A circuit board etching liquid uniform spraying device and spraying method
By using a dynamic sweeping spray device and a modular nozzle fixing mechanism, the problem of uneven spraying of PCB etching solution was solved, achieving uniform coverage of the solution and efficient etching, thus improving etching quality and equipment applicability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FOSHAN SHUNDE YICHUANG ELECTRONICS CO LTD
- Filing Date
- 2026-05-27
- Publication Date
- 2026-07-14
AI Technical Summary
In existing circuit board etching solution spraying equipment, the nozzles are fixed, resulting in uneven distribution of the solution, creating overlapping and weak areas, which affects the etching quality.
The system employs a dynamic sweeping spray device, which drives the nozzles to perform compound movements through a forward and backward swinging mechanism and a left and right swinging mechanism, thereby achieving two-dimensional sweeping of the nozzles. Combined with a modular nozzle fixing mechanism, it can be adapted to different board sizes.
It improves the uniformity of chemical solution distribution, reduces poor etching of circuit boards, enhances etching quality and equipment applicability, and reduces maintenance difficulty.
Smart Images
Figure CN122395837A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board manufacturing equipment technology, and in particular to a circuit board etching solution uniform spraying device and spraying method. Background Technology
[0002] In the mass production process of printed circuit boards (PCBs), the etching process is a core and critical step that determines the quality of the circuit board. This process mainly relies on etching solution to directionally etch and remove excess conductive copper foil on the surface of the PCB, thereby creating the precision circuit traces and patterns required by the design. Throughout the etching process, whether the etching solution can act evenly, continuously, and fully on the upper and lower surfaces of the PCB directly determines the consistency of the etching depth, the regularity of the circuit edges, and the overall yield rate. The operation method and movement mode of the spraying operation have become important factors restricting the improvement of etching process quality and efficiency.
[0003] In existing circuit board etching solution spraying equipment, the spray nozzles are all fixed in position. After installation, the nozzles remain stationary, and can only spray the solution within their predetermined spray range. This results in overlapping and weak spray areas between adjacent nozzles, leading to significant differences in the flow rate of etching solution received by different areas of the circuit board. Furthermore, the circuit board is conveyed forward at a constant speed by a transport mechanism. The stationary nozzles continuously spray the same spot on the board, easily causing a large accumulation of solution in that area, forming a thick film and leading to defects such as over-etching of localized circuits and inconsistent circuit widths. Meanwhile, insufficient solution supply to the board area corresponding to the nozzle gaps results in a low etching reaction rate, easily causing copper foil residue and incomplete etching. Therefore, it is necessary to provide a circuit board etching solution uniform spraying device and method to solve the above-mentioned technical problems. Summary of the Invention
[0004] The technical problem solved by this invention is to provide a hydraulic tensioning device and its usage method that can operate smoothly, realize dynamic sweeping spraying of the nozzle back and forth, effectively improve the problem of uneven distribution of chemical solution on the board surface, and improve the etching quality of circuit boards.
[0005] To solve the above-mentioned technical problems, the present invention provides a circuit board etching solution uniform spraying device, including an outer casing and a plurality of dual-fluid spray nozzles disposed inside the outer casing. Side mounting plates are fixedly installed on the inner walls of both sides of the outer casing. Two first slide rails are fixedly installed on the outer wall of the two side mounting plates that are close to each other. The same movable vertical seat is slidably installed on the two first slide rails on the same side mounting plate. Two horizontal plates are fixedly installed on the outer wall of the two movable vertical seats that are close to each other. The plurality of dual-fluid spray nozzles are respectively installed on the two horizontal plates. A first fixing frame is fixedly installed on one of the side mounting plates. A front-back swing mechanism is installed on the first fixing frame. The front-back swing mechanism is used to drive the movable vertical seat to slide back and forth along the first slide rail, thereby driving the horizontal plate and the dual-fluid spray nozzles to move back and forth synchronously.
[0006] Preferably, the forward and backward swinging mechanism includes a first electric motor, a first push-pull arm, and a first cam. The first electric motor is fixedly mounted on the first fixed frame, and the first cam is fixedly sleeved on the output end of the first electric motor. One end of the first push-pull arm is rotatably connected to the corresponding movable vertical seat, and the other end is rotatably connected to the eccentric end of the first cam.
[0007] Preferably, the top and bottom of the movable vertical seat are rotatably mounted with multiple first rollers at equal intervals. The first rollers are embedded in the grooves of the corresponding first slide rails and roll in close contact with the inner sidewall of the grooves.
[0008] Furthermore, two second slide rails are fixedly installed on the outer walls of the two cross plates on opposite sides. The same movable cross plate is slidably installed in the two second slide rails on the same cross plate. Multiple dual-fluid spray nozzles are respectively installed on the two movable cross plates. A second fixing frame is fixedly installed on each of the two cross plates. A left-right swinging mechanism is installed on each of the two second fixing frames. The left-right swinging mechanism is used to drive the movable cross plate to slide back and forth along the second slide rail, thereby driving the dual-fluid spray nozzles to swing horizontally synchronously.
[0009] Preferably, the left and right swinging mechanism includes a second electric motor, a second push-pull arm, and a second cam. The second electric motor is fixedly mounted on the second fixed frame, and the second cam is fixedly sleeved on the output end of the second electric motor. A bent connecting rod is fixedly mounted on the cross plate. One end of the second push-pull arm is rotatably connected to the bent connecting rod, and the other end is rotatably connected to the eccentric end of the second cam.
[0010] Furthermore, multiple nozzle fixing mechanisms arranged in a rectangular array are installed on the outer walls of the two movable horizontal plates on opposite sides, and multiple dual-fluid spray nozzles are respectively fixedly installed in the corresponding nozzle fixing mechanisms.
[0011] Preferably, the nozzle fixing mechanism includes two U-shaped positioning blocks, two sliding bars, and four pins. The two U-shaped positioning blocks are fixedly mounted on the movable horizontal plate. The two fluid inlet seats of the dual-fluid spray nozzle are both square and located within their respective U-shaped positioning blocks. Fixed sliding rods are fixedly mounted on the outer walls of both sides of the two sliding bars. The two sliding bars are slidably sleeved on their respective fixed sliding rods. The four pins are fixedly mounted at both ends of the two sliding bars. An end plate is fixedly mounted on the end of each fixed sliding rod away from its corresponding U-shaped positioning block. A retaining spring is sleeved on the fixed sliding rod, with one end contacting the end plate and the other end contacting the sliding bar. Limiting blocks are fixedly mounted on the outer walls of both sides of the two fluid inlet seats of the dual-fluid spray nozzle. The outer walls of the two U-shaped positioning blocks that are far apart from each other are in contact with their respective limiting blocks. Circular slots are provided on the limiting blocks, and one end of each sliding bar extends into the circular slot.
[0012] Preferably, the connection between the inner walls on both sides and the top of the U-shaped positioning block is chamfered.
[0013] Furthermore, two connecting plates are fixedly installed on the outer walls of the two U-shaped positioning blocks that are close to each other, and anti-return blocks are fixedly installed on the outer walls of the two connecting plates that are far apart from each other. The two anti-return blocks are respectively located below the corresponding sliding bars, and a rotating hand plate is rotatably installed on the two sliding bars.
[0014] To address the above problems, the present invention also provides a method for using a circuit board etching solution uniform spraying device, comprising the following steps: T1: Smoothly transport the circuit board to be etched to the spraying operation area inside the outer casing; T2: Introduce etching solution and compressed air into the dual-fluid spray nozzle 6, so that the dual-fluid spray nozzle 6 sprays out mixed atomized etching solution. T3: Start the front and back swing mechanism, and use the front and back swing mechanism to drive the moving vertical seat to perform a back and forth reciprocating sliding motion along the first slide rail 3; T4: The moving vertical seat drives the horizontal carrier plate and the dual-fluid spray nozzles installed on the horizontal carrier plate to move back and forth synchronously. During the reciprocating movement, the circuit board surface is continuously subjected to dynamic sweeping spraying operation. T5: After the circuit board etching spraying process is completed, close the front and rear swing mechanism, and at the same time stop supplying etching liquid and compressed air to the dual-fluid spray nozzle, and end the spraying operation.
[0015] Compared with related technologies, the circuit board etching solution uniform spraying device and spraying method provided by the present invention have the following beneficial effects: The present invention provides a device for uniformly spraying a circuit board etching solution. By setting up a first slide rail, a moving vertical seat, a front-back swing mechanism, etc., a linkage drive structure is formed, changing the traditional spraying mode where the spray heads are fixed, and it can drive all the two-fluid spray heads to complete reciprocating dynamic sweeping back and forth. By means of the position movement of the spray heads, the spraying amount of the etching solution at various parts of the circuit board surface is balanced, effectively eliminating the accumulation of the etching solution and the weak spraying areas caused by fixed-point spraying, enabling the etching solution to uniformly cover the entire surface of the circuit board, reducing the difference in the etching reaction rate at various parts of the surface, and fundamentally reducing the generation of defective products such as over-etching of the circuit and residual copper, and effectively improving the etching forming quality of the circuit board; The present invention further optimizes the spraying trajectory and coverage effect by setting up a left-right swing mechanism to form a coordinated linkage with the front-back swing mechanism. The left-right swing mechanism can drive the moving cross plate to reciprocate left and right along the second slide rail,带动 the two-fluid spray heads to complete lateral swinging synchronously. Combined with the longitudinal sweeping driven by the front-back swing mechanism, the spray heads form a two-dimensional composite spraying trajectory, completely eliminating the spraying blind areas and overlapping areas between adjacent spray heads, and further improving the spraying uniformity; The modular spray head fixing mechanism provided in the present invention is arranged in a rectangular array, forming standardized spray head installation points, with extremely strong flexible adaptability and convenient maintainability. On the one hand, according to the actual size of the circuit board to be etched and the requirements of the etching process, the installation quantity and installation position of the spray heads can be flexibly selected. Without changing the overall mechanical structure, the precise matching of the spraying area and the size of the board can be achieved, reducing both the ineffective consumption of the etching solution and compressed air, and avoiding the risk of etching solution residue and corrosion in the non-spraying area, adapting to circuit boards of different lengths and widths, and further broadening the application scope of the equipment; on the other hand, this fixing mechanism adopts an elastic locking structure, combined with the design of a rotating hand plate and an anti-return block, enabling the quick disassembly and assembly of the spray heads. Without the need for any special tools, it is convenient for the staff to clean, dredge and replace the spray heads, greatly reducing the daily maintenance difficulty of the equipment, shortening the downtime for maintenance, ensuring the continuous and stable operation of the etching production line, and indirectly improving the production efficiency.
[0016] The present invention provides a method for using a device for uniformly spraying a circuit board etching solution. This method is simple to operate, relying on dynamic spraying to improve the uniformity of the distribution of the etching solution and effectively improve the etching quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a three-dimensional structural schematic diagram of the device for uniformly spraying a circuit board etching solution provided by the present invention; Figure 2 is Figure 1 a sectional three-dimensional structural schematic diagram of the side front view of the device for uniformly spraying a circuit board etching solution shown in; Figure 3 is Figure 1 a front view of the device for uniformly spraying a circuit board etching solution shown in; Figure 4 for Figure 2 The diagram shows the structural schematic of the components installed inside the outer casing; Figure 5 for Figure 4 A structural schematic diagram from another perspective is shown; Figure 6 for Figure 4 The diagram shows the connection between the movable vertical seat and the forward and backward swinging mechanism. Figure 7 for Figure 3 The diagram shows the structure of the forward and backward swinging mechanism. Figure 8 for Figure 5 The diagram shows the connection between the movable horizontal plate and the left-right swinging mechanism. Figure 9 for Figure 8 The diagram shows the structure of the left and right swinging mechanism. Figure 10 for Figure 8 The diagram shows the interaction between the movable horizontal plate and the horizontal support plate. Figure 11 for Figure 8 The diagram shows the connection between the nozzle fixing mechanism and the dual-fluid spray nozzle. Figure 12 for Figure 11 The diagram shows the interaction between the nozzle fixing mechanism and the dual-fluid spray nozzle. Figure 13 for Figure 12 The diagram shows the structure of the nozzle fixing mechanism.
[0018] Numbering on the map: 1. Outer casing; 2. Side mounting plate; 3. First slide rail; 4. Movable vertical seat; 5. Horizontal support plate; 6. Dual-fluid spray nozzle; 7. First fixed frame; 8. Front and rear swing mechanism; 81. First electric motor; 82. First push-pull arm; 83. First cam; 9. Second slide rail; 10. Movable horizontal plate; 11. Second fixed frame; 12. Left and right swing mechanism; 121. Second electric motor; 122. Second push-pull arm; 123. Second cam; 13. Nozzle fixing mechanism; 131. U-shaped positioning block; 132. Connecting plate; 133. Fixed slide bar; 134. Sliding bar; 135. Pin; 136. End plate; 137. Holding spring; 138. Anti-reverse block; 139. Rotating hand plate; 14. Limiting block; 140. Circular slot. Detailed Implementation
[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0020] First embodiment: Please refer to the following:Figures 1-12 In the first embodiment of the present invention, a circuit board etching solution uniform spraying device is proposed, which includes: an outer box 1 and a plurality of dual-fluid spray nozzles 6 disposed inside the outer box 1. The outer box 1 is designed to prevent the etching solution from splashing outwards and to collect the dripping etching solution for easy recycling. Side mounting plates 2 are fixedly installed on both inner walls of the outer box 1. Two first slide rails 3 are fixedly installed on the outer wall of the side of the two side mounting plates 2 that are close to each other. The first slide rails 3 are used to provide forward and backward sliding guidance and limiting constraint. The same movable vertical seat 4 is slidably installed on the two first slide rails 3 located on the same side mounting plate 2. Specifically, a plurality of first rollers are rotatably installed at equal intervals on the top and bottom of the movable vertical seat 4. The first rollers are embedded in the slide grooves of the corresponding first slide rails 3 and roll and fit against the inner side wall of the slide groove. The movable vertical seat 4 is an intermediate support bracket that can smoothly complete the forward and backward movement along the first slide rails 3. The two movable vertical seats 4 are fixedly installed on the outer wall of the side of the two movable vertical seats 4 that are close to each other. Two horizontal support plates 5 are fixedly installed, arranged symmetrically to support the upper and lower dual-fluid spray nozzles 6, respectively, to match the double-sided synchronous etching spraying process on the circuit board. Multiple dual-fluid spray nozzles 6 are installed on the two horizontal support plates 5. The dual-fluid spray nozzles 6 can be connected to the etching solution delivery pipeline and the compressed air pipeline respectively to achieve gas-liquid mixed atomization spraying. The top and one side of the outer box 1 are provided with pipeline passage openings for the upper and lower pipelines to pass through, respectively. A first fixed frame 7 is fixedly installed on one of the side mounting plates 2. The first fixed frame 7 is equipped with a front-back swing mechanism 8. The front-back swing mechanism 8 is used to drive the moving vertical seat 4 to slide back and forth along the first slide rail 3, driving the horizontal support plates 5 and the dual-fluid spray nozzles 6 to move back and forth synchronously to complete the longitudinal sweeping spraying operation. An etching solution discharge pipe is fixedly installed at the bottom of the outer box 1 to discharge the etching solution collected at the bottom of the box for subsequent recycling and reuse.
[0021] Specifically, the forward and backward swing mechanism 8 includes a first electric motor 81, a first push-pull arm 82, and a first cam 83. The first electric motor 81 is fixedly mounted on the first fixed frame 7, and the first cam 83 is fixedly sleeved on the output end of the first electric motor 81. It is driven by the first electric motor 81 to perform uniform circular rotation. One end of the first push-pull arm 82 is rotatably connected to the corresponding movable vertical seat 4, and the other end is rotatably connected to the eccentric end of the first cam 83. By utilizing the eccentric rotational motion characteristics of the cam, the rotational motion of the first electric motor 81 is converted into linear reciprocating push-pull motion through the first push-pull arm 82, thereby stably driving the movable vertical seat 4 to complete the forward and backward reciprocating sliding motion.
[0022] In this embodiment, two second slide rails 9 are fixedly installed on the outer walls of the two cross plates 5 on opposite sides. The same movable cross plate 10 is slidably installed in the two second slide rails 9 on the same cross plate 5. The movable cross plate 10 can slide back and forth along the second slide rails 9 in the left and right directions. Multiple dual-fluid spray nozzles 6 are respectively installed on the two movable cross plates 10 to realize the overall horizontal synchronous movement of the dual-fluid spray nozzles 6. A second fixed frame 11 is fixedly installed on both cross plates 5. A left and right swing mechanism 12 is installed on both second fixed frames 11. The left and right swing mechanism 12 is used to drive the movable cross plate 10 to slide back and forth along the second slide rails 9, driving the dual-fluid spray nozzles 6 to swing horizontally synchronously. The forward and backward sweeping and the left and right swinging cooperate with each other to make the dual-fluid spray nozzles 6 form a two-dimensional composite spray trajectory, which greatly improves the uniformity of the spray coverage on the plate surface.
[0023] In this embodiment, the left-right swing mechanism 12 includes a second electric motor 121, a second push-pull arm 122, and a second cam 123. The second electric motor 121 is fixedly mounted on the second fixed frame 11, and the second cam 123 is fixedly sleeved on the output end of the second electric motor 121. A bent connecting rod is fixedly mounted on the cross plate 5. The bent connecting rod plays the role of transmission steering and force arm adaptation, adapting to the installation space layout. One end of the second push-pull arm 122 is rotatably connected to the bent connecting rod, and the other end is rotatably connected to the eccentric end of the second cam 123. Similarly, this mechanism converts rotational motion into transverse linear reciprocating motion, accurately driving the moving cross plate 10 to complete the left-right swing.
[0024] Furthermore, multiple nozzle fixing mechanisms 13 arranged in a rectangular array are installed on the outer walls of the two movable horizontal plates 10 on opposite sides. The regularly arranged nozzle fixing mechanisms 13 form a standardized installation point matrix. Depending on the actual circuit board size and spray area requirements, all or only some dual-fluid spray nozzles 6 can be installed in the corresponding area to achieve flexible configuration of the spray area. Without modifying the overall mechanical structure, it can adapt to the spraying operation of PCB boards of different specifications, greatly improving the equipment's versatility. Multiple dual-fluid spray nozzles 6 are fixedly installed in the corresponding nozzle fixing mechanisms 13 to achieve modular and rapid assembly and positioning of the nozzles.
[0025] Preferably, the nozzle fixing mechanism 13 includes two U-shaped positioning blocks 131, two sliding bars 134, and four pins 135. The two U-shaped positioning blocks 131 are fixedly installed on the movable horizontal plate 10. The two fluid inlet seats of the dual-fluid spray nozzle 6 are square and located within the corresponding U-shaped positioning blocks 131. The outer dimensions of the two fluid inlet seats are adapted to the inner groove dimensions of the U-shaped positioning blocks 131, allowing them to accurately engage with the corresponding U-shaped positioning blocks 131 for initial alignment. The movable horizontal plate 10 has a clearance strip opening through which the dual-fluid spray nozzle 6 passes and is movably connected to the inner wall of the clearance strip opening. Fixed sliding rods 133 are fixedly installed on the outer walls of both sides of the two sliding bars 134. The two sliding bars 134 are slidably sleeved on the corresponding two fixed sliding rods 133. The fixed sliding rods 133 provide linear sliding guidance for the sliding bars 134, restricting their displacement to only along the axis. The four pins 135 are fixedly installed on the two... Both ends of the sliding bar 134 move synchronously with the sliding bar 134. The end of the fixed sliding rod 133 away from the corresponding U-shaped positioning block 131 is fixedly installed with an end plate 136. A retaining spring 137 is sleeved on the fixed sliding rod 133. One end of the retaining spring 137 is in contact with the end plate 136, and the other end is in contact with the sliding bar 134. Under normal conditions, the retaining spring 137 pushes the sliding bar 134 towards one side of the U-shaped positioning block 131 by its own elastic force. Limiting blocks 14 are fixedly installed on the outer walls of both sides of the two fluid inlet seats of the dual-fluid spray nozzle 6. The outer walls of the two U-shaped positioning blocks 131 away from each other are in contact with the two corresponding limiting blocks 14, realizing the front and rear positioning of the dual-fluid spray nozzle 6. A circular slot 140 is opened on the limiting block 14. One end of the sliding bar 134 extends into the circular slot 140, which can lock and fix the dual-fluid spray nozzle 6, effectively preventing the nozzle from loosening or shifting due to the impact of the liquid during spraying.
[0026] In this embodiment, the connection between the inner walls on both sides and the top of the U-shaped positioning block 131 is chamfered. The chamfered structure can form a guide slope, which can guide the square fluid inlet seat to slide quickly into the slot when installing the dual-fluid spray nozzle 6, reducing assembly difficulty and improving installation efficiency.
[0027] In this embodiment, two connecting plates 132 are fixedly installed on the outer wall of the two U-shaped positioning blocks 131 that are close to each other. The connecting plates 132 are used to securely connect the two sets of U-shaped positioning blocks 131. Anti-reverse blocks 138 are fixedly installed on the outer wall of the two connecting plates 132 that are far apart from each other. The two anti-reverse blocks 138 are respectively located below the corresponding sliding bars 134. Rotating hand plates 139 are rotatably installed on the two sliding bars 134. During disassembly and assembly, the rotating hand plates 139 are manually pulled, which causes the sliding bars 134 to overcome the elastic force of the retaining springs 137 and slide away from the U-shaped positioning blocks 131. The sliding bars 134 simultaneously drive the two U-shaped positioning blocks 131 to move away from the U-shaped positioning blocks 131. The end pin 135 exits the circular slot 140 on the limit block 14, releasing the nozzle locking state; then rotate the rotary hand plate 139, and the rotary hand plate 139 overlaps and locks onto one side of the anti-return block 138. The anti-return block 138 limits and blocks the rotary hand plate 139, restricting the sliding bar 134 from springing back to its original position. No manual continuous force is required to fix it. At this time, the disassembly, cleaning, maintenance and replacement of the dual-fluid spray nozzle 6 can be completed freely. During assembly, simply rotate the rotary hand plate 139 to disengage from the anti-return block 138. The retaining spring 137 will automatically push the sliding bar 134 to its original position, and the pin 135 will automatically lock. The overall disassembly and assembly are convenient and efficient.
[0028] Working principle: According to the actual size (length, width) and process requirements of the circuit board to be etched, select the corresponding area in the nozzle fixing mechanism 13 of the moving horizontal plate 10 to install the dual-fluid spray nozzle 6, so that the spray range is adapted to the actual size of the board, saving etching liquid and compressed air, and avoiding the generation of chemical residue and corrosion risks in non-working areas. The first electric motor 81 and the second electric motor 121 are started sequentially. Using an eccentric cam transmission structure, the first electric motor 81 drives the first cam 83 to rotate at a constant speed, which, via the first push-pull arm 82, drives the moving vertical seat 4 to slide back and forth. The second electric motor 121 drives the second cam 123 to rotate at a constant speed, which, via the second push-pull arm 122, drives the moving horizontal plate 10 to slide left and right. The moving vertical seat 4 drives the entire dual-fluid spray nozzle 6 to complete a longitudinal back-and-forth sweeping motion, while each moving horizontal plate 10 drives its own dual-fluid spray nozzle 6 to complete a lateral left-right swinging motion. The two sets of movements coordinate with each other, so that all the installed dual-fluid spray nozzles 6 form an all-round, blind-angle composite spray trajectory; combined with the relative motion of the circuit board itself at a constant speed, completely eliminating... In addition to the problems of flow difference between nozzles, blind spots in spraying caused by conveyor rollers, and liquid accumulation at fixed positions on the board surface that exist in traditional fixed spraying, this method can also adjust the number of nozzle rows to be used according to the width of the board, further optimizing the uniformity of spraying and avoiding insufficient spraying of edge boards or excessive spraying of middle boards. It achieves precise control of spraying on demand. Etching liquid and compressed air are introduced into the dual-fluid spray nozzle 6 respectively. The internal structure of the dual-fluid nozzle completes the gas-liquid mixing, tearing and atomizing large particles of etching liquid into fine and uniform liquid droplets, which are evenly sprayed on the upper and lower surfaces of the circuit board. The airflow simultaneously forms a purging effect, quickly dispersing the liquid accumulated on the surface of the board, weakening the pooling effect, ensuring that the etching rate is consistent throughout the circuit board, effectively improving the etching accuracy of fine lines, and reducing defects such as side etching, residual copper, and over-etching of board edges.
[0029] When the dual-fluid spray head 6 becomes clogged with pesticide or its components are worn and damaged, requiring disassembly for cleaning, repair, or replacement, the operator manually operates the rotary lever 139. This causes the sliding bar 134 to slide outward against the spring force of the retaining spring 137, disengaging the pin 135 at the end of the sliding bar 134 from the circular slot 140 on the limiting block 14, thus releasing the locking limit of the spray head. Then, the rotary lever 139 is rotated to engage with the anti-reverse stop block 138, completing the positioning and preventing the sliding bar 134 from springing back to its original position. At this point, the spray head can be directly... Next, remove the dual-fluid spray nozzle 6 from the U-shaped positioning block 131 to complete the nozzle cleaning, unblocking, and maintenance. After maintenance or replacement with a new nozzle, align the square fluid inlet seat of the dual-fluid spray nozzle 6 and insert it into the U-shaped positioning block 131. Then, rotate the rotary lever 139 to release it from the limiting constraint of the anti-reverse block 138. The spring 137 uses its own elastic potential energy to push the sliding bar 134 to automatically reset, driving the pin 135 to re-engage into the round slot 140, automatically completing the nozzle locking and fixing. The entire disassembly and assembly operation requires no disassembly or assembly tools, making it simple and quick. This effectively reduces the difficulty of daily equipment maintenance, significantly shortens equipment downtime for maintenance, and ensures the continuous and stable operation of the etching production line.
[0030] Second embodiment: In a second embodiment of the present invention, a method for using a circuit board etching solution uniform spraying device is provided, comprising the following steps: T1: Based on the actual size of the circuit board, lay out the dual-fluid spray nozzles 6 on the moving horizontal plate 10 and lock them in place with the help of the nozzle fixing mechanism 13. After checking that the overall machine is in good working order, smoothly transport the circuit board to be etched to the spraying operation area inside the outer box 1. T2: Introduce etching solution and compressed air into the dual-fluid spray nozzle 6, and adjust the delivery pressure to make the dual-fluid spray nozzle 6 stably spray out uniform mixed atomized etching solution. T3: Start the front and back swing mechanism 8, and use the front and back swing mechanism 8 to drive the moving vertical seat 4 to make a back and forth reciprocating sliding motion along the first slide rail 3. At the same time, the left and right swing mechanism 12 is opened simultaneously, and the moving horizontal plate 10 is driven to complete the left and right reciprocating sliding motion along the second slide rail 9. T4: The moving vertical seat 4 drives the horizontal plate 5 and the dual-fluid spray nozzle 6 installed on the horizontal plate 5 to move back and forth synchronously. Together with the left and right swing of the moving horizontal plate 10, a composite spray trajectory is formed. During the reciprocating movement, the upper and lower surfaces of the circuit board are continuously subjected to all-round dynamic sweeping spraying operations. T5: After the circuit board etching spraying process is completed, the front and rear swinging mechanism 8 and the left and right swinging mechanism 12 are closed in sequence. At the same time, the supply of etching liquid and compressed air to the dual-fluid spray nozzle 6 is stopped, and the spraying operation is ended. Subsequently, the rotating hand plate 139 can be operated to unlock the nozzle and complete the nozzle disassembly, cleaning and maintenance replacement.
[0031] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A circuit board etching solution uniform spraying device, comprising an outer casing and a plurality of dual-fluid spray nozzles disposed within the outer casing, characterized in that, Side mounting plates are fixedly installed on both inner walls of the outer casing. Two first slide rails are fixedly installed on the outer wall of the two side mounting plates that are close to each other. The same movable vertical seat is slidably installed on the two first slide rails on the same side mounting plate. Two horizontal load plates are fixedly installed on the outer wall of the two movable vertical seats that are close to each other. Multiple dual-fluid spray nozzles are respectively installed on the two horizontal load plates. A first fixing frame is fixedly installed on one of the side mounting plates. A front-back swing mechanism is installed on the first fixing frame. The front-back swing mechanism is used to drive the movable vertical seat to slide back and forth along the first slide rail, thereby driving the horizontal load plate and the dual-fluid spray nozzles to move back and forth synchronously.
2. The circuit board etching solution uniform spraying device according to claim 1, characterized in that, The forward and backward swinging mechanism includes a first electric motor, a first push-pull arm, and a first cam. The first electric motor is fixedly mounted on the first fixed frame, and the first cam is fixedly sleeved on the output end of the first electric motor. One end of the first push-pull arm is rotatably connected to the corresponding movable vertical seat, and the other end is rotatably connected to the eccentric end of the first cam.
3. The circuit board etching solution uniform spraying device according to claim 1, characterized in that, The top and bottom of the movable vertical seat are rotatably mounted with multiple first rollers at equal intervals. The first rollers are embedded in the grooves of the corresponding first slide rails and roll in close contact with the inner sidewall of the grooves.
4. The circuit board etching solution uniform spraying device according to claim 1, characterized in that, Two second slide rails are fixedly installed on the outer walls of the two cross plates on opposite sides. The same movable cross plate is slidably installed in the two second slide rails on the same cross plate. Multiple dual-fluid spray nozzles are respectively installed on the two movable cross plates. A second fixing frame is fixedly installed on each of the two cross plates. A left-right swinging mechanism is installed on each of the two second fixing frames. The left-right swinging mechanism is used to drive the movable cross plate to slide back and forth along the second slide rail, thereby driving the dual-fluid spray nozzles to swing horizontally synchronously.
5. The circuit board etching solution uniform spraying device according to claim 4, characterized in that, The left and right swinging mechanism includes a second electric motor, a second push-pull arm, and a second cam. The second electric motor is fixedly mounted on the second fixed frame, and the second cam is fixedly sleeved on the output end of the second electric motor. A bent connecting rod is fixedly mounted on the cross plate. One end of the second push-pull arm is rotatably connected to the bent connecting rod, and the other end is rotatably connected to the eccentric end of the second cam.
6. The circuit board etching solution uniform spraying device according to claim 4, characterized in that, Multiple nozzle fixing mechanisms arranged in a rectangular array are installed on the outer walls of the two movable horizontal plates on opposite sides. The multiple dual-fluid spray nozzles are respectively fixedly installed in the corresponding nozzle fixing mechanisms.
7. The circuit board etching solution uniform spraying device according to claim 6, characterized in that, The nozzle fixing mechanism includes two U-shaped positioning blocks, two sliding bars, and four pins. The two U-shaped positioning blocks are fixedly mounted on the movable horizontal plate. The two fluid inlet seats of the dual-fluid spray nozzle are both square and located within their respective U-shaped positioning blocks. Fixed sliding rods are fixedly mounted on the outer walls of both sides of the two sliding bars. The two sliding bars are slidably sleeved on their respective fixed sliding rods. The four pins are fixedly mounted at both ends of the two sliding bars. An end plate is fixedly mounted on the end of each fixed sliding rod away from its corresponding U-shaped positioning block. A retaining spring is sleeved on the fixed sliding rod, with one end contacting the end plate and the other end contacting the sliding bar. Limiting blocks are fixedly mounted on the outer walls of both sides of the two fluid inlet seats of the dual-fluid spray nozzle. The outer walls of the two U-shaped positioning blocks that are far apart from each other are in contact with their respective limiting blocks. Circular slots are provided on the limiting blocks, and one end of each sliding bar extends into the circular slot.
8. The circuit board etching solution uniform spraying device according to claim 7, characterized in that, The connection between the inner walls on both sides and the top of the U-shaped positioning block is chamfered.
9. The circuit board etching solution uniform spraying device according to claim 7, characterized in that, Two connecting plates are fixedly installed on the outer wall of the two U-shaped positioning blocks that are close to each other, and anti-reverse blocks are fixedly installed on the outer wall of the two connecting plates that are far from each other. The two anti-reverse blocks are respectively located below the corresponding sliding bars, and a rotating hand plate is rotatably installed on the two sliding bars.
10. A method for uniformly spraying etchant onto a circuit board using the circuit board etching solution uniform spraying device as described in any one of claims 1-9, characterized in that, Includes the following steps: T1: Smoothly transport the circuit board to be etched to the spraying operation area inside the outer casing; T2: Introduce etching solution and compressed air into the dual-fluid spray nozzle, so that the dual-fluid spray nozzle sprays out mixed atomized etching solution. T3: Start the front and back swing mechanism, and use the front and back swing mechanism to drive the moving vertical seat to make a back and forth reciprocating sliding motion along the first slide rail; T4: The moving vertical seat drives the horizontal carrier plate and the dual-fluid spray nozzles installed on the horizontal carrier plate to move back and forth synchronously. During the reciprocating movement, the circuit board surface is continuously subjected to dynamic sweeping spraying operation. T5: After the circuit board etching spraying process is completed, close the front and rear swing mechanism, and at the same time stop supplying etching liquid and compressed air to the dual-fluid spray nozzle, and end the spraying operation.