed area.
10. A PCB board, characterized in that, It is manufactured using the PCB board manufacturing method as described in any one of claims 1 to 9.