A method for sticking a heat-conducting ceramic sheet on a high-frequency circuit board

Abstract

The application discloses a method for sticking heat-conducting ceramic sheets on high-frequency circuit boards and relates to the technical field of sticking heat-conducting ceramic sheets on high-frequency circuit boards. The method comprises the following steps: S1, milling two through grooves A and two through grooves B on the left and right end portions of the high-frequency circuit board respectively; S2, limiting the high-frequency circuit board; S3, forming a bonding layer on the top surface of the high-frequency circuit board; S4, covering the heat-conducting ceramic sheet on the bonding layer; S5, embedding a copper strip in each of the four through grooves of the high-frequency circuit board; S6, bending the upper and lower end portions of the four copper strips; S7, making the welding head of the spot welding machine touch the top surface of the bent portion A; S8, embedding the high-frequency circuit board into the auxiliary limiting assembly area again; and S9, producing the first circuit product II. The application has the beneficial effect that the bonding layer can be effectively prevented from falling off the high-frequency circuit board naturally, and the quality of sticking the heat-conducting ceramic sheet on the high-frequency circuit board is greatly improved.

Description

Technical Field

[0001] This invention relates to the technical field of bonding thermally conductive ceramic sheets onto high-frequency circuit boards, and in particular to a method for bonding thermally conductive ceramic sheets onto high-frequency circuit boards. Background Technology

[0002] The high-frequency circuit board produced in a certain workshop is rectangular in shape. It has the characteristics of faster signal transmission and lower power loss. A large number of lines are distributed on the bottom surface of the high-frequency circuit board. When these lines are running at the same time, they will inevitably generate a lot of heat. The heat will be conducted to the high-frequency circuit board, thus causing damage to the high-frequency circuit board.

[0003] To solve the above problems, workers attach a thermally conductive ceramic sheet to the top surface of the high-frequency circuit board. This ceramic sheet absorbs heat from the circuit board, preventing damage due to overheating. Figure 1 The diagram shown is a schematic of the structure of a high-frequency circuit board 1 with a thermally conductive ceramic sheet 3 attached to it. The method by which the workers in the workshop attach a thermally conductive ceramic sheet 3 to the high-frequency circuit board 1 is as follows: R1. The worker removes a high-frequency circuit board 1, such as... Figures 2-3 As shown, place it flat on the workbench surface; R2. The worker uses a glue-applying machine to apply a layer of adhesive material to the top surface of the high-frequency circuit board 1, specifically to its center. After application, an adhesive layer 2 is formed on the top surface of the high-frequency circuit board 1. Figure 4 As shown; R3. The worker takes out a thermally conductive ceramic sheet 3 and covers it onto the adhesive layer 2 from top to bottom. The adhesive layer 2 bonds and fixes the thermally conductive ceramic sheet 3, thus achieving the bonding of a thermally conductive ceramic sheet 3 onto the high-frequency circuit board 1, thereby producing a corresponding circuit product I. The structure of circuit product I is as follows: Figure 1 As shown; R4. Workers repeat steps R1 to R3 multiple times to attach a thermally conductive ceramic sheet 3 to each batch of high-frequency circuit boards 1, thereby producing multiple circuit products I.

[0004] When the circuits on circuit product I are running simultaneously, the heat generated on the circuits is conducted to the high-frequency circuit board 1. The high-frequency circuit board 1 then conducts the heat through the adhesive layer 2 to the thermally conductive ceramic sheet 3. Finally, the thermally conductive ceramic sheet 3 conducts the heat into the air, thereby preventing the high-frequency circuit board 1 in circuit product I from being damaged due to excessive temperature.

[0005] However, although the method used by the workers in the workshop was able to attach the thermally conductive ceramic sheet 3 to the high-frequency circuit board 1, the following technical defects still existed: From step R3 Figure 1 As can be seen, when the adhesive layer 2 of circuit product I is subjected to prolonged heating, it will naturally fall off the high-frequency circuit board 1, causing the thermally conductive ceramic sheet 3 to fall off as well. This renders the entire circuit product I unusable, necessitating the re-attaching of the thermally conductive ceramic sheet 3 to the high-frequency circuit board 1, which undoubtedly increases the cost of use. Therefore, the method used in the workshop undoubtedly reduces the quality of attaching the thermally conductive ceramic sheet 3 to the high-frequency circuit board 1.

[0006] Therefore, there is an urgent need for a method that can effectively prevent the adhesive layer from falling off the high-frequency circuit board naturally and greatly improve the quality of bonding thermally conductive ceramic sheets on the high-frequency circuit board. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for attaching thermally conductive ceramic sheets on high-frequency circuit boards.

[0008] The objective of this invention is achieved through the following technical solution: a method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board, comprising the following steps: S1. Two through slots A and two through slots B are milled into the left and right ends of the high-frequency circuit board, respectively. S2. The high-frequency circuit board is embedded into the area enclosed by the two strip-shaped limiting grooves of the auxiliary limiting component to limit the high-frequency circuit board. S3. An adhesive layer is formed on the top surface of the high-frequency circuit board; S4. Cover the thermally conductive ceramic sheet onto the adhesive layer, and the adhesive layer will bond and fix the thermally conductive ceramic sheet in place. S5. Embed a copper strip in each of the four through slots of the high-frequency circuit board; S6. Bend the upper and lower ends of the four copper strips to form a bent part A that is attached to the top surface of the thermally conductive ceramic sheet, and at the same time, form a bent part B that is attached to the bottom surface of the high-frequency circuit board. S7. Make the welding head of the spot welding machine touch the top surface of the bent part A to weld the bent part A onto the heat-conducting ceramic sheet and form a circular weld scar A on the bent part A. S8. Remove the high-frequency circuit board from the auxiliary limiting component, then rotate the high-frequency circuit board 180°, and then re-insert the high-frequency circuit board into the area enclosed by the two strip limiting slots of the auxiliary limiting component. S9. Make the welding head of the spot welding machine touch the top surface of the bent part B to weld the bent part B onto the high-frequency circuit board and form a circular weld scar B on the bent part B, thereby finally realizing the bonding of a thermally conductive ceramic sheet onto the high-frequency circuit board and producing the first circuit product II.

[0009] In step S1, the through slots A and B in the high-frequency circuit board are symmetrical.

[0010] The auxiliary limiting component in step S2 includes a base and strip-shaped limiting blocks fixed on the top surfaces of the left and right ends of the base, respectively. Both strip-shaped limiting blocks are arranged longitudinally, and strip-shaped limiting grooves are opened on the inner end faces of both strip-shaped limiting blocks. The area enclosed by the two strip-shaped limiting grooves matches the outer contour of the high-frequency circuit board.

[0011] The two strip-shaped limiting blocks of the auxiliary limiting component are symmetrical about the base.

[0012] In step S3, an adhesive material is brushed onto the top surface of the high-frequency circuit board using a glue brushing machine, ensuring that the adhesive material is brushed within the area enclosed by the two through slots A and B of the high-frequency circuit board; after brushing, an adhesive layer is formed on the top surface of the high-frequency circuit board.

[0013] In step S5, the copper strip is interference-fitted with the through slot A in the high-frequency circuit board.

[0014] The method also includes step S10, whereby, after the first circuit product II is produced, the worker removes the circuit product II from the strip-shaped limiting groove of the auxiliary limiting component.

[0015] The present invention has the following advantages: it can effectively prevent the adhesive layer from falling off the high-frequency circuit board naturally and greatly improve the quality of bonding thermally conductive ceramic sheets on the high-frequency circuit board. Attached Figure Description

[0016] Figure 1 A schematic diagram of a structure for attaching a thermally conductive ceramic sheet to the top surface of a high-frequency circuit board; Figure 2 This is a schematic diagram of the structure of a high-frequency circuit board; Figure 3 for Figure 2 Top view; Figure 4 This is a schematic diagram of forming an adhesive layer on the top surface of a high-frequency circuit board. Figure 5 This is a schematic diagram of the auxiliary limiting component of the present invention; Figure 6 for Figure 5 Top view; Figure 7 for Figure 6 PP sectional view; Figure 8 A schematic diagram showing the structure for milling two through slots A and two through slots B into the left and right ends of a high-frequency circuit board, respectively. Figure 9 for Figure 8 Top view; Figure 10 A schematic diagram illustrating how to limit the movement of a high-frequency circuit board; Figure 11 for Figure 10 Top view; Figure 12 A schematic diagram showing how the adhesive layer bonds and fixes the thermally conductive ceramic sheet in place. Figure 13 for Figure 12 Top view; Figure 14 This is an isometric view of the copper strip. Figure 15 for Figure 14 The main view; Figure 16 This is a schematic diagram showing how a copper strip is embedded in each of the four through slots of a high-frequency circuit board. Figure 17 for Figure 16 Top view; Figure 18 A schematic diagram for forming the bent portion A attached to the top surface of the thermally conductive ceramic sheet; Figure 19 for Figure 18 Top view; Figure 20 A schematic diagram showing the formation of a circular weld scar A on the bend A; Figure 21 A schematic diagram illustrating the re-embedding of the high-frequency circuit board into the area enclosed by the two strip-shaped limiting slots of the auxiliary limiting component; Figure 22 A schematic diagram showing the formation of a circular weld scar B on the bend B; Figure 23 A schematic diagram of the structure for producing circuit product II; In the picture: 1-High frequency circuit board, 2-Adhesive layer, 3-Heat-conducting ceramic sheet, 4-Base, 5-Strip limiting block, 6-Strip limiting groove, 7-Through groove A, 8-Through groove B, 9-Copper strip, 10-Bending part A, 11-Bending part B, 12-Welding head, 13-Circular weld scar A, 14-Circular weld scar B. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings. The scope of protection of the present invention is not limited to the following description: A method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board includes the following steps: S1. Two through slots A7 and two through slots B8 are milled into the left and right ends of the high-frequency circuit board 1, respectively. The through slots A7 and B8 in the high-frequency circuit board 1 are symmetrical from left to right. Figures 8-9As shown. The specific milling process is as follows: First, take out a high-frequency circuit board 1, fix the high-frequency circuit board 1 on the tooling table of the CNC milling machine, and then the worker operates the CNC milling machine to first mill two through slots A7 in the left end of the high-frequency circuit board 1, and then mill two through slots B8 in the right end of the high-frequency circuit board 1.

[0018] S2. The high-frequency circuit board 1 is embedded into the area enclosed by the two strip-shaped limiting grooves 6 of the auxiliary limiting component to limit the high-frequency circuit board 1, such as... Figures 10-11 As shown; the structure of the auxiliary limiting component is as follows Figures 5-7 As shown, the auxiliary limiting component includes a base 4 and two strip-shaped limiting blocks 5 fixed to the top surfaces of the left and right ends of the base 4, respectively. Both strip-shaped limiting blocks 5 are arranged longitudinally, and each strip-shaped limiting groove 6 is formed on its inner end face. The area enclosed by the two strip-shaped limiting grooves 6 matches the outer contour of the high-frequency circuit board 1. The two strip-shaped limiting blocks 5 of the auxiliary limiting component are symmetrical about the base 4.

[0019] S3. An adhesive layer 2 is formed on the top surface of the high-frequency circuit board 1. An adhesive material is brushed onto the top surface of the high-frequency circuit board 1 using a glue brushing machine, ensuring that the adhesive material is brushed within the area enclosed by the two through slots A7 and B8 of the high-frequency circuit board 1. After brushing, an adhesive layer 2 is formed on the top surface of the high-frequency circuit board 1.

[0020] S4. Cover the thermally conductive ceramic sheet 3 onto the adhesive layer 2. The adhesive layer 2 will bond and fix the thermally conductive ceramic sheet 3 in place. Figures 12-13 As shown.

[0021] S5. An embedded element is placed in each of the four through slots of the high-frequency circuit board 1. Figures 14-15 The copper strip 9 shown is embedded as follows: Figures 16-17 As shown, the copper strip 9 is interference-fitted with the through slot A7 in the high-frequency circuit board 1.

[0022] S6. Bend the upper and lower ends of the four copper strips 9 to form bent portions A10 that adhere to the top surface of the thermally conductive ceramic sheet 3, and simultaneously form bent portions B11 that adhere to the bottom surface of the high-frequency circuit board 1, as shown. Figures 18-19 As shown.

[0023] S7. Make the welding head 12 of the spot welding machine touch the top surface of the bent portion A10 to weld the bent portion A10 onto the heat-conducting ceramic sheet 3, and form a circular weld scar A13 on the bent portion A10, such as Figure 20 As shown.

[0024] S8. Remove the high-frequency circuit board 1 from the auxiliary limiting assembly, then rotate the high-frequency circuit board 1 180°, and then re-insert the high-frequency circuit board 1 into the area enclosed by the two strip-shaped limiting grooves 6 of the auxiliary limiting assembly, as shown. Figure 21 As shown.

[0025] S9. Make the welding head 12 of the spot welding machine touch the top surface of the bent portion B11 to weld the bent portion B11 onto the high-frequency circuit board 1, and form a circular solder scar B14 on the bent portion B11, such as Figure 22 As shown, this ultimately enabled the bonding of a thermally conductive ceramic sheet 3 onto the high-frequency circuit board 1, resulting in the production of the first circuit product II. The structure of circuit product II is as follows. Figure 23 As shown.

[0026] When Figure 23 When the circuit on the circuit product II shown is running, the heat generated on the circuit is conducted to the high-frequency circuit board 1. The high-frequency circuit board 1 then conducts the heat through the adhesive layer 2 to the thermally conductive ceramic sheet 3. Finally, the thermally conductive ceramic sheet 3 conducts the heat into the air, thereby preventing the high-frequency circuit board 1 in the circuit product II from being damaged due to excessive temperature.

[0027] Among them, from the appendix in step S10 Figure 23 It can be seen that, since two copper strips 9 are welded to both the left and right ends of the thermally conductive ceramic sheet 3 of circuit product II, and the lower ends of the four copper strips 9 penetrate the high-frequency circuit board 1 and are welded to the bottom surface of the high-frequency circuit board 1, the adhesive layer 2 is always pressed between the thermally conductive ceramic sheet 3 and the high-frequency circuit board 1. Therefore, when the adhesive layer 2 of circuit product II is heated for a long time, the adhesive layer 2 will not fall off the high-frequency circuit board 1 naturally, thus extending the service life of the entire circuit product II. Therefore, this method is superior to... Figures 1-4 The bonding method shown effectively prevents the adhesive layer 2 from falling off the high-frequency circuit board 1 naturally, thereby greatly improving the quality of bonding the thermally conductive ceramic sheet 3 to the high-frequency circuit board 1.

[0028] S10. The worker removes the circuit product II from the strip-shaped limiting groove 6 of the auxiliary limiting component.

[0029] S11. Workers repeat steps S1 to S10 multiple times to attach a thermally conductive ceramic sheet 3 to each batch of high-frequency circuit boards 1, thereby producing multiple circuit products II.

[0030] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board, characterized in that: It includes the following steps: S1. Two through slots A (7) and two through slots B (8) are milled into the left and right ends of the high-frequency circuit board (1), respectively. S2. The high-frequency circuit board (1) is embedded into the area enclosed by the two strip-shaped limiting grooves (6) of the auxiliary limiting component to limit the high-frequency circuit board (1); S3. An adhesive layer (2) is formed on the top surface of the high-frequency circuit board (1). S4. Cover the thermally conductive ceramic sheet (3) on the adhesive layer (2), and the adhesive layer (2) will bond and fix the thermally conductive ceramic sheet (3). S5. A copper strip (9) is embedded in each of the four through slots of the high-frequency circuit board (1). S6. Bend the upper and lower ends of the four copper strips (9) to form a bent part A (10) attached to the top surface of the thermally conductive ceramic sheet (3), and at the same time, form a bent part B (11) attached to the bottom surface of the high-frequency circuit board (1). S7. Make the welding head (12) of the spot welding machine touch the top surface of the bent part A (10) to weld the bent part A (10) onto the heat-conducting ceramic sheet (3) and form a circular weld scar A (13) on the bent part A (10). S8. Take the high-frequency circuit board (1) out of the auxiliary limiting component, then flip the high-frequency circuit board (1) 180°, and then embed the high-frequency circuit board (1) into the area enclosed by the two strip limiting grooves (6) of the auxiliary limiting component again. S9. Make the welding head (12) of the spot welding machine touch the top surface of the bent part B (11) to weld the bent part B (11) onto the high-frequency circuit board (1) and form a circular weld scar B (14) on the bent part B (11), thereby finally realizing the bonding of a thermally conductive ceramic sheet (3) onto the high-frequency circuit board (1) and producing the first circuit product II.

2. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 1, characterized in that: In step S1, the through slots A (7) and B (8) in the high-frequency circuit board (1) are symmetrical.

3. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 1, characterized in that: The auxiliary limiting component in step S2 includes a base (4) and strip-shaped limiting blocks (5) respectively fixed on the top surfaces of the left and right ends of the base (4). Both strip-shaped limiting blocks (5) are arranged longitudinally, and strip-shaped limiting grooves (6) are opened on the inner end surfaces of both strip-shaped limiting blocks (5). The area enclosed by the two strip-shaped limiting grooves (6) matches the outer contour of the high-frequency circuit board (1).

4. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 3, characterized in that: The two strip-shaped limiting blocks (5) of the auxiliary limiting component are symmetrical about the base (4).

5. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 1, characterized in that: In step S3, a layer of adhesive material is brushed onto the top surface of the high-frequency circuit board (1) using a glue brushing machine, ensuring that the adhesive material is brushed within the area enclosed by the two through slots A (7) and two through slots B (8) of the high-frequency circuit board (1); after brushing, an adhesive layer (2) is formed on the top surface of the high-frequency circuit board (1).

6. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 1, characterized in that: In step S5, the copper strip (9) is interference-fitted with the through slot A (7) in the high-frequency circuit board (1).

7. The method for attaching a thermally conductive ceramic sheet to a high-frequency circuit board according to claim 1, characterized in that: The method also includes step S10, whereby, after the first circuit product II is produced, the worker removes the circuit product II from the strip-shaped limiting groove (6) of the auxiliary limiting component.

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